JP2017069426A - Foreign matter removal device and foreign matter removal method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a foreign matter removal device and a foreign matter removal method capable of enhancing detection accuracy and removal accuracy of a fine foreign matter in a clean chamber.SOLUTION: A foreign matter removal device 10 includes a probe device 30 having a probe 33 at the tip, and detecting the position of a foreign matter 7 existing on a substrate 5, and removing the foreign matter 7, and a blower 13 for blowing air toward the substrate 5. Detection of the position of a foreign matter 7 and removal of the foreign matter 7 are carried out while decreasing the wind speed of the blower 13 above the substrate.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a foreign matter removing apparatus and a foreign matter removing method.

  Photomasks (reticles) are used in the manufacture of semiconductor integrated circuits (LSIs), printed wiring boards (PWB), liquid crystal display panels (LCDs) and the like using photolithography technology. When foreign matter (also referred to as particles) such as dust adheres to the photomask, the foreign matter causes an unnecessary shadow on light transmitted through the photomask. This shadow can cause a serious defect in a semiconductor circuit to be manufactured.

  Therefore, when manufacturing a photomask, an inspection is performed as to whether or not foreign matter exists in the manufactured photomask. If foreign matter exists on the photomask, the foreign matter is removed. Conventionally, cleaning using pure water or the like has generally been performed when removing foreign matter from a photomask. However, with the miniaturization of the photomask pattern, it is necessary to remove even smaller foreign matter, and the foreign matter may not be completely removed by cleaning with pure water or the like. Although it is conceivable to repeat the cleaning until the foreign matter is removed, this is time consuming and costly and has limitations.

  As a technique capable of removing such fine foreign substances, it has been proposed to remove foreign substances by applying an atomic force microscope (AFM) technique. In Patent Document 1, an atomic force microscope having a cantilever provided with a probe is used to recognize a region in which a defect has occurred, and then the probe provided on the atomic force microscope, particularly the cantilever, is used. Used to physically remove defects.

JP 2008-96578 A

  By the way, the removal of foreign matter using this atomic force microscope technique is usually performed in a clean chamber (clean room). In the clean chamber, ventilation is performed in order to remove dust and the like floating in the clean chamber and maintain the cleanliness in the clean chamber. For example, an air outlet and an exhaust port are provided on the ceiling or wall of the clean chamber, and purified air is blown into the clean chamber through the air outlet, and the air is exhausted from the clean chamber through the exhaust port. In particular, when high cleanliness is required, a method of forming an air flow (down flow) downward from the ceiling of the clean chamber and exhausting air from below the clean chamber can be used.

  When the present inventors diligently investigated the removal of foreign matter using the atomic force microscope technique in the clean chamber, the air flow (for example, the down flow) in the clean chamber is changed to the cantilever of the atomic force microscope. It was also found that it affects the operation of the probe. That is, if the wind speed above a substrate such as a photomask from which foreign matter is to be removed is high, the cantilever and probe of the atomic force microscope vibrate, making it difficult to remove fine foreign matter, There is a risk of damaging the pattern of the photomask.

  The present invention has been made in consideration of such points, and provides a foreign matter removing apparatus and a foreign matter removing method capable of improving the detection accuracy and removal accuracy of fine foreign matters in a clean chamber. Objective.

The foreign matter removing apparatus according to the present invention includes:
A foreign matter removing device for removing foreign matter on a substrate,
A probe is provided at the tip, and has a probe for detecting the position of the foreign matter existing on the substrate and removing the foreign matter, and a blower for blowing air toward the substrate,
The detection of the position of the foreign matter and the removal of the foreign matter are performed by reducing the wind speed of the air blown by the blower above the substrate.

The foreign matter removing apparatus according to the present invention includes:
A foreign matter removing device for removing foreign matter on a substrate,
A probe provided at the tip and detecting the position of the foreign matter existing on the substrate, a second probe provided at the tip and removing the foreign matter, and the substrate And a blower that blows air toward,
The detection of the position of the foreign matter and the removal of the foreign matter are performed by reducing the wind speed of the air blown by the blower above the substrate.

  In the foreign matter removing apparatus according to the present invention, the air speed above the substrate of the air blown by the blower may be reduced by reducing the blower speed from the blower.

  In the foreign matter removing apparatus according to the present invention, the wind speed of the air blown by the blower device above the substrate may be reduced by changing the direction of the blown air from the blower device.

  In the foreign matter removing apparatus according to the present invention, the blower device may have a louver for changing the direction of the blown air.

  In the foreign matter removing apparatus according to the present invention, by stopping the blowing by the blowing device, the wind speed of the blowing by the blowing device above the substrate may be reduced.

The foreign matter removal method according to the present invention includes:
A foreign matter removing method for removing foreign matter on a substrate, including a step of blowing air toward a substrate with a blower,
Using a probe provided with a probe at the tip, a position detection step of detecting the position of the foreign matter existing on the substrate;
A foreign matter removing step of removing the foreign matter using the probe;
The position detection step and the foreign matter removal step are performed by reducing the wind speed of the air blown by the blower above the substrate.

The foreign matter removal method according to the present invention includes:
A foreign matter removing method for removing foreign matter on a substrate, including a step of blowing air toward a substrate with a blower,
A position detecting step of detecting the position of a foreign substance existing on the substrate using a first probe provided with a probe at a tip;
Using a second probe provided with a probe at the tip, and removing the foreign matter, and
The position detection step and the foreign matter removal step are performed by reducing the wind speed of the air blown by the blower above the substrate.

  In the foreign matter removing method according to the present invention, the air speed above the substrate of the air blown by the air blower may be reduced by reducing the air blow speed from the air blower.

  In the foreign matter removing method according to the present invention, the wind speed of the air blown by the blower device above the substrate may be reduced by changing the direction of the blown air from the blower device.

  In the foreign matter removing method according to the present invention, the blower device may have a louver for changing the direction of the blown air.

  In the foreign matter removing method according to the present invention, by stopping the blowing by the blowing device, the wind speed of the blowing by the blowing device above the substrate may be reduced.

  ADVANTAGE OF THE INVENTION According to this invention, the foreign material removal apparatus and foreign material removal method which can improve the detection precision and removal precision of a fine foreign material in a clean chamber can be provided.

FIG. 1 is a top view showing a foreign matter removing apparatus for explaining an embodiment according to the present invention. FIG. 2 is a side view of the foreign matter removing apparatus shown in FIG. FIG. 3 is a diagram illustrating a probe device of the foreign matter removing apparatus. FIG. 4 is a diagram for explaining a foreign substance removing operation using the foreign substance removing apparatus. FIG. 5 is a diagram for explaining a foreign substance removing operation using the foreign substance removing apparatus. FIG. 6 is a diagram for explaining a foreign substance removing operation using the foreign substance removing apparatus. FIG. 7 is a side view showing a modified example of the foreign matter removing apparatus. FIG. 8 is a side view showing another modified example of the foreign matter removing apparatus. FIG. 9 is a side view showing another modified example of the foreign matter removing apparatus.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  As used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, and values of length and angle, etc. have a strict meaning. Without being bound, it should be interpreted including the extent to which similar functions can be expected.

  FIGS. 1-9 is a figure for demonstrating one Embodiment by this invention. Among these, FIG. 1 is a top view showing the foreign matter removing apparatus, and FIG. 2 is a side view of the foreign matter removing apparatus shown in FIG. In addition, in FIG. 1, illustration of the ceiling of a foreign material removal apparatus and the air blower provided in the ceiling is abbreviate | omitted. In FIG. 2, the illustration of the wall portion located on the front side of the sheet is omitted.

  Photomasks are mainly used in pattern formation processes using photolithography technology in the manufacture of semiconductor integrated circuits (LSIs), printed wiring boards (PWB), liquid crystal display panels (LCDs), and the like. The photomask includes a plate-like member formed using a material that can shield at least light in a specific wavelength range. This plate-like member has a pattern corresponding to the pattern to be formed in the pattern forming process, and an opening or a thinned portion is formed. Note that a photomask used for manufacturing a semiconductor integrated circuit is also called a reticle.

  This photomask is generally manufactured through the following manufacturing process. First, a metal film (light-shielding film) made of chromium or the like is formed on a transparent substrate made of glass or the like, and a photosensitive resist is applied on the metal film. Next, a mask pattern is drawn by irradiating the resist film with an electron beam, a laser beam, or the like, and the resist film is developed to form a resist pattern. Then, using the resist pattern as a mask, the metal film is patterned by etching or the like to form a mask pattern (light-shielding pattern) made of the patterned metal film. Finally, the resist is removed to obtain a photomask.

  The photomask manufactured in this way is inspected (pattern inspection) for the presence or absence of a mask pattern defect. When a defect of the mask pattern is found by this pattern inspection, the defect is corrected. In addition, an inspection (foreign matter inspection) for the presence of foreign matter on the photomask is also performed. When foreign matter is found on the photomask by this foreign matter inspection, the foreign matter is removed. Finally, a photomask having no defect (corrected) in the mask pattern and no foreign matter (removed) on the photomask is actually used as the photomask. Note that inspections other than pattern inspection and foreign matter inspection may be performed.

  The foreign matter removing device 10 is a device that detects the position of foreign matter on the substrate 5 such as a manufactured photomask and removes the foreign matter. The foreign matter removing apparatus 10 includes a probe device 30 that detects the position of the foreign matter 7 existing on the substrate 5 and removes the foreign matter 7, and a blower device 13 that blows air toward the substrate 5. In particular, in the example shown in FIGS. 1 and 2, the foreign matter removing apparatus 10 includes a probe device 30, a blower device 13, a substrate support device 20 for supporting the substrate 5, and the substrate 5 to the substrate support device 20. A substrate transfer device 15 for loading and unloading, and a clean chamber 11 for housing the probe device 30, the substrate support device 20 and the substrate transfer device 15 are provided.

  The clean chamber 11 has a function of maintaining the atmosphere (for example, air) in the clean chamber 11 at a predetermined cleanliness. For this reason, an inlet for introducing purified air is provided in the ceiling or wall of the clean chamber 11. Further, the clean chamber 11 may be provided with an exhaust port for discharging the air in the clean chamber 11. Further, a filter may be provided immediately after the blower 13 (on the clean chamber 11 side of the blower 13) so that the atmosphere in the chamber can be kept at a higher cleanliness. This filter is mainly used to remove foreign matters (particles) in the blowing atmosphere, but may be provided with a chemical filter for removing gaseous components such as acids, alkalis and organic substances in the blowing atmosphere. . In the example shown in FIGS. 1 and 2, the clean chamber 11 accommodates a substrate transfer device 15, a substrate support device 20, and a probe device 30 therein. The clean chamber 11 can also be called a clean bench, a clean booth, or the like.

  The air blower 13 introduces purified air into the clean chamber 11. In particular, in the example shown in FIG. 2, the blower 13 is attached to the ceiling portion of the clean chamber 11 and blows air into the clean chamber 11 through an inlet provided in the ceiling portion of the clean chamber 11. It is configured as a device. That is, the blower 13 in the illustrated example is configured as a device that generates an air flow (down flow) from the upper side to the lower side in the clean chamber 11. By this downflow, the rising of foreign matter (particles) such as dust in the clean chamber 11 can be suppressed, and the cleanliness in the clean chamber 11 can be maintained.

  The substrate transfer device 15 takes out the substrate 5 from a substrate storage container (not shown) and transfers the substrate 5 to the substrate support device 20. As the substrate storage container, for example, a container called SMIF (Standard Mechanical Interface) can be used. In the example shown in FIGS. 1 and 2, the substrate transfer device 15 has a robot arm 17, and the robot arm 17 accommodates a substrate through a substrate carry-in port (not shown) provided on the wall portion of the clean chamber 11. The substrate 5 is taken out from the container, and the substrate 5 is placed on the stage 21 of the substrate support device 20. Further, the substrate 5 that has been inspected and removed of the foreign substances is taken out from the stage 21 of the substrate support device 20, and the substrate 5 is removed via a substrate carry-in port provided on the wall of the clean chamber 11 or another substrate carry-out port. And housed in a substrate storage container.

  The substrate support device 20 supports the substrate 5 and positions the substrate 5 with respect to the probe device 30. In the example shown in FIGS. 1 and 2, the substrate support device 20 includes a stage 21 that supports the substrate 5, a vibration isolation base 23 that supports the stage 21, and a positioning device 25 that positions the substrate 5. doing.

  The vibration isolation table 23 has a function of reducing vibration transmitted to the stage 21 from the floor where the substrate support device 20 is disposed. In particular, the vibration transmitted to the stage 21 of the foreign matter removing apparatus 10 from the other devices arranged in the vicinity of the foreign matter removing apparatus 10 via the floor is reduced. As the vibration isolation table 23, a passive vibration isolation table may be used, or an active vibration isolation table may be used.

  In the illustrated example, the stage 21 supports the substrate 5 and is configured to be movable in two directions parallel to the horizontal plane and orthogonal to each other. The stage 21 has a base portion 21a fixed on the vibration isolation table 23 and an X which is disposed on the base portion 21a and can move the substrate 5 in two directions (X direction and Y direction) parallel to the horizontal plane and perpendicular to each other. -Y stage 21b, two pillar parts 21c fixed to the base part 21a and extending in a substantially vertical direction, and a bridge part 21d bridged between the upper parts of the two pillar parts 21c. The stage 21 is not limited to one configured to move the substrate 5 in two directions parallel to the horizontal plane and orthogonal to each other, and may further be configured to rotate the substrate 5 in the horizontal plane. It may be configured to be movable in the vertical direction (height direction).

  The positioning device 25 has an optical system for recognizing the alignment mark formed on the substrate 5. As this optical system, for example, an optical microscope can be used. The positioning device 25 is disposed on the bridge portion 21 d of the stage 21. The alignment mark formed on the substrate 5 is recognized by the optical system of the positioning device 25, and the alignment between the substrate 5 and the probe device 30 is performed based on the positional information of the alignment mark. Specifically, based on the position information of the alignment marks on the substrate 5, a control unit (not shown) drives the XY stage 21b of the stage 21, and moves the substrate 5 on the XY stage 21b in the X direction and the Y direction. By moving, the substrate 5 is positioned at a desired position with respect to the probe device 30.

  Next, an example of the probe device 30 will be described with reference to FIG.

  As the probe device 30, a probe device similar to the probe device used in a scanning probe microscope (SPM) can be used. For example, a probe device similar to that used in an atomic force microscope (AFM) or a scanning tunneling microscope (STM) can be used. In the example shown in FIG. 3, the probe device 30 includes a cantilever 31 having a probe 33 at the tip, a mirror 35 for further reflecting light L emitted from a light source (not shown) and reflected from the upper surface of the cantilever 31, And a light detector 37 that receives light reflected by the mirror 35. In the example shown in FIGS. 1 and 2, the probe device 30 is disposed on the bridge portion 21 d of the stage 21.

  The cantilever 31 is connected to a cantilever driving device (for example, a piezo element) (not shown) at the base, and is driven to move up and down (up and down) within a minute range by the driving device and is driven to vibrate in the up and down direction. In the example shown in FIG. 3, the vertical movement (vibration) of the cantilever 31 is detected by the light detector 37. A light L such as laser light is irradiated on the upper surface of the cantilever 31 from a light source (not shown), the light L reflected on the upper surface of the cantilever 31 is reflected by the mirror 35, and the optical path of the light L is bent toward the light detector 37. Since the base of the cantilever 31 is connected to the cantilever driving device, and is particularly fixed, the angle of the upper surface of the cantilever 31 with respect to the vertical direction changes according to the vertical position (height) of the cantilever 31. Accordingly, the incident position of the light L reflected by the mirror 35 and incident on the light detector 37 is thereby changed. That is, the incident position of the light L on the photodetector 37 changes according to the vertical position (height) of the cantilever 31. By detecting the incident position of the light L on the light detector 37, the vertical position (height) of the cantilever 31 can be detected.

  The detection signal of the light detector 37 is given to a control unit (not shown), and based on this, the control unit controls the drive of the cantilever 31 (a minute vertical movement or vibration) by the drive device. Note that this control unit may also control the XY stage 21b of the stage 21. That is, the control unit that controls driving of the cantilever 31 and the control unit that controls the XY stage 21b of the stage 21 may be configured by the same control device.

  In addition, you may make it a foreign material removal apparatus provide another apparatus as needed. For example, a static eliminator (ionizer) for removing static electricity on the substrate 5 may be provided. As the static eliminator, a static eliminator using corona discharge, a static eliminator using ionizing radiation such as soft X-rays and ultraviolet rays, and the like can be used. In particular, a static eliminator that removes static electricity by irradiating with soft X-rays is preferable because a stable static elimination effect is obtained and dust or the like is not generated when static electricity is removed. The static eliminator can be attached to, for example, the bridge portion 21 d of the stage 21 so as to be positioned in the vicinity of the substrate 5.

  Next, an example of the foreign matter removing operation on the substrate 5 will be described.

  First, the manufactured substrate 5 such as a photomask is inspected for the presence of foreign matter 7 using an appearance inspection apparatus or the like. This inspection can be performed by, for example, a data-to-die method, a die-to-die method, or a combination of these methods. If it is determined by this inspection that the foreign matter 7 exists, position information of the foreign matter 7 on the substrate 5 is acquired.

  Using the air blower 13, air is blown into the clean chamber 11 of the foreign matter removing apparatus 10. In the example shown in FIG. 2, the air blower 13 is attached to the ceiling portion of the clean chamber 11, and blows air into the clean chamber 11 through an inlet provided in the ceiling portion of the clean chamber 11. An air flow (down flow) from above to below is generated in the chamber 11. Thereby, the rising of foreign matters such as dust in the clean chamber 11 is suppressed, and the cleanliness in the clean chamber 11 is maintained. The wind speed above the substrate for blowing air by such a blowing device 13 can be set to, for example, 0.3 m / second or more and 0.5 m / second or less. Here, the wind speed above the substrate means the wind speed at any point in the region (height) in the range of 30 cm from the upper surface of the substrate 5 to the upper side in the vertical direction.

  The substrate 5 determined to have the foreign matter 7 in the inspection of the presence or absence of the foreign matter 7 by an appearance inspection apparatus or the like is placed on the substrate support device 20. Specifically, using the robot arm 17 of the substrate transport device 15, the substrate 5 is taken out from a substrate storage container (not shown) and placed on the XY stage 21 b of the stage 21 of the substrate support device 20.

  Next, the substrate 5 and the probe device 30 are aligned using the positioning device 25. Specifically, the alignment mark formed on the substrate 5 is recognized by the optical system of the positioning device 25, and the position information of the foreign matter 7 acquired by the position information of the alignment mark and the appearance inspection device or the like is used on the substrate 5. The position where the foreign object 7 exists and the probe device 30 are aligned. At this time, a control unit (not shown) drives the XY stage 21b of the stage 21, moves the substrate 5 on the XY stage 21b in the X direction and the Y direction, and a location where the foreign matter 7 on the substrate 5 exists. Is positioned with respect to the probe device 30. Thereby, rough alignment between the foreign substance 7 on the substrate 5 and the probe device 30 is performed.

  Then, the wind speed above the board | substrate of the ventilation by the air blower 13 is decreased. Here, the decrease in the wind speed above the substrate means that the wind speed at any point in the region (height) in the range (height) from the upper surface of the substrate 5 to the upper side in the vertical direction is reduced to 30 cm. Further, the decrease in wind speed includes that the wind speed becomes zero. As an example, the wind speed above the board of the air blown by the blower 13 can be 50% or less compared to the wind speed before the decrease. Preferably, the wind speed above the board of the air blown by the blower 13 can be 40% or less compared to the wind speed before the decrease. Specifically, the wind speed above the substrate of the air blown by such a blower 13 can be set to, for example, 0 m / second or more and 0.2 m / second or less.

  In order to reduce the wind speed above the substrate of the air blown by the blower 13, for example, the blower 13 can be controlled to reduce the wind speed at the outlet of the blower 13 (introduction port of the clean chamber 11). Moreover, you may reduce the wind speed above the board | substrate of the ventilation by the ventilation apparatus 13 by stopping ventilation by the ventilation apparatus 13. FIG.

<Position detection process>
The detailed position of the foreign matter 7 on the substrate 5 is detected by using the probe device 30 in a state where the wind speed of the air blown by the blower 13 is reduced above the substrate. Here, an example in which a probe device similar to the probe device used in an atomic force microscope (AFM) is used as the probe device 30 will be described.

  Detection of the position of the foreign substance 7 on the substrate 5 can be performed in a contact mode or a non-contact mode using the probe device 30.

  Using the probe 33 of the cantilever 31 of the probe device 30, the region including the portion where the foreign substance 7 exists on the substrate 5 is scanned. Thereby, the surface image of the board | substrate 5 in a scanning range can be obtained. Then, accurate position information of the foreign matter 7 is obtained from the surface image of the substrate 5.

<Foreign matter removal process>
Next, the foreign material 7 on the substrate 5 is removed using the probe device 30. For example, the foreign material 7 can be removed by attaching an adhesive material to the probe 33 of the cantilever 31 and moving the cantilever 31 to attach the foreign material 7 to the adhesive material. The adhesive material can be used without particular limitation as long as it can adhere foreign matter and does not contaminate the mask or generate dust. Further, the adhesion of the adhesive material to the probe 33 of the cantilever 31 may be performed before the position detection process of the foreign material 7 or may be performed after the position detection process of the foreign material 7.

  Based on the accurate position information of the foreign matter 7 on the substrate 5, the probe 33 of the cantilever 31 is brought into contact with the foreign matter 7. 4 to 6 show the foreign substance removal operation by the probe 33 of the cantilever 31. FIG.

  As shown in FIG. 4, the probe 33 to which the adhesive material of the cantilever 31 is attached is brought close to the foreign material 7 on the substrate 5. In particular, the probe 33 is preferably brought close to the foreign material 7 along the direction in which the pattern 5 b provided on the base material 5 a of the substrate 5 extends. In the illustrated example, the relative movement of the probe 33 to the substrate 5 is performed by scanning the probe 33.

  By moving the probe 33 relative to the substrate 5 as it is, the probe 33 is brought into contact with the foreign substance 7 as shown in FIG. In particular, the adhesive material attached to the probe 33 is brought into contact with the foreign material 7. Thereby, the foreign material 7 is made to adhere to an adhesive material. Further, by moving the probe 33 relative to the substrate 5, the foreign matter 7 can be removed from the substrate 5 as shown in FIG. The removed foreign matter 7 is collected from the probe 33 of the cantilever 31 by a foreign matter collecting means (not shown).

  After completion of the foreign matter removing operation, the presence / absence of the foreign matter 7 on the substrate 5 is inspected to confirm that the foreign matter 7 has been removed from the substrate 5. Using the probe 33 of the cantilever 31 of the probe device 30, the region including the portion where the foreign matter 7 exists on the substrate 5 is scanned. Thereby, the surface image of the substrate 5 in the scanning range is obtained, and the presence or absence of the foreign matter 7 is determined from the surface image. Here, when it is determined that the foreign matter 7 has not been removed, the removal of the foreign matter 7 and the inspection for the presence or absence of the foreign matter 7 are performed again. If the foreign matter 7 is not removed after repeating this a predetermined number of times, the operator may be notified or the substrate 5 may be discarded.

  When there are a plurality of foreign substances 7 on the substrate 5, for example, a single foreign substance 7 is inspected for the position detection process, the foreign substance removal process, and the presence of the foreign substance 7, and then the probe device 30 is attached to the substrate 5. Then, the position detection step, the foreign matter removal step, and the inspection for the presence or absence of the foreign matter 7 are similarly repeated for the other foreign matter 7. Here, when the probe device 30 is moved from a position corresponding to one foreign substance 7 to a position corresponding to another foreign substance 7 (relative movement with respect to the substrate 5), the stage 21 of the substrate support apparatus 20 moves greatly, thereby causing dust. Etc. may occur. Therefore, after the inspection of the presence or absence of the foreign matter 7 after the foreign matter removing process for one foreign matter 7 is finished, the wind speed of the blower 13 is temporarily increased above the substrate, and returned to the original wind speed, for example. After moving from a position corresponding to one foreign substance 7 to a position corresponding to another foreign substance 7, the velocity of air blown above the substrate by the blower 13 is reduced again, and a position detection process for the other foreign substance 7 is started. It is preferable to do so.

  As described above, when the position detection process, the foreign substance removal process, and the inspection for the presence of the foreign substance 7 are completed for all the foreign substances 7 on the substrate 5, the wind speed of the blower 13 above the board is increased. For example, return to the original wind speed. Thereafter, the substrate 5 is transferred from the substrate support device 20 to the substrate storage container using the robot arm 17 of the substrate transfer device 15.

  The foreign matter removing apparatus 10 according to the present embodiment described above includes the probe device 30 that is provided with the probe 33 at the tip, detects the position of the foreign matter 7 on the substrate 5, and removes the foreign matter 7. The position of the foreign material 7 and the removal of the foreign material 7 are detected by reducing the wind speed of the air blower 13 above the substrate.

  Further, the foreign matter removal method of the present embodiment described above includes a position detection step of detecting the position of the foreign matter 7 existing on the substrate 5 using the probe device 30 provided with the probe 33 at the tip. The foreign substance removal process of removing the foreign substance 7 using the probe device 30 is performed, and the position detection process and the foreign substance removal process are performed by reducing the wind speed above the substrate of the air blown by the blower 13.

  As a result, when the position of the foreign matter 7 on the substrate 5 is detected and the foreign matter 7 is removed using the probe device 30, the air velocity above the substrate by the blower 13 is reduced. The vibration of the cantilever 31 and the probe 33 of the probe device 30 due to the airflow can be suppressed. Therefore, the removal of the foreign matter 7 by the probe device 30 can be performed stably. Further, the probe 33 can prevent the pattern 5b of the substrate 5 from being damaged.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as appropriate. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

  A modification of the foreign matter removing apparatus 10 will be described with reference to FIG. FIG. 7 is a side view showing a modified example of the foreign matter removing apparatus 10. In FIG. 7, the illustration of the wall portion located on the front side of the sheet is omitted.

  In the example shown in FIG. 7, a partition wall 41 is provided inside the clean chamber 11, whereby the clean chamber 11 is partitioned into a first chamber 11 a and a second chamber 11 b. In the illustrated example, the substrate transfer device 15 is disposed in the first chamber 11a, and the substrate support device 20 and the probe device 30 are disposed in the second chamber 11b. A first blower 13a is provided corresponding to the first chamber 11a, and a second blower 13b is provided corresponding to the second chamber 11b.

  In this modified example, when the position of the foreign matter 7 on the substrate 5 is detected and the foreign matter 7 is removed using the probe device 30, the air blow by the first blower 13a is not changed, and the second blower It is possible to reduce only the wind speed above the substrate for blowing air by the device 13b. Thereby, vibration of the cantilever 31 and the probe 33 of the probe apparatus 30 by the ventilation from the 2nd ventilation apparatus 13b can be suppressed, maintaining the cleanliness in the 1st chamber 11a.

  Next, another modified example of the foreign matter removing apparatus 10 will be described with reference to FIGS. 8 and 9 are side views showing another modification of the foreign matter removing apparatus 10. 8 and 9, the illustration of the wall portion located on the front side of the sheet is omitted.

  In the example shown in FIGS. 8 and 9, a partition plate 43 is provided inside the clean chamber 11. In the illustrated example, a gap is provided between the upper portion of the partition plate 43 and the ceiling portion of the clean chamber 11.

  In the illustrated example, at least a region corresponding to the probe device 30, that is, a region located directly above the probe device 30, of the introduction port of the air blown from the blower device 13 provided in the ceiling portion of the clean chamber 11, A louver 45 is provided corresponding to the inlet. In particular, in the illustrated example, a region corresponding to the substrate support device 20, i.e., directly above the substrate support device 20, of the air inlet from the blower device 13 provided in the ceiling portion of the clean chamber 11. A louver 45 is provided corresponding to the introduction port of the area. The louver 45 is configured such that the angle with respect to the blowing direction from the blowing device 13 (vertical direction in the illustrated example) can be changed.

  In this modification, when air is blown into the clean chamber 11 using the blower 13, the angle of the louver 45 is set in the direction of blow from the blower 13 (not shown) as shown in FIG. 8. In this example, the air flow from the blower 13 can be directed to the substrate 5 (the probe device 30 and the substrate support device 20). Further, when detecting the position of the foreign matter 7 on the substrate 5 and removing the foreign matter 7 using the probe device 30, as shown in FIG. 9, the angle of the louver 45 is blown from the blower device 13. Inclination with respect to the direction (vertical direction in the illustrated example), so that the air blown from the blower 13 is directed in a direction different from the direction toward the substrate 5 (the probe device 30 and the substrate support device 20). Can do. In particular, in the example shown in FIG. 9, the air blown from the blower device 13 can be directed to the gap between the upper portion of the partition plate 43 and the ceiling portion of the clean chamber 11. Therefore, when detecting the position of the foreign matter 7 on the substrate 5 and removing the foreign matter 7 using the probe device 30, it is possible to reduce the wind speed above the substrate by the blower 13.

  As yet another modification, in the above-described embodiment, the position of the foreign substance 7 on the substrate 5 and the removal of the foreign substance 7 are performed using the same probe device 30, but the present invention is not limited to this. Detection of the position of the foreign substance 7 and removal of the foreign substance 7 may be performed using different probe devices 30.

  That is, the foreign matter removing apparatus 10 includes a first probe device that is provided with a probe at the tip and detects the position of the foreign matter 7 existing on the substrate 5, and a probe is provided at the tip to remove the foreign matter 7. It has the 2nd probe apparatus to perform, and the air blower 13 which ventilates toward the board | substrate 5, and the detection of the position of the foreign material 7 and the removal of a foreign material are performed by reducing the wind speed above the board | substrate of the ventilation by the air blower 13. You may comprise as follows.

  Also, a foreign matter removing method for removing the foreign matter 7 on the substrate 5 including a step of blowing air toward the substrate 5 with the blower 13, using the first probe device provided with a probe at the tip, A position detecting step for detecting the position of the foreign matter 7 existing on the substrate 5 and a foreign matter removing step for removing the foreign matter 5 using the second probe device provided with a probe at the tip. You may make it remove the foreign material 7 on the board | substrate 5 using the foreign material removal method performed by reducing the wind speed above the board | substrate of the ventilation by the air blower 13 in a detection process and a foreign material removal process.

  As yet another modification, in the above-described embodiment, the adhesive material is attached to the probe 33 of the cantilever 31, and the foreign material 7 is removed by moving the cantilever 31 and attaching the foreign material 7 to the adhesive material. However, the present invention is not limited to this. For example, the foreign substance 7 may be attracted to the probe 33 using static electricity.

  The substrate 5 from which the foreign material 7 can be removed is not limited to the above-described photomask, and may be a color filter used in a liquid crystal display or the like, a nanoimprint mold, or the like.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

5 substrate 5a base material 5b pattern 7 foreign material 10 foreign material removal device 11 clean chamber 11a first chamber 11b second chamber 13 blower device 13a first blower device 13b second blower device 15 substrate transfer device 17 robot arm 20 substrate Support device 21 Stage 21a Base portion 21b XY stage 21c Pillar portion 21d Bridge portion 23 Vibration isolation table 25 Positioning device 30 Probe device 31 Cantilever 33 Probe 35 Mirror 37 Photo detector 41 Partition wall 43 Partition plate 45 Louver

Claims (12)

A foreign matter removing device for removing foreign matter on a substrate,
A probe is provided at the tip, and includes a probe device that detects the position of foreign matter existing on the substrate and removes the foreign matter, and a blower that blows air toward the substrate,
The foreign matter removing apparatus, wherein the detection of the position of the foreign matter and the removal of the foreign matter are performed by reducing the wind speed of the air blown by the blower above the substrate. A foreign matter removing device for removing foreign matter on a substrate,
A first probe device provided with a probe at the tip and detecting the position of the foreign substance existing on the substrate; a second probe device provided with a probe at the tip and removing the foreign substance; A blower that blows air toward the substrate,
The foreign matter removing apparatus, wherein the detection of the position of the foreign matter and the removal of the foreign matter are performed by reducing the wind speed of the air blown by the blower above the substrate.   The foreign matter removing apparatus according to claim 1 or 2, wherein a wind speed above the substrate of air blown by the blower is reduced by reducing a blower speed from the blower.   The foreign matter removing apparatus according to any one of claims 1 to 3, wherein the direction of the air blown from the blower device is changed to reduce a wind speed of the blown air by the blower device above the substrate.   The foreign matter removing device according to claim 4, wherein the blower device has a louver for changing the direction of the blown air.   The foreign matter removing apparatus according to claim 1, wherein the blower by the blower is stopped to reduce a wind speed of the blown air by the blower above the substrate. A foreign matter removing method for removing foreign matter on a substrate, including a step of blowing air toward a substrate with a blower,
Using a probe device provided with a probe at the tip, a position detection step of detecting the position of the foreign matter present on the substrate;
A foreign matter removing step of removing the foreign matter using the probe device;
The position detection step and the foreign matter removal step are foreign matter removal methods that are performed by reducing the wind speed above the substrate of the air blown by the blower. A foreign matter removing method for removing foreign matter on a substrate, including a step of blowing air toward a substrate with a blower,
A position detecting step of detecting the position of a foreign substance existing on the substrate using a first probe device provided with a probe at a tip;
Using a second probe device provided with a probe at the tip, and removing the foreign matter, and
The position detection step and the foreign matter removal step are foreign matter removal methods that are performed by reducing the wind speed above the substrate of the air blown by the blower.   The foreign matter removal method according to claim 7 or 8, wherein a wind speed above the substrate of air blown by the blower is reduced by reducing a blower speed from the blower.   The foreign matter removal method according to any one of claims 7 to 9, wherein a wind speed above the substrate of air blown by the blower is reduced by changing a direction of blown air from the blower.   The foreign matter removing method according to claim 10, wherein the blower device includes a louver for changing a direction of the blown air.   The foreign matter removing method according to claim 7 or 8, wherein the air velocity above the substrate of the air blown by the blower is reduced by stopping the blow by the blower.

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