JP2017082281A5 - - Google Patents

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JP2017082281A5
JP2017082281A5 JP2015211180A JP2015211180A JP2017082281A5 JP 2017082281 A5 JP2017082281 A5 JP 2017082281A5 JP 2015211180 A JP2015211180 A JP 2015211180A JP 2015211180 A JP2015211180 A JP 2015211180A JP 2017082281 A5 JP2017082281 A5 JP 2017082281A5
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aluminum alloy
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inevitable impurities
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2)Mn:0.2〜0.7質量%、Mg:2.0〜5.0質量%を含有し、残部Alおよび不可避不純物からなるAl−Mn−Mg系合金、Si:0.2〜0.8質量%、Mg:0.4〜1.2質量%、残部Alおよび不可避不純物からなるAl−Si−Mg系合金、ならびにZn:4.0〜6.5質量%、Mg:0.5〜3.0質量%、残部Alおよび不可避不純物からなるAl−Zn−Mg系合金のうちいずれか1つのアルミニウム合金からなる、上記1)の小型電子機器ケース用アルミニウム合金圧延板材。
2) Al—Mn—Mg-based alloy containing Mn: 0.2 to 0.7% by mass, Mg: 2.0 to 5.0% by mass, the balance Al and inevitable impurities, Si: 0.2 to 0.8% by mass, Mg: 0.4-1.2% by mass, Al—Si—Mg-based alloy composed of the balance Al and inevitable impurities, Zn: 4.0-6.5% by mass, Mg: 0.0. The aluminum alloy rolled plate for a small electronic device case according to the above 1), which is made of any one aluminum alloy among Al-Zn-Mg alloys composed of 5-3.0 mass%, the balance Al and inevitable impurities.

この発明による小型電子機器ケース用アルミニウム合金圧延板材(1)は、0.2%耐力が200MPa以上、好ましくは250MPa以上、より好ましくは300MPa以上のものである。これにより、所望のケースの強度が得られる。また、アルミニウム合金圧延板材(1)は、破断伸びが5%以上20%以下のものが好適に用いられる。これにより絞り加工の成形性が向上する。ここで、「0.2%耐力」および「破断伸び」は、JIS Z2241−2011に規定された、5号試験片を使用した、圧延方向に並行方向の引張試験によるものである。
また、アルミニウム合金圧延板材(1)は、厚さ方向と直交する方向にのびた繊維状の結晶組織を有している。
前記繊維状の結晶組織は、均質化処理したアルミニウム合金鋳魂を、熱間圧延後、所定の条件で熱処理を行い、その後に冷間圧延を行うことによって形成される。前記熱処理は、200〜400℃で1時間以上保持することにより行う。前記熱処理によって、MgSiを微細かつ均一に析出させるとともに、圧延材料中に存在する加工歪を減少させることができる。その後の冷間加工によって加工硬化させ、その後の成形加工性を損なわない範囲で高強度のアルミニウム合金圧延板材を得ることができる。
アルミニウム合金鋳魂の均質化処理の条件は特に限定されず、常法に従って500℃以上、2時間以上で行うのが好ましい。
熱間圧延では、任意のパス工程において所定の温度条件で圧延する間の温度降下により焼き入れと同等の効果を得る。従って、パス前の材料温度は、MgおよびSiが固溶された状態を保持しうる温度が必要であり、350〜440℃とする。パス上がり温度を上記200〜400℃の温度範囲とするためには、熱間圧延上がりで、直ちに高圧シャワー水冷等の強制冷却を行っても良い。また、焼き入れ効果を得るために、パス間の冷却速度は50℃/分以上、パス上がり温度は250〜340℃、また、パス圧延速度は50m/分以上、上り板厚が10mm以下とする。
冷間圧延では、加工硬化により所定の強度を得るために圧下率30%以上とする。好ましい圧下率は、50%以上である。
更に、必要に応じて、冷間圧延した合金板を130〜150℃の温度で最終焼鈍することができる。低温での熱処理を行うことにより、時効硬化させて更に強度を向上させるとともに、伸びを向上させることができる。また、機械的諸物性を安定化させる効果もある。
アルミニウム合金圧延板材(1)としては、以下のいずれかのアルミニウム合金からなるものが好適に用いられる。
i)Mn:0.2〜0.7質量%、Mg:2.0〜5.0質量%を含有し、残部Alおよび不可避不純物からなるAl−Mn−Mg系合金
ii)Si:0.2〜0.8質量%、Mg:0.4〜1.2質量%を含有し、残部Alおよび不可避不純物からなるAl−Si−Mg系合金
iii)Zn:4.0〜6.5質量%、Mg:0.5〜3.0質量%を含有し、残部Alおよび不可避不純物からなるAl−Zn−Mg系合金
上記i)の合金としては、Si:0.4質量%以下、Mn:0.4〜1.0質量%、Mg:4.0〜4.9質量%、Fe:0.4質量%以下、Cr:0.05〜0.25質量%、Zn:0.25質量%以下を含有し、残部Alおよび不可避不純物からなるアルミニウム合金が挙げられる。
上記ii)の合金としては、Si:0.2〜0.6質量%、Mg:0.45〜0.9質量%、Fe:0.35質量%以下、Cr:0.1質量%以下、Zn:0.1質量%以下を含有し、残部Alおよび不可避不純物からなるアルミニウム合金が挙げられる。
上記iii)の合金としては、Si:0.4質量%以下、Mg:2.1〜2.9質量%、Fe:0.5質量%以下、Cu:1.2〜2.0質量%、Mn:0.3質量%以下、Cr:0.18〜0.28質量%、Zn:5.1〜6.1質量%を含有し、残部Alおよび不可避不純物からなるアルミニウム合金が挙げられる。
これらの中でも、特に、Si:0.2〜0.6質量%、Mg:0.45〜0.9質量%、Fe:0.35質量%以下、Cr:0.1質量%以下、Zn:0.1質量%以下を含有し、残部Alおよび不可避不純物からなるアルミニウム合金よりなるアルミニウム合金圧延板材(1)が、小型電子機器ケースの成形材料として好適である。
また、使用するアルミニウム合金圧延板材(1)の厚さは、成形条件や成形品であるケースのサイズ等に応じて適宜設定されるが、好ましくは0.5〜3.5mm、より好ましくは0.8〜1.2mmとなされる。
The aluminum alloy rolled sheet material (1) for a small electronic device case according to the present invention has a 0.2% proof stress of 200 MPa or more, preferably 250 MPa or more, more preferably 300 MPa or more. Thereby, the intensity | strength of a desired case is obtained. In addition, as the aluminum alloy rolled sheet (1), those having a breaking elongation of 5% or more and 20% or less are preferably used. Thereby, the moldability of the drawing process is improved. Here, “0.2% proof stress” and “breaking elongation” are based on a tensile test parallel to the rolling direction using No. 5 test piece defined in JIS Z2241-2011.
The aluminum alloy rolled sheet (1) has a fibrous crystal structure extending in a direction orthogonal to the thickness direction.
The fibrous crystal structure is formed by subjecting a homogenized aluminum alloy cast soul to heat treatment under a predetermined condition after hot rolling, and then cold rolling. The said heat processing is performed by hold | maintaining at 200-400 degreeC for 1 hour or more. By the heat treatment, Mg 2 Si can be finely and uniformly precipitated, and processing strain existing in the rolled material can be reduced. It is possible to obtain a high-strength rolled aluminum alloy sheet within a range that does not impair subsequent workability by work hardening by subsequent cold working.
The conditions for the homogenization treatment of the aluminum alloy casting soul are not particularly limited, and it is preferably performed at 500 ° C. or more for 2 hours or more according to a conventional method.
In hot rolling, the same effect as quenching is obtained by a temperature drop during rolling at a predetermined temperature condition in an arbitrary pass process. Accordingly, the material temperature before the pass needs to be a temperature at which Mg and Si can be kept in a solid solution state, and is set to 350 to 440 ° C. In order to set the pass rising temperature in the temperature range of 200 to 400 ° C., forced cooling such as high pressure shower water cooling may be performed immediately after hot rolling. Further, in order to obtain a quenching effect, the cooling rate between passes is 50 ° C./min or more, the pass rising temperature is 250 to 340 ° C., the pass rolling rate is 50 m / min or more, and the ascending plate thickness is 10 mm or less. .
In cold rolling, the rolling reduction is 30% or more in order to obtain a predetermined strength by work hardening. A preferable rolling reduction is 50% or more.
Furthermore, the cold-rolled alloy plate can be finally annealed at a temperature of 130 to 150 ° C., if necessary. By performing the heat treatment at a low temperature, the strength can be further improved by age hardening, and the elongation can be improved. It also has the effect of stabilizing mechanical properties.
As the aluminum alloy rolled sheet (1), one made of any of the following aluminum alloys is preferably used.
i) Al—Mn—Mg-based alloy containing Mn: 0.2 to 0.7% by mass, Mg: 2.0 to 5.0% by mass, the balance being Al and inevitable impurities ii) Si: 0.2 -0.8 mass%, Mg: 0.4-1.2 mass%, Al-Si-Mg-based alloy iii consisting of the balance Al and inevitable impurities iii) Zn: 4.0-6.5 mass%, Mg: Al-Zn-Mg-based alloy containing 0.5 to 3.0% by mass, the balance being Al and inevitable impurities As the alloy of i), Si: 0.4% by mass or less, Mn: 0. 4-1.0 mass%, Mg: 4.0-4.9 mass%, Fe: 0.4 mass% or less, Cr: 0.05-0.25 mass%, Zn: 0.25 mass% or less The aluminum alloy which contains and consists of remainder Al and an unavoidable impurity is mentioned.
As the alloy of ii), Si: 0.2 to 0.6 mass%, Mg: 0.45 to 0.9 mass%, Fe: 0.35 mass% or less, Cr: 0.1 mass% or less, Zn: An aluminum alloy containing 0.1% by mass or less and composed of the balance Al and inevitable impurities may be mentioned.
As the alloy of the above iii), Si: 0.4 mass% or less, Mg: 2.1-2.9 mass%, Fe: 0.5 mass% or less, Cu: 1.2-2.0 mass%, Examples include an aluminum alloy containing Mn: 0.3% by mass or less, Cr: 0.18 to 0.28% by mass, Zn: 5.1 to 6.1% by mass, and the balance Al and inevitable impurities.
Among these, Si: 0.2-0.6 mass%, Mg: 0.45-0.9 mass%, Fe: 0.35 mass% or less, Cr: 0.1 mass% or less, Zn: An aluminum alloy rolled sheet material (1) made of an aluminum alloy containing 0.1% by mass or less and the balance Al and inevitable impurities is suitable as a molding material for a small electronic device case.
Further, the thickness of the aluminum alloy rolled sheet (1) to be used is appropriately set according to the molding conditions, the size of the case as a molded product, etc., but is preferably 0.5 to 3.5 mm, more preferably 0. .8 to 1.2 mm.

図2は、小型電子機器ケース(10)を示すものである。このケース(10)は、アルミニウム合金圧延板材(1)を絞り加工することにより得られた成形品に、部分的に切削加工を施して仕上げ成形した後、表面をアルマイト処理してなるものである。
小型電子機器ケース(10)は、略方形状の底壁(11)と、底壁(11)の周縁から立ち上がった側壁(12)とで構成されている。
側壁(12)の高さ(換言すれば、成形高さ)は、0.5〜25mm、好ましくは1〜15mm、さらに好ましくは2〜10mmである。
底壁(11)に対する側壁(12)の角度は、90〜170°(図示のものは約90°)、好ましくは90〜145°、さらに好ましくは90〜120°である。
底壁(11)と側壁(12)との境界部にはアールが付けられており、また、側壁(12)のコーナー部(12a)にもアールが付けられている。これらアール部分においては、繊維状の結晶組織が、アールに沿うようにのびている。
FIG. 2 shows a small electronic device case (10). This case (10) is formed by subjecting a molded product obtained by drawing the aluminum alloy rolled sheet (1) to a partial cutting process and finish molding, and then anodizing the surface. .
The small electronic device case (10) includes a substantially rectangular bottom wall (11) and a side wall (12) rising from the periphery of the bottom wall (11).
The height of the side wall (12) (in other words, the molding height) is 0.5 to 25 mm, preferably 1 to 15 mm, and more preferably 2 to 10 mm.
The angle of the side wall (12) with respect to the bottom wall (11) is 90 to 170 ° (the one shown is about 90 °), preferably 90 to 145 °, more preferably 90 to 120 °.
The corners (12a) of the side walls (12) are also rounded at the boundary between the bottom wall (11) and the side walls (12). In these round portions, the fibrous crystal structure extends along the round.

<実施例3>
Si:0.4質量%以下、Mg:2.1〜2.9質量%、Fe:0.5質量%以下、Cu:1.2〜2.0質量%、Mn:0.3質量%以下、Cr:0.18〜0.28質量%、Zn:5.1〜6.1質量%を含有し、残部Alおよび不可避不純物からなるアルミニウム合金鋳塊を、実施例2と同一の工程・条件で圧延することにより、0.2%耐力が550MPa、破断伸びが9%である厚さ1.5mmのアルミニウム合金圧延板材を得た。
上記板材の断面を、光学顕微鏡および偏向レンズによって観察したところ、厚さ方向と直交する方向にのびる繊維状の結晶組織が見られた。
このアルミニウム合金圧延板材を、縦150mm、横82mm、コーナー部アール14.5mmの略方形状にカットして、実施例3の成形材料を作製した。
<Example 3>
Si: 0.4% by mass or less, Mg: 2.1-2.9% by mass, Fe: 0.5% by mass or less, Cu: 1.2-2.0% by mass, Mn: 0.3% by mass or less , Cr: 0.18 to 0.28 mass%, Zn: 5.1 to 6.1 mass%, the aluminum alloy ingot consisting of the balance Al and inevitable impurities, the same process and conditions as in Example 2 Was rolled to obtain an aluminum alloy rolled sheet having a thickness of 1.5 mm and a 0.2% proof stress of 550 MPa and a breaking elongation of 9%.
When the cross section of the plate was observed with an optical microscope and a deflecting lens, a fibrous crystal structure extending in a direction perpendicular to the thickness direction was observed.
The aluminum alloy rolled sheet material, vertical 150 mm, horizontal 82mm, and cut into a substantially square shape of the corner portion rounded 14.5 mm, to prepare a molding material of Example 3.

JP2015211180A 2015-10-27 2015-10-27 Small sized electronic device case, molding method thereof and aluminum alloy rolled laminate sheet material for small sized electronic device case Pending JP2017082281A (en)

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CN106391851B (en) * 2016-09-18 2018-07-17 广东欧珀移动通信有限公司 Moulding process, former, metal-back and the electronic equipment of metal-back
US11133572B2 (en) * 2018-08-30 2021-09-28 Apple Inc. Electronic device with segmented housing having molded splits
CN115011848B (en) * 2022-05-11 2023-03-28 北京理工大学 High-purity aluminum alloy conductor and preparation method thereof

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JP3438993B2 (en) * 1995-05-16 2003-08-18 古河電気工業株式会社 Al-Mg based alloy sheet excellent in bending workability and method for producing the same
DE60336891D1 (en) * 2002-03-01 2011-06-09 Showa Denko Kk METHOD FOR PRODUCING A PLATE OF Al-Mg-Si ALLOYING
CN101325849B (en) * 2007-06-14 2011-07-27 鸿富锦精密工业(深圳)有限公司 Metal casing and shaping method thereof
JP5059505B2 (en) * 2007-07-19 2012-10-24 株式会社神戸製鋼所 Aluminum alloy cold-rolled sheet that can be formed with high strength
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JP6085473B2 (en) * 2012-12-25 2017-02-22 三菱アルミニウム株式会社 Aluminum alloy plate with excellent press formability
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