JP2017017242A

JP2017017242A - Electronic control unit

Info

Publication number: JP2017017242A
Application number: JP2015134237A
Authority: JP
Inventors: 智雄山岸; Tomoo Yamagishi
Original assignee: Mitsuba Corp
Current assignee: Mitsuba Corp
Priority date: 2015-07-03
Filing date: 2015-07-03
Publication date: 2017-01-19

Abstract

PROBLEM TO BE SOLVED: To provide an electronic control device provided with a flat cable which is hard to receive external forces from outside.SOLUTION: The electronic control device includes a control board, first, second, and third power boards, first, second, and third heat sinks, and a flat cable connecting the control board and the power board. A first recessed portion is formed on one side wall portion of the control board, the power board, and the heat sink, a second recessed portion is formed on the other side wall portion of the control board, the power board, and the radiator plate, the flat cable connecting the control board and the second power board is accommodated in the first recessed portion, and the flat cable connecting the control board and the third power board is accommodated in the second recessed portion. Since the flat cable is accommodated in the first and second recessed portions, the flat cable is less susceptible to external forces from the outside.SELECTED DRAWING: Figure 1

Description

本発明は、電子制御装置に関するもので、特に電動モータを駆動制御する電子制御装置に関するものである。 The present invention relates to an electronic control device, and more particularly to an electronic control device that drives and controls an electric motor.

従来から複数の電子基板が積層された電子制御装置があり、各電子基板はフラットケーブルによって接続されている。積層された各電子基板は同一形状であるため、電子制御装置の電子基板は、共通化が図られる（例えば、特許文献１参照）。 Conventionally, there is an electronic control device in which a plurality of electronic boards are stacked, and each electronic board is connected by a flat cable. Since the stacked electronic boards have the same shape, the electronic boards of the electronic control device can be shared (for example, refer to Patent Document 1).

特開昭５９−１７２７９７号公報JP 59-172797 A

上述した電子制御装置において、フラットケーブルは電子制御装置の側壁部の外側に配置される。フラットケーブルが電子基板の側部の外側に配置されるため、フラットケーブルは外からの外力を受けやすい。本発明の目的は、外からの外力を受けにくくフラットケーブルを備えた電子制御装置を提供することである。 In the electronic control device described above, the flat cable is disposed outside the side wall portion of the electronic control device. Since the flat cable is disposed outside the side portion of the electronic substrate, the flat cable is likely to receive external force from the outside. An object of the present invention is to provide an electronic control device including a flat cable that hardly receives external force from the outside.

請求項１に記載された発明は、制御基板と、制御基板と電気的に接続された第１パワー基板と、第１パワー基板に生じた熱を放熱する第１放熱板と、制御基板と電気的に接続された第２パワー基板と、第２パワー基板に生じた熱を放熱する第２放熱板と、制御基板と電気的に接続された第３パワー基板と、第３パワー基板に生じた熱を放熱する第３放熱板と、を備えた電子制御装置において、制御基板は、第１パワー基板上に積層され、第１パワー基板は、第１放熱板上に積層され、第１放熱板は、第２パワー基板上に積層され、第２パワー基板は、第２放熱板上に積層され、第２放熱板は、第３パワー基板上に積層され、第３パワー基板は、第３放熱板上に積層されており、制御基板の表面の一方の側部には、第１コネクタ部が設けられており、制御基板の表面の他方の側部には、第２コネクタ部が設けられており、制御基板の背面の後部には、第３コネクタ部が設けられており、第１、第２、第３パワー基板は、いずれも同一形状であって、第１、第２、第３パワー基板の表面の一方の側部には、第１コネクタ部が設けられており、第１、第２、第３パワー基板の表面の他方の側部には、第２コネクタ部が設けられており、第１、第２、第３パワー基板の表面の後部には、第３コネクタ部が設けられており、制御基板の一方の側壁部には、第１の凹部が設けられており、制御基板の他方の側壁部には、第２の凹部が設けられており、第１、第２、第３パワー基板の一方の側壁部には、第１の凹部が設けられており、第１、第２、第３パワー基板の他方の側壁部には、第２の凹部が設けられており、制御基板の第３コネクタ部と第１パワー基板の第３コネクタ部は、第１フラットケーブルによって接続されており、制御基板の第１コネクタ部と第２パワー基板の第１コネクタ部は、第２フラットケーブルによって接続されており、制御基板の第２コネクタ部と第３パワー基板の第２コネクタ部は、第３フラットケーブルによって接続されており、第２フラットケーブルは、制御基板の第１の凹部と、第１パワー基板の第１の凹部とに収容されており、第３フラットケーブルは、制御基板の第２の凹部と、第１パワー基板の第２の凹部と、第２パワー基板の第２の凹部とに収容されていることを特徴とする電子制御装置である。 According to a first aspect of the present invention, there is provided a control board, a first power board electrically connected to the control board, a first heat radiating plate for radiating heat generated in the first power board, the control board and the electric board. Connected to the second power board, the second heat radiating plate for radiating heat generated in the second power board, the third power board electrically connected to the control board, and the third power board In an electronic control device comprising a third heat radiating plate for radiating heat, the control board is laminated on the first power board, the first power board is laminated on the first heat radiating board, and the first heat radiating board. Are stacked on the second power board, the second power board is stacked on the second heat sink, the second heat sink is stacked on the third power board, and the third power board is the third heat sink. The first connector part is provided on one side of the surface of the control board. The second connector portion is provided on the other side of the surface of the control board, and the third connector portion is provided on the rear portion of the back surface of the control board. All of the three power boards have the same shape, and a first connector part is provided on one side of the surface of the first, second, and third power boards. A second connector part is provided on the other side of the surface of the 3 power board, and a third connector part is provided on the rear part of the surface of the first, second and third power boards, A first recess is provided in one side wall of the control board, and a second recess is provided in the other side wall of the control board. The first, second, and third power boards A first recess is provided in one of the side walls, and a second recess is provided in the other side wall of the first, second, and third power boards. The third connector part of the control board and the third connector part of the first power board are connected by a first flat cable, and the first connector part of the control board and the first connector of the second power board are provided. The parts are connected by a second flat cable, the second connector part of the control board and the second connector part of the third power board are connected by a third flat cable, and the second flat cable is connected to the control board. Are accommodated in the first recess of the first power board and the first recess of the first power board. The third flat cable includes a second recess of the control board, a second recess of the first power board, The electronic control device is housed in the second recess of the two-power board.

請求項２に記載された発明は、請求項１に記載された電子制御装置において、第１、第２、第３放熱板の一方の側壁部には、第１の凹部が設けられており、第１、第２、第３放熱板の他方の側壁部には、第２の凹部が設けられており、第２フラットケーブルは、第１放熱板の第１の凹部に収容され、第３フラットケーブルは、第１放熱板の第２の凹部と、第２放熱板の第２の凹部とに収容されていることを特徴とする電子制御装置である。 According to a second aspect of the present invention, in the electronic control device according to the first aspect, a first recess is provided in one of the side walls of the first, second, and third radiator plates. A second recess is provided in the other side wall of each of the first, second, and third heat sinks, and the second flat cable is accommodated in the first recess of the first heat sink, and the third flat. The cable is an electronic control device that is housed in the second recess of the first heat sink and the second recess of the second heat sink.

請求項３に記載された発明は、制御基板と、制御基板と電気的に接続された第１パワー基板と、第１パワー基板に生じた熱を放熱する第１放熱板と、制御基板と電気的に接続された第２パワー基板と、第２パワー基板に生じた熱を放熱する第２放熱板と、を備えた電子制御装置において、制御基板は、第１パワー基板上に第１スペーサを介して積層され、第１パワー基板は、第１放熱板上に積層され、第１放熱板は、第２パワー基板上に第２スペーサを介して積層され、第２パワー基板は、第２放熱板上に積層されており、制御基板の表面の一方の側部には、第１コネクタ部が設けられており、制御基板の表面の他方の側部には、第２コネクタ部が設けられており、制御基板の背面の後部には、第３コネクタ部が設けられており、第１、第２パワー基板は、いずれも同一形状であって、第１、第２パワー基板の表面の一方の側部には、第１コネクタ部が設けられており、第１、第２パワー基板の表面の他方の側部には、第２コネクタ部が設けられており、第１、第２パワー基板の表面の後部には、第３コネクタ部が設けられており、制御基板の一方の側壁部には、第１の凹部が設けられており、制御基板の他方の側壁部には、第２の凹部が設けられており、第１、第２パワー基板の一方の側壁部には、第１の凹部が設けられており、第１、第２パワー基板の他方の側壁部には、第２の凹部が設けられており、制御基板の第３コネクタ部と第１パワー基板の第３コネクタ部は、第１フラットケーブルによって接続されており、制御基板の第１コネクタ部と第２パワー基板の第１コネクタ部は、第２フラットケーブルによって接続されており、第２フラットケーブルは、制御基板の第１の凹部と、第１パワー基板の第１の凹部とに収容されていることを特徴とする電子制御装置である。 According to a third aspect of the present invention, there is provided a control board, a first power board electrically connected to the control board, a first heat radiating plate for radiating heat generated in the first power board, the control board and the electric board. In an electronic control device comprising: a second power board connected to the second power board; and a second heat radiating plate for radiating heat generated in the second power board, the control board includes a first spacer on the first power board. The first power board is laminated on the first heat dissipation plate, the first heat dissipation board is laminated on the second power substrate via the second spacer, and the second power substrate is the second heat dissipation The first connector part is provided on one side of the surface of the control board, and the second connector part is provided on the other side of the surface of the control board. A third connector portion is provided at the rear portion of the back surface of the control board. Each of the war boards has the same shape, and a first connector portion is provided on one side of the surface of the first and second power boards, and the other of the surfaces of the first and second power boards. The second connector part is provided on the side part of the first and second power boards, and the third connector part is provided on the rear part of the surface of the first and second power boards. A first recess is provided, a second recess is provided on the other side wall of the control board, and a first recess is provided on one side of the first and second power boards. A second recess is provided in the other side wall of the first and second power boards, and the third connector part of the control board and the third connector part of the first power board are 1 connected by a flat cable, the first connector part of the control board and the first connector of the second power board The parts are connected by a second flat cable, and the second flat cable is accommodated in the first recess of the control board and the first recess of the first power board. Device.

請求項４に記載された発明は、請求項３に記載された電子制御装置において、第１、第２放熱板の一方の側壁部には、第１の凹部が設けられており、第１、第２放熱板の他方の側壁部には、第２の凹部が設けられており、第２フラットケーブルは、第１放熱板の第１の凹部に収容されていることを特徴とする電子制御装置である。 According to a fourth aspect of the present invention, in the electronic control device according to the third aspect of the present invention, a first recess is provided on one side wall portion of the first and second heat radiating plates. An electronic control device characterized in that a second recess is provided in the other side wall of the second heat sink, and the second flat cable is accommodated in the first recess of the first heat sink. It is.

本発明の第１実施形態における電子制御装置の斜視図である。It is a perspective view of the electronic controller in a 1st embodiment of the present invention. 図１のＡ視側面図である。It is A view side view of FIG. 制御基板の表面斜視図である。It is a surface perspective view of a control board. 制御基板の背面斜視図である。It is a back perspective view of a control board. パワー基板の表面斜視図である。It is a surface perspective view of a power board. パワー基板の背面斜視図である。It is a back perspective view of a power board. 放熱板の表面斜視図である。It is a surface perspective view of a heat sink. 放熱板の背面斜視図である。It is a back perspective view of a heat sink. 本発明の第２実施形態における電子制御装置の斜視図である。It is a perspective view of the electronic controller in 2nd Embodiment of this invention. 本発明の第３実施形態における電子制御装置の斜視図である。It is a perspective view of the electronic controller in 3rd Embodiment of this invention.

本発明の第１実施形態の電子制御装置１が、図１、図２に基づいて説明される。電子制御装置１は、制御基板３と、パワー基板４、５、６と、放熱板７、８、９とを備えている。制御基板３はスペーサＳ１を介してパワー基板４上に積層されている。パワー基板４は放熱板７上に積層され、放熱板７はスペーサＳ２を介してパワー基板５上に積層されている。パワー基板５は放熱板８上に積層され、放熱板８はスペーサＳ３を介してパワー基板６上に積層されている。パワー基板６は、放熱板９上に積層されている。 An electronic control device 1 according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. The electronic control device 1 includes a control board 3, power boards 4, 5, 6 and heat sinks 7, 8, 9. The control board 3 is laminated on the power board 4 via the spacer S1. The power board 4 is laminated on the heat sink 7 and the heat sink 7 is laminated on the power board 5 via the spacer S2. The power board 5 is laminated on the heat sink 8 and the heat sink 8 is laminated on the power board 6 via the spacer S3. The power substrate 6 is laminated on the heat sink 9.

スペーサＳ１、Ｓ３の一方の端部Ｓ１ａ、Ｓ３ｂには雌螺子が形成されており、スペーサＳ１、Ｓ３の他方の端部Ｓ１ｂ、Ｓ３ａには雄螺子が形成されている。スペーサＳ２の両方の端部Ｓ２ａ、Ｓ２ｂには雌螺子が形成されている。 A female screw is formed at one end S1a, S3b of the spacers S1, S3, and a male screw is formed at the other end S1b, S3a of the spacers S1, S3. Female screws are formed at both ends S2a and S2b of the spacer S2.

スペーサＳ１の一方の端部Ｓ１ａには、制御基板３を介して螺子Ｎ１が螺入される。これによって、スペーサＳ１は、制御基板３に固定され、両者は一体化される。スペーサＳ１の他方の端部Ｓ１ｂは、パワー基板４と放熱板７とを介して、スペーサＳ２の一方の端部Ｓ２ａに螺入される。これによって、スペーサＳ２はスペーサＳ１に固定され、パワー基板４と放熱板７は、スペーサＳ１とスペーサＳ２とに挟持され、制御基板３とパワー基板４と放熱板７とが一体化される。スペーサＳ２の他方の端部Ｓ２ｂには、パワー基板５と放熱板８を介して、スペーサＳ３の一方の端部Ｓ３ａが螺入される。これによって、スペーサＳ３はスペーサＳ２に固定され、パワー基板５と放熱板８は、スペーサＳ２とスペーサＳ３に挟持され、制御基板３とパワー基板４と放熱板７とパワー基板５と放熱板８とが一体化される。スペーサＳ３の他方の端部Ｓ３ｂには、パワー基板６と放熱板９を介して螺子Ｎ２が螺入される。これによって、パワー基板６と放熱板９は、スペーサＳ３と螺子Ｎ２とに挟持され、制御基板３とパワー基板４と放熱板７とパワー基板５と放熱板８とパワー基板６と放熱板９が一体化される。 A screw N1 is screwed into one end S1a of the spacer S1 via the control board 3. As a result, the spacer S1 is fixed to the control board 3, and both are integrated. The other end S1b of the spacer S1 is screwed into one end S2a of the spacer S2 via the power substrate 4 and the heat sink 7. Thus, the spacer S2 is fixed to the spacer S1, the power substrate 4 and the heat sink 7 are sandwiched between the spacer S1 and the spacer S2, and the control substrate 3, the power substrate 4 and the heat sink 7 are integrated. One end S3a of the spacer S3 is screwed into the other end S2b of the spacer S2 via the power substrate 5 and the heat radiating plate 8. Thus, the spacer S3 is fixed to the spacer S2, the power board 5 and the heat sink 8 are sandwiched between the spacer S2 and the spacer S3, and the control board 3, the power board 4, the heat sink 7, the power board 5, and the heat sink 8 Are integrated. A screw N2 is screwed into the other end S3b of the spacer S3 via the power board 6 and the heat sink 9. As a result, the power board 6 and the heat sink 9 are sandwiched between the spacer S3 and the screw N2, and the control board 3, the power board 4, the heat sink 7, the power board 5, the heat sink 8, the power board 6 and the heat sink 9 are Integrated.

制御基板３とパワー基板４との間にはスペーサＳ１が設けられており、パワー基板４は、制御基板３から予め定められた距離だけ離れて配置される。そのため、制御基板３がパワー基板４と接触することはない。また、放熱板７とパワー基板５との間にはスペーサＳ２が設けられており、パワー基板５は放熱板７から予め定められた距離だけ離れて配置される。そのため、パワー基板５が放熱板７と接触することはない。また、放熱板８とパワー基板６との間にはスペーサＳ３が設けられており、パワー基板６は放熱板８から予め定められた距離だけ離れて配置される。そのため、パワー基板６が放熱板８と接触することはない。 A spacer S <b> 1 is provided between the control board 3 and the power board 4, and the power board 4 is arranged away from the control board 3 by a predetermined distance. Therefore, the control board 3 does not come into contact with the power board 4. A spacer S <b> 2 is provided between the heat sink 7 and the power board 5, and the power board 5 is disposed away from the heat sink 7 by a predetermined distance. Therefore, the power board 5 does not come into contact with the heat sink 7. A spacer S <b> 3 is provided between the heat sink 8 and the power board 6, and the power board 6 is disposed away from the heat sink 8 by a predetermined distance. Therefore, the power board 6 does not come into contact with the heat sink 8.

制御基板３は、フラットケーブル１０によって、パワー基板４と接続されている。制御基板３は、フラットケーブル１１によって、パワー基板５と接続されている。制御基板３は、フラットケーブル１２によって、パワー基板６と接続されている。図３ａ、図３ｂ、図４ａ、図４ｂに示されるように、制御基板３の側壁部３ｇと、パワー基板４、５、６の側壁部４ｇ、５ｇ、６ｇと、放熱板７、８、９の側壁部７ｇ、８ｇ、９ｇとには、第１の凹部３ａ、４ａ、５ａ、６ａ、７ａ、８ａ、９ａが形成されている。また、制御基板３の側壁部３ｈと、パワー基板４、５、６の側壁部４ｈ、５ｈ、６ｈと、放熱板７、８、９の側壁部７ｈ、８ｈ、９ｈとには、第２の凹部３ｂ、４ｂ、５ｂ、６ｂ、７ｂ、８ｂ、９ｂが形成されている。制御基板３、パワー基板４、５、６には、各々、第１コネクタ部３ｃ、４ｃ、５ｃ、６ｃと、第２コネクタ部３ｄ、４ｄ、５ｄ、６ｄ、第３コネクタ部３ｅ、４ｅ、５ｅ、６ｅが配置されている。第１コネクタ部３ｃ、４ｃ、５ｃ、６ｃは、第１の凹部３ａ、４ａ、５ａ、６ａと近接されて配置されており、第２コネクタ部３ｄ、４ｄ、５ｄ、６ｄは、第２の凹部３ｂ、４ｂ、５ｂ、６ｂと近接して配置されている。 The control board 3 is connected to the power board 4 by a flat cable 10. The control board 3 is connected to the power board 5 by a flat cable 11. The control board 3 is connected to the power board 6 by a flat cable 12. As shown in FIGS. 3a, 3b, 4a and 4b, the side wall 3g of the control board 3, the side walls 4g, 5g and 6g of the power boards 4, 5, 6 and the heat sinks 7, 8, 9 The first recesses 3a, 4a, 5a, 6a, 7a, 8a, 9a are formed in the side wall portions 7g, 8g, 9g. In addition, the side wall 3h of the control board 3, the side walls 4h, 5h, 6h of the power boards 4, 5, 6 and the side walls 7h, 8h, 9h of the heat sinks 7, 8, 9 are Recesses 3b, 4b, 5b, 6b, 7b, 8b, 9b are formed. The control board 3 and the power boards 4, 5, 6 are respectively provided with a first connector part 3c, 4c, 5c, 6c, a second connector part 3d, 4d, 5d, 6d, a third connector part 3e, 4e, 5e. , 6e are arranged. The first connector portions 3c, 4c, 5c, 6c are arranged close to the first recesses 3a, 4a, 5a, 6a, and the second connector portions 3d, 4d, 5d, 6d are the second recesses. 3b, 4b, 5b, and 6b are arranged close to each other.

フラットケーブル１１の一端は、制御基板３の第１コネクタ部３ｃに接続され、フラットケーブル１１の他端は、パワー基板５の第１コネクタ部５ｃに接続されている。
制御基板３はフラットケーブル１１を介してパワー基板５に信号を送信する。フラットケーブル１２の一端は、制御基板３の第２コネクタ部３ｄに接続され、フラットケーブル１２の他端は、パワー基板６の第２コネクタ部６ｄと接続されている。制御基板３はフラットケーブル１２を介してパワー基板６に信号を送信する。図２に示されるように、フラットケーブル１０の一端は、制御基板３の第３コネクタ部３ｅに接続され、フラットケーブル１０の他端は、パワー基板４の第３コネクタ部４ｅに接続されている。制御基板３はフラットケーブル１０を介してパワー基板４に信号を送信する。 One end of the flat cable 11 is connected to the first connector part 3 c of the control board 3, and the other end of the flat cable 11 is connected to the first connector part 5 c of the power board 5.
The control board 3 transmits a signal to the power board 5 via the flat cable 11. One end of the flat cable 12 is connected to the second connector part 3 d of the control board 3, and the other end of the flat cable 12 is connected to the second connector part 6 d of the power board 6. The control board 3 transmits a signal to the power board 6 via the flat cable 12. As shown in FIG. 2, one end of the flat cable 10 is connected to the third connector part 3 e of the control board 3, and the other end of the flat cable 10 is connected to the third connector part 4 e of the power board 4. . The control board 3 transmits a signal to the power board 4 via the flat cable 10.

本発明の電子制御装置１は、産業用ロボット用のモータを駆動させるためのものである。フラットケーブル１１は、制御基板３、パワー基板４、放熱板７の第１の凹部３ａ、４ａ、７ａ内に配され、フラットケーブル１２は、制御基板３、パワー基板４、放熱板７、パワー基板５、放熱板８の第２の凹部３ｂ、４ｂ、７ｂ、５ｂ、８ｂ内に配されている。そのため、作業者はフラットケーブル１１、１２を周囲の物に接触させることなく、電子制御装置１を産業用ロボット内に組み付けることができる。 The electronic control device 1 of the present invention is for driving a motor for an industrial robot. The flat cable 11 is arranged in the control board 3, the power board 4, and the first recesses 3a, 4a, and 7a of the heat sink 7. The flat cable 12 is the control board 3, the power board 4, the heat sink 7, and the power board. 5. It arrange | positions in the 2nd recessed part 3b, 4b, 7b, 5b, 8b of the heat sink 8. FIG. Therefore, the operator can assemble the electronic control device 1 in the industrial robot without bringing the flat cables 11 and 12 into contact with surrounding objects.

フラットケーブル１１は、第１の凹部３ａ、４ａ、７ａ内に収容され、フラットケーブル１２は、第２の凹部３ｂ、４ｂ、５ｂ、７ｂ、８ｂ内に収容されている。フラットケーブル１１、１２が、制御基板の側壁部３ｇ、３ｈと、パワー基板４、５、６の側壁部４ｇ、４ｈ、５ｇ、５ｈ、６ｇ、６ｈよりも内側に配置されている。フラットケーブル１１、１２は、制御基板の側壁部３ｇ、３ｈと、パワー基板４、５、６の側壁部４ｇ、４ｈ、５ｇ、５ｈ、６ｇ、６ｈによって保護されるため、外からの外力を受けにくくなる。 The flat cable 11 is accommodated in the first recesses 3a, 4a, 7a, and the flat cable 12 is accommodated in the second recesses 3b, 4b, 5b, 7b, 8b. The flat cables 11 and 12 are disposed inside the side wall portions 3g and 3h of the control board and the side wall portions 4g, 4h, 5g, 5h, 6g, and 6h of the power boards 4, 5, and 6. Since the flat cables 11 and 12 are protected by the side wall portions 3g and 3h of the control board and the side wall portions 4g, 4h, 5g, 5h, 6g and 6h of the power boards 4, 5 and 6, they receive external force from the outside. It becomes difficult.

制御基板３が、図３ａ、図３ｂに基づいて説明される。制御基板３の表面にはモータ制御回路部３１と、制御回路用電源コネクタ３２と、エンコーダ用コネクタ部３３ａ、３３ｂ、３３ｃとが配置されており、エンコーダ用コネクタ部３３ａ、３３ｂ、３３ｃには不図示のエンコーダが接続される。制御基板３の表面の一方の側部３ｉには、第１コネクタ部３ｃが配置されており、第１コネクタ部３ｃは第１の凹部３ａに近接して配置されている。そのため、第１コネクタ部３ｃに接続されたフラットケーブル１１は、第１の凹部３ａに向かって容易に引き出される。制御基板３の表面の他方の側部３ｊには、第２コネクタ部３ｄが配置されており、第２コネクタ部３ｄは第２の凹部３ｂに近接して配置されている。そのため、第２コネクタ部３ｄに接続されたフラットケーブル１２は、第２の凹部３ｂに向かって容易に引き出される。 The control board 3 will be described with reference to FIGS. 3a and 3b. A motor control circuit unit 31, a control circuit power connector 32, and encoder connector units 33a, 33b, and 33c are arranged on the surface of the control board 3. The encoder connector units 33a, 33b, and 33c are not connected to the control board 3. The illustrated encoder is connected. A first connector portion 3c is disposed on one side 3i of the surface of the control board 3, and the first connector portion 3c is disposed in the vicinity of the first recess 3a. Therefore, the flat cable 11 connected to the first connector portion 3c is easily pulled out toward the first recess 3a. A second connector portion 3d is disposed on the other side portion 3j of the surface of the control board 3, and the second connector portion 3d is disposed in proximity to the second recess 3b. Therefore, the flat cable 12 connected to the second connector portion 3d is easily pulled out toward the second recess 3b.

制御基板３の背面には、第３のコネクタ部３ｅと、シリアル通信用コネクタ部３４とが配置されており、シリアル通信用コネクタ３４は、不図示のＥＣＵ（ｅｌｅｃｔｒｏｎｉｃｃｏｎｔｒｏｌｕｎｉｔ）に接続される。制御基板３の背面の後部３ｋには、第３コネクタ部３ｅが配置されており、第３コネクタ部３ｅは、パワー基板４の第３コネクタ部４ｅと対向して配置される。そのため、第３コネクタ部３ｅに接続されたフラットケーブル１０は、パワー基板４の第３コネクタ部に向かって容易に引き出される。 A third connector portion 3e and a serial communication connector portion 34 are disposed on the back surface of the control board 3, and the serial communication connector 34 is connected to an ECU (electronic control unit) (not shown). A third connector portion 3 e is disposed on the rear portion 3 k of the back surface of the control board 3, and the third connector portion 3 e is disposed to face the third connector portion 4 e of the power board 4. Therefore, the flat cable 10 connected to the third connector portion 3 e is easily pulled out toward the third connector portion of the power board 4.

パワー基板４、５、６が、図４ａ、図４ｂに基づいて説明される。パワー基板４、５、６は、いずれも同一毛状である。パワー基板４、５、６の表面には、複数のＩＣ５０と、第１コネクタ４ｃ、５ｃ、６ｃと、第２コネクタ部４ｄ、５ｄ、６ｄ、第３コネクタ部４ｅ、５ｅ、６ｅとが配置されている。パワー基板４、５、６の一方の側部４ｉ、５ｉ、６ｉには、第１コネクタ部４ｃ、５ｃ、６ｃが配置されており、第１コネクタ部４ｃ、５ｃ、６ｃは第１の凹部４ａ、５ａ、６ａに近接して配置されている。パワー基板４、５、６の他方の側部４ｊ、５ｊ、６ｊには、第２コネクタ部４ｄ、５ｄ、６ｄが配置されており、第２コネクタ部４ｄ、５ｄ、６ｄは第２の凹部４ｂ、５ｂ、６ｂに近接して配置されている。パワー基板４、５、６の後部４ｋ、５ｋ、６ｋには、第３コネクタ部４ｅ、５ｅ、６ｅが配置されている。フラットケーブル１１は、第１の凹部３ａ、４ａ、７ａ内に収容される。フラットケーブル１２は、第２の凹部３ｂ、４ｂ、７ｂ、５ｂ、６ｂ内に収容される。 The power boards 4, 5, 6 will be described with reference to FIGS. 4a and 4b. The power boards 4, 5, and 6 are all in the same hair shape. A plurality of ICs 50, first connectors 4 c, 5 c, 6 c, second connector parts 4 d, 5 d, 6 d, third connector parts 4 e, 5 e, 6 e are arranged on the surfaces of the power boards 4, 5, 6. ing. 1st connector part 4c, 5c, 6c is arrange | positioned at one side part 4i, 5i, 6i of the power boards 4, 5, 6 and the 1st connector part 4c, 5c, 6c is the 1st recessed part 4a. 5a and 6a. Second connector portions 4d, 5d, and 6d are disposed on the other side portions 4j, 5j, and 6j of the power boards 4, 5, and 6, and the second connector portions 4d, 5d, and 6d are disposed in the second recess 4b. 5b and 6b. Third connectors 4e, 5e, and 6e are disposed on the rear portions 4k, 5k, and 6k of the power boards 4, 5, and 6, respectively. The flat cable 11 is accommodated in the first recesses 3a, 4a, and 7a. The flat cable 12 is accommodated in the second recesses 3b, 4b, 7b, 5b, 6b.

複数のＩＣ５０は、ゲートドライブ回路を構成する。パワー基板４、５、６の背面には、複数のスイッチング素子５１と、コンデンサ５２と、モータ駆動回路用電源コネクタ５３と、モータ用コネクタ５４とが配置されている。複数のスイッチング素子５１は、パワーＭＯＳＦＥＴであって、モータ駆動回路を構成している。 The plurality of ICs 50 constitute a gate drive circuit. A plurality of switching elements 51, a capacitor 52, a motor drive circuit power supply connector 53, and a motor connector 54 are disposed on the back surfaces of the power boards 4, 5, 6. The plurality of switching elements 51 are power MOSFETs and constitute a motor drive circuit.

パワー基板４のモータ用コネクタ５４は、例えば、ロボットの中に配置された第１のモータ（図示せず）と接続される。そして、第１のモータの回転位置を検出するエンコーダが、制御基板３のエンコーダ用コネクタ部３３ａを介して制御基板３に接続される。パワー基板５のモータ用コネクタ５４は、ロボットの中に沿って配置された第２のモータ（図示せず）と接続される。第２のモータの回転位置を検出するエンコーダは、制御基板３のエンコーダ用コネクタ部３３ｂを介して制御基板３に接続される。パワー基板６のモータ用コネクタ５４は、ロボットの中に沿って配置された第３のモータ（図示せず）と接続される。第３のモータの回転位置を検出するエンコーダは、エンコーダ用コネクタ部３３ｃを介して制御基板３に接続される。 The motor connector 54 of the power board 4 is connected to, for example, a first motor (not shown) arranged in the robot. An encoder that detects the rotational position of the first motor is connected to the control board 3 via the encoder connector portion 33 a of the control board 3. The motor connector 54 of the power board 5 is connected to a second motor (not shown) arranged along the robot. The encoder that detects the rotational position of the second motor is connected to the control board 3 via the encoder connector portion 33 b of the control board 3. The motor connector 54 of the power board 6 is connected to a third motor (not shown) arranged along the robot. The encoder that detects the rotational position of the third motor is connected to the control board 3 via the encoder connector portion 33c.

スペーサＳ１に制御基板３を介して螺子Ｎ１が螺入されることによって、螺子Ｎ１と制御基板３とスペーサＳ１とは一体化される。スペーサＳ２に、パワー基板４と放熱板７とを介してスペーサＳ１が螺入されることによって、螺子Ｎ１と制御基板３とスペーサＳ１とパワー基板４と放熱板７とスペーサＳ２は一体化される。スペーサＳ２にパワー基板５と放熱板８を介して７スペーサＳ３が螺入されることによって、螺子Ｎ１と制御基板３とスペーサＳ１とパワー基板４と放熱板７とスペーサＳ２とパワー基板５と放熱板８とスペーサＳ３は一体化される。スペーサＳ３にパワー基板６と放熱板９を介して螺子Ｎ２が螺入されることによって、螺子Ｎ１と制御基板３とスペーサＳ１とパワー基板４と放熱板７とスペーサＳ２とパワー基板５と放熱板８とスペーサＳ３とパワー基板６と放熱板９は一体化される。そのため、作業者がスペーサＳ３に螺入されたＮ２を取り外すことによって、容易に電子制御装置１からパワー基板６、放熱板９を取り外すことができる。電子制御装置１からパワー基板６、放熱板９が取り外されると、電子制御装置１は、制御基板３と、パワー基板４、５と、放熱板７、８とによって構成される。すなわち、第１、第２、第３のモータを駆動させる電子制御装置１は、第１、第２のモータを駆動させる電子制御装置１へ容易に変更することができる。 When the screw N1 is screwed into the spacer S1 via the control board 3, the screw N1, the control board 3, and the spacer S1 are integrated. When the spacer S1 is screwed into the spacer S2 via the power board 4 and the heat sink 7, the screw N1, the control board 3, the spacer S1, the power board 4, the heat sink 7, and the spacer S2 are integrated. . 7 spacers S3 are screwed into the spacers S2 via the power substrate 5 and the heat dissipation plate 8, whereby the screw N1, the control substrate 3, the spacer S1, the power substrate 4, the heat dissipation plate 7, the spacer S2, the power substrate 5, and the heat dissipation. The plate 8 and the spacer S3 are integrated. The screw N2 is screwed into the spacer S3 via the power board 6 and the heat sink 9 so that the screw N1, the control board 3, the spacer S1, the power board 4, the heat sink 7, the spacer S2, the power board 5, and the heat sink. 8, the spacer S3, the power board 6, and the heat sink 9 are integrated. Therefore, the power board 6 and the heat sink 9 can be easily removed from the electronic control unit 1 by removing the N2 screwed into the spacer S3 by the operator. When the power board 6 and the heat radiating plate 9 are removed from the electronic control device 1, the electronic control device 1 includes the control board 3, the power boards 4 and 5, and the heat radiating plates 7 and 8. That is, the electronic control device 1 that drives the first, second, and third motors can be easily changed to the electronic control device 1 that drives the first and second motors.

放熱板７、８、９が、図５ａ、図５ｂに基づいて説明される。放熱板７、８、９は、いずれも同一形状のアルミ製であって、パワー基板４、５、６に対向して配置される台座部７０と、台座部７０を支持する脚部７２と、台座部７０の表面に固着された伝熱部７１とを有している。
放熱板７の脚部７２は、スペーサＳ１とスペーサＳ２とによって挟持される。放熱板８の脚部７２は、スペーサＳ２とスペーサＳ３とによって挟持される。放熱板９の脚部７２は、スペーサＳ３と螺子Ｎ２とによって挟持される。放熱板７、８、９の脚部７２は、台座部７０よりも肉薄に形成されているため、螺子Ｎ１、Ｎ２とスペーサＳ１、Ｓ３の長さを短くすることができ、作業者は電子制御装置１を容易に組み付けることができる。 The heat sinks 7, 8, and 9 will be described with reference to FIGS. 5a and 5b. The radiator plates 7, 8, 9 are all made of aluminum having the same shape, and a pedestal portion 70 disposed to face the power boards 4, 5, 6, a leg portion 72 that supports the pedestal portion 70, And a heat transfer portion 71 fixed to the surface of the pedestal portion 70.
The leg 72 of the heat sink 7 is sandwiched between the spacer S1 and the spacer S2. The leg 72 of the heat sink 8 is sandwiched between the spacer S2 and the spacer S3. The leg part 72 of the heat sink 9 is sandwiched between the spacer S3 and the screw N2. Since the legs 72 of the heat sinks 7, 8, 9 are formed thinner than the base 70, the lengths of the screws N1, N2 and the spacers S1, S3 can be shortened, and the operator can control electronically. The device 1 can be easily assembled.

伝熱部７１はシリコン系のゴム部材によって形成され、パワー基板４、５、６のスイッチング素子５１と密着する。そのため、スイッチング素子５１に生じた熱は伝熱部７１、放熱板７、８、９を介して、電子制御装置１の外へと放熱される。 The heat transfer portion 71 is formed of a silicon rubber member and is in close contact with the switching elements 51 of the power boards 4, 5, 6. Therefore, the heat generated in the switching element 51 is radiated to the outside of the electronic control device 1 through the heat transfer section 71 and the heat radiating plates 7, 8, 9.

本発明の電子制御装置１の動作が、図１から図５ｂに基づいて示される。制御基板３に制御回路用電源コネクタ３２を介して電力が供給されると、電子制御装置１は動作状態となる。また、パワー基板４、５、６には、モータ駆動回路用電源コネクタ５３を介して電力が供給される。エンコーダが第１のモータの回転位置を検出すると、第１のモータの回転位置情報はエンコーダ用コネクタ部３３ａを介して制御基板３に送信される。制御基板３はシリアル通信用コネクタ３４を介してＥＣＵに第１のモータの回転位置情報を送信し、ＥＣＵはシリアル通信用コネクタ３４を介して制御基板３に第１のモータの回転数指令を送信する。制御基板３は第１のモータの回転数指令に従い、フラットケーブル１０を介してパワー基板４に信号を送信し、第１のモータを制御する。エンコーダが第２のモータの回転位置を検出すると、第２のモータの回転位置情報はエンコーダ用コネクタ部３３ｂを介して制御基板３に送信される。制御基板３はシリアル通信用コネクタ３４を介してＥＣＵに第２のモータの回転位置情報を送信し、ＥＣＵはシリアル通信用コネクタ３４を介して制御基板３に第２のモータの回転数指令を送信する。制御基板３は第２のモータの回転数指令に従い、フラットケーブル１１を介してパワー基板５に信号を送信し、第２のモータを制御する。エンコーダが第３のモータの回転位置を検出すると、第３のモータの回転位置情報はエンコーダ用コネクタ部３３ｃを介して制御基板３に送信される。制御基板３はシリアル通信用コネクタ３４を介してＥＣＵに第１のモータの回転位置情報を送信し、ＥＣＵはシリアル通信用コネクタ３４を介して制御基板３に第３のモータの回転数指令を送信する。制御基板３は第３のモータの回転数指令に従い、フラットケーブル１２を介してパワー基板６に信号を送信し、第３のモータを制御する。 The operation of the electronic control device 1 of the present invention is shown based on FIGS. 1 to 5b. When electric power is supplied to the control board 3 via the control circuit power connector 32, the electronic control unit 1 enters an operating state. Further, power is supplied to the power boards 4, 5, 6 via the motor drive circuit power connector 53. When the encoder detects the rotational position of the first motor, the rotational position information of the first motor is transmitted to the control board 3 via the encoder connector section 33a. The control board 3 transmits the rotational position information of the first motor to the ECU via the serial communication connector 34, and the ECU transmits the rotational speed command of the first motor to the control board 3 via the serial communication connector 34. To do. The control board 3 transmits a signal to the power board 4 via the flat cable 10 according to the rotation speed command of the first motor, and controls the first motor. When the encoder detects the rotational position of the second motor, the rotational position information of the second motor is transmitted to the control board 3 via the encoder connector portion 33b. The control board 3 transmits the rotational position information of the second motor to the ECU via the serial communication connector 34, and the ECU transmits the rotational speed command of the second motor to the control board 3 via the serial communication connector 34. To do. The control board 3 transmits a signal to the power board 5 through the flat cable 11 in accordance with the rotation speed command of the second motor, and controls the second motor. When the encoder detects the rotational position of the third motor, the rotational position information of the third motor is transmitted to the control board 3 via the encoder connector section 33c. The control board 3 transmits the rotational position information of the first motor to the ECU via the serial communication connector 34, and the ECU transmits the rotational speed command of the third motor to the control board 3 via the serial communication connector 34. To do. The control board 3 transmits a signal to the power board 6 via the flat cable 12 in accordance with the rotation speed command of the third motor, and controls the third motor.

本発明におけるパワー基板４、５、６は各々同一形状の基板であって、各パワー基板４、５、６には、第１コネクタ部４ｃ、５ｃ、６ｃ、第２コネクタ部４ｄ、５ｄ、６ｄ、第３コネクタ部４ｅ、５ｅ、６ｅが配置されている。そのため、パワー基板４、５、６の形状を変更することなく、電子制御装置１の形態を第２実施形態の電子制御装置１０１や、第３実施形態の電子制御装置２０１のように変更することが可能である。 The power boards 4, 5, and 6 in the present invention are boards having the same shape, and the power boards 4, 5, and 6 have first connector portions 4c, 5c, and 6c, second connector portions 4d, 5d, and 6d, respectively. The third connector parts 4e, 5e, 6e are arranged. Therefore, the form of the electronic control device 1 is changed to the electronic control device 101 of the second embodiment or the electronic control device 201 of the third embodiment without changing the shape of the power boards 4, 5, 6. Is possible.

本発明の第２実施形態の電子制御装置１０１が、図６に基づいて説明される。電子制御装置１０１は、制御基板３がパワー基板４、放熱板７上に積層され、放熱板７、８がパワー基板４、５の間に配されている。この場合、制御基板１とパワー基板４は、フラットケーブル１０によって接続され、制御基板１とパワー基板５は、フラットケーブル１１によって接続される。 An electronic control device 101 according to a second embodiment of the present invention will be described with reference to FIG. In the electronic control device 101, the control board 3 is laminated on the power board 4 and the heat sink 7, and the heat sinks 7 and 8 are arranged between the power boards 4 and 5. In this case, the control board 1 and the power board 4 are connected by a flat cable 10, and the control board 1 and the power board 5 are connected by a flat cable 11.

本発明の第３実施形態の電子制御装置２０１が、図７に基づいて説明される。電子制御装置２０１は、制御基板１がパワー基板４、放熱板７上に積層され、筐体２０２内に配置されている。この場合、制御基板３とパワー基板４は、フラットケーブル１０によって接続され、制御基板３とパワー基板５は、フラットケーブル１１によって接続され、制御基板３とパワー基板６は、フラットケーブル１２によって接続されている。 An electronic control device 201 according to a third embodiment of the present invention will be described with reference to FIG. In the electronic control device 201, the control board 1 is laminated on the power board 4 and the heat radiating plate 7 and is arranged in the housing 202. In this case, the control board 3 and the power board 4 are connected by a flat cable 10, the control board 3 and the power board 5 are connected by a flat cable 11, and the control board 3 and the power board 6 are connected by a flat cable 12. ing.

１電子制御装置
３制御基板
３ａ第１の凹部
３ｂ第２の凹部
３ｃ第１コネクタ部
３ｄ第２コネクタ部
３ｅ第３コネクタ部
４パワー基板
４ａ第１の凹部
４ｂ第２の凹部
４ｃ第１コネクタ部
４ｄ第２コネクタ部
４ｅ第３コネクタ部
５パワー基板
５ａ第１の凹部
５ｂ第２の凹部
５ｃ第１コネクタ部
５ｄ第２コネクタ部
５ｅ第３コネクタ部
６パワー基板
６ａ第１の凹部
６ｂ第２の凹部
６ｃ第１コネクタ部
６ｄ第２コネクタ部
６ｅ第３コネクタ部
７放熱板
７ａ第１の凹部
７ｂ第２の凹部
８放熱板
８ａ第１の凹部
８ｂ第２の凹部
９放熱板
９ａ第１の凹部
９ｂ第２の凹部
１０フラットケーブル
１１フラットケーブル
１２フラットケーブル
３３ａエンコーダ用コネクタ部
３３ｂエンコーダ用コネクタ部
３３ｃエンコーダ用コネクタ部
３４シリアル通信用コネクタ
５１スイッチング素子
５２コンデンサ
５３モータ駆動回路用電源コネクタ
５４モータ用コネクタ
７０台座部
７１伝熱部
７２脚部
１０１電子制御装置
２０１電子制御装置
２０２筐体
Ｎ１螺子
Ｎ２螺子
Ｓ１スペーサ
Ｓ２スペーサ
Ｓ３スペーサ DESCRIPTION OF SYMBOLS 1 Electronic controller 3 Control board 3a 1st recessed part 3b 2nd recessed part 3c 1st connector part 3d 2nd connector part 3e 3rd connector part 4 Power board 4a 1st recessed part 4b 2nd recessed part 4c 1st connector part 4d 2nd connector part 4e 3rd connector part 5 Power board 5a 1st recessed part 5b 2nd recessed part 5c 1st connector part 5d 2nd connector part 5e 3rd connector part 6 Power board 6a 1st recessed part 6b 2nd Recess 6c First connector portion 6d Second connector portion 6e Third connector portion 7 Heat sink 7a First recess 7b Second recess 8 Heat sink 8a First recess 8b Second recess 9 Heat sink 9a First recess 9b Second recess 10 Flat cable 11 Flat cable 12 Flat cable 33a Encoder connector portion 33b Encoder connector portion 33c Encoder connector portion 34 Serial communication connector 51 Switching element 52 Capacitor 53 Motor drive circuit power supply connector 54 Motor connector 70 Base portion 71 Heat transfer portion 72 Leg portion 101 Electronic control device 201 Electronic control device 202 Housing N1 Screw N2 Screw S1 Spacer S2 Spacer S3 spacer

Claims

A control board; a first power board electrically connected to the control board; a first heat radiating plate for radiating heat generated in the first power board; and a second electrically connected to the control board. A power board, a second heat radiating plate for radiating heat generated in the second power board, a third power board electrically connected to the control board, and radiating heat generated in the third power board In an electronic control device comprising a third heat sink,
The control board is laminated on the first power board, the first power board is laminated on the first heat sink, the first heat sink is laminated on the second power board, The second power board is stacked on the second heat sink, the second heat sink is stacked on the third power board, and the third power board is stacked on the third heat sink. A first connector portion is provided on one side of the surface of the control board, and a second connector portion is provided on the other side of the surface of the control board. A third connector portion is provided at a rear portion of the back surface of the board, and the first, second, and third power boards have the same shape, and the first, second, and third power boards. A first connector portion is provided on one side of the surface of the first, second, second A second connector part is provided on the other side of the surface of the power board, and a third connector part is provided on the rear part of the surface of the first, second and third power boards, A first recess is provided in one side wall of the control board, and a second recess is provided in the other side wall of the control board, and the first, second, and second A first recess is provided on one side wall of the 3 power board, and a second recess is provided on the other side wall of the first, second and third power boards, The third connector part of the control board and the third connector part of the first power board are connected by a first flat cable, and the first connector part of the control board and the first connector part of the second power board. Are connected by a second flat cable, the second of the control board The connector part and the second connector part of the third power board are connected by a third flat cable, and the second flat cable is connected to the first recess of the control board and the first power board. The third flat cable is housed in a first recess, and the third flat cable includes the second recess of the control board, the second recess of the first power board, and the second of the second power board. An electronic control device, wherein the electronic control device is housed in two recesses.

2. The electronic control device according to claim 1, wherein a first recess is provided on one side wall of each of the first, second, and third radiator plates, and the first, second, and third are provided. A second recess is provided in the other side wall of the heat sink, the second flat cable is accommodated in the first recess of the first heat sink, and the third flat cable is An electronic control device, wherein the electronic control device is housed in the second recess of the first heat sink and the second recess of the second heat sink.

A control board; a first power board electrically connected to the control board; a first heat radiating plate for radiating heat generated in the first power board; and a second electrically connected to the control board. In an electronic control device comprising: a power board; and a second heat radiating plate that radiates heat generated in the second power board.
The control board is stacked on the first power board via a first spacer, the first power board is stacked on the first heat sink, and the first heat sink is the second power board. The second power board is laminated on the second heat sink, and a first connector part is provided on one side of the surface of the control board. A second connector part is provided on the other side of the surface of the control board, and a third connector part is provided on the rear part of the back surface of the control board. Each of the second power boards has the same shape, and a first connector portion is provided on one side of the surface of the first and second power boards. The first and second power boards A second connector part is provided on the other side of the surface of the first, 2 A third connector portion is provided at the rear of the surface of the power board, a first recess is provided in one side wall portion of the control board, and a second side wall portion of the control board is provided. Is provided with a second recess, and one side wall portion of the first and second power boards is provided with a first recess, and the other side wall of the first and second power boards is provided. The portion is provided with a second recess, and the third connector portion of the control board and the third connector portion of the first power board are connected by a first flat cable, 1 connector part and the 1st connector part of the 2nd power board are connected by the 2nd flat cable, and the 2nd flat cable is connected to the 1st crevice of the control board, and the 1st power board. The first recess is accommodated Electronic control device according to claim.

4. The electronic control unit according to claim 3, wherein a first recess is provided in one side wall portion of the first and second heat radiating plates, and the other side wall of the first and second heat radiating plates is provided. The electronic control device is characterized in that a second recess is provided in the part, and the second flat cable is accommodated in the first recess of the first heat radiating plate.