JP2017019983A5 - - Google Patents

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Publication number
JP2017019983A5
JP2017019983A5 JP2015201385A JP2015201385A JP2017019983A5 JP 2017019983 A5 JP2017019983 A5 JP 2017019983A5 JP 2015201385 A JP2015201385 A JP 2015201385A JP 2015201385 A JP2015201385 A JP 2015201385A JP 2017019983 A5 JP2017019983 A5 JP 2017019983A5
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JP
Japan
Prior art keywords
resin composition
composition according
cured product
benzoxazine resin
item
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JP2015201385A
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English (en)
Japanese (ja)
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JP6656870B2 (ja
JP2017019983A (ja
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Publication of JP2017019983A5 publication Critical patent/JP2017019983A5/ja
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JP2015201385A 2015-07-10 2015-10-09 ベンゾオキサジン樹脂組成物、その製造方法、及び該組成物の用途 Active JP6656870B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015139147 2015-07-10
JP2015139147 2015-07-10

Publications (3)

Publication Number Publication Date
JP2017019983A JP2017019983A (ja) 2017-01-26
JP2017019983A5 true JP2017019983A5 (es) 2018-09-06
JP6656870B2 JP6656870B2 (ja) 2020-03-04

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JP2015201385A Active JP6656870B2 (ja) 2015-07-10 2015-10-09 ベンゾオキサジン樹脂組成物、その製造方法、及び該組成物の用途

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JP (1) JP6656870B2 (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190119434A1 (en) 2015-07-10 2019-04-25 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition, process for producing same, and uses of said composition
KR102459583B1 (ko) * 2017-01-10 2022-10-28 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
JP6553311B2 (ja) * 2017-01-10 2019-07-31 住友精化株式会社 エポキシ樹脂組成物
US20200385514A1 (en) * 2017-01-10 2020-12-10 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
US11292872B2 (en) 2017-01-10 2022-04-05 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
EP3569626B1 (en) 2017-01-10 2023-03-01 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
CN111072886B (zh) * 2019-11-30 2022-09-02 长沙新材料产业研究院有限公司 一种低介电苯并噁嗪及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10001228B4 (de) * 2000-01-13 2007-01-04 3M Espe Ag Polymerisierbare Zubereitungen auf der Basis von siliziumhaltigen Epoxiden
GB2444010B (en) * 2005-09-15 2010-12-08 Sekisui Chemical Co Ltd Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2009097013A (ja) * 2007-09-27 2009-05-07 Hitachi Chem Co Ltd 封止用液状樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
WO2010035451A1 (ja) * 2008-09-24 2010-04-01 積水化学工業株式会社 半硬化体、硬化体、積層体、半硬化体の製造方法及び硬化体の製造方法
JP5310656B2 (ja) * 2010-06-18 2013-10-09 信越化学工業株式会社 シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子

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