JP2017028601A - Crystal vibration element aggregation wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a crystal vibration element aggregation wafer where a crystal vibration element can be separated from the frame thereof reliably, even when an electrode composed of a metal film for used in the characteristic measurement of the crystal vibration element is formed on the surface of a coupling part.SOLUTION: A crystal vibration element aggregation wafer 100 includes a frame 160, a crystal vibration element 110, a first coupling part 120 and a second coupling part 130 connecting the frame 160 and individual crystal vibration elements 110, a first through hole 140, a first bridge 121 and a second bridge 122 and a second through hole 123 provided in the first coupling part 120, a third bridge 131 and a fourth bridge 132 and a third through hole 133 provided in the second coupling part 130, a first groove 124 provided in at least any one of the first bridge 121 and second bridge 122, and a second groove 134 provided in at least any one of the third bridge 131 and fourth bridge 132.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a crystal vibration element assembly wafer in which crystal vibration elements are integrated and configured integrally.

  A crystal resonator element is mounted inside a crystal resonator or crystal oscillator, which is one of electronic components. The quartz resonator element includes a quartz base plate, a first electrode, a second electrode, and a conductive wiring pattern provided on the surface of the quartz base plate. The quartz base plate is a thin plate, and the outer shape in plan view is, for example, a circular shape, a square shape, or a tuning fork shape. The first electrode is provided at a predetermined position on the surface of the quartz base plate and excites at least a part of the quartz base plate. The conductive wiring pattern is provided on the surface of the quartz base plate so as to electrically connect, for example, a predetermined first electrode and a predetermined second electrode described later. The second electrode is provided at a predetermined position on the surface of the crystal base plate, and electrically connects the crystal resonator element and the container on which the crystal resonator element is mounted. In the case of manufacturing such a crystal resonator element, a crystal resonator element assembly wafer in which a plurality of crystal resonator elements are integrated and integrated is used.

  For example, a conventional crystal resonator element assembly wafer includes a plurality of crystal base plates that can be folded from a crystal wafer left by etching from a crystal substrate, a support portion, and a crystal base plate connected to the support portion. 1 connection part and 2nd connection part, The 1st electrode, the 2nd electrode, and the conductive wiring pattern are formed in the surface of this quartz base plate, This 1st connection part and said 2nd Are connected so as to extend from one short side of the crystal base plate along the direction in which the pair of long sides of the crystal base plate extends, and with the crystal base plate of the first connection portion The connection portion is provided with a bottomed groove only on one main surface, and the connection portion with the crystal base plate of the second coupling portion is provided with a bottomed groove only on the other main surface. (For example, refer to Patent Document 1).

JP 2010-178320 A

  When separating individual crystal resonator elements from a crystal resonator element assembly wafer on which a plurality of crystal resonator elements are formed as in the prior art, a connecting portion that connects the crystal resonator element and the frame portion of the crystal resonator element assembly wafer The quartz resonator element is separated from the frame portion of the quartz resonator element assembly wafer by folding the substrate. However, when a metal film used for measuring the characteristics of the crystal resonator element is formed on the surface of the connecting portion, even if the connecting portion is broken when the crystal resonator element is folded at the connecting portion, it is formed on the surface. The metal film remains connected due to the ductility of the metal, and there is a possibility that the crystal resonator element cannot be completely separated from the frame portion of the crystal resonator element assembly wafer.

  Therefore, the present invention provides a crystal that can reliably separate the crystal resonator element from the frame portion of the crystal resonator element assembly wafer even when the metal film used for measuring the characteristics of the crystal resonator element is formed on the surface of the connecting portion. An object of the present invention is to provide a vibrating element assembly wafer.

  The quartz resonator element assembly wafer according to the present invention is arranged in a plurality of rows in a flat frame portion having a rectangular shape in outer periphery and inner periphery in plan view, and in a space surrounded by the frame portion. A flat and rectangular crystal resonator element in plan view with two electrodes formed thereon, arranged along one side where the second electrode of each crystal resonator element is provided, and one side of the inner periphery of the frame portion, and each crystal A first connecting part and a second connecting part connected so as to extend from one side where the second electrode of the vibration element is provided, and a first penetration provided between the first connecting part and the second connecting part A hole, a third electrode extending from the second electrode through the surface of the first connecting portion and the second connecting portion to the surface of the frame portion, and both ends of the first connecting portion in the short side direction of the crystal resonator element The first and second bridge sections, and the second through hole provided between the first and second bridge sections. , A third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion, and a third portion provided between the third bridge portion and the fourth bridge portion. A through-hole, a first groove provided in at least one of the first bridge part or the second bridge part, and a second groove provided in at least one of the third bridge part or the fourth bridge part And.

  The quartz resonator element assembly wafer according to the present invention is arranged in a plurality of rows in a flat frame portion having a rectangular shape in outer periphery and inner periphery in plan view, and in a space surrounded by the frame portion. A flat and rectangular crystal resonator element in plan view with two electrodes formed thereon, arranged along one side where the second electrode of each crystal resonator element is provided, and one side of the inner periphery of the frame portion, and each crystal A first connecting part and a second connecting part connected so as to extend from one side where the second electrode of the vibration element is provided, and a first penetration provided between the first connecting part and the second connecting part A hole, a third electrode extending from the second electrode through the surface of the first connecting portion and the second connecting portion to the surface of the frame portion, and both ends of the first connecting portion in the short side direction of the crystal resonator element The first and second bridge sections, and the second through hole provided between the first and second bridge sections. , A third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion, and a third portion provided between the third bridge portion and the fourth bridge portion. A through-hole, a first groove provided in at least one of the first bridge part or the second bridge part, and a second groove provided in at least one of the third bridge part or the fourth bridge part And are provided. In such a configuration, since the film thickness of the third electrode of the first connecting portion and the second connecting portion can be partially reduced, the crystal resonator element can be reliably separated from the crystal resonator element assembly wafer. It becomes.

1 is a plan view showing a crystal resonator element assembly wafer according to an embodiment of the present invention. It is the elements on larger scale which expanded and showed the circle A part described in FIG. It is sectional drawing cut | disconnected by the BB line shown in FIG. FIG. 6 is a partial enlarged view showing, in an enlarged manner, the same portion as the circle A portion shown in FIG. 1 in the first modification of the crystal resonator element assembly wafer according to the embodiment of the present invention. FIG. 9 is a partially enlarged view showing, in an enlarged manner, the same portion as the circle A portion shown in FIG. 1 in a second modification of the quartz resonator element assembly wafer according to the embodiment of the present invention. It is sectional drawing cut | disconnected by the CC line | wire shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a crystal resonator element assembly wafer according to an embodiment of the present invention. FIG. 2 is a partially enlarged view showing the virtual circle A portion shown in FIG. 1 in an enlarged manner. FIG. 3 is a cross-sectional view taken along the virtual cutting line BB described in FIG. In addition, in each figure of FIGS. 1-6, in order to clarify description, a part of structure is not shown and the dimension is partially exaggerated and shown. In particular, the thickness direction of the cross section in FIGS. 3 and 6 is greatly exaggerated. In addition, in order to simplify the explanation, in FIGS. 1, 2, 4 and 5, the surface side shown in the drawing is the upper side, the opposite side is the lower side, and in FIGS. 3 and 6, the sheet on which the drawings are described. The upper part is described as the upper part of the crystal vibration element assembly wafer.

  As shown in FIGS. 1 to 3, the crystal vibration element assembly wafer 100 includes a crystal vibration element 110, a first bridge portion 121, a second bridge portion 122, a second through hole 123, and a first groove portion 124. A connecting portion 120, a third bridge portion 131, a fourth bridge portion 132, a second connecting portion 130 having a third through hole 133 and a second groove portion 134, a first through hole 140, a third electrode 150, The frame portion 160 is configured. The crystal vibration element assembly wafer 100 is used to simultaneously manufacture a plurality of crystal vibration elements 110 mounted in a crystal device in the process of manufacturing a crystal device such as a crystal resonator or a crystal oscillator.

  The crystal resonator element 110 has a first electrode 112 used for excitation of the crystal base plate 111 and a short side of the crystal base plate 111 drawn from the first electrode 112 on each of an upper surface and a lower surface of the crystal base plate 111. The second electrode 113 is attached and plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

  The quartz base plate 111 has a rectangular shape in plan view. For example, in a rectangular coordinate system composed of an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis), the Z axis is -Y with the Y axis. When the axis tilted in the direction is the Z ′ axis and the Y axis is the Y ′ axis is the axis tilted in the + Z direction of the Z axis, the parallel top and bottom with the X axis direction as the long side and the Z ′ axis direction as the short side It consists of an AT-cut thin plate composed of the XZ ′ plane and having a thickness parallel to the Y ′ axis.

  The first electrode 112 is for causing the crystal base plate 111 to be excited in a predetermined vibration mode and frequency when an alternating voltage from the outside is applied to the crystal base plate 111 via the first electrode 112. The first electrode 112 is provided at a substantially central portion of the upper surface and the lower surface of the quartz base plate 111 so as to face each other between the upper surface and the lower surface.

  The second electrode 113 is for transmitting an alternating voltage from the outside to each first electrode 112. The second electrode 113 includes one short side of the two short sides of the crystal base plate 111 from each of the first electrode 112 provided on the top surface of the crystal base plate 111 and the first electrode 112 provided on the bottom surface. It extends so that it may not oppose between an upper surface and a lower surface to the edge part.

  The first electrode 112 and the second electrode 113 are formed at predetermined positions on the crystal base plate 111 using, for example, a photolithography technique and an etching technique. Specifically, a metal film to be the first electrode 112 and the second electrode 113 is formed on both main surfaces of the crystal vibrating element assembly wafer 100 on which the portions to be the plurality of crystal base plates 111 are formed. A photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed so that a predetermined pattern of this photosensitive resist (a portion to become the first electrode 112 and the second electrode 113) remains. Finally, the exposed metal film is peeled off, and the remaining photosensitive resist is removed. In this way, the first electrode 112 and the second electrode 113 are formed at predetermined positions of the portion to be the crystal element plate 111 of the crystal vibrating element assembly wafer 100 in which the portions to be the plurality of crystal element plates 111 are formed. Is done. Here, the case where the film is formed using the photolithography technique and the etching technique is described, but the film may be formed using, for example, a sputtering technique or a vapor deposition technique.

  The first electrode 112 and the second electrode 113 are formed so that silver or gold is laminated on chromium. By using chrome for the base, it is possible to ensure adhesion between the crystal base plate 111 and the first electrode 112 and the second electrode 113 while also ensuring adhesion with gold or silver.

  The first connecting part 120, together with the second connecting part 130 described later, mechanically connects the crystal vibrating element 110 and the frame part 160 of the crystal vibrating element assembly wafer 100, thereby the crystal vibrating element 110 described later. Used to support 160. The first connecting portion 120 extends from one short side where the second electrode 112 of the crystal resonator element 110 is provided along one of the two sides in the length direction of the crystal resonator element 110 to the one short side. The frame portion 160 is provided so as to extend to the front. The first connecting part 120 is formed integrally with the crystal resonator element 110 and the frame part 160. The first connecting part 120 includes a first bridge part 121, a second bridge part 122, a second through hole 123, and a first groove part 124.

  The first bridge portion 121 and the second bridge portion 122 can absorb and distribute impacts and the like from the outside to the first bridge portion 121 and the second bridge portion 122, and maintain the rigidity of the entire first connecting portion 120. It is used to The first bridge portion 121 and the second bridge portion 122 are arranged so that the first bridge portion 121 is placed on one long side of the crystal resonator element 110 so as to sandwich a second through hole 123 described later in the first connection portion 120. The bridge portion 122 is provided so as to be on the second connecting portion 130 side provided in the same crystal resonator element 110. The thickness of the 1st bridge part 121 and the 2nd bridge part 122 except the part in which the 1st groove part 124 mentioned later is provided is the same as the thickness of the crystal vibration element 110 and the frame part 160, The thickness dimension is 20-20. It is 70 μm.

  The second through-hole 123 is for making it easier to fold the crystal resonator element 110 from the first connecting portion 120. The second through-hole 123 is a hole that is provided substantially at the center of the first connecting portion 120 and penetrates the first connecting portion 120 from the upper surface to the lower surface. Moreover, the upper surface side opening part shape of the 2nd through-hole 123 and the lower surface side opening part shape are the same shapes. By providing the second through hole 123, the rigidity of only a predetermined portion of the first connecting portion 120 can be weakened, and will be described later when the crystal resonator element 110 is folded from the frame portion 160 in the first connecting portion 120. By folding at the first groove portion 124 and the second through hole 123, the folding position can be arbitrarily controlled.

  The first groove portion 124 is for making it easier to break the crystal resonator element 110 from the first connecting portion 120, and is for reducing burrs from adhering to the crystal resonator element 110 after being broken. is there. The first groove portion 124 is provided with a bottom with the second bridge portion 122, for example. The opening of the first groove portion 124 is provided on the upper surface or the lower surface of the second bridge portion 122. The depth of the 1st groove part 124 exists in the range of 30 to 70% of the thickness of the 2nd bridge part 122, as shown in FIG. The first groove portion 124 may be provided in the first bridge portion 122. However, when the first groove portion 124 is provided in the first bridge portion 121, when the crystal vibrating element 110 is broken and a burr is generated, the burr is formed on the second bridge portion 122 side where the first groove portion 124 is not provided. There is a high possibility that it will occur near the center of one short side of a certain crystal resonator element 110. In the crystal resonator element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is greater than the outer shape abnormality at each side edge, that is, near the corner of the crystal resonator element, rather than the outer shape abnormality at the center of each side. Is smaller. Therefore, it is more preferable to provide the first groove portion 124 in the second bridge portion 122 than in the first bridge portion 121. In addition, the position where the first groove portion 124 is provided is desirably a position offset as far as possible to the crystal vibrating element 110 side of the second bridge portion 122.

  The second connecting portion 130, together with the first connecting portion 120 described above, mechanically connects the crystal resonator element 110 and the frame portion 160 of the crystal resonator element assembly wafer 100, whereby the crystal resonator element 110 will be described later. Used to support 160. The second connecting portion 130 extends from one short side where the second electrode 113 of the crystal resonator element 110 is provided along the other side of the two sides in the length direction of the crystal resonator element 110 to the one short side. The frame portion 160 is provided so as to extend to the front. The second connecting portion 130 is formed integrally with the crystal resonator element 110 and the frame portion 160. The second connecting portion 130 includes a third bridge portion 131, a fourth bridge portion 132, a third through hole 133, and a second groove portion 134.

  The third bridge portion 131 and the fourth bridge portion 132 can absorb and absorb the impact etc. from the outside to the third bridge portion 131 and the fourth bridge portion 132, and maintain the rigidity of the entire second connecting portion 130. It is used to The third bridge portion 131 and the fourth bridge portion 132 are arranged on the other long side of the crystal resonator element 110 so that the third through hole 133 described later is sandwiched in the second connecting portion 130. The bridge portion 132 is provided so as to be on the first connecting portion 120 side provided in the same crystal resonator element 110. The thickness of the third bridge portion 131 and the fourth bridge portion 132 excluding the portion where the second groove portion 134 to be described later is provided is the same as the thickness of the crystal resonator element 110 and the frame portion 160, and the thickness dimension thereof is 20 It is -70 micrometers.

  The third through-hole 133 is for facilitating the folding of the crystal resonator element 110 from the second connecting portion 130. The third through hole 133 is a hole that is provided substantially at the center of the second connecting portion 130 and penetrates the second connecting portion 130 from the upper surface to the lower surface. Moreover, the upper surface side opening shape and the lower surface side opening shape of the third through-hole 133 are the same shape. By providing the third through-hole 133, the rigidity of only a predetermined portion of the second connecting portion 130 can be weakened, and when the crystal resonator element 110 is folded from the frame portion 160 in the second connecting portion 130, By folding at the three through-holes 133, the folding position can be arbitrarily controlled.

  The second groove portion 134 is for making it easier to fold the crystal resonator element 110 from the second connecting portion 130, and for reducing burrs from adhering to the crystal resonator element 110 after being broken. is there. The second groove part 134 is provided with a bottom in the fourth bridge part 132, for example. The opening of the second groove portion 134 is provided on the upper surface or the lower surface of the fourth bridge portion 132. As shown in FIG. 3, the depth of the second groove portion 134 is in the range of 30 to 70% of the thickness of the fourth bridge portion 132. The second groove part 134 may be provided in the third bridge part 131. However, when the second groove portion 134 is provided in the third bridge portion 131, when the burr is generated by breaking the crystal resonator element 110, the burr is formed on the fourth bridge portion 132 side where the second groove portion 134 is not provided. There is a high possibility that it will occur near the center of one short side of a certain crystal resonator element 110. In the crystal resonator element 110, the degree of the adverse effect on the main vibration mode due to the outer shape abnormality such as burrs is greater than the outer shape abnormality at each side edge, that is, near the corner of the crystal resonator element, rather than the outer shape abnormality at the center of each side. Is smaller. Therefore, it is more preferable to provide the second groove portion 134 in the fourth bridge portion 132 than in the third bridge portion 131. In addition, the position where the second groove portion 134 is provided is desirably a position offset as far as possible to the crystal vibrating element 110 side of the fourth bridge portion 132.

  A first through hole 140 is provided between the first connecting part 120 and the second connecting part 130. The first through hole 140 is a hole penetrating from the upper surface to the lower surface of the crystal resonator element assembly wafer 100, and the first connecting portion 120 and the second connecting portion 130 are symmetrical with respect to the first through hole 140. It is configured.

  The frame portion 160 is a thin plate made of crystal, and supports the plurality of crystal resonator elements 110 provided with the first connecting portion 120 and the second connecting portion 130 while maintaining the rigidity of the entire crystal resonator element assembly wafer 100. belongs to. The frame portion 160 includes an outer frame 161 and a crosspiece portion 162, and is configured integrally with a plurality of crystal resonator elements 110 provided with the first connecting portion 120 and the second connecting portion 130.

  The outer frame 161 is provided so as to surround four sides of the entire crystal resonator element assembly wafer 100. The outer peripheral shape in plan view is rectangular, and has a predetermined width for having the required rigidity. The crosspieces 162 are provided so as to connect two opposing sides of the inner periphery of the outer frame 161, and a plurality of the crosspieces 162 are provided in parallel with a certain interval. The inner peripheral shape of the frame portion 160 composed of the outer frame 161 and the crosspiece portion 162 is also rectangular.

  In the crystal resonator element 110 provided with the first connecting portion 120 and the second connecting portion 130, the long sides of the adjacent crystal resonator elements 110 are parallel in the space formed by the inner periphery of the outer frame 161 and the crosspiece 162. Are arranged side by side in the same direction. Further, the first connecting portion 120 and the second connecting portion 130 provided in each of the crystal resonator elements 110 are ends opposite to the end portions of the first connecting portion 120 and the second connecting portion 130 on the crystal resonator element 110 side. The part is connected to the inner periphery of the crosspiece 162 or the outer frame 161 located opposite to the end.

  The third electrode 150 is used as a terminal for measuring a characteristic value such as frequency or CI (crystal impedance) of each crystal resonator element 110 in the state of the crystal resonator element assembly wafer 100. In a state where a plurality of crystal resonator elements 110 are arranged and connected in the crystal resonator element assembly wafer 100, the third electrode 150 is connected to the first connecting portion 120 and the second electrode 113 provided on each crystal resonator element 110. The surface extends from the surface of the second connecting portion 130 to the surfaces of the outer frame 161 and the crosspiece 162 to which the first connecting portion 120 and the second connecting portion 130 are connected. The thickness of the third electrode 150 formed inside the first groove portion 124 and the second groove portion 134 is the thickness of the third electrode 150 formed in the other portion constituting the first connecting portion 120 or the second connecting portion 130. Compared to, it is very thin.

  The third electrode 150 is formed at a predetermined position of the first connecting portion 120, the second connecting portion 130, and the frame portion 160 simultaneously with the first electrode 112 and the second electrode 113 by using, for example, a photolithography technique and an etching technique. It is formed. Specifically, a metal film that becomes the third electrode 150 together with the first electrode 112 and the second electrode 113 is formed on both main surfaces of the crystal vibrating element assembly wafer 100 in which portions to be the plurality of crystal base plates 111 are formed. A film is formed, and a photosensitive resist is applied on the metal film. Thereafter, exposure and development are performed so that a predetermined pattern of this photosensitive resist (portions that become the first electrode 112, the second electrode 113, and the third electrode 150) remains. Finally, the exposed metal film is peeled off, and the remaining photosensitive resist is removed. In this way, the third electrode 150 is formed at a predetermined position of the portion that becomes the first connection portion 120, the second connection portion 130, and the frame portion 160 of the crystal vibration element assembly wafer 100. Here, the case where the film is formed using the photolithography technique and the etching technique is described, but the film may be formed using, for example, a sputtering technique or a vapor deposition technique.

  The third electrode 150 is formed so that silver or gold is laminated on chromium. The third electrode 150 uses chromium as a base to ensure adhesion between the first connection part 120, the second connection part 130, the frame part 160, and the third electrode 150, and to adhere to gold or silver. Can also be secured.

  A quartz crystal resonator element assembly wafer 100 according to an embodiment of the present invention has a flat frame portion 160 whose outer and inner peripheral shapes are rectangular in plan view, and a plurality of the wafers arranged in a space surrounded by the frame portion 160. Are arranged along one side where the second electrode 113 of each crystal resonator element 110 is provided, and a rectangular plate-like crystal resonator element 110 having at least a first electrode 112 and a second electrode 113 formed in a plan view. The first connecting portion 120 and the second connecting portion 130 that are connected so as to extend from one side of the inner periphery of the frame portion 160 and one side where the second electrodes 113 of the individual crystal resonator elements 110 are provided. The first through-hole 140 provided between the connecting part 120 and the second connecting part 130 and the surface extending from the second electrode 113 to the surface of the frame part 160 through the surfaces of the first connecting part 120 and the second connecting part 130. Third electrode 15 provided A first bridge part 121 and a second bridge part 122 provided at both ends in the short side direction of the crystal resonator element 110 of the first connecting part 120, and the first bridge part 121 and the second bridge part 122 A second through-hole 123 provided therebetween, a third bridge portion 131 and a fourth bridge portion 132 provided at both ends of the crystal resonator element 110 of the second connecting portion 130 in the short side direction, and the third bridge A third through-hole 133 provided between the part 131 and the fourth bridge part 132, a first groove part 124 provided in at least one of the first bridge part 121 and the second bridge part 122, A second groove portion 134 provided in at least one of the three bridge portions 131 and the fourth bridge portion 132 is provided.

  With such a configuration, the amount of the metal constituting the third electrode 150 inside the first groove portion 124 and the second groove portion 134 provided by vapor deposition and sputtering is the same as that of the first groove portion 124 and the second groove portion 134 by masking. The amount of metal adhering to the side portions of the first connecting portion 120 and the other portions of the second connecting portion 130 is less due to the influence of less metal wrapping around the side surface, and the thickness of the third electrode 150 can be reduced. it can. Accordingly, when the first connecting portion 120 and the second connecting portion 130 are folded at the position where the first groove portion 124 and the second groove portion 134 are formed, the film thickness of the third electrode 150 is thin, The formed third electrode 150 can significantly reduce the influence of the ductility of the metal, and the first connecting portion 120 and the second connecting portion 130 and the third electrode 150 formed on the surface thereof can be folded simultaneously. It becomes possible.

  In addition, the crystal resonator element assembly wafer 100 according to the embodiment of the present invention includes a plurality of frame portions 160 that surround a space in which the crystal resonator element 110 is disposed by the outer frame 161 and the crosspiece portion 162 that constitute the frame portion 160. Adjacent to each other. With such a configuration, even when the crystal resonator element wafer 100 is enlarged, a large number of crystal resonator elements 110 can be disposed inside while maintaining the rigidity of the entire wafer.

(First modification)
FIG. 4 is a partially enlarged view showing the same place as the virtual circle A shown in FIG. 1 in the crystal resonator element assembly wafer according to the first modification of the embodiment described above. Further, as shown in FIG. 4, the crystal vibrating element assembly wafer 100 according to the first modification of the above-described embodiment has an outer side of the first bridge portion 121 on an extension line of one long side of the crystal vibrating element 110. The first bridge part 121 is provided outside the first connecting part 120 so that the one side outside the third bridge part 131 is on the extended line of one long side of the crystal resonator element 110. It differs from the above-described embodiment in that the third bridge portion 131 is provided outside the second connecting portion 130 so as to be positioned.

  With such a configuration, even when the crystal resonator element 110 is folded, even if a part of the first connecting portion 120 or the second connecting portion 130 is attached to the crystal resonator element 110, it is attached. The position is only near the corner where the vibration mode of the crystal resonator element 110 has little influence. Therefore, the broken crystal resonator element 110 can vibrate only in a desired vibration mode.

  In the crystal vibration element assembly wafer 100 according to the first modification of the embodiment, the first connecting portion 120 is arranged such that one side outside the first bridge portion 121 is positioned on an extension line of one long side of the crystal vibration element 110. The first bridge portion 121 is provided outside the first connecting portion 130, and the outer side of the second connecting portion 130 is positioned such that one side of the third bridge portion 131 is located on the extended line of one long side of the crystal resonator element 110. The third bridge 131 is provided on the side. With such a configuration, when the crystal resonator element 110 is folded, even if a part of the first connecting portion 120 or the second connecting portion 130 is attached to the crystal resonator element, the attached position However, it can be limited to the vicinity of the corner portion where the vibration mode of the crystal resonator element 110 is less affected. Therefore, the broken crystal resonator element 110 can vibrate only in a desired vibration mode.

(Second modification)
FIG. 5 is a partially enlarged view showing the same place as the virtual circle A shown in FIG. 1 in the crystal resonator element wafer according to the second modification of the embodiment described above. 6 is a cross-sectional view taken along the virtual cutting line CC shown in FIG.
As shown in FIG. 5, the crystal vibrating element assembly wafer 100 according to the second modification of the above-described embodiment has one of the first bridge portion 121 and the second bridge portion 122 provided with the first groove portion 124. A notch 170 extending from the upper surface to the lower surface of each bridge portion is provided in the bridge portion and the bridge portion of the third bridge portion 131 or the fourth bridge portion 132 where the second groove portion 134 is provided. This is different from the above-described embodiment.

  The notch 170 is for making it easier to fold the quartz resonator element 110 from the first connecting portion 120 and the second connecting portion 130, and to prevent the burrs from adhering to the quartz resonator element 110 after being broken. It is for reducing. As illustrated in FIG. 5, the notch portion 170 includes, for example, a first notch portion 171 provided in the second bridge portion 122 and a second notch portion 172 provided in the fourth bridge portion 132. . The first notch portion 171 is located at a position corresponding to the location where the first groove portion 124 of the second bridge portion 122 is provided from the side surface on the first through hole 140 side toward the side surface on the second through hole 123 side. The first notch 171 has one end opened on the upper surface of the second bridge portion 122 and the other end opened on the lower surface of the second bridge portion 122. Further, the second notch portion 172 is formed at a position corresponding to the location where the second groove portion 134 of the fourth bridge portion 132 is provided, from the side surface of the fourth bridge portion 132 on the first through hole 140 side to the third penetration. The second notch 172 is open at the top surface of the fourth bridge portion 132 and the other end is open at the bottom surface of the fourth bridge portion 132. In addition, the shape of the upper surface side opening end portion of the first cutout portion 171 is the same as the shape of the lower surface side opening end portion.

  In addition, the depth dimension α1 from the first through hole 140 side opening of the second bridge portion 122 to the notch end portion on the second through hole 123 side in the first notch portion 171 is the width of the second bridge portion 122. It is desirable to be within a range of 25 to 75% of the dimension β1. In addition, the depth dimension α2 from the first through hole 140 side opening of the fourth bridge portion 132 to the notch end portion on the third through hole 133 side in the second notch portion 172 is the width of the fourth bridge portion 132. It is desirable to be within a range of 25 to 75% of the dimension β2.

  In addition, the notch part 170 which comprises the 1st notch part 171 and the 2nd notch part 172 is the bridge part by which the 1st groove part 124 is provided among the 1st bridge part 121 or the 2nd bridge part 122. Of the third bridge part 131 or the fourth bridge part 132, the bridge part provided with the second groove part 134 is provided from the upper surface to the lower surface of the bridge part. By doing so, the crystal resonator element 110 is provided with the first connecting portion 120 including the first bridge portion 121 and the second bridge portion 122, and the second bridge portion including the third bridge portion 131 and the fourth bridge portion 132. This is intended to make it easier to break off from the connecting portion 130, and it is possible to reduce burrs from adhering to the crystal resonator element 110 after being broken.

  In addition, the notch portion 170 that constitutes the first notch portion 171 and the second notch portion 172, particularly the second bridge portion 122 provided with the first groove portion 124 and the fourth portion provided with the second groove portion 134. Even if burrs are formed on the crystal resonator element 110 after being broken by providing the bridge portion 132, burrs are likely to be formed at the corners of the crystal resonator element 110, and an adverse effect on the main vibration mode due to an external shape abnormality. The crystal vibration element 110 that is further smaller than the notch portion provided in the first bridge portion 121 and the third bridge portion 131 and vibrates in a desired main vibration mode can be obtained.

  Further, the position where the notch 170 is provided is the position offset to the quartz resonator element 110 side of the second bridge portion 122 and the fourth bridge portion 132 as much as possible, similarly to the first groove portion 124 and the second groove portion 134. It is desirable. With such a configuration, when the crystal resonator element 110 is separated from the crystal resonator element assembly wafer 100 at the position where the notch 170 is formed, most of the first connecting portion 120 and the second connecting portion 130 are crystal resonator elements. The crystal resonator element 110 having a desired outer shape in which the first connecting portion 120 and the second connecting portion 130 are not attached to the crystal resonator element 110 can be obtained in the state left on the frame portion 160 side of the collective wafer 100. . Therefore, it is possible to suppress the influence of the unnecessary vibration mode due to the unauthorized outer shape that is generated when the crystal resonator element 110 is vibrated.

  In the crystal vibration element assembly wafer 100 according to the second modification of the embodiment, the first bridge portion 121 or the second bridge portion 122 in which the first groove portion 124 is provided, and the third bridge portion. Of the 131 or the fourth bridge part 132, the bridge part in which the second groove part 134 is provided may be provided with a notch part from the upper surface to the lower surface of the bridge part. By doing so, the crystal resonator element 110 is provided with the first connecting portion 120 including the first bridge portion 121 and the second bridge portion 122, and the second bridge portion including the third bridge portion 131 and the fourth bridge portion 132. This is intended to make it easier to break off from the connecting portion 130, and it is possible to reduce burrs from adhering to the crystal resonator element 110 after being broken.

  In the crystal vibration element assembly wafer 100 according to the second modification of the embodiment, the notch portion 170 is provided with the first bridge portion 121 or the second bridge portion 122 provided with the first groove portion 124 and the second groove portion 134. The third bridge portion 131 or the fourth bridge portion 132 is provided at a position offset toward the crystal resonator element 110 side. With such a configuration, when the crystal resonator element 110 is separated from the crystal resonator element assembly wafer 100 at the position where the notch 170 is formed, most of the first connecting portion 120 and the second connecting portion 130 are formed. The crystal resonator element 110 having a desired outer shape in which the first connecting portion 120 and the second connecting portion 130 are not attached to the crystal resonator element 110 is obtained in the state left on the frame 160 side of the crystal resonator element assembly wafer 100. be able to. Therefore, it is possible to suppress the influence of the unnecessary vibration mode due to the unauthorized outer shape that is generated when the crystal resonator element 110 is vibrated.

  The present invention is not limited to the above-described embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the quartz resonator element 110 has an AT cut and has a rectangular outer shape in plan view, but may be processed by another cut angle. The outer shape may also be a crystal resonator element having another outer shape such as a tuning fork shape.

DESCRIPTION OF SYMBOLS 100 ... Quartz vibration element assembly wafer 110 ... Quartz vibration element 111 ... Crystal base plate 112 ... First electrode 113 ... Second electrode 120 ... First connection part 121 ... First One bridge part 122 ... Second bridge part 123 ... Second through hole 124 ... First groove part 130 ... Second connecting part 131 ... Third bridge part 132 ... Fourth bridge part 133 ... 3rd through-hole 134 ... 2nd groove part 140 ... 1st through-hole 150 ... 3rd electrode 160 ... frame part 161 ... outer frame 170 ... notch part

Claims (5)

The outer periphery and the inner periphery shape are rectangular in plan view, and a flat frame portion;
A plurality of crystal resonator elements arranged in a space surrounded by the frame portion and having a rectangular shape in plan view in which at least a first electrode and a second electrode are formed on the surface, and
It is arranged along one side where the second electrodes of the individual crystal resonator elements are provided, and extends from one side of the inner periphery of the frame portion and one side where the second electrodes of the individual crystal resonator elements are provided. A first connecting portion and a second connecting portion that are connected so as to come out,
A first through hole provided between the first connecting portion and the second connecting portion;
A third electrode extending from the second electrode to the surface of the frame portion through the surfaces of the first connection portion and the second connection portion;
A first bridge portion and a second bridge portion provided at both ends in the short side direction of the crystal resonator element of the first connection portion;
A second through hole provided between the first bridge portion and the second bridge portion;
A third bridge portion and a fourth bridge portion provided at both ends in the short side direction of the crystal resonator element of the second connecting portion;
A third through hole provided between the third bridge portion and the fourth bridge portion;
A first groove provided in at least one of the first bridge and the second bridge; and
A second groove provided in at least one of the third bridge part or the fourth bridge part;
A quartz vibrating element assembly wafer characterized by comprising:   The frame portion is composed of an outer frame and a crosspiece, and a plurality of spaces surrounded by the frame made up of the outer frame and the crosspiece are provided adjacent to each other. The quartz crystal vibration element assembly wafer according to claim 1.   The first bridge portion is provided outside the first connecting portion so that one side outside the first bridge portion is located on an extension line of one long side of the crystal resonator element. The bridge portion is provided outside the second connecting portion so that one side outside the third bridge portion is positioned on an extension line of one long side of the crystal resonator element. Item 3. The crystal vibration element assembly wafer according to Item 1 or 2.   4. The crystal resonator element according to claim 1, wherein the first groove portion and the second groove portion are provided at positions offset to the crystal resonator element side of each bridge portion. 5. Collective wafer.   The first bridge part or the second bridge part in which the first groove part is provided, and the third bridge part or the fourth bridge part in which the second groove part is provided, each bridge part has The cutout portion from the upper surface to the lower surface is provided corresponding to the position where the first groove portion and the second groove portion are provided. The described quartz vibration element assembly wafer.

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