CN117170190A - Exposure apparatus, method for producing article, and exposure method - Google Patents

Exposure apparatus, method for producing article, and exposure method Download PDF

Info

Publication number
CN117170190A
CN117170190A CN202310620836.0A CN202310620836A CN117170190A CN 117170190 A CN117170190 A CN 117170190A CN 202310620836 A CN202310620836 A CN 202310620836A CN 117170190 A CN117170190 A CN 117170190A
Authority
CN
China
Prior art keywords
exposure
scanning direction
region
substrate
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310620836.0A
Other languages
Chinese (zh)
Inventor
田實慎也
铃木彻
滨崎恭考
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN117170190A publication Critical patent/CN117170190A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides an exposure apparatus, a method for manufacturing an article, and an exposure method. To provide an exposure apparatus capable of simply reducing unevenness in the cumulative exposure amount of a bonding region. The exposure device of the invention is characterized by comprising: an illumination optical system including a light shielding portion movable in a non-scanning direction, a plurality of shape adjusting portions having an opening through which exposure light from a light source passes and a scanning direction width capable of adjusting a predetermined position of the opening in the non-scanning direction, respectively, for guiding the exposure light to the master; the control unit controls the relative positions of the master stage and the opening in the non-scanning direction so that the arrangement of the shape adjustment unit included in the 1 st joint region of the 1 st exposure region in the non-scanning direction when the 1 st exposure region is exposed and the arrangement of the shape adjustment unit included in the 2 nd joint region of the 2 nd exposure region in the non-scanning direction when the 2 nd exposure region is exposed are different from each other.

Description

Exposure apparatus, method for producing article, and exposure method
Technical Field
The present invention relates to an exposure apparatus and a method for manufacturing an article.
Background
Conventionally, in an exposure apparatus, in order to transfer a pattern formed on a master onto a substrate with high accuracy, it has been required to uniformize an illuminance distribution formed on the substrate by exposure light.
Patent document 1 discloses an exposure apparatus in which an opening through which exposure light from a light source passes and a plurality of adjustment axes each of which is movable in a non-scanning direction and is capable of adjusting the shape of a predetermined portion of the opening are provided in an illumination optical system for guiding the exposure light to an original plate, thereby making illuminance distribution uniform.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2018-66956
Disclosure of Invention
On the other hand, in a scanning type exposure apparatus, it is sometimes required to transfer a pattern formed on a master to an area larger than an exposure area to be exposed by one-time scanning exposure.
Therefore, conventionally, as a method of transferring such a large pattern onto a substrate, so-called bonding (scanning) exposure has been performed in which a plurality of exposure regions are partially repeated in a non-scanning direction and scanning exposure is performed at the same time.
In addition, in performing such bonding exposure, it is important to make the cumulative exposure amount uniform in the bonding region overlapping and the non-bonding region not overlapping among the adjacent exposure regions.
Therefore, there has been proposed a method of uniformly adjusting the cumulative exposure in the joint region and the non-joint region by arranging an exposure adjustment plate capable of adjusting the exposure in the joint region.
In this case, when there is a manufacturing error in optical components such as lenses and mirrors in the illumination optical system, for example, the same illuminance uneven distribution is generated in the scanning direction, and a distribution of the secondary component is generated in the integrated exposure amount in the joint region, and the integrated exposure amount may become uneven.
In this case, as disclosed in patent document 1, by arranging a plurality of adjustment shafts at desired positions in the non-scanning direction to adjust the shape of the opening through which the exposed light passes, it is possible to reduce the unevenness in the cumulative exposure amount.
However, in the exposure apparatus disclosed in patent document 1, the shape of the opening varies according to the arrangement relationship between the respective adjustment shafts in addition to the respective driving amounts.
Therefore, in order to adjust the opening to a desired shape, it is necessary to examine the change in the shape of the opening while changing the driving amounts of the respective adjustment shafts and the arrangement relations between the respective adjustment shafts in advance, and a considerable effort is required.
Accordingly, an object of the present invention is to provide an exposure apparatus capable of easily reducing unevenness in the cumulative exposure amount of a bonding region.
The present invention provides an exposure apparatus for exposing a substrate so as to transfer a pattern drawn on an original plate to the substrate while scanning the original plate and the substrate in a scanning direction, the exposure apparatus comprising: a master stage movable in a scanning direction and a non-scanning direction perpendicular to the scanning direction within a substrate surface of the substrate while holding the master; an illumination optical system including a light shielding portion movable in a non-scanning direction, the light shielding portion having an opening through which exposure light from a light source passes, and a plurality of shape adjustment portions each of which is capable of adjusting a width of the opening in a scanning direction at a predetermined position in the non-scanning direction, the illumination optical system directing the exposure light to the master; and a control unit that controls the master stage and the illumination optical system, wherein the 1 st exposure region on the substrate surface includes a 1 st non-bonding region and a 1 st bonding region arranged in the non-scanning direction, and the 2 nd exposure region on the substrate surface includes a 2 nd bonding region and a 2 nd non-bonding region that overlap with the 1 st bonding region arranged in the non-scanning direction, and the control unit controls the relative positions of the master stage and the opening in the non-scanning direction so that the 1 st arrangement of the shape adjustment unit included in the 1 st bonding region in the non-scanning direction when the 1 st exposure region is exposed and the 2 nd arrangement of the shape adjustment unit included in the 2 nd bonding region in the non-scanning direction when the 2 nd exposure region is exposed are projected along the optical path of the exposed light are different from each other.
According to the present invention, it is possible to provide an exposure apparatus capable of easily reducing unevenness in the cumulative exposure amount of a bonding region.
Drawings
Fig. 1 is a schematic cross-sectional view of an exposure apparatus according to a first embodiment.
Fig. 2 is a plan view of a substrate in the case of performing the 1 st exposure and the 2 nd exposure in the exposure apparatus according to the first embodiment.
Fig. 3 is a diagram showing the non-scanning direction position dependence of the integrated exposure amount when the 1 st exposure and the 2 nd exposure are performed.
Fig. 4 is a plan view showing the arrangement relation of the respective constituent elements when the 1 st exposure and the 2 nd exposure are performed in the exposure apparatus according to the first embodiment and the conventional exposure apparatus, and a diagram showing the non-scanning direction position dependence of the integrated exposure amounts when the 1 st exposure and the 2 nd exposure are performed in the exposure apparatus according to the first embodiment.
Fig. 5 is a plan view showing the arrangement relationship of the aperture of the light shielding plate and the exposure amount adjustment plate before and after the light shielding plate is displaced in the non-scanning direction in the exposure apparatus according to the first embodiment.
Fig. 6 is a flowchart showing a process when exposing the 1 st exposure field and the 2 nd exposure field in the exposure apparatus according to the first embodiment.
Fig. 7 is a plan view showing the arrangement relation of the respective components when the 1 st exposure and the 2 nd exposure are performed in the exposure apparatus according to the second embodiment and the conventional exposure apparatus, respectively.
Fig. 8 is a flowchart showing a process when exposing the 1 st exposure area and the 2 nd exposure area in the exposure apparatus according to the second embodiment.
(symbol description)
1: an illumination optical system; 3: a master; 5: a light source; 9: a light shielding plate (light shielding portion); 9p: an opening; 16: a substrate; 20: a control unit; 22a: 1 st exposure area; 22b: a 2 nd exposure region; 24: bonding regions (1 st bonding region, 2 nd bonding region); 27: a master mounting table; 100: an exposure device; l1, L2, L3, L4, L5, R1, R2, R3, R4, R5, X0: an adjustment shaft (shape adjustment section).
Detailed Description
The exposure apparatus according to the present embodiment will be described in detail below with reference to the attached drawings. In the drawings shown below, the present embodiment is drawn to a scale different from the actual scale so that the present embodiment can be easily understood.
First embodiment
In manufacturing a liquid crystal panel, an organic EL (electroluminescence) display, a semiconductor device, or the like, an exposure device is used that transfers a pattern of an original plate by exposing a substrate coated with a photosensitive agent using light that has passed through the exposure of the original plate.
In addition, as one of such exposure apparatuses, a scanning type exposure apparatus is known in which exposure is performed by scanning while synchronizing a substrate and an original plate (hereinafter referred to as "scanning exposure").
In recent years, with the increase in panel size of liquid crystal panels and organic EL displays, there is a demand for transferring a pattern formed on a master to a region on a substrate larger than an exposure region that can be exposed by one-time scanning exposure.
Therefore, conventionally, as a method of transferring such a large pattern onto a substrate, a so-called joint exposure has been proposed in which a plurality of exposure regions are partially repeated in a non-scanning direction orthogonal to a scanning direction in a plane parallel to a substrate surface, and scanning exposure is performed at the same time.
In performing such bonding exposure, it is important to make uniform the cumulative exposure amount in the bonding region repeated in the adjacent exposure region.
Further, a method has been proposed in which an exposure amount adjustment plate capable of adjusting the exposure amount in an exposure region is disposed between a projection optical system and a substrate, and the position of the exposure amount adjustment plate is adjusted so that the cumulative exposure amount in a joint region becomes uniform.
On the other hand, it is known that the same illuminance unevenness distribution is generated in the scanning direction due to manufacturing errors of optical components such as lenses and mirrors in the illumination optical system, and a distribution of the secondary component is generated in the cumulative exposure amount of the junction region.
Accordingly, a method of reducing the distribution of such a secondary component generated in the cumulative exposure amount in the junction region by providing a light shielding plate capable of deforming the shape of an opening through which the exposure light passes using a plurality of adjustment axes in the illumination optical system has been proposed.
However, since the regions corresponding to the joint regions are arranged laterally symmetrically in the adjacent exposure regions, it is difficult to reduce the distribution of the secondary components generated in the cumulative exposure amount in the joint regions when a plurality of adjustment axes for adjusting the shape of the openings are arranged laterally symmetrically.
In this case, although the distribution of the secondary components can be further reduced by increasing the number of adjustment shafts adjusting the shape of the opening, the device is complicated and the cost is increased due to the increase in the number of adjustment shafts.
In addition, although the distribution of the secondary components can be further reduced by providing the driving portion that drives each of the plurality of adjustment shafts in the left-right direction, even in this case, the device is complicated and the cost is increased by providing the driving portion.
When each of the plurality of adjustment shafts can be driven in the left-right direction, the shape of the opening changes according to the arrangement relationship between the respective adjustment shafts in addition to the driving amounts of the respective adjustment shafts.
Therefore, in order to adjust the opening to a desired shape, it is necessary to examine the change in the shape of the opening while changing the driving amounts of the respective adjustment shafts and the arrangement relationships between the respective adjustment shafts in advance, and considerable labor is required.
Accordingly, an object of the present invention is to provide an exposure apparatus capable of easily reducing unevenness in the cumulative exposure amount of a bonding region.
Fig. 1 shows a schematic cross-sectional view of an exposure apparatus 100 according to a first embodiment.
In the following, a direction parallel to the optical axis of the projection optical system 4 is defined as a Z direction, and two directions orthogonal to each other in a plane perpendicular to the optical axis of the projection optical system 4 are defined as an X direction and a Y direction.
The direction in which the substrate 16 is moved (scanned) when scanning exposure is performed in the exposure apparatus 100, that is, the scanning direction is referred to as the Y direction, and the non-scanning direction orthogonal to the scanning direction in the XY plane, that is, the plane parallel to the substrate surface of the substrate 16 is referred to as the X direction.
The exposure apparatus 100 according to the present embodiment is a lithography apparatus used in a lithography process, which is one of processes for manufacturing devices such as a semiconductor device and a Flat Panel Display (FPD).
Specifically, the exposure apparatus 100 according to the present embodiment performs exposure processing in which a substrate is exposed through a master having a surface on which a pattern is formed, and the pattern formed on the master is transferred to the substrate.
As shown in fig. 1, an exposure apparatus 100 according to the present embodiment includes an illumination optical system 1, an alignment observer 2, a master stage 27, a projection optical system 4, an exposure amount adjustment plate 19 (exposure amount adjustment unit), a substrate stage 17, a control unit 20, and an acquisition unit 26 (control unit).
As shown in fig. 1, for example, the illumination optical system 1 includes a light source 5, a condenser lens 6, a fly's eye lens 7, a plane mirror 11, a condenser lens 8, a light shielding plate 9, and an imaging optical system 10, and guides light from the exposure of the light source 5 onto the master 3.
The light source 5 is constituted by, for example, a mercury lamp and an elliptical reflector.
The light shielding plate 9 is provided between the light source 5 and the master 3, and has a slit-shaped opening 9p through which the exposure light emitted from the light source 5 passes. Then, only the exposure light entering the opening 9p is allowed to pass through, thereby defining an illumination area on the substrate surface of the substrate 16.
The light shielding plate 9 includes a driving portion (not shown) that can drive the entire light shielding plate 9 in a non-scanning direction (X direction), and an adjusting portion 9a that can adjust the shape of the opening 9p is fixedly provided.
Hereinafter, the light shielding plate 9, the driving portion, and the adjusting portion 9a will be collectively referred to as a light shielding portion, and the detailed configuration of the light shielding portion will be described later.
The imaging optical system 10 is constituted by a plurality of mirrors arranged so as to image the light having passed through the exposure of the light shielding plate 9 on the surface of the master 3 on which the pattern is formed.
The plane mirror 11 is configured to bend the optical path of the exposure light in the illumination optical system 1.
The alignment observer 2 detects alignment marks provided on the master 3 and the substrate 16, respectively.
The master stage 27 is configured to be movable in the rotational directions around the X direction, the Y direction, and the Z direction while holding the master 3.
The projection optical system 4 projects (transfers) the pattern formed (drawn) on the surface of the original plate 3 onto the substrate surface of the substrate 16 by directing the light of the exposure of the original plate 3 held by the original plate stage 27 onto the substrate 16 held by the substrate stage 17.
At this time, the projection optical system 4 is disposed so that the original plate 3 is disposed at the position of the object surface of the projection optical system 4 and the substrate 16 is disposed at the position of the image surface of the projection optical system 4.
Specifically, in the projection optical system 4, the light having passed through the exposure of the original plate 3 passes through the parallel plate 13a, and then is reflected in the order of the plane mirror 14, the concave mirror 12, the convex mirror 15, the concave mirror 12, and the plane mirror 14, and passes through the parallel plate 13b, and is guided to the substrate 16.
The projection optical system 4 provided in the exposure apparatus 100 according to the present embodiment may be an equivalent imaging optical system that projects the pattern formed on the master 3 onto the substrate surface of the substrate 16 in an equivalent manner.
The projection optical system 4 provided in the exposure apparatus 100 according to the present embodiment may be an enlarged imaging optical system that enlarges and projects the pattern formed on the original plate 3 onto the substrate surface of the substrate 16, or a reduced imaging optical system that reduces and projects the pattern formed on the original plate 3 onto the substrate surface of the substrate 16.
The exposure amount adjustment plate 19 is provided between the projection optical system 4 and the substrate 16 so as to be capable of blocking at least a part of the exposure light passing through the projection optical system 4.
Further, the exposure amount adjustment plate 19 is configured to be movable in the non-scanning direction (X direction) and the scanning direction (Y direction), so that the shape of the light-shielded region, that is, the illumination region on the substrate 16, in the exposed light can be adjusted.
As a result, the cumulative exposure amount can be continuously changed in the bonding region, and the position of the bonding region can be changed as will be described later.
The substrate stage 17 is configured to be movable in at least the X-direction and the Y-direction while holding the substrate 16, and a light amount sensor 18 (detection unit, exposure amount measurement unit) for measuring an exposure amount generated by exposure light guided by the projection optical system 4 is provided on the substrate stage 17.
The control unit 20 is configured by a CPU, a memory, and the like, and controls the entire exposure apparatus 100 according to the present embodiment, specifically, the illumination optical system 1, the original mount 27, the projection optical system 4, the substrate mount 17, and the like.
Next, an exposure method called bonding exposure performed in the exposure apparatus 100 according to the present embodiment will be described.
In the bonding exposure, exposure can be performed in comparison with a region in which exposure can be performed by one-time scanning exposure, that is, a region in which the exposure region is wide.
Therefore, the present invention can be used advantageously for producing a large-screen liquid crystal panel or an organic EL panel, for example.
However, in the bonding region formed by the bonding exposure, the cumulative exposure amount becomes an amount that is repeated by the second scanning exposure.
Therefore, it is required to reduce the deviation of the cumulative exposure amount between the bonding region and the non-bonding region other than the bonding region, or the deviation of the cumulative exposure amount in the bonding region.
Fig. 2 (a) is a plan view of the substrate 16 when the 1 st exposure region 22a on the substrate surface of the substrate 16 is exposed (hereinafter referred to as "1 st exposure") in the exposure apparatus 100 according to the present embodiment.
Fig. 2b is a plan view of the substrate 16 when the substrate 16 is moved in order to expose the 2 nd exposure region 22b on the substrate surface of the substrate 16 (hereinafter referred to as "2 nd exposure") in the exposure apparatus 100 according to the present embodiment.
Fig. 2 (c) is a plan view of the substrate 16 when the 2 nd exposure is performed in the exposure apparatus 100 according to the present embodiment.
In the exposure apparatus 100 according to the present embodiment, the 1 st exposure and the 2 nd exposure performed as shown in fig. 2 (a) to (c) are transferred to the 1 st exposure region 22a and the 2 nd exposure region 22b, respectively, to form the same pattern.
That is, in the exposure apparatus 100 according to the present embodiment, when the 1 st exposure and the 2 nd exposure are performed, the same pattern formed on the same master 3 is illuminated by the exposure light from the illumination optical system 1.
First, in the 1 st exposure, as shown in fig. 2 (a), the 1 st exposure region 22a is irradiated with the exposure light 23 while the master 3 and the substrate 16 are moved in the scanning direction (Y direction) in synchronization with each other.
Next, after the end of the 1 st exposure, as shown in fig. 2 (b), the substrate stage 17 is driven to move the substrate 16 in the non-scanning direction (X direction) in order to perform the 2 nd exposure. I.e. no exposure is performed at this time.
The movement amounts of the original plate 3 and the substrate 16 in the non-scanning direction at this time are determined so that a part of the 1 st exposure region 22a and a part of the 2 nd exposure region 22b overlap each other.
That is, the 1 st exposure region 22a includes 1 st non-bonding region and 1 st bonding region arranged in the non-scanning direction, and the 2 nd exposure region 22b includes 2 nd bonding region and 2 nd non-bonding region overlapping with the 1 st bonding region arranged in the non-scanning direction.
In addition, at the time of the 2 nd exposure, as shown in fig. 2 (c), the original plate 3 and the substrate 16 are moved in the scanning direction (Y direction) in synchronization with each other, and the 2 nd exposure region 22b is irradiated with the exposure light 23.
By exposing each of the 1 st exposure region 22a and the 2 nd exposure region 22b in this manner, a joint region 24 (repeatedly exposed region) in which a part of the 1 st exposure region 22a and a part of the 2 nd exposure region 22b overlap each other is formed.
In the exposure apparatus 100 according to the present embodiment, the bonding region 24 is formed by the second scanning exposure including the 1 st exposure and the 2 nd exposure, but the present invention is not limited thereto, and the bonding region 24 may be formed by three or more scanning exposures.
Fig. 3 shows the non-scanning direction position dependence of the cumulative exposure amount and the total cumulative exposure amount when the 1 st exposure and the 2 nd exposure are performed, respectively.
Here, the cumulative exposure amount is a cumulative value of exposure amounts in one exposure performed for a predetermined exposure area by the pointer, and the cumulative exposure amount is a value obtained by adding up cumulative values of exposure amounts in each exposure performed for the predetermined exposure area.
In fig. 3, the cumulative exposure of the non-bonding region is set to 100%.
Specifically, fig. 3 shows a non-scanning direction position dependence 200a of the cumulative exposure amount in the 1 st exposure region 22a under the 1 st exposure, and a non-scanning direction position dependence 200b of the cumulative exposure amount in the 2 nd exposure region 22b under the 2 nd exposure.
Fig. 3 shows a non-scanning direction position dependence 200 of the total cumulative exposure amount of the 1 st exposure area 22a at the 1 st exposure and the cumulative exposure amount of the 2 nd exposure area 22b at the 2 nd exposure.
The non-scanning direction position dependencies 200a and 200b of the cumulative exposure amount shown in fig. 3 are respectively at the same predetermined positions with respect to the scanning direction.
As will be described later, in the exposure apparatus 100 according to the present embodiment, when each of the 1 st exposure and the 2 nd exposure is performed, the exposure amount adjustment plate 19 is inserted so as to shield a part of the exposure light 23 in order to reduce the exposure amount in the bonding region 24.
Thus, the non-scanning direction position dependencies 200a and 200b of the integrated exposure amount shown in fig. 3 continuously vary in the bonding region 24, respectively.
On the other hand, as shown in fig. 3, the non-scanning direction position dependencies 200a and 200b of the cumulative exposure amounts in the 1 st non-bonding region and the 2 nd non-bonding region are constant, respectively.
The exposure amount adjustment plate 19 can adjust the cumulative exposure amount in the bonding region 24 to the same extent as the cumulative exposure amount in each non-bonding region by the edges extending in the directions intersecting the scanning direction, that is, in the directions non-parallel to the scanning direction and the non-scanning direction, respectively (for example, see fig. 4 (a)).
However, when there is illuminance unevenness in the scanning direction (Y direction), a secondary component is generated in the non-scanning direction position dependence 200 of the total integrated exposure in the joint region 24 as shown in fig. 3 when the exposure adjustment is performed by inserting the exposure adjustment plate 19.
In other words, it is difficult to correct the non-scanning direction position dependencies 200a and 200b of the integrated exposure amount uniformly in the entire area of the bonding region 24, and the distribution of the integrated exposure amount is not uniform in the 1 st non-bonding region and the 2 nd non-bonding region and the bonding region 24.
The reason why the secondary component is generated in the non-scanning direction position dependence 200 of the total integrated exposure amount in the bonding region 24 is, for example, an error in manufacturing the optical component. That is, for example, a manufacturing error of each mirror used in the imaging optical system 10 may be a main cause.
In the exposure apparatus 100 according to the present embodiment, when the illumination shape formed by the exposure light 23 illuminating the master 3 is a circular arc shape, each mirror provided in the imaging optical system 10 is polished so as to follow the circular arc shape.
When the imaging optical system 10 uses a mirror polished so as to have a circular arc shape, there is a concern that illuminance unevenness occurs in the illumination shape formed by the exposure light 23 illuminating the master 3 in the scanning direction (Y direction).
When there is an uneven illuminance in the scanning direction (Y direction) in the illumination shape formed by the exposure light illuminating the master 3, a region where the exposure amount becomes large and a region where the exposure amount becomes small when the exposure region is scanned are formed.
However, even if the region where the exposure amount is increased and the region where the exposure amount is decreased are formed in this way, since the exposure area is scanned, the cumulative exposure amount is uniform in the scanning direction, and thus the cumulative exposure amount is not problematic in a large part of the exposure area.
However, since the joint region 24 is shielded from light by inserting the exposure amount adjustment plate 19 as described above in a part of the illumination region under the exposure light 23, there is a concern that only a part where the exposure amount is small or only a part where the exposure amount is large is accumulated.
In this case, the integrated exposure amount in the joint region 24 does not become uniform, that is, a distribution of the secondary shape such as a peak appearing at the center is generated in the non-scanning direction position dependency 200 of the integrated exposure amount in the joint region 24.
As described above, in the exposure apparatus 100 according to the present embodiment, when each of the 1 st exposure and the 2 nd exposure is performed, correction is performed only by inserting the exposure amount adjustment plate 19, and the total integrated exposure amount in the bonding region 24 is reduced as a quadratic function compared to the non-bonding region.
Therefore, in the exposure apparatus 100 according to the present embodiment, in order to make the total cumulative exposure amount uniform in the 1 st exposure area 22a and the 2 nd exposure area 22b as a whole, it is necessary to increase the total cumulative exposure amount, that is, the exposure amount in the bonding area 24.
That is, by reducing the quadratic component of the curve characteristic representing the total cumulative exposure amount distribution in the non-scanning direction (X direction) in the bonding region 24, the shape of the total cumulative exposure amount distribution in the non-scanning direction (X direction) in the bonding region 24 can be made to be a straight line from the curve.
Therefore, in the exposure apparatus 100 according to the present embodiment, as will be described in detail later, by deforming the shape of the opening 9p formed in the light shielding plate 9 by using the adjusting portion 9a, the secondary component in the non-scanning direction position dependency of the total accumulated exposure amount in the bonding region 24 can be reduced.
That is, in the exposure apparatus 100 according to the present embodiment, the shape of the total integrated exposure amount distribution in the non-scanning direction (X direction) in the joint region 24 can be made to be a straight line from a curve using the exposure amount adjustment plate 19 and the plurality of adjustment sections of the adjustment section 9 a.
This makes it possible to make the total cumulative exposure amount uniform in the entire 1 st exposure field 22a and the 2 nd exposure field 22 b.
Fig. 4 (a) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19a and the 1 st exposure region 22a when the 1 st exposure region 22a is exposed in the exposure apparatus 100 according to the present embodiment.
In the exposure apparatus 100 according to the present embodiment, an exposure amount adjustment plate 19a and an exposure amount adjustment plate 19b are provided as the exposure amount adjustment plate 19.
As shown in fig. 4 (a), the exposure amount distribution in the joint region 24 is continuously adjusted to be between 0 and 100% by moving the exposure amount adjustment plate 19a in the non-scanning direction (X direction) when exposing the 1 st exposure region 22 a.
In the exposure apparatus 100 according to the present embodiment, the adjustment unit 9a is fixed to the light shielding plate 9 so that a plurality of adjustment axes (shape adjustment units) constituting the adjustment unit 9a are arranged symmetrically with respect to a cross section including the center of the opening 9p and perpendicular to the non-scanning direction (X direction).
Specifically, in the exposure apparatus 100 according to the present embodiment, as shown in fig. 4 (a), the adjustment unit 9a is configured with eleven adjustment axes L5, L4, L3, L2, L1, X0, R1, R2, R3, R4, and R5. Further, the number of adjustment shafts in the adjustment portion 9a is not limited thereto.
Then, by pushing and pulling each portion (applying force) of one end portion of the opening 9p in the scanning direction (Y direction) by each adjustment shaft, the width of the scanning direction is changed at each position of the opening 9p in the non-scanning direction (X direction).
Thus, the cumulative exposure amount at each position in the non-scanning direction of the exposure field can be adjusted.
In the exposure apparatus 100 according to the present embodiment, when the 1 st exposure region 22a is exposed, the center of the opening 9p and the center of the outer shape of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 1 st exposure region 22a along the optical path of the exposure light, the adjustment axes R3 and R4 are included in the joint region 24 as shown in fig. 4 (a).
Therefore, by driving the adjustment shafts R3 and R4 to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction can be adjusted.
Fig. 4 (b) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b and the 2 nd exposure region 22b when the 2 nd exposure region 22b is exposed in the conventional exposure apparatus.
The conventional exposure apparatus shown here is identical to the exposure apparatus 100 according to the present embodiment except that the light shielding plate 9 is not movable in the non-scanning direction, and therefore identical reference numerals are given to identical components, and descriptions thereof are omitted.
First, as shown in fig. 4 (b), the exposure amount distribution in the joint region 24 is continuously adjusted to be between 0 and 100% by moving the exposure amount adjustment plate 19b in the non-scanning direction (X direction) when exposing the 2 nd exposure region 22 b.
In the conventional exposure apparatus, when the 2 nd exposure region 22b is exposed, the center of the opening 9p and the center of the outer shape of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 2 nd exposure region 22b along the optical path of the exposure light, the adjustment axes L3 and L4 are included in the joint region 24 as shown in fig. 4 (b).
Accordingly, the adjustment axes L3 and L4 are driven to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, thereby adjusting the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction.
That is, in the conventional exposure apparatus, when each of the 1 st exposure region 22a and the 2 nd exposure region 22b is exposed, the center of the opening 9p and the outer shape center of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
Therefore, in the conventional exposure apparatus, the position of the adjustment axis R3 with respect to the joint region 24 when exposing the 1 st exposure region 22a and the position of the adjustment axis L4 with respect to the joint region 24 when exposing the 2 nd exposure region 22b in the non-scanning direction are the same.
The position of the adjustment axis R4 with respect to the joint region 24 when exposing the 1 st exposure region 22a and the position of the adjustment axis L3 with respect to the joint region 24 when exposing the 2 nd exposure region 22b in the non-scanning direction are also the same.
In other words, the arrangement in the non-scanning direction of the adjustment axis included in the joint region 24 when the 1 st exposure region 22a is exposed and the arrangement in the non-scanning direction of the adjustment axis included in the joint region 24 when the 2 nd exposure region 22b is exposed are the same.
Thus, in the conventional exposure apparatus, when the 1 st exposure region 22a and the 2 nd exposure region 22b are exposed, the exposure amount distribution in the joint region 24 is adjusted by the two adjustment axes, i.e., the adjustment axes R3 (L4) and R4 (L3).
At this time, as shown in the above description using fig. 3, a case is considered in which a secondary component is generated in the non-scanning direction position dependency of the total integrated exposure amount in the bonding region 24.
In this case, the width of the opening 9p in the scanning direction cannot be changed particularly in the vicinity of the center of the joint region 24 where the secondary component is maximum, and therefore it is difficult to make the total cumulative exposure amount uniform in the 1 st exposure region 22a and the 2 nd exposure region 22b as a whole.
Therefore, in the exposure apparatus 100 according to the present embodiment, the following method is adopted, so that it is difficult to solve the problem that the total cumulative exposure amount becomes uniform in the entire 1 st exposure area 22a and 2 nd exposure area 22b in such a conventional exposure apparatus.
Fig. 4 (c) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b and the 2 nd exposure region 22b when the 2 nd exposure region 22b is exposed in the exposure apparatus 100 according to the present embodiment.
First, as shown in fig. 4 (c), the exposure amount distribution in the joint region 24 is continuously adjusted to be between 0 and 100% by moving the exposure amount adjustment plate 19b in the non-scanning direction (X direction) when exposing the 2 nd exposure region 22 b.
In the exposure apparatus 100 according to the present embodiment, the light shielding plate 9 is moved in the non-scanning direction so that the center of the opening 9p and the outer shape center of the original plate 3 are respectively positioned at different positions in the non-scanning direction (X direction) when the 2 nd exposure region 22b is exposed.
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 2 nd exposure region 22b along the optical path of the exposure light, the adjustment axis L4 is included in the joint region 24 as shown in fig. 4 (c).
Therefore, by driving the adjustment shaft L4 to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction can be adjusted.
That is, in the exposure apparatus 100 according to the present embodiment, the positions of the adjustment axes R3 and R4 with respect to the joint region 24 when exposing the 1 st exposure region 22a and the position of the adjustment axis L4 with respect to the joint region 24 when exposing the 2 nd exposure region 22b in the non-scanning direction are different from each other.
In other words, the arrangement (1 st arrangement) of the adjustment axis included in the joint region 24 in the non-scanning direction when the 1 st exposure region 22a is exposed and the arrangement (2 nd arrangement) of the adjustment axis included in the joint region 24 in the non-scanning direction when the 2 nd exposure region 22b is exposed are different from each other.
In this way, in the exposure apparatus 100 according to the present embodiment, when the 1 st exposure region 22a and the 2 nd exposure region 22b are exposed, the exposure amount distribution in the joint region 24 is adjusted by the three adjustment axes R3, R4, and L4.
Therefore, the total integrated exposure amount can be made uniform in the entire 1 st exposure region 22a and the 2 nd exposure region 22b, compared to the conventional exposure apparatus.
Fig. 4 (d) shows the non-scanning direction position dependence of the cumulative exposure amount and the cumulative exposure amount when the 1 st exposure area 22a and the 2 nd exposure area 22b are exposed in the exposure apparatus 100 according to the present embodiment.
First, when the 1 st exposure region 22a is exposed, as shown in fig. 4 (a), the exposure amount distribution in the joint region 24 is adjusted by inserting the exposure amount adjustment plate 19a and changing the shape of the opening 9p by the adjustment axes R3 and R4 of the adjustment unit 9 a.
At this time, as shown in fig. 4 (d), the non-scanning direction position dependence 300a of the integrated exposure amount in the 1 st exposure region 22a is obtained.
Next, when exposing the 2 nd exposure region 22b, as shown in fig. 4 (c), the exposure amount adjustment plate 19b is inserted, the light shielding plate 9 is displaced in the non-scanning direction, and the shape of the opening 9p is changed by the adjustment axis L4 of the adjustment portion 9 a. Thereby, the exposure amount distribution in the bonding region 24 is adjusted.
At this time, as shown in fig. 4 (d), the non-scanning direction position dependence 300b of the integrated exposure amount in the 2 nd exposure region 22b is obtained.
As shown in fig. 4 (d), the non-scanning direction position dependence 300 of the total integrated exposure amount, which is the total of the non-scanning direction position dependence 300a and 300b of the integrated exposure amounts, is uniform in the 1 st exposure area 22a and the 2 nd exposure area 22 b.
In other words, in the exposure apparatus 100 according to the present embodiment, by changing the shape of the opening 9p after shifting the light shielding plate 9 in the non-scanning direction, the distribution of the secondary shape, that is, the secondary component generated in the non-scanning direction position dependency 200 of the total accumulated exposure amount can be reduced.
In the above, the light shielding plate 9 is displaced in the non-scanning direction when the 2 nd exposure region 22b is exposed, but the present invention is not limited to this, and the light shielding plate 9 may be displaced in the non-scanning direction when the 1 st exposure region 22a is exposed.
Fig. 5 (a) is a plan view showing an opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b before the light shielding plate 9 is displaced in the non-scanning direction when the 2 nd exposure region 22b is exposed in the exposure apparatus 100 according to the present embodiment.
Fig. 5 (b) is a plan view of the exposure apparatus 100 according to the present embodiment, showing the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b after the light shielding plate 9 is displaced in the non-scanning direction when the 2 nd exposure region 22b is exposed.
As shown in fig. 5 (a), the intersection point of the negative side edge portion 9pe3 of the opening 9p in the scanning direction (Y direction) and the inclined edge portion 19be1 of the exposure amount adjustment plate 19b is set to be (Xstitch, ysttch) before the light shielding plate 9 is displaced in the non-scanning direction.
As described above, in the exposure apparatus 100 according to the present embodiment, the light shielding plate 9 is displaced in the non-scanning direction (X direction) when the 2 nd exposure region 22b is exposed.
At this time, at the position where x=xstich, the edge portion 9pe3 and the oblique edge portion 19be1 do not intersect with each other.
Even after shifting the light shielding plate 9 in the non-scanning direction, in order to maintain a continuous exposure amount distribution between 0 and 100% in the bonding region 24, it is required to mutually intersect the edge portion 9pe3 and the oblique edge portion 19be1 at the position of x=xstich.
For this reason, as shown in fig. 5 (b), when the light shielding plate 9 is displaced in the X direction, the exposure amount adjustment plate 19b may be displaced in the Y direction.
Specifically, as shown in fig. 5 (b), the edge portion 9pe3 and the oblique edge portion 19be1 may be intersected with each other at (Xstitch, Y' stitch).
Here, when the displacement amount of the light shielding plate 9 in the X direction is L and the radius of the circular arc of the negative side edge portion 9pe3 of the opening 9p is R, the displacement amount Yshift of the exposure amount adjustment plate 19b in the Y direction is obtained as shown in the following equation (1).
[ math 1 ]
In the exposure apparatus 100 according to the present embodiment, when exposing each exposure region of the substrate 16, the acquisition unit 26 first acquires positional information of each bonding region 24 in the substrate 16.
Here, the positional information of each bonding region 24 in the substrate 16 is determined based on, for example, information such as the layout of the exposure regions in the substrate 16 and the irradiation regions of the pattern formed on the master 3, which are input from an input device not shown by a user.
Next, the control unit 20 determines the arrangement of the adjustment axes of the adjustment units 9a in the region of the opening 9p corresponding to the joint region 24, based on the positional information of the joint region 24 acquired by the acquisition unit 26.
Next, after determining the exposure amount distribution in each of the bonding regions 24, the control unit 20 determines the driving amount of the exposure amount adjustment plate 19 in the non-scanning direction based on the determined exposure amount distribution in each of the bonding regions 24.
The control unit 20 then measures the exposure amount distribution in the exposure region by the light amount sensor 18, and determines the driving amounts of the adjustment axes of the adjustment unit 9a disposed in the region of the opening 9p corresponding to the bonding region 24 for correcting the exposure amount distribution in the bonding region 24.
Specifically, the exposure amount distribution in the exposure area is measured by detecting the light amount by the light amount sensor 18 while sequentially moving the substrate stage 17 stepwise in the non-scanning direction (X direction).
The measurement of the exposure dose distribution may be performed each time each exposure region is exposed, or may be performed each time a predetermined period elapses during the exposure process when the layout of the exposure regions in the substrate 16 is changed.
Fig. 6 is a flowchart showing a process when the 1 st exposure area and the 2 nd exposure area, which are predetermined two exposure areas, are exposed in the exposure apparatus 100 according to the present embodiment.
The respective components in the exposure apparatus 100 are controlled by the control unit 20, and the steps included in the flowchart are executed.
First, based on the layout of the exposure regions on the substrate 16, positional information of the bonding region 24 is obtained from positional information of the irradiation region of the pattern in the master 3 transferred to the 1 st and 2 nd exposure regions and positional information of the projection region of the pattern on the substrate 16 (step S401).
As positional information of the bonding region 24, for example, coordinates of an intermediate position of the bonding region 24 in the non-scanning direction (X direction) are acquired.
Next, the arrangement of the adjustment axes of the adjustment portions 9a in the region of the opening 9p of the light shielding plate 9 corresponding to the joint region 24 is determined.
Then, the movement amount, i.e., the position of the light shielding plate 9 in the non-scanning direction (X direction) when exposing the 2 nd exposure region is determined so that the respective adjustment axes of the adjustment unit 9a are arranged in the determined arrangement in this region (step S402).
Specifically, for example, when the 1 st exposure region is exposed, two adjustment shafts are arranged in the region of the opening 9p of the light shielding plate 9 corresponding to the joint region 24.
At this time, when the 2 nd exposure region is exposed, the position of the mask 9 in the non-scanning direction (X direction) is determined such that one adjustment axis is arranged in the region of the opening 9p of the mask 9 at the intermediate position between the two adjustment axes when the 1 st exposure region is exposed.
The arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when exposing the 1 st exposure region and the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when exposing the 2 nd exposure region are not limited to the above description.
Next, based on the positional information of the bonding region 24 acquired in step S401, the cumulative exposure amount in the bonding region 24 is calculated, and the movement amount, i.e., the position of the exposure amount adjustment plate 19 in the non-scanning direction for adjusting the cumulative exposure amount is determined (step S403).
Next, the driving amounts of the adjustment axes of the adjustment portion 9a corresponding to the amount of change (adjustment amount) in the width in the scanning direction at the respective positions in the non-scanning direction in the region of the opening 9p of the light shielding plate 9 corresponding to the bonding region 24 are determined (step S404).
Here, when the driving amounts of the adjustment axes of the adjustment portions 9a in the region of the opening 9p of the light shielding plate 9 corresponding to the bonding region 24 are determined, the exposure amount distribution in the 1 st exposure region and the 2 nd exposure region is measured by the light amount sensor 18.
However, not limited to this, in the case of using the exposure amount distribution measured at the previous exposure, the measurement of the exposure amount distribution in step S404 may be omitted.
Then, the 1 st exposure area and the 2 nd exposure area are respectively exposed according to the positions of the light shielding plate 9 and the exposure amount adjustment plate 19 determined in the above description and the driving amounts of the adjustment axes of the adjustment unit 9a (step S405).
As described above, in the exposure apparatus 100 according to the present embodiment, the opening 9p is moved in the non-scanning direction (X direction) in the 2 nd exposure so that the arrangement of the adjustment axes included in the joint region in the non-scanning direction is different from each other in the 1 st exposure and the 2 nd exposure.
In other words, the relative positions of the master table 27 and the opening 9p in the non-scanning direction are controlled so that the arrangement of the adjustment axes included in the bonding region in the non-scanning direction is different from each other when the 1 st exposure and the 2 nd exposure are performed.
Accordingly, the exposure amount distribution in the joint region 24 can be adjusted with more adjustment axes than in the conventional exposure apparatus, so that the total integrated exposure amount can be made better and more easily uniform in the 1 st exposure region 22a and the 2 nd exposure region 22 b.
In the exposure apparatus 100 according to the present embodiment, the same pattern formed on the same master 3 at the time of the 1 st exposure and the 2 nd exposure is illuminated with the light from the exposure of the illumination optical system 1 as described above.
In this case, when the 2 nd exposure region 22b is exposed, the center of the opening 9p and the outer shape center of the original plate 3 are respectively different from each other in the non-scanning direction (X direction) by moving the light shielding plate 9 in the non-scanning direction.
However, the exposure apparatus 100 according to the present embodiment is not limited to the above, and may be applied to a case where different patterns formed on the same master 3 and different patterns formed on different masters 3 are illuminated when the 1 st exposure and the 2 nd exposure are performed.
That is, even in such a case, the 1 st exposure and the 2 nd exposure are performed so that the arrangement of the adjustment axes of the shapes of the adjustment openings included in the joint region in the non-scanning direction are different from each other, respectively, whereby the above-described effects can be obtained.
Second embodiment
Fig. 7 (a) is a plan view of each of the master 3, the illumination region 22a', and the master stage 27 when the 1 st exposure region 22a is exposed in the exposure apparatus according to the second embodiment.
Fig. 7 (b) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19a and the 1 st exposure region 22a when the 1 st exposure region 22a is exposed in the exposure apparatus according to the present embodiment.
Since the exposure apparatus according to the present embodiment is composed of the same components as those of the exposure apparatus 100 according to the first embodiment, the same reference numerals are given to the same components, and the description thereof is omitted.
As shown in fig. 7 (a), when the 1 st exposure region 22a in the substrate 16 is exposed, the illumination region 22a' in the master 3 is illuminated.
Further, a region corresponding to the bonding region 24 included in the 1 st exposure region 22a among the illumination regions 22a 'is denoted by 24'.
Note here that the light having passed through the exposure of the master 3 is reversed from left to right by the projection optical system 4, so that the 1 st exposure region 22a and the illumination region 22a' are in a reversed relationship with each other as shown in fig. 7 (a) and (b).
As shown in fig. 7 b, the exposure amount adjustment plate 19a is driven in the non-scanning direction (X direction) when the 1 st exposure region 22a is exposed, so that the exposure amount distribution in the joint region 24 is continuously adjusted to be between 0 and 100%.
In the exposure apparatus according to the present embodiment, when the 1 st exposure region 22a is exposed, the center of the opening 9p and the center of the outer shape of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 1 st exposure region 22a along the optical path of the exposure light, the adjustment axes R2 and R3 are included in the joint region 24 as shown in fig. 7 (b).
Therefore, by driving the adjustment shafts R2 and R3 to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction can be adjusted.
Fig. 7 (c) is a plan view of each of the original plate 3, the illumination region 22b', and the original plate stage 27 when the 2 nd exposure region 22b is exposed in the conventional exposure apparatus.
Fig. 7 (d) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b and the 2 nd exposure region 22b when the 2 nd exposure region 22b is exposed in the conventional exposure apparatus.
The configuration of the conventional exposure apparatus shown here is the same as that of the exposure apparatus according to the present embodiment, and therefore the same reference numerals are given to the same components, and the description thereof is omitted.
As shown in fig. 7 (c), when the 2 nd exposure region 22b in the substrate 16 is exposed, the illumination region 22b' in the master 3 is illuminated.
Further, a region corresponding to the bonding region 24 included in the 2 nd exposure region 22b in the illumination region 22b 'is denoted by 24'.
As shown in fig. 7 d, the exposure amount distribution in the joint region 24 is continuously adjusted to be between 0 and 100% by moving the exposure amount adjustment plate 19b in the non-scanning direction (X direction) when exposing the 2 nd exposure region 22 b.
In the conventional exposure apparatus, when the 2 nd exposure region 22b is exposed, the center of the opening 9p and the center of the outer shape of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 2 nd exposure region 22b along the optical path of the exposure light, the adjustment axes L2 and L3 are included in the joint region 24 as shown in fig. 7 (d).
Therefore, the adjustment axes L2 and L3 are driven to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, thereby adjusting the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction.
That is, in the conventional exposure apparatus, when each of the 1 st exposure region 22a and the 2 nd exposure region 22b is exposed, the center of the opening 9p and the outer shape center of the original plate 3 are positioned at the same positions in the non-scanning direction (X direction).
Thus, the position of the adjustment axis R2 with respect to the joint region 24 when exposing the 1 st exposure region 22a and the position of the adjustment axis L3 with respect to the joint region 24 when exposing the 2 nd exposure region 22b in the non-scanning direction are the same.
The position of the adjustment axis R3 with respect to the joint region 24 when exposing the 1 st exposure region 22a and the position of the adjustment axis L2 with respect to the joint region 24 when exposing the 2 nd exposure region 22b in the non-scanning direction are also the same.
In other words, the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 1 st exposure region 22a is exposed and the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 2 nd exposure region 22b is exposed are the same.
Thus, in the conventional exposure apparatus, when the 1 st exposure region 22a and the 2 nd exposure region 22b are exposed, the exposure amount distribution in the joint region 24 is adjusted by the two adjustment axes R2 (L3) and R3 (L2).
At this time, as described above, using fig. 3, a case is considered in which a secondary component is generated in the non-scanning direction position dependency of the total integrated exposure amount in the bonding region 24.
In this case, the width of the opening 9p in the scanning direction cannot be changed particularly in the vicinity of the center of the joint region 24 where the secondary component is maximum, and therefore it is difficult to make the total cumulative exposure amount uniform in the 1 st exposure region 22a and the 2 nd exposure region 22b as a whole.
As described above, in the exposure apparatus 100 according to the first embodiment, the light shielding plate 9 is moved in the non-scanning direction (X direction) when the 2 nd exposure region 22b is exposed, so that the secondary component generated in the non-scanning direction position dependency of the total accumulated exposure amount in the joint region 24 is reduced.
On the other hand, in the exposure apparatus according to the present embodiment, as described in detail below, the second component is reduced by moving the original mount 27, the substrate mount 17, and the exposure amount adjustment plate 19 in the non-scanning direction (X direction) when exposing the 2 nd exposure region 22 b.
Fig. 7 (e) is a plan view of each of the original plate 3, the illumination region 22b', and the original plate stage 27 when the 2 nd exposure region 22b is exposed in the exposure apparatus according to the present embodiment.
Fig. 7 (f) is a plan view showing the arrangement relationship between the opening 9p formed in the light shielding plate 9 and the exposure amount adjustment plate 19b and the 2 nd exposure region 22b when the 2 nd exposure region 22b is exposed in the exposure apparatus according to the present embodiment.
In the exposure apparatus according to the present embodiment, when exposing the 2 nd exposure field 22b, for example, the master stage 27 is moved to the negative side in the X direction, whereby the center of the opening 9p and the outer shape center of the master 3 are respectively different from each other in the non-scanning direction (X direction).
At this time, the pattern formed on the original plate 3, that is, the illumination region 22b' in the original plate 3 is reversed from left to right by the projection optical system 4, and is therefore projected on the substrate 16 while being shifted to the positive side in the X direction.
Therefore, in the exposure apparatus according to the present embodiment, in this case, the substrate stage 17 and the exposure amount adjustment plate 19b are moved to the positive side in the X direction.
At this time, when each adjustment axis of the adjustment unit 9a is projected onto the 2 nd exposure region 22b along the optical path of the exposure light, the adjustment axis L2 is included in the joint region 24 as shown in fig. 7 (f).
Therefore, by driving the adjustment shaft L2 to change the width of the opening 9p in the scanning direction at the position corresponding to the joint region 24, the exposure amount distribution in the joint region 24, that is, the cumulative exposure amount at each position in the non-scanning direction can be adjusted.
That is, in the exposure apparatus according to the present embodiment, the positions of the adjustment axes R2 and R3 in the non-scanning direction when exposing the 1 st exposure region 22a and the position of the adjustment axis L2 in the exposure of the 2 nd exposure region 22b are different from each other with respect to the joint region 24.
In other words, the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 1 st exposure region 22a is exposed and the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 2 nd exposure region 22b is exposed are different from each other.
Thus, in the exposure apparatus according to the present embodiment, when the 1 st exposure region 22a and the 2 nd exposure region 22b are exposed, the exposure amount distribution in the joint region 24 is adjusted by the three adjustment axes R2, R3, and L2.
Therefore, the total integrated exposure amount can be made uniform in the entire 1 st exposure region 22a and the 2 nd exposure region 22b, compared to the conventional exposure apparatus.
In the above, the original mounting table 27, the substrate mounting table 17, and the exposure amount adjustment plate 19 are shifted in the non-scanning direction when the 2 nd exposure region 22b is exposed, but the present invention is not limited to this, and they may be shifted in the non-scanning direction when the 1 st exposure region 22a is exposed.
Fig. 8 is a flowchart showing a process when exposing the 1 st exposure area and the 2 nd exposure area, which are two predetermined exposure areas, in the exposure apparatus according to the present embodiment.
The respective components in the exposure apparatus are controlled by the control unit 20, and the steps included in the flowchart are executed.
First, based on the layout of the exposure regions on the substrate 16, positional information of the bonding region 24 is obtained from positional information of the irradiation region of the pattern in the master 3 transferred to the 1 st and 2 nd exposure regions and positional information of the projection region of the pattern on the substrate 16 (step S601).
As positional information of the bonding region 24, for example, coordinates of an intermediate position of the bonding region 24 in the non-scanning direction (X direction) are acquired.
Next, the arrangement of the adjustment axes of the adjustment portions 9a in the region of the opening 9p of the light shielding plate 9 corresponding to the joint region 24 is determined.
Then, the positions, which are the movement amounts of the original mount 27 and the substrate mount 17 in the non-scanning direction (X direction) when exposing the 2 nd exposure region, are determined so that the respective adjustment axes of the adjustment unit 9a are arranged in the determined arrangement in the region (step S602).
Specifically, for example, when the 1 st exposure region is exposed, two adjustment shafts are arranged in the region of the opening 9p of the light shielding plate 9 corresponding to the joint region 24.
At this time, when the 2 nd exposure region is exposed, the positions of the original plate stage 27 and the substrate stage 17 in the non-scanning direction are determined such that one adjustment axis is arranged at the intermediate position between the two adjustment axes when the 1 st exposure region is exposed in the region of the opening 9p of the light shielding plate 9.
The arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 1 st exposure region is exposed and the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction when the 2 nd exposure region is exposed are not limited to the above.
Next, based on the positional information of the bonding region 24 acquired in step S601, the cumulative exposure amount in the bonding region 24 is calculated, and the movement amount, i.e., the position of the exposure amount adjustment plate 19 in the non-scanning direction for adjusting the cumulative exposure amount is determined (step S603).
Next, the driving amounts of the adjustment axes of the adjustment portion 9a corresponding to the amount of change (adjustment amount) in the width in the scanning direction at the respective positions in the non-scanning direction in the region of the opening 9p of the light shielding plate 9 corresponding to the bonding region 24 are determined (step S604).
Here, when the driving amounts of the adjustment axes of the adjustment portions 9a in the region of the opening 9p of the light shielding plate 9 are determined, the exposure amount distribution in the 1 st exposure region and the 2 nd exposure region is measured by the light amount sensor 18.
However, not limited to this, in the case of using the exposure amount distribution measured at the previous exposure, the measurement of the exposure amount distribution in step S604 may be omitted.
Then, exposure is performed for each of the 1 st exposure field and the 2 nd exposure field based on the positions of the original mounting table 27, the substrate mounting table 17, and the exposure amount adjustment plate 19 in the non-scanning direction and the driving amounts of the adjustment axes of the adjustment unit 9a determined in the above description (step S605).
As described above, in the exposure apparatus according to the present embodiment, the original plate stage 27 is moved in the non-scanning direction (X direction) during the 2 nd exposure so that the arrangement of the adjustment axes included in the joint region in the non-scanning direction is different from each other during the 1 st exposure and the 2 nd exposure.
In other words, the relative positions of the master table 27 and the opening 9p in the non-scanning direction are controlled so that the arrangement of the adjustment axes included in the bonding region in the non-scanning direction is different from each other when the 1 st exposure and the 2 nd exposure are performed, respectively.
Accordingly, the exposure amount distribution in the joint region 24 can be adjusted with more adjustment axes than in the conventional exposure apparatus, so that the total integrated exposure amount can be made better and more easily uniform in the 1 st exposure region 22a and the 2 nd exposure region 22 b.
In the exposure apparatus according to the present embodiment, the position of the original mount 27 in the non-scanning direction is changed so that the arrangement of the adjustment axes included in the joint region 24 in the non-scanning direction is different when the 1 st exposure region 22a and the 2 nd exposure region 22b are exposed.
However, in the exposure apparatus according to the present embodiment, the position of the light shielding plate 9 in the non-scanning direction may be changed in addition to the original mount 27.
[ method for producing article ]
The method of manufacturing an article according to the present embodiment is suitable for manufacturing, for example, a Flat Panel Display (FPD).
Specifically, the method for manufacturing an article according to the present embodiment includes: a step of forming a latent image pattern on a photosensitive agent applied to a substrate (a step of exposing the substrate) using the exposure apparatus according to the present embodiment; and developing the substrate on which the latent image pattern is formed.
The method for manufacturing an article according to the present embodiment further includes other known processing steps (oxidation, film formation, vapor deposition, doping, planarization, etching, stripping of a photosensitive agent, dicing, bonding, packaging, and the like).
The method for manufacturing an article according to the present embodiment is more advantageous than the conventional method for manufacturing an article in at least one of performance, quality, productivity, and production cost of an article.
While the preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

Claims (16)

1. An exposure apparatus for exposing a substrate to light so as to transfer a pattern drawn on an original plate to the substrate while scanning the original plate and the substrate in a scanning direction, the exposure apparatus comprising:
a master mounting table movable in the scanning direction and a non-scanning direction perpendicular to the scanning direction within a substrate surface of the substrate while holding the master;
an illumination optical system including a light shielding portion movable in the non-scanning direction, the light shielding portion having an opening through which exposure light from a light source passes, and a plurality of shape adjustment portions each of which is capable of adjusting a width of the opening in the scanning direction at a predetermined position in the non-scanning direction, the illumination optical system directing the exposure light to the master; and
a control unit for controlling the original plate mounting table and the illumination optical system,
the 1 st exposure area on the substrate surface includes a 1 st non-bonding area and a 1 st bonding area arranged in the non-scanning direction,
the 2 nd exposure region on the substrate surface includes a 2 nd bonding region and a 2 nd non-bonding region overlapping the 1 st bonding region arranged in the non-scanning direction,
The control unit controls the relative positions of the master stage and the opening in the non-scanning direction so that the 1 st arrangement of the shape adjustment unit included in the 1 st joint region in the non-scanning direction when the 1 st exposure region is exposed and the 2 nd arrangement of the shape adjustment unit included in the 2 nd joint region in the non-scanning direction when the 2 nd exposure region is exposed are different from each other.
2. The exposure apparatus according to claim 1, comprising:
and a projection optical system including an exposure amount adjustment unit that adjusts an exposure amount of at least a part of the exposure region by blocking at least a part of the exposure light by moving in the non-scanning direction, the projection optical system directing the exposure light having passed through the master onto the substrate.
3. The exposure apparatus according to claim 1, wherein,
the plurality of shape adjustment portions are arranged so as to be symmetrical to each other across a cross section including a center of the opening and perpendicular to the non-scanning direction.
4. The exposure apparatus according to claim 2, comprising:
a substrate stage movable in the scanning direction and the non-scanning direction while holding the substrate, the substrate stage having an exposure amount measuring section for measuring an exposure amount distribution on the substrate stage,
the control unit determines the amount of change in the width of the opening in the scanning direction at a predetermined position in the non-scanning direction, which is adjusted by the shape adjustment unit included in the 2 nd arrangement, based on the positions of the opening in the non-scanning direction and the exposure amount adjustment unit when exposing the 2 nd exposure area, and the exposure amount distribution measured by the exposure amount measurement unit in an area corresponding to the 1 st exposure area and the 2 nd exposure area on the substrate mounting table.
5. The exposure apparatus according to claim 4, wherein,
the control part
Obtaining the position of the joint region according to the positions of the 1 st exposure region and the 2 nd exposure region on the substrate surface,
determining the 1 st arrangement and the 2 nd arrangement, and determining a position of the opening in the non-scanning direction when exposing the 2 nd exposure region so as to be the determined 2 nd arrangement,
Calculating an accumulated exposure in the bonding region based on the acquired position of the bonding region, and determining a position of the exposure adjustment section in the non-scanning direction based on the calculated accumulated exposure,
controlling the original mounting table, the substrate mounting table, the illumination optical system, and the projection optical system based on the positions of the 1 st exposure region and the 2 nd exposure region and the determined positions of the opening and the exposure amount adjustment unit in the non-scanning direction, and measuring the exposure amount distribution in the region corresponding to the 1 st exposure region and the 2 nd exposure region on the substrate mounting table by the exposure amount adjustment unit,
the variation of the width in the scanning direction of the opening at a predetermined position in the non-scanning direction, which is adjusted by the shape adjusting section included in the 2 nd arrangement, is determined based on the measured exposure amount distribution.
6. The exposure apparatus according to claim 5, wherein,
the control unit determines the position of the opening in the non-scanning direction so that the center of the opening and the center of the outer shape of the master are positioned differently in the non-scanning direction when exposing the 2 nd exposure region.
7. The exposure apparatus according to claim 4, wherein,
the shape adjusting portion adjusts the width of the opening in the scanning direction by driving in such a manner that a force is applied in the scanning direction at a predetermined position of an edge portion of the opening in the scanning direction,
the control unit determines a driving amount during the driving of the shape adjusting unit when determining the amount of change in the width of the opening in the scanning direction.
8. The exposure apparatus according to claim 5, wherein,
the control unit determines the 2 nd arrangement such that a predetermined one of the 2 nd arrangement is arranged at an intermediate position of the two predetermined shape adjustment units in the 1 st arrangement in the non-scanning direction.
9. The exposure apparatus according to claim 5, wherein,
the control unit determines a position of the exposure amount adjustment unit in the scanning direction based on the determined position of the opening in the non-scanning direction.
10. The exposure apparatus according to claim 2, comprising:
a substrate stage movable in the scanning direction and the non-scanning direction while holding the substrate, the substrate stage having an exposure amount measuring section for measuring an exposure amount distribution on the substrate stage,
The control unit determines the amount of change in the width of the opening in the scanning direction at a predetermined position in the non-scanning direction, which is adjusted by the shape adjustment unit included in the 2 nd arrangement, based on the positions of the master stage, the substrate stage, and the exposure amount adjustment unit in the non-scanning direction when exposing the 2 nd exposure area, and the exposure amount distribution measured by the exposure amount measurement unit in an area corresponding to the 1 st exposure area and the 2 nd exposure area on the substrate stage.
11. The exposure apparatus according to claim 10, wherein,
the control part
Obtaining the position of the joint region according to the positions of the 1 st exposure region and the 2 nd exposure region on the substrate surface,
determining the 1 st arrangement and the 2 nd arrangement, and determining positions of the original mounting table and the substrate mounting table in the non-scanning direction when exposing the 2 nd exposure region so as to be the determined 2 nd arrangement,
calculating an accumulated exposure in the bonding region based on the acquired position of the bonding region, and determining a position of the exposure adjustment section in the non-scanning direction based on the calculated accumulated exposure,
The master stage, the substrate stage, the illumination optical system, and the projection optical system are controlled based on the positions of the 1 st exposure region and the 2 nd exposure region and the determined positions of the master stage, the substrate stage, and the exposure amount adjustment unit in the non-scanning direction, and the exposure amount distribution in the regions corresponding to the 1 st exposure region and the 2 nd exposure region on the substrate stage is measured by the exposure amount measurement unit,
the variation of the width in the scanning direction of the predetermined position in the non-scanning direction of the opening adjusted by the shape adjusting section included in the 2 nd arrangement is determined.
12. The exposure apparatus according to claim 11, wherein,
the control unit determines positions of the original plate stage and the substrate stage in the non-scanning direction so that positions of a center of the opening and a center of an outer shape of the original plate in the non-scanning direction are different from each other when the 2 nd exposure region is exposed.
13. The exposure apparatus according to claim 10, wherein,
The shape adjusting portion adjusts the width of the opening in the scanning direction by driving in such a manner that a force is applied in the scanning direction at a predetermined position of an edge portion of the opening in the scanning direction,
the control unit determines a driving amount during the driving of the shape adjusting unit when determining the amount of change in the width of the opening in the scanning direction.
14. The exposure apparatus according to claim 11, wherein,
the control unit determines the 2 nd arrangement such that a predetermined one of the 2 nd arrangement is arranged at an intermediate position of the two predetermined shape adjustment units in the 1 st arrangement in the non-scanning direction.
15. A method of manufacturing an article, comprising:
a step of exposing a substrate by the exposure apparatus according to any one of claims 1 to 14; and
and developing the exposed substrate.
16. An exposure method for exposing a substrate by using an exposure device to scan a master and the substrate in a scanning direction and simultaneously transfer a pattern drawn on the master to the substrate, the exposure device comprising: a master mounting table movable in the scanning direction and a non-scanning direction perpendicular to the scanning direction within a substrate surface of the substrate while holding the master; an illumination optical system including a light shielding portion movable in the non-scanning direction, the light shielding portion having an opening through which exposure light from a light source passes, and a plurality of shape adjustment portions each of which is capable of adjusting a width of the opening in the scanning direction at a predetermined position in the non-scanning direction, the illumination optical system directing the exposure light to the master; and a control unit for controlling the original plate mounting table and the illumination optical system, wherein,
The 1 st exposure area on the substrate surface includes a 1 st non-bonding area and a 1 st bonding area arranged in the non-scanning direction,
the 2 nd exposure region on the substrate surface includes a 2 nd bonding region and a 2 nd non-bonding region overlapping the 1 st bonding region arranged in the non-scanning direction,
the exposure method includes a step of controlling a relative position between the original plate stage and the opening in the non-scanning direction so that a 1 st arrangement of the shape adjusting portion included in the 1 st joint region in the non-scanning direction when the 1 st exposure region is exposed and a 2 nd arrangement of the shape adjusting portion included in the 2 nd joint region in the non-scanning direction when the 2 nd exposure region is exposed are different from each other in projection along an optical path of the exposure light.
CN202310620836.0A 2022-06-03 2023-05-30 Exposure apparatus, method for producing article, and exposure method Pending CN117170190A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022090602A JP2023177758A (en) 2022-06-03 2022-06-03 Light exposure device, and manufacturing method of article
JP2022-090602 2022-06-03

Publications (1)

Publication Number Publication Date
CN117170190A true CN117170190A (en) 2023-12-05

Family

ID=88934296

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310620836.0A Pending CN117170190A (en) 2022-06-03 2023-05-30 Exposure apparatus, method for producing article, and exposure method

Country Status (3)

Country Link
JP (1) JP2023177758A (en)
KR (1) KR20230168138A (en)
CN (1) CN117170190A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018066956A (en) 2016-10-21 2018-04-26 キヤノン株式会社 Illumination optical system, exposure apparatus and production method of article

Also Published As

Publication number Publication date
JP2023177758A (en) 2023-12-14
KR20230168138A (en) 2023-12-12

Similar Documents

Publication Publication Date Title
CN107621749B (en) Mask, measuring method, exposure method, and article manufacturing method
EP3392903A1 (en) Variable slit device, illumination device, exposure apparatus, exposure method, and device manufacturing method
JP2004327660A (en) Scanning projection aligner, exposure method, and device manufacturing method
JP6261207B2 (en) Exposure apparatus, exposure method, and device manufacturing method using them
US8384900B2 (en) Exposure apparatus
KR100849870B1 (en) Scanning exposure method and scanning exposure apparatus
US6172740B1 (en) Projection exposure apparatus and device manufacturing method
JP3200244B2 (en) Scanning exposure equipment
EP1443364B1 (en) Projection exposure apparatus
JPH113856A (en) Method and device for projection exposure
JP3460129B2 (en) Exposure apparatus and exposure method
KR101870001B1 (en) Exposure apparatus, exposure method, and device manufacturing method
JP6243616B2 (en) Exposure apparatus and article manufacturing method
CN117170190A (en) Exposure apparatus, method for producing article, and exposure method
JP2000114164A (en) Scanning projection aligner and manufacture of device using the same
JP6139870B2 (en) Exposure method, exposure apparatus, and article manufacturing method
JP6581417B2 (en) Exposure apparatus, exposure method, and article manufacturing method
JP2022142981A (en) Exposure apparatus, exposure method, and production method of article
US6562528B2 (en) Method for determining and calibrating image plane tilt and substrate plane tilt in photolithography
JP5632685B2 (en) Exposure apparatus and device manufacturing method
JP3530716B2 (en) Scanning projection exposure equipment
JP3473767B2 (en) Scanning projection exposure apparatus and element manufacturing method using the apparatus
JP6570298B2 (en) Illumination optical system, exposure apparatus, and device manufacturing method
CN114063393A (en) Adjustment method, exposure apparatus, and article manufacturing method
CN116482946A (en) Exposure method, exposure apparatus, and method for manufacturing article

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication