JP2017078174A - Resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition which has excellent long-term adhesion reliability and excellent circuit embedding properties.SOLUTION: The resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler. The epoxy resin (A) contains a silsesquioxane-modified epoxy resin. The content of the silsesquioxane-modified epoxy resin is 0.1-5 mass% based on 100 mass% of a nonvolatile component in the resin composition. The silsesquioxane-modified epoxy resin has an epoxy equivalent of 100-3,000 and a viscosity at 25°C of 1-200 mPa s.SELECTED DRAWING: None

Description

The present invention relates to a resin composition. Furthermore, it is related with the sheet-like laminated material, multilayer printed wiring board, and semiconductor device containing the said resin composition.

In recent years, miniaturization and high performance of electronic devices have progressed, and in a semiconductor package substrate, a build-up layer has been formed into multiple layers, and miniaturization and high density of wiring have been demanded.

Various efforts were made against this. For example, Patent Document 1 discloses a curable resin composition characterized by containing an epoxy group-containing silsesquioxane substantially free of silanol groups and an epoxy resin curing agent as essential components. It is described to provide a curable resin composition capable of curing which has solved the drawback that the stability of the curable composition is very poor. However, no consideration has been given to circuit embedding and long-term adhesion reliability.

JP 2012-180463 A

According to the knowledge of the present inventors, when a multilayer printed wiring board was produced using a resin composition having excellent circuit embedding properties, long-term adhesion reliability was confirmed by an environmental test under high temperature and high humidity. It was found that the adhesion strength between the cured product of the resin composition and the conductor layer formed on the cured product was lowered.

Therefore, the problem to be solved by the present invention is to provide a resin composition having excellent long-term adhesion reliability between a cured product of a resin composition and a conductor layer formed on the cured product, and also having excellent circuit embedding properties. The purpose is to provide.

As a result of intensive studies to solve the above problems, the present inventors have found that (A) an epoxy resin, (B)
A resin composition comprising a curing agent and (C) an inorganic filler, wherein the (A) epoxy resin contains the (A1) silsesquioxane-modified epoxy resin, and the (A1) silsesquioxane-modified In the resin composition whose content of an epoxy resin is a specific range, it came to complete this invention.

That is, the present invention includes the following contents.
[1] A resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein (A) the epoxy resin is (A1) a silsesquioxane-modified epoxy resin. In addition, when the nonvolatile component in the resin composition is 100% by mass, the content of the (A1) silsesquioxane-modified epoxy resin is 0.1 to 5% by mass.
[2] The epoxy equivalent of the (A1) silsesquioxane-modified epoxy resin is 100 to 3
[1] The resin composition according to [1].
[3] The viscosity of the (A1) silsesquioxane-modified epoxy resin at 25 ° C. is 1 to 20
The resin composition according to [1] or [2], which is 0 mPa · s.
[4] The (A1) silsesquioxane-modified epoxy resin is a compound obtained by reacting (a1) an epoxy resin having a hydroxyl group and (a2) a silsesquioxane derivative by dehydration condensation [1] to [3 ] The resin composition in any one of these.
[5] The resin composition according to any one of [1] to [4], wherein the (B) curing agent is one or more selected from a phenolic curing agent, a cyanate ester curing agent and an active ester curing agent. object.
[6] The resin according to any one of [1] to [5], wherein the content of the inorganic filler (C) is 30 to 90% by mass when the nonvolatile component in the resin composition is 100% by mass. Composition.
[7] The resin composition according to any one of [1] to [6], wherein an average particle diameter of the (C) inorganic filler is 0.01 to 5 μm.
[8] The (A) epoxy resin includes (A2) another epoxy resin, and the (A2) other epoxy resin is a bisphenol A type epoxy resin, a naphthalene type epoxy resin, a biphenyl type epoxy resin, or a dicyclopentadiene type epoxy. 1 type or more selected from resin, 1 type or more selected from phenol type hardening | curing agent, cyanate ester type hardening | curing agent, and active ester type hardening | curing agent as said (B) hardening | curing agent, (C) inorganic filling The resin composition according to any one of [1] to [7], which contains silica as a material.
[9] The (A) epoxy resin includes (A2) another epoxy resin, and the (A2) other epoxy resin is selected from bisphenol A type epoxy resin, naphthalene type epoxy resin, and dicyclopentadiene type epoxy resin. [1] to [1], including an active ester type curing agent as the (B) curing agent, and silica as the (C) inorganic filler.
8] The resin composition according to any one of
[10] The resin composition according to any one of [1] to [9], further comprising (D) a polymer resin.
[11] The resin composition according to any one of [1] to [10], which is a resin composition for forming an insulating layer of a multilayer printed wiring board.
[12] A resin composition for forming a buildup layer of a multilayer printed wiring board [1] to [11
] The resin composition in any one of these.
[13] A sheet-like laminated material using the resin composition according to any one of [1] to [12].
[14] An adhesive film or prepreg comprising the resin composition according to any one of [1] to [12].
[15] A cured product obtained by thermosetting the resin composition according to any one of [1] to [12].
[16] The cured product according to [15], wherein the surface of the cured product after the roughening treatment has an arithmetic average roughness of 10 to 200 nm and a root mean square roughness of 20 to 300 nm.
[17] A conductor layer is formed by plating on the surface of the cured product after the roughening treatment, and the plating peel strength after an environmental test between the surface of the cured product and the conductor layer is 0.25 to 0.8 kgf / cm. [15
] Or [16] cured product.
[18] A multilayer printed wiring board having an insulating layer formed of the cured product according to any one of [15] to [17].
[19] A semiconductor device using the multilayer printed wiring board according to [18].

ADVANTAGE OF THE INVENTION According to this invention, it came to be able to provide the resin composition which was excellent in the long-term contact | adherence reliability of the hardened | cured material of a resin composition, and the conductor layer formed on this hardened | cured material, and was excellent also in the circuit embedding property. .

The present invention is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the (A) epoxy resin contains a silsesquioxane-modified epoxy resin, When the nonvolatile component in the resin composition is 100% by mass, the content of the silsesquioxane-modified epoxy resin is 0.1 to 5% by mass. Hereinafter, the compounding components of the resin composition will be described in detail.

<(A) Epoxy resin>
The (A) epoxy resin used in the present invention can improve long-term adhesion reliability by including (A1) a silsesquioxane-modified epoxy resin. (A1) The silsesquioxane-modified epoxy resin is not particularly limited as long as it is an epoxy resin including a silsesquioxane structure. For example, (a1) an epoxy resin having a hydroxyl group and (a2)
Examples thereof include a compound obtained by reacting a silsesquioxane derivative with dehydration condensation.

(A1) Epoxy resins having a hydroxyl group include bisphenol type (bisphenol A
Type, bisphenol F type, etc.) epoxy resin, phenol novolac type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin, etc., the viscosity of the silsesquioxane modified epoxy resin itself is lowered, and the circuit of the resin composition In order to ensure the embedding property, it is preferable to use a bisphenol type epoxy resin.

(A2) The silsesquioxane derivative may be a silsesquioxane having a basic constituent unit of [RSiO _1.5 ] _n , and may be a random silsesquioxane, a ladder silsesquioxane, a cage silsesquioxane, or a cage silsesquioxane. Random type silsesquioxane is preferably used in order to lower the viscosity of the silsesquioxane-modified epoxy resin itself and to ensure circuit embedding property of the resin composition. In addition, since the (a2) silsesquioxane derivative has an epoxy group, the cross-linked portion of the cured product of the resin composition is increased, the heat resistance of the cured product is improved, and long-term adhesion reliability is improved. Silsesquioxane derivatives having a group are preferred. In addition, since the (a2) silsesquioxane derivative has an alkoxy group, adhesion with a metal is improved and long-term adhesion reliability is improved. Therefore, a silsesquioxane derivative having an alkoxy group is preferable. That is, a silsesquioxane derivative having an epoxy group and an alkoxy group is more preferable.

(A1) As one embodiment of the silsesquioxane-modified epoxy resin, a compound in which a bisphenol type epoxy resin having a hydroxyl group and a random type silsesquioxane are reacted by dehydration condensation is preferable, and the following general formula (1) is exemplified. .

(R ₁ includes a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, and preferably a hydrogen atom and a methyl group. R ₂ includes a hydroxyl group, an alkoxy group, a glycidoxyalkyl group, and the like. A glycidoxyalkyl group is preferable, and a methoxy group, an ethoxy group, and a glycidoxypropyl group are more preferable, and the ratio of the number of alkoxy groups to glycidoxyalkyl groups in R ₂ is preferably 0.1: 1 to 1 0.5: 1 is preferable, and n is an average value of 1 to 1.
10 is mentioned, and 1-8 are more preferable. )

The commercially available (A1) silsesquioxane-modified epoxy resin, Arakawa Chemical Co., Ltd. "Compoceran E150" (Arakawa Chemical Industries, Ltd., the above general formula (1), R ₁ is a methyl group And _two of R ₂ are methoxy groups and seven are glycidoxypropyl groups).

(A1) The epoxy equivalent of the silsesquioxane-modified epoxy resin is not particularly limited, but is preferably 100 to 3000, more preferably 300 to 2000, and 500 to 1500.
Is more preferable, and 700 to 1200 is particularly preferable. This makes it possible to improve the circuit embedding property, the crosslinking density of the cured product of the resin composition is sufficient, and the long-term adhesion reliability can be improved by improving the heat resistance. In this case, the handling property can be improved without becoming brittle. In addition, epoxy equivalent (g / eq) is the mass of resin containing 1 equivalent of epoxy groups, and is JIS K7236: 2.
It can be measured according to 001.

The viscosity at 25 ° C. of the (A1) silsesquioxane-modified epoxy resin is not particularly limited, but is preferably 1 to 200 mPa · s, more preferably 5 to 100 mPa · s,
50 mPa · s is more preferable. Thereby, the point which can improve circuit embedding property, the point which can improve a handleability by the tack prevention in the case of an adhesive film form, etc. are excellent. The viscosity was measured using an E-type viscometer (RE-made by Toki Sangyo Co., Ltd.).
80) in an apparatus adjusted to 25 ° C., and using a syringe, the epoxy resin is about 0.
It can be measured at a rotation speed set to 5 to 20 rpm by measuring 2 ml.

(A1) The content of the silsesquioxane-modified epoxy resin is 0.1 to 5% by mass when the nonvolatile component in the resin composition is 100% by mass. From the viewpoint of improving long-term adhesion reliability, 0.2% by mass or more is preferable, 0.3% by mass or more is more preferable, and 0.5% by mass or more is more preferable. On the other hand, it is preferably 4.5% by mass or less, more preferably 4% by mass or less, and still more preferably 3.5% by mass or less from the viewpoint of ensuring circuit embedding.

In the resin composition of the present invention, within the range in which the effect of the present invention is exhibited, (A
1) A silsesquioxane-modified epoxy resin and (A2) another epoxy resin can be used in combination. (A2) Other epoxy resins include, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin , Naphthol type epoxy resin, naphthalene type epoxy resin, naphthylene ether type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, anthracene type Epoxy resin, linear aliphatic epoxy resin,
Examples include epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane dimethanol type epoxy resins, trimethylol type epoxy resins, halogenated epoxy resins, and the like. One or more selected from A-type epoxy resins, naphthalene-type epoxy resins, biphenyl-type epoxy resins and dicyclopentadiene-type epoxy resins are preferred. These may be used alone or in combination of two or more.

When (A1) a silsesquioxane-modified epoxy resin and (A2) another epoxy resin are included, the non-volatile component of (A) the epoxy resin is 1 in terms of improving the compatibility as the resin composition.
When it is 00% by mass, 2-30% by mass of (A1) silsesquioxane-modified epoxy resin
It is preferable that it is 3-25 mass%, and it is still more preferable that it is 4-20 mass%.

<(B) Curing agent>
(B) Curing agent used in the present invention is not particularly limited, but phenolic curing agent,
Examples include cyanate ester curing agents, active ester curing agents, and benzoxazine curing agents. From the viewpoint of contributing to low roughness, phenol curing agents, cyanate ester curing agents, and active ester curing agents. It is preferable to use one or more selected, more preferable to use one or more selected from a cyanate ester curing agent and an active ester curing agent, and it is even more preferable to use an active ester curing agent. These may be used alone or in combination of two or more.

Although there is no restriction | limiting in particular as a phenol type hardening | curing agent, One or more types selected from a biphenyl type hardening | curing agent, a naphthalene type hardening | curing agent, a phenol novolak type hardening | curing agent, a naphthylene ether type hardening | curing agent, and a triazine skeleton containing phenol type hardening | curing agent. Is preferably used. In particular,
Biphenyl type curing agents MEH-7700, MEH-7810, MEH-7785 (Maywa Kasei Co., Ltd.), naphthalene type curing agents NHN, CBN, GPH (Nippon Kayaku Co., Ltd.), S
N170, SN180, SN190, SN475, SN485, SN495, SN375
SN395 (manufactured by Nippon Steel Chemical Co., Ltd.), EXB9500 (manufactured by DIC Corporation), phenol novolac type curing agent TD2090 (manufactured by DIC Corporation), naphthylene ether type curing agent EXB-6000 (DIC (manufactured by DIC Corporation)) Co., Ltd.), a triazine skeleton-containing phenolic curing agent LA3
018, LA7052, LA7054, LA1356 (manufactured by DIC Corporation) and the like. These may be used alone or in combination of two or more.

Although there is no restriction | limiting in particular as cyanate ester type hardening | curing agent, Novolac type (phenol novolak type, alkylphenol novolak type, etc.) cyanate ester type hardening agent, dicyclopentadiene type cyanate ester type hardening agent, bisphenol type (bisphenol A type, bisphenol) Fate, bisphenol S type, etc.) cyanate ester curing agents, and prepolymers in which these are partially triazines. Although the weight average molecular weight of a cyanate ester hardening | curing agent is not specifically limited, 500-4500 are preferable and 600-3000 are more preferable. As a specific example of a cyanate ester curing agent,
For example, bisphenol A dicyanate, polyphenol cyanate (oligo (3-methylene-1,5-phenylene cyanate), 4,4′-methylenebis (2,6-dimethylphenyl cyanate), 4,4′-ethylidene diphenyl dicyanate, hexa Fluorobisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1,
1-bis (4-cyanatephenylmethane), bis (4-cyanate-3,5-dimethylphenyl) methane, 1,3-bis (4-cyanatephenyl-1- (methylethylidene)
) Polyfunctional cyanate resins derived from bifunctional cyanate resins such as benzene, bis (4-cyanatephenyl) thioether, bis (4-cyanatephenyl) ether, phenol novolacs, cresol novolacs, dicyclopentadiene structure-containing phenol resins, Examples include prepolymers in which these cyanate resins are partially triazine. These may be used alone or in combination of two or more. As a commercially available cyanate ester resin, a phenol novolac type polyfunctional cyanate ester resin represented by the following formula (2) (manufactured by Lonza Japan Co., Ltd., PT30S, cyanate equivalent 124), represented by the following formula (3): Prepolymer (part of Lonza Japan Co., Ltd., BA230S, cyanate equivalent 232), containing dicyclopentadiene structure represented by the following formula (4) Examples include cyanate ester resins (Lonza Japan Co., Ltd., DT-4000, DT-7000).

[In formula, n shows arbitrary numbers (preferably 0-20) as an average value. ]

(In formula, n represents the number of 0-5 as an average value.)

Although there is no restriction | limiting in particular as an active ester type hardening | curing agent, Generally ester groups with high reaction activity, such as phenol ester, thiophenol ester, N-hydroxyamine ester, ester of heterocyclic hydroxy compound, are in 1 molecule. A compound having two or more in the above is preferably used. The active ester curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid,
Examples include isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol , Dicyclopentadienyl diphenol, phenol novolac and the like. 1 type (s) or 2 or more types can be used for an active ester type hardening | curing agent. As the active ester curing agent, specifically, an active ester curing agent having a dicyclopentadienyl diphenol structure, an active ester curing agent having a naphthalene structure, an active ester curing agent which is an acetylated product of phenol novolac, An active ester curing agent that is a benzoylated product of phenol novolac is preferable, and among them, an active ester curing agent containing a dicyclopentadienyl diphenol structure is more preferable in terms of excellent peel strength. As an active ester type curing agent, JP-A-2004-27.
An active ester curing agent disclosed in Japanese Patent No. 7460 may be used, or a commercially available product may be used. Commercially available products include those containing a dicyclopentadienyl diphenol structure, EXB9451, EXB9460, EXB9460S-65T, HPC800.
0-65T (manufactured by DIC Corporation, active group equivalent of about 223), DC808 (manufactured by Mitsubishi Chemical Co., Ltd., active group equivalent of about 1 as an active ester-based curing agent which is an acetylated product of phenol novolak)
49), YL as an active ester curing agent which is a benzoylated product of phenol novolac
H1026 (Mitsubishi Chemical Corporation, active group equivalent of about 200), YLH1030 (Mitsubishi Chemical Corporation, active group equivalent of about 201), YLH1048 (Mitsubishi Chemical Corporation, active group equivalent of about 245)
) And the like.

More specifically, examples of the active ester curing agent containing a dicyclopentadienyl diphenol structure include a compound represented by the following formula (5).

(In the formula, R is a phenyl group or a naphthyl group, k represents 0 or 1, and n is 0.05 to 2.5 on the average of repeating units.)

From the viewpoint of reducing the dielectric loss tangent and improving the heat resistance, R is preferably a naphthyl group, while k is preferably 0 and n is preferably 0.25 to 1.5.

The benzoxazine-based curing agent is not particularly limited, but specific examples include F-a, P
-D (manufactured by Shikoku Kasei Co., Ltd.), HFB2006M (manufactured by Showa Polymer Co., Ltd.), and the like.

(B) From the viewpoint of low roughness, the content of the curing agent is preferably 2 to 30% by mass and more preferably 5 to 20% by mass when the nonvolatile component in the resin composition is 100% by mass.

In the resin composition of the present invention, from the viewpoint of improving the mechanical strength and water resistance of the cured product of the resin composition, the ratio of the total number of epoxy groups of the epoxy resin and the total number of reactive groups of the curing agent is: 1: 0.2-1: 2 is preferable, 1: 0.3-1: 1.5 is more preferable, 1: 0.4
More preferred is ˜1: 1. The total number of epoxy groups of the epoxy resin present in the resin composition is a value obtained by dividing the solid content mass of each epoxy resin by the epoxy equivalent for all epoxy resins, and the reactive group of the curing agent. The total number of is a value obtained by adding the values obtained by dividing the solid mass of each curing agent by the reactive group equivalent for all curing agents.

<(C) Inorganic filler>
The inorganic filler (C) used in the present invention is not particularly limited. For example, silica,
Alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, titanic acid Examples include magnesium, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate. Of these, silica such as amorphous silica, pulverized silica, fused silica, crystalline silica, synthetic silica, hollow silica, and spherical silica is preferable. In particular, fused silica and spherical silica are more preferable in terms of reducing the surface roughness of the insulating layer. Preferably, spherical fused silica is more preferable. You may use these 1 type or in combination of 2 or more types. Examples of commercially available spherical fused silica include “SOC2” and “SOC1” manufactured by Admatechs Co., Ltd.

(C) Although the average particle diameter of the inorganic filler is not particularly limited, it is preferably 5 μm or less, more preferably 3 μm or less from the viewpoint that the surface of the insulating layer has low roughness and enables fine wiring formation. 2 μm or less is more preferable, 1 μm or less is even more preferable, 0.8 μm
m or less is particularly preferable, and 0.6 μm or less is particularly preferable. On the other hand, when the resin composition is a resin varnish, it is preferably 0.01 μm or more, more preferably 0.03 μm or more, from the viewpoint of preventing the viscosity of the varnish from increasing and handling properties from decreasing. 05 μm or more is more preferable, 0.07 μm or more is further more preferable, and 0.1 μm or more is particularly preferable. The average particle diameter of the inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared on a volume basis by a laser diffraction / scattering particle size distribution measuring apparatus, and the median diameter can be measured as the average particle diameter. As the measurement sample, an inorganic filler dispersed in water by ultrasonic waves can be preferably used. As a laser diffraction scattering type particle size distribution analyzer,
LA-950 manufactured by HORIBA, Ltd. can be used.

(C) The content of the inorganic filler is preferably 30% by mass or more when the nonvolatile component in the resin composition is 100% by mass from the viewpoint of preventing cracks in the multilayer printed wiring board.
0 mass% or more is more preferable, 50 mass% or more is still more preferable, and 60 mass% or more is still more preferable. On the other hand, 90 mass% or less is preferable, 85 mass% or less is more preferable, and 80 mass% or less is still more preferable from the point which prevents hardened | cured material from becoming weak and the point which prevents a peeling strength fall. In particular, in the present invention, in a resin composition containing 50% by mass or more of an inorganic filler, it is possible to improve long-term adhesion reliability although the peel strength after an environmental test tends to decrease.

(C) The inorganic filler is preferably surface-treated with a surface treatment agent. Specifically, an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, and a styrylsilane coupling agent. One or more selected from acrylate silane coupling agents, isocyanate silane coupling agents, sulfide silane coupling agents, vinyl silane coupling agents, silane coupling agents, organosilazane compounds and titanate coupling agents It is more preferable to perform surface treatment with the surface treatment agent. Thereby, the dispersibility and moisture resistance of (C) inorganic filler can be improved.

Specifically, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldiethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane N-2 (-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3
-Aminosilane coupling agents such as aminopropyldimethoxymethylsilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyl (dimethoxy) Methylsilane, glycidylbutyltrimethoxysilane, 2- (3
, 4-epoxycyclohexyl) ethyltrimethoxysilane and other epoxysilane coupling agents, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 11-mercaptoundecyltrimethoxy Mercaptosilane coupling agents such as silane, styrylsilane coupling agents such as p-styryltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyldimethoxysilane , 3-methacryloxypropyltriethoxysilane, 3-
Acrylate silane coupling agents such as methacryloxypropyldiethoxysilane,
Isocyanate silane coupling agents such as 3-isocyanatopropyltrimethoxysilane, bis (triethoxysilylpropyl) disulfide, sulfide silane coupling agents such as bis (triethoxysilylpropyl) tetrasulfide, methyltrimethoxysilane, octadecyltri Silane coupling agents such as methoxysilane, phenyltrimethoxysilane, methacryloxypropyltrimethoxysilane, imidazolesilane, triazinesilane, t-butyltrimethoxysilane, hexamethyldisilazane, 1,3-divinyl-1,1, 3,3-tetramethyldisilazane, hexaphenyldisilazane, trisilazane, cyclotrisilazane, 2,2,4,4,6,6-hexamethylcyclotrisilazane, octamethylcyclotetrasilazane , Hexabutyldisilazane, hexaoctyldisilazane, 1,3-diethyltetramethyldisilazane, 1,3-di-n-octyltetramethyldisilazane, 1,3-diphenyltetramethyldisilazane, 1,3-dimethyl Tetraphenyldisilazane, 1,3-diethyltetramethyldisilazane, 1,1,3,3-tetraphenyl-1,3-dimethyldisilazane, 1,3-dipropyltetramethyldisilazane, hexamethylcyclotrisilazane , Organosilazane compounds such as dimethylaminotrimethylsilazane, tetramethyldisilazane, tetra-n-butyl titanate dimer, titanium-i-
Propoxyoctylene glycolate, tetra-n-butyl titanate, titanium octylene glycolate, diisopropoxy titanium bis (triethanolaminate), dihydroxy titanium bis lactate, dihydroxy bis (ammonium lactate) titanium, bis (dioctyl pyrophosphate) ethylene titanate Bis (dioctylpyrophosphate) oxyacetate titanate, tri-n-butoxytitanium monostearate,
Tetra-n-butyl titanate, tetra (2-ethylhexyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) Bis (ditridecyl) phosphite titanate, isopropyl trioctanoyl titanate, isopropyl tricumyl phenyl titanate, isopropyl triisostearoyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tri (dioctyl phosphate) titanate, isopropyl tri Dodecylbenzenesulfonyl titanate, isopropyl tris (dioctyl pyrophosphate) Titanate, isopropyl tri (N- amidoethyl-aminoethyl) titanate coupling agents such as titanates. Of these, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, and organosilazane compounds are preferred. Commercially available products include “KBM403” (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., “KBM803” (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Co., Ltd. "KBE903" (3-aminopropyltriethoxysilane) manufactured by Co., Ltd. "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "SZ" manufactured by Shin-Etsu Chemical Co., Ltd. -31 "(hexamethyldisilazane) and the like.

Moreover, in the inorganic filler surface-treated with the surface treatment agent, the amount of carbon per unit surface area of the inorganic filler can be determined by analyzing the surface composition of the inorganic filler. Specifically, an inorganic filler surface-treated with a surface treatment agent is added to MEK, and after ultrasonic cleaning at 25 ° C. for 5 minutes, the supernatant is removed and the solid content is dried. Thereafter, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. Examples of the carbon analyzer include “EMIA-320V” manufactured by HORIBA, Ltd.

The amount of carbon per unit surface area of the inorganic filler is preferably 0.05 mg / m ² or more in terms of improving the dispersibility of the inorganic filler and stabilizing the root mean square roughness after the wet roughening step of the cured product. 0.1 mg / m ² or more is more preferable, 0.15 mg / m ² or more is further preferable, and 0.2 mg / m ² or more is even more preferable. On the other hand, it is preferably 1 mg / m ² or less in view of preventing the melt viscosity of the resin varnish and the increase in melt viscosity in the form of an adhesive film.
75 mg / m ^2, more preferably less, 0.5 mg / m ² or less is more preferable.

The inorganic filler surface-treated with the surface treatment agent is preferably added to the resin composition after the inorganic filler is surface-treated with the surface treatment agent. In this case, the dispersibility of the inorganic filler can be further enhanced.

The surface treatment method for the inorganic filler surface-treated with the surface treatment agent is not particularly limited, and examples thereof include a dry method and a wet method. As a dry method, an inorganic filler is charged in a rotary mixer, and an alcohol solution or an aqueous solution of a surface treatment agent is dropped or sprayed while stirring, followed by further stirring and classification with a sieve. Thereafter, the surface treatment agent and the inorganic filler can be dehydrated and condensed by heating. As a wet method, a surface treatment agent is added while stirring a slurry of an inorganic filler and an organic solvent, and after stirring, classification is performed by filtration, drying, and sieving. Thereafter, the surface treatment agent and the inorganic filler can be dehydrated and condensed by heating. Furthermore, an integral blend method in which a surface treating agent is added to the resin composition is also possible.

One preferred embodiment of the resin composition of the present invention is a resin composition having excellent long-term adhesion reliability between a cured product of the resin composition and a conductor layer formed on the cured product, and also having excellent circuit embedding properties. A resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the (A) epoxy resin is (A1) Silsesquioki When the sun-modified epoxy resin is included and the nonvolatile component in the resin composition is 100% by mass, the (A1)
The content of the silsesquioxane-modified epoxy resin is 0.1 to 5% by mass, the (A) epoxy resin includes (A2) another epoxy resin, and the (A2) other epoxy resin is bisphenol A type. Epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin,
And at least one selected from dicyclopentadiene type epoxy resins, including (B) one or more selected from phenolic curing agents, cyanate ester curing agents and active ester curing agents as the curing agent, The aspect of the resin composition containing silica as said (C) inorganic filler is preferable.

Moreover, it is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, wherein the (A) epoxy resin includes (A1) a silsesquioxane-modified epoxy resin. When the nonvolatile component in the resin composition is 100% by mass, the content of the (A1) silsesquioxane-modified epoxy resin is 0.1 to 5% by mass, and the (A) epoxy resin ( A2) containing another epoxy resin, wherein the (A2) other epoxy resin contains one or more selected from bisphenol A type epoxy resin, naphthalene type epoxy resin and dicyclopentadiene type epoxy resin, and (B) curing Containing an active ester curing agent as an agent,
The aspect of the resin composition containing silica as said (C) inorganic filler is more preferable.

<(D) polymer resin>
When the resin composition of the present invention further contains (D) a polymer resin, the mechanical strength of the cured product can be improved, and further the film molding ability when used in the form of an adhesive film is improved. You can also. (D) As the polymer resin, phenoxy resin, polyvinyl acetal resin, polyimide resin, polyamideimide resin, polyetherimide resin,
A polysulfone resin, a polyether sulfone resin, a polyphenylene ether resin, a polycarbonate resin, a polyether ether ketone resin, and a polyester resin can be exemplified, and a phenoxy resin and a polyvinyl acetal resin are particularly preferable. These may be used alone or in combination of two or more. (D) The weight average molecular weight of the polymer resin is preferably in the range of 8000 to 200000, more preferably in the range of 12000 to 100,000, and still more preferably in the range of 20000 to 60000. In addition, the weight average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion). Specifically, the weight average molecular weight determined by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Sh manufactured by Showa Denko KK as a column.
odex K-800P / K-804L / K-804L can be measured at a column temperature of 40 ° C. using chloroform or the like as a mobile phase, and can be calculated using a standard polystyrene calibration curve.

When the (D) polymer resin is blended in the resin composition of the present invention, 0.1 to 10% by mass is preferable when the nonvolatile component in the resin composition is 100% by mass, preferably 0.5 to 5%. The mass% is more preferable. Within this range, the effect of improving the film forming ability and mechanical strength can be exhibited, and the melt viscosity can be increased and the roughness of the insulating layer surface after the wet roughening step can be reduced.

<(E) Curing accelerator>
By further including (E) a curing accelerator in the resin composition of the present invention, (A) the epoxy resin and (B) the curing agent can be efficiently cured. (E) Although it does not specifically limit as a hardening accelerator, An amine hardening accelerator, a guanidine hardening accelerator, an imidazole hardening accelerator, a phosphonium hardening accelerator, a metal hardening accelerator, etc. are mentioned. These may be used alone or in combination of two or more.

The amine curing accelerator is not particularly limited, but trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl). And amine compounds such as phenol and 1,8-diazabicyclo (5,4,0) -undecene (hereinafter abbreviated as DBU). You may use these 1 type or in combination of 2 or more types.

Although it does not specifically limit as a guanidine type hardening accelerator, Dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-
Phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] dec-5-ene 7-methyl-1,5,
7-triazabicyclo [4.4.0] dec-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide, 1,1-
Dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1
-Allyl biguanide, 1-phenyl biguanide, 1- (o-tolyl) biguanide and the like. You may use these 1 type or in combination of 2 or more types.

The imidazole curing accelerator is not particularly limited, but 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-
4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-
Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2- Undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-
s-triazine, 2,4-diamino-6- [2'-undecylimidazolyl- (1 ')]
-Ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2' -Methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 Hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-
Examples thereof include imidazole compounds such as 3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, and adducts of imidazole compounds and epoxy resins. You may use these 1 type or in combination of 2 or more types.

Although it does not specifically limit as a phosphonium type hardening accelerator, A triphenylphosphine, a phosphonium borate compound, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4- Methylphenyl) triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like. You may use these 1 type or in combination of 2 or more types.

In the case where a curing accelerator (excluding a metal-based curing accelerator) is blended in the resin composition of the present invention, the range of 0.005 to 1 part by mass when the total of the epoxy resin and the curing agent is 100 parts by mass. Is preferable, and the range of 0.01 to 0.5 parts by mass is more preferable. Within this range, thermosetting can be performed more efficiently, and the storage stability of the resin varnish is improved.

Although it does not specifically limit as a metal type hardening accelerator, The organometallic complex or organometallic salt of metals, such as cobalt, copper, zinc, iron, nickel, manganese, tin, is mentioned. Specific examples of the organometallic complex include organic cobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organocopper complexes such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. Organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, manganese (II)
And organic manganese complexes such as acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate. These may be used alone or in combination of two or more.

When blending a metal-based curing accelerator in the resin composition of the present invention, when the nonvolatile component in the resin composition is 100% by mass, the metal content based on the metal-based curing catalyst is 25 to 500 pp.
The range of m is preferable, and the range of 40 to 200 ppm is more preferable. Within this range,
An excellent conductor layer is formed due to adhesion to the surface of the insulating layer, and the storage stability of the resin varnish is also improved.

<Other ingredients>
In the resin composition of the present invention, other components can be blended as necessary within a range not inhibiting the effects of the present invention. Other components include thermosetting resins such as vinyl benzyl compounds, acrylic compounds, maleimide compounds, and blocked isocyanate compounds, organic fillers such as silicon powder, nylon powder, fluorine powder, and rubber particles; Adhesive, silicone-based, fluorine-based, polymer-based antifoaming or leveling agent, phthalocyanine blue, phthalocyanine green, iodin green, disazo yellow,
Examples thereof include colorants such as carbon black, flame retardants such as phosphorus compounds, and metal hydroxides.

The resin composition of the present invention is appropriately mixed with the above components and, if necessary, kneaded or mixed by a kneading means such as a three-roll, ball mill, bead mill, or sand mill, or a stirring means such as a super mixer or a planetary mixer. It can be adjusted by doing. Moreover, the said component may be melt | dissolved in the organic solvent and you may add in a resin composition, and it can also adjust as a resin varnish by adding an organic solvent further in a resin composition.

Since the resin composition of the present invention has excellent long-term adhesion reliability and excellent circuit embedding properties, it can be suitably used as a resin composition for forming an insulating layer of a multilayer printed wiring board. Furthermore,
It can be suitably used as a resin composition for forming a conductor layer by plating (resin composition for forming an insulating layer of a multilayer printed wiring board in which a conductor layer is formed by plating), and further, a circuit embedded in a multilayer printed wiring board It is suitable as a resin composition for forming a buildup layer of a multilayer printed wiring board.

The resin composition of the present invention can be used as a cured product obtained by thermosetting. The conditions for thermosetting may be appropriately selected according to the type and content of the resin component in the resin composition, but are preferably 90 ° C. to 220 ° C. for 20 minutes to 180 minutes, more preferably 150 ° C. to 210 ° C. 3 at ℃
It is selected in the range of 0 to 120 minutes. Moreover, you may perform thermosetting in 2 steps or more.

Although it does not specifically limit as a form of the resin composition of this invention, It can apply to sheet-like laminated materials, such as an adhesive film and a prepreg, and a circuit board (a laminated board use, a multilayer printed wiring board use, etc.). The resin composition of the present invention can be applied to a circuit board in a varnish state to form an insulating layer, but in general, it is preferably used in the form of a sheet-like laminated material such as an adhesive film or a prepreg. . The softening point of the resin composition is preferably 40 to 150 ° C. from the viewpoint of the laminate property of the sheet-like laminated material.

<Sheet laminated material>
(Adhesive film)
The adhesive film of the present invention has a resin composition layer formed on a support, and is prepared by a method known to those skilled in the art, for example, a resin varnish in which a resin composition is dissolved in an organic solvent. Can be produced by applying the composition to a support using a die coater or the like, and further drying the organic solvent by heating or blowing hot air to form a resin composition layer.

Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate, and carbitols such as cellosolve and butyl carbitol. And aromatic hydrocarbons such as toluene and xylene, amide solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone. Two or more organic solvents may be used in combination.

The drying conditions are not particularly limited, but the drying is performed so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Depending on the amount of organic solvent in the varnish and the boiling point of the organic solvent, for example, 50 to 15 varnish containing 30 to 60% by mass of the organic solvent is used.
The resin composition layer can be formed by drying at 0 ° C. for about 3 to 10 minutes.

The thickness of the resin composition layer formed in the adhesive film is preferably equal to or greater than the thickness of the conductor layer. Since the thickness of the conductor layer of the circuit board is usually in the range of 5 to 70 μm, the resin composition layer preferably has a thickness of 10 to 100 μm. 15-80 from the viewpoint of thinning
μm is more preferable, and 20 to 50 μm is more preferable.

As the support, a film of polyolefin such as polyethylene, polypropylene, polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”),
Examples thereof include various plastic films such as a polyester film such as polyethylene naphthalate, a polycarbonate film, and a polyimide film. Moreover, you may use release foil, metal foil, such as copper foil and aluminum foil. Among these, from the viewpoint of versatility, a plastic film is preferable, and a polyethylene terephthalate film is more preferable. The support and a protective film described later may be subjected to surface treatment such as mud treatment or corona treatment. The release treatment may be performed with a release agent such as a silicone resin release agent, an alkyd resin release agent, or a fluororesin release agent.

Although the thickness of a support body is not specifically limited, 10-150 micrometers is preferable and 25-50 micrometers is more preferable.

A protective film according to the support can be further laminated on the surface of the resin composition layer on which the support is not in close contact. Although the thickness of a protective film is not specifically limited, For example, it is 1-40 micrometers. By laminating the protective film, it is possible to prevent dust and the like from being attached to the surface of the resin composition layer and scratches. The adhesive film can also be stored in a roll.

(Prepreg)
The prepreg of the present invention can be produced by impregnating the resin composition of the present invention into a sheet-like reinforcing base material by a hot melt method or a solvent method, and heating and semi-curing it.
That is, it can be set as the prepreg which will be in the state which impregnated the sheet-like reinforcement base material with the resin composition of this invention. As a sheet-like reinforcement base material, what consists of a fiber currently used as prepreg fibers, such as glass cloth and an aramid fiber, can be used, for example. And what formed the prepreg on the support body is suitable.

In the hot melt method, the resin composition is once coated on a support without being dissolved in an organic solvent, and then laminated on a sheet-like reinforcing substrate, or directly applied to a sheet-like reinforcing substrate by a die coater. Thus, a prepreg is manufactured. In the solvent method, a resin varnish is prepared by dissolving a resin in an organic solvent in the same manner as the adhesive film, and a sheet-like reinforcing base material is immersed in the varnish, and the resin-like varnish is impregnated into the sheet-like reinforcing base material, It is a method of drying. Moreover, a prepreg can also be prepared by heating and laminating the adhesive film continuously from both sides of the sheet-like reinforcing base material under heat and pressure. A support, a protective film, and the like can be used in the same manner as the adhesive film.

<Multilayer printed wiring board using sheet-like laminated material>
Next, an example of a method for producing a multilayer printed wiring board using the sheet-like laminated material produced as described above will be described.

First, a sheet-like laminated material is laminated (laminated) on one side or both sides of a circuit board using a vacuum laminator. Examples of the substrate used for the circuit substrate include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, and the like. In addition, a circuit board means here that the conductor layer (circuit) patterned was formed in the one or both surfaces of the above boards. Also, in a multilayer printed wiring board in which conductor layers and insulating layers are alternately laminated, one of the outermost layers of the multilayer printed wiring board is a conductor layer (circuit) in which one or both sides are patterned. It is included in the circuit board. The surface of the conductor layer may be previously roughened by blackening, copper etching, or the like.

In the above laminate, when the sheet-like laminated material has a protective film, after removing the protective film, if necessary, preheat the sheet-like laminated material and the circuit board,
The sheet-like laminated material is laminated on the circuit board while being pressurized and heated. In the sheet-like laminated material of the present invention, a method of laminating on a circuit board under reduced pressure by a vacuum laminating method is suitably used. Lamination conditions are not particularly limited. For example, the pressure bonding temperature (laminating temperature) is preferably 70 to 140 ° C., and the pressure bonding pressure (laminating pressure) is preferably 1 to 11 kgf / cm ² (9.8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m ² ), the pressure bonding time (laminating time) is preferably 5 to 180 seconds, and the air pressure is 20 mmHg (2
It is preferable to laminate under a reduced pressure of 6.7 hPa) or less. The laminating method may be a batch method or a continuous method using a roll. The vacuum lamination can be performed using a commercially available vacuum laminator. As a commercially available vacuum laminator, for example,
Examples include vacuum applicators manufactured by Nichigo Morton Co., Ltd., vacuum pressurizing laminators manufactured by Meiki Seisakusho Co., Ltd., roll dry coaters manufactured by Hitachi Industries, Ltd., vacuum laminators manufactured by Hitachi AIC Co., Ltd. it can.

After laminating the sheet-like laminated material on the circuit board, after cooling to around room temperature, if the support is peeled off, it is peeled off to form a cured product obtained by thermosetting the resin composition. An insulating layer can be formed. The conditions for thermosetting are as described above. After the insulating layer is formed, if the support is not peeled before curing, it can be peeled off here if necessary.

Moreover, a sheet-like laminated material can also be laminated | stacked on the single side | surface or both surfaces of a circuit board using a vacuum press machine. The lamination process for heating and pressurizing under reduced pressure can be performed using a general vacuum hot press machine. For example, it can be performed by pressing a metal plate such as a heated SUS plate from the support layer side. The pressing condition is that the degree of vacuum is usually 1 × 10 ^-2 MPa
Hereinafter, the pressure is preferably 1 × 10 ⁻³ MPa or less. Although heating and pressurization can be carried out in one stage, it is preferable to carry out the conditions separately in two or more stages from the viewpoint of controlling the oozing of the resin. For example, the first stage press has a temperature of 70 to 150 ° C. and a pressure of 1 to 15 kg.
f / cm2 range, second stage press, temperature 150-200 ° C, pressure 1-40kg
It is preferable to carry out in the range of f / cm2. The time for each stage is preferably 30 to 120 minutes. Thus, an insulating layer can be formed on a circuit board by thermosetting the resin composition layer. Examples of commercially available vacuum hot press machines include MNPC-V-750.
-5-200 (manufactured by Meiki Seisakusho), VH1-1603 (manufactured by Kitagawa Seiki Co., Ltd.), and the like.

Next, a hole is formed in the insulating layer formed on the circuit board to form a via hole and a through hole. For example, the drilling can be performed by a known method such as drilling, laser, or plasma, or a combination of these methods if necessary, but drilling by a laser such as a carbon dioxide gas laser or a YAG laser is the most common. Is the method. If the support is not peeled off before drilling, it will be peeled off here.

Next, a roughening process is performed on the surface of the insulating layer. In the case of dry-type roughening treatment, plasma treatment or the like can be mentioned. It is done. The wet roughening treatment is preferable in that smear in the via hole can be removed while forming an uneven anchor on the surface of the insulating layer. In the swelling treatment with the swelling liquid, the insulating layer is heated at 50 to 80 ° C. for 5 to 20 minutes (preferably 55
˜70 ° C. for 8 to 15 minutes). Examples of the swelling liquid include an alkaline solution and a surfactant solution, and an alkaline solution is preferable. Examples of the alkaline solution include a sodium hydroxide solution and a potassium hydroxide solution. Examples of commercially available swelling liquids include Swelling Dip Securiganth P, Swelling Dip, manufactured by Atotech Japan Co., Ltd.
Examples include Securigans SBU (Swelling Dip Securiganth SBU).
The roughening treatment with an oxidant is performed at 60 to 85 ° C. for 10 to 30 minutes (preferably 70 to 8).
For 15 to 25 minutes at 0 ° C.). Examples of the oxidizing agent include alkaline permanganate solution in which potassium permanganate and sodium permanganate are dissolved in an aqueous solution of sodium hydroxide, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid and the like. it can. The concentration of permanganate in the alkaline permanganate solution is preferably 5 to 10% by weight. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as Concentrate Compact CP and Dosing Solution Securigans P manufactured by Atotech Japan. The neutralization treatment with the neutralizing solution is performed by immersing in a neutralizing solution at 30 to 50 ° C. for 3 to 10 minutes (preferably at 35 to 45 ° C. for 3 to 8 minutes). As the neutralizing solution, an acidic aqueous solution is preferable, and as a commercially available product, Reduction Solution / Secligant P manufactured by Atotech Japan Co., Ltd. may be mentioned.

Here, the arithmetic average roughness (Ra value) of the surface of the cured product after the roughening treatment is preferably 200 nm or less, more preferably 150 nm or less, and still more preferably 100 nm or less, from the viewpoint of fine wiring formation. Further, the lower limit value of the arithmetic average roughness (Ra value) is not particularly limited, and is 10 nm or more,
30 nm or more. Furthermore, since the root mean square roughness (Rq value) of the cured product surface reflects the local state of the cured product surface, it can be confirmed that the cured product surface is dense and smooth by grasping the Rq value. . The root mean square roughness (Rq value) is preferably 300 nm or less, more preferably 200 nm or less, still more preferably 150 nm or less, and particularly preferably 100 nm or less in order to obtain a dense and smooth cured product surface. The lower limit of the root mean square roughness (Rq value) is preferably 20 nm or more from the viewpoint of stabilizing the peel strength.
0 nm or more is more preferable. Specifically, as described later in “Measurement of arithmetic average roughness (Ra value) and root mean square roughness (Rq value)”, a non-contact type surface roughness meter (WYKO manufactured by Beec Instruments, Inc.). NT3300) can be measured with a VSI contact mode and a 50 × lens with a measurement range of 121 μm × 92 μm.

Next, a conductor layer is formed on the insulating layer after the roughening treatment by dry plating or wet plating. As the dry plating, a known method such as vapor deposition, sputtering, or ion plating can be used. Examples of wet plating include a method in which a conductive layer is formed by combining electroless plating and electrolytic plating, a method in which a plating resist having a pattern opposite to that of the conductive layer is formed, and a conductive layer is formed only by electroless plating. It is done. After the conductor layer is formed on the insulating layer after the roughening treatment, it is preferable to perform an annealing treatment for improving adhesion. Annealing treatment is 14
It is preferably performed at 0 to 200 ° C. for 30 to 90 minutes, more preferably at 150 to 200 ° C. for 30 to 60 minutes.

Here, in the present invention, long-term adhesion reliability can be confirmed by performing an environmental test under high temperature and high humidity on a circuit board and measuring the plating peel strength after the environmental test. Highly accelerated life test apparatus PM422 (manufactured by Enomoto Kasei Co., Ltd.) can be used. Specifically, a conductor layer is formed by plating on the surface of the cured product after the roughening treatment, and the plating peel strength after an environmental test between the surface of the cured product and the conductor layer is measured. Environmental test conditions are 1
Examples include conditions of 30 ° C., 85% RH, and standing for 100 hours.

The plating peel strength after the environmental test is preferably 0.25 kgf / cm or more, more preferably 0.26 kgf / cm or more, and 0.27 kgf in order to sufficiently adhere the cured product (insulating layer) and the conductor layer. / Cm or more is more preferable. The upper limit value of the plating peel strength after the environmental test is preferably as high as possible and is not particularly limited, but generally 0.8 kgf / cm or less, 0.7 kgf / cm
cm or less, 0.6 kgf / cm, 0.5 kgf / cm or less.

As a pattern formation method thereafter, for example, a subtractive method or a semi-additive method known to those skilled in the art can be used. By repeating the above-described series of steps a plurality of times,
It can be set as the multilayer printed wiring board which laminated | stacked the buildup layer in multiple steps.

Another example of a method for producing a multilayer printed wiring board using the sheet-like laminated material produced as described above will be described.

In the same manner as described above, after laminating the sheet-like laminated material on one or both sides of the circuit board using a vacuum laminator, after cooling to near room temperature, the support is peeled off, and a copper foil is further laminated. Lamination is the same as described above.

Next, in the same manner as described above, an insulating layer is formed on the circuit board by forming a cured product obtained by thermosetting the resin composition. Thereby, copper foil was laminated | stacked on the hardened | cured material surface.
The conditions for thermosetting are the same as those described above.

Here, the long-term adhesion reliability in the present invention can also be confirmed by measuring the copper foil peel strength after the environmental test. Specifically, the copper foil peel strength after the environmental test between the cured product surface and the copper foil is measured. Examples of the environmental test conditions include 130 ° C., 85% RH, and a condition of standing for 100 hours.

The copper foil peel strength after the environmental test is 0. In order to keep the insulating layer and the conductor layer in close contact with each other.
3 kgf / cm or more is preferable, and 0.33 kgf / cm or more is more preferable. The higher the upper limit of the copper foil peel strength after the environmental test, the better, and there is no particular limitation, but generally 0.8 kgf /
cm or less, 0.7 kgf / cm or less, 0.6 kgf / cm, 0.5 kgf / cm or less.

After that, drilling is performed as appropriate, and a wiring pattern is formed by a subtractive method,
It can be set as the multilayer printed wiring board which laminated | stacked the buildup layer in multiple steps.

<Semiconductor device>
A semiconductor device can be manufactured by using the multilayer printed wiring board of the present invention. A semiconductor device can be manufactured by mounting a semiconductor chip in a conductive portion of the multilayer printed wiring board of the present invention. The “conduction location” is a “location where an electrical signal is transmitted in a multilayer printed wiring board”, and the location may be a surface or an embedded location. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

The semiconductor chip mounting method for manufacturing the semiconductor device of the present invention is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, and no bumps. Mounting method by buildup layer (BBUL), mounting method by anisotropic conductive film (ACF), mounting method by non-conductive film (NCF),
Etc.

EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. “Part” means part by mass. First, various measurement methods and evaluation methods will be described.

<Long-term adhesion reliability evaluation by plating test>
(1) Base treatment of inner layer circuit board Glass cloth base epoxy resin double-sided copper-clad laminate with inner layer circuit (copper foil thickness 18 μm,
Substrate thickness of 0.3 mm, R5715ES manufactured by Matsushita Electric Works Co., Ltd.)
The surface of the copper was roughened by etching 1 μm at 100 μm.

(2) Lamination of adhesive film The adhesive film created in the examples and comparative examples was converted into a batch-type vacuum pressure laminator MVLP.
-500 (trade name, manufactured by Meiki Co., Ltd.) was used to laminate on both sides of the inner circuit board. Lamination was performed by reducing the pressure for 30 seconds to a pressure of 13 hPa or less, and then pressure bonding for 30 seconds at 100 ° C. and a pressure of 0.74 MPa.

(3) Curing of Resin Composition The laminated substrate was cured at 100 ° C. for 30 minutes and then cured at 180 ° C. for 30 minutes to form an insulating layer. Thereafter, the polyethylene terephthalate (PET) support film was peeled off.

(4) Roughening treatment The inner layer circuit board on which the insulating layer is formed is a swelling liquid, diethylene glycol monobutyl ether-containing swelling dip securigant P (glycol ethers, aqueous solution of sodium hydroxide) of Atotech Japan Co., Ltd. And soaking at 60 ° C. for 10 minutes. Next, as a roughening solution, Atotech Japan Co., Ltd. Concentrate Compact P (KMnO4)
: 60 g / L, NaOH: 40 g / L aqueous solution) at 80 ° C. for 20 minutes. Finally, as a neutralizing solution, it was immersed for 5 minutes at 40 ° C. in Reduction Sholysin Securigant P (an aqueous solution of sulfuric acid) of Atotech Japan Co., Ltd. After drying at 80 ° C. for 30 minutes, this substrate was designated as evaluation substrate A.

(5) Plating by semi-additive method Evaluation board A was immersed in an electroless plating solution containing PdCl ₂ at 40 ° C. for 5 minutes, and then immersed in an electroless copper plating solution at 25 ° C. for 20 minutes. After annealing for 30 minutes at 150 ° C., an etching resist was formed. After pattern formation by etching, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 30 μm. Next, annealing treatment was performed at 190 ° C. for 60 minutes. This substrate was designated as evaluation substrate B.

(6) Measurement of arithmetic average roughness (Ra value) and root mean square roughness (Rq value) Evaluation substrate A was measured using a non-contact type surface roughness meter (WYKO NT33 manufactured by Beeco Instruments).
00), VSI contact mode, and the measurement range is 121 μm by a 50 × lens.
Ra value and Rq value were obtained from the numerical value obtained as 92 μm. Each was measured by obtaining an average value of 10 points.

(7) Measurement of Peeling Strength (Plating Peel Strength) of Plated Conductor Layer Evaluation Board B was measured at 130 ° C. and 85 ° C. using a highly accelerated life test device PM422 (manufactured by Enomoto Kasei Co., Ltd.).
It was exposed to an accelerated environmental test for 100 hours under the condition of% RH. After that, the conductor layer of the evaluation board B is cut into a portion having a width of 10 mm and a length of 100 mm, and one end is peeled off to grasp the grip (TSE, Inc., Autocom type tester AC-50C-SL). Using an Instron universal testing machine, measure the load (kgf / cm) when peeling 35 mm in the vertical direction at a speed of 50 mm / min at room temperature, and the plating peel strength after the environmental test It was. When the peel strength after the environmental test is 0.25 kgf / cm or more, it is evaluated as “◯” and 0.2
Those less than 5 kgf / cm were evaluated as “x”.

<Long-term adhesion reliability evaluation by copper foil test>
(1) Base treatment of inner layer circuit board Glass cloth base epoxy resin double-sided copper-clad laminate with inner layer circuit (copper foil thickness 18 μm,
Substrate thickness of 0.3 mm, R5715ES manufactured by Matsushita Electric Works Co., Ltd.)
The surface of the copper was roughened by etching 1 μm at 100 μm.

(2) Lamination of adhesive film The adhesive film created in the examples and comparative examples was converted into a batch-type vacuum pressure laminator MVLP.
-500 (trade name, manufactured by Meiki Co., Ltd.) was used to laminate on both sides of the laminate. The laminate was depressurized for 30 seconds to a pressure of 13 hPa or less, and then 30 seconds, 100 ° C., pressure 0.
This was performed by pressure bonding at 74 MPa.

(3) Surface treatment of copper foil The glossy surface of 3EC-III (electrolytic copper foil, 35 μm) manufactured by Mitsui Mining Co., Ltd. is immersed in Mec Etch Bond CZ-8100 manufactured by Mec Co., Ltd., and roughened on the copper surface. (1 um etching) was performed.

(4) Lamination of copper foil and formation of insulating layer The PET film is peeled from the adhesive film laminated in (2) above, and the glossy surface of the copper foil treated in (3) above is set to the resin composition layer side. Under the same conditions as in 2), the copper foil was laminated on the resin composition layer formed on both surfaces of the circuit board. The evaluation substrate C was produced by curing the resin composition under curing conditions of 100 ° C. for 30 minutes, 180 ° C. for 30 minutes, and further 190 ° C. for 60 minutes to form an insulating layer.

(5) Measurement of peel strength (copper foil peel strength) of copper foil conductor layer>
Evaluation board C was measured at 130 ° C. using highly accelerated life test apparatus PM422 (manufactured by Enomoto Kasei Co., Ltd.)
It was exposed to an accelerated environmental test for 100 hours at 85% RH. Then, on the copper foil of the evaluation board C,
Make a notch in the 10mm width and 100mm length, peel off one end and grab it with a gripping tool (TSE Co., Ltd., Autocom type testing machine AC-50C-SL) and use Instron universal testing machine Then, at room temperature, the load (kgf / cm) when 35 mm was peeled in the vertical direction at a speed of 50 mm / min was measured, and the copper foil peel strength after the environmental test was measured. A copper foil peel strength after an environmental test of 0.3 kgf / cm or more is evaluated as “◯” and 0.3 kg
Those less than f / cm were evaluated as “x”.

[Evaluation of resin embedding]
(1) Substrate surface treatment Glass cloth base epoxy resin double-sided copper-clad laminate [copper foil thickness 35 μm, substrate thickness 0.3 mm
, Matsushita Electric Works, Ltd. R5715ES] and IPC MULTI-PURPOSE TEST
BOARD NO. IPC B-25 pattern (line / space = 175/17
5um comb tooth pattern (residual copper ratio 50%)), both sides of CZ8100 made by Mec Co., Ltd.
The copper surface was roughened by immersion in
(2) Lamination of adhesive film The adhesive film created in the examples and comparative examples was converted into a batch-type vacuum pressure laminator MVLP.
-500 (trade name, manufactured by Meiki Co., Ltd.) was laminated so as to contact the resin composition surface. The laminate is depressurized for 30 seconds to reduce the pressure to 13 hPa or less, and then 10 seconds for 10 seconds.
The pressing was performed at 0 ° C. and a pressure of 0.74 MPa. Then 100 ° C., pressure 0.
Hot pressing was performed for 60 seconds under the condition of 5 MPa.
(3) Curing of Resin Composition The laminated substrate was cured at 100 ° C. for 30 minutes and then cured at 180 ° C. for 30 minutes to form an insulating layer. Thereafter, the polyethylene terephthalate (PET) support film was peeled off.
(4) Embedding property of resin surface Insulating layer on comb / tooth pattern with line / space = 175 / 175um is observed from the surface with a micro optical microscope. Or “×” indicates that the resin floats.

<Example 1>
3 parts of bisphenol type epoxy resin (“ZX1059” manufactured by Nippon Steel Chemical Co., Ltd., 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent of about 169), naphthalene type epoxy resin (manufactured by DIC Corporation “ HP4032SS ”, epoxy equivalent of about 144) 3 parts,
Crystalline bifunctional epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation), epoxy equivalent of about 1
85) 12 parts, dicyclopentadiene type epoxy resin (manufactured by DIC Corporation "HP7200H
", Epoxy equivalent of about 275) 9 parts, phenoxy resin (Mitsubishi Chemical Corporation" YL7553B
10 parts of H30 "(MEK solution having a solid content of 30% by mass) were dissolved in 30 parts of solvent naphtha with stirring. After cooling to room temperature, the active ester compound (DIC Corporation)
"HPC8000-65T", 40 parts by weight of a non-volatile content 65 mass% toluene solution having an active group equivalent of about 223), curing accelerator (4-dimethylaminopyridine, MEK solution having a solid content of 5 mass%)
3 parts, silsesquioxane-modified epoxy resin (Arakawa Chemical Industries, Ltd. “Composeran E1
50 ”, a mixed solution of methyl isobutyl ketone and methanol having a solid content of 50%, an epoxy equivalent of 910, a viscosity of 20 mPa · s at 25 ° C., 5 parts, a phenylaminosilane coupling agent (
(Shin-Etsu Chemical Co., Ltd., "KBM573") surface-treated spherical silica (average particle size 0.
25 μm, “SOC1” manufactured by Admatechs Co., Ltd., carbon amount per unit surface area 0.3
6 parts of 6 mg / m ² ) were mixed and dispersed uniformly with a high-speed rotary mixer to prepare a resin varnish.
Next, a polyethylene terephthalate film with a release treatment (“A” manufactured by Lintec Corporation)
The resin varnish is uniformly applied on the release surface of L5 ", thickness 38 μm) so that the thickness of the resin composition layer after drying is 30 μm, and dried at 80 to 120 ° C. (average 100 ° C.) for 4 minutes. Let me
An adhesive film was prepared.

<Example 2>
Naphthalene type epoxy resin (manufactured by DIC Corporation "HP4032SS", epoxy equivalent of about 1
44) 5 parts, 5 parts of crystalline bifunctional epoxy resin (“YX4000HK” manufactured by Mitsubishi Chemical Corporation, epoxy equivalent of about 185), biphenyl type epoxy resin (“NC3000 manufactured by Nippon Kayaku Co., Ltd.)
H ", epoxy equivalent of about 288) 12 parts, phenoxy resin (" YL755 "manufactured by Mitsubishi Chemical Corporation)
10 parts of 3BH30 ", MEK solution having a solid content of 30% by mass) was dissolved in 30 parts of solvent naphtha with stirring. After cooling to room temperature, a prepolymer of bisphenol A dicyanate (“BA230S75” manufactured by Lonza Japan KK), cyanate equivalent of about 23
2, MEK solution having a nonvolatile content of 75% by mass) 20 parts, phenol novolac-type polyfunctional cyanate ester resin ("PT30S" manufactured by Lonza Japan Co., Ltd., cyanate equivalent of about 133, MEK solution having a nonvolatile content of 85% by mass), 6 parts, Curing accelerator (4-dimethylaminopyridine, MEK solution having a solid content of 5% by mass), 0.4 part, curing accelerator (manufactured by Tokyo Chemical Industry Co., Ltd., cobalt (III))
3 parts of acetylacetonate, MEK solution having a solid content of 1% by mass, silsesquioxane-modified epoxy resin (“Composeran E150” manufactured by Arakawa Chemical Industries, Ltd.), a mixed solution of methyl isobutyl ketone and methanol having a solid content of 50%, Epoxy equivalent 910, viscosity at 25 ° C., 20 mPa
・ S) 2 parts, phenylaminosilane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., “KBM
573 ") and spherical silica (average particle size 0.5 μm," SOC2 "manufactured by Admatechs Co., Ltd., carbon amount 0.39 mg / m ² per unit surface area) is mixed and rotated at high speed. A resin varnish was prepared by uniformly dispersing with a mixer. Next, an adhesive film was produced in the same manner as in Example 1.

<Example 3>
3 parts of bisphenol type epoxy resin (“ZX1059” manufactured by Nippon Steel Chemical Co., Ltd., 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent of about 169), naphthalene type epoxy resin (manufactured by DIC Corporation “ HP4032SS ”, epoxy equivalent of about 144) 3 parts,
Crystalline bifunctional epoxy resin ("YX4000HK" manufactured by Mitsubishi Chemical Corporation), epoxy equivalent of about 1
85) 5 parts, 12 parts of biphenyl type epoxy resin (“NC3000H” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent of about 288), phenoxy resin (“YL7553BH30” manufactured by Mitsubishi Chemical Corporation)
10 parts of a MEK solution having a solid content of 30% by mass was dissolved in 30 parts of solvent naphtha with stirring. After cooling to room temperature, the triazine skeleton-containing phenolic curing agent (D
10 parts of an “LA-1356” hydroxyl equivalent of 146 manufactured by IC Corporation and a 60% solid content MEK solution), naphthalene type curing agent (“SN-485” produced by Nippon Steel Chemical Co., Ltd., solid content of 215 hydroxyl equivalent of 215) % MEK solution) 10 parts, curing accelerator (4-dimethylaminopyridine, 5 mass% MEK solution) 1 part, silsesquioxane modified epoxy resin (Arakawa Chemical Industries, Ltd. “
Composelan E150 ", 50% solid content methyl isobutyl ketone and methanol mixed solution, epoxy equivalent 910, viscosity at 25 ° C of 20 mPa · s 10 parts, phenylaminosilane coupling agent (Shin-Etsu Chemical Co., Ltd.," KBM573 )) And spherical silica (average particle size of 0.5 μm, “SOC2” manufactured by Admatechs Co., Ltd., carbon amount of 0.39 mg / m ² per unit surface area) is mixed with a high-speed rotary mixer. To uniformly disperse the resin varnish. Next, an adhesive film was produced in the same manner as in Example 1.

<Example 4>
An adhesive film was produced in exactly the same manner as in Example 1 except that 5 parts of the silsesquioxane-modified epoxy resin of Example 1 were changed to 1.2 parts.

<Comparative Example 1>
An adhesive film was produced in exactly the same manner as in Example 1 except that the silsesquioxane-modified epoxy resin of Example 1 was not added.

<Comparative example 2>
Without adding 5 parts of the silsesquioxane-modified epoxy resin of Example 1, an epoxy resin silica hybrid (“COMPOCERAN E201” manufactured by Arakawa Chemical Industries, Ltd., a mixed solution of methyl isobutyl ketone and methanol having a solid content of 90%, epoxy Equivalent 285) 2.5 parts, phenol resin silica hybrid (Arakawa Chemical Industries, Ltd. “Composeran P502” (the following formula (6)
), A mixed solution of methyl isobutyl ketone and methanol having a solid content of 73%, a hydroxyl equivalent of 300
) An adhesive film was prepared in the same manner as in Example 1 except that 2.5 parts were added.

<Comparative Example 3>
An adhesive film was produced in exactly the same manner as in Example 2 except that the silsesquioxane-modified epoxy resin of Example 2 was not added.

<Comparative example 4>
An adhesive film was produced in exactly the same manner as in Example 3, except that 10 parts of the silsesquioxane-modified epoxy resin of Example 3 was increased to 20 parts.

  The results are shown in Table 1.

As shown in Table 1, it can be seen that the examples have excellent circuit embedding properties and long-term adhesion reliability. On the other hand, Comparative Examples 1, 2, and 3 do not contain the silsesquioxane-modified epoxy resin and have poor long-term adhesion reliability. In Comparative Example 2, a silica hybrid resin different from the silsesquioxane structure is added, but the circuit embedding property is poor and the long-term adhesion reliability is also inferior. Moreover, since the comparative example 4 has too many silsesquioxane modified | denatured epoxy resins, circuit embedding property is bad, the balance in hardened | cured material is harmed, and long-term adhesion reliability is inferior.

It has become possible to provide a resin composition having excellent long-term adhesion reliability of the resin composition and excellent circuit embedding properties. Furthermore, sheet-like laminated materials, multilayer printed wiring boards, and semiconductor devices using the same can be provided. Furthermore, electric products such as computers, mobile phones, digital cameras, and televisions, and vehicles such as motorcycles, automobiles, trains, ships, and airplanes equipped with these can be provided.

Claims (19)

(A) an epoxy resin, (B) a curing agent, and (C) a resin composition containing an inorganic filler,
The (A) epoxy resin includes (A1) silsesquioxane-modified epoxy resin,
The resin composition whose content of this (A1) silsesquioxane modified epoxy resin is 0.1-5 mass% when the non-volatile component in the said resin composition is 100 mass%. The epoxy equivalent of the (A1) silsesquioxane-modified epoxy resin is 100 to 3000.
The resin composition according to claim 1. The viscosity at 25 ° C. of the (A1) silsesquioxane-modified epoxy resin is 1 to 200 mP.
The resin composition according to claim 1, which is a · s. The (A1) silsesquioxane-modified epoxy resin is a compound obtained by reacting (a1) an epoxy resin having a hydroxyl group and (a2) a silsesquioxane derivative by dehydration condensation. The resin composition according to Item. The resin composition according to any one of claims 1 to 4, wherein the (B) curing agent is at least one selected from a phenolic curing agent, a cyanate ester curing agent and an active ester curing agent. The resin composition according to any one of claims 1 to 5, wherein the content of the inorganic filler (C) is 30 to 90% by mass when the nonvolatile component in the resin composition is 100% by mass. The resin composition according to any one of claims 1 to 6, wherein an average particle diameter of the (C) inorganic filler is 0.01 to 5 µm. The (A) epoxy resin includes (A2) another epoxy resin, and the (A2) other epoxy resin is selected from bisphenol A type epoxy resin, naphthalene type epoxy resin, biphenyl type epoxy resin and dicyclopentadiene type epoxy resin. Including one or more of
The (B) one or more selected from a phenolic curing agent, a cyanate ester curing agent and an active ester curing agent as the curing agent, and silica as the inorganic filler (C). The resin composition of any one of Claims. The (A) epoxy resin includes (A2) another epoxy resin, and the (A2) other epoxy resin is selected from bisphenol A type epoxy resin, naphthalene type epoxy resin, and dicyclopentadiene type epoxy resin The resin composition according to any one of claims 1 to 8, further comprising an active ester-based curing agent as the (B) curing agent and silica as the (C) inorganic filler.   The resin composition according to any one of claims 1 to 9, further comprising (D) a polymer resin. The resin composition according to any one of claims 1 to 10, which is a resin composition for forming an insulating layer of a multilayer printed wiring board. The resin composition according to any one of claims 1 to 11, which is a resin composition for forming a buildup layer of a multilayer printed wiring board.   The sheet-like laminated material formed using the resin composition of any one of Claims 1-12. The adhesive film or prepreg which uses the resin composition of any one of Claims 1-12.   Hardened | cured material formed by thermosetting the resin composition of any one of Claims 1-12. The hardened | cured material of Claim 15 whose arithmetic mean roughness of the hardened | cured material surface after a roughening process is 10-200 nm, and whose root mean square roughness is 20-300 nm. 16. A conductor layer is formed by plating on the surface of the cured product after the roughening treatment, and the plating peel strength after an environmental test between the surface of the cured product and the conductor layer is 0.25 to 0.8 kgf / cm. Or the hardened | cured material of 16. The multilayer printed wiring board by which the insulating layer was formed with the hardened | cured material of any one of Claims 15-17.   A semiconductor device using the multilayer printed wiring board according to claim 18.