JP2017084833A - Sensor case structure, and heating cooker including sensor case structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor case structure having high resistance against the impact of electromagnetic waves, generated from a heating coil that is a factor of noise, and capable of positioning an infrared sensor at an accurate position, and to provide a heating cooker including that sensor case structure.SOLUTION: In a sensor case structure having a metallic member, and a resin member, and housing the sensor part in the metallic member, the resin member is bonded partially to the metallic member, and the sensor part is attached to the metallic member via the resin member. The metallic member is formed of more than one components composed of a nonmagnetic metal so as to have a hollow structure, and irregularities are formed on the surface of the metallic member. The resin member is molded on the surface where the irregularities are formed.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a sensor case structure of a sensor that detects the temperature of an object to be heated placed on a top plate, and a heating cooker including the sensor case structure.

As a method of detecting the temperature of the pan, which is the object to be heated, placed on the top plate of the cooking device, a thermistor, which is a contact temperature sensor, is brought into contact with the top plate and transmitted from the pan through the top plate. There are a thermistor method for detecting the temperature to be detected and an infrared sensor method for detecting the infrared radiation energy radiated from the pan through the top plate.
In the infrared sensor system, an infrared sensor is disposed below the central space of the heating coil and the space between the inner coil and the outer coil, and infrared radiation energy radiated from a pan placed on the top plate is passed through the space. The temperature of the pan is detected by the amount of energy detected.

  In such an infrared sensor, the output of the infrared sensor becomes unstable due to the radiant heat radiated from the top plate or the like around the infrared sensor, the electromagnetic wave radiated from the heating coil, the cooling air for cooling the inside of the housing, etc. In order to prevent this, the infrared sensor is housed inside a resin case with a large heat capacity, and a case made of a non-magnetic metal is provided on the outside of the resin case. The sensor case is made of the same material as the top plate above the field of view of the infrared sensor. What seals using a glass filter is known (refer patent document 1).

JP 2013-97935 A

  However, in such a conventional sensor case, an accurate shape processing is required when positioning the infrared sensor, which is an optical component, at an accurate position, and in order to prevent deformation of the sensor case, it is made of resin. There was a need to adopt. For this reason, among the radiant heat, electromagnetic waves, and cooling air that affect the detection value of the infrared sensor, the resistance to electromagnetic waves that have a particularly large effect has not been sufficient.

  The present invention has been made in order to solve the above-described problems, and in order to accurately detect the temperature of an object to be heated placed on the top plate using an infrared sensor, a factor of a large noise. Provided is a sensor case structure that is highly resistant to the influence of electromagnetic waves generated from a heating coil and that can position an infrared sensor at an accurate position, and a cooking device equipped with the sensor case structure The purpose is to do.

  The sensor case structure according to the present invention includes a metal member and a resin member, and a sensor case structure in which a sensor unit is accommodated in the metal member, wherein the resin member is partially included in the metal member. The sensor part is attached to the metal member via the resin member, and the metal member is formed to have a hollow structure with at least two parts made of nonmagnetic metal, and the metal member Unevenness is formed on the surface of the member, and the resin member is molded on the surface where the unevenness is formed.

  According to the sensor case structure according to the present invention, it is possible to obtain a sensor case excellent in heat dissipation and strength while suppressing the influence of electromagnetic waves on the sensor with a compact and simple structure using a metal member. In addition, by partially using the resin member with respect to the surface of the metal member, the sensor can be positioned at an accurate position while being low in cost.

3 is a top view of the induction heating cooker according to Embodiment 1. FIG. It is a block diagram explaining the structure and function of the principal part of the induction heating cooking appliance which concerns on Embodiment 1. FIG. It is a figure explaining the operation part and thermal-power display part which were provided corresponding to the left heating coil of the induction heating cooking appliance which concerns on Embodiment 1. FIG. 2 is a longitudinal sectional view in the longitudinal direction of the sensor case according to Embodiment 1. FIG. FIG. 3 is a longitudinal sectional view of the sensor case according to Embodiment 1 in the short direction. 3 is a top horizontal direction (AA) cross-sectional view of the sensor case according to Embodiment 1. FIG. 6 is a lower horizontal (BB) cross-sectional view of the sensor case according to Embodiment 1. FIG. 2 is a perspective view of a sensor case according to Embodiment 1. FIG. 4 is a development view of a metal member of the sensor case according to Embodiment 1. FIG. It is explanatory drawing (a bottom view and a side view) of the upper surface part of the sensor case which concerns on Embodiment 1. FIG. 4 is a graph showing spectral transmission characteristics of a top plate of the induction heating cooker according to Embodiment 1. It is a graph which shows the relationship between the spectral transmission characteristic of the top plate of the induction heating cooking appliance which concerns on Embodiment 1, and the spectral radiance curve in each temperature. It is the graph which showed the spectral radiance curve of the black body for every temperature. It is a block diagram which shows the electric power system of the induction heating cooking appliance which concerns on Embodiment 2. FIG. It is a flowchart at the time of the earthquake response of the induction heating cooking appliance which concerns on Embodiment 2. FIG.

Hereinafter, the cooking device according to the present invention will be described with reference to the drawings.
In addition, the structure, control content, etc. which are demonstrated below are examples, and the heating cooker which concerns on this invention is not limited to such a structure, control content, etc.
Further, the illustration of the fine structure is simplified or omitted as appropriate.
In addition, overlapping or similar descriptions are appropriately simplified or omitted.

In the following Embodiments 1 and 2, an induction heating cooker will be described as an example of a heating cooker.
Embodiment 1 FIG.
1 is a top view of the induction heating cooker according to Embodiment 1. FIG.
The induction heating cooker 100 includes a main body 1 and a top plate 2 that is disposed on the upper surface of the main body 1 and is formed of heat-resistant glass. The induction cooker 100 is a pan 10 or a pan that is placed on the top plate 2. The heated object is heated by induction heating means provided inside the main body 1. In the first embodiment, heating ports 6 are respectively provided on the left front side, the right front side, and the center side back of the top plate 2. In the following description, the object to be heated may be referred to as “pan 10”.

  On the upper surface of the main body 1, an operation unit 3 that receives an input operation of a heating condition or a heating instruction is arranged corresponding to each heating port 6. When a user places a pot 10 or a frying pan, which is an object to be heated, on the top plate 2 and performs an operation input on an operation key provided in the operation unit 3 corresponding to each heating port 6, guidance is performed according to the operation input. The object to be heated is heated by the heating means. Information relating to settings such as the progress of heating and cooking mode is displayed on the display unit 4 having liquid crystal or the like disposed on the upper surface of the top plate 2 corresponding to each heating port 6, and the thermal power of heating is the thermal power display unit 5. Is displayed.

  Behind the main body 1, there are intake ports 9 a and 9 b that take in air for cooling the inside of the main body 1 (hereinafter, may be collectively referred to as the intake port 9), and an exhaust port 8 that exhausts air in the main body 1. Provided. When the air blowing means (not shown) provided in the main body 1 operates, external air flows into the main body 1 from the intake port 9 as cooling air, and the cooling air is sent to the inside of the main body by a substrate (not shown), elements, and induction heating means. A certain heating coil 14, the lower surface of the top plate 2, and the like are cooled. The cooling air after cooling the inside of the main body 1 is discharged from the exhaust port 8 to the outside.

  The portion corresponding to the heating port 6 of the top plate 2 is provided with, for example, a circular display indicating the place where the pan 10 is placed by printing or the like, so that the user knows where the pan 10 should be placed. It has become.

  A heating coil 14 as a heating means is provided below the heating port 6 in the main body 1. In addition, in FIG. 1, arrangement | positioning of the heating coil 14 is illustrated with the broken line. An eddy current is generated in the pan 10 placed on the top plate 2 by flowing a high-frequency current through the heating coil 14, and the pan bottom itself generates heat due to the generated eddy current and the resistance of the pan 10 itself. Cooking with good heating efficiency can be realized. In addition, you may provide other heating means, such as an electric heater, as a heating means of the heating port 6 of the induction heating cooking appliance 100. FIG.

FIG. 2 is a block diagram illustrating a configuration and functions of main parts of the induction heating cooker according to the first embodiment. In FIG. 2, only the structure corresponding to one heating port 6 is illustrated, and the pan 10 as an object to be heated is also illustrated.
A heating coil 14 is disposed below the heating port 6 provided in the top plate 2. In the first embodiment, the heating coil 14 has a double ring shape including a substantially annular inner heating coil 14a and a substantially annular outer heating coil 14b provided outside thereof. A substantially annular gap is provided between the inner heating coil 14 a and the outer heating coil 14 b, and this gap is referred to as a gap 15. The heating coil 14 is held at a predetermined distance from the lower surface of the top plate 2 by a heating coil support 16 that accommodates the heating coil 14.

  In the gap 15 between the inner heating coil 14a and the outer heating coil 14b, and below the upper surface of the heating coil 14, an infrared sensor 12 that performs output corresponding to the detected amount of infrared light is provided. . The output from the infrared sensor 12 is input to an infrared temperature detection unit 24 provided in the main body 1. The infrared temperature detector 24 calculates the temperature based on the output from the infrared sensor 12. More specifically, the storage unit 21 stores in advance a temperature conversion table in which the output amount of the infrared sensor 12 is associated with the temperature data calculated based on the output amount and a predetermined emissivity. When receiving the output from the infrared sensor 12, the infrared temperature detecting unit 24 refers to the temperature conversion table and calculates the temperature.

  The infrared sensor 12 is covered with a sensor case 200 so that the cooling air flowing in the vicinity of the heating coil 14 is not directly applied. The infrared sensor 12 is held in the sensor case 200 while maintaining a spatial distance so that the ambient temperature around the infrared sensor 12 is uniform. The sensor case 200 is fixed to the heating coil support portion 16 with a tapping screw or the like, or partly formed integrally with the heating coil support portion 16, and the distance between the top plate 2 and the infrared sensor 12. Is kept constant.

  In the first embodiment, in order to detect the infrared rays of the pan 10 that passes through the top plate 2, it is desirable that the transmission window portion 7 on the upper surface portion of the infrared sensor 12 does not have the coating 13. However, if the transmission window 7 is not coated, the internal heating coil 14 and wiring may be visible from the upper surface of the top plate 2, which is not desirable in design. For this reason, when the coating 13 is not applied to the transmission window portion 7, a cylinder or a plate is provided toward the top plate 2 in the heating coil support portion 16 that holds the heating coil 14 or the sensor case 200. What is necessary is just to make it difficult to see the heating coil 14, wiring, etc. from the outside by doing in this way. In addition, instead of covering the entire surface of the transmission window portion 7 with the coating 13, the coating 13 is applied to the transmission window portion 7 in the form of dots or stripes so as to manage the ratio of the unpainted openings. Well, it is possible to ensure design and functionality by doing so.

  In addition, two contact-type temperature sensors 17 that are contact-type temperature detecting means such as a thermistor are provided on the lower surface of the top plate 2 (FIG. 2 shows only one contact-type temperature sensor 17. ). The two contact temperature sensors 17 are provided at positions shifted by 180 degrees with respect to the center of the heating coil 14. The contact temperature sensor 17 is provided so as to be in close contact with the lower surface of the top plate 2 and outputs a signal corresponding to the temperature of the lower surface of the top plate 2. The output signal of the contact temperature sensor 17 is input to the top plate temperature detector 25 provided in the main body 1. The top plate temperature detector 25 detects the temperature of the top plate 2 based on the signal from the contact temperature sensor 17. In the first embodiment, the contact temperature sensor 17 and the top plate temperature detection unit 25 constitute the top plate temperature detection means of the present invention. As long as the temperature of the top plate 2 can be detected more accurately with less time delay, not only the contact-type temperature sensor 17 such as a thermistor, but any other one can be used as the top plate temperature detection means. .

  In the first embodiment, the contact temperature sensor 17 is provided in the gap 15 between the inner heating coil 14a and the outer heating coil 14b. However, the arrangement of the contact temperature sensor 17 is not limited to this. For example, the contact temperature sensor 17 may be disposed in the vicinity of the outer periphery of the outer heating coil 14 b or may be disposed in the center of the heating coil 14. Moreover, the number of the contact-type temperature sensors 17 is not limited to two, and may be one or two or more.

The output of the contact-type temperature sensor 17 is used when calculating the temperature of the pan 10 based on the amount of infrared rays detected by the infrared sensor 12. For this reason, in order to detect the temperature of the pan 10 with higher accuracy, the contact-type temperature sensor 17 is preferably installed in the vicinity of the infrared sensor 12.
It should be noted that it is uncertain where the pan 10 as the object to be heated is placed on the top plate 2, and since the shape of the pan 10 is also uncertain, it detects a wider range of temperatures, and The contact-type temperature sensor 17 and the infrared sensor 12 may be arranged apart from each other by giving priority to the realization at a low cost.

  If the number of the contact-type temperature sensors 17 is small, the acquisition temperature may vary due to the difference in the position and shape of the object to be heated placed on the top plate 2. For this reason, the average value of the detection values of the plurality of contact-type temperature sensors 17 and the detection value of the output of the highest temperature among the plurality of contact-type temperature sensors 17 are used for temperature detection of the pan 10. Also good. By doing in this way, even when the number of installation of the contact-type temperature sensor 17 is small, temperature detection resistant to variations can be performed.

Information set by the operation unit 3 and outputs from the infrared temperature detection unit 24 and the top plate temperature detection unit 25 are input and stored in the storage unit 21 provided in the main body 1.
The calculation part 22 is comprised, for example with a microcomputer etc., and performs the various calculation processing which calculates the temperature of the pan 10. FIG.

  The control unit 23 subtracts the influence of the top plate temperature from the detected temperature of the infrared sensor 12 based on the setting content of the operation unit 3 and the physical information detected by the infrared sensor 12 and the contact temperature sensor 17. The high frequency current flowing in the heating coil 14 is adjusted by controlling the high frequency inverter 26. By doing in this way, heating control of a to-be-heated material is performed.

Next, the structure of the operation part 3 and the thermal power display part 5 of the induction heating cooking appliance 100 is demonstrated.
FIG. 3 is a diagram illustrating an operation unit and a thermal power display unit provided corresponding to the left heating coil of the induction heating cooker according to the first embodiment. The operation unit 3 and the thermal power display unit 5 respectively corresponding to the heating coil 14 provided on the left side, the right side, and the center of the induction heating cooker 100 have the same configuration. The operation unit 3 and the thermal power display unit 5 provided correspondingly will be described as an example.

The operation unit 3 includes a heating power setting key 31 for setting a heating power for heating the object to be heated, and a menu key 32 for setting a cooking menu.
The heat setting key 31 includes a “low heat” key, a “medium fire” key, a “high fire” key, and a “3 kW” key, and the user can use any of the four levels of fire power using these keys. Can be set. By providing keys individually according to the thermal power, the user can input the necessary thermal power settings with a single operation.

  The menu key 32 includes a “fried food” key, a “preheat” key, a “boiled” key, and a “timer” key. When these keys are pressed, the control unit 23 performs heating control according to a control sequence preset for each menu and stored in the storage unit 21.

  The thermal power display unit 5 displays thermal power in a plurality of stages based on the thermal power input by the thermal power setting key 31 and the menu set by the menu key 32, and the display mode is switched according to the thermal power. The display of the thermal power display unit 5 can indicate to the user that it is operating. The thermal power display unit 5 includes, for example, a plurality of LEDs, and expresses thermal power by switching the lighting states (lighting, extinguishing, blinking, etc.) of these LEDs or switching the lighting color. By doing in this way, the user can perform notification which is easy to understand intuitively.

  Although not shown in FIG. 3, the display unit 4 (see FIG. 1) configured with a liquid crystal screen or the like has, for example, a thermal power and progress status such as “during preheating” and “appropriate temperature reached”, set menus, etc. Information on the contents of the is displayed.

  In the induction heating cooker 100 having such a configuration, for example, when cooking fried food, the user first puts oil for performing fried food in the pan 10 and places the pan 10 on the heating port 6 of the top plate 2. Put. Next, when the user performs an operation input for starting heating at the operation unit 3, the control unit 23 applies a high-frequency current to the heating coil 14 based on the signal from the operation unit 3 and the estimated temperature of the pan 10. The cooking is performed according to a control sequence set in advance and stored in the storage unit 21.

Here, a configuration example of the infrared sensor 12 and the sensor case 200 will be described.
FIG. 4 is a longitudinal sectional view in the longitudinal direction of the sensor case according to the first embodiment.
FIG. 5 is a longitudinal sectional view of the sensor case according to Embodiment 1 in the short direction.
6 is an upper horizontal (AA) cross-sectional view of the sensor case according to Embodiment 1. FIG.
FIG. 7 is a lower horizontal (BB) cross-sectional view of the sensor case according to the first embodiment.
FIG. 8 is a perspective view of the sensor case according to the first embodiment.
FIG. 9 is a development view of the metal member of the sensor case according to the first embodiment.
FIG. 10 is an explanatory diagram (a bottom view and a side view) of the upper surface portion of the sensor case according to the first embodiment.

As the infrared sensor 12, a sensor having sensitivity in a wide wavelength with respect to an infrared region, such as a thermopile sensor, is used.
The main body of the infrared sensor 12 shown in FIGS. 4 and 5 is provided with a convex condensing lens 121 on the upper surface, for example, a cylindrical shape in which a thermopile chip (not shown) and a self-temperature detecting thermistor (not shown) are enclosed. An encapsulating member 122 is placed on a printed circuit board 123 and packaged. By making the condensing lens 121 convex, the visual field range 12a of the infrared sensor 12 is narrowed to suppress the influence of ambient light. The shape of the enclosing member 122 is not limited to a cylindrical shape.

  Silicon can be used as the base material of the condenser lens 121. Silicon has a low wavelength dependency of about 50 to 60% in the infrared region, and has a high reflectance and a low heat absorption rate except for the transmission of light in the infrared region, so that the temperature hardly rises. In addition, since the thermal diffusivity is high, even if the condenser lens 121 absorbs infrared rays and the temperature rises, the thermal diffusion does not easily affect the detection of the amount of infrared rays.

  As described above, by using the silicon base material as the base material of the condensing lens 121, the temperature of the condensing lens 121 of the infrared sensor 12 rises even in a usage environment provided in the vicinity of the top plate 2. Insensitive to the detection of the amount of infrared rays. In addition, the base material of the condensing lens 121 is not limited to silicon, and any material having similar transmission characteristics and thermal diffusibility can be used. Further, the specific configuration of the infrared sensor 12 is not limited to that illustrated in FIG.

Next, the sensor case 200 that covers the infrared sensor 12 will be described with reference to FIGS.
The sensor case 200 is configured using a metal member for preventing the influence of electromagnetic noise from the heating coil 14 and a resin member for holding the infrared sensor 12 in place.
The metal member and the resin member are joined to form an integrally molded product.
As the metal member, for example, plate-like aluminum, copper, stainless steel, iron, or the like can be adopted, but it is desirable to use aluminum or copper which is a nonmagnetic metal in consideration of magnetic resistance. The metal member may be other than a plate shape. For example, a metal member processed into a three-dimensional shape can be used.
As the resin member, for example, polybutylene terephthalate resin (PBT) having high heat resistance, polyphenylene sulfide resin (PPS), or the like can be used.

There are various methods for joining the metal member and the resin member. For example, the surface of the metal member is immersed in a solvent, or chemical etching is performed to perform a surface treatment to make the surface of the metal member uneven. It is possible to form an integrally molded product by directly performing injection molding or extrusion molding of a resin on a metal surface to join the metal member and the resin member.
As the solvent, for example, an aqueous solution containing sodium chlorite is used if the metal member is copper, and one or more aqueous solutions selected from ammonia, hydrazine, hydrazine derivatives, and water-soluble amine compounds if the metal member is aluminum. Can be used. Or you may perform the surface treatment from which the surface of a metal member becomes uneven | corrugated shape by performing machining.
It is also possible to join the metal member and the resin member using an adhesive to form an integrally molded product.

The sensor case 200 formed of a metal member has a hollow, substantially rectangular parallelepiped shape, and includes a rectangular side surface portion 201, a bottom surface portion 202, and an upper surface portion 203.
The four side surface portions 201 and the bottom surface portion 202 are composed of a single plate-like metal member as shown in a development view shown in FIG. 9, and the rectangular shape of the rectangular parallelepiped box shown in FIG. Form. A side opening 201 a is opened in the side part 201 facing the sensor case 200.
Further, as shown in FIG. 10, the upper surface portion 203 is provided with a circular visual field opening 203 a at a position corresponding to the pair of upper surface openings 203 b and the visual field range 12 a of the infrared sensor 12.

Next, the resin member joined to the metal member constituting the sensor case 200 will be described.
The hatched portions shown in FIGS. 4 to 10 indicate resin members.
An attachment piece 301 for attaching the sensor case 200 is formed in the side opening 201a of the sensor case 200 so as to penetrate the side opening 201a.
The attachment piece 301 has a rectangular parallelepiped shape, and has an opening 301a through which screw tapping is inserted.

A substrate support member 302 on which the printed circuit board 123 is placed is disposed around the upper surface of the bottom surface portion 202 of the sensor case 200 as shown in FIG. The substrate support member 302 has an L-shaped cross section, and is placed in contact with the side surface portion 201 so that the periphery of the printed circuit board 123 is placed on the stepped portion as shown in FIGS. . By partially placing the printed circuit board 123 in this way, a gap is provided between the lower surface of the printed circuit board 123 and the bottom surface portion 202, and the metal member of the sensor case 200 and the back surface of the printed circuit board 123 are in contact with each other. Insulation distance is secured.
In the sensor case 200 according to the first embodiment, four are arranged on the four sides around the bottom surface portion 202, but the shape is not limited to this, and the sensor case 200 may be disposed on the four corners of the bottom surface portion 202. Alternatively, as long as the printed circuit board 123 can be supported so as not to move, four or more may be dispersedly arranged in a small shape.

  Triangular prism-shaped joining members 303 are attached to the four sides joining the side surface parts 201 of the sensor case 200 from the inside of the sensor case 200. In the first embodiment, the joining member 303 has a triangular prism shape. However, for example, a rectangular parallelepiped shape can be adopted as long as two surfaces can be joined.

  A pair of engaging claw members 304 that are inserted into the upper surface opening 203 b of the upper surface portion 203 and engage the side surface portion 201 and the upper surface portion 203 are formed at the upper part of the side surface portion 201 facing the sensor case 200. As shown in FIG. 4, the engaging claw member 304 includes a substantially triangular pyramid-shaped claw portion 304 a on the upper end side. The claw portion 304 a is inserted into the rectangular upper surface opening 203 b and elastically deformed, and then the shape is restored. Is caught on the upper surface portion 203, and the side surface portion 201 and the upper surface portion 203 are engaged with each other. In addition, although the nail | claw part 304a was made into the triangular pyramid shape, if it is a shape engaged with the upper surface part 203, it will not be limited to this shape.

  Two positioning projections 305 to be inserted into the positioning holes 123 a opened in the printed circuit board 123 are formed on the bottom surface portion 202. The positioning projection 305 has a convex cross section with a circular placement surface that abuts the lower surface of the printed circuit board 123 and an insertion portion that is erected at the center of the placement surface and inserted into the positioning hole 123a. The positioning protrusion 305 is not limited to a cylindrical shape, and a rectangular parallelepiped shape or the like can be adopted as long as the placement surface and the insertion portion are formed. Also, the number is not limited to two.

  Four cylindrical urging members 306 that abut against the upper surface of the printed circuit board 123 and urge the printed circuit board 123 downward are formed on the upper surface portion 203. The urging member 306 is set to a length that holds the printed circuit board 123 when the upper surface portion 203 of the sensor case 200 is engaged with the side surface portion 201. Note that the urging member 306 is not limited to a cylindrical shape, and the number is not limited to four.

  In this way, by making the sensor case 200 an integrally molded product of a metal member and a resin member, it is possible to achieve both the magnetic shielding performance by metal and the high degree of freedom and molding accuracy of molding by resin. That is, it is possible to obtain a sensor case 200 that suppresses the influence of electromagnetic waves from the heating coil 14 on the infrared sensor 12 and is excellent in heat dissipation and strength due to metal. Moreover, it becomes possible to position the infrared sensor 12 in an exact position by using resin partially joining with respect to the surface of a metal member. The sensor case 200 can be reduced in size by integral molding, and the amount of expensive high heat-resistant resin used can be reduced, so that the cost of the sensor case 200 can be reduced. Furthermore, since the printed circuit board 123 of the infrared sensor 12 is supported via the resin member with respect to the metal member, an insulation distance can be ensured.

  Moreover, since the sensor case 200 is a metal member having a high reflectance, the radiant heat from the top plate 2 is reflected, and the influence of the radiant heat on the infrared sensor 12 is suppressed. Further, since the sensor case 200 has no opening other than the visual field opening 203a, the cooling air does not blow around the infrared sensor 12.

  Therefore, since the influence of electromagnetic waves, the influence of radiant heat, and the influence of cooling air on the infrared sensor 12 can be suppressed with a simple structure, the infrared sensor 12 having high resistance to various noises in the induction heating cooker 100. Can be provided.

In the first embodiment, the sensor case 200 that houses the infrared sensor 12 (thermopile type) has been described as an example. However, the sensor case 200 is applied to a photodiode-type infrared sensor that is affected by disturbance light. Light can be shielded.
Furthermore, for example, the sensor case 200 can be applied to an ultrasonic distance sensor or a Doppler distance sensor in which the oscillator becomes high temperature, and heat dissipation performance can be improved. In addition, by adopting the magnetic distance sensor, it is possible to block the influence of the magnetic field, and by adopting it in the optical (laser) sensor, it is possible to ensure the blocking of disturbance light and heat dissipation. It becomes possible.

Next, the spectral transmission characteristics of the top plate 2 will be described.
FIG. 11 is a graph showing the spectral transmission characteristics of the top plate of the induction heating cooker according to the first embodiment.
The graph of FIG. 11 shows, as an example, the transmittance τ of the top plate 2 made of crystallized glass having a thickness of about 4 mm and high heat resistance.
Moreover, FIG. 12 is a graph which shows the relationship between the spectral transmission characteristic of the top plate of the induction heating cooking appliance concerning Embodiment 1, and the spectral radiance curve in each temperature.
FIG. 12 shows the spectral radiance curve and the transmittance τ of the top plate 2 when the pan temperature is 150 ° C., 200 ° C., and 250 ° C.

  As can be seen from FIG. 11, the wavelength band with high transmittance in the top plate 2 is 0.6 μm to 2.6 μm, and then is 3.2 μm to 4.2 μm. In addition, referring to FIG. 12, the spectral radiance curves of the pan 10 at 150 ° C., 200 ° C., and 250 ° C. increase from around 2.0 μm. Accordingly, the value of the amount of infrared energy that reaches the infrared sensor 12 from the bottom of the pan 10, which is obtained by the product of the transmittance (%) and the spectral radiance, increases in the wavelength band of 3.2 μm to 4.2 μm. In order to detect temperature, it is necessary to detect infrared rays in this wavelength band. By detecting the wavelength band of 3.2 μm to 4.2 μm, it becomes possible to accurately measure the temperature range where the temperature of the pan bottom which is not easily affected by the attenuation by the top plate 2 is 140 ° C. or more.

The infrared sensor 12 detects infrared energy radiated from the bottom of the pan and infrared energy radiated from the lower surface of the top plate 2 when the top plate 2 is heated by heat conduction.
Infrared energy emitted from the top plate 2 is emitted at a high rate in a wavelength band longer than 4.5 μm, which is a region where the transmittance of the top plate 2 is low. The emissivity ε of glass is generally about 0.84 to 0.9, and has a high emissivity.
FIG. 13 is a graph showing a spectral radiance curve of a black body for each temperature.
As the temperature of the cooked food (pan 10) heated by the induction heating cooker 100, a temperature range lower than about 230 ° C. from boiling water to deep-fried food is used.

According to FIG. 13, the spectral radiance up to 250 ° C. is detected up to about 20 μm as the wavelength band.
For this reason, the amount of infrared energy emitted from the top plate 2 has a high influence as noise on the wavelength band of 3.2 μm to 4.2 μm that the infrared sensor 12 originally wants to detect.
By increasing the reflectance of the metal member of the sensor case 200 to such a long wavelength band, the infrared sensor 12 is resistant to radiation with a long wavelength emitted by the top plate 2.
Therefore, it is desirable that the metal member be surface-treated so as to have a high reflectance particularly in the infrared region of 0.1 μm to 20 μm. The surface treatment can be performed by plating or surface polishing to adjust the reflectance.

The radiation characteristic of the metal member of the sensor case 200 is represented by Kirchhoff's law [emissivity (ε) + transmittance (τ) + reflectance (ρ) = 1]. For an object that does not transmit heat, such as a metal surface, transmittance (τ) = 0, and emissivity (ε) = 1−reflectance (ρ). That is, as the reflectance (ρ) increases, the emissivity (ε) decreases.
Therefore, by increasing the reflectance of both surfaces of the metal member of the sensor case 200, it is possible to reflect the radiation from the top plate 2 on the outer surface of the metal member and to suppress the secondary radiation from the inner surface of the metal member. is there.
In this way, it is desirable to increase the reflectivity of both surfaces of the metal member in terms of resistance to radiation from the top plate 2, but even if the reflectivity of either the upper surface or the lower surface is increased, the sensor case 200 or the infrared sensor There is a certain effect of suppressing radiation of radiant heat to 12.

Embodiment 2. FIG.
The induction heating cooker according to the second embodiment includes the configuration of the induction heating cooker according to the first embodiment, and further, by cooperating with a home power system and an information device controller, In preparation for the situation, it is provided with a control capable of selecting resumption or stop of cooking.
A wireless communication receiver or the like provided in the induction heating cooker 100 is connected to a power system (energy management system) provided in the house or the Internet, and a control system for acquiring disaster information is constructed.

FIG. 14 is a configuration diagram showing an electric power system of the induction heating cooker according to the second embodiment.
The power source of the induction heating cooker according to the second embodiment is configured by drawing a system power source (commercial power source) 400 and an external power source (storage battery) 410 different from the system power source 400 into the house. This external power supply 410 converts a DC power charged in a lithium ion storage battery or the like into an AC power that can be used in the house and supplies it to the house.

  The switching distribution board 420 functions to select an AC power source to be supplied to each outlet (not shown) in the house from the system power source 400 and the external power source 410. The in-home controller 430 communicates with devices (not shown) such as the induction heating cooker 100, for example, by radio to perform energy management in the house.

FIG. 15 is a flowchart of the induction heating cooker according to Embodiment 2 when responding to an earthquake.
The induction heating cooker according to Embodiment 2 receives, for example, an electric power system (energy management system), earthquake information on various places on the Internet, and the like. The earthquake information includes the seismic intensity at the place of use of the induction heating cooker, the arrival time of the earthquake, and the like.
Therefore, as an example, an operation when one earthquake information of disaster information is received when cooking at a high temperature such as a fried food automatic cooking function is performed will be described below.

First, in step S1, the user presses the “fried food” key of the menu key 32 of the operation unit 3, and the control unit 23 is set in advance in step S2 according to the control sequence stored in the storage unit 21. The heating operation is started so as to be (for example, about 140 ° C. to 200 ° C. in the case of fried food).
In step S3, the control unit 23 reads temperature sensor information (Ttp = output temperature of the infrared temperature detection unit 24, Tth = output temperature of the top plate temperature detection unit 25).
Proceeding to step S4, the pan temperature estimated value (Tobj) is calculated using the output values of Ttp and Tth.
In step S5, preheating control is performed so that the calculated pan temperature estimated value (Tobj) becomes the target temperature.
In step S6, the receiver mounted in the main body 1 receives the earthquake information from the home controller 430, and confirms the presence or absence of the earthquake information.

If there is no earthquake information in step S6, the normal fried food control flow is entered, and the process proceeds to step S7.
In step S7, it is determined whether or not the pot temperature estimated value (Tobj) has reached the first target temperature. When it reaches, it progresses to step S8, preheating control is complete | finished, and it transfers to temperature maintenance control so that the pan temperature estimated value (Tobj) may be maintained at 1st target temperature in step S9. If it has not reached, the process returns to step S6.
In step S <b> 10, normal fried food cooking control is performed, and the control unit 23 performs heating control according to the control sequence stored in the storage unit 21.
In step S11, it is determined whether or not the maximum available heating time (for example, 45 minutes has been set) has elapsed since the start of cooking. If it has elapsed, the process proceeds to step S12, and the cooking by the fried food function is terminated. If not, the process returns to step S9.

Next, the case where there is earthquake information in step S6 will be described.
If there is earthquake information in step S6, it will progress to step S21 and will be in an earthquake notification mode. The control unit 23 notifies the user that earthquake information is contained by voice or display on the display unit 4.
In step S22, it is confirmed whether or not the pan temperature estimated value (Tobj) has reached the first target temperature. When it has reached, it progresses to step S23, and it is confirmed to a user by an audio | voice, the display on the display part 4, etc. whether heating is stopped. If the user instructs to stop heating, or if there is no input, the process proceeds to step S12 to forcibly stop heating. However, when there is no input, after the elapse of a predetermined time, re-notification may be performed before the heating is stopped. While the heating operation is stopped based on this earthquake information, for example, a display to that effect is displayed on the display unit 4.
In step S23, when the user instructs to continue heating, the process proceeds to step S24, temperature maintenance control is performed so that the estimated pan temperature value (Tobj) is maintained at the first target temperature, and the process proceeds to step S25. Control fried food cooking.

In step S22, when the pan temperature estimated value (Tobj) does not reach the first target temperature, the process proceeds to step S31, where the target temperature is lowered to the second target temperature lower than the first target temperature, and the preheating control is performed. Do. The second target temperature is set to about 100 ° C., for example, and is set to a temperature that can return to the first target temperature without taking time during reheating.
In step S <b> 32, it is confirmed to the user by voice, display on the display unit 4, etc., whether or not heating is stopped. If the user instructs to stop heating, or if there is no input, the process proceeds to step S12 to forcibly stop heating. However, when there is no input, after the elapse of a predetermined time, re-notification may be performed before the heating is stopped. While the heating operation is stopped based on this earthquake information, for example, a display to that effect is displayed on the display unit 4.

In step S32, when the user instructs to continue heating, the process proceeds to step S33, and the preheating control is continued so that the estimated pan temperature value (Tobj) is maintained at the second target temperature.
In step S34, it is confirmed whether or not the pan temperature estimated value (Tobj) has reached the second target temperature. If it has not reached, the process returns to step S32, and if it has reached, the process proceeds to step S35 to confirm whether or not to return to normal fried food cooking control by voice or display on the display unit 4. If there is an input that does not return to the normal deep-fried food cooking control, the process returns to step S32. If there is an input that returns to the normal deep-fried food cooking control, the process proceeds to step S36 to perform the normal deep-fried food cooking control.

In addition, when the control part 23 receives the confirmation report without an earthquake prediction by earthquake information at the time of the said earthquake response flow, the control which returns to the normal heating control after displaying the notification to that effect on the audio | voice or the display part 4 is performed. .
In step S22, if the estimated pan temperature value (Tobj) does not reach the first target temperature, the process proceeds to step S31, where the target temperature is lowered to the second target temperature lower than the first target temperature and preheated. Although control is performed, for example, if the magnitude of the earthquake is determined from the earthquake information and the seismic intensity is large, control for reducing the target temperature of the preheating control may be employed.

As described above, when performing earthquake response control of the induction heating cooker, it is important that the detected temperature of the object to be heated is accurate, and the resistance of the infrared sensor 12 is increased against noise in the induction heating cooker 100. It is necessary. In the induction cooking device according to the second embodiment, the configuration of the sensor case 200 of the infrared sensor 12 according to the first embodiment improves the infrared measurement accuracy. For example, the frying food automatic cooking control is performed. It is possible to provide protection and convenience for the user by performing control in preparation for an unexpected situation when a heated object is heated in a high temperature range of 140 ° C. or higher.
In addition, in Embodiment 2, although the case where the heating operation by a fried food automatic cooking function was performed was demonstrated as an example, it is not limited to this function, The heating at the time of receiving disaster information during various heating operation control It can be applied as a cooker.

  Although the first and second embodiments have been described above, the present invention is not limited to the description of each embodiment. For example, it is possible to combine all or some of the embodiments.

  DESCRIPTION OF SYMBOLS 1 Main body, 2 Top plate, 3 Operating part, 4 Display part, 5 Thermal power display part, 6 Heating port, 7 Transmission window part, 8 Exhaust port, 9 Intake port, 9a Intake port, 9b Intake port, 10 Pan, 12 Infrared Sensor, 12a Field of view range, 13 Coating, 14 Heating coil, 14a Inner heating coil, 14b Outer heating coil, 15 Clearance, 16 Heating coil support, 17 Contact type temperature sensor, 21 Storage unit, 22 Calculation unit, 23 Control unit, 24 Infrared temperature detection unit, 25 Top plate temperature detection unit, 26 High frequency inverter, 31 Thermal power setting key, 32 Menu key, 100 Induction heating cooker, 121 Condensing lens, 122 Encapsulating member, 123 Printed circuit board, 123a Positioning hole, 200 Sensor case, 201 side surface portion, 201a side surface opening, 202 bottom surface portion, 203 top surface portion, 03a Field opening, 203b Upper surface opening, 301 Mounting piece, 301a opening, 302 Substrate support member, 303 Joining member, 304 Engaging claw member, 304a Claw portion, 305 Positioning projection, 306 Energizing member, 400 System power supply, 410 External power source, 420 switching distribution board, 430 Home controller.

Claims (13)

A sensor case structure having a metal member and a resin member, and housing a sensor part in the metal member,
The resin member is partially joined to the metal member,
The sensor unit is attached to the metal member via the resin member,
The metal member is
It is formed so as to have a hollow structure with at least two parts made of nonmagnetic metal, and irregularities are formed on the surface of the metal member,
The resin member is
A sensor case structure, wherein the sensor case structure is formed on the surface on which irregularities are formed.   2. The sensor case structure according to claim 1, wherein the resin member includes a positioning protrusion that positions at least when the sensor portion is attached to the metal member.   3. The sensor case according to claim 1, wherein the metal member is formed by a main body having an upper surface opened and having a bottom surface portion and a side surface portion, and an upper surface portion blocking the opening of the upper surface. Construction.   The sensor case structure according to claim 3, wherein the resin member includes a support member that is formed on at least the bottom surface portion and on which the sensor portion is placed.   5. The sensor case structure according to claim 3, wherein the resin member includes an engaging member that engages at least the main body and the upper surface portion.   The sensor according to claim 3, wherein the resin member includes an urging member that is formed at least on the upper surface portion and urges the sensor portion toward the bottom surface portion. Case structure.   The sensor case structure according to claim 1, wherein the resin member is a polybutylene terephthalate resin or a polyphenylene sulfide resin.   The sensor case structure according to claim 1, wherein the sensor unit is an infrared sensor unit that detects infrared rays. A sensor case structure according to claim 8, a top plate, heating means, and control means,
The infrared sensor unit detects infrared rays emitted from an object to be heated on the top plate through the top plate,
The cooking device according to claim 1, wherein the control means performs capacity control of the heating means based on a value detected by the infrared sensor unit. It has a receiving means to receive disaster information from outside,
The cooking device according to claim 9, wherein the control unit includes a notification unit that notifies the user that the disaster information has been received when the reception unit receives the disaster information during the heating operation. .   When the receiving means receives the disaster information, the control means performs a notification for selecting whether or not to continue the heating operation with the notification means, and when there is an input to continue the heating operation, The cooking device according to claim 10, wherein the heating operation is stopped when there is an input to continue the operation and stop the heating operation.   12. The control unit according to claim 11, wherein the control unit stops the heating operation when there is no input when the notification unit performs notification for selecting whether to continue the heating operation. The cooking device described.   The cooking device according to any one of claims 10 to 12, wherein when the disaster information is received, the control means reduces the target heating temperature of the object to be heated.

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