JP2017059649A - Hermetic sealing cap and manufacturing method therefor, electronic component housing package and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hermetic sealing cap that is not only inexpensive but also easily realizes high vacuum or inert gas atmosphere in the electronic component housing package by making gas hard to remain therein, and to provide a manufacturing method therefor, an electronic component housing package using the hermetic sealing cap, and a manufacturing method therefor.SOLUTION: A hermetic sealing cap includes an annular sealing material part having a discontinuous part at one or more positions on the surface of a metal plate. An electronic component housing package has a first sealing part where a junction structure of the hermetic sealing cap and an electronic component housing member internally housing an electronic component are joined annularly while having the discontinuous part, and a second sealing part which is joined to embed the discontinuous part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a hermetic sealing cap and a manufacturing method thereof, an electronic component storage package, and a manufacturing method thereof.

  Conventionally, for example, a surface acoustic wave (SAW) filter used for noise removal of a mobile phone, a surface mount device (SMD: Surface Mount) used for hermetic sealing of electronic components such as a crystal resonator and an oscillator. An electronic component storage package in which an electronic component is stored inside, such as a device) package, is often used. In such an electronic component storage package, a lid member (airtight sealing cap) is bonded to a ceramic case (electronic component storage member) in which an electronic component is stored. It is hermetically sealed.

  For example, in the hermetic sealing cap disclosed in Patent Document 1, a ceramic plate having a lower thermal expansion than metal is used as a base material, and a low-melting glass paste (sealing material) is provided on the surface of the ceramic plate. A sealing material portion that is coated and hardened is provided. Such a sealing material portion has a two-layer structure using a low-melting-point glass paste of the same quality, and four corners are formed on the surface of the first sealing material portion (lower layer) arranged in a ring (square). A second sealing material portion (upper layer) is formed so as to be discontinuous and arranged in a ring shape (square shape) as a whole. Such a two-layer sealing material part is obtained by applying a low-melting-point glass paste to be the first sealing material part on the surface of the ceramic plate, and subsequently applying a second sealing on the surface of the first sealing material part. After applying the same low melting point glass paste as the material part so that the four corners are discontinuous, only the surface is dried and cured at a temperature lower than the melting point of the low melting point glass paste. Yes. In addition, the glass paste solvent, organic binder, etc. which are easy to gasify by heating remain in the sealing material part which hardened only the surface inside.

  In the electronic component storage package disclosed in Patent Document 1, the above-described hermetic sealing cap having the two-layer sealing material portion and the electronic component storage member in which the electronic component is stored are joined. It is hermetically sealed. In the joining process, a discontinuous portion that connects the inside and the outside of the electronic component storage package is formed by the second sealing material portion configured so that the four corner portions are discontinuous. According to the joining structure having such a discontinuous portion, even when the solvent of the glass paste or the organic binder is gasified inside when the sealing material portion is heated, the gas can be discharged to the outside through the discontinuous portion. it can. Or even if gas expand | swells inside, gas will be discharged | emitted outside through a discontinuous part and the leak defect resulting from ejection of residual gas will be suppressed.

JP 2005-26974 A

  In recent years, electronic devices using electronic component storage packages have been further reduced in size and performance. As a result, electronic component storage packages and hermetic sealing caps used therefor are required not only to be inexpensive, but also to reduce the amount of moisture and gas remaining in the interior and to increase the vacuum. It has been. Or depending on a use, it is calculated | required that the inside of an electronic component storage package shall be inert gas atmosphere.

  By the way, since the 1st sealing material part and the 2nd sealing material part are homogeneous in the sealing material part of 2 layer structure disclosed by patent document 1, the glass paste of a 1st sealing material part melt | dissolved. The first sealing material generated in this way and the second sealing material generated by melting the glass paste of the second sealing material part are very familiar. Therefore, although the two-layered sealing material portion increases the manufacturing cost, it was formed by the second sealing material portion when the glass paste of the first sealing material portion and the second sealing material portion was melted. There is also an advantage that the discontinuous portion is closed in a short time with a time margin that the inside does not become high pressure, and the ejection of the residual gas is suppressed. Even so, since the discontinuous portion is closed in a short time, the gas caused by the solvent of the glass paste, the organic binder or the like tends to remain inside the electronic component storage package. For this reason, a decrease in the degree of vacuum due to the residual gas or the residual gas itself may affect various characteristics of the electronic component.

  An object of the present invention is to provide a hermetic sealing cap that is inexpensive and does not easily cause gas to remain in an electronic component storage package, and that can easily be evacuated, or in which an interior is easily brought into an inert gas atmosphere, and a method for manufacturing the same. Another object is to provide an electronic component storage package using the hermetic sealing cap and a manufacturing method thereof.

  The present inventor has examined the bonding structure between the hermetic sealing cap using the sealing material and the electronic component storage member, and communicated the inside and outside of the electronic component storage package in the process of bonding and closed the plug in a short time. The present inventors have found that the above-described problems can be solved by forming a joining structure having discontinuous portions that are difficult to achieve, and have arrived at the present invention.

That is, the hermetic sealing cap of the present invention is a hermetic sealing cap provided with an annular sealing member having one or more discontinuous portions on the surface of the metal plate.
It is preferable that the surface of the metal plate in the discontinuous portion has a region where wettability with respect to the sealing material generated by melting the sealing material portion is lower than the other surface of the metal plate.

  The hermetic sealing cap of the present invention is arranged by disposing an annular sealing material having one or more discontinuous portions on the surface of a metal plate, and solidifying after melting the sealing material by heating. It can be produced by a production method for forming an annular sealing material portion having one or more discontinuous portions on the surface of the metal plate.

Using the above-described hermetic sealing cap of the present invention, an electronic component storage package in which electronic components are stored can be obtained.
That is, the electronic component storage package of the present invention is an electronic component storage package in which the above-described hermetic sealing cap of the present invention and an electronic component storage member in which the electronic component is stored are joined. The sealing structure of the hermetic sealing cap and the electronic component housing member includes a first sealing portion that is annularly joined while having the discontinuous portion, and a first sealing portion that is joined so as to embed the discontinuous portion. It has two sealing parts.

  An electronic component storage package according to the present invention is a method for manufacturing an electronic component storage package in which an airtight sealing cap and an electronic component storage member in which an electronic component is stored are joined. An airtight sealing cap forming step of preparing a stopper and forming an annular first sealing material portion having one or more discontinuous portions on the surface of the metal plate using the first sealing material; Then, after disposing the hermetic sealing cap on the electronic component housing member in which the electronic component is housed, the first sealing material portion is melted and then solidified to form one or more discontinuous portions. A first sealing step for forming an annular first sealing portion, and an airtight sealing cap by embedding the discontinuous portion using a second sealing material to form a second sealing portion. Including a second sealing step for sealing the electronic component housing member. It can be.

  According to the present invention, in the process of joining the hermetic sealing cap and the electronic component storage member, the inside and the outside of the electronic component storage package communicate with each other, and the bonding structure having a discontinuous portion that is difficult to close in a short time. Can be formed. By using such a joint structure having discontinuous portions, it is possible to perform a process for increasing the vacuum inside the electronic component storage package or a process for creating an inert gas atmosphere.

It is a structural example of the cap for airtight sealing of this invention, Comprising: It is a top view by the side of a joint surface with an electronic component storage member. It is sectional drawing along line AA shown in FIG. It is sectional drawing which shows the structural example of the cap for airtight sealing using the metal plate using the base material 5, the intermediate | middle layer 7, and the contact | adherence layer 6 instead of the metal plate shown in FIG. It is a perspective view which shows the structural example which joined the cap for airtight sealing of this invention, and the electronic component storage member. It is a perspective view which shows the structural example which embedded the discontinuous part 10 shown in FIG. 4 using the 2nd sealing material, and performed final airtight sealing.

  The hermetic sealing cap (hereinafter referred to as “cap”) of the present invention is used in an electronic component storage package (hereinafter referred to as “package”), and an electronic component storage member (hereinafter referred to as “electronic component storage member”) in which the electronic component is stored. , Referred to as “case”). An important feature of the present invention is a cap including an annular sealing material portion having one or more discontinuous portions on the surface of the metal plate. That is, the annular sealing member does not have one continuous annular shape but has one or more discontinuous portions.

Hereinafter, the cap of the present invention and the manufacturing method thereof will be described with reference to FIG. 1, FIG. 2, and FIG.
A cap 1 shown in FIG. 1 includes a rectangular metal plate 2 and a rectangular annular sealing material portion 3 formed along the four sides on the surface of the metal plate 2. This annular sealing material portion 3 has a total of two discontinuous portions 4, one on the opposing long side. Thereby, the annular sealing member 3 does not become one continuous annular shape. As shown in FIG. 2, the discontinuous portion 4 has no sealing material portion 3 formed on the surface of the metal plate 2, so that when the package is manufactured using the cap 1 as described later, And the outside communicate with each other, and finally there are important effects such as improvement of hermetic sealing of the package and high vacuum.

  The metal plate 2 is formed into a predetermined shape shown in FIG. 1 using a metal material having a predetermined thickness, such as a rolled thin plate, by press processing, laser processing, water jet processing, or the like. In addition, the shape of the cap of this invention is not limited to this shape. As a metal material used for the metal plate 2, an Fe—Ni alloy, an Fe—Ni—Co alloy, an Fe—Cr alloy, an Fe—Ni—Cr alloy, or the like can be used. Specifically, the Fe-Ni-based alloy containing 10 to 48 mass% Ni, the Fe-Ni-Co-based alloy containing 10 to 45 mass% Ni and 10 to 25 mass% Co, or 2 to 20 mass%. Fe-Cr alloy containing Cr can be used. Moreover, Fe-42 mass% Ni-6 mass% Cr type alloy containing 35-50 mass% Ni, Fe-42 mass% Ni-4% Cr type alloy, Fe-47 mass% Ni-6 mass % Cr alloy can also be used. In addition to the elements of Fe, Ni, Cr, and Co described above, the metal plate 2 is made of, for example, elements such as Ti, Si, Mn, Cu, Al, C, P, S, N, and O according to the present invention. It can be included as long as the effect is not inhibited.

The cap 1 is joined to the case via the sealing material by reflow processing of the sealing material, seam welding, laser welding, or the like. In the process of joining, the cap 1 and the case are expanded by heating, and thermal stress is generated due to a difference in thermal expansion between the cap 1 and the case. Since the thermal stress increases as the difference in thermal expansion between the cap 1 and the case increases, cracks and the like are likely to occur at the joint. Further, when the hermetically sealed package is subjected to a change in thermal cycle, the joint may be damaged due to residual stress. Therefore, the metal plate 2 preferably has a thermal expansion coefficient comparable to that of the case material (for example, ceramic). When the material of the case is ceramic, it is preferable that the thermal expansion coefficient of the metal plate 2 at 40 ° C. to 400 ° C. is 12 × 10 ⁻⁶ / ° C. or less.

  The metal plate 2 used for the cap in the present invention may be coated on the surface before the annular sealing material portion 3 is formed. For example, the metal plate 2 shown in FIG. 3 (for the sake of convenience, the same reference numeral as in FIG. 1) is used as an intermediate layer on the surface of the base material 5 formed using the same metal material as the metal plate 2 shown in FIG. 7 and an adhesion layer 6 on the surface of the intermediate layer 7. The adhesion layer 6 on the outermost surface of the metal plate 2 is melted when the sealing material is fixed on the surface of the metal plate 2 by, for example, reflow treatment to form the annular sealing material portion 3. It is a layer that imparts appropriate wet spread and high adhesion to the metal plate when it is fixed. The metal plate 2 having the adhesion layer 6 is preferable because the peel strength of the annular sealing material portion 3 is increased.

  As the adhesion layer 6, for example, Sn—Sn—Au—Sn alloy, Sn—Ag alloy, Sn—Cu alloy, Sn—Zn alloy, Sn—In alloy, Sn—Bi alloy or the like is used as the sealing material. In the case of using a metal material containing Ni, an Au layer, an Au—Co alloy layer, a Pd layer, an Ag layer, or the like can be used. Each of these layers can be formed by plating treatment such as electrolysis and electroless, vapor deposition treatment such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), and pressure treatment such as clad rolling. In addition, the adhesion layer 6 is made of, for example, a VPO system, a Pb—B—O—F system, a Pb—B—O system, a Bi—B—O system, or a Sn—PO system. When a glass material such as, for example, is used, an oxide film layer derived from an element contained in the base material 5 such as Cr, Fe, Zn, Al, Ti, Mg, Ca, and Si can be used. Such an oxide film layer is made of, for example, an Fe—Cr alloy containing 2 to 8% by mass of Cr and Fe or a Fe—Ni—Cr alloy containing 35 to 50% by mass of Ni. In some cases, the substrate 5 can be formed as a strong oxide film layer containing Cr by heat treatment in a selective oxidizing atmosphere in a temperature range of 1150 ° C. or lower. Similarly, even if the substrate 5 is an Fe—Ni alloy or an Fe—Ni—Co alloy, it can be formed as an oxide film layer containing Fe.

  The selective oxidizing atmosphere here means that when formed as a strong oxide film layer containing Cr, Cr is preferentially oxidized over elements such as Fe and Ni other than Cr of the base material 5 containing Cr. Intended for an oxidizing atmosphere. A preferred selective oxidizing atmosphere is a wet hydrogen atmosphere controlled at a temperature 10 to 40 ° C. higher than the dew point in the atmosphere. In addition to the heat treatment in the selective oxidizing atmosphere, the oxide film layers related to the various elements described above can be formed by plating treatment or vapor deposition treatment according to practical convenience.

  Further, the metal plate 2 having the adhesion layer 6 can have an intermediate layer 7 between the adhesion layer 6 and the substrate 5. For example, when the high-performance but expensive Au layer is used as the adhesion layer 6, the thickness of the adhesion layer 6 may be reduced from the viewpoint of cost reduction. In such a case, since the surface of the base material 5 is easily corroded by the atmosphere, it is effective to have the intermediate layer 7. Further, when the adhesion layer 6 is formed on the surface of the substrate 5 by, for example, plating, the plating solution may corrode the surface of the substrate 5. Even in such a case, by having the intermediate layer 7 in advance, corrosion of the surface of the substrate 5 is prevented. The intermediate layer 7 is, for example, a Ni layer, a Ni—P alloy layer containing 1 to 30% by mass of P, an Al layer, a Cr layer, a Ti layer, or an Al alloy layer, a Cr alloy layer, a Ti alloy, or the like. it can. Each of these layers can be formed by plating treatment such as electrolysis or electroless, vapor deposition treatment such as PVD or CVD, or pressure contact treatment such as clad rolling.

  In the present invention, as shown in FIG. 1, the annular sealing material portion 3 is configured such that after the sealing material for forming the sealing material portion 3 is disposed on the surface of the metal plate 2, the sealing material is heated. It can be fixed on the surface of the metal plate 2 by melting or softening.

  The material of the sealing material used for the annular sealing material portion 3 is preferably, for example, a low melting point metal material, a glass material or a resin material having a low softening point. A sealing material having a low melting point and softening point reduces the thermal load on the cap 1, the case, and the electronic components housed in the case when the cap 1 and the case are joined by melting or softening by heating, for example. be able to. In addition, such a sealing material is solidified after melting or hardened after softening, and is important for maintaining the state inside the package after hermetic sealing. It is preferable that the subsequent structure has a dense structure.

  Preferred metal materials having a low melting point include, for example, an Au—Sn alloy containing 15 to 80% by mass of Sn, an Sn—Ag alloy containing 50% by mass or more of Sn, an Sn—Cu alloy, an Sn—Zn alloy, and the like. , Sn—In alloy or Sn—Bi alloy whose Sn is less than 50% by mass. Since the Au—Su alloy has a relatively low melting point of about 250 ° C. to 400 ° C., the above-described heat load can be made relatively small, and further has excellent corrosion resistance. In addition, the above-described alloys other than the Au—Su alloy are also preferable because of their relatively low melting points. Note that the low melting point metal material includes other elements not contained in the above-described alloys, such as Ag, Cu, Zn, Al, In, Bi, Ti, Ag, Cu, Ge, Sb, Mg, Cr, Co, and the like. May be included as long as the effects of the present invention are not impaired.

Preferred glass material low softening point, for _example, a V-P-O based glass, such as _{V 2 O 5 -P 2 O 5} -TeO-Fe 2 O 3. Since the VPO glass has a relatively low softening point of about 300 ° C. to 450 ° C., the above-described heat load can be made relatively small, and further has excellent corrosion resistance. Each glass material described above other than the VPO glass is also preferable because the softening point is relatively low at about 300 ° C to 500 ° C.

  Preferred resin materials having a low softening point include, for example, epoxy resins, phenol resins, urea resins, unsaturated polyester resins, polyurethane resins, thermosetting polyimide resins, and the like. A general resin material has a softening point of about 50 ° C. to 300 ° C., which is lower than the low melting point metal material and the glass material having a low softening point, and is suitable for the reduction of the heat load described above. In addition, the epoxy resin is suitable because it has a heat resistance of about 250 ° C. to 300 ° C. and a relatively high heat resistance in the resin system, and has a thermal expansion coefficient comparable to that of ceramic.

  As the sealing material used for the annular sealing material portion 3, a paste-like material, a solid material such as a solder washer, or a film-like material formed by plating or vapor deposition can be used. The sealing material arrangement method when forming the annular sealing material part 3 on the surface of the metal plate 2 is, for example, a screen printing method using a mask, a coating method using a dispenser, or a transfer alignment using a mask. In addition to the method or the adsorption alignment method using an adsorption jig, a layer forming method such as plating or vapor deposition can be applied. In addition, such a sealing material has a thickness of the sealing material to be arranged in order to reliably form one or more discontinuous portions 4 in the process of forming the annular sealing material portion 3 on the surface of the metal plate 2. It is preferable to appropriately adjust the shape such as the width and the arrangement interval.

  In the present invention, at least one discontinuous portion 4 is provided on the surface of the metal plate 2 as a portion where the annular sealing material portion 3 is discontinuous. The discontinuous portion 4 communicates the inside and outside of the package in the process of manufacturing the package by joining the cap 1 and the case, and ultimately contributes to improving the hermetic sealing performance of the package and increasing the vacuum. This is an important configuration. The surface of the metal plate 2 provided with the discontinuous portion 4 has a region 8 (see FIG. 3) having a lower wettability with respect to the molten or softened sealing material than on the other surface of the metal plate 2. Preferably it is. Such a region 8 suppresses excessive wetting and spreading of the sealing material that has been melted or softened in the process of forming the annular sealing material portion 3 on the surface of the metal plate 2, and is due to the wetting and spreading of the sealing material that is disposed adjacently. It is possible to prevent the coalescence and to reliably form the annular sealing material portion 3 having one or more discontinuous portions 4. The region 8 can be formed by laser irradiation in an oxidizing atmosphere, application of a wetting and spreading preventing material, or the like.

  The hermetic sealing cap (cap 1) of the present invention described above, for example, along a long side facing the metal plate 2 as shown in FIG. 1 when a solid sealing material such as a solder washer is used. The discontinuous portions 4 are arranged so that a total of two discontinuous portions 4 are formed on the surface of the metal plate 2. Then, the cap 1 which has one or more discontinuous parts 4 in the cyclic | annular sealing material part 3 as shown in FIG. 1 is manufactured by making it solidify after melting this solid sealing material by heating. be able to.

  Further, for example, when using a paste-like sealing material such as Au—Sn alloy, V—P—O glass or epoxy resin, an annular sealing material as shown in FIG. 1 using a metal mask. The paste-like sealing material is printed or applied on the surface of the metal plate 2 where only the surface corresponding to the portion 3 is exposed. Thereafter, the paste-like sealing material is melted or softened by heating and then solidified or cured (temporarily cured in the case of a resin system), so that it is provided in one place on the annular sealing material portion 3 as shown in FIG. The cap 1 having the above discontinuous portion 4 can be manufactured.

  In the case of using a low-melting-point metal material-based sealing material such as an Au—Sn alloy, the adhesive layer 6 such as an Au layer is difficult to form a surface oxide film that deteriorates the adhesion of the sealing material. Application of the metal plate 2 is preferable, and heating in a vacuum of 250 ° C. to 400 ° C. or in an inert gas atmosphere is preferable. Moreover, when using the glass-type sealing material with a low softening point, such as VPO-type glass, the metal plate 2 which has contact | adherence layers 6, such as an oxide film containing Cr which improves the adhesiveness of a sealing material. Is preferable, and it is preferable to heat in a vacuum of 300 ° C. to 450 ° C., an inert gas, or an air atmosphere. Moreover, when using resin-type sealing materials, such as an epoxy resin, application of the metal plate 2 which has the surface (rough surface) with a large surface roughness which raises the adhesiveness of a sealing material is preferable, and it is rather than a softening point. It is preferable to heat in a low temperature vacuum, inert gas, or air atmosphere.

  In the present invention, the region 8 (see FIG. 3) on the surface of the metal plate 2 where the discontinuous portion 4 included in the annular sealing material portion 3 is formed is the sealing material constituting the annular sealing material portion 3. It is preferable that the surface property is an appropriate state in which the wettability when melted or softened is neither too good nor too bad. “Wettability is not too good” means that the discontinuous portions 4 can be held without contacting each other on the region 8 when both ends of the opposing sealing material portions 3 in the discontinuous portions 4 spread out. Intended. Further, if the wettability is not too bad, the cap 1 and the case are joined to form a discontinuous portion 10 (see FIG. 4) that becomes discontinuous in the region 8, and then the discontinuous portion 10 is buried and the discontinuous portion 10 is buried. When forming the two sealing material portions 12 (see FIG. 5), the sealing material for constituting the second sealing material portion 12 can be melted or softened on the region 8 and can be appropriately adhered. Intended. In addition, when the wettability of the said area | region 8 with respect to the fuse | melting sealing material is too good, the discontinuous part 4 may be formed smaller than a desired dimension, or it may block | close. Further, if the wettability of the region 8 is too bad, the adhesiveness cannot be obtained when the discontinuous portion 4 is finally buried, and the airtightness of the package may be impaired. That is, in the region 8 on the surface of the metal plate 2, the annular sealing member 3 having the discontinuous portion 4 is melted and solidified, so that the discontinuous portion 10 can be reliably formed when the cap 1 and the case are joined. It is preferable that the discontinuous portion 10 has a surface property that can be reliably embedded thereafter.

The treatment for bringing the surface property of the region 8 into an appropriate state is performed when YVO is applied to the surface of the metal plate 2 in an oxidizing atmosphere when a low melting point metal material type sealing material such as an Au—Sn alloy is used. It is preferable to form a surface oxide layer by irradiating a laser beam having ₄ as a medium. For example, when the metal plate 2 has an adhesion layer 6 such as an Au layer and an intermediate layer 7 such as a Ni layer, the adhesion layer 6 is removed by irradiation with the laser light in an oxidizing atmosphere, and the exposed intermediate layer 7 is formed. A surface oxide layer can be formed. At this time, the region 8 can have a desired surface property by appropriately adjusting the conditions such as the output, time, and range of the laser light irradiation and the oxidation concentration in the oxidizing atmosphere.

  In addition, when a glass-based sealing material having a low softening point such as VPO glass is used, an appropriate addition of, for example, siloxane as a main component on the surface corresponding to the region 8 of the metal plate 2. It is preferable to apply a glass adhesion preventing material containing an agent. Since the siloxane contained in the glass adhesion preventing material lowers the wettability of the region 8, the softening and wetting and spreading of the low-melting-point glass into the region 8 is suppressed, and an appropriate additive moderately reduces the action of the siloxane. In order to weaken, the wettability of the area | region 8 can be controlled appropriately. In addition, the glass adhesion preventing material is not limited to the above-described siloxane, and the main component may be one having the same characteristics as this.

  Moreover, when using resin-type sealing materials, such as an epoxy resin, it is preferable to apply | coat a resin adhesion prevention material on the surface corresponding to the area | region 8 of the metal plate 2. FIG. Such a resin adhesion preventing material is preferably, for example, a silicone-based or fluorine-based material, but a material having equivalent characteristics can also be used. Moreover, the wettability of the area | region 8 can be appropriately controlled by including an appropriate additive in the resin adhesion preventing material.

Next, the package of the present invention using the cap 1 described above and the manufacturing method thereof will be described with reference to FIGS.
The hermetically sealed package 13 shown in FIG. 5 includes a square cap 1 and a case 9 in which an electronic component (not shown) is accommodated by bonding using a sealing material. In the package 13 a before airtight sealing shown in FIG. 4, the rectangular annular first sealing portion 11 is formed by connecting the rectangular annular sealing material portion 3 on the surface of the metal plate 2 constituting the cap 1 to the bonding surface of the case 9. It can be formed by melting or softening the sealing material constituting the rectangular annular sealing material part 3 in a state of being overlaid, and then solidifying or curing (preliminarily curing in the case of a resin system) ( First sealing step). At this time, the discontinuous portion 4 included in the rectangular annular sealing material portion 3 constituting the cap 1 is held by the area 8 (see FIG. 3) in which wetting and spreading of the molten or softened sealing material is suppressed, It is formed as a discontinuous portion 10 that is not embedded by the sealing material. Since the discontinuous portion 10 communicates between the inside and the outside of the package 13a, even if gas is generated when the cap 1 and the case 9 forming such a structure are joined, the residue does not substantially remain inside.

  Further, the discontinuous portion 10 is buried when the package 13 shown in FIG. 5 is finally formed. Specifically, in the process of finally hermetically sealing the inside of the package 13a, the discontinuous part 10 included in the first sealing part 11 shown in FIG. 4 as described above uses a new sealing material. The second sealing part 12 shown in FIG. 5 is formed (second sealing step). Therefore, when the sealing material used for the second sealing portion 12 is melted or softened by heating, the sealing material constituting the first sealing portion 11 is preferably easily adapted to, for example, the first sealing portion 11. It is preferable that the material is the same as the constituent sealing material. Any sealing material that exhibits the same effect can be used. Moreover, although the paste-form sealing material containing a solvent can also be used for the form of the sealing material which comprises the 2nd sealing part 12, it is preferable that it is a solid form which does not contain a solvent. The solid sealing material hardly generates a gas due to the solvent when melted or softened by heating. Therefore, in addition to the gas being discharged by the discontinuous portion 10 communicating with the outside, the remaining of the gas inside the package 13a (finally inside the package 13) is further suppressed.

  Between the first sealing step and the second sealing step, that is, before the final hermetic sealing in the joining of the cap 1 and the case 9 (see FIG. 4), the inside and the outside of the package 13a are By using the discontinuous portion 10 that communicates, it is possible to perform a process such as a high vacuum at a desired level, an inert gas atmosphere such as argon gas, or an active gas atmosphere such as oxygen gas. Similarly, using the discontinuous portion 10, it is possible to carry out an appearance inspection of the inside of the package 13 a before airtight sealing after joining the cap 1 and the case 9, and to suppress the outflow of defective products to the subsequent process. it can.

  In addition, as described above, by performing the process of bringing the surface property of the region 8 on the surface of the metal plate 2 of the cap 1 into an appropriate state, the rectangular annular sealing material portion 3 is joined at the joint between the cap 1 and the case 9. The phenomenon that the discontinuous portion 4 is embedded when the material is melted or softened by heating is easily suppressed, and as a result, the discontinuous portion 10 can be easily formed in the package 13a. Further, even if the discontinuous portion 10 may be blocked due to the joining of the cap 1 and the case 9, it is necessary to close the discontinuous portion 10 as long as the region 8 has an appropriate surface property. The time can be long enough. Therefore, unlike the double-layer sealing material portion disclosed in Patent Document 1 in which the discontinuous portion easily closes in a short time, the inside of the gas package 13a generated by melting or softening of the sealing material (final) It is easy to suppress the residue in the inside of the package 13.

  As described above, the cap 1 of the present invention having the annular sealing material portion 3 formed with the discontinuous portion 4 on the surface of the metal plate 2 has a case 9 in which an electronic component is housed. The joining structure which has the 1st sealing part 11 joined cyclically | annularly including the discontinuous part 10 can be formed by joining. Using the joining structure having such a discontinuous portion 10, the inside of the package 13 is subjected to processing such as high vacuum, inert gas atmosphere, and active gas atmosphere, and the appearance inspection inside the package 13a shown in FIG. can do.

1. Cap, 2. 2. metal plate; 3. Sealing material part Discontinuity, 5. Base material, 6. 6. adhesion layer; Intermediate layer, 8. Region 9. Case, 10 Discontinuities, 11. First sealing portion, 12. Second sealing portion, 13. Package, 13a. package

Claims (5)

  An airtight sealing cap comprising an annular sealing material portion having one or more discontinuous portions on the surface of a metal plate.   The surface of the said metal plate in the said discontinuous part has an area | region where the wettability with respect to the sealing material produced | generated by the fusion | melting of the said sealing material part is lower than the other surface of the said metal plate. Cap for hermetic sealing.   Arranging an annular sealing material having one or more discontinuous portions on the surface of the metal plate, melting the sealing material by heating and then solidifying it, thereby providing one or more locations on the surface of the metal plate The manufacturing method of the cap for airtight sealing which forms the cyclic | annular sealing material part which has a discontinuous part. An electronic component storage package in which the hermetic sealing cap according to claim 1 and an electronic component storage member in which an electronic component is stored is joined.
The sealing structure of the hermetic sealing cap and the electronic component housing member includes a first sealing portion that is annularly joined while having the discontinuous portion, and a first sealing portion that is joined so as to embed the discontinuous portion. An electronic component storage package having two sealing portions. A manufacturing method of an electronic component storage package in which an airtight sealing cap and an electronic component storage member in which an electronic component is stored are joined,
Air-sealing for preparing a metal plate and a first sealing material and forming an annular first sealing material portion having one or more discontinuous portions on the surface of the metal plate using the first sealing material A stop cap forming step;
After disposing the hermetic sealing cap with respect to the electronic component storage member in which the electronic component is stored, the first sealing material portion is melted and then solidified to have one or more discontinuous portions. A first sealing step for forming an annular first sealing portion;
A second sealing step of sealing the hermetic sealing cap and the electronic component housing member by embedding the discontinuous portion using a second sealing material to form a second sealing portion. , Manufacturing method of electronic component storage package.

Images