JP2017011006A - Semiconductor unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the cooling efficiency of a semiconductor module having projections for cooling.SOLUTION: A semiconductor unit 1 includes: a semiconductor module 10 having a plurality of protrusions 12 for cooling; a cooling module 30 for releasing heat generated by the semiconductor module 10; and a connection module 20 having connection surfaces 21a, 21b connecting the semiconductor module 10 with the cooling module 30. Heat radiation sheets 25, 28 are provided on the connection surfaces 21a, 21b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor unit having a semiconductor module such as an insulated gate bipolar transistor (IGBT).

  Conventionally, it is known that a semiconductor module such as an IGBT is used for an inverter that controls a high output motor such as a motor for a hybrid electric vehicle. Since these semiconductor modules generate a large amount of heat, a cooling system with high cooling efficiency is generally used for cooling the semiconductor modules. Moreover, what has the fin (projection) for cooling is known in the semiconductor module used for a water cooling system (for example, patent document 1).

JP 2004-259791 A

  However, for example, when cooling a semiconductor module having these cooling protrusions using an air cooling method, there arises a problem that the cooling efficiency must be further improved.

  Therefore, an object of the present invention is to provide a semiconductor unit capable of improving the cooling efficiency of a semiconductor module having a cooling protrusion.

  In order to solve the above problems, for example, the configuration described in the claims is adopted. The present application includes a plurality of means for solving the above problems. To give an example, a semiconductor module having a plurality of cooling projections, a cooling module for releasing heat generated in the semiconductor module, and a semiconductor A semiconductor unit comprising a connection module having a connection surface for connecting the module and the cooling module, and a heat radiating portion provided on the connection surface of the connection module, wherein the cooling module is attached to the semiconductor module via the connection module Is achieved.

  According to the semiconductor unit of the present invention, it is possible to improve the cooling efficiency of the semiconductor module having the cooling protrusion.

It is a cross-sectional schematic diagram which shows the basic structure of the semiconductor unit which concerns on embodiment of this invention. 1 is a top perspective view of a semiconductor module according to an embodiment of the present invention. FIG. 3A is a top perspective view of the connection module according to the embodiment of the present invention, and FIG. 3B is a schematic cross-sectional view of the connection module according to the embodiment of the present invention. It is a perspective view of the heat dissipation sheet which concerns on embodiment of this invention. It is a perspective view of the heat dissipation sheet which concerns on embodiment of this invention. It is an upper surface perspective view of the cooling module which concerns on embodiment of this invention. It is a whole perspective view of the mounting jig for attaching a heat radiating sheet to the connection module of the semiconductor unit concerning the embodiment of the present invention. It is a disassembled perspective view of the mounting jig for attaching a thermal radiation sheet to the connection module of the semiconductor unit which concerns on embodiment of this invention. It is explanatory drawing (the 1) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 2) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 3) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 4) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 5) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 6) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is explanatory drawing (the 7) about the manufacture procedure of the connection module using the mounting jig which concerns on embodiment of this invention. It is the whole semiconductor unit mounting jig perspective view for attaching a semiconductor module and a cooling module to a connection module concerning an embodiment of the present invention. It is a top view of the semiconductor unit mounting jig which concerns on embodiment of this invention. It is a schematic block diagram of the connection module guide used when attaching a connection module to the semiconductor module mounted in the mounting jig main body which concerns on embodiment of this invention. It is a schematic block diagram of the set member to which two semiconductor modules were connected and fixed.

  Hereinafter, an example of a semiconductor unit according to an embodiment of the present invention will be described with reference to the drawings. In addition, this invention is not limited to the following examples.

[Configuration of semiconductor unit]
FIG. 1 is a schematic cross-sectional view showing a basic structure of a semiconductor unit 1 according to an embodiment of the present invention. As shown in FIG. 1, the semiconductor unit 1 of this embodiment includes a semiconductor module 10, a connection module 20, and a cooling unit 30.

FIG. 2 is a top perspective view of the semiconductor module 10 according to the embodiment of the present invention.
As shown in FIG. 2, the semiconductor module 10 is generated in a rectangular chip portion 11 made of a power semiconductor element such as an IGBT in which a circuit pattern or the like is formed, and a power semiconductor element provided on a flat surface 11 a of the chip portion 11. It consists of a plurality of protrusions 12 for releasing heat. In the present embodiment, the plurality of protrusions 12 are provided on both surfaces of the front surface 11 a of the chip portion 11 that is one plane of the semiconductor module 10 and the back surface 11 b of the chip portion 11 that is the other plane of the semiconductor module 10. However, the protrusions 12 may be provided only on one surface of the chip portion 11.

FIG. 3A is a top perspective view of the connection module 20 according to the embodiment of the present invention, and FIG. 3B is a schematic cross-sectional view thereof.
As shown in FIG. 3A, the connection module 20 includes a rectangular main body receiving portion 21 and a quadrangular columnar connecting receiving portion 22 provided along an end in the short direction of the main body receiving portion 21. Yes. The connection receiving portion 22 is disposed so as to face the main body receiving portion 21, and a recess 21 c is formed between the connection receiving portions 22. A plurality of through holes 23 for penetrating the protrusions 12 of the semiconductor module 10 are formed in the central portion of the main body receiving portion 21. As shown in FIG. 3B, the through hole 23 is formed so as to penetrate the main body receiving portion 21. A heat radiation part 24 on the semiconductor module 10 side is provided on the flat surface 21 a of the main body receiving part 21 on the side where the connection receiving part 22 is provided. The connecting module 20 is attached to the semiconductor module 10 using the flat surface 21a as a connecting surface.

  As shown in FIG. 4, the heat dissipating part 24 is composed of a rectangular heat dissipating sheet 25. The size of the heat radiating sheet 25 is configured to be the same as the area of the flat surface 21 a of the main body receiving portion 21. In addition, a plurality of through holes 26 formed at the same interval as the protrusions 12 formed in the semiconductor module 10 are provided in the central portion of the heat dissipation sheet 25.

  The heat radiating sheet 25 is a heat conductive sheet made of silicon or acrylic having excellent heat conductivity, and conducts heat generated in the semiconductor module 10 to the connection module 20. The heat dissipation sheet 25 is made of a flexible soft material, and fills a gap generated between the semiconductor module 10 and the connection module 20 when the connection module 20 is attached to the semiconductor module 10. Fulfill. The gap is caused by minute irregularities present on the surfaces of the semiconductor module 10 and the connection module 20. In the present embodiment, by using the heat radiating sheet 25, air does not exist in the gap, and the heat conduction from the semiconductor module 10 to the connection module 20 can be prevented from being lowered.

  A heat dissipating portion 27 on the cooling module 30 side is provided on the flat surface 21b on the side opposite to the flat surface 21a on the side on which the connection receiving portion 22 of the main body receiving portion 21 is provided. The cooling module 30 is attached to the connection module 20 using the flat surface 21b as a connection surface.

  As shown in FIG. 5, the heat dissipating part 27 is composed of a rectangular heat dissipating sheet 28. The size of the heat dissipation sheet 28 is configured to be the same as the area of the flat surface 21 b of the connection module 20. The heat dissipation sheet 28 is a heat conductive sheet made of silicon or acrylic having excellent heat conductivity, and conducts heat conducted from the semiconductor module 10 to the connection module 20 to the cooling unit 30. The heat dissipation sheet 28 is made of a flexible soft material, and fills a gap generated between the cooling module 30 and the connection module 20 when the cooling module 30 is attached to the connection module 20. Fulfill. In order to prevent a decrease in the thermal conductivity from the connection module 20 to the cooling module 30, the heat dissipation sheet 28 is not provided with a through hole as formed in the heat dissipation sheet 25.

  In the present embodiment, the heat dissipating parts 24 and 27 are formed of sheet-like members, but the heat dissipating part may be formed by applying grease or the like, for example.

FIG. 6 is a top perspective view of the cooling module 30 according to the embodiment of the present invention.
As shown in FIG. 6, the cooling module 30 includes a main body portion 31 formed in a rectangular shape and a plurality of connecting portions 32 provided at equal intervals along the periphery of the main body portion 31. The main body 31 has a plurality of fins (not shown) for releasing heat generated in the semiconductor module 10. The connecting portion 32 is for connecting and fixing a pair of cooling modules 30. The connecting portion 32 of one cooling module 30 is configured by a through hole, and the connecting portion 32 of the other cooling module 30 is threaded. It is comprised by the hole provided.

  As shown in FIG. 1, in the semiconductor unit 1, connection modules 20 are attached in the vertical direction of the semiconductor module 10 having the protrusions 12. The two connection modules 20 are attached so as to sandwich the semiconductor module 10 in a state in which the respective connection receiving portions 22 are matched. In this way, by attaching the connection module 20 in a state where the connection receiving part 22 is matched, an extra force applied to the connection module 20 can be absorbed by the connection receiving part 22 when attaching to the semiconductor module 10. Thereby, it is possible to prevent an excessive force from being applied to the semiconductor module 10 and to prevent the circuit pattern of the semiconductor element and the protrusion 12 from being damaged.

  Further, as described above, the heat radiation sheet 25 is provided between the semiconductor module 10 and the connection module 20. Thereby, a minute gap between the semiconductor module 10 and the connection module 20 can be filled, and a decrease in thermal conductivity between the semiconductor module 10 and the connection module 20 can be suppressed.

  The cooling module 30 is attached to the surface 21b opposite to the surface 21a to which the semiconductor module 10 of the connection module 20 is attached. The cooling module 30 is attached so as to sandwich the semiconductor module 10 and the connection module 20 with the connection portions 32 formed in the respective modules facing each other.

  A bolt-shaped connecting tool 33 is inserted from the cooling module side where the connecting part 32 is a through hole, and the tip of the connecting tool 33 is fixed by a threaded hole formed in the connecting part 32 of one cooling module. . Thus, the two cooling modules 30 are connected and fixed in a state where the semiconductor module 10 is sandwiched between the connecting portion 32 and the connecting tool 33 as the fixing portions.

  A heat dissipation sheet 28 is provided between the connection module 20 and the cooling module 30. Thereby, a minute gap between the connection module 20 and the cooling module 30 can be filled, and a decrease in thermal conductivity between the connection module 20 and the cooling module 30 can be suppressed.

  Thus, in the semiconductor unit 1 of the present embodiment, the cooling module 30 is attached to the semiconductor module 10 via the connection module 20. Further, heat radiation sheets 25 and 28 are provided between the semiconductor module 10 and the connection module 20 and between the connection module 20 and the cooling module 30. For this reason, the fall of the heat conductivity between the semiconductor module 10 and the connection module 20 and between the connection module 20 and the cooling module 30 can be suppressed, and the cooling efficiency of the semiconductor module 10 can be improved.

  Thus, according to the semiconductor unit 1 of the present embodiment, by improving the cooling efficiency of the semiconductor module 10 having the cooling protrusions, for example, the semiconductor module used in the water cooling method is diverted to the air cooling method. be able to.

  In the present embodiment, the semiconductor unit 1 using the semiconductor module 10 having the cooling protrusions 12 on both sides has been described. However, the present invention can also be applied to a semiconductor module having the cooling protrusions on only one side.

  Next, the manufacturing process of the semiconductor unit 1 will be described.

[Manufacturing apparatus for connecting module 20]
FIG. 7 is an overall perspective view of a mounting jig 40 for attaching the heat radiation sheets 25 and 28 to the connection module 20 of the semiconductor unit 1 of the present embodiment, and FIG. 8 is an exploded perspective view of the mounting jig 40. is there.

  As shown in FIG. 7, the mounting jig 40 for attaching the heat radiation sheets 25 and 28 to the connection module 20 includes a box-shaped mounting jig main body 41 and a lid placed on the mounting jig main body 41. A first pressing jig 42 also serving as a second pressing jig 50 accommodated in the mounting jig main body 41 is provided. The first pressing jig 42 is used when the heat radiation sheet 28 is attached to the connection module 20. The second pressing jig 50 is used when the heat radiation sheet 25 is attached to the connection module 20.

  The first pressurizing jig 42 includes a flat pressurizing jig main body 43 that matches the shape of the opening 41 a formed on the upper surface of the mounting jig main body 41. The pressurizing jig main body 43 is provided with a gripping portion 43a used when the first pressurizing jig 42 is taken in and out through the opening 41a.

  FIG. 8 is an exploded perspective view of the mounting jig 40. As shown in FIG. 8, the mounting jig body 41 includes a rectangular tube-shaped storage jig 44 and a connection module holding jig 46 that is fixed below the storage jig 44 by a fixing screw 45. . A rectangular space 44 a for storing the connection module 20 is formed in the central portion of the storage jig 44. Note that openings 41a are formed above and below the space 44a. An insertion hole 44b for removably inserting the fixing screw 45 is formed in the lower part of the outer peripheral surface of the storage jig 44. The insertion holes 44b are formed on one side surface of the outer peripheral surface of the storage jig 44 and the side surface facing the side surface, and two insertion holes 44b are provided on one side surface.

  The connection module holding jig 46 includes a rectangular holding jig main body 47 and a plurality of holding members 48 erected on the upper surface of the holding jig main body 47. The holding jig body 47 is formed in a shape that matches the opening 41a. An insertion hole 47 a into which the tip of the fixing screw 45 is inserted is formed in the side surface portion of the holding jig main body 47. The insertion holes 47a are formed on one side surface of the holding jig main body 47 and the side surface facing the side surface, and two insertion holes 47a are provided on one side surface. The holding jig main body 47 is fixed to the storage jig 44 by the fixing screw 45, thereby closing the lower opening 41 a and configuring the bottom of the mounting jig main body 41. Further, a concave portion is formed on the surface of the holding jig main body 47 opposite to the side on which the holding member 48 is provided, and a grip portion 49 (not shown) is provided in the concave portion.

  The holding member 48 provided in the holding jig main body 47 is a pin member formed in a rod shape, and a taper is formed at the tip of the pin member. The arrangement of the plurality of support members 48 is the same as the arrangement of the through holes 23 formed in the main body receiving portion 21 of the connection module 20. Further, the length of the holding member 48 is set to be longer than at least the thickness of the main body receiving portion 21 of the connection module 20.

  The second pressurizing jig 50 includes a rectangular pressurizing jig main body 51, a quadrangular prism-shaped convex portion 52 provided along an end of the pressurizing jig main body 51 in the short direction, and a rectangular shape And a pressing surface portion 53. The convex portions 52 are arranged so as to face each other on the pressing jig main body 51. The shape of the pressurizing jig body 51 is formed to match the opening 41a. In addition, a grip portion 54 is provided on the surface of the pressing jig main body 51 on the side where the convex portion 52 is provided. The pressing surface portion 53 is attached to the surface opposite to the side where the grip portion 54 of the pressing jig body 51 is provided. The shape of the pressing surface portion 53 is formed so as to fit with the concave portion 21 c of the connection module 20. In addition, an insertion hole 55 (not shown) for inserting the tip of the holding member 48 of the connection module holding jig 46 is formed in the pressing surface portion 53.

[Manufacturing Procedure of Connecting Module 20]
Next, the manufacturing procedure of the connection module 20 using the mounting jig 40 will be described with reference to FIGS.

  First, the first pressure jig 42 is removed from the mounting jig 40 and the second pressure jig 50 accommodated in the mounting jig body 41 is taken out. After taking out the second pressure jig 50, as shown in FIG. 9, the connecting module 20 is inserted into the space 44a with the plane 21b of the main body receiving portion 21 facing downward. Since the shapes of the main body receiving portion 21 and the opening 41 a of the connection module 20 match, the connection module 20 moves below the mounting jig main body 41 while being guided by the inner peripheral wall 44 c of the storage jig 44. .

  When the connecting module 20 moves downward, the holding member 48 of the connecting module holding jig 46 is inserted into the through hole 23 of the main body receiving portion 21 of the connecting module 20, and the connecting module 20 is mounted as shown in FIG. Set on the tool body 41. At this time, the connection module 20 is set in a state where the tip of the holding member 48 protrudes from the through hole 23 of the connection module 20. In addition, since the taper is formed in the front-end | tip of the holding member 48, the through-hole 23 of the connection module 20 can be inserted easily.

  Next, the heat dissipation sheet 25 is inserted into the space 44a. The heat radiating sheet 25 is set on the mounting jig body 41 so that the through hole 26 of the inserted heat radiating sheet 25 and the tip of the holding member 48 are aligned. Since the heat dissipating sheet 25 is composed of a flexible thin member, as shown in FIG. 11, the heat dissipating sheet 25 is held in a state of being locked in the middle of the protective member 48 protruding from the connection module 20.

  Next, the second pressing jig 50 is inserted into the space 44 a with the pressing surface portion 53 facing downward. Since the shapes of the jig main body 51 and the opening 41a of the second pressure jig 50 are matched, the jig main body 51 of the second pressure jig 50 is mounted on the mounting jig while being guided by the inner peripheral wall 44c. It moves below the tool body 41. The insertion hole 55 of the second pressure jig 50 that has moved downward is inserted into the tip of the holding member 48, and further, when the second pressure jig 50 is moved downward, the pressure surface portion 53 is brought into contact with the holding member 48. The protective sheet 25 that is locked on the way is contacted and pressed. When the second pressurizing jig 50 is further moved downward, as shown in FIG. 12, the pressurizing surface portion 53 is engaged with the concave portion 21c of the connecting module 20, and the protective sheet 25 is placed on the flat surface 21a of the connecting module 20. It is attached. Thus, according to the mounting jig 40 of the present embodiment, the protective sheet 25 can be easily attached to the connection module 20. In addition, since the protective sheet 25 is pressed by the pressing surface portion 53 of the second pressurizing jig 50 with an equal pressing force, there is no possibility of damaging the protective sheet 25 as compared with the case where the protective sheet is manually attached.

  Next, the mounting jig 40 is turned upside down. When the mounting jig 40 is turned upside down, the connection module 20 and the second pressure jig 50 and the connection module holding jig are caused by the weight of the connection module 20 and the second pressure jig 50 as shown in FIG. 46 is disengaged from the holding member 48, and the connection module 20 is placed on the second pressure jig 50. In this state, the fixing screw 45 is removed from the mounting jig main body 41, and the connection module holding jig 46 is removed from the mounting jig main body 41 by holding the holding portion 49 of the connection module holding jig 46.

  Next, the heat dissipation sheet 28 is inserted into the space 44a. The heat dissipation sheet 28 is formed in the same size as the surface 21 b of the connection module 20, and is placed on the surface 21 b of the connection module 20. Next, the holding part 43a of the first pressing jig 42 is held and inserted into the space part 44a. Since the shapes of the first pressure jig 42 and the opening 41a match, the first pressure jig 42 is guided by the inner peripheral wall 44c of the storage jig 44, as shown in FIG. It is placed on the heat dissipation sheet 28. Next, the heat radiating sheet 28 is attached to the flat surface 21 b of the connection module 20 by pressurizing the heat radiating sheet 28 with the first pressing jig 42. Thus, according to the mounting jig 40 of the present embodiment, the protective sheet 28 can be easily attached to the connection module 20. In addition, since the protective sheet 28 is pressed by the first pressing jig 42 with an equal pressing force, the protective sheet 25 is not likely to be damaged as compared with the case where the protective sheet is manually attached.

  Next, holding the holding part 43a, moving the first pressure jig 42 upward, pulling it out from the mounting jig body 41, and then moving the storage jig 44 upward, FIG. As shown, the connection module 20 placed on the second pressure jig 50 can be taken out. Finally, by removing the connection module 20 from the second pressure jig 50, it is possible to obtain the connection module 20 having the heat radiation sheets 25 and 28 attached to both sides as shown in FIG. 3B.

  As described above, by using the mounting jig 40 of this embodiment, the connection module 20 having the heat radiation sheets 25 and 28 attached to both surfaces can be easily manufactured.

[Semiconductor unit 1 manufacturing apparatus]
FIG. 16 is an overall perspective view of a semiconductor unit mounting jig 60 for attaching the semiconductor module 10 and the cooling module 30 to the connection module 20 of the present embodiment, and FIG. 17 is a top view of the semiconductor unit mounting jig 60. is there.
As shown in FIG. 16, the semiconductor unit mounting jig 60 includes a first mounting jig 70 used when attaching the connection module 20 to the semiconductor module 10 and a first mounting jig 70 used when attaching the cooling module 30 to the connection module 20. 2 mounting jig 80.

  The first mounting jig 70 includes a mounting jig main body 71 made of a rectangular flat plate. On the upper surface of the mounting jig body 71, a recess 72 for mounting the semiconductor module 10 and a recess 73 for attaching a set member 65 for connecting and supporting the semiconductor module 10 are formed. The shape of the recess 72 is rectangular and is formed in accordance with the shape of the semiconductor module 10 to be placed. In the present embodiment, two recesses 72 are provided, and the two recesses 72 are provided at a predetermined distance along the longitudinal direction of the mounting jig body 71. In the present embodiment, the number of recesses 72 is two, but the number of recesses may be one or three according to the number of semiconductor modules 10 connected to the set member 65. You may provide above. The concave portion 73 is a groove formed along the longitudinal direction of the mounting jig main body 71 and is a groove portion into which the support body 64 of the set member 65 is fitted.

  The second mounting jig 80 includes a mounting jig body 81 made of a rectangular flat plate. On the upper surface of the mounting jig body 81, a recess 82 for mounting the cooling module 30 and a recess 83 for attaching a set member 65 for connecting and supporting the semiconductor module 10 are formed. The recess 83 is a groove formed along the longitudinal direction of the mounting jig body 81, and when the first mounting jig 70 and the second mounting jig 80 are combined, the support 64 of the set member 65. Is a groove to be fitted.

[Manufacturing Procedure of Semiconductor Unit 1]
FIG. 17 is a top view of the semiconductor unit mounting jig 60, and is configured by connecting a first mounting jig 70 and a second mounting jig 80 arranged side by side with a plurality of hinges 61. A handle 74 is provided outside the first mounting jig 70, and 84 is provided outside the second mounting jig 80.

FIG. 18 is a schematic configuration diagram of a connection module guide 90 used when attaching the connection module 20 to the semiconductor module 10 placed on the mounting jig main body 71.
As shown in FIG. 18, the connection module guide 90 includes a guide body 91 that is formed in a U shape that guides the connection module 20, and a leg portion 92 that is provided at a lower portion of the corner of the guide body 91. Composed. The size of the guide body 91 is formed in accordance with the size of the connection module 20. The leg portion 92 is inserted into an engagement hole (not shown) provided on the upper surface of the mounting jig main body 71 to determine the position of the connection module guide 90 on the mounting jig main body 71. In this embodiment, a cooling module guide that guides the cooling module 30 is also used. However, the configuration of the cooling module guide is different from the rare module guide 90 only in the size of the U-shaped portion of the guide body. The description is omitted here.

  First, a set member 65 is prepared in which two semiconductor modules 10 are connected and fixed to a long flat support 64 as shown in FIG. Next, the support member 64 of the set member 65 is fitted into the recess 73 of the mounting jig body 71 of the first mounting jig 70, and the set member 65 is attached to the first mounting jig 70, and at the same time, the setting member The semiconductor module 10 connected to 65 is placed on the recess 72 of the mounting jig body 71.

  Next, the connection module guide 90 is attached to the mounting jig body 71 in accordance with the position of the semiconductor module 10 placed on the recess 72. Next, the connecting module 20 is attached to the semiconductor module 10 placed on the recess 72 while being guided by the connecting module guide 90. After the connection module 20 is attached to the semiconductor module 10, the connection module guide 90 is removed from the mounting jig body 71. In the present embodiment, since the connection module guide 90 is used, the position of the connection module 20 is not shifted when the connection module 20 is attached to the semiconductor module 10. Therefore, the connection module 20 is accurately attached to the semiconductor module. Can do.

  Next, after attaching a cooling module guide to the mounting jig body 81 of the second mounting jig 80, the cooling module 30 is placed in the recess 82 of the mounting jig body 81 while being guided by the cooling module guide. After placing the cooling module 30 in the recess 82, the cooling module guide is removed from the mounting jig body 82. By using the cooling module, the cooling module 30 can be accurately placed on the mounting jig body 81.

  Next, the handle 84 of the second mounting jig 80 is gripped, and the second mounting jig 80 is rotated in the direction of the first mounting jig 70 around the hinge 61, so that the first mounting jig 70 and the second mounting jig 70 are rotated. The mounting jig 80 is united. Thereby, the cooling module 30 in the second mounting jig 80 is attached to the connection module 20 in the first mounting jig 70.

  Next, in the state where the first mounting jig 70 and the second mounting jig 80 are combined, the vertical direction is reversed. After reversing, the grip 74 of the first mounting jig 70 is gripped, and the first mounting jig 70 is rotated to release the united state and return to the initial state juxtaposed with the second mounting jig 80. . At this time, the semiconductor module 10 is placed on the mounting jig body 81 of the second mounting jig 80 with the surface to which the cooling module 30 is not attached facing upward.

  Next, in accordance with the position of the semiconductor module 10 placed on the mounting jig body 81, the connecting module guide 90 is attached to the mounting jig body 81, and the connecting module 20 is guided by the connecting module guide 90. The semiconductor module 10 mounted on the mounting jig body 81 is attached. After the connection module 20 is attached to the semiconductor module 10, the connection module guide 90 is removed from the mounting jig body 81, and the cooling module guide is attached to the mounting jig body 81. Next, the cooling module 30 is attached to the connection module 20 while being guided by the cooling module guide, and then the cooling module guide is removed from the mounting jig body 82.

  Next, the semiconductor module 10 to which the connection module 20 and the cooling module 30 are attached is taken out from the mounting jig body 81. Finally, the connection part 32 formed in the cooling module 30 is fixed with a bolt-shaped connection tool 33, and the semiconductor unit 1 as shown in FIG. 1 can be obtained.

  In the present embodiment, the cooling module 30 is attached to the connection module 20 on the first mounting jig 70 using the second mounting jig 80, but without using the second mounting jig 80, The cooling module 30 may be directly attached to the connection module 20 on the first mounting jig 70.

  As described above, the present invention has been described based on the embodiment. However, the present invention is not limited to the configuration described in the above-described embodiment, and the configuration can be appropriately changed without departing from the gist thereof. Is. For example, the above-described exemplary embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of an embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of an embodiment. In addition, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  DESCRIPTION OF SYMBOLS 1 ... Semiconductor unit, 10 ... Semiconductor module, 11 ... Chip part, 20 ... Connection module, 21 ... Main body receiving part, 24 ... Radiation part, 25 ... Radiation sheet, 27 ... Radiation part, 28 ... Radiation sheet, 30 ... Cooling module , 32 ... connecting portion, 33 ... connecting tool, 40 ... mounting jig, 41 ... mounting jig main body, 42 ... first pressurizing jig, 43 ... pressurizing jig main body, 44 ... storage jig, 44a ... space 45, fixing screw, 46 ... connecting module holding jig, 47 ... holding jig body, 48 ... holding member, 50 ... second pressing jig, 53 ... pressing surface part, 60 ... semiconductor unit mounting jig, 70 ... 1st mounting jig, 80 ... 2nd mounting jig

Claims (4)

A semiconductor module having a plurality of cooling protrusions;
A cooling module for releasing heat generated in the semiconductor module;
A connection module having a connection surface for connecting the semiconductor module and the cooling module;
A heat dissipating part provided on the connection surface of the connection module,
A semiconductor unit in which the cooling module is attached to the semiconductor module via the connection module. The said heat radiating part is a sheet | seat member which has flexibility, Comprising: The some hole for engaging with the some protrusion which the said semiconductor module has is formed in the said sheet member. Semiconductor unit. The semiconductor module has one plane on which the plurality of cooling projections are formed, and another plane on which the plurality of cooling projections are formed on the opposite side of the one plane,
The semiconductor unit according to claim 1, wherein the cooling module is attached to one plane and the other plane of the semiconductor module via the connection module. The semiconductor unit according to claim 3, further comprising: a fixing portion that connects and fixes the cooling module attached to one plane of the semiconductor module and the cooling module attached to the other plane of the semiconductor module.

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