JP2017032655A - Exposure device, exposure method, and manufacturing method of article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scanning type exposure device that is advantageous for performing stitching exposure.SOLUTION: The exposure device includes: a blade 18 that forms an aperture for shaping light from a light source; a shield plate 18a which is provided to be movable along a scanning direction and defines width of the scanning direction of the light passed through the aperture; and a control part 12 that controls scanning exposure executed in order on a first shot region, a second shot region including a first overlapping connection region, and a third shot region including a second connection region overlapping with the second shot region provided on a substrate 10. The control part controls movement of the shield plate such that the moving directions of the shield plate vary between the scanning exposure of the first connection region and the scanning exposure of the second connection region in order to control the exposure amount of the second shot region while moving the shield plate.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

  In a lithography process for manufacturing a device such as a liquid crystal display element, an image of a mask (original) pattern is transferred onto a substrate coated with a resist (photosensitive agent) via a projection optical system. Repeat type exposure apparatuses are used. In recent years, step-and-scan type exposure apparatuses that perform scanning exposure that exposes a substrate while scanning the mask and the substrate relative to the projection optical system, so-called scanning exposure apparatuses, are also used. ing.

  In a scanning exposure apparatus, as the size of a liquid crystal panel or the like increases, it is required to form a pattern in a region larger than a region (shot region) where a mask pattern image is transferred in one scanning exposure. Yes. In view of this, there has been proposed a so-called joint exposure technique in which exposure is performed by joining shot areas on a substrate using a shielding plate (see Patent Document 1). Further, a technique for superimposing a part of the shot area (a joining area) not only in a direction orthogonal to the scanning direction but also in a direction along the scanning direction in joining exposure has been proposed (Patent Document). 2).

JP 2000-347020 A JP 2002-353108 A

  However, in the technique disclosed in Patent Document 2, a plurality of shielding plates are used to perform joint exposure in the scanning direction. However, with the recent increase in the size of masks, it is also necessary to increase the shielding plates. . Therefore, in the exposure apparatus, it is difficult to secure a space for arranging the shielding plate, and the cost is increased.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide an exposure apparatus that is advantageous for performing continuous exposure.

  In order to achieve the above object, an exposure apparatus according to one aspect of the present invention is a scanning exposure apparatus that performs scanning exposure for exposing a substrate while scanning the mask and the substrate in a scanning direction. A blade that forms an opening for shaping the light of the light, and one shielding plate that is provided so as to be movable along the scanning direction with respect to the blade and that defines the width of the light passing through the opening in the scanning direction And a first shot region, a second shot region including a first connecting region overlapping the first shot region, and a second connecting region overlapping the second shot region along the scanning direction on the substrate. A control unit that controls the scanning exposure performed in the order of the third shot region including the control unit, and the control unit performs the scanning exposure on the second shot region while moving the shielding plate. In this case, in order to control the exposure amount of the second shot area, the first shot area on the side of the first shot area of the second shot area and the second shot area in the second exposure area. The movement of the shielding plate is controlled so that the movement direction of the shielding plate is different between the scanning exposure of the second connecting region on the side of the three-shot region.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide an exposure apparatus that is advantageous for performing continuous exposure.

It is the schematic which shows the structure of the exposure apparatus as 1 side surface of this invention. It is a figure for demonstrating joint exposure. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. It is a figure which shows an example of the relationship between the position of the mask at the time of scanning exposure, a board | substrate, and a shielding board, and the exposure amount. 2 is a flowchart for explaining the operation of the exposure apparatus shown in FIG. It is a figure which shows an example of a movement of the board | substrate at the time of the scanning exposure of the exposure apparatus shown in FIG. It is a figure for demonstrating joining exposure in the case of joining two shot area | regions. It is a figure which shows the combination of the method shown in FIG. 3 thru | or FIG. 10 for using the light which passes the opening of a braid | blade uniformly.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 according to one aspect of the present invention. The exposure apparatus 100 is a lithography apparatus that forms a pattern on a substrate. In this embodiment, the exposure apparatus 100 employs a step-and-scan method, and scans the substrate while scanning the mask and the substrate in the scanning direction (Y-axis direction) using light from the light source (slit light). The present invention is embodied as a scanning exposure apparatus that performs scanning exposure.

  The exposure apparatus 100 includes an illumination optical system 1, an alignment scope 2, a projection optical system 4, a substrate stage 11, a control unit 12, and a mask stage 30. The mask 3 is movably held on the mask stage 30 and is disposed between the alignment scope 2 and the projection optical system 4, specifically on the object plane of the projection optical system 4. The substrate 10 is movably held on the substrate stage 11 and is disposed on the image plane of the projection optical system 4. The control unit 12 includes a CPU and a memory, and controls the entire exposure apparatus 100. The control unit 12 controls each part of the exposure apparatus 100 to control a process for transferring the pattern of the mask 3 to the substrate 10, that is, a process for scanning and exposing the substrate 10.

  The illumination optical system 1 includes, for example, a light source 13, a first fly-eye lens 14a, a first condenser lens 15a, a second fly-eye lens 14b, a plane mirror 16, a second condenser lens 15b, and a blade 18. One shielding plate 18a and the imaging optical system 19 are included.

  The light source 13 includes, for example, a high-pressure mercury lamp and an elliptical mirror. The light emitted from the light source 13 sequentially passes through the first fly-eye lens 14a, the first condenser lens 15a, and the second fly-eye lens 14b, and the optical path is bent by the plane mirror 16. Light from the plane mirror 16 enters the blade 18, the shielding plate 18a, and the imaging optical system 19 in this order via the second condenser lens 15b.

  The blade 18 forms an opening OP for shaping the light from the light source 13. The blade 18 is a slit defining member that regulates the width of the illumination area on the mask (exposure area on the substrate) in the scanning direction to be constant.

  The shielding plate 18 a is provided so as to be movable along the scanning direction with respect to the blade 18. The shielding plate 18a partially or completely shields (completely shields) the opening OP of the blade 18, thereby defining the width in the scanning direction of the light that has passed through the opening OP on the substrate. Under the control of the control unit 12, the shielding plate 18a is positioned at an arbitrary position in the scanning direction via a drive unit (not shown). Thus, the control unit 12 has a function of controlling the movement of the shielding plate 18a. Further, the shielding plate 18a is configured to be capable of minute rotation in the XY plane.

  In the present embodiment, the opening OP of the blade 18 is shielded using the edges on both sides of one shielding plate 18a. Therefore, the shielding plate 18a has a length longer than the width (slit width) of the opening OP of the blade 18 and is capable of moving by a long stroke to allow the opening OP to be fully shielded or fully opened. It is configured. For example, the shielding plate 18a is different from the first position in the scanning direction from the first position where the opening OP of the blade 18 is fully opened without shielding the opening OP, and is fully opened without shielding the opening OP. The second position has a movable stroke. The first position is, for example, a position on the left side of the opening OP shown in FIG. 1, and the second position is, for example, a position on the right side of the opening OP shown in FIG.

  The imaging optical system 19 illuminates the mask 3 disposed on the object plane of the projection optical system 4 with light defined by the blade 18 and the shielding plate 18a.

  The alignment scope 2 detects an alignment mark provided on the mask 3 and an alignment mark provided on the substrate 10 via the projection optical system 4. The alignment scope 2 may detect the alignment marks provided on the mask 3 and the substrate 10 at the same time, or may detect them individually.

  The projection optical system 4 projects an image of the pattern of the mask 3 illuminated by the illumination optical system 1 onto the substrate 10. The projection optical system 4 can be any optical system such as an equal magnification imaging optical system, an enlarged imaging optical system, and a reduced imaging optical system. In the present embodiment, the projection optical system 4 is configured as an equal magnification imaging optical system. ing. The projection optical system 4 includes, for example, a first parallel plate 5a, a second parallel plate 5b, a first plane mirror 6, a second plane mirror 7, a convex mirror 8, and a concave mirror 9.

  The light that has passed through the mask 3 includes the first parallel plate 5a, the first flat mirror 6, the first surface 9a of the concave mirror 9, the convex mirror 8, the second surface 9b of the concave mirror 9, the second flat mirror 7, and the second. The light enters the substrate 10 through the parallel plates 5b in order. Then, the pattern of the mask 3 is transferred to the substrate 10 by scanning the mask 3 and the substrate 10 in the scanning direction at a speed ratio according to the projection magnification of the projection optical system 4 under the control of the control unit 12. Can do.

  The area on the substrate to which the light defined by the blade 18 and the shielding plate 18a is irradiated, that is, the shape of the exposure area is the same as the shape of the illumination area on the mask. Therefore, it can be said that the blade 18 and the shielding plate 18a have a function of defining an exposure area (shape) on the substrate. In the exposure apparatus 100, the shape of the exposure region on the substrate, specifically, the boundary shape on the scanning direction side of the exposure region is assumed to be an arc shape, but is not limited thereto.

  The exposure apparatus 100 is required to form a pattern in a region larger than a region (shot region) where a pattern image of the mask 3 is transferred by one scanning exposure as the liquid crystal panel or the like becomes larger. Therefore, the exposure apparatus 100 uses the shielding plate 18a to perform a technique for performing exposure so as to join shot areas on the substrate, so-called joint exposure. In the present embodiment, a plurality of shot areas are arranged so that adjacent shot areas include a connecting area where the adjacent shot areas overlap each other in the scanning direction, and the connecting area is used when scanning exposure is performed on each of the adjacent shot areas. It is exposed (ie, it is exposed in duplicate). However, in the connection exposure, it is necessary to suppress variations in the exposure amount over the entire substrate 10 including a plurality of shot regions. Therefore, it is important to reduce the variation in the exposure amount of the joint area exposed in duplicate.

  For example, as shown in FIG. 2A, with respect to three shot regions arranged along the scanning direction on the substrate, that is, the first shot region 22, the second shot region 21, and the third shot region 20. Suppose a case of performing joint exposure. In this case, the second shot region 21 on the first shot region side connection region (first connection region) 21b and the first shot region 22 on the second shot region side connection region 22a overlap each other. The two-shot area 21 and the first shot area 22 are joined together. Therefore, as shown in FIG. 2B, it is important to reduce the variation in exposure amount in a region 23b where the connecting region 21b of the second shot region 21 and the connecting region 22a of the first shot region 22 overlap. . Therefore, as shown in FIG. 2C, the second shot area 21 is subjected to scanning exposure so that the exposure amount of the joint area 21b decreases linearly as it goes in the positive direction of the Y axis. Further, scanning exposure is performed on the first shot area 22 such that the exposure amount of the connection area 22a decreases linearly as it goes in the negative direction of the Y axis. FIG. 2C is a diagram showing the exposure amount distribution of each shot area on the substrate, in which the exposure amount is adopted on the vertical axis and the position in the Y-axis direction on the substrate is adopted on the horizontal axis.

  Similarly, the connecting region (second connecting region) 21a on the third shot region side of the second shot region 21 and the connecting region 20a on the second shot region side of the third shot region 20 overlap each other. The two-shot area 21 and the third shot area 20 are joined together. Therefore, as shown in FIG. 2B, it is important to reduce the variation in the exposure amount in the region 23a where the connecting region 21a of the second shot region 21 and the connecting region 20a of the third shot region 20 overlap. . Therefore, as shown in FIG. 2C, the second shot area 21 is subjected to scanning exposure so that the exposure amount of the connection area 21a decreases linearly as it goes in the negative direction of the Y axis. Further, scanning exposure is performed on the third shot region 20 so that the exposure amount of the joint region 20a decreases linearly as it goes in the positive direction of the Y axis.

  By performing scanning exposure on each of the first shot area 22, the second shot area 21, and the third shot area 20 as described above, variation in the exposure amount of the overlapping areas exposed in an overlapping manner is reduced. be able to. Specifically, variations in the exposure amount can be reduced in the region 23b where the connecting region 21b and the connecting region 22a overlap, and in the region 23a where the connecting region 21a and the connecting region 22a overlap.

  Further, assuming that the exposure amount of the regions excluding the regions 23a and 23b on the substrate shown in FIG. 2B is 100%, the exposure amounts of the regions 23a and 23b on the substrate can be close to 100%. In other words, as shown in FIG. 2D, the exposure amount variation can be suppressed in the entire region 23 including the first shot region 22, the second shot region 21, and the third shot region 20. FIG. 2D is a diagram showing the exposure amount distribution on the substrate, where the exposure amount is adopted on the vertical axis and the position in the Y-axis direction on the substrate is adopted on the horizontal axis.

  As described above, in order to suppress the variation in the exposure amount in the entire substrate 10 including the plurality of shot regions, it is necessary to linearly incline the exposure amount in the connection region between the shot regions.

  In the joint exposure for the first shot area 22, the second shot area 21, and the third shot area 20, when performing the scanning exposure for the second shot area 21, the joint areas 21a and 21b are exposed by the same scanning exposure. There must be. Therefore, before the scanning exposure of the second shot area 21 is started, the shielding plate 18a is positioned so that the shielding plate 18a completely shields the opening OP of the blade 18 so that the exposure amount becomes zero. Next, at the start of scanning exposure of the second shot region 21, the connecting region 21a or 21b is exposed while moving the shielding plate 18a in the first direction along the scanning direction, and the shielding plate 18a completely shields the opening OP. A state where the exposure is not performed, that is, a fully opened state where the exposure amount is maximized is set. Then, normal scanning exposure is performed on the second shot region 21 while maintaining the fully open state. Next, at the end of the scanning exposure of the second shot region 21, the shielding plate 18a is moved in the second direction opposite to the start of the scanning exposure (first direction) along the scanning direction (that is, from the fully opened state). While in the shielding state, the connecting region 21b or 21a is exposed. At the start and end of the scanning exposure of the second shot region 21, the movement of the shielding plate 18a is controlled so as to shield the opening OP of the blade 18 with the same edge of the shielding plate 18a.

  Thus, in the exposure apparatus 100, when scanning exposure is performed on the second shot area 21, the movement of the shielding plate 18a is controlled in order to control the exposure amount of the second shot area 21. In the present embodiment, at the time of scanning exposure of the end portion of the second shot region 21 on the first shot region 22 side, and at the time of scanning exposure of the end portion of the second shot region 21 on the third shot region 20 side, The moving direction of the shielding plate 18a is varied. For example, during the scanning exposure of the connecting region 21b of the second shot region 21 on the first shot region side, the shielding plate 18a is moved along the scanning direction so that the width of the light passing through the opening OP of the blade 18 increases in the scanning direction. To move in the first direction. Further, during the scanning exposure of the connecting area 21a of the second shot area 21 on the side of the third shot area, the shielding plate 18a is moved along the scanning direction so that the width in the scanning direction of the light passing through the opening OP of the blade 18 is reduced. To move in the second direction opposite to the first direction. At this time, the shielding plate is set so that the sum of the exposure amount of the connection region 21b of the second shot region 21 and the exposure amount of the connection region 22a of the first shot region 22 becomes equal to the exposure amount of the substrate 10 in the fully opened state. The movement of 18a is controlled. Similarly, the shielding plate is arranged such that the sum of the exposure amount of the connection region 21a of the second shot region 21 and the exposure amount of the connection region 20a of the third shot region 20 is equal to the exposure amount of the substrate 10 in the fully opened state. The movement of 18a is controlled.

  3 (a) to 3 (d), 4 (a) to 4 (d), 5 (a) to 5 (d) and 6 (a) to 6 (d). A method for linearly inclining the exposure amount in the connecting area between the shot areas on the substrate will be described in detail. 3 (a) to 3 (d), FIG. 4 (a) to FIG. 4 (d), FIG. 5 (a) to FIG. 5 (d), and FIG. 6 (a) to FIG. It is a figure which shows the relationship between the position of the mask 3, the board | substrate 10, and the shielding board 18a at the time of scanning exposure, and the exposure amount.

  Referring to FIGS. 3A to 3D, when the mask 3 and the substrate 10 are scanned in the positive direction of the Y axis, the shielding for linearly tilting the exposure amount E at the start of scanning exposure. The movement of the plate 18a will be described. As shown in FIG. 3A, the shielding plate 18a completely shields the opening OP of the blade 18, and the exposure amount is zero. By continuously moving the shielding plate 18a from the shielding state at a constant speed (that is, at a constant speed) in the negative direction of the Y axis, as shown in FIGS. 3B and 3C, The light amount (exposure amount) of light incident on the substrate 10 increases at a constant rate. Accordingly, the exposure amount E is linear in the state (shielding region W2) from the shield state to the state where the shield plate 18a does not completely shield the opening OP of the blade 18, that is, the fully open state where the exposure amount is maximized. Can be inclined. Further, as shown in FIG. 3D, when the fully opened state is reached, the exposure amount E becomes a constant value. Here, the slit width of the opening OP of the blade 18 is W0, the width in the scanning direction of the exposure region on the substrate in the fully opened state is W1, the width in the scanning direction of the joint region is W2, and the scanning speed of the mask 3 and the substrate 10 (exposure) Speed) is V1, and the moving speed of the shielding plate 18a is V2. In this case, the relationship shown by the following formula (1) is established.

  Referring to FIGS. 4A to 4D, when the mask 3 and the substrate 10 are scanned in the positive direction of the Y axis, the shielding for linearly tilting the exposure amount E at the end of the scanning exposure. The movement of the plate 18a will be described. As shown in FIG. 4A, the shielding plate 18a does not completely shield the opening OP of the blade 18, that is, the fully opened state in which the exposure amount is maximized. By continuously moving the shielding plate 18a from the fully open state at a constant speed (that is, constant speed) in the positive direction of the Y-axis, as shown in FIGS. 4B and 4C, The light amount (exposure amount) of light incident on the substrate 10 decreases at a constant rate. Therefore, the exposure amount E is linearly inclined during the period (the connecting region W2) from the fully open state until the shielding plate 18a completely shields the opening OP of the blade 18 and becomes the shielding state where the exposure amount becomes zero. Can do. In addition, as shown in FIG. 4D, in the shielding state, the exposure amount E becomes a constant value, specifically zero. Here, the slit width of the opening OP of the blade 18 is W0, the width in the scanning direction of the exposure region on the substrate in the fully opened state is W1, the width in the scanning direction of the joint region is W2, and the scanning speed of the mask 3 and the substrate 10 (exposure) Speed) is V1, and the moving speed of the shielding plate 18a is V2. In this case, the relationship shown by the following formula (2) is established. Therefore, it is necessary to make the width W2 of the connecting region in the scanning direction larger than the width W1 of the exposure region on the substrate in the fully opened state in the scanning direction.

  Here, a method of linearly inclining the exposure amount at the start of the scanning exposure shown in FIGS. 3A to 3D, and at the end of the scanning exposure shown in FIGS. 4A to 4D. A method of linearly tilting the exposure amount is combined, that is, the same scanning exposure is performed. This makes it possible to linearly incline the exposure amount at both ends of the second shot region 21 shown in FIG. 2A, specifically, the connecting region 21a and the connecting region 22a.

  For example, when performing scanning exposure on the second shot region 21, as described above, the shielding plate 18a is moved from the shielding state in which the opening OP of the blade 18 is completely shielded to the Y-axis. Move in the negative direction. Thereby, the exposure amount in the connection area | region 21b at the time of the start of scanning exposure of the 2nd shot area | region 21 can be linearly inclined using the positive edge of the Y-axis of the shielding board 18a. Next, the shielding plate 18a is moved in the positive direction of the Y axis. As a result, similarly to the start of the scanning exposure, the exposure amount in the joint area 21a at the end of the scanning exposure of the second shot area 21 is linearly used by using the positive side edge of the Y axis of the shielding plate 18a. Can be tilted.

  Further, when scanning exposure is performed on the second shot region 21, as shown in FIGS. 5A to 5D, the shielding plate 18a completely shields the opening OP of the blade 18. From the shielded state, the shield plate 18a may be moved in the positive direction of the Y axis. Thereby, the exposure amount in the joint area 21b at the start of the scanning exposure of the second shot area 21 can be linearly inclined using the negative edge of the Y axis of the shielding plate 18a. Next, as shown in FIGS. 6A to 6D, the shielding plate 18a is moved in the negative direction of the Y axis. As a result, similarly to the start of the scanning exposure, the exposure amount in the joint area 21a at the end of the scanning exposure of the second shot area 21 is linearly used by using the negative side edge of the Y axis of the shielding plate 18a. Can be tilted.

  Referring to FIGS. 5A to 5D, when the mask 3 and the substrate 10 are scanned in the positive direction of the Y axis, the shielding for linearly tilting the exposure amount E at the start of scanning exposure. The movement of the plate 18a will be described. As shown in FIG. 5A, the shielding plate 18a completely shields the opening OP of the blade 18, and the exposure amount is zero. By continuously moving the shielding plate 18a from the shielding state at a constant speed (that is, at a constant speed) in the positive direction of the Y axis, as shown in FIGS. 5B and 5C, The light amount (exposure amount) of light incident on the substrate 10 increases at a constant rate. Accordingly, the exposure amount E is linear in the state (shielding region W2) from the shield state to the state where the shield plate 18a does not completely shield the opening OP of the blade 18, that is, the fully open state where the exposure amount is maximized. Can be inclined. Further, as shown in FIG. 5D, when the fully opened state is reached, the exposure amount E becomes a constant value. Here, the slit width of the opening OP of the blade 18 is W0, the width in the scanning direction of the exposure region on the substrate in the fully opened state is W1, the width in the scanning direction of the joint region is W2, and the scanning speed of the mask 3 and the substrate 10 (exposure) Speed) is V1, and the moving speed of the shielding plate 18a is V2. In this case, the relationship shown by the following formula (3) is established. Therefore, it is necessary to make the width W2 of the connecting region in the scanning direction larger than the width W1 of the exposure region on the substrate in the fully opened state in the scanning direction.

  Referring to FIGS. 6A to 6D, when the mask 3 and the substrate 10 are scanned in the positive direction of the Y axis, the shielding for linearly tilting the exposure amount E at the end of the scanning exposure. The movement of the plate 18a will be described. As shown in FIG. 6A, the shielding plate 18a does not completely shield the opening OP of the blade 18, that is, the fully open state where the exposure amount is maximized. As shown in FIGS. 6B and 6C, the shielding plate 18a is continuously moved in the negative direction of the Y axis at a constant speed (ie, constant speed) from the fully opened state. The light amount (exposure amount) of light incident on the substrate 10 decreases at a constant rate. Therefore, the exposure amount E is linearly inclined during the period (the connecting region W2) from the fully open state until the shielding plate 18a completely shields the opening OP of the blade 18 and becomes the shielding state where the exposure amount becomes zero. Can do. Further, as shown in FIG. 6D, in the shielding state, the exposure amount E becomes a constant value, specifically zero. Here, the slit width of the opening OP of the blade 18 is W0, the width in the scanning direction of the exposure region on the substrate in the fully opened state is W1, the width in the scanning direction of the joint region is W2, and the scanning speed of the mask 3 and the substrate 10 (exposure) Speed) is V1, and the moving speed of the shielding plate 18a is V2. In this case, the relationship shown by the following formula (4) is established.

  Thus, at the start of scanning exposure, the shielding plate 18a is moved so as to be in the fully open state from the shielding state, and at the end of scanning exposure, the shielding plate 18a is moved so as to be in the shielding state from the fully open state. The moving direction of the shielding plate 18a may be either the minus direction or the plus direction of the Y axis. This makes it possible to linearly incline the exposure amount in the connecting area between the shot areas on the substrate.

  Further, the scanning direction of the mask 3 and the substrate 10 is not limited to the positive direction of the Y axis, but is also illustrated in FIGS. 7A to 7D, FIGS. 8A to 8D, and FIG. 9A. As shown in FIG. 9D and FIG. 10A to FIG. 10D, it may be the negative direction of the Y axis. Even when the scanning direction of the mask 3 or the substrate 10 is the negative direction of the Y-axis, the exposure amount in the connecting region of the shot region on the substrate is linearly controlled by controlling the movement of the shielding plate 18a according to the principle described above. Can be inclined. 7 (a) to 7 (d), FIG. 8 (a) to FIG. 8 (d), FIG. 9 (a) to FIG. 9 (d), and FIG. 10 (a) to FIG. It is a figure which shows the relationship between the position of the mask 3, the board | substrate 10, and the shielding board 18a at the time of scanning exposure, and the exposure amount.

  Also, when the opening OP of the blade 18 is shielded by one shielding plate 18a and the exposure amount in the joint region at both ends of the shot region is linearly inclined, as described above, the moving speed of the shielding plate 18a. Need to control. Specifically, based on at least one of the scanning direction and the scanning speed of the mask 3 and the substrate 10, the moving speed of the shielding plate 18a at the start of scanning exposure and the movement of the shielding plate 18a at the end of scanning exposure. The speed is made different (see formulas (1) to (4)).

  Hereinafter, the operation of the exposure apparatus 100, that is, the process of scanning and exposing the substrate 10 will be described with reference to FIG. As described above, this process is performed by the control unit 12 controlling the respective units of the exposure apparatus 100 in an integrated manner. Here, as shown in FIG. 2A and FIG. 2B, the case where the entire substrate 10 is exposed by connecting the first shot region 22, the second shot region 21, and the third shot region 20 will be described. To do.

  First, scanning exposure is performed on the first shot region 22 on the substrate. In the first shot area 22, the connecting area 22a is required on the second shot area side, so the four methods shown in FIGS. 4, 6, 7, and 9 are candidates.

  Next, scanning exposure is performed on the second shot region 21 on the substrate. In the second shot region 21, connecting regions 21b and 21a are required on the first shot region side and the third shot region side, respectively. Therefore, the combination of the method shown in FIG. 3 and the method shown in FIG. 4, the combination of the method shown in FIG. 5 and the method shown in FIG. 6, the combination of the method shown in FIG. 7 and the method shown in FIG. Four combinations of the method shown in FIG. 9 and the method shown in FIG. 10 are candidates.

  Next, scanning exposure is performed on the third shot region 20 on the substrate. In the third shot area 20, since the connecting area 20a is required on the second shot area side, the four methods shown in FIGS. 3, 5, 8, and 10 are candidates.

  There are several criteria for determining which method to select (determine) from such candidates. For example, there is a case in which a method that minimizes the time (processing time) required for the process of scanning and exposing the substrate 10 may be selected. In the processing time, it is necessary to consider the moving distance of the substrate 10 and the acceleration or deceleration time. Specifically, as shown in FIG. 12, based on the moving distance of the substrate 10 (total of moving distances L1 to L5) when performing scanning exposure on all shot areas on the substrate, FIG. Any of the methods shown in FIG. 10, that is, the moving direction of the shielding plate 18a may be determined. Here, the moving distance L1 is a moving distance of the substrate 10 necessary for scanning and exposing the first shot region 22. The moving distance L2 is a moving distance of the substrate 10 necessary for scanning exposure of the region 23b where the connecting region 21b of the second shot region 21 and the connecting region 22a of the first shot region 22 overlap. The moving distance L3 is a moving distance of the substrate 10 that is necessary for scanning exposure of the second shot region 21. The moving distance L4 is a moving distance of the substrate 10 necessary for scanning and exposing a region 23a where the connecting region 21a of the second shot region 21 and the connecting region 20a of the third shot region 20 overlap. The moving distance L5 is a moving distance of the substrate 10 necessary for scanning and exposing the third shot region 20.

  In S11, the control unit 12 positions the shielding plate 18a so that the shielding plate 18a does not completely shield the opening OP, that is, a fully opened state in which the exposure amount is maximized. In S <b> 12, the control unit 12 starts scanning exposure of the first shot region 22. In S13, the control unit 12 moves the shielding plate 18a so that the exposure amount in the connecting region 22a is linearly inclined according to the width of the connecting region 22a on the second shot region side of the first shot region 22. Move continuously. Here, since the shielding plate 18a is moved from the fully opened state so that the shielding plate 18a completely shields the opening OP of the blade 18 and the exposure amount becomes zero, the method shown in FIG. 4 or FIG. The method shown in Fig. 2 can be adopted. In this way, the scanning exposure of the first shot area 22 is finished.

  In S21, the control part 12 positions the shielding board 18a so that it may be in a shielding state. In S <b> 22, the control unit 12 starts scanning exposure of the second shot area 21. In S23, the control unit 12 moves the shielding plate 18a so that the exposure amount in the connection region 21b is linearly inclined according to the width of the connection region 21b of the second shot region 21 on the first shot region side. Move continuously. Here, the shielding plate 18a is moved so as to be in the fully open state from the shielding state. Then, after the scanning exposure of the connection area 21b is completed, the fully opened state is maintained for a period during which the area other than the connection areas 21a and 21b of the second shot area 21 is subjected to the scanning exposure. In S24, the control unit 12 moves the shielding plate 18a so that the exposure amount in the connecting region 21b is linearly inclined according to the width of the connecting region 21a on the third shot region side of the second shot region 21. Move continuously. Here, the shielding plate 18a is moved so as to be in the shielding state from the fully open state. In the scanning exposure of the second shot region 21, in order to move the shielding plate 18a from the shielding state through the fully opened state to the shielding state again, a combination of the method shown in FIG. 3 and the method shown in FIG. A combination of the method shown in FIG. 5 and the method shown in FIG. 6 can be adopted. In this way, the scanning exposure of the second shot area 21 is completed.

  In S31, the control part 12 positions the shielding board 18a so that it may be in a shielding state. In S <b> 32, the control unit 12 starts scanning exposure of the third shot region 20. In S33, the control unit 12 moves the shielding plate 18a so that the exposure amount in the connection region 20a is linearly inclined according to the width of the connection region 20a on the second shot region side of the third shot region 20. Move continuously. Here, the method shown in FIG. 3 or the method shown in FIG. 5 can be employed to move the shielding plate 18a so as to be in the fully opened state from the shielded state. In this way, the scanning exposure of the third shot area 20 is completed.

  As described above, the exposure apparatus 100 has one shielding plate 18a that can shield the opening OP of the blade 18 in the scanning direction, and is a connecting region (a region that is exposed in an overlapping manner) of each shot region on the substrate. The variation in the exposure amount can be reduced. Therefore, the exposure apparatus 100 can suppress variations in the exposure amount over the entire substrate 10 including a plurality of shot regions in the joint exposure.

  In this embodiment, the shielding plate 18a is disposed between the blade 18 and the imaging optical system 19, but the present invention is not limited to this. For example, the shielding plate 18 a may be disposed in the vicinity of the pattern surface of the mask 3 or on a surface substantially conjugate with the pattern surface of the mask 3.

  Further, in the exposure apparatus 100, the resolution and overlay accuracy may be taken into account instead of considering the processing time required for the process of scanning and exposing the substrate 10. In such a case, it is necessary to ensure exposure performance by uniformly using light passing through the opening OP of the blade 18.

  For example, consider a case where two shot areas are connected. In the method shown in FIGS. 3A to 3D, since light that passes through the positive side (right side) of the Y axis of the opening OP of the blade 18 starts to enter the substrate 10, it is greatly affected by such light. It will be. On the other hand, in the method shown in FIGS. 6A to 6D, the light passing through the negative side (left side) of the Y axis of the opening OP of the blade 18 is incident on the substrate 10 to the end. Will receive a lot. By combining these two methods, the light passing through the opening OP of the blade 18 can be used uniformly.

  As shown in FIG. 13, the exposure amount in the joint area of the first shot area on the second shot area side (minus direction of the Y axis) and the first shot area side of the second shot area (plus the Y axis plus). Let us consider a case where the exposure amount in the connecting region in the direction is linearly inclined. In this case, in order to use the light passing through the opening OP of the blade 18 uniformly, the combination shown in FIG. 14 may be selected in the method shown in FIGS. FIG. 14 is a diagram showing a combination of the methods shown in FIGS. 3 to 10 in consideration of uniformly using light passing through the opening OP of the blade 18. In FIG. 14, a combination that can uniformly use light passing through the opening OP of the blade 18 is represented by a circle. For example, the light passing through the opening OP of the blade 18 can be uniformly used by combining the method shown in FIG. 7 and the method shown in FIG.

  In this way, the shield 18 is shielded so that the opening OP of the blade 18 is shielded by the different edges of the shield plate 18a between the scanning exposure of the joining area of the first shot area and the scanning exposure of the joining area of the second shot area. The movement of the plate 18a is controlled. Thereby, it is possible to uniformly use the light passing through the opening OP of the blade 18.

In addition to the processing time required for the scanning exposure of the substrate 10, it is also possible to consider the uniform use of light that passes through the opening OP of the blade 18.
For example, when scanning exposure is performed on the first shot region 22 shown in FIGS. 2A and 2B by the method shown in FIG. 4, referring to FIG. Requires scanning exposure by the method shown in FIG. 5 or FIG. However, considering the processing time, the second shot region 21 may be scanned and exposed by the method shown in FIG. Further, referring to FIG. 14, the third shot region 20 needs to be subjected to scanning exposure by the method shown in FIG. 3 or FIG. However, considering the processing time, the third shot region 20 may be scanned and exposed by the method shown in FIG. Similarly, when the scanning exposure is performed on the first shot region 22 by the method shown in FIG. 6, the method for performing the scanning exposure on each of the second shot region 21 and the third shot region 20 is similarly used. Can be determined.

  The article manufacturing method in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.), for example. Such a manufacturing method includes a step of exposing a substrate coated with a photosensitive agent using the exposure apparatus 100 and a step of developing the exposed substrate. Such a manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. For example, the present invention can be applied to an EUV exposure apparatus that exposes a substrate using EUV light (extreme ultraviolet light) as exposure light.

100: Exposure apparatus 3: Mask 10: Substrate 12: Controller 18: Blade 18a: Shielding plate

Claims (14)

A scanning exposure apparatus that performs scanning exposure for exposing the substrate while scanning the mask and the substrate in a scanning direction,
A blade that forms an opening for shaping light from the light source;
One shielding plate that is movably provided along the scanning direction with respect to the blade, and that defines a width in the scanning direction of light that has passed through the opening;
A first shot region, a second shot region including a first connecting region overlapping the first shot region, and a second connecting region including a second connecting region overlapping the second shot region along the scanning direction on the substrate. A control unit for controlling the scanning exposure performed in the order of three shot areas;
Have
The controller is configured to control the exposure amount of the second shot region when performing the scanning exposure on the second shot region while moving the shielding plate. The moving direction of the shielding plate is different between the scanning exposure of the first connecting area on the one shot area side and the scanning exposure of the second connecting area on the third shot area side of the second shot area. And an exposure apparatus that controls the movement of the shielding plate.   The shielding plate has a stroke that is movable in the scanning direction from a first position that does not shield the opening to a second position that does not shield the opening and is different from the first position across the opening. The exposure apparatus according to claim 1, characterized in that:   When the scanning exposure is performed on the second shot area, the control unit moves the shielding plate so that the width increases during the scanning exposure of the first connection area on the first shot area side. The shield plate is moved in the first direction along the scanning direction, and the shielding plate is moved along the scanning direction so as to reduce the width during the scanning exposure of the second connecting region on the third shot region side. The exposure apparatus according to claim 1, wherein the movement of the shielding plate is controlled so as to move in a second direction opposite to the one direction. The first connecting area is also exposed when performing the scanning exposure on the first shot area,
The exposure apparatus according to claim 3, wherein the second connection area is exposed also when the scanning exposure is performed on the third shot area. The controller is
Prior to the start of scanning exposure of the first connection area, the shielding plate is positioned so that the shielding plate shields the opening and the exposure amount of the substrate becomes zero,
The shield plate is continuously moved from the shield state to the fully open state where the exposure amount of the substrate is maximized from the start to the end of the scanning exposure of the first joint region. The exposure apparatus according to claim 3 or 4. The controller is
After the end of the scanning exposure of the first connecting region, the fully open state is maintained until scanning exposure of the second connecting region is started,
The said shielding board is continuously moved so that it may become the said shielding state from the said full open state by the time from the scanning exposure of the said 2nd connection area | region being started to ending. Exposure device. The controller is
In the period of performing the scanning exposure of the first connecting region, the shielding plate is moved at a constant speed,
7. The exposure apparatus according to claim 3, wherein the shielding plate is moved at a constant speed during a period in which the scanning exposure of the second connection area is performed.   The controller controls the moving speed of the shielding plate during the period of performing the scanning exposure of the first connecting area and the second connecting area based on at least one of the scanning direction and the scanning speed of the mask and the substrate. The exposure apparatus according to claim 7, wherein the moving speed of the shielding plate in a period during which scanning exposure is performed is made different.   The control unit controls movement of the shielding plate so as to shield the opening with the same edge of the shielding plate when performing the scanning exposure on the second shot region. The exposure apparatus according to any one of claims 1 to 8.   The control unit determines a moving direction of the shielding plate based on a moving distance of the substrate when the scanning exposure is performed on all shot regions on the substrate. The exposure apparatus according to any one of 9.   The control unit includes a sum of an exposure amount of the first connection region and an exposure amount of the first shot region on a side of the second shot region, and an exposure amount of the second connection region and the second exposure region. The movement of the shielding plate is controlled so that the sum of the exposure amount of the connection region on the side of the second shot region of the three-shot region becomes equal to the exposure amount of the substrate in the fully opened state. The exposure apparatus described. The controller is
The shielding is performed so that the opening is shielded by different edges of the shielding plate during the scanning exposure of the first joining region and during the scanning exposure of the joining region of the first shot region on the second shot region side. Control the movement of the board,
The shielding is performed so that the opening is shielded by different edges of the shielding plate during the scanning exposure of the second joining region and during the scanning exposure of the joining region of the third shot region on the second shot region side. 4. The exposure apparatus according to claim 3, wherein the movement of the plate is controlled. An exposure method for performing scanning exposure for exposing the substrate while scanning a mask and a substrate in a scanning direction,
A single shielding plate is provided that is movable along the scanning direction with respect to a blade that forms an opening for shaping light from the light source, and that defines the width of the light passing through the opening in the scanning direction. A first shot region, a second shot region including a first connecting region overlapping the first shot region, and a second connecting region overlapping the second shot region along the scanning direction on the substrate. A step of controlling the scanning exposure performed in the order of the third shot region including,
In the step, when the scanning exposure is performed on the second shot region while moving the shielding plate, the first shot of the second shot region is controlled in order to control an exposure amount of the second shot region. The moving direction of the shielding plate is different between the scanning exposure of the first joining area on the shot area side and the scanning exposure of the second joining area on the second shot area side of the third shot area. An exposure method comprising controlling movement of the shielding plate. A step of exposing the substrate using the exposure apparatus according to any one of claims 1 to 12,
Developing the exposed substrate;
A method for producing an article comprising:

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