JP2017019983A5 - - Google Patents

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Publication number
JP2017019983A5
JP2017019983A5 JP2015201385A JP2015201385A JP2017019983A5 JP 2017019983 A5 JP2017019983 A5 JP 2017019983A5 JP 2015201385 A JP2015201385 A JP 2015201385A JP 2015201385 A JP2015201385 A JP 2015201385A JP 2017019983 A5 JP2017019983 A5 JP 2017019983A5
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JP
Japan
Prior art keywords
resin composition
composition according
cured product
benzoxazine resin
item
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JP2015201385A
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Japanese (ja)
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JP2017019983A (en
JP6656870B2 (en
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Publication of JP2017019983A publication Critical patent/JP2017019983A/en
Publication of JP2017019983A5 publication Critical patent/JP2017019983A5/ja
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Publication of JP6656870B2 publication Critical patent/JP6656870B2/en
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Description

項４ 前記項１又は２に記載のベンゾオキサジン樹脂組成物を硬化した物。 Item 4 A cured product of the benzoxazine resin composition according to Item 1 or 2.

Claims (1)

前記請求項１又は２に記載のベンゾオキサジン樹脂組成物を硬化した物。 A cured product of the benzoxazine resin composition according to claim 1 or 2.
JP2015201385A 2015-07-10 2015-10-09 Benzoxazine resin composition, method for producing the same, and use of the composition Active JP6656870B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015139147 2015-07-10
JP2015139147 2015-07-10

Publications (3)

Publication Number Publication Date
JP2017019983A JP2017019983A (en) 2017-01-26
JP2017019983A5 true JP2017019983A5 (en) 2018-09-06
JP6656870B2 JP6656870B2 (en) 2020-03-04

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ID=57887603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015201385A Active JP6656870B2 (en) 2015-07-10 2015-10-09 Benzoxazine resin composition, method for producing the same, and use of the composition

Country Status (1)

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JP (1) JP6656870B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102534679B1 (en) 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 Epoxy resin composition, manufacturing method thereof, and use of the composition
CN110177820B (en) 2017-01-10 2022-03-01 住友精化株式会社 Epoxy resin composition
CN110177819B (en) 2017-01-10 2022-11-08 住友精化株式会社 Epoxy resin composition
US11091627B2 (en) 2017-01-10 2021-08-17 Sumitomo Seika Chemicals Co., Ltd. Epoxy resin composition
WO2018131569A1 (en) * 2017-01-10 2018-07-19 住友精化株式会社 Epoxy resin composition
WO2018131570A1 (en) * 2017-01-10 2018-07-19 住友精化株式会社 Epoxy resin composition
CN111072886B (en) * 2019-11-30 2022-09-02 长沙新材料产业研究院有限公司 Low-dielectric benzoxazine and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10001228B4 (en) * 2000-01-13 2007-01-04 3M Espe Ag Polymerizable preparations based on silicon-containing epoxides
US20090104429A1 (en) * 2005-09-15 2009-04-23 Sekisui Chemical Co., Ltd. Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
JP2009097013A (en) * 2007-09-27 2009-05-07 Hitachi Chem Co Ltd Liquid resin composition for sealing, electronic component device and wafer level chip-size package
KR101050901B1 (en) * 2008-09-24 2011-07-20 세키스이가가쿠 고교가부시키가이샤 Semi-hardened body, hardened body, laminated body, manufacturing method of semi-hardened body, and manufacturing method of hardened body
JP5310656B2 (en) * 2010-06-18 2013-10-09 信越化学工業株式会社 Silphenylene-containing photocurable composition, pattern forming method using the same, and optical semiconductor device obtained by the method

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