JP2017085680A - Electric power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion device capable of easily adjusting applied pressure acting on a semiconductor laminate unit while reducing production costs.SOLUTION: An electric power conversion device has a semiconductor lamination unit, a case, a spring member 4, and a bearing body 5. The spring member 4 has a pair of born parts 41 which are in a long-sized shape in a lateral direction Y and each have both ends in the lateral direction Y borne by a pair of bearing bodies 5 respectively, and a press part which presses the semiconductor lamination unit between the pair of born parts 41. The bearing bodies 5 are in a columnar shape standing in a height direction Z. The bearing bodies 5 are so shaped as to have three or more stable attitudes of being stably held between the born parts 41 and a rear wall part 32. The bearing bodies 5 can change their attitudes among the three or more stable attitudes by being made to rotate on axes of rotation parallel with the height direction Z. The three or more stable attitudes are such attitudes that the bearing bodies 5 differ in size in a lamination direction X.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a power conversion device.

  In order to drive a motor, an electric vehicle, a hybrid vehicle, and the like are equipped with a power conversion device that converts DC power from a battery into AC power. The power conversion apparatus has a plurality of semiconductor modules incorporating semiconductor elements. The semiconductor module generates heat by a controlled current flowing through the semiconductor element.

  Therefore, Patent Document 1 discloses a power conversion device in which a semiconductor stacked unit is configured by alternately stacking semiconductor modules and cooling pipes for cooling the semiconductor modules. Thereby, the semiconductor module can be cooled from both sides in the stacking direction, and the cooling efficiency of the semiconductor module can be improved.

  In the power conversion device, a spring member that pressurizes the semiconductor stacked unit in the stacking direction is disposed at an end of the semiconductor stacked unit in the stacking direction. The semiconductor laminated unit and the spring member are accommodated in the case. The spring member is supported on the inner wall of the case via a cylindrical support body. The power conversion device attempts to improve the cooling efficiency of the semiconductor module by bringing the semiconductor module and the cooling pipe into close contact with each other by the biasing force of the spring member.

JP 2009-27805 A

However, the power conversion device described in Patent Document 1 has the following problems.
The biasing force of the spring member against the semiconductor multilayer unit is required to be within a certain range from the viewpoint of the cooling performance of the semiconductor module and the rigidity of the semiconductor multilayer unit.
However, the biasing force of the spring member depends on the spring characteristics of the spring member, the amount of elastic deformation of the spring member, and the like. The elastic deformation amount of the spring member depends on the dimension of the case in the stacking direction, the dimension of the semiconductor stacking unit in the stacking direction, and the like. Therefore, if a design error occurs in the dimension of the case in the stacking direction, the dimension of the semiconductor stacking unit in the stacking direction, etc., an error also occurs in the biasing force of the spring member. In particular, the dimension in the stacking direction of the semiconductor stacking unit is likely to cause an error because a dimensional error of a plurality of semiconductor modules and a dimensional error of a plurality of cooling pipes are accumulated, and accordingly, the biasing force of the spring member also includes an error. Is likely to occur.

  Therefore, in the said power converter device, you have to prepare the multiple types of support body which has a different diameter. That is, in the above power conversion device, by selecting a support body having an appropriate diameter according to the dimension or the like of the semiconductor lamination unit in the lamination direction, the dimension error or the like in the lamination direction of the semiconductor lamination unit is absorbed, and the spring The biasing force of the member is adjusted. However, a plurality of types of bearing bodies having different diameters must be prepared. Therefore, there is a problem that it is difficult to reduce the production cost of the power conversion device.

  This invention is made | formed in view of this subject, and aims at providing the power converter device which can adjust the pressurization force which acts on a semiconductor lamination unit easily, aiming at reduction of production cost. .

One aspect of the present invention includes a plurality of semiconductor modules (11) each including a semiconductor element;
A plurality of cooling pipes (2) arranged together with the plurality of semiconductor modules to constitute a semiconductor lamination unit (10);
A case (3) having a front wall portion (31) and a rear wall portion (32) facing the semiconductor lamination unit from both sides in the lamination direction (X);
A spring member (4) disposed between the semiconductor lamination unit and the rear wall in the lamination direction and pressurizing the semiconductor lamination unit in the lamination direction;
A pair of supports (5) disposed between the spring member and the rear wall in the stacking direction;
The spring member has a long shape in a lateral direction (Y) orthogonal to the stacking direction, and a pair of supported portions (41) supported by the pair of support bodies at both ends in the lateral direction. And a pressing portion (42) for pressing the semiconductor laminated unit between the pair of supported portions,
The support body has a column shape standing in a height direction (Z) perpendicular to both the stacking direction and the lateral direction, and between the supported part and the rear wall part. It is a shape that can obtain three or more stable postures (A1, A2, A3, A4, A5, A6) that are stably held by
The bearing can change its posture between the three or more stable postures by rotating around a rotation axis parallel to the height direction,
The three or more stable postures are in the power conversion device (1) in such a posture that the dimensions of the support bodies in the stacking direction are different from each other.

  In the power converter, the support body has a shape that can obtain three or more of the stable postures. And a support body can change an attitude | position between three or more stable attitudes by rotating around the rotating shaft parallel to a height direction. Further, the three or more stable postures are postures in which the dimensions of the support bodies in the stacking direction are different from each other. Therefore, the applied pressure acting on the semiconductor laminated unit can be easily adjusted by rotating the support body and changing the arrangement posture. Therefore, it is not necessary to prepare a plurality of support bodies having different diameters. Therefore, the production cost of the power conversion device can be reduced.

As mentioned above, in the said aspect, the power converter device which can adjust the pressurization force which acts on a semiconductor lamination | stacking unit easily can be provided, aiming at reduction of production cost.
In addition, the code | symbol in the parenthesis described in the means to solve a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later, and limits the technical scope of this invention. It is not a thing.

The top view of the power converter device in Embodiment 1. FIG. The II-II sectional view taken on the line of FIG. The perspective view of the support body in Embodiment 1. FIG. The top view of the support body in Embodiment 1. FIG. FIG. 3 is an enlarged top view around a pair of support bodies of the power conversion device when the support bodies are in a first stable posture in the first embodiment. The enlarged upper side figure of a pair of support body periphery of a power converter device when the support body in Embodiment 1 is made into the 2nd stable attitude | position. The enlarged upper surface figure of a pair of support body periphery of a power converter device when the support body in Embodiment 1 is made into the 3rd stable attitude | position. Explanatory drawing for comparing the length of the stacking direction of the support body of (A) 1st stable posture (B) 2nd stable posture (C) 3rd stable posture in Embodiment 1. FIG. The top view of the power converter device in Embodiment 2. FIG. The perspective view of the support body in Embodiment 2. FIG. The top view of the support body in Embodiment 2. FIG. The expanded top view of a pair of support bodies periphery of a power converter device when a support body is set to the 1st stable posture in Embodiment 2. FIG. The enlarged top view around a pair of support bodies of a power converter when a support body is made into the 2nd stable posture in Embodiment 2. The expanded upper side figure of a pair of support body periphery of a power converter device when the support body in Embodiment 2 was made into the 3rd stable attitude | position. Explanatory drawing for comparing the length of the lamination direction of the support body of Embodiment 2 in (A) 1st stable attitude | position, (B) 2nd stable attitude | position, and (C) 3rd stable attitude | position.

(Embodiment 1)
An embodiment according to a power conversion device will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the power conversion device 1 of the present embodiment includes a plurality of semiconductor modules 11, a plurality of cooling pipes 2, a case 3, a spring member 4, and a support body 5. The semiconductor module 11 includes a semiconductor element. The plurality of cooling pipes 2 are stacked together with the plurality of semiconductor modules 11 to constitute the semiconductor stacked unit 10. The case 3 includes a front wall portion 31 and a rear wall portion 32 that face the semiconductor stacked unit 10 from both sides in the stacking direction X. The spring member 4 is disposed between the semiconductor stacked unit 10 and the rear wall portion 32 in the stacking direction X. The spring member 4 pressurizes the semiconductor lamination unit 10 in the lamination direction X. The support body 5 is disposed between the spring member 4 and the rear wall portion 32 in the stacking direction X.

  As shown in FIGS. 1 and 5 to 7, the spring member 4 has an elongated shape in the lateral direction Y orthogonal to the stacking direction X. The spring member 4 has a pair of supported portions 41 and a pressing portion 42. The pair of supported portions 41 are supported by the pair of support bodies 5 at both ends in the lateral direction Y, respectively. The pressing part 42 presses the semiconductor multilayer unit 10 between the pair of supported parts 41. As shown in FIG. 3, the support body 5 has a column shape standing in the height direction Z perpendicular to both the stacking direction X and the lateral direction Y. Moreover, as shown in FIGS. 5-7, the support body 5 is a shape which can obtain three or more stable attitude | positions stably clamped between the to-be-supported part 41 and the back wall part 32. As shown in FIG. . The support body 5 can change its posture among three or more stable postures by rotating around the rotation axis parallel to the height direction Z. As shown in FIG. 8, the three or more stable postures are postures in which the dimensions of the support body 5 in the stacking direction X are different from each other.

The power conversion device 1 according to the present embodiment is mounted on, for example, an electric vehicle or a hybrid vehicle, and can be used as an inverter that converts power supply power to drive power necessary for driving a drive motor.
In the stacking direction X, the side on which the semiconductor stack unit 10 is arranged with respect to the spring member 4 is referred to as the front, and the opposite side is referred to as the back.

  As shown in FIG. 1, the case 3 has a rectangular frame shape. The case 3 has a front wall portion 31, a rear wall portion 32, and a pair of side wall portions 33. The front wall portion 31 and the rear wall portion 32 face each other in the stacking direction X. The pair of side wall portions 33 connect the end portions of the front wall portion 31 and the rear wall portion 32 in the lateral direction Y in the stacking direction X. The pair of side wall portions 33 oppose each other in the lateral direction Y.

  As shown in FIGS. 1 and 2, a semiconductor laminated unit 10 is arranged in the case 3. The semiconductor module 11 includes a switching element such as an insulated gate bipolar transistor or a MOS field effect transistor.

  The semiconductor module 11 is sandwiched between the pair of cooling pipes 2 from both sides in the stacking direction X. The cooling pipes 2 adjacent to each other in the stacking direction X are connected to each other by connecting pipes 21 in the vicinity of both ends in the horizontal direction Y. The connecting pipe 21 is configured such that the interval between the adjacent cooling pipes 2 can be changed, for example, by making the shape of the connecting pipe 21 bellows or by providing a diaphragm at the connection portion with the cooling pipe 2. .

  Of the plurality of cooling pipes 2, the front surface of the cooling pipe 2 disposed at the front end is in contact with the front wall portion 31. Further, from the cooling pipe 2 at the front end, a refrigerant introduction pipe 22 for introducing the refrigerant into the cooling pipe 2 and a refrigerant discharge pipe 23 for discharging the refrigerant from the cooling pipe 2 are formed protruding forward. Yes. The refrigerant introduction pipe 22 and the refrigerant discharge pipe 23 pass through the side wall portion 33 in the stacking direction X and project outside the case 3.

  A contact plate 12 is disposed in surface contact with the rear surface of the semiconductor laminated unit 10 in the case 3. The contact plate 12 is a plate member having high rigidity.

  As shown in FIGS. 1 and 5 to 7, the spring member 4 is in contact with the rear surface of the contact plate 12. As described above, the spring member 4 has a pair of supported portions 41 and a pressing portion 42. The pressing portion 42 is formed at the central portion of the spring member 4 in the lateral direction Y. The pressing portion 42 is curved so as to protrude forward, and is in contact with the rear surface of the contact plate 12. The pair of supported portions 41 are extended in the lateral direction Y from both ends of the pressing portion 42 in the lateral direction Y. The pair of supported portions 41 are curved so as to protrude forward. The rear surface 411 of the supported portion 41 is a curved surface that is recessed forward in the stacking direction X. The pair of support bodies 5 are sandwiched between the rear surface 411 of the pair of supported portions 41 and the front surface of the rear wall portion 32. Note that at least a portion of the front surface of the rear wall portion 32 in contact with the support body 5 is a plane orthogonal to the stacking direction X.

  As shown in FIGS. 3 and 4, the support body 5 has a shape in which the end of the cylinder in a direction orthogonal to the height direction Z is cut out in two planes along the height direction Z. Yes. The outer peripheral surface 50 of the support body 5 has a curved surface portion 51 and two flat surface portions 52. As shown in FIG. 4, the curved surface portion 51 has an arc shape in which a cross-sectional shape perpendicular to the height direction Z has a central angle θ exceeding 180 °. The two flat portions 52 face the direction orthogonal to the height direction Z. Further, in the cross section orthogonal to the height direction Z, the two flat portions 52 are located inside the virtual circle D passing through the curved surface portion 51 and concentric with the center C of the arc of the curved surface portion 51. The two plane portions 52 have different normal directions. As shown in FIGS. 4 and 8, the dimensions of the support body 5 in the normal direction of the two plane portions 52 are different from each other.

  The support body 5 can be formed by, for example, cutting a cylindrical metal member to form the two flat portions 52. That is, the virtual circle D also represents the outer shape of the support body 5 in a state before the flat portion 52 is formed by cutting. In addition, the manufacturing method of the support body 5 is not restricted to this, For example, the two plane parts 52 can also be formed by shaping | molding.

  As shown in FIGS. 1 and 5 to 7, the radius of curvature of the curved surface portion 51 is smaller than the radius of curvature of the rear surface 411 of the supported portion 41.

  As shown in FIG. 3, each planar portion 52 has a rectangular shape having sides extending in the height direction Z and sides extending in a direction orthogonal to the height direction Z. Each flat surface portion 52 is in contact with the other flat surface portion 52 at the end opposite to the curved surface portion 51. The angle formed by the two flat surfaces 52 toward the curved surface portion 51 is an obtuse angle. The two plane portions 52 have different dimensions in the direction orthogonal to the height direction Z. In the following, of the two plane parts 52, the plane part 52 having the longer dimension in the direction orthogonal to the height direction Z is referred to as a long plane part 521, and the dimension in the direction orthogonal to the height direction Z is The shorter plane part 52 is referred to as a short plane part 522.

  As shown in FIGS. 4, 8 </ b> B, and 8 </ b> C, the dimension L <b> 3 of the support body 5 in the normal direction of the long plane part 521 is the dimension L <b> 2 of the support body 5 in the normal direction of the short plane part 522. Smaller than. Also, as shown in FIGS. 4 and 8, the dimension L1 in the direction in which the straight line passing through the center C of the arc of the curved surface portion 51 and perpendicular to the height direction Z and extending through the two portions of the curved surface portion 51 extends is as follows. , Larger than dimension L2 and dimension L3. That is, the dimensional relationship of the support body 5 is L1> L2> L3.

  As shown in FIGS. 5 to 7, the pair of support bodies 5 incorporated in the power converter 1 are arranged so that the dimensions in the stacking direction X are the same. In the present embodiment, the pair of support bodies 5 incorporated in the power converter 1 are in a state of being line-symmetric with respect to each other with respect to the axis of symmetry in the stacking direction X passing through each other as viewed from the height direction Z. It is arranged with. That is, the support body 5 sandwiched between one supported portion 41 and the rear wall portion 32 is different from the support body 5 sandwiched between the other supported portion 41 and the rear wall portion 32 in the stacking direction. It is arranged in a posture rotated by 180 ° about an axis parallel to X. The support body 5 sandwiched between the one supported portion 41 and the rear wall portion 32 is not limited to this, and the support body sandwiched between the other supported portion 41 and the rear wall portion 32 is used. 5 may be arranged in the same posture. Also by this, the dimension of the pair of support bodies 5 in the stacking direction X is the same.

  As described above, the support body 5 is sandwiched between the supported portion 41 and the rear wall portion 32 in a stable posture. Here, the stable posture is a posture in which the posture of the support body 5 in a state of being pressed between the supported portion 41 and the rear wall portion 32 does not change with the passage of time. The stable posture is a posture in which, for example, the posture of the support body 5 does not change even when an external force such as vibration generated during normal operation of the vehicle acts on the power conversion device 1. Since the support body 5 is sandwiched between the supported part 41 and the rear wall part 32 in a stable posture, the positions of the spring member 4, the case 3, and the support body 5 do not change with the passage of time. The spring member 4 can be stably supported by the support body 5. As shown in FIGS. 5 to 7, in the present embodiment, the support body 5 can change its posture among three stable postures. In the present embodiment, the three stable postures are appropriately referred to as a first stable posture A1, a second stable posture A2, and a third stable posture A3, respectively.

  As shown in FIGS. 5 and 8A, in the first stable posture A1, the curved surface portion 51 of the support body 5 is in contact with both the rear surface 411 of the supported portion 41 and the front surface of the rear wall portion 32. This is the posture of the body 5. Thereby, as shown to FIG. 8 (A), the dimension of the lamination direction X of the support body 5 in 1st stable attitude | position A1 becomes L1. The first stable posture A <b> 1 is a posture in contact with the spring member 4 and the rear wall portion 32 at two locations on the curved surface portion 51. However, since the force acting on the support body 5 is balanced in all directions, the posture is stable.

  As shown in FIGS. 6 and 8B, in the second stable posture A2, the curved surface portion 51 of the support body 5 abuts the rear surface 411 of the supported portion 41, and the short flat surface portion 522 of the support body 5 is the rear wall portion. This is the posture of the support body 5 in surface contact with the front surface of 32. Accordingly, as shown in FIG. 8B, the dimension in the stacking direction X of the support body 5 in the second stable posture A2 is L2.

  As shown in FIGS. 7 and 8C, in the third stable posture A3, the curved surface portion 51 of the support body 5 abuts the rear surface 411 of the supported portion 41, and the long flat surface portion 521 of the support body 5 is the rear wall portion. This is the posture of the support body 5 in surface contact with the front surface of 32. Thereby, as shown in FIG.8 (C), the dimension of the lamination direction X of the support body 5 in the 3rd stable attitude | position A3 will be L3.

  As described above, since L1, L2, and L3 have a relationship of L1> L2> L3, as shown in FIG. 8, the stable postures are the first stable posture A1, the second stable posture A2, and the third stable posture. The dimension of the support body 5 in the stacking direction X becomes longer in the order of A3.

  In the present embodiment, the support body 5 is arranged in any one of the first stable posture A1, the second stable posture A2, and the third stable posture A3. The arrangement posture of the support body 5 is appropriately selected so that the pressure applied from the spring member 4 to the semiconductor laminated unit 10 is appropriate. Here, the pressure applied from the spring member 4 to the semiconductor laminated unit 10 depends on the amount of elastic deformation of the spring member 4. That is, the arrangement posture of the support body 5 is appropriately selected so that the elastic deformation amount of the spring member 4 is appropriate according to the dimension of the case 3 in the stacking direction X and the dimension of the semiconductor stacking unit 10 in the stacking direction X. The Whether or not the pressure applied from the spring member 4 to the semiconductor laminated unit 10 is appropriate is determined from the viewpoint of the cooling performance of the semiconductor module 11 and the rigidity of the semiconductor laminated unit 10.

Next, an example of how to select the arrangement posture of the support body 5 with respect to the case 3 will be described.
For example, there is a tolerance in the dimension in the stacking direction X of the semiconductor stacked unit 10 for each product. Here, when the dimension in the stacking direction X of the semiconductor stacked unit 10 is formed larger than the design value, the gap between the semiconductor stacked unit 10 and the rear wall portion 32 is formed narrower than designed. On the other hand, when the dimension in the stacking direction X of the semiconductor multilayer unit 10 is formed smaller than the design value, the gap between the semiconductor multilayer unit 10 and the rear wall portion 32 is formed wider than the design. In these two situations, if the dimensions of the support body 5 in the stacking direction X are the same, the pressure applied to the semiconductor stacked unit 10 by the spring member 4 is too small in the former state, and the spring in the latter state. A situation may occur in which the pressure applied to the semiconductor multilayer unit 10 by the member 4 is too large.

  Therefore, in the former state, the first stable posture A1 is selected as the posture of the support body 5 as shown in FIG. On the other hand, in the latter state, the third stable posture A3 is selected as the posture of the support body 5 as shown in FIG. Further, when the dimension in the stacking direction X of the semiconductor stacked unit 10 is formed so as to be close to the design value, the second stable posture A2 is selected as the posture of the support body 5 as shown in FIG. As described above, by selecting the posture of the support body 5 with respect to the case 3, the pressure applied from the spring member 4 to the semiconductor laminated unit 10 can be made appropriate.

Next, the effect of this embodiment is demonstrated.
In the power converter 1, the support body 5 has a shape that can obtain three or more stable postures. And the support body 5 can change an attitude | position between three or more stable attitudes by rotating around the rotating shaft parallel to the height direction Z. As shown in FIG. Further, the three or more stable postures are postures in which the dimensions of the support body 5 in the stacking direction X are different from each other. Therefore, the applied pressure acting on the semiconductor multilayer unit 10 can be easily adjusted by rotating the support body 5 and changing the arrangement posture. Therefore, it is not necessary to prepare a plurality of support bodies 5 having different diameters. Therefore, the production cost of the power conversion device 1 can be reduced.

  The outer peripheral surface 50 of the support body 5 has a curved surface portion 51 and two flat surface portions 52. Therefore, it is possible to easily manufacture the support bodies 5 having different dimensions in the stacking direction X in the three stable postures.

  The curvature radius of the curved surface portion 51 of the support body 5 is smaller than the curvature radius of the rear surface 411 of the supported portion 41. Therefore, it is easy to stably support the spring member 4 by the support body 5.

  As described above, in this embodiment, it is possible to provide a power conversion device that can easily adjust the pressure applied to the semiconductor multilayer unit while reducing the production cost.

(Embodiment 2)
As shown in FIGS. 9 to 15, the present embodiment is an embodiment in which the shape of the support body 5 is changed with respect to the first embodiment. As shown in FIG. 10, the support body 5 has a triangular prism shape in which the outer peripheral surface 50 has three flat surfaces 53. Furthermore, as shown in FIGS. 10 and 11, the support body 5 is different in the dimension of the three flat surfaces 53 in the normal direction.

  As shown in FIGS. 9 and 12 to 14, also in the present embodiment, the rear surface 411 of the supported portion 41 is a curved surface that is recessed forward in the stacking direction X. As shown in FIGS. 10 and 11, the support 5 has corners 54 between the flat surfaces 53 formed in a curved shape. As shown in FIGS. 9 and 12 to 14, the radius of curvature of the corner portion 54 is smaller than the radius of curvature of the rear surface 411 of the supported portion 41.

  As shown in FIGS. 10 and 11, the support body 5 is formed in a curved surface so that the corners 54 between the flat surfaces 53 smoothly connect the flat surfaces 53 to each other. In this embodiment, the support body 5 is formed by cutting the corners between the side surfaces of the regular triangular prism-shaped metal member to form the three corner portions 54. In FIG. 11, the outer shape of the support body 5 in a state before the corner portion 54 is formed is represented by a two-dot chain line. In addition, the manufacturing method of the support body 5 is not restricted to this, For example, the three corner | angular part 53 can also be formed in a curved surface shape by shaping | molding.

  As shown in FIG. 11, the corner portions 54 are different from each other in the shaved length in the normal direction of the flat surface 53 that is not adjacent to the corner portion 54. Thereby, the support body 5 is formed so that the dimension in the normal line direction of each flat surface 53 may mutually differ. In the following, the corner 54 with the shortest cut length is the first corner 541, the corner 54 with the second shortest cut length is the second corner 542, and the corner with the longest cut length. 54 is referred to as a third triangular portion 543. The “cut length” refers to a length obtained by subtracting the dimension of the support body 5 after being cut from the dimension of the support body before being cut in the normal direction of each flat surface 53. .

  As shown in FIGS. 11 and 15, the dimension L4 of the support body 5 in the normal direction of the flat surface 53 not adjacent to the first corner portion 541 and the support in the normal direction of the flat surface 53 not adjacent to the second corner portion 542. The dimension L5 of the body 5 and the dimension L6 of the support body 5 in the normal direction of the flat surface 53 not adjacent to the third triangular portion 543 satisfy the relationship L4> L5> L6.

  As shown in FIGS. 12-15, in this embodiment, the support body 5 can change an attitude | position between three stable attitude | positions. In the present embodiment, the three stable postures are appropriately referred to as a first stable posture A4, a second stable posture A5, and a third stable posture A6, respectively.

  As shown in FIGS. 12 and 15A, in the first stable posture A4, the first corner portion 541 is in contact with the rear surface 411 of the supported portion 41, and the flat surface 53 not adjacent to the first corner portion 541 is the rear wall. The posture of the support body 5 is in surface contact with the front surface of the portion 32. Thereby, as shown to FIG. 15 (A), the dimension of the lamination direction X of the support body 5 in 1st stable attitude | position A4 will be L4.

  As shown in FIGS. 13 and 15B, in the second stable posture A5, the second corner portion 542 abuts the rear surface 411 of the supported portion 41, and the flat surface 53 not adjacent to the second corner portion 542 is the rear wall. The posture of the support body 5 is in surface contact with the front surface of the portion 32. Accordingly, as shown in FIG. 15B, the dimension in the stacking direction X of the support body 5 in the second stable posture A5 is L5.

  As shown in FIGS. 14 and 15C, in the third stable posture A6, the third triangular portion 543 contacts the rear surface 411 of the supported portion 41, and the flat surface 53 not adjacent to the third triangular portion 543 is the rear wall portion 32. It is the attitude | position of the support body 5 which surface-contacted. Thereby, as shown in FIG.15 (C), the dimension of the lamination direction X of the support body 5 in 3rd stable attitude | position A6 will be L6.

  As described above, L4, L5, and L6 have a relationship of L4> L5> L6. Therefore, as shown in FIG. 15, the stable postures are the first stable posture A4, the second stable posture A5, and the third stable posture. In the order of A6, the dimension of the support body 5 in the stacking direction X becomes longer.

  Also in this embodiment, the support body 5 is arrange | positioned with the attitude | position in any one of 1st stable attitude | position A4, 2nd stable attitude | position A5, and 3rd stable attitude | position A6.

Next, an example of how to select the arrangement posture of the support body 5 with respect to the case 3 will be described.
When the dimension in the stacking direction X of the semiconductor stacked unit 10 is formed to be larger than the design value, the gap between the semiconductor stacked unit 10 and the rear wall portion 32 is formed to be narrower than designed. On the other hand, when the dimension in the stacking direction X of the semiconductor multilayer unit 10 is formed smaller than the design value, the gap between the semiconductor multilayer unit 10 and the rear wall portion 32 is formed wider than the design.

  Therefore, in the former state, the first stable posture A4 is selected as the posture of the support body 5 as shown in FIG. On the other hand, in the latter state, the third stable posture A6 is selected as the posture of the support body 5 as shown in FIG. Further, when the dimension in the stacking direction X of the semiconductor stacked unit 10 is formed so as to be close to the design value, the second stable posture A5 is selected as the posture of the support body 5 as shown in FIG. As described above, by selecting the posture of the support body 5 with respect to the case 3, the pressure applied from the spring member 4 to the semiconductor laminated unit 10 can be made appropriate.

Others are the same as in the first embodiment.
Of the reference numerals used in the second embodiment, the same reference numerals as those used in the above-described embodiments represent the same components as those in the above-described embodiments unless otherwise indicated.
This embodiment also has the same effects as those of the first embodiment.

  The present invention is not limited to the above embodiments, and can be applied to various embodiments without departing from the spirit of the invention.

DESCRIPTION OF SYMBOLS 1 Power converter 10 Semiconductor lamination | stacking unit 11 Semiconductor module 2 Cooling pipe 3 Case 31 Front wall part 32 Back wall part 4 Spring member 41 Supported part 42 Pressing part 5 Support body A1, A2, A3 Stable attitude X Lamination direction Y Lateral direction Z height direction

Claims (5)

A plurality of semiconductor modules (11) each including a semiconductor element;
A plurality of cooling pipes (2) arranged together with the plurality of semiconductor modules to constitute a semiconductor lamination unit (10);
A case (3) having a front wall portion (31) and a rear wall portion (32) facing the semiconductor lamination unit from both sides in the lamination direction (X);
A spring member (4) disposed between the semiconductor lamination unit and the rear wall in the lamination direction and pressurizing the semiconductor lamination unit in the lamination direction;
A pair of supports (5) disposed between the spring member and the rear wall in the stacking direction;
The spring member has a long shape in a lateral direction (Y) orthogonal to the stacking direction, and a pair of supported portions (41) supported by the pair of support bodies at both ends in the lateral direction. And a pressing portion (42) for pressing the semiconductor laminated unit between the pair of supported portions,
The support body has a column shape standing in a height direction (Z) perpendicular to both the stacking direction and the lateral direction, and between the supported part and the rear wall part. It is a shape that can obtain three or more stable postures (A1, A2, A3, A4, A5, A6) that are stably held by
The bearing can change its posture between the three or more stable postures by rotating around a rotation axis parallel to the height direction,
The power converter (1), wherein the three or more stable postures are postures in which the dimensions of the support bodies in the stacking direction are different from each other.   The outer peripheral surface (50) of the support body has a curved surface portion (51) having an arc shape with a central angle (θ) of 180 ° or more and a cross-sectional shape orthogonal to the height direction, and orthogonal to the height direction. Two plane parts (52, 521, 522) facing in the direction to be cut, and in a cross section orthogonal to the height direction, the two plane parts are arranged at the center (C) of the arc of the curved surface part. Concentric, positioned inside a virtual circle (D) passing through the curved surface portion, the two plane portions have different normal directions, and the support in the normal direction of the two plane portions The power converter according to claim 1, wherein the body dimensions are different from each other.   The rear surface (411) of the supported portion is a curved surface that is recessed forward in the stacking direction, and the curvature radius of the curved surface portion of the supported body is smaller than the curvature radius of the rear surface of the supported portion. Item 3. The power conversion device according to Item 2.   2. The electric power according to claim 1, wherein the bearing body has a triangular prism shape with an outer peripheral surface (50) having three flat surfaces (53), and the dimensions of the three flat surfaces in the normal direction are different from each other. Conversion device.   The back surface (411) of the supported portion is a curved surface that is recessed forward in the stacking direction, and the support body has curved portions (54, 541, 542, 543) between the flat surfaces. The power conversion device according to claim 4, wherein the power conversion device is formed, and a radius of curvature of the corner portion is smaller than a radius of curvature of the rear surface of the supported portion.

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