JP2017068927A - Organic light emitting device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic light emitting device having an organic light emitting element that is prevented or suppressed from being deteriorated in light emission characteristic due to occurrence of a dark spot over a long term, and high-reliability electronic equipment having the same.SOLUTION: An organic EL device (organic light emitting device) 100 includes a mounting substrate (substrate) 35, an organic EL element (organic light emitting element) 30 disposed on the mounting substrate 35, and a sealing layer 34 for covering the organic EL element 30 to seal the organic EL element 30. The sealing layer 34 is a laminate including a first sealing layer 34a mainly composed of silicon oxynitride, a buffer layer 34b mainly composed of a resin material, and a second sealing layer 34c mainly composed of silicon oxynitride, which are laminated in order from the organic EL element 30 side. Within a plane orthogonal to the lamination direction of the sealing layer 34, the first sealing layer 34a has a flat portion (dense portion) 342a having a high density, and an inclined portion (sparse portion) 341a having a density lower than that of the flat portion 342a.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an organic light emitting device and an electronic apparatus.

  An organic electroluminescence element (organic EL element) has a configuration including an anode, a cathode, and a functional layer including an organic light emitting layer sandwiched between these electrodes. In the functional layer, energy generated by recombination of holes injected from the anode side and electrons injected from the cathode side in the organic light emitting layer is converted into fluorescence or phosphorescence to emit light.

  However, if moisture, oxygen, or the like enters the functional layer from the outside via the anode or cathode, the injection of carriers (holes or electrons) into the organic light emitting layer is hindered, and the luminance of the emitted light decreases, or the functional layer is altered. As a result, the light emitting function itself is lost, and a dark spot called a so-called dark spot is generated.

  In an organic EL device (organic light-emitting device) including such an organic EL element (organic light-emitting element), a sealing layer that covers a plurality of organic EL elements is formed to prevent intrusion of moisture, oxygen, and the like. .

  As this sealing layer, for example, in Patent Document 1, a cathode protective layer made of an inorganic material such as silicon oxynitride, and a buffer layer (flattening layer) made of a resin material such as an epoxy resin, It has been proposed that a gas barrier layer made of an inorganic material such as silicon oxynitride is a laminate having a three-layer structure in which the gas barrier layer is laminated in this order from the cathode side.

  In the organic EL device provided with the sealing layer having such a configuration, both the cathode protective layer and the gas barrier layer are made of an inorganic material such as silicon oxynitride. Therefore, not only the gas barrier layer but also the cathode protective layer Similar to the gas barrier layer, it may exhibit gas barrier properties that prevent intrusion of moisture, oxygen, and the like.

  Therefore, if the cathode protective layer also exhibits gas barrier properties, this sealing layer has two layers of the cathode protective layer and the gas barrier layer, so that, for example, one gas barrier layer is the sealing layer. Compared with the case where it comprises, the outstanding gas barrier property is exhibited.

  Thus, when gas barrier properties are exhibited in both the cathode protective layer and the gas barrier layer, it seems that the occurrence of dark spots (dark spots) in the organic EL element is prevented and the lifetime characteristics of the organic EL device are improved. It is.

  However, in general, in the cathode protective layer and the gas barrier layer having the above-described configuration, the gas barrier property is locally generated due to the contamination of foreign matters in the layer and defects in the structure in the layer with a certain probability. There may be a defect part that lowers.

  Thus, for example, when a single gas barrier layer constitutes a sealing layer, if such a defect occurs in the gas barrier layer (sealing layer), moisture, oxygen, etc. enter the functional layer immediately from the defect. Dark spots are generated. Therefore, the occurrence of the dark spot is detected as an initial failure, and this does not constitute a problem in reliability of the organic EL device in which the dark spot is generated during use after the organic EL device is shipped.

  On the other hand, in a sealing layer having two layers of a cathode protective layer having a gas barrier property and a gas barrier layer, it is assumed that such a defect portion occurs in both of these two layers (particularly at positions separated in plan view). It takes a certain amount of time for moisture, oxygen, etc. to enter the functional layer through the two defective portions. Therefore, the occurrence of dark spots is not detected as an initial failure, and there is a problem that dark spots are generated during use by the purchaser after shipping the organic EL device, and the reliability of the organic EL device is lowered.

  That is, in an organic EL device having a sealing layer including two layers of a cathode protective layer having a gas barrier property and a gas barrier layer, although the yield is improved, a dark spot is generated relatively early after shipment. There has been a problem that sufficient reliability cannot be obtained during use of the apparatus.

JP 2006-147528 A

  One of the objects of the present invention is to provide an organic light-emitting device including an organic light-emitting element in which deterioration of light emission characteristics due to generation of dark spots is suppressed or prevented over a long period of time, and reliability including the organic light-emitting device. It is to provide high electronic equipment.

Such an object is achieved by the present invention described below.
[Application Example 1]
The organic light-emitting device of the present invention comprises a substrate, an organic light-emitting element disposed on the substrate, and a sealing layer that is sealed by covering the organic light-emitting element,
The sealing layer includes, in order from the organic light emitting element side, a first sealing layer mainly made of silicon oxynitride, a buffer layer mainly made of a resin material, and mainly silicon oxynitride. A laminated body in which a second sealing layer is laminated;
In a plane orthogonal to the stacking direction of the sealing layer, the first sealing layer includes a dense portion having a high density and a sparse portion having a density lower than that of the dense portion.

  According to such an organic light emitting device, in the organic light emitting element provided in the organic light emitting device, it is possible to accurately suppress or prevent the deterioration of the light emission characteristics due to the occurrence of dark spots.

[Application Example 2]
In the organic light emitting device of the present invention, the deuterium diffusion coefficient of the first sealing layer is preferably 1.0 × 10 ⁻²¹ m ² / sec or more.

  Thereby, since the first sealing layer can be said to be a layer having no gas barrier property, in the organic light-emitting device, it is possible to accurately suppress or prevent the deterioration of the light emission characteristics due to the occurrence of dark spots. it can.

[Application Example 3]
In the organic light emitting device of the present invention, it is preferable that water vapor permeation is allowed mainly in the sparse part.

By providing such a sparse part, the size of the deuterium diffusion coefficient can be easily set to 1.0 × 10 ⁻²¹ m ² / sec or more, and the first sealing layer having this sparse part is provided. The water vapor can be allowed to pass therethrough.

[Application Example 4]
In the organic light emitting device of the present invention, a plurality of the organic light emitting elements constitute subpixels of the organic light emitting device,
It is preferable that a plurality of the sparse portions are formed corresponding to each organic light emitting element.
Thereby, the organic light emitting device having such a configuration can be obtained with certainty.

[Application Example 5]
In the organic light emitting device of the present invention, it is preferable that the plurality of sparse portions are generated corresponding to the steps formed on the upper surface side of the substrate for each of the organic light emitting elements.

[Application Example 6]
In the organic light-emitting device according to the aspect of the invention, the step is used to electrically connect the organic light-emitting element and a pixel circuit provided on the substrate, or to insulate each organic light-emitting element. The insulating layer is preferably provided on the outer edge of the organic light emitting device.

  By using such a connection electrode or an insulating layer as a step, the inclined portion of the first sealing layer formed corresponding to the step can be a sparse portion.

[Application Example 7]
An electronic apparatus according to the present invention includes the organic light-emitting device according to the present invention.
By having the organic light-emitting device having such a configuration, the electronic device becomes highly reliable.

1 is an equivalent circuit diagram illustrating an electrical configuration of a first embodiment in which an organic light-emitting device of the present invention is applied to an organic EL device. 1 is a schematic plan view showing a configuration of a first embodiment in which an organic light-emitting device of the present invention is applied to an organic EL device. It is a schematic plan view which shows arrangement | positioning of the pixel in the organic EL apparatus shown to FIG. It is a schematic longitudinal cross-sectional view which shows the structure of the organic electroluminescent apparatus along the AA in FIG. FIG. 5 is a partially enlarged longitudinal sectional view in which the vicinity of the contact electrode and the first sealing layer of the organic EL device shown in FIG. 4 is partially enlarged. It is a schematic longitudinal cross-sectional view which shows the structure of 2nd Embodiment which applied the organic light-emitting device of this invention to the organic EL apparatus. It is the schematic which applied the electronic device of this invention to the head mounted display. Each sample No. It is a graph which shows the deuterium diffusion coefficient in the 1st sealing layer.

  Hereinafter, an organic light emitting device and an electronic apparatus of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

  Hereinafter, a case where the organic light emitting device of the present invention is applied to an organic EL device (active matrix organic EL device) will be described as an example.

<Organic EL device>
<< First Embodiment >>
FIG. 1 is an equivalent circuit diagram showing an electrical configuration of the first embodiment in which the organic light emitting device of the present invention is applied to an organic EL device, and FIG. 2 is an application of the organic light emitting device of the present invention to the organic EL device. 3 is a schematic plan view showing the configuration of the first embodiment, FIG. 3 is a schematic plan view showing the arrangement of pixels in the organic EL device shown in FIGS. 1 and 2, and FIG. 4 is taken along the line AA in FIG. FIG. 5 is a partially enlarged longitudinal sectional view partially enlarged in the vicinity of the contact electrode and the first sealing layer of the organic EL device shown in FIG. In the following, for convenience of explanation, the front side of the paper surface in FIGS. 1 to 3 is referred to as “upper”, the back side of the paper surface is referred to as “lower”, the upper side in FIGS. 4 and 5 is “upper”, and the lower side is “lower”. Say. Moreover, in FIG. 1 to FIG. 5, the dimensions, ratios, and the like of the respective constituent elements are appropriately changed for easy understanding of the drawings. Further, in the following forms, for example, when “on the substrate” is described, the substrate is disposed so as to be in contact with the substrate, or is disposed on the substrate via another component, or the substrate. It is assumed that a part is arranged so as to be in contact with each other and a part is arranged via another component.

  As shown in FIG. 1, the organic EL device 100 includes a plurality of scanning lines 12 and a plurality of data lines 13 that intersect each other, and a plurality of power supply lines 14 that are parallel to each of the plurality of data lines 13. ing. In addition, a scanning line driving circuit 16 to which a plurality of scanning lines 12 are connected and a data line driving circuit 15 to which a plurality of data lines 13 are connected are provided. In addition, a plurality of sub-pixels 18 are arranged in a matrix corresponding to each intersection of the plurality of scanning lines 12 and the plurality of data lines 13.

  The subpixel 18 includes an organic EL element 30 that is a light emitting element and a pixel circuit 20 that controls driving of the organic EL element 30.

  The organic EL element 30 includes a pixel electrode 31 that functions as an anode, a counter electrode 33 that functions as a cathode, and a functional layer 32 that includes an organic light-emitting layer provided between the pixel electrode 31 and the counter electrode 33. ing. Such an organic EL element 30 can be electrically expressed as a diode.

  The pixel circuit 20 includes a switching transistor 21, a storage capacitor 22, and a driving transistor 23. The two transistors 21 and 23 can be configured using, for example, an n-channel or p-channel MOS transistor or a thin film transistor (TFT).

  The gate of the switching transistor 21 is connected to the scanning line 12, one of the source or drain is connected to the data line 13, and the other of the source or drain is connected to the gate of the driving transistor 23.

  One of the source and drain of the driving transistor 23 is connected to the pixel electrode 31 of the organic EL element 30, and the other of the source and drain is connected to the power supply line 14.

  Further, a storage capacitor 22 is connected between the gate of the driving transistor 23 and the power supply line 14.

  In the organic EL device 100 having such a configuration, when the scanning line 12 is driven and the switching transistor 21 is turned on, the potential based on the image signal supplied from the data line 13 at that time is accumulated via the switching transistor 21. The capacity 22 is held. The on / off state of the driving transistor 23 is determined according to the potential of the storage capacitor 22, that is, the gate potential of the driving transistor 23. When the driving transistor 23 is turned on, a current corresponding to the gate potential flows from the power supply line 14 to the functional layer 32 sandwiched between the pixel electrode 31 and the counter electrode 33 via the driving transistor 23. As a result, the organic EL element 30 emits light according to the amount of current flowing through the functional layer 32.

  The configuration of the pixel circuit 20 is not limited to this. For example, the light emission control is provided between the pixel electrode 31 and the driving transistor 23 and controls conduction between the pixel electrode 31 and the driving transistor 23. A transistor may be provided.

  In addition, as shown in FIG. 2, the organic EL device 100 includes an element substrate 10 and a counter substrate 41 disposed to face the element substrate 10.

  The element substrate 10 is provided with a display area E1 (indicated by a broken line in the figure) and a dummy area E2 (indicated by a two-dot chain line in the figure) outside the display area E1. The outside of the dummy area E2 is a non-display area.

  Sub-pixels 18 are arranged in a matrix in the display area E1. As described above, the sub-pixel 18 includes the organic EL element 30 that is a light-emitting element, and red (R), green (G), and blue (B) in accordance with the operations of the switching transistor 21 and the driving transistor 23. ) In any of the colors can be obtained.

  In the present embodiment, the sub-pixels 18 that can emit light of the same color are arranged in the first direction, and the second direction in which the sub-pixels 18 that can emit light of different colors intersect (orthogonal) the first direction. The so-called stripe-type sub-pixels 18 are arranged in an array. In the following description, the first direction is the Y direction, and the second direction is the X direction.

  The arrangement of the sub-pixels 18 on the element substrate 10 is not limited to the stripe method, and may be a mosaic method or a delta method.

  The dummy area E2 is provided with a peripheral circuit mainly for causing the organic EL elements 30 of the sub-pixels 18 to emit light. For example, as shown in FIG. 2, a pair of scanning line driving circuits 16 are provided extending in the Y direction at positions sandwiching the display area E1 in the X direction. An inspection circuit 17 is provided between the pair of scanning line driving circuits 16 at a position along the display area E1.

  The element substrate 10 has a wiring layer 29 that extends in the Y direction along the pair of scanning line driving circuits 16 and the X direction along the inspection circuit 17 and is disposed so as to surround the dummy region E2. ing. The counter electrode 33 included in the organic EL element 30 is formed as a common cathode across the plurality of organic EL elements 30, that is, the plurality of subpixels 18. The counter electrode 33 is formed so as to extend from the display area E1 to the non-display area, and is electrically connected to the wiring layer 29 in the non-display area.

  The element substrate 10 is larger than the counter substrate 41 and protrudes from the counter substrate 41 in the Y direction (the side between the end of the lower element substrate 10 and the dummy region E2 in FIG. , "Terminal portion 11t"), a plurality of connection terminals 101 for electrical connection with an external drive circuit are arranged in the X direction. A flexible circuit board (FPC) 105 is connected to the plurality of connection terminals 101. A driving IC 110 is mounted on the FPC 105. The driving IC 110 includes the data line driving circuit 15 described above. The FPC 105 has an input terminal 102 connected to the input side of the driving IC 110 via a wiring, and an output terminal (not shown) connected to the output side of the driving IC 110 via a wiring. The data line 13 and the power supply line 14 on the element substrate 10 side are electrically connected to the driving IC 110 via the connection terminal 101 and the FPC 105. The wiring connected to the scanning line driving circuit 16 and the inspection circuit 17 is electrically connected to the driving IC 110 via the connection terminal 101 and the FPC 105. The counter electrode 33 as a common cathode is also electrically connected to the driving IC 110 via the wiring layer 29, the connection terminal 101, and the FPC 105. Therefore, a control signal from the driving IC 110, a driving potential (VDD), or the like is supplied to any of the plurality of connection terminals 101 arranged in the terminal portion 11t. As a method of electrically connecting the plurality of connection terminals 101 on the element substrate 10 side and the output terminal on the FPC 105 side, a known method can be used. For example, a method using a thermoplastic anisotropic conductive film or a heat A method using a curable anisotropic adhesive may be mentioned.

Next, the configuration of the sub-pixel 18 and its planar arrangement will be described with reference to FIG.
The organic EL device 100 is configured by combining an organic EL element 30 capable of obtaining white light emission and a color filter 36 including red (R), green (G), and blue (B) colored layers.

  As shown in FIG. 3, the sub-pixel 18R from which red (R) light emission is obtained, the sub-pixel 18G from which green (G) light emission is obtained, and the sub-pixel 18B from which blue (B) light emission is obtained are sequentially arranged in the X direction. Arranged. The sub-pixels 18 that can emit light of the same color are arranged in the Y direction. The three sub-pixels 18R, 18G, and 18B arranged in the X direction are configured as one pixel 19 for display.

  In the present embodiment, the arrangement pitch of the sub-pixels 18R, 18G, and 18B in the X direction is less than 5 μm. Sub-pixels 18R, 18G, and 18B are arranged at intervals of 0.5 μm to 1.0 μm in the X direction. The arrangement pitch of the sub-pixels 18R, 18G, and 18B in the Y direction is less than about 10 μm.

  In the present embodiment, the pixel electrode 31 in the sub-pixel 18 has a substantially rectangular shape, and the longitudinal direction is arranged along the Y direction. Note that the pixel electrode 31 may be referred to as pixel electrodes 31R, 31G, and 31B corresponding to the emission color. An insulating layer 28 that functions as a partition for partitioning the outer edges of the pixel electrodes 31R, 31G, and 31B and insulating the pixel electrodes 31R, 31G, and 31B from each other is formed. As a result, an opening 28a is formed on each of the pixel electrodes 31R, 31G, and 31B, and each of the pixel electrodes 31R, 31G, and 31B comes into contact with the functional layer 32 in the opening 28a. The planar shape of the opening 28a is also substantially rectangular. In addition, the substantially rectangular shape includes a rectangle, a shape in which a corner portion of the rectangle is rounded, a shape in which a short side of the rectangle is an arc, and the like.

  The red (R) colored layer 36R of the color filter 36 is formed so as to overlap with the plurality of pixel electrodes 31R arranged in the Y direction. The green (G) colored layer 36G is formed so as to overlap with the plurality of pixel electrodes 31G arranged in the Y direction. The blue (B) colored layer 36B is formed so as to overlap with the plurality of pixel electrodes 31B arranged in the Y direction. That is, the colored layers 36R, 36G, and 36B of different colors are formed in a stripe shape extending in the Y direction and formed in contact with each other in the X direction.

Next, the structure of the organic EL device 100 will be described with reference to FIG.
FIG. 4 shows the structure of the sub-pixel 18 in the display area E1 and the structure of the terminal portion 11t outside the dummy area E2.

  As shown in FIG. 4, the organic EL device 100 includes a base material 11, a pixel circuit 20, an organic EL element 30, and a plurality of organic EL elements 30 that are sequentially formed on the base material 11 in the display region E <b> 1. The element substrate 10 including the sealing layer 34 that seals and the color filter 36 is provided. In addition, a counter substrate 41 disposed to face the element substrate 10 is provided.

  The counter substrate 41 is made of a transparent substrate such as glass, for example, and is disposed to face the element substrate 10 via the transparent resin layer 42 in order to protect the color filter 36 formed on the sealing layer 34 in the element substrate 10. Yes.

  Light emitted from the functional layer 32 of the sub-pixels 18R, 18G, and 18B (the sub-pixel 18G is shown in FIG. 4) is reflected by the reflective layer 25 described later, and is transmitted through the color filter 36 to the counter substrate 41 side. Taken from. That is, the organic EL device 100 is a top emission type light emitting device.

  Since the organic EL device 100 is a top emission type, the substrate 11 can be a transparent substrate such as glass or an opaque substrate such as silicon or ceramics. Hereinafter, a case where a MOS transistor is used for the pixel circuit 20 will be described as an example.

  A first insulating film 11 a is formed to cover the surface of the substrate 11. A semiconductor layer 23a of the driving transistor 23 is formed so as to cover the first insulating film 11a. A second insulating film 11b that functions as a gate insulating film is formed so as to cover the semiconductor layer 23a. A gate electrode 23g is formed at a position facing the channel region 23c of the semiconductor layer 23a through the second insulating film 11b. A first interlayer insulating film 24 is formed to a thickness of, for example, 300 nm to 2 μm so as to cover the gate electrode 23g. The first interlayer insulating film 24 is subjected to a flattening process so as to eliminate surface irregularities caused by covering the driving transistor 23 and the like of the pixel circuit 20. Corresponding to the source region 23s and the drain region 23d of the semiconductor layer 23a, contact holes penetrating the second insulating film 11b and the first interlayer insulating film 24 are formed. A conductive film is formed so as to fill these contact holes, and patterned and electrodes and wirings connected to the driving transistor 23 are formed. Further, the conductive film is formed using light-reflective, for example, aluminum, or an alloy of aluminum and Ag (silver) or Cu (copper), and is patterned for each sub-pixel 18 by patterning it. A reflective layer 25 is formed. Although not shown in FIG. 4, the switching transistor 21 and the storage capacitor 22 in the pixel circuit 20 are also formed on the substrate 11.

  Further, a second interlayer insulating film 26 is formed with a film thickness of, for example, 10 nm to 2 μm so as to cover the reflective layer 25 and the first interlayer insulating film 24. A contact hole for electrically connecting the pixel electrode 31 and the driving transistor 23 is formed through the second interlayer insulating film 26. As a material constituting the first insulating film 11a, the second insulating film 11b, the first interlayer insulating film 24, and the second interlayer insulating film 26, for example, silicon oxide or nitride, or silicon oxynitride is used. be able to.

  A conductive film (first conductive film) is formed to cover the second interlayer insulating film 26 so as to fill the contact hole formed in the second interlayer insulating film 26, and the conductive film is patterned to form the contact electrode 27. Is formed. Further, a conductive film (second conductive film) is formed so as to cover the contact electrode 27, and the pixel electrode 31 (31R, 31G, 31B) (the subpixel 18G is shown in FIG. 4) by patterning this conductive film. ) Is formed. The contact electrode (connection electrode) 27 is formed using aluminum or an alloy thereof, and the pixel electrode 31 (31R, 31G, 31B) is formed using a transparent conductive film such as ITO (Indium Tin Oxide). Has been.

  An insulating layer (partition wall) 28 is formed by partitioning the outer edge of each pixel electrode 31R, 31G, 31B. Thereby, the insulating properties of the pixel electrodes 31R, 31G, and 31B are ensured, and the opening 28a is formed on the pixel electrodes 31R, 31G, and 31B. The insulating layer 28 is formed using, for example, an acrylic photosensitive resin so as to partition the pixel electrodes 31R, 31G, and 31B at a height of about 1 μm.

  In the present embodiment, the insulating layer 28 made of a photosensitive resin is formed to insulate the pixel electrodes 31R, 31G, and 31B from each other. However, each pixel electrode 31R is made of an inorganic insulating material such as silicon oxide. , 31G, 31B may be partitioned.

  The functional layer 32 is formed using a vapor phase process such as a vacuum deposition method or an ion plating method so as to be in contact with the pixel electrodes 31R, 31G, and 31B (in FIG. 4, the subpixel 18G is shown). The surface of the insulating layer 28 is also covered with the functional layer 32. Note that the functional layer 32 does not have to cover the entire surface of the insulating layer 28, and the functional layer 32 may be formed in a region partitioned by the insulating layer 28. Therefore, as shown in FIG. The top of 28 need not be covered with the functional layer 32.

  The functional layer 32 includes, for example, a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron transport layer. In the present embodiment, a functional layer 32 is formed by forming a hole injection layer, a hole transport layer, an organic light emitting layer, and an electron transport layer on the pixel electrode 31 by using a vapor phase process and sequentially stacking them. Is formed. The layer configuration of the functional layer 32 is not limited to this, and may include an intermediate layer that controls the movement of holes and electrons that are carriers.

  The organic light emitting layer may be configured to obtain white light emission. For example, an organic light emitting layer capable of obtaining red light emission, an organic light emitting layer capable of obtaining green light emission, and an organic light emitting layer capable of obtaining blue light emission; It is possible to adopt a combination of the above.

  Next, a counter electrode 33 as a common cathode is formed so as to cover the functional layer 32. The counter electrode 33 is formed, for example, by depositing an alloy of Mg and Ag with a film thickness (for example, 10 nm to 30 nm) such that light transmittance and light reflectivity can be obtained. Thus, a plurality of organic EL elements 30 are formed on the upper side of the base material 11.

  In addition, an optical resonator is configured between the reflective layer 25 and the counter electrode 33 for each of the sub-pixels 18R, 18G, and 18B by forming the counter electrode 33 in a state having light transmittance and light reflectivity. Also good. The optical resonator extracts light having a specific resonance wavelength by making the optical distance between the reflective layer 25 and the counter electrode 33 different for each of the sub-pixels 18R, 18G, and 18B. Thereby, the color purity of light emitted from each of the sub-pixels 18R, 18G, and 18B can be increased. The optical distance is obtained as the sum of products of refractive indexes and film thicknesses of various functional films sandwiched between the reflective layer 25 and the counter electrode 33 constituting the optical resonator. Therefore, as a method of changing the optical distance for each of the sub-pixels 18R, 18G, and 18B, a method of changing the film thickness of the pixel electrodes 31R, 31G, and 31B, a method of changing the reflective layer 25 and the pixel electrodes 31R, 31G, and 31B A method in which the thickness of the second interlayer insulating film 26 between them is made different is applicable.

  Next, a sealing layer 34 that covers the plurality of organic EL elements 30 is formed to prevent intrusion of water, oxygen, or the like.

  In the present invention, the sealing layer 34 includes, in order from the counter electrode 33 side, a first sealing layer (cathode protective layer) 34a, a buffer layer (flattening layer) 34b, and a second sealing layer (gas barrier layer) 34c. Are laminated.

  The first sealing layer 34a and the second sealing layer 34c are mainly composed of silicon oxynitride (SiON), and the buffer layer 34b is composed mainly of a resin material such as an epoxy resin or an acrylic resin. The

  Here, since the first sealing layer 34a and the second sealing layer 34c are both mainly composed of silicon oxynitride as described in the background art, the second sealing layer (gas barrier layer). The first sealing layer (cathode protective layer) 34a as well as 34c may exhibit gas barrier properties that prevent intrusion of moisture, oxygen, and the like.

  In this case, for example, it is assumed that a defect portion in which the gas barrier property is locally deteriorated is generated in both of these two layers due to contamination of foreign matters in the layer and defects in the structure in the layer (particularly, It takes a certain time for moisture, oxygen, etc. to enter the functional layer 32 through the two defective portions. Therefore, the occurrence of a dark spot (dark spot) is not detected as an initial failure, a dark spot is generated during use by a purchaser after shipping the organic EL device 100, and the reliability of the organic EL device 100 is reduced. There was a problem.

  On the other hand, in the present invention, the first sealing layer 34a has a flat portion (dense portion) 342a having a higher density and a density higher than that of the flat portion 342a in a plane orthogonal to the stacking direction of the sealing layer 34. Are provided with a low inclined part (sparse part) 341a.

  Since the first sealing layer 34a mainly composed of silicon oxynitride is formed (film formation) using a vapor phase film formation method such as an ion plating method, as described later, this silicon oxynitride. It is comprised with the porous body formed by laminating | stacking the granular material comprised with a thing.

  The first sealing layer 34a formed of such a porous body includes a flat portion (dense portion) 342a having a high density and an inclined portion (sparse portion) 341a having a lower density than the flat portion 342a. By doing so, it can be said that the granular material is in a sparse state in the inclined portion (sparse portion) 341a. As a result, the gas barrier property of the first sealing layer 34a is reduced in the inclined portion (sparse portion) 341a. As a result, the present invention has been completed.

  As described above, the first sealing layer 34a is provided with a defective portion in the inclined portion (sparse portion) 341a, so that the first sealing layer 34a enters (permeates) moisture (water vapor) or oxygen. In other words, that is, having no gas barrier property. For this reason, if a defect portion is generated in the second sealing layer (gas barrier layer) 34c originally formed as a gas barrier layer that prevents the intrusion of moisture, oxygen, etc., this defect portion is promptly generated as a dark spot. It can detect as an initial failure of the organic EL device 100. In this manner, by removing the initial defect by inspection, in the organic EL device 100 that has passed the inspection, the organic EL element 30 included in each sub-pixel 18 has light emission characteristics due to the occurrence of dark spots over a long period of time. The decrease is suppressed or prevented. Therefore, the reliability during use of the organic EL device 100 can be improved.

  In this embodiment shown in FIG. 4 and FIG. 5, since the granular material is in a sparse state as described above, a deficient portion (sparse portion) that is allowed to transmit moisture (water vapor) or oxygen is not present. The inclined portion 341a is formed corresponding to the plurality of sub-pixels 18 arranged in a matrix.

  The inclined portion 341a is inclined with respect to the flat portion 342a that is not inclined with respect to the thickness direction in the first sealing layer 34a, so that the granular material is sparse relative to the flat portion (dense portion) 342a. Although the sparse part (defect part) which will be in a state is comprised, the principle by which a granular material will be in a sparse state with respect to the flat part 342a is demonstrated in the manufacturing method of the organic EL apparatus mentioned later.

  In the present embodiment, the contact electrode 27 formed on the second interlayer insulating film 26 included in the pixel circuit 20 functions as a step, and the inclined portion 341 a is formed corresponding to the contact electrode (step) 27. However, the principle will be described in the method for manufacturing an organic EL device described later.

In addition, the inclined portion 341a has a transmittance of a peak (a peak indicating the main structure of SiON) generated in the vicinity of 1000 cm ⁻¹ when measured with a Fourier transform infrared spectrophotometer (FTIR) as A [%], and is 3200 cm. ⁻¹ , when the transmittance of a peak (a peak showing Si—OH or NH vibration) generated near ⁻¹ is B [%], B / A is preferably 0.6 or more, and 0.7 or more. Is more preferable.

  Here, in the first sealing layer 34a, it is clear from the study of the present inventor that the size of the B / A changes by setting a dense state of the granular material. Further, by further study by the present inventor, in the inclined part (sparse part) 341a, the size of the B / A is preferably set to 0.6 or more, more preferably 0.7 or more, so that the inclined part ( The gas barrier property of the sparse part 341a is lowered, and as a result, the inclined part 341a reliably allows the transmission of moisture (water vapor) and oxygen. Further, in the method of manufacturing the organic EL device described later, when the buffer layer 34b is formed on the first sealing layer 34a using the liquid phase film forming method, the liquid material used in the liquid phase film forming method is transmitted. It is possible to reliably prevent (intrusion) from being allowed. That is, the first sealing layer 34a can reliably function as a cathode protective layer.

Further, as a method for evaluating the dense state of the granular material in the inclined portion 341a, in addition to the method of defining the size of B / A, deuterium in the layer of the inclined portion 341a at 85 ° C. in a deuterium atmosphere. There is a way to define the diffusion coefficient. That is, when the first sealing layer 34a is mainly composed of silicon oxynitride, the deuterium diffusion coefficient of the first sealing layer 34a is 1.0 × 10 ⁻²¹ m ² / sec or more. Therefore, it can be said that the gas barrier property in the inclined portion (sparse portion) 341a is lowered, and as a result, the inclined portion 341a reliably allows the transmission of moisture (water vapor) and oxygen. .

  Although the average thickness of the 1st sealing layer 34a is not specifically limited, For example, it is preferable that it is about 100 nm or more and 2000 nm or less, and it is more preferable that it is about 200 nm or more and 1000 nm or less. Thereby, when the size of the B / A is set to 0.6 or more, the first sealing layer 34a reliably allows permeation of moisture (water vapor) and oxygen, and is a liquid material (liquid Transmission of the sexual component) may not be allowed.

  Like the first sealing layer (cathode protective layer) 34a, the second sealing layer (gas barrier layer) 34c is mainly composed of silicon oxynitride (SiON), and has a gas barrier property that prevents intrusion of moisture, oxygen, and the like. It is a layer which has. With the function of the second sealing layer 34 c, the sealing layer 34 prevents moisture, oxygen, and the like from entering the functional layer 32.

  The B / A size of the second sealing layer 34c is preferably 0.01 or more and less than 0.5. Thereby, the 2nd sealing layer 34c can be made into a more precise | minute layer, and can prevent the transmission | permeation of a water | moisture content (water vapor | steam) and oxygen reliably.

  The average thickness of the second sealing layer 34c is not particularly limited, but is preferably about 100 nm to 2000 nm, and more preferably about 400 nm to 1000 nm, for example. Thereby, when the magnitude of the B / A is set to be 0.01 or more and less than 0.5, the second sealing layer 34c is surely not allowed to transmit moisture (water vapor) or oxygen. be able to.

The buffer layer 34b is composed mainly of a resin material.
By providing the buffer layer 34b between the first sealing layer 34a and the second sealing layer 34c, the functions of both the first sealing layer 34a and the second sealing layer 34c can be reliably exhibited. Can do.

  Further, the buffer layer 34b is applied and formed by a printing method such as a screen printing method or a quantitative discharge method in a method for manufacturing an organic EL device described later, thereby flattening the surface (upper surface) of the buffer layer 34b. It can be configured with a plane. As a result, the buffer layer 34b also functions as a planarizing layer that relaxes the irregularities on the surface of the first sealing layer 34a and forms the second sealing layer 34c as a flat layer.

  As the constituent material of the buffer layer 34b, various resin materials having transparency can be used, for example, epoxy resin, acrylic resin, etc., and one or more of these are used. Of these, epoxy resins are preferred. By using the epoxy resin, the buffer layer 34b can more reliably exhibit the function as the planarizing layer.

  The average thickness of the buffer layer 34b is not particularly limited, but is preferably about 1 μm or more and 5 μm or less, and more preferably about 3 μm. Thereby, the function as a planarization layer can be more reliably demonstrated to the buffer layer 34b.

  On the sealing layer 34, colored layers 36R, 36G, and 36B (the colored layer 36G is shown in FIG. 4) corresponding to the sub-pixels 18R, 18G, and 18B of the respective colors are formed. As a method for forming the color filter 36 including the colored layers 36R, 36G, and 36B, a photosensitive resin material including a color material is applied to form a photosensitive resin layer, which is exposed and developed by a photolithography method. The method of doing is mentioned. The color layers 36R, 36G, and 36B may have the same film thickness, and at least one color may be different from the other colors.

  The element substrate 10 and the counter substrate 41 are arranged to face each other with a space therebetween, and the transparent resin material 42 is formed by filling the space with the transparent resin material. Examples of the transparent resin material include urethane, acrylic, epoxy, and polyolefin resin materials. The thickness of the transparent resin layer 42 is 10 μm to 100 μm.

  As shown in FIG. 4, the organic EL device 100 includes a base material 11, a pixel circuit 20, an organic EL element 30, and a plurality of organic EL elements 30 that are sequentially formed on the base material 11 in the display region E <b> 1. The element substrate 10 including the sealing layer 34 that seals and the color filter 36 is provided. In addition, a counter substrate 41 disposed to face the element substrate 10 is provided.

  In the element substrate 10, the first insulating film 11a, the semiconductor layer 23a, the second insulating film 11b, the first interlayer insulating film 24, and the second interlayer insulating film 26 constitute the pixel circuit 20, and the pixel electrode 31, the functional layer 32 and the counter electrode 33 constitute an organic EL element 30, and the pixel circuit 20 and the organic EL element 30 constitute a mounting substrate 35.

Next, the terminal portion 11t of the element substrate 10 and the surrounding structure will be described.
As shown in FIG. 4, the connection terminal 101 is formed on the second interlayer insulating film 26 in the terminal portion 11 t of the element substrate 10, similarly to the pixel electrode 31. The wiring layer 103 formed on the first interlayer insulating film 24 is connected to the wiring layer 103 formed on the first interlayer insulating film 24 through a conductive film in the contact hole 26 a formed in the second interlayer insulating film 26. In FIG. 4, illustration of the configuration of peripheral circuits such as the pixel circuit 20 on the substrate 11, the signal wiring connected to the pixel circuit 20, and the scanning line driving circuit 16 is omitted, but a plurality of connection terminals 101 are omitted. Are electrically connected to these circuits and signal wirings through the wiring layer 103.

  The wiring layer 103 is preferably patterned together with the reflective layer 25 using a conductive film formed on the first interlayer insulating film 24, but is formed of a material different from that of the reflective layer 25. Also good.

  The connection terminal 101 is preferably patterned together with the pixel electrode 31 by using a conductive film formed on the second interlayer insulating film 26, but is formed of a constituent material different from that of the pixel electrode 31. May be.

  A first sealing layer 34a, a second sealing layer 34c, a colored layer 36B, a colored layer 36G, and a colored layer 36R are sequentially stacked on the terminal portion 11t of the element substrate 10, and these are formed on the connection terminal 101. An opening 45 penetrating the layer is formed. These layers are not formed on at least a part of the connection terminal 101, and the connection terminal 101 is exposed in the opening 45.

  In other words, among the sealing layer 34, the first sealing layer 34a and the second sealing layer 34c made of an inorganic material are formed so as to cover the plurality of organic EL elements 30 in the display region E1 (see FIG. 2). It is formed so as to cover not only the terminal portion 11t. In the color filter 36, colored layers 36R, 36G, and 36B are formed in the order of red (R), green (G), and blue (B) corresponding to the sub-pixels 18R, 18G, and 18B. , 36G, 36B are also formed so as to cover not only the display area E1 but also the terminal portion 11t. And the opening part 45 is formed so that the 1st sealing layer 34a, the 2nd sealing layer 34c, the colored layer 36B, the colored layer 36G, and the colored layer 36R may be penetrated.

  The three colored layers 36R, 36G, and 36B are formed to extend from the outer edge of the terminal portion 11t on the peripheral side of the element substrate 10 to the insulating layer 28 at the boundary between the dummy region E2 (see FIG. 2) and the display region E1. The colored layers 36R, 36G, and 36B overlapping the insulating layer 28 are protected by the counter substrate 41 through the transparent resin layer 42.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device of the first embodiment will be described.

  The manufacturing method of the organic EL device 100 includes a pixel circuit forming step, an organic EL element forming step, a sealing layer forming step, a color filter forming step, a sealing layer etching step, and a substrate bonding step. ing.

  [1] First, the base material 11 is prepared, and the pixel circuit 20 is formed on the base material 11 (pixel circuit forming step).

  Note that when the pixel circuit 20 is formed, peripheral circuits, signal wirings, a reflective layer 25, contact electrodes 27, and the like are also formed.

  A known method can be used as a method of forming the pixel circuit 20 and the like on the substrate 11.

  [2] Next, the organic EL element 30 is formed on the pixel circuit 20 (organic EL element forming step).

Note that the insulating layer 28 and the like are also formed at the time of forming the organic EL element 30.
Further, as a method for forming the organic EL element 30 or the like on the pixel circuit 20, a known method can be used.

  [3] Next, a first sealing layer 34 a that covers the counter electrode 33 and the terminal portion 11 t included in the organic EL element 30 is formed.

  A forming method for forming the first sealing layer 34a is not particularly limited, and examples thereof include vapor deposition methods such as an ion plating method, a vacuum deposition method, a sputtering method, and a laser ablation method. The ion plating method is preferable.

  By forming the first sealing layer 34a using the ion plating method, when the granular material composed of silicon oxynitride is stacked on the counter electrode 33, the film component flying to the counter electrode 33 is countered. It can fly along the parallel direction of the thickness direction of the electrode 33 (base material 11). That is, it can fly with excellent directivity along the thickness direction of the counter electrode 33. For this reason, in the flat portion 342a formed corresponding to the flat position of the counter electrode 33, since the granular materials made of silicon oxynitride are stacked in a dense state, a dense portion is formed. In the inclined portion 341a formed corresponding to the inclined position, the sparse portion is formed because the granular materials made of silicon oxynitride are stacked in a sparse state.

  Further, based on such a principle, the flat portion 342a is formed of a dense portion, and the inclined portion 341a is formed of a sparse portion. Therefore, the angle θ formed between the lower surface of the flat portion 342a and the lower surface of the inclined portion 341a is preferably It is 45 ° or more and less than 90 °, more preferably 55 ° or more and less than 75 °. Thereby, the inclined part 341a can be more reliably formed as a sparse part.

  Further, in the present embodiment, the contact electrode 27 formed on the second interlayer insulating film 26 included in the pixel circuit 20 has the highest height (thickness) among those formed on the second interlayer insulating film 26. ) Is getting bigger. Therefore, when the organic EL element 30 is formed so as to cover the second interlayer insulating film 26, the contact electrode 27 functions as a step, and the organic EL element 30 (the pixel electrode 31 and the functional layer 32) follows the shape of the step. , The counter electrode 33) is formed. Therefore, the first sealing layer 34a formed on the organic EL element 30 is also formed following the shape of the step. That is, the 1st sealing layer 34a is formed as what is provided with the flat part 342a and the inclination part 341a.

  In order to make the contact electrode 27 function as a step and form the inclined portion 341a as a sparse portion, the height of the contact electrode 27 is H [μm] and the thickness of the functional layer 32 is T [μm]. Sometimes, T / H is preferably 1 or more and 4 or less, and more preferably 2 or more and 4 or less. As a result, the first sealing layer 34a can be reliably formed by setting the angle θ formed by the lower surface of the flat portion 342a and the lower surface of the inclined portion 341a to 45 ° or more. As a result, the inclined portion 341a is sparse. It is surely formed as a part.

[4] Next, the buffer layer 34b covering the first sealing layer 34a is formed.
The buffer layer 34b is made of a resin material having transparency. As a method for forming the buffer layer 34b, for example, a liquid material (solution) containing a resin material and a solvent in which the resin material is soluble is used. A method in which a liquid material is applied and dried by a liquid phase film forming method such as a printing method or a quantitative discharge method is preferably used. By using this method, it is possible to form the buffer layer 34b made of a resin material, the upper surface of which is flattened, with excellent accuracy.

  In this step [4], the liquid material is supplied onto the first sealing layer 34a to form the buffer layer 34b. At this time, as described above, the first sealing layer 34a is the liquid material. It is made up of a membrane that does not allow permeation (penetration). Therefore, in this step [4], it is possible to accurately suppress or prevent the functional layer 32 from being altered or deteriorated due to the functional layer 32 coming into contact with the liquid material.

[5] Next, the second sealing layer 34c covering the buffer layer 34b is formed.
As a formation method for forming the second sealing layer 34c, the same method as described for the formation method of the first sealing layer 34a is used.

At this time, the upper surface of the buffer layer 34b is a flat surface. Therefore, the second sealing layer 34c formed on the buffer layer 34b is formed as a flat layer having a substantially uniform film thickness without forming an inclined portion. Accordingly, the second sealing layer 34c is formed with a B / A size of less than 0.6. As a result, the second sealing layer 34c functions as a gas barrier layer having a gas barrier property that prevents intrusion of moisture, oxygen, and the like. It will surely be demonstrated.
In addition, the sealing layer formation process is comprised by the above processes [3]-[5].

[6] Next, a blue (B) colored layer 36B is formed.
The colored layer 36B is formed by, for example, forming a photosensitive resin layer by applying a photosensitive resin containing a blue color material by a spin coat method and drying it, and exposing and developing the photosensitive resin layer. Can be formed.

  The colored layer 36B is patterned so as to be formed at a position corresponding to each sub-pixel 18B, and is patterned (exposure / development) so that an opening 45 is formed in a portion overlapping the connection terminal 101 in the terminal portion 11t. ) Is preferable.

[7] Next, a green (G) colored layer 36G is formed.
The colored layer 36G is formed in the same manner as the colored layer 36B, and is patterned so as to be formed at a position corresponding to each sub-pixel 18G, and an opening 45 is formed in a portion overlapping the connection terminal 101 in the terminal portion 11t. It is preferable to perform patterning (exposure / development).

[8] Next, a red (R) colored layer 36R is formed.
The colored layer 36R is formed in the same manner as the colored layer 36B, and is patterned so as to be formed at a position corresponding to each sub-pixel 18R, and an opening 45 is formed in a portion overlapping the connection terminal 101 in the terminal portion 11t. It is preferable to perform patterning (exposure / development).

  In addition, a color filter formation process is comprised by the above processes [6]-[8].

  [9] Next, in the opening 45, the remaining first sealing layer 34a and second sealing layer 34c are removed to expose the connection terminals 101 (sealing layer etching step).

  As a method for removing the first sealing layer 34a and the second sealing layer 34c, for example, a dry etching method using the colored layers 36R, 36G, and 36B as a mask is preferably used.

  [10] Next, the element substrate 10 and the counter substrate 41 are bonded together via the transparent resin layer 42 made of a transparent resin material (substrate bonding step).

  For this bonding, for example, a transparent resin material having adhesiveness is applied so as to cover the color filter 36, and then the counter substrate 41 is disposed in a predetermined position with respect to the element substrate 10 to which the transparent resin material is applied. In this state, for example, it can be performed by pressing the counter substrate 41 toward the base material 11 side.

An example of the transparent resin material is a thermosetting epoxy resin.
The thickness of the transparent resin layer 42 is not particularly limited, but is set to about 10 μm or more and 100 μm or less.

  After the steps [1] to [10] as described above, the organic EL device 100 can be obtained by mounting the FPC 105 on the terminal portion 11t of the element substrate 10 as shown in FIG.

<< Second Embodiment >>
Next, a second embodiment in which the organic light emitting device of the present invention is applied to an organic EL device will be described.

  FIG. 6 is a schematic longitudinal sectional view showing the structure of a second embodiment in which the organic light emitting device of the present invention is applied to an organic EL device.

  Hereinafter, the organic EL device 100B according to the second embodiment will be described with a focus on differences from the organic EL device 100 according to the first embodiment, and description of similar matters will be omitted.

  In the organic EL device 100B shown in FIG. 6, the insulating layer 28 covers the outer edges of the pixel electrodes 31R, 31G, 31B, and is provided with a height higher than that of the contact electrode 27. The same as the organic EL device 100 shown in FIG.

  That is, in the organic EL device 100B of the second embodiment, the insulating layer 28 that covers the outer edges of the pixel electrodes 31R, 31G, and 31B is provided with a height higher than that of the contact electrode 27. In the device manufacturing method, the insulating layer 28 functions as a step. And since the 1st sealing layer 34a can be formed following the shape of this level | step difference, the 1st sealing layer 34a is formed as what is provided with the inclination part 341a.

  The organic EL device 100B according to the second embodiment can provide the same effects as those of the first embodiment.

<Electronic equipment>
Next, a head mounted display to which the electronic apparatus of the present invention is applied will be described.

FIG. 7 is a schematic diagram in which the electronic apparatus of the present invention is applied to a head mounted display.
As shown in FIG. 7, a head mounted display (HMD) 1000 as an electronic apparatus of the present invention has two display units 1001 provided corresponding to the left and right eyes. The observer M can see characters, images, and the like displayed on the display unit 1001 by wearing the head mounted display 1000 on the head like glasses. For example, if an image in consideration of parallax is displayed on the left and right display units 1001, a stereoscopic video can be viewed and enjoyed.

  The display unit 1001 includes the organic EL devices 100 and 100B according to the first embodiment or the second embodiment described above.

  Therefore, the head mounted display 1000 is equipped with the organic EL devices 100 and 100B including the organic EL element 30 in which the deterioration of the light emission characteristics due to the occurrence of dark spots is suppressed or prevented for a long period of time. Therefore, a highly reliable head mounted display 1000 can be provided.

  The head mounted display 1000 is not limited to having the two display units 1001 and may be configured to include one display unit 1001 corresponding to either the left or right.

  In addition to the head-mounted display of FIG. 7, the electronic device of the present invention includes, for example, a personal computer (mobile personal computer), a tablet terminal, a smartphone, a mobile phone, a clock, a digital still camera, a television, and a video camera. , Viewfinder type, monitor direct view type video tape recorder, laptop personal computer, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, TV Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, equipment equipped with touch panel (for example, cash dispenser, automatic ticket vending machine of financial institution), medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram) Devices, ultrasound diagnostic devices, endoscope display devices), fish detectors, various measuring instruments, instruments (eg, vehicles, aircraft, ship instruments), flight simulators, other monitors, projections such as projectors It can be applied to a mold display device or the like.

  As mentioned above, although the organic light-emitting device and electronic device of this invention were demonstrated based on embodiment of illustration, this invention is not limited to these.

  For example, the structure of each part in the organic light-emitting device and the electronic device of the present invention can be replaced with any structure having the same function. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

Next, specific examples of the present invention will be described.
1. Formation of first sealing layer (Sample 1)
First, a p-type silicon crystal substrate was prepared, and then a first sealing layer made of silicon oxynitride (SiON) was formed by ion plating under the following conditions.

<Film formation conditions>
・ Pressure in the chamber: 1.2 Pa
Process gas: N ₂
・ Raw material ： SiO
・ Discharge current value: 180A
Ar flow rate: 80 mL / m
In addition, the average thickness of the obtained 1st sealing layer was 200 nm.

(Sample 2)
The first sealing layer was obtained in the same manner as Sample 1 by changing the conditions for forming the first sealing layer made of silicon oxynitride by the ion plating method as follows. .

<Film formation conditions>
-Pressure in the chamber: 1.1 Pa
Process gas: N ₂
・ Raw material ： SiO
・ Discharge current value: 180A
Ar flow rate: 80 mL / m
In addition, the average thickness of the obtained 1st sealing layer was 200 nm.

(Sample 3)
The first sealing layer was obtained in the same manner as Sample 1 by changing the conditions for forming the first sealing layer made of silicon oxynitride by the ion plating method as follows. .

<Film formation conditions>
-Pressure in the chamber: 0.9 Pa
Process gas: N ₂
・ Raw material ： SiO
・ Discharge current value: 150A
Ar flow rate: 80 mL / m
In addition, the average thickness of the obtained 1st sealing layer was 200 nm.

(Sample 4)
The first sealing layer was obtained in the same manner as Sample 1 by changing the conditions for forming the first sealing layer made of silicon oxynitride by the ion plating method as follows. .

<Film formation conditions>
-Pressure in the chamber: 0.85 Pa
Process gas: N ₂
・ Raw material ： SiO
・ Discharge current value: 130A
Ar flow rate: 80 mL / m
In addition, the average thickness of the obtained 1st sealing layer was 200 nm.

(Sample 5)
The first sealing layer was obtained in the same manner as Sample 1 by changing the conditions for forming the first sealing layer made of silicon oxynitride by the ion plating method as follows. .

<Film formation conditions>
-Pressure in the chamber: 0.8 Pa
Process gas: N ₂
・ Raw material ： SiO
・ Discharge current value: 130A
Ar flow rate: 80 mL / m
In addition, the average thickness of the obtained 1st sealing layer was 200 nm.

(Sample 1B)
In the chamber, the first sealing layer was formed in the same manner as in Sample 1 except that the p-type silicon crystal substrate was placed on the placement plate in a state where it was inclined 45 °.

(Sample 2B)
In the chamber, a first sealing layer was formed in the same manner as in the sample 2 except that the p-type silicon crystal substrate was placed on the placement plate while being inclined by 45 °.

(Sample 3B)
In the chamber, the first sealing layer was formed in the same manner as in Sample 3 except that the p-type silicon crystal substrate was placed on the placement plate while being inclined by 45 °.

(Sample 4B)
In the chamber, a first sealing layer was formed in the same manner as in the sample 4 except that the p-type silicon crystal substrate was placed on the placement plate while being inclined by 45 °.

(Sample 5B)
In the chamber, a first sealing layer was formed in the same manner as in Sample 5 except that the p-type silicon crystal substrate was placed on the placement plate while being inclined by 45 °.

2. Manufacture of organic EL devices (device sample 1)
The organic EL device of device sample 1 was manufactured according to the steps [1] to [10] of the method for manufacturing the organic EL device described above.

  In manufacturing the device sample 1, in the step [3], the first sealing layer 34a was formed under the same conditions as those for forming the first sealing layer of the sample 1.

  Further, in this step [3], the inclined portion 341a is formed so that the angle θ formed by the lower surface of the flat portion 342a and the lower surface of the inclined portion 341a is 40 ° or less.

(Device sample 5)
In the step [3], the first sealing layer 34a is formed in the same manner as the device sample 1 except that the film is formed under the same conditions as those for forming the first sealing layer of the sample 5. An organic EL device of device sample 5 was manufactured.

(Device sample 1B)
In the step [3], except that the inclined portion 341a is formed so that the angle θ formed by the lower surface of the flat portion 342a and the lower surface of the inclined portion 341a is 45 ° or more, the same as the device sample 1, An organic EL device of device sample 1B was manufactured.

(Device sample 5B)
In the step [3], except that the inclined portion 341a is formed so that the angle θ formed by the lower surface of the flat portion 342a and the lower surface of the inclined portion 341a is 45 ° or more, the same as the device sample 5, An organic EL device of device sample 5B was manufactured.

3. Evaluation 3-1. Evaluation by the presence or absence of dark spot generation 100 organic EL devices were prepared, and these were left under high-temperature and high-humidity conditions of 65 ° C. and 90% RH for 28 hours, and then the organic EL device in which the initial failure occurred was rejected.

Thereafter, a reliability test was performed under the conditions of 65 ° C. and 90% RH 1000 hr to confirm whether or not dark spots were generated in each organic EL device. In the organic EL device, the number of devices (panels) in which dark spots are generated was obtained.
The results are shown in Tables 1 and 2 below.

  As shown in Tables 1 and 2, it was found that dark spots were generated in device sample 1 and device sample 5, whereas dark spots did not increase in device sample 1B and device sample 5B.

  Due to the presence or absence of the occurrence of dark spots as described above, in the device samples 1 and 5 in which the angle θ is less than 45 °, the first sealing layer does not have a gas barrier property (water vapor barrier property). In the device samples 1B and 5B having an angle θ of 45 ° or more, a result that the first sealing layer is considered to have gas barrier properties (water vapor barrier properties) was obtained.

3-2. Measurement of deuterium diffusion coefficient For each of the first sealing layers, the deuterium diffusion coefficient in the first sealing layer in a deuterium atmosphere at 85 ° C. was measured.
In addition, the measurement of the deuterium diffusion coefficient was implemented as follows.

<Measurement method>
For the calculation of the deuterium diffusion coefficient, each sample No. was determined using a SIMS device ("IMS-7f" manufactured by Kameka Corporation). The amount of deuterium diffused in the film at 85 ° C. in a deuterium atmosphere was measured by SIMS, and the deuterium diffusion coefficient was calculated from the value. The SIMS measurement uses a Cs ⁺ primary beam and detects D ⁻ secondary ions. The measurement of D ^{− was performed in} a high mass resolution mode in order to eliminate the influence of H ²⁺ that is an interfering ion.

  Each sample No. measured as described above was measured. FIG. 8 shows the deuterium diffusion coefficient toward the respective p-type silicon crystal substrates in the first sealing layer.

  As shown in FIG. 8, between samples in which the first sealing layer is formed under the same film forming conditions, the p-type silicon crystal substrate is tilted by 45 ° without tilting the mounting plate. It can be said that the deuterium diffusion coefficient is higher than that when the type silicon crystal substrate is placed, and the first sealing layer allows moisture (water vapor) and oxygen to pass therethrough.

Each sample No. in the case where the p-type silicon crystal substrate is inclined by 45 ° is used. Is a deuterium diffusion coefficient of 1 × 10 ⁻²¹ (m ² / sec) or more, and each sample in the case where the p-type silicon crystal substrate is placed without being inclined on the mounting plate (inclination angle is 0 °) No. Was found to be lower than the deuterium diffusion coefficient of 1 × 10 ⁻²¹ (m ² / sec).

3-3. Summary From the above, when the angle θ is 45 ° or more and the first sealing layer has a step, the first sealing layer is provided with a dense portion and a sparse portion. The result considered that 1 sealing layer does not have gas barrier property (water vapor | steam barrier property) was obtained.

The first sealing layer is a layer having no gas barrier property (water vapor barrier property) when the deuterium diffusion coefficient is 1 × 10 ⁻²¹ (m ² / sec) or more. It was considered.

DESCRIPTION OF SYMBOLS 10 ... Element substrate 11 ... Base material 11a ... 1st insulating film 11b ... 2nd insulating film 11t ... Terminal part 12 ... Scanning line 13 ... Data line 14 ... Power supply line 15 ... Data line drive Circuit 16... Scanning line drive circuit 17... Inspection circuit 18... Sub pixel 18 B... Sub pixel 18 G. ... Storage capacitor 23 ... Driving transistor 23a ... Semiconductor layer 23c ... Channel region 23d ... Drain region 23g ... Gate electrode 23s ... Source region 24 ... First interlayer insulating film 25 ... Reflective layer 26 ... Second interlayer insulating film 26a ... contact hole 27 ... contact electrode 28 ... insulating layer 28a ... opening 29 ... wiring layer 30 ... organic EL element 31 ... pixel electrode 31B ... Element electrode 31G... Pixel electrode 31R... Pixel electrode 32... Functional layer 33 .. counter electrode 34... Sealing layer 34a ... first sealing layer 34b ... buffer layer 34c ... second sealing layer 35 …… Mounted substrate 36 …… Color filter 36 </ b> B …… Colored layer 36 </ b> G ...... Colored layer 36 </ b> R …… Colored layer 41 …… Counter substrate 42 …… Transparent resin layer 45 ...... Opening 100 …… Organic EL device 100 </ b> B …… Organic EL device 101... Connection terminal 102... Input terminal 103 .. wiring layer 105.
110 …… Drive IC
341a: Inclined portion 342a: Flat portion 1000 ... Head mounted display 1001 ... Display portion E1 ... Display region E2 ... Dummy region M ... Observer θ ... Angle

Claims (7)

A substrate, an organic light emitting device disposed on the substrate, and a sealing layer that seals by covering the organic light emitting device,
The sealing layer includes, in order from the organic light emitting element side, a first sealing layer mainly made of silicon oxynitride, a buffer layer mainly made of a resin material, and mainly silicon oxynitride. A laminated body in which a second sealing layer is laminated;
In the plane orthogonal to the laminating direction of the sealing layer, the first sealing layer includes a dense part having a high density and a sparse part having a density lower than the dense part. . The organic light-emitting device according to claim 1, wherein a deuterium diffusion coefficient of the first sealing layer is 1.0 × 10 ⁻²¹ m ² / sec or more.   The organic light-emitting device according to claim 1, wherein permeation of water vapor is allowed mainly in the sparse part. A sub-pixel of the organic light-emitting device is configured by the plurality of organic light-emitting elements,
The organic light-emitting device according to any one of claims 1 to 3, wherein a plurality of the sparse portions are formed corresponding to each organic light-emitting element.   5. The organic light-emitting device according to claim 4, wherein the plurality of sparse portions are generated corresponding to steps formed on an upper surface side of the substrate for each organic light-emitting element.   The step is a connection electrode for electrically connecting the organic light emitting device and a pixel circuit provided on the substrate, or an outer edge portion of the organic light emitting device to insulate each organic light emitting device. The organic light-emitting device according to claim 5, wherein the organic light-emitting device is an insulating layer.   An electronic apparatus comprising the organic light-emitting device according to claim 1.

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