JP2017010773A - Lighting device - Google Patents

Lighting device Download PDF

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JP2017010773A
JP2017010773A JP2015124989A JP2015124989A JP2017010773A JP 2017010773 A JP2017010773 A JP 2017010773A JP 2015124989 A JP2015124989 A JP 2015124989A JP 2015124989 A JP2015124989 A JP 2015124989A JP 2017010773 A JP2017010773 A JP 2017010773A
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housing
substrate
light emitting
emitting element
light
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JP6579311B2 (en
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鈴木　勝也
Katsuya Suzuki
勝也 鈴木
増田　敏文
Toshifumi Masuda
敏文 増田
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which has good design and enables improvement of merchantability.SOLUTION: A lighting device 10 includes a housing 11, a light source unit 12, and a translucent cover 15. The housing 11 has an opening 35. The light source unit 12 includes a substrate 20, light emitting elements 21 mounted on the substrate 20, and a power supply circuit 22 provided on the substrate 20 and is disposed in the opening 35 of the housing 11. The translucent cover 15 has: a cover part 65 covering the opening 35 of the housing 11; and a lens part 68 which is provided on the cover part 65 so as to face the light emitting elements 21. The cover part 65 excluding the lens part 68 has light diffusibility.SELECTED DRAWING: Figure 1

Description

本発明の実施形態は、発光素子を用いた照明装置に関する。   Embodiments described herein relate generally to a lighting device using a light emitting element.

従来、例えば防犯灯や道路灯等の照明装置では、筐体の下面に発光素子を実装した基板を配設するとともに、筐体内の空間部に電源回路を配設していることが多い。また、筐体の下面に発光素子からの光の配光を制御するためのレンズを配設するとともに、筐体の下面をグローブで覆っていることが多い。   2. Description of the Related Art Conventionally, for example, in a lighting device such as a crime prevention light or a road light, a substrate on which a light emitting element is mounted is disposed on the lower surface of a housing, and a power circuit is often disposed in a space portion within the housing. In addition, a lens for controlling the light distribution from the light emitting element is disposed on the lower surface of the housing, and the lower surface of the housing is often covered with a glove.

また、部品点数の削減等のために、レンズとグローブの機能を併せ持つように、レンズ部を設けた透光カバーを筐体の下面に取り付けるようにしたものがある。   In order to reduce the number of parts, a translucent cover provided with a lens portion is attached to the lower surface of the housing so as to have both a lens and a globe function.

この場合、透光カバーが基板に近接し、基板に実装されている発光素子以外の実装部品等が透光カバーに映り込みやすくなるので、意匠性が損なわれ、商品性が低下する。   In this case, the translucent cover is close to the substrate, and mounting components other than the light-emitting elements mounted on the substrate are easily reflected on the translucent cover.

特開２０１４−７２１０６号公報JP 2014-72106 A

本発明が解決しようとする課題は、意匠性が良好で、商品性を向上できる照明装置を提供することである。   The problem to be solved by the present invention is to provide an illuminating device that has good design properties and can improve commercial properties.

実施形態の照明装置は、筐体、光源ユニットおよび透光カバーを備える。筐体は、開口部を有する。光源ユニットは、基板、基板に実装された発光素子、および基板に設けられた電源回路を有し、筐体の開口部内に配設される。透光カバーは、筐体の開口部を覆うカバー部、および発光素子に対向してカバー部に設けられたレンズ部を有する。レンズ部を除くカバー部は、光拡散性を有する。   The illuminating device of embodiment is provided with a housing | casing, a light source unit, and a translucent cover. The housing has an opening. The light source unit includes a substrate, a light emitting element mounted on the substrate, and a power supply circuit provided on the substrate, and is disposed in the opening of the housing. The translucent cover includes a cover portion that covers the opening of the housing and a lens portion that is provided on the cover portion so as to face the light emitting element. The cover part excluding the lens part has light diffusibility.

本発明によれば、意匠性が良好で、商品性を向上することが期待できる。   According to the present invention, it is expected that the design property is good and the commercial property is improved.

一実施形態を示す照明装置の断面図である。It is sectional drawing of the illuminating device which shows one Embodiment. 同上照明装置の断面図である。It is sectional drawing of an illuminating device same as the above. 同上照明装置の下方から見た分解状態の斜視図である。It is a perspective view of the decomposition | disassembly state seen from the downward direction of the illuminating device same as the above. 同上照明装置の下方から見た斜視図である。It is the perspective view seen from the downward direction of the illuminating device same as the above. 同上照明装置の上方から見た斜視図である。It is the perspective view seen from the upper direction of an illuminating device same as the above. 同上照明装置の透光カバーの斜視図である。It is a perspective view of the translucent cover of an illuminating device same as the above. 同上照明装置の筐体に設けられている配線孔付近の断面図である。It is sectional drawing of wiring hole vicinity provided in the housing | casing of the illuminating device same as the above.

以下、一実施形態を、図１ないし図７を参照して説明する。   Hereinafter, an embodiment will be described with reference to FIGS. 1 to 7.

図１ないし図５に示すように、照明装置10は、例えば電柱やポール等に設置される防犯灯や街路灯である。   As shown in FIGS. 1 to 5, the lighting device 10 is a crime prevention light or a street light installed on, for example, a utility pole or a pole.

照明装置10は、筐体11、この筐体11に組み込まれる光源ユニット12と採光ユニット13とブッシング14、筐体11の下面に取り付けられる透光カバー15、光源ユニット12と透光カバー15との間に配置される延焼防止シート16等を備えている。   The illuminating device 10 includes a housing 11, a light source unit 12, a lighting unit 13 and a bushing 14 incorporated in the housing 11, a translucent cover 15 attached to the lower surface of the housing 11, and the light source unit 12 and the translucent cover 15. A fire spread prevention sheet 16 or the like disposed therebetween is provided.

まず、図１ないし図３を参照し、光源ユニット12について説明する。光源ユニット12は、基板20、この基板20にそれぞれ実装された複数の発光素子21および電源回路22を備えている。   First, the light source unit 12 will be described with reference to FIGS. The light source unit 12 includes a substrate 20, a plurality of light emitting elements 21 and a power supply circuit 22 mounted on the substrate 20, respectively.

基板20は、金属をベースとするかあるいは絶縁材料で形成され、基板20の下面に配線パターンが形成されている。基板20の表面は、光の反射率が高い白色に塗装されている。   The substrate 20 is made of metal or made of an insulating material, and a wiring pattern is formed on the lower surface of the substrate 20. The surface of the substrate 20 is painted white with high light reflectance.

基板20は、略長方形に形成され、長手方向の一端側に発光素子実装領域23aが形成され、他端側に電源回路実装領域23bが形成されている。基板20の長手方向における発光素子実装領域23aと電源回路実装領域23bとの寸法関係は、発光素子実装領域23aが電源回路実装領域23bよりも小さく、例えば１：２の関係にある。   The substrate 20 is formed in a substantially rectangular shape, a light emitting element mounting region 23a is formed on one end side in the longitudinal direction, and a power circuit mounting region 23b is formed on the other end side. The dimensional relationship between the light emitting element mounting region 23a and the power circuit mounting region 23b in the longitudinal direction of the substrate 20 is such that the light emitting element mounting region 23a is smaller than the power circuit mounting region 23b, for example, 1: 2.

発光素子実装領域23aの略中央の１個所、および電源回路実装領域23bの幅方向一側の１箇所には、基板20を筐体11にねじ25で締め付け固定するための取付孔26が形成されている。電源回路実装領域23bの幅方向他側の１箇所には、位置決め孔27が形成されている。発光素子実装領域23aの幅方向中央で取付孔26よりも一端側に、挿通孔28が形成されている。   A mounting hole 26 for fastening the substrate 20 to the housing 11 with a screw 25 is formed at one location in the approximate center of the light emitting element mounting region 23a and one location on the side in the width direction of the power circuit mounting region 23b. ing. A positioning hole 27 is formed at one place on the other side in the width direction of the power circuit mounting region 23b. An insertion hole 28 is formed at one end side of the mounting hole 26 at the center in the width direction of the light emitting element mounting region 23a.

発光素子21は、例えばＳＭＤ（Surface Mount Device）パッケージのＬＥＤが用いられている。複数の発光素子21は、基板20の下面の発光素子実装領域23aに実装され、基板20の下面の配線パターンに接続されている。本実施形態では、複数の発光素子21は、基板20の幅方向に２列で、基板20の長手方向に沿って所定の間隔をあけて３つずつ配列されている。なお、発光素子21は、ＬＥＤの場合にはＣＯＢ（Chip On Board）モジュールを用いてもよく、また、ＥＬ（Electro Luminescence）素子等を用いてもよい。   As the light emitting element 21, for example, an LED of an SMD (Surface Mount Device) package is used. The plurality of light emitting elements 21 are mounted on the light emitting element mounting region 23a on the lower surface of the substrate 20 and connected to the wiring pattern on the lower surface of the substrate 20. In the present embodiment, the plurality of light emitting elements 21 are arranged in three rows at predetermined intervals along the longitudinal direction of the substrate 20 in two rows in the width direction of the substrate 20. In the case of an LED, the light emitting element 21 may be a COB (Chip On Board) module, or an EL (Electro Luminescence) element or the like.

基板20の発光素子実装領域23aには、各発光素子21のちらつき防止のために各発光素子21に電気的に接続されるコンデンサＣが、各発光素子21の近傍にそれぞれ実装されている。   Capacitors C that are electrically connected to the light emitting elements 21 to prevent the light emitting elements 21 from flickering are mounted in the vicinity of the light emitting elements 21 in the light emitting element mounting region 23 a of the substrate 20.

電源回路22は、基板20の電源回路実装領域23bに実装されている。電源回路22は、複数の電子部品29を有している。これら電子部品29のうち、リード線を有するリード部品は基板20の上面に配置されるとともにリード線が基板20の下面に挿通して配線パターンに接続され、チップ部品は基板20の下面に配置されて配線パターンに接続されている。電子部品29には、基板20の上面に実装されていて照明装置10の周囲の明るさを検知するための照度センサ30が含まれている。そして、電源回路22は、外部から供給される交流電力を所定の直流電力に変換し、この直流電力を発光素子21に供給して発光素子21を発光させるものであり、さらに、照度センサ30によって検出する明るさが所定の閾値よりも低い場合に発光素子21を点灯させ、所定の閾値よりも高い場合に発光素子21を消灯させるように、発光素子21の点灯および消灯を自動的に制御する。なお、電源回路22には、コンデンサＣも含まれる。   The power circuit 22 is mounted on the power circuit mounting region 23b of the substrate 20. The power supply circuit 22 has a plurality of electronic components 29. Among these electronic components 29, the lead component having the lead wire is arranged on the upper surface of the substrate 20, and the lead wire is inserted into the lower surface of the substrate 20 and connected to the wiring pattern, and the chip component is arranged on the lower surface of the substrate 20. Connected to the wiring pattern. The electronic component 29 includes an illuminance sensor 30 that is mounted on the upper surface of the substrate 20 and detects the brightness around the lighting device 10. The power supply circuit 22 converts AC power supplied from the outside into predetermined DC power, supplies the DC power to the light emitting element 21, and causes the light emitting element 21 to emit light. The light emitting element 21 is automatically controlled to be turned on and off so that the light emitting element 21 is turned on when the detected brightness is lower than the predetermined threshold and the light emitting element 21 is turned off when the detected brightness is higher than the predetermined threshold. . The power supply circuit 22 includes a capacitor C.

また、図１ないし図５に筐体11を示す。筐体11は、例えばアルミニウムなどの金属製で、上面部32および周囲の側面部33を有し、内部に空間部34が形成されているとともに一面側である下面に開口部35が形成されている。筐体11の基端側には例えば電柱やポール等に取り付けられる取付部36が一体に形成されている。筐体11は、基端側から反対の先端側にかけての長手方向に長い形状に形成されている。   Moreover, the housing | casing 11 is shown in FIG. 1 thru | or FIG. The casing 11 is made of a metal such as aluminum, and has an upper surface portion 32 and a surrounding side surface portion 33. A space portion 34 is formed inside, and an opening portion 35 is formed on the lower surface on one side. Yes. An attachment portion 36 attached to, for example, a utility pole or a pole is integrally formed on the base end side of the housing 11. The casing 11 is formed in a shape that is long in the longitudinal direction from the proximal end side to the opposite distal end side.

筐体11の下面周辺部には環状の凹溝37が形成され、この凹溝37に筐体11と透光カバー15との間の防水性を確保するための環状のパッキング38が配置されている。さらに、筐体11の先端側の幅方向中央の１箇所、および基端側の幅方向一側の１箇所に基板20をねじ25で締め付け固定するためのねじ孔を有するボス39a，39bがそれぞれ突設され、基端側の幅方向他側の１箇所に基板20の位置決め孔27が嵌り込む位置決め突起40aを有するボス40が突設されている。さらに、筐体11の先端側の幅方向中央の１箇所、および基端側の幅方向両側の２箇所に、透光カバー15をねじ41で締め付け固定するためのねじ孔を有するボス42a，42bがそれぞれ形成されている。ボス42aは、基板20の挿通孔28を挿通される。   An annular groove 37 is formed around the lower surface of the housing 11, and an annular packing 38 is provided in the groove 37 to ensure waterproofness between the housing 11 and the translucent cover 15. Yes. Further, bosses 39a and 39b having screw holes for fastening and fixing the substrate 20 with screws 25 at one position in the center in the width direction on the front end side of the housing 11 and one position in the width direction on the base end side are respectively provided. A boss 40 that protrudes and has a positioning protrusion 40a into which the positioning hole 27 of the substrate 20 is fitted is protruded at one place on the other side in the width direction on the base end side. Furthermore, bosses 42a and 42b having screw holes for fastening the translucent cover 15 with screws 41 at one position in the center in the width direction on the front end side of the housing 11 and two positions on both sides in the width direction on the base end side. Are formed respectively. The boss 42a is inserted through the insertion hole 28 of the substrate 20.

筐体11の内部には、筐体11の先端側と基端側との中間位置であって、基板20の発光素子実装領域23aと電源回路実装領域23bとの間に対応した位置に、空間部34内に突出する仕切部43が形成されている。仕切部43は、筐体11内の幅方向に沿って壁状に形成されており、筐体11内の空間部34を先端側の発光素子側空間部34aと基端側の電源回路側空間部34bとに仕切っている。   Inside the housing 11, there is a space at an intermediate position between the front end side and the base end side of the housing 11 and corresponding to a position between the light emitting element mounting area 23a and the power circuit mounting area 23b of the substrate 20. A partition portion 43 that protrudes into the portion 34 is formed. The partition portion 43 is formed in a wall shape along the width direction in the housing 11, and the space portion 34 in the housing 11 is divided into a light emitting element side space portion 34a on the front end side and a power circuit side space on the base end side. It is partitioned into part 34b.

筐体11の内部には、筐体11の長手方向に沿って発光素子側空間部34aに突出する複数の壁部44，45が形成されている。本実施形態では、幅方向両側の壁部44と中央の壁部45とを備えている。両側の壁部44は、基板20に２列に実装された発光素子21にそれぞれ対応した位置に沿って形成されており、また、中央の壁部45は、基板20の取付孔26に対応した位置であってボス39a，42aに対応した位置に形成されている。両側の壁部44には、基板20に実装された各発光素子21の位置に対応して基板20に接触する複数の接触部44aが形成されている。接触部44aは、壁部44の厚みより大きい直径を有する円柱状に形成されている。中央の壁部45には、ボス39a，42aがそれぞれ一体に形成されている。   Inside the housing 11, a plurality of wall portions 44 and 45 projecting into the light emitting element side space 34 a along the longitudinal direction of the housing 11 are formed. In the present embodiment, a wall portion 44 on both sides in the width direction and a central wall portion 45 are provided. The wall portions 44 on both sides are formed along positions corresponding to the light emitting elements 21 mounted in two rows on the substrate 20, and the central wall portion 45 corresponds to the mounting hole 26 of the substrate 20. It is formed at a position corresponding to the boss 39a, 42a. A plurality of contact portions 44 a that come into contact with the substrate 20 are formed on the wall portions 44 on both sides corresponding to the positions of the light emitting elements 21 mounted on the substrate 20. The contact portion 44a is formed in a cylindrical shape having a diameter larger than the thickness of the wall portion 44. Boss 39a and 42a are integrally formed in the central wall 45, respectively.

筐体11の内部には、仕切部43および壁部44，45が一体に形成されている。筐体11の開口部35の内側に位置するボス39a，39b，40、仕切部43および壁部44，45等の下面は、同一平面に形成され、基板20の上面が接触して取り付けられる基板取付部46として構成されている。   Inside the housing 11, a partition portion 43 and wall portions 44 and 45 are integrally formed. The bottom surfaces of the bosses 39a, 39b, 40, the partition portion 43, the wall portions 44, 45, and the like located inside the opening 35 of the housing 11 are formed in the same plane, and the substrate 20 is attached by contacting the top surface of the substrate 20 The mounting portion 46 is configured.

筐体11の基端側の側面部33には、配線孔47および通気孔48が形成されている。図７に示すように、配線孔47の外面側には、配線孔47の周囲を囲むように突部47aが形成されているとともに、突部47aの先端から側面部33に亘って傾斜部47bが形成されている。通気孔48は、気体の通過を可能とするとともに液体の通過を不可とする内圧調整フィルタ48aによって閉塞されている。   A wiring hole 47 and a vent hole 48 are formed in the side surface portion 33 on the base end side of the housing 11. As shown in FIG. 7, a protrusion 47 a is formed on the outer surface side of the wiring hole 47 so as to surround the periphery of the wiring hole 47, and an inclined portion 47 b extends from the tip of the protrusion 47 a to the side surface portion 33. Is formed. The vent hole 48 is closed by an internal pressure adjusting filter 48a that allows gas to pass and prevents liquid from passing.

筐体11の上面部32は全体的に曲面で構成されているが、上面部32の頂部に平面部49が形成され、この平面部49に電源回路側空間部34bに連通する採光孔50が形成されている。   Although the upper surface portion 32 of the housing 11 is generally formed of a curved surface, a flat surface portion 49 is formed on the top of the upper surface portion 32, and a light extraction hole 50 communicating with the power circuit side space portion 34b is formed in the flat surface portion 49. Is formed.

筐体11の内面から基板20の発光素子実装領域23aまでの発光素子側空間部34aの最大高さは、筐体11の内面から基板20の電源回路実装領域23bまでの電源回路側空間部34bの最大高さりも低く形成されている。   The maximum height of the light emitting element side space 34a from the inner surface of the housing 11 to the light emitting element mounting region 23a of the substrate 20 is the power circuit side space 34b from the inner surface of the housing 11 to the power circuit mounting region 23b of the substrate 20 The maximum height of is also low.

そして、筐体11の開口部35よりも基板20の外形が小さい関係にあり、筐体11に基板20を固定した状態では、筐体11の開口部35（空間部34）の内側縁部と基板20の外側縁部との間に隙間51が設けられている。この隙間51は、例えば０．５ｍｍ程度である。   The outer shape of the substrate 20 is smaller than the opening 35 of the housing 11, and in a state where the substrate 20 is fixed to the housing 11, the inner edge of the opening 35 (space 34) of the housing 11 A gap 51 is provided between the outer edge of the substrate 20. The gap 51 is about 0.5 mm, for example.

また、図１および図３に採光ユニット13を示す。採光ユニット13は、採光孔50にパッキング53を介して嵌め込まれる透光性を有する採光窓54、および採光窓54から採光された外光を照度センサ30に導くとともに外光が電源回路側空間部34b内に放出されるのを防止する遮光筒55を備えている。   1 and 3 show the daylighting unit 13. The daylighting unit 13 includes a light-transmitting daylighting window 54 fitted into the daylighting hole 50 via the packing 53, and guides the external light collected from the daylighting window 54 to the illuminance sensor 30 and the external light is supplied to the power circuit side space. A light-shielding cylinder 55 is provided to prevent discharge into the 34b.

また、図１、図３および図７にブッシング14を示す。ブッシング14は、例えばゴム等の絶縁性および弾性を有する材料で形成されている。ブッシング14には、外部から電源回路22に交流電力を供給する一対の電線58が挿通する一対の電線挿通孔59が形成されている。
ブッシング14の外面側には円筒部60が形成され、この円筒部60の外周に配線孔47の周縁部が嵌り込む溝部61が形成されている。筐体11の外面に対向する溝部61の内面の外周部には溝部61内に突出する鍔部62が形成されている。図１および図７に示すように、ブッシング14が筐体11に取り付けられた状態では、鍔部62が筐体11の外面に接触するように構成されている。 A bushing 14 is shown in FIGS. The bushing 14 is formed of an insulating and elastic material such as rubber. The bushing 14 is formed with a pair of wire insertion holes 59 through which a pair of wires 58 for supplying AC power from the outside to the power supply circuit 22 are inserted.
A cylindrical portion 60 is formed on the outer surface side of the bushing 14, and a groove portion 61 into which the peripheral edge portion of the wiring hole 47 is fitted is formed on the outer periphery of the cylindrical portion 60. On the outer peripheral portion of the inner surface of the groove portion 61 facing the outer surface of the housing 11, a flange portion 62 protruding into the groove portion 61 is formed. As shown in FIGS. 1 and 7, when the bushing 14 is attached to the housing 11, the flange portion 62 is configured to contact the outer surface of the housing 11.

また、図１ないし図６に透光カバー15を示す。透光カバー15は、透光性を有する例えば合成樹脂やガラス等の透明な材料によって一体に形成されている。   Moreover, the translucent cover 15 is shown in FIGS. The translucent cover 15 is integrally formed of a transparent material such as synthetic resin or glass having translucency.

透光カバー15は、筐体11の開口部35を覆うカバー部65を備えている。カバー部65の周辺部には、筐体11の凹溝37に侵入してパッキング38に当接する環状の当接部66が突設されている。カバー部65の先端側の幅方向中央の１箇所、および基端側の幅方向両側の２箇所に、透光カバー15を筐体11に固定するためのねじ41が挿通する取付孔67a，67bが形成されている。   The translucent cover 15 includes a cover portion 65 that covers the opening 35 of the housing 11. An annular contact portion 66 that protrudes into the recessed groove 37 of the housing 11 and contacts the packing 38 protrudes from the periphery of the cover portion 65. Mounting holes 67a and 67b through which screws 41 for fixing the translucent cover 15 to the housing 11 are inserted at one position in the center in the width direction on the front end side of the cover portion 65 and two positions on both sides in the width direction on the base end side. Is formed.

カバー部65は、基板20の発光素子実装領域23aを覆う発光素子側カバー部65a、および電源回路実装領域23bを覆う電源回路側カバー部65bを備えている。   The cover portion 65 includes a light emitting element side cover portion 65a that covers the light emitting element mounting region 23a of the substrate 20, and a power circuit side cover portion 65b that covers the power circuit mounting region 23b.

発光素子側カバー部65aは、平板状に形成され、上面が基板20の下面に当接される。発光素子側カバー部65aには、基板20の各発光素子21の位置に対応してレンズ部68が一体に形成され、基板20の各コンデンサＣの位置に対応して収容部69が一体に形成され、基板20を筐体11に固定しているねじ25の位置に対応して突出部70が一体に形成されている。   The light emitting element side cover portion 65a is formed in a flat plate shape, and the upper surface is in contact with the lower surface of the substrate 20. In the light emitting element side cover portion 65a, a lens portion 68 is integrally formed corresponding to the position of each light emitting element 21 of the substrate 20, and an accommodating portion 69 is integrally formed corresponding to the position of each capacitor C of the substrate 20. The protrusions 70 are integrally formed corresponding to the positions of the screws 25 that fix the substrate 20 to the housing 11.

レンズ部68は、発光素子21からの光を所定の配光に制御する。レンズ部68の上面側には発光素子21を収容する凹部68aが形成され、レンズ部68の下面側は発光素子側カバー部65aから突出されている。レンズ部68は、凹部68aの内面が発光素子21からの光が入射する入射面68bであり、発光素子側カバー部65aから突出する凸面が入射した光が出射する出射面68cである。   The lens unit 68 controls the light from the light emitting element 21 to a predetermined light distribution. A concave portion 68a for accommodating the light emitting element 21 is formed on the upper surface side of the lens portion 68, and the lower surface side of the lens portion 68 protrudes from the light emitting element side cover portion 65a. In the lens portion 68, the inner surface of the concave portion 68a is an incident surface 68b on which light from the light emitting element 21 is incident, and the convex surface protruding from the light emitting element side cover portion 65a is an outgoing surface 68c from which the incident light is emitted.

収容部69は、コンデンサＣを収容するように、発光素子側カバー部65aの下方に突設されている。   The accommodating portion 69 protrudes below the light emitting element side cover portion 65a so as to accommodate the capacitor C.

突出部70は、複数のレンズ部68の内側間に位置し、ねじ25との干渉を防止するように発光素子側カバー部65aの下方に半球状に突設されている。突出部70は、発光素子側カバー部65aに対してレンズ部68よりも下方に突出されている（図１の２点鎖線参照）。   The protruding portion 70 is located between the insides of the plurality of lens portions 68, and protrudes in a hemispherical shape below the light emitting element side cover portion 65a so as to prevent interference with the screw 25. The protruding portion 70 protrudes below the lens portion 68 with respect to the light emitting element side cover portion 65a (see the two-dot chain line in FIG. 1).

発光素子側カバー部65aの内側で周辺部には、透光カバー15の補強のための補強部71が一体に形成されている。補強部71は、当接部66の内側に沿って形成されている。発光素子側カバー部65aの内面からの補強部71の突出高さは、透光カバー15を筐体11に固定した状態で補強部71が筐体11に接触しない高さとされている。補強部71の内側には、基板20が嵌り込むように構成されている。なお、補強部71は、発光素子側カバー部65aから電源回路側カバー部65bまで連続して形成されていてもよい。   A reinforcing portion 71 for reinforcing the translucent cover 15 is formed integrally with the inner periphery of the light emitting element side cover portion 65a. The reinforcing portion 71 is formed along the inside of the contact portion 66. The protruding height of the reinforcing portion 71 from the inner surface of the light emitting element side cover portion 65a is set such that the reinforcing portion 71 does not come into contact with the housing 11 in a state where the light transmitting cover 15 is fixed to the housing 11. The substrate 20 is configured to fit inside the reinforcing portion 71. The reinforcing portion 71 may be formed continuously from the light emitting element side cover portion 65a to the power circuit side cover portion 65b.

電源回路側カバー部65bには、基板20の電源回路22や基板20を筐体11に固定しているねじ25との干渉を防止するために、基板20との間に所定の間隙が形成されているように下方へ突出する突出部72が形成されている。突出部72は、電源回路側カバー部65bの略全域に形成されており、筐体11の下面や基板20に平行な平面部73を有している。突出部72は、筐体11の下面に対してレンズ部68よりも下方へ突出されているとともに、その突出量が突出部70の突出量と同じとされている（図１の２点鎖線参照）。さらに、突出部72の幅方向の両側には、基板20を筐体11に押し付ける複数の押付部74が形成されている。   A predetermined gap is formed between the power supply circuit side cover portion 65b and the substrate 20 in order to prevent interference with the power supply circuit 22 of the substrate 20 and the screws 25 fixing the substrate 20 to the housing 11. As shown, a projecting portion 72 projecting downward is formed. The protruding portion 72 is formed in substantially the entire area of the power circuit side cover portion 65b, and has a flat surface portion 73 parallel to the lower surface of the housing 11 and the substrate 20. The protruding portion 72 protrudes below the lens portion 68 with respect to the lower surface of the housing 11, and the protruding amount is the same as the protruding amount of the protruding portion 70 (see the two-dot chain line in FIG. 1). ). Furthermore, a plurality of pressing portions 74 that press the substrate 20 against the housing 11 are formed on both sides of the protruding portion 72 in the width direction.

そして、透光カバー15は、レンズ部68を除き、収容部69および突出部70等を含むカバー部65が光拡散性を有している。すなわち、レンズ部68（入射面68bおよび出射面68cを含む）を除き、収容部69および突出部70等を含むカバー部65の内面および外面の少なくとも一方に、例えばシボ等の凹凸を形成することで、光拡散効果のある拡散面75が形成されている。   In the translucent cover 15, except for the lens portion 68, the cover portion 65 including the accommodating portion 69, the protruding portion 70, and the like has light diffusibility. That is, irregularities such as wrinkles are formed on at least one of the inner surface and the outer surface of the cover portion 65 including the housing portion 69, the protruding portion 70, etc., excluding the lens portion 68 (including the entrance surface 68b and the exit surface 68c). Thus, a diffusion surface 75 having a light diffusion effect is formed.

また、延焼防止シート16は、透光カバー15の電源回路側カバー部65bの内面に沿って配置され、基板20の電源回路実装領域23bに実装された電源回路22と透光カバー15の電源回路側カバー部65bとの間を隔離する。延焼防止シート16は、例えばノーメックス（登録商標）紙のタイプ４１０等が用いられる。   Further, the fire spread prevention sheet 16 is disposed along the inner surface of the power circuit side cover portion 65b of the translucent cover 15, and the power circuit 22 mounted on the power circuit mounting area 23b of the substrate 20 and the power circuit of the translucent cover 15 The space between the side cover portion 65b is isolated. As the fire spread prevention sheet 16, for example, Nomex (registered trademark) paper type 410 is used.

このように構成された照明装置10は、取付部36および別途用いられる取付金具によって例えば道路の脇に設置された電柱やポール等に設置される。その際、電源回路22は電線58によって交流電源に接続され、筐体11はアース接続される。照明装置10の設置状態では、筐体11の先端側が斜め上方に向けて傾斜し、光源ユニット12および透光カバー15等が道路の中心側に対向される。   The illuminating device 10 configured as described above is installed, for example, on a utility pole or pole installed on the side of a road by the mounting portion 36 and a separately used mounting bracket. At that time, the power supply circuit 22 is connected to an AC power supply by an electric wire 58, and the casing 11 is grounded. In the installed state of the lighting device 10, the front end side of the housing 11 is inclined obliquely upward, and the light source unit 12, the translucent cover 15 and the like are opposed to the center side of the road.

そして、照明装置10は、筐体11の上面の採光窓54から採光される外光が遮光筒55を通じて照度センサ30に入射し、照度センサ30が明るさを検出する。   In the illuminating device 10, the outside light collected from the lighting window 54 on the upper surface of the housing 11 enters the illuminance sensor 30 through the light shielding cylinder 55, and the illuminance sensor 30 detects the brightness.

電源回路22は、発光素子21の消灯状態において、照度センサ30で検出する明るさが所定の閾値よりも低くなることにより、交流電力を所定の直流電力に変換して発光素子21に供給し、発光素子21を点灯させる。また、電源回路22は、発光素子21の点灯状態において、照度センサ30で検出する明るさが所定の閾値よりも高くなることにより、発光素子21への直流電力の供給を停止し、発光素子21を消灯させる。   The power supply circuit 22 converts the alternating current power into predetermined direct current power and supplies it to the light emitting element 21 when the brightness detected by the illuminance sensor 30 is lower than a predetermined threshold when the light emitting element 21 is turned off. The light emitting element 21 is turned on. In addition, the power supply circuit 22 stops the supply of DC power to the light emitting element 21 when the brightness detected by the illuminance sensor 30 is higher than a predetermined threshold in the lighting state of the light emitting element 21, and the light emitting element 21 Turn off the light.

また、点灯時において、発光素子21が発生する熱は、基板20に伝わり、基板20から筐体11に熱伝導され、筐体11の外面から大気中に放熱され、さらに、基板20に伝わった熱の一部が透光カバー15に伝わり、透光カバー15の外面から外気中に放熱される。   Further, at the time of lighting, the heat generated by the light emitting element 21 is transmitted to the substrate 20, is thermally conducted from the substrate 20 to the housing 11, is radiated from the outer surface of the housing 11 to the atmosphere, and is further transmitted to the substrate 20. A part of the heat is transmitted to the translucent cover 15 and is radiated from the outer surface of the translucent cover 15 into the outside air.

電源回路22の電子部品29が発生する熱は、電源回路22が配置されている電源回路側空間部34b内の空気中に放熱されるとともに、電源回路側空間部34b内の空気の対流によって筐体11に伝わり、筐体11の外面から外気中に放熱される。   The heat generated by the electronic components 29 of the power supply circuit 22 is radiated into the air in the power supply circuit side space 34b where the power supply circuit 22 is disposed, and at the same time due to the convection of the air in the power supply circuit side space 34b. It is transmitted to the body 11 and radiated from the outer surface of the housing 11 into the outside air.

また、点灯時において、発光素子21の光は、入射面68bからレンズ部68に入射し、出射面68cから所定の配光方向に向けて出射される。このとき、レンズ部68は、光拡散性を施されていないため、発光素子21の光を所定の配光に制御できるとともに、発光素子21の光を効率よく出射することができる。   Further, at the time of lighting, the light of the light emitting element 21 enters the lens unit 68 from the incident surface 68b and is emitted from the emission surface 68c in a predetermined light distribution direction. At this time, since the lens unit 68 is not subjected to light diffusibility, the light from the light emitting element 21 can be controlled to a predetermined light distribution, and the light from the light emitting element 21 can be emitted efficiently.

発光素子21の光の一部は、出射面68cから出射されずに出射面68cで反射するなどして、カバー部65に導光される。カバー部65に導光された光は、カバー部65が光拡散性を有することによって、すなわち拡散面75の作用によって、カバー部65の少なくとも発光素子側カバー部65aの表面から拡散出射される。   A part of the light of the light emitting element 21 is guided to the cover portion 65 by being reflected by the emission surface 68c without being emitted from the emission surface 68c. The light guided to the cover portion 65 is diffused and emitted from the surface of at least the light emitting element side cover portion 65a of the cover portion 65 by the light diffusion property of the cover portion 65, that is, by the action of the diffusion surface 75.

そのため、透光カバー15は、レンズ部68から光が出射されるとともに、カバー部65からも光が拡散出射されるため、レンズ部68とカバー部65との輝度差が少なくなり、透光カバー15の少なくとも発光素子側カバー部65aの全体が光っているように見え、グレアを低減することができる。   Therefore, the translucent cover 15 emits light from the lens unit 68 and also diffuses and emits light from the cover unit 65, so that the difference in luminance between the lens unit 68 and the cover unit 65 is reduced, and the translucent cover At least the entire light emitting element side cover portion 65a of 15 appears to shine, and glare can be reduced.

また、透光カバー15のカバー部65は、基板20に接触または接近しており、カバー部65を透過して基板20に実装されている発光素子21以外の実装部品や基板20を筐体11に固定しているねじ25等が透光カバー15に映り込み、透光カバー15の外部から見えやすいが、カバー部65が光拡散性を有するため、基板20に実装されている発光素子21以外の実装部品や基板20を筐体11に固定しているねじ25等が透光カバー15に映り込むのを低減し、透光カバー15の外部から見えにくくできる。そのため、照明装置10の意匠性が良好で、商品性を向上できる。   Further, the cover portion 65 of the translucent cover 15 is in contact with or close to the substrate 20, and the mounting component other than the light emitting element 21 and the substrate 20 that are mounted on the substrate 20 through the cover portion 65 are mounted on the housing 11. The screws 25 etc. that are fixed to the light are reflected on the translucent cover 15 and can be easily seen from the outside of the translucent cover 15, but since the cover portion 65 has light diffusibility, other than the light emitting element 21 mounted on the substrate 20 It is possible to reduce the reflection of the mounted parts and the screws 25 fixing the substrate 20 to the housing 11 on the translucent cover 15 and make it difficult to see from the outside of the translucent cover 15. Therefore, the design of the lighting device 10 is good, and the merchantability can be improved.

また、基板20の外側縁部と筐体11の開口部35（空間部34）の内側縁部との間に隙間51を設けているため、基板20の配線パターンや実装されている部品と筐体11との間に絶縁空間を形成し、基板20と筐体11との絶縁距離を確保できるとともに、寒暖によって基板20や筐体11の収縮または膨張があっても絶縁距離を維持でき、さらに、隙間51を通じて空気の流れが可能となり、放熱性の向上が期待できる。そして、隙間51が外部から見えると意匠性が好ましくないが、透光カバー15の光拡散性を有するカバー部65で隙間51を覆うため、隙間51を外部から見えにくくできる。   Further, since the gap 51 is provided between the outer edge of the substrate 20 and the inner edge of the opening 35 (space 34) of the housing 11, the wiring pattern of the substrate 20 and the mounted components and the housing Insulation space is formed between the body 11 and the insulation distance between the substrate 20 and the housing 11 can be secured, and the insulation distance can be maintained even if the substrate 20 or the housing 11 contracts or expands due to cold or warm. In addition, air can flow through the gap 51, and improvement in heat dissipation can be expected. Further, when the gap 51 is visible from the outside, the design is not preferable, but the gap 51 is covered with the cover portion 65 having the light diffusibility of the translucent cover 15, so that the gap 51 can be hardly seen from the outside.

また、透光カバー15は長手方向の両端部が筐体11にねじ41で固定されるだけであるため、透光カバー15が変形しやすく、透光カバー15と筐体11との間の防水性が損なわれる虞があるが、透光カバー15に補強部71を設けているため、透光カバー15の変形を抑制し、防水性を確保することができる。   Further, since both ends in the longitudinal direction of the translucent cover 15 are only fixed to the casing 11 with screws 41, the translucent cover 15 is easily deformed, and the waterproof between the translucent cover 15 and the casing 11 is waterproof. However, since the reinforced portion 71 is provided in the translucent cover 15, deformation of the translucent cover 15 can be suppressed and waterproofness can be ensured.

また、筐体11の配線孔47の外面側に、配線孔47の周囲を囲むように突部47aを設けているため、筐体11の外面を伝わって流れる雨水が配線孔47に流れ込まないように突部47aで遮ることができ、防水性を向上できる。さらに、突部47aの先端から側面部33に亘って傾斜部47bを設けているため、金型を用いた製造時に容易に突部47aの部分を容易に製造することができる。   Further, since the protrusion 47a is provided on the outer surface side of the wiring hole 47 of the housing 11 so as to surround the wiring hole 47, rainwater flowing along the outer surface of the housing 11 does not flow into the wiring hole 47. It can be blocked by the protrusion 47a, and the waterproofness can be improved. Furthermore, since the inclined portion 47b is provided from the tip of the protrusion 47a to the side surface portion 33, the portion of the protrusion 47a can be easily manufactured at the time of manufacturing using a mold.

本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。   Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

10 照明装置
11 筐体
12 光源ユニット
15 透光カバー
20 基板
21 発光素子
22 電源回路
35 開口部
65 カバー部
68 レンズ部 10 Lighting equipment
11 Enclosure
12 Light source unit
15 Translucent cover
20 substrates
21 Light emitting element
22 Power supply circuit
35 opening
65 Cover
68 Lens section

Claims (2)

開口部を有する筐体と；
基板、この基板に実装された発光素子、および前記基板に設けられた電源回路を有し、前記筐体の前記開口部内に配設された光源ユニットと；
前記筐体の前記開口部を覆うカバー部、および前記発光素子に対向して前記カバー部に設けられたレンズ部を有し、前記レンズ部を除く前記カバー部が光拡散性を有する透光カバーと；
を具備することを特徴とする照明装置。 A housing having an opening;
A light source unit having a substrate, a light emitting element mounted on the substrate, and a power supply circuit provided on the substrate, and disposed in the opening of the housing;
A translucent cover having a cover portion that covers the opening of the housing and a lens portion that is provided on the cover portion so as to face the light emitting element, and the cover portion excluding the lens portion has light diffusibility. When;
An illumination device comprising: 前記透光カバーの前記カバー部は、前記基板に接触する
ことを特徴とする請求項１記載の照明装置。 The lighting device according to claim 1, wherein the cover portion of the translucent cover is in contact with the substrate.
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JP2019149311A (en) * 2018-02-27 2019-09-05 東芝ライテック株式会社 Lighting fixture
JP2019220283A (en) * 2018-06-15 2019-12-26 かがつう株式会社 Lighting apparatus and lighting fixture
JP2020047745A (en) * 2018-09-19 2020-03-26 パナソニックＩｐマネジメント株式会社 Light-emitting device and mobile body comprising the same

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