JP2017055039A - Coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil component in which heat dissipation is enhanced with a simple structure, without impeding the thinning or downsizing.SOLUTION: A coil component includes a coil body 1 formed by superposing a plurality of substrates 5, having a conductive pattern 6 constituting a part of a coil formed therein, on an insulating substrate 5, and connecting the conductive pattern 6 in the lamination direction, and a core 2 surrounding the outer periphery of the coil body 1. Furthermore, a conductive plate 10 connected with the conductive pattern 6 and forming a by-path thereof, while having the height dimension in the lamination direction smaller than the thickness direction of the core 2 in the lamination direction, is provided on a substrate 3 located at the end in the lamination direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a thin and small coil component having a coil body obtained by superposing a plurality of substrates each having a conductive pattern formed on an insulating substrate.

  In recent years, with the miniaturization of various electric devices and electronic devices, there is an increasing demand for thinning and miniaturization of coil components such as transformers and choke coils incorporated in these devices.

  For this reason, a plurality of substrates on which a conductive pattern made of copper foil forming a part of a coil is formed are laminated on the surface of an insulating substrate having a central hole, and upper and lower conductive patterns are connected by through holes or the like to be vacant. Coil components that have been reduced in size by forming a core coil have been proposed.

  By the way, in the coil component having the above configuration, if the conductive pattern is narrowed in order to reduce the size, there is a problem that heat generation increases. Therefore, if the substrate is multi-layered in order to prevent the heat generation, there is a problem that it is contrary to the demand for thinning and is expensive.

  Therefore, for example, in Patent Document 1 below, a sheet coil provided with a conductive foil for forming a coil on an insulating sheet, and a flat heat sink made of an aluminum plate or a copper plate insulated from the sheet coil via an insulating sheet Has been proposed in which a planar type coil device is fitted into a core in a stacked state.

Japanese Utility Model Publication No. 4-20217

  However, in the conventional coil device, since the heat sink is fitted into the core in a state of being laminated with the sheet coil with the insulating sheet interposed therebetween, the thickness dimension in the stacking direction is the heat sink and There was a problem that the thickness of the insulating sheet was increased. In addition, there is a problem that it is necessary to take measures such as forming a cutout portion so that an eddy current that prevents the magnetic field generated in the sheet coil does not occur in the heat sink.

  This invention is made | formed in view of the said situation, and makes it a subject to provide the coil components which improved heat dissipation, without preventing thinning and size reduction with a simple structure.

  In order to solve the above-mentioned problem, the invention according to claim 1 is configured such that a plurality of substrates on which an electrically conductive pattern forming a part of a coil is formed are superimposed on an insulating substrate and the electrically conductive pattern is connected in the stacking direction. In the coil component comprising the coil body formed by this and the core surrounding the outer periphery of the coil body, the conductive pattern is connected to the conductive pattern on the substrate located at the end in the stacking direction. And a conductive plate having a height dimension in the stacking direction smaller than a thickness dimension of the core in the stacking direction is provided.

  According to a second aspect of the present invention, in the first aspect of the present invention, the conductive plate is disposed along the conductive pattern of the substrate located at an end in the stacking direction. It is a feature.

  Further, the invention according to claim 3 is the invention according to claim 1, wherein the conductive plate is located inside the laminating direction at both ends penetrating the one or more substrates in the laminating direction. It is characterized by being connected to a conductive pattern.

  Furthermore, the invention according to claim 4 is the height dimension in the stacking direction on the insulating substrate of the substrate located at the end in the stacking direction in the invention according to any one of claims 1 to 3. Is provided with a heat conduction plate that is smaller than the thickness dimension of the core in the stacking direction and has a heat dissipation function.

  According to the invention described in any one of claims 1 to 4, the current flowing through the coil body is reduced by causing the current flowing through the coil body to be bypassed by the conductive plate disposed on the substrate, thereby generating the coil body. Heat generation can be suppressed.

  Moreover, since the conductive plate provided on the substrate is formed such that the height dimension in the stacking direction is smaller than the thickness dimension of the core in the stacking direction, the structure is reduced in thickness and size by a simple structure. The heat dissipation can be improved without hindering.

  Here, as a configuration for bypassing the current flowing through the coil body by the conductive plate, as in the invention according to claim 2, the conductive plate is formed on the conductive pattern of the substrate located at the end in the stacking direction. In addition to the configuration in which the conductive plate is disposed along the both ends of the conductive plate disposed on the substrate, one or more substrates are penetrated in the laminating direction, as in the invention according to claim 3. The structure connected to the conductive pattern located in can be adopted.

  Furthermore, according to the invention described in claim 4, the height dimension in the stacking direction is smaller than the thickness dimension in the stacking direction of the core on the insulating substrate of the substrate positioned at the end in the stacking direction, and heat dissipation. Since the heat conductive plate having a function is provided, heat dissipation can be further improved by cooperation with the conductive plate without providing an insulating sheet or the like separately.

1 is a perspective view showing a first embodiment of the present invention. It is a disassembled perspective view which shows the laminated structure of the board | substrate of FIG. It is a front view which shows the 2nd Embodiment of this invention. FIG. 4 is a side view of a part of FIG. It is a perspective view which shows the 3rd Embodiment of this invention.

(First embodiment)
1 and 2 show a first embodiment in which a coil component according to the present invention is applied to a coil.
This coil is roughly constituted by a coil body 1 and a pair of E-type cores 2. The coil body 1 is formed by stacking and integrating a plurality of substrates 3 as shown in FIG. It is configured.

  The substrate 3 is formed by forming a conductive pattern 6 in which a copper foil is punched into a shape forming a part of a coil on a substantially rectangular insulating substrate 5 having a hole 4 formed in the center. is there. A plurality of through holes 7 are formed in the opposing side edges 5a of the insulating substrate 5 at equal intervals in the extending direction of the side edges 5a.

  The through hole 7 is formed in a semicircular shape so as to open to the side edge 5a, and a connection portion 8 connected to the end portion of the conductive pattern 6 is formed on the inner peripheral edge thereof. Further, the through holes 7 formed in the insulating substrates 5 of the plurality of substrates 3 are formed at positions that are continuous in the stacking direction when they are overlapped with each other.

  Then, a connection member (not shown) is inserted into the through hole 7 of the coil body 1 in which a plurality of substrates 3 are laminated and integrated, and connected to the connection portion 8 that is electrically connected to the end portion of the conductive pattern 6 by soldering. Thus, the conductive patterns 6 of the upper and lower substrates 3 are sequentially connected to form a coil shape.

  A pair of the E-type cores 2 is disposed on the outer periphery of the coil body 1. Here, the E-type core 2 is disposed so that the respective middle legs are inserted into the holes 4 of the coil body 1 and the outer legs 2 a surround the outer periphery of the coil body 1. In addition, the code | symbol 9 in a figure is a tape for integrating both E type | mold cores 2. FIG.

  Further, in this coil, a conductive plate 10 made of a conductive metal such as copper is provided on the upper surface of the substrate 2 located at the upper end portion in the drawing in the stacking direction of the coil body 1. The conductive plate 10 is formed in a shape along a part of the conductive pattern 6 (6a) formed on the substrate 2, and its side surface is connected to the corresponding part of the conductive pattern 6 (6a) over the entire length. Has been.

  In addition, the conductive plate 10 has a height dimension protruding from the conductive pattern 6 (the height dimension in the stacking direction) larger than the thickness dimension of the back portion 2b of the E-type core 2 (the thickness dimension in the stacking direction). Is also formed small.

(Second Embodiment)
FIGS. 3 and 4 show a second embodiment of the present invention. The same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will be simplified.
In this coil, a conductive plate 11 made of a conductive metal such as copper is provided on the upper surface of the substrate 2 located at the upper end portion in the figure in the stacking direction of the coil body 1.

  The conductive plate 11 has both end portions 11a passing through a plurality (six in the figure) of the substrates 3 in the stacking direction and connected to the conductive pattern 6b of the substrate 3 positioned inside the stacking direction. Here, the conductive plate 11 is connected so that the both end portions 11a bypass the conductive pattern 6b without a shortcut.

  Further, the conductive plate 11 also has a height dimension (height dimension in the stacking direction) protruding from the substrate 3 at the upper end portion in the stacking direction in the drawing, and a thickness dimension of the back portion 2b of the E-type core 2 (described above). (Thickness dimension in the stacking direction).

(Third embodiment)
FIG. 5 shows a third embodiment of the present invention.
This coil is characterized in that, in addition to the one shown in the first embodiment, a heat conduction plate 20 is provided on the substrate 3 at the upper end in the drawing in the stacking direction of the coil body 1.

  The heat conducting plate 20 is formed by bending a metal having excellent heat conductivity such as copper into a gate shape, and both end portions 20 a and 20 b are fixed on the insulating substrate 5 of the substrate 3. The heat conduction plate 20 also has a height dimension (the height dimension in the stacking direction) protruding from the substrate 3 smaller than the thickness dimension (the thickness dimension in the stacking direction) of the back portion 2b of the E-type core 2. It is formed to become.

  According to the coils having the above-described configuration shown in the first to third embodiments, the current flowing in the coil body 1 is caused by the conductive plates 10 and 11 disposed on the substrate 3 at the upper end portion in the drawing in the stacking direction. By bypassing, the current density flowing through the coil body 1 can be lowered, and heat generated in the coil body 1 can be suppressed.

  In addition, since the conductive plates 10 and 11 are formed so that the height dimension protruding from the substrate 3 is smaller than the thickness dimension of the back portion 2b of the E-type core 2, the thickness is reduced and the size is reduced by a simple structure. The heat dissipation can be improved without hindering.

  Furthermore, according to the coil shown in the third embodiment, the height dimension protruding from the substrate 3 on the insulating substrate 5 of the substrate 3 located at the upper end portion in the stacking direction is the back portion of the E-type core 2. Since the heat conduction plate 20 having a heat dissipation function smaller than the thickness dimension of 2b is provided, the heat dissipation performance can be further enhanced by cooperation with the conductive plate 10 without providing a separate insulating sheet or the like. Can be improved.

DESCRIPTION OF SYMBOLS 1 Coil body 2 E-type core 2a Outer leg 2b Back part 3 Board | substrate 5 Insulation board | substrate 6, 6a, 6b Conductive pattern 10, 11 Conductive plate 11a End part 20 Thermal conduction plate 20a, 20b End part

Claims (4)

A plurality of substrates on which a conductive pattern forming a part of a coil is formed on an insulating substrate, and a coil body formed by connecting the conductive patterns in the stacking direction and an outer periphery of the coil body are surrounded. In a coil component having a core to be
On the substrate located at the end in the stacking direction, connected to the conductive pattern to form a bypass of the conductive pattern, and the height dimension in the stacking direction is the thickness dimension of the core in the stacking direction. A coil component comprising a smaller conductive plate.   The coil component according to claim 1, wherein the conductive plate is disposed along the conductive pattern of the substrate located at an end portion in the stacking direction.   2. The coil according to claim 1, wherein both ends of the conductive plate pass through the one or more substrates in the stacking direction and are connected to a conductive pattern located inside the stacking direction. parts.   A heat conduction plate having a height dimension in the stacking direction smaller than a thickness dimension in the stacking direction of the core and having a heat dissipation function is provided on the insulating substrate of the substrate positioned at the end in the stacking direction. The coil component according to any one of claims 1 to 3, wherein the coil component is provided.

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