JP2017017079A - Sample holder and sample processing device provided with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve thermal uniformity of a sample holding surface.SOLUTION: A sample holder comprises: a ceramic board formed by a laminated plate having a sample holding surface in one principal surface; a first heater provided between layers of the ceramic board; a metal member provided on the other principal surface of the ceramic board; and a second heater provided between layers different from the layers between which the first heater of the ceramic board is provided so that at least a part of the second heater is overlapped with the metal member when viewed in a plan view.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a sample holder used when holding a sample such as a semiconductor wafer used in a manufacturing process of a semiconductor integrated circuit or a manufacturing process of a liquid crystal display device.

  As a sample holder, for example, a sample holder described in Patent Document 1 is known. The sample holder described in Patent Document 1 includes a ceramic substrate having a sample holding surface on the upper surface and a heater provided on the ceramic substrate in a planar shape. A metal member is attached to the lower surface of the ceramic substrate.

JP 2000-219578 A

  In recent years, further soaking on the sample holding surface has been demanded. However, in the sample holder disclosed in Patent Document 1, it has been difficult to further soak the sample holding surface. Specifically, the heat generated from the heater escapes to the outside through the metal member, so that the temperature of the region of the sample holding surface located immediately above the metal member may be lowered.

  A sample holder according to one aspect of the present invention includes a ceramic substrate formed of a laminated plate having a sample holding surface on one main surface, a first heater provided between layers of the ceramic substrate, and the other of the ceramic substrates. A second metal member provided on an interlayer different from the layer provided with the first heater of the ceramic substrate so that at least a part of the metal member provided on the main surface overlaps the metal member when viewed in plan. And a heater.

  A sample processing apparatus of one embodiment of the present invention includes the sample holder and a casing having a through hole, and is attached to the casing so that the ceramic substrate and the metal member close the through hole. It has been.

  A ceramic substrate made of a laminate having a sample holding surface on one main surface, a first heater provided between layers of the ceramic substrate, a metal member provided on the other main surface of the ceramic substrate, and a plan view And a second heater provided in a different layer from the layer in which the first heater of the ceramic substrate is provided so that at least a part of the metal member overlaps with the metal member. In particular, the heat generation density can be increased. As a result, the soaking property of the sample holding surface can be improved.

It is a schematic sectional drawing which shows an example of embodiment of the sample holder of this invention, and a sample processing apparatus provided with the same. It is a longitudinal cross-sectional view of the sample holder shown in FIG. It is a cross-sectional view which shows the area | region in which the 1st heater is provided among the sample holders shown in FIG. 2, and the shape of a pattern. FIG. 3 is a transverse cross-sectional view illustrating a region where a second heater is provided and a shape of a pattern in the sample holder illustrated in FIG. 2. It is a longitudinal cross-sectional view which shows the modification of the sample holder of this invention.

  A sample holder 10 and a sample processing apparatus 100 including the sample holder 10 according to an embodiment of the present invention will be described in detail.

  As shown in FIG. 1, the sample processing apparatus 100 includes a housing 5 and a sample holder 10 provided inside the housing 5. The sample processing apparatus 100 is used as a semiconductor manufacturing apparatus, for example. In this case, the housing 5 is used as a so-called chamber, and the sample holder 10 holds, for example, a silicon wafer.

  The housing 5 has a through hole 50 that opens to the lower side, and the sample holder 10 is attached so as to close the through hole 50. Specifically, the metal member 4 of the sample holder 10 surrounds the through hole 50 of the housing 5, and the through hole 50 is closed by the metal member 4 and the ceramic substrate 1. The metal member 4 is bonded to the housing 5 and seals the space in the housing 5 where the sample holding surface 11 of the ceramic substrate 1 is exposed together with the housing 5 and the ceramic substrate 1.

  As shown in FIG. 2, the sample holder 10 includes a ceramic substrate 1 made of a laminated plate having a sample holding surface 11 on one main surface, a first heater 2 provided between layers of the ceramic substrate 1, and a ceramic. The metal member 4 provided on the other main surface of the substrate 1 and an interlayer different from the layer provided with the first heater 2 of the ceramic substrate 1 so that at least a part of the metal member 4 overlaps the metal member 4 when seen in a plan view. The second heater 3 is provided.

  The ceramic substrate 1 is a member for holding a sample. The ceramic substrate 1 is formed of a laminate. The ceramic substrate 1 is a disk-shaped member, for example. The ceramic substrate 1 has a sample holding surface 11 on one main surface.

  The ceramic substrate 1 is made of a ceramic material such as aluminum nitride, for example. The ceramic substrate 1 can be obtained, for example, by laminating a plurality of green sheets and firing them in a nitrogen atmosphere. A first heater 2 and a second heater 3 are provided inside the ceramic substrate 1. Further, if necessary, an electrostatic adsorption electrode 6 may be provided inside the ceramic substrate 1. In order to obtain such a configuration, the first heater 2, the second heater 3 or the electrostatic adsorption is used after baking by using a screen printing method or the like on a desired green sheet among the plurality of green sheets before baking described above. What is necessary is just to print the pattern used as the electrode 6. FIG. The dimensions of the ceramic substrate 1 can be set, for example, such that the diameter of the main surface is about 30 to 500 mm and the thickness is about 5 to 25 mm.

  The metal member 4 is a member for holding the ceramic substrate 1. As shown in FIG. 2, the metal member 4 has a flange portion 41 provided on the other main surface of the ceramic substrate 1 and a cylindrical portion 42 that extends away from the ceramic substrate 1 from the flange portion 41. The flange 41 is joined to the other main surface of the ceramic substrate 1. The collar part 41 and the cylinder part 42 can be integrally formed. The collar part 41 and the cylinder part 42 are made of a metal material having excellent heat resistance and productivity, such as Fe—Ni—Co.

In the metal member 4, the flange portion 41 is a portion joined to the other main surface of the ceramic substrate 1. The flange portion 41 is an annular portion and is provided on the other main surface of the ceramic substrate 1. More specifically, the collar portion 41 is an annular portion. The dimension of the collar part 41 can set an internal diameter to about 20-450 mm and the width | variety of a ring to about 2-20 mm, for example. The thickness of the collar part 41 and the cylinder part 42 can be set to 0.2-2 mm, for example. The inner diameter of the flange 41 is provided in the ceramic substrate 1 in order to introduce various terminals (not shown) arranged on the other main surface of the ceramic substrate 1 and to introduce gas into the sample processing apparatus 100. It is set based on the arrangement of gas supply holes (not shown) and the like. In addition, the width of the ring of the collar portion 41 is set so that the bonding strength between the ceramic substrate 1 and the metal member 4 can be sufficiently secured.

  The flange 41 and the ceramic substrate 1 are joined by a brazing material. As the brazing material, for example, silver brazing or silver copper brazing can be used. A metallized layer (not shown) is provided on the other main surface of the ceramic substrate 1 in order to better bond the flange portion 41 and the ceramic substrate 1. The metallized layer is provided corresponding to the shape of the collar portion 41. Specifically, the metallized layer is also in an annular shape so as to correspond to the annular flange 41. As the metallized layer, for example, an Ag—Cu—Ti-based tool or the like can be used.

  The first heater 2 is a member for heating the sample held on the sample holding surface 11 of the ceramic substrate 1 together with the second heater 3. The first heater 2 is provided between the layers of the ceramic substrate 11. By applying a voltage to the first heater 2, the first heater 2 can generate heat. The heat generated by the first heater 2 is transmitted through the inside of the ceramic substrate 1 and reaches the sample holding surface 11 on the upper surface of the ceramic substrate 1. Thereby, the sample held on the sample holding surface 11 can be heated. The first heater 2 is a linear pattern having a plurality of folded portions, and is formed on almost the entire surface between layers of the ceramic substrate 1. Specifically, as shown in FIG. 3, a linear pattern having a plurality of folded portions arranged concentrically is formed almost entirely between one layer of the ceramic substrate 1. In FIG. 3, although it is a cross-sectional view, hatching is omitted for the sake of easy viewing. Further, the wiring pattern of the first heater 2 is shown by partially displaying a region where the first heater 2 is provided and partially expanding the region. The first heater 2 is formed so that the heat generation density is constant. Thereby, it can suppress that dispersion | variation arises in heat distribution in the upper surface of the sample holder 10. FIG.

  The first heater 2 includes a conductor component and a ceramic component. As a conductor component, the metal material which consists of tungsten or tungsten carbide, for example is included. As a ceramic component, the powder which consists of the same component as the ceramic substrate 1, such as aluminum nitride, is included.

  The second heater 3 is a member for heating the sample held on the sample holding surface 11 of the ceramic substrate 1 together with the first heater 2. The second heater 3 has a linear pattern and is provided between different layers from the first heater 2. As shown in FIG. 4, the 2nd heater 3 is formed in the annular | circular shape so that it may correspond to the collar part 41 of the metal member 4 arrange | positioned in an annular | circular shape, for example. The second heater 3 is made of the same material as the first heater 2. In FIG. 4, although it is a cross-sectional view, hatching is omitted for the sake of easy viewing. The wiring pattern of the second heater 3 is shown by partially displaying a region where the second heater 3 is provided and partially expanding the region.

  In the sample holder 10 of the present embodiment, the second heater 3 is provided so as to at least partially overlap the metal member 4 when seen through in plan. Thereby, it is possible to partially increase the heat generation density directly above the metal member 4. As a result, the thermal uniformity of the sample holding surface 11 can be improved. In the present embodiment, the second heater 3 is provided between the first heater 2 and the sample holding surface 11, but the present invention is not limited to this. Specifically, the second heater 3 may be provided between the metal member 4 and the first heater 2.

Furthermore, it is preferable that the first heater 2 at least partially overlaps the metal member 4 when viewed in plan. As a result, a portion where the first heater 2 and the second heater 3 overlap can be formed immediately above the metal member 4, so that the heat generation density can be increased immediately above the metal member 4.

  Further, the metal member 4 is preferably in an annular shape at a portion in contact with the other main surface of the ceramic substrate 1, and the second heater 3 is overlapped with a portion in contact with the other main surface of the metal member 4. . Thereby, when the ceramic substrate 1 and the metal member 4 are thermally expanded or contracted under the heater cycle, the second heater 3 having the same shape as the metal member 4 sandwiches a part of the ceramic substrate 1 together with the metal member 4. Thereby, the deformation | transformation which arises in the ceramic substrate 1 can be suppressed. Thereby, the long-term reliability of the sample holder 10 can be improved. Here, “the second heater 3 has an annular shape” means not only the case where the second heater 3 itself has an annular shape, but also the second heater 3 has a fine wiring pattern and this wiring pattern. This also includes the case where the region provided with is an annular shape.

  Furthermore, as shown in FIG. 5, when the ceramic substrate 1 has the convex portion 12 on the other main surface and at least a part of the second heater 3 overlaps with the convex portion 12 when seen through the plane. Good. The convex portion 12 is provided, for example, to make it easy to attach the metal member 4 to the sample holder 10. Specifically, by providing the metal member 4 on the surface of the convex portion 12, the metal member 4 and the wiring provided in a portion where the convex portion is not provided can be arranged separately. Further, as a configuration different from the configuration shown in FIG. 5, the metal member 4 can be fitted into the convex portion such that the inner peripheral surface of the metal member 4 is brought into contact with the convex portion. In the portion where the convex portion 12 is provided, heat easily escapes to the outside due to an increase in the surface area. However, by providing the second heater 3 so as to overlap the convex portion 12, the level on the sample holding surface 11 is increased. Thermal deterioration can be reduced.

  Furthermore, it is preferable that the first heater 2 and the second heater 3 are electrically independent. Since the first heater 2 and the second heater 3 can be controlled independently of each other, the temperature distribution of the ceramic substrate 1 can be controlled more precisely. Thereby, the soaking | uniform-heating property of the sample holding surface 11 can further be improved.

  Furthermore, an input terminal and an output terminal may be further provided on the surface of the ceramic substrate 1, and the first heater 2 and the second heater 3 may be electrically connected to the input terminal and the output terminal. Thus, the number of input / output terminals can be reduced by connecting the first heater 2 and the second heater 3 to one input / output terminal. This can reduce the possibility of unnecessary heat pulling.

  In the above-described embodiment, the example in which the first heater 2 is formed almost entirely between one layer of the ceramic substrate 1 is shown, but the present invention is not limited to this. The first heater 2 is formed at the center between one layer of the ceramic substrate 1, and the second heater 3 is formed at the outer periphery between different layers of the ceramic substrate 1. 4, the first heater 2 and the second heater 3 may be arranged so as to overlap each other. The sample holder 10 is not limited to the first heater 2 and the second heater 3, and may further include a third heater that overlaps the metal member 4 in a plan view.

1: Ceramic substrate 11: Sample holding surface 12: Convex part 2: First heater 3: Second heater 4: Metal member 41: Gutter part 42: Tube part 5: Case 6: Electrode for electrostatic attraction 50: Through hole 10: Sample holder 100: Sample processing apparatus

Claims (7)

  A ceramic substrate formed of a laminate having a sample holding surface on one main surface; a first heater provided between layers of the ceramic substrate; a metal member provided on the other main surface of the ceramic substrate; A sample comprising: a second heater provided in a different layer from the layer in which the first heater of the ceramic substrate is provided so that at least part of the metal member overlaps when viewed through Retaining tool.   2. The sample holder according to claim 1, wherein the first heater is at least partially overlapped with the metal member when viewed through a plane.   The metal member has an annular shape in contact with the other main surface of the ceramic substrate, and the second heater has an annular shape overlapping with a portion in contact with the other main surface of the metal member. The sample holder according to claim 1.   The ceramic substrate has a convex portion on the other main surface, and at least a part of the second heater overlaps the convex portion when seen through a plane. Sample holder.   The sample holder according to any one of claims 1 to 4, wherein the first heater and the second heater are electrically independent.   The input terminal and the output terminal are further provided on the surface of the ceramic substrate, and the first heater and the second heater are electrically connected to the input terminal and the output terminal. The sample holder according to any one of claims 1 to 4.   A sample holder according to any one of claims 1 to 6 and a casing having a through hole, and the ceramic substrate and the metal member are attached to the casing so as to block the through hole. A sample processing apparatus.