JP2017061120A - Prepreg and manufacturing method therefor, printed circuit board using the same and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a prepreg maintaining high modulus, having low thermal expansion coefficient and high credibility even with thin thickness.SOLUTION: A prepreg 130 includes a nonwoven fabric having thickness in a range of 10 to 100 nm and consisting of a hollow nanofiber obtained by an electrical spinning method using an aramid organic materials, nylon, silica-based inorganic materials and titania-based inorganic materials as a core layer 110, an upper insulation layer 120a and a lower insulation layer 120b formed on an upper surface and a lower surface facing each other of the core layer 110 respectively. A printed circuit board 100 is obtained by laminating a copper foil 140a on an outer surface of the insulation layer of the prepreg.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a prepreg and a manufacturing method thereof, a printed circuit board using the prepreg, and a manufacturing method thereof, and more specifically, a prepreg having a thin thickness and a reliability thereof, a manufacturing method thereof, and a printed circuit using the same. The present invention relates to a substrate and a manufacturing method thereof.

  With the development of electronic device manufacturing technology, printed circuit boards (PCBs) that are essentially built into electronic devices are also required to be reduced in weight, thickness, and size. In the printed circuit board, wiring layers for circuit connection and insulating layers serving as insulation between the wiring layers are alternately laminated, and the wiring layers are mainly formed of a metal material such as copper (Cu). The insulating layer is formed of a polymer resin such as epoxy.

  In this case, the printed circuit board needs to keep the thickness of the insulating layer thin in order to reduce the thickness. However, the thinner the insulating layer is, the more difficult it is to adjust the characteristics against warpage. It was. That is, the wiring layer and the insulating layer made of metal have different values in various physical properties such as a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a modulus. Therefore, it is difficult to adjust the characteristics of the printed circuit board. For this reason, electrical, thermal and mechanical properties are reduced.

  As a result, the thinner the printed circuit board, the more unstable the quality of the printed circuit board, and the lower the dielectric constant, dielectric loss, etc., and signal transmission defects in the high frequency region may occur. In mounting, a connection failure may occur due to warpage.

  In order to solve such a problem, the printed circuit board is made of a fabric cloth or a glass cloth (glass cloth) in order to increase the glass transition temperature, modulus and stiffness of the core core layer. A thick copper clad laminate (CCL) with a glass cross core is applied to form a build-up layer of resin material to prevent distortion and dimensional stability Is granted.

  At this time, in order to further improve the physical characteristics, a resin material is impregnated with a large amount of an inorganic filler. In this case, the adhesion with copper forming the wiring layer is reduced, and the wiring layer Stability and reliability are reduced.

Korean Published Patent No. 2013-0119643

  The problem to be solved by the present invention is to provide a prepreg that maintains a high modulus and has a low coefficient of thermal expansion.

  Another problem to be solved by the present invention is to provide a method for producing a prepreg that maintains a high modulus and has a low coefficient of thermal expansion.

  Another object of the present invention is to provide a printed circuit board including a prepreg that maintains a high modulus and has a low coefficient of thermal expansion.

  Another object of the present invention is to provide a method of manufacturing a printed circuit board including a prepreg that maintains a high modulus and has a low coefficient of thermal expansion.

  Problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

  In order to achieve the above object, the present invention provides a prepreg.

  The prepreg may include a core material made of nanofibers having a thickness in the range of 10 to 100 nm, and an upper insulating layer and a lower insulating layer respectively provided on an upper surface and a lower surface of the core material facing each other. it can.

  The core material can include an aramid organic material, nylon, silica-based inorganic material, or titania-based inorganic material.

  A part of the upper insulating layer or the lower insulating layer may be impregnated in the core material.

  The nanofiber may be a hollow fiber. A part of the upper insulating layer or the lower insulating layer may be impregnated in the hollow of the hollow fiber.

  The upper insulating layer and the lower insulating layer may have different thicknesses.

  In order to achieve the above-mentioned other problems, the present invention provides a method for producing a prepreg. The manufacturing method includes a step of preparing a lower insulating layer having a copper foil layer on a lower surface, and nanofibers spun by an electrospinning method on an upper surface of the lower insulating layer facing the lower surface. Forming the constructed core material and forming an upper insulating layer on the core material can be included.

  Nanofibers can be formed to have a thickness in the range of 10-100 nm.

  The core material can include an aramid organic material, nylon, silica-based inorganic material, or titania-based inorganic material.

  An upper insulating layer may be formed on the core material, and a part of the upper insulating layer may be impregnated in the core material.

  The nanofiber may be a hollow fiber.

  By forming the upper insulating layer on the core material, a part of the upper insulating layer may be impregnated in the hollow of the hollow fiber.

  The upper insulating layer may be formed to have a thickness different from that of the lower insulating layer.

  In addition, in order to achieve the above and other problems, the present invention provides a printed circuit board. The printed circuit board may include the above-described prepreg and a base material provided on at least one of the upper insulating layer and the lower insulating layer.

  The substrate can be a copper foil layer.

  Furthermore, in order to achieve the above and other objects, the present invention provides a method for manufacturing a printed circuit board. The method may include manufacturing a prepreg by the method described above and forming a substrate on at least one of the lower insulating layer and the upper insulating layer.

  The substrate can be a copper foil layer.

It is sectional drawing for demonstrating the printed circuit board based on one Example of this invention. It is sectional drawing which shows 1 process for demonstrating the manufacturing method of the printed circuit board which concerns on one Example of this invention. FIG. 3 is a cross-sectional view showing a step subsequent to the step in FIG. 2. FIG. 4 is a cross-sectional view showing a step subsequent to the step of FIG. 3. FIG. 5 is a cross-sectional view showing a step subsequent to the step in FIG. 4. It is a plane projection electron micrograph with respect to the nanofiber of the core material applied to the printed circuit board concerning one Example of this invention.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention and methods of achieving them will become more apparent with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described here, and may be embodied in different forms. The embodiments illustrated here are provided so that the disclosed contents will be thorough and complete, and to make the idea of the present invention sufficiently communicated to those skilled in the art. It should be defined by the scope of the claims.

  Throughout the specification, the same reference numerals refer to the same components. Thus, identical or similar reference numerals may be described with reference to other drawings, even if not mentioned or described in the drawings. Further, even if the reference numerals are not displayed, they can be described with reference to other drawings.

  The terminology used herein is for describing the embodiments and is not intended to limit the present invention. In this specification, the singular includes the plural unless specifically stated otherwise. Also, as used herein, “comprise” and / or “comprising” refers to a component, step, operation, and / or other component that includes one or more of the components, It does not mean to exclude the presence or addition of steps, actions and / or elements. Moreover, since it is based on a preferable Example, the reference code shown by the order of description is not necessarily limited to the order. In addition to this, when a film is referred to herein as being on another film or substrate, it is formed directly on the other film or substrate, or a third between them. It means that a membrane can also be interposed.

  When an element is “connected to” or “coupled to” with another component, the description “directed” or “coupled to” refers to the case where the element is directly connected to another component All cases where other components are interposed in between.

  On the other hand, the description that one component is “directly connected to” or “directly coupled to” with another component is in the middle of other components It means not intervening. “And / or” includes each and every combination of one or more of the items mentioned.

  The spatially relative terms “below”, “beneath”, “lower”, “above”, “upper” and the like are shown in the drawings. In addition, it can be used to easily describe the correlation between one element or component and another element or component. Spatial relative terms should be understood as terms that include different directions of the element in use or operation in addition to the directions shown in the drawings. For example, when reversing the elements shown in the drawing, an element described as “below” or “beneath” of another element is placed “above” the other element. Will be. Thus, the exemplary term “bottom” can include all directions of bottom and top. The elements can be oriented in other directions so that spatially relative terms can be interpreted by orientation.

  In addition, the embodiments described in this specification will be described with reference to cross-sectional views and / or plan views which are ideal illustrative views of the present invention. In the drawings, the thickness of films and regions are exaggerated for effective description of technical contents. Therefore, the form of the illustrative drawing can be modified depending on the manufacturing technique and / or tolerance. Accordingly, embodiments of the present invention are not limited to the specific forms shown, but also include changes in form produced by the manufacturing process. For example, the etched areas shown at right angles may be rounded or have a predetermined curvature. Accordingly, the region illustrated in the drawing has a schematic attribute, and the form of the region illustrated in the drawing is for illustrating a specific form of the region of the element, and does not limit the scope of the invention. Absent.

  FIG. 1 is a cross-sectional view illustrating a printed circuit board according to an embodiment of the present invention.

  Referring to FIG. 1, a printed circuit board 100 according to this embodiment includes a core material 110 made of a spinning layer, insulating layers 120a and 120b formed on both surfaces of the core material 110, and insulating layers 120a and 120b. And formed base materials 140a and 140b.

  The core material 110 may be composed of a spinning layer made of nanofibers, in which nanofibers are spun by electrospinning. At this time, the spinning layer can be formed by spinning by an electrospinning method using a solution in which an organic substance or an inorganic substance is dissolved, and includes an aramid organic material, nylon, silica. (Silica) -based inorganic materials or titania-based inorganic materials can be used.

  When an aramid organic material is used, high rigidity and high modulus can be imparted to the printed circuit board 100 according to this embodiment, and distortion can be reduced. When nylon is used, hollow fibers can be easily formed, and the dielectric constant (Dk) and loss factor (Df) can be lowered by air.

  When a silica-based inorganic material or a titania-based inorganic material is used, a low thermal expansion coefficient and a high modulus can be imparted to the printed circuit board 100, and the dielectric constant (Dk) and loss factor (Df) can be lowered by the additive. .

  The core material 110 is composed of nanofibers having a thickness in the range of about 10 nm to 100 nm, but is composed of a porous nanofiber structure in a state where the nanofibers are physically intertwined. It is possible to maintain a low coefficient of thermal expansion while improving the modulus of the printed circuit board 100.

  Here, when the thickness of the nanofiber is less than 10 nm, it is not possible to form a network having a sufficient network structure to obtain the modulus required for the core material 110, and when the thickness of the nanofiber exceeds 100 nm. Depending on the thickness of the nanofiber, the adhesion between the core material 110 and the insulating layers 120a and 120b is lowered. For this reason, it is preferable to perform electrospinning so that the nanofibers constituting the core material 110 have a thickness in the range of 10 nm to 100 nm.

  The electrospinning of the core material 110 is performed at a high voltage of 5 to 25 kV, and the heat treatment after the electrospinning is performed while increasing the temperature from 10 to 30 ° C. to 300 to 400 ° C. at a rate of 2 to 6 ° C. per minute. Can be performed.

  Insulating layers 120a and 120b are stacked on the upper surface and the lower surface of the core material 110, respectively, and a prepreg 130 (PrePreG: PPG) is formed by stacking the insulating layers 120a and 120b. The insulating layers 120a and 120b are formed by laminating and curing an insulating resin such as epoxy on the upper surface and the lower surface of the core material 110. Here, the insulating layers 120a and 120b can be formed by impregnating a glass cloth or a fabric cloth with an insulating resin. In this case, the modulus of the printed circuit board 100 according to the present embodiment is further improved. can do.

  The prepreg 130 configured in this way can reduce the thickness of the core material 110 while maintaining mechanical, thermal, and electrical characteristics.

  A base material can be laminated on the insulating layers 120a and 120b. The base materials 140a and 140b may be formed of copper foil (Cu foil) according to the type of the printed circuit board 100 according to the present embodiment, and may be made of an insulating resin made of the same material as or different from the insulating layers 120a and 120b. It may be configured.

  In addition, the insulating layers 120a and 120b may be formed to have different thicknesses. That is, the thickness ratio between the insulating layers formed in the prepreg 130 may be different from each other. This is also for controlling the distortion of the printed circuit board 100 according to the present embodiment.

  Each of the insulating layers 120a and 120b can be made of a thermosetting resin or a photocurable resin. Here, one of the insulating layers 120a and 120b may be made of a thermosetting resin, and the other insulating layer may be made of a photocurable resin.

  When the base materials 140a and 140b are made of copper foil, the prepreg 130 is made of a copper clad laminate in which copper foil layers are formed on both surfaces, and the copper foil layer of the copper clad laminate is later used as a wiring layer. Can be formed. In addition, when the base materials 140a and 140b are made of an insulating resin, they can be formed as a build-up layer of a multilayer printed circuit board.

  Meanwhile, the nanofibers constituting the core material 110 can be configured in the form of hollow fibers. When the nanofiber is configured in the form of a hollow fiber, air enters the internal cavity of the hollow fiber, so that the dielectric constant of the core material 110 can be lowered. Accordingly, the printed circuit board 100 according to the present embodiment is advantageous for high frequency and high speed transmission.

  2 to 5 are process cross-sectional views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention, and FIG. 6 is applied to the printed circuit board according to an embodiment of the present invention. It is a plane projection electron micrograph with respect to the nanofiber of the core material.

  Referring to FIG. 2, a lower base material 140a on which a lower insulating layer 120a is stacked is prepared. The lower substrate 140a can be formed of a copper foil or an insulating plate obtained by curing an insulating resin. The lower insulating layer 120a may be stacked on the base material 140a with a thickness of several μm.

  Referring to FIG. 3, a core material 110 made of nanofibers may be formed on the lower insulating layer 120a. The core material 110 can be composed of a spinning layer in which nanofibers spun by an electrospinning method are stacked in an intertwined state.

  The electrospinning method can realize continuous nanofibers having a diameter of a minimum nm scale using an electric field. As shown in FIG. 6, the core material 110 in which nanofibers are randomly arranged can be obtained by discharging and spinning nanofibers through a nozzle at a constant speed.

  Nanofibers obtained by such electrospinning can be formed to a thickness of about 10 nm to 100 nm. Thereby, the core material 110 can have a high specific surface area per unit volume, and can be comprised by the insulating layer with a high hardening degree.

  In addition, the core material 110 can adjust the gap when the nanofibers are laminated by electrospinning. For example, the core material 110 has different solubility in the polymer solution injected into the electrospinning apparatus for forming the nanofibers. After the nano-fibers are randomly arranged by mixing the polymers having them, the size and the porosity of the core material 110 can be adjusted by selectively dissolving and removing one component.

  Meanwhile, the core material 110 applied on the lower insulating layer 120a may be applied by forming the nanofibers constituting the core material 110 in the form of hollow fibers. Nanofibers in the form of hollow fibers can be manufactured by forming a nozzle provided in the electrospinning apparatus in a double structure, and an air layer is formed by the internal cavities of the nanofibers in the form of hollow fibers. The rate can be improved.

  Referring to FIG. 4, the upper insulating layer 120 b is further stacked on the core material 110 stacked on the lower insulating layer 120 a, and the prepreg 130 including the core material 110 at the center is manufactured. The prepreg 130 is mainly applied as a core of the printed circuit board 100 due to a high modulus and a low thermal expansion coefficient of the core material 110, and is also applied to a build-up layer of a multilayer printed circuit board whose main purpose is to prevent distortion. Can do.

  Referring to FIG. 5, an upper base material 140b made of the same material as the lower base material 140a shown in FIG. 2 is laminated on the upper insulating layer 120b to form a copper-clad laminate or a double-sided printed circuit board build-up layer. Can be done.

  In the printed circuit board of this embodiment manufactured by such a configuration and manufacturing method, the core material 110 constituting the central portion can have a relatively flat surface whose flexibility is reduced by electrospinning. . Accordingly, the insulating layers 120a and 120b stacked on the upper surface and the lower surface of the core material 110 can have a relatively flat surface. Thereby, when an additional insulating layer is laminated on the insulating layers 120a and 120b, or when a plating layer is formed on the insulating layers 120a and 120b, the defect rate can be reduced.

  On the other hand, in the step of forming the core material 110, an organic nanofiber layer can be additionally formed between the core material 110 in which inorganic nanofibers are randomly arranged and the insulating layers 120a and 120b. Thereby, the joining performance with the insulating layers 120a and 120b laminated on the upper surface and the lower surface of the core material 110 can be improved. That is, since the insulating layers 120a and 120b laminated on the core material 110 are made of an organic insulating resin, by forming organic nanofiber layers of the same material as the insulating layers 120a and 120b on both surfaces of the core material 110, The joining performance can be improved by the joining affinity of the same material.

  The embodiments of the present invention have been described above with reference to the accompanying drawings, but those skilled in the art to which the present invention pertains change the technical idea and essential features of the present invention. It will be understood that other specific forms can be implemented without. Accordingly, it should be understood that the embodiments described above are illustrative in all aspects and not limiting.

100 printed circuit board 110 core material 120a, 120b insulating layer 130 prepreg 140a, 140b base material

Claims (17)

A core material composed of nanofibers having a thickness in the range of 10 to 100 nm;
A first insulating layer and a second insulating layer respectively provided on the first surface and the second surface of the core material facing each other;
Including prepreg.   The prepreg according to claim 1, wherein the core material includes an aramid organic material, nylon, silica-based inorganic material, or titania-based inorganic material.   The prepreg according to claim 1 or 2, wherein a part of the first insulating layer and / or the second insulating layer is impregnated in the core material.   The prepreg according to any one of claims 1 to 3, wherein the nanofiber is a hollow fiber.   The prepreg according to claim 4, wherein a part of the first insulating layer and / or the second insulating layer is impregnated in a cavity of the hollow fiber.   The prepreg according to any one of claims 1 to 5, wherein the first insulating layer and the second insulating layer have different thicknesses. The prepreg according to any one of claims 1 to 6,
A substrate provided on at least one of the first insulating layer and the second insulating layer;
Including printed circuit board.   The printed circuit board according to claim 7, wherein the base material is a copper foil layer. Providing a first insulating layer provided with a copper foil layer on a first surface;
Forming a core material composed of nanofibers spun by electrospinning on a second surface of the first insulating layer facing the first surface;
Forming a second insulating layer on the core material;
A method for producing a prepreg comprising:   The method for producing a prepreg according to claim 9, wherein the nanofiber is formed to have a thickness in a range of 10 to 100 nm.   The prepreg manufacturing method according to claim 9 or 10, wherein the core material includes an aramid organic material, nylon, silica-based inorganic material, or titania-based inorganic material.   The method for manufacturing a prepreg according to claim 9, wherein a part of the second insulating layer is impregnated in the core material by forming a second insulating layer on the core material.   The method for producing a prepreg according to any one of claims 9 to 12, wherein the nanofiber is a hollow fiber.   The method for producing a prepreg according to claim 13, wherein a part of the second insulating layer is impregnated in a cavity of the hollow fiber by forming a second insulating layer on the core material.   The prepreg manufacturing method according to claim 9, wherein the second insulating layer is formed to have a thickness different from that of the first insulating layer.   A step of manufacturing a prepreg by the method for manufacturing a prepreg according to any one of claims 9 to 15, and forming a base material on at least one of the first insulating layer and the second insulating layer And a method of manufacturing a printed circuit board.   The method of manufacturing a printed circuit board according to claim 16, wherein the base material is a copper foil layer.