JP2017005048A - Resin seal type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin seal type electronic component which is excellent in environmental resistance and can be produced with a simple structure, in a short time and at low cost.SOLUTION: The resin seal type electronic component includes: a chip-like electronic component body 2; a cylindrical member 3 storing the electronic component body therein; a sealing member 4 charged between the electronic component body and the cylindrical member to seal the electronic component body. The sealing member is formed by charging a resin material into the cylindrical member by means of injection molding in a state where the electric component body is inserted into the cylindrical member, covering at least one end face of the cylindrical member, and the end face covered with the sealing member of the cylindrical member is formed with a plurality of groove parts 7 extending in the peripheral direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin-sealed electronic component which is an electronic component such as a thermistor element sealed with resin and has excellent environmental resistance.

  Conventionally, electronic components such as thermistor elements are generally known in which an electronic component is placed in a resin or metal cap and cast with a thermosetting resin, or an electronic component sealed with a resin. For example, in Patent Document 1, a thermistor element, a sealed member provided with a conductor of an electric wire electrically connected to both sides of the thermistor element, and an electrically insulating resin are injection-molded around the sealed member A temperature sensor having a resin sealing portion is described.

In the method of Patent Document 1, an electronic component is positioned at the time of injection molding, a slide mechanism that supports the electronic component is provided in the injection mold, and the slide is removed when the support portion starts to harden during molding. Are molded and sealed.
Further, Patent Document 2 describes a method of forming a joined body of a thermistor and an electrical conductor that is a plastic material that adheres firmly to a conductor coating material and covers the thermistor by a multi-stage injection process. In this forming method, the thermistor is sealed with the first injection coating material and the second injection coating material by two injection moldings and is integrally formed, so that the thermistor can be manufactured in a shorter time than the method of Patent Document 1. Is possible.

JP 2013-149807 A JP-A-8-69904

The following problems remain in the conventional technology.
That is, in the above-described conventional technique, the method of performing casting using a cap requires a step of putting an electronic component into the cap, pouring a thermosetting resin or the like, and heat-curing and sealing. However, it takes time and man-hours, and it is difficult to ensure reliability. Further, the method of sealing electronic parts by injection molding as in Patent Document 1 has a disadvantage that the mold structure is complicated and sensitive molding conditions are required to provide a slide mechanism and the like.
Furthermore, as in Patent Document 2, when the thermistor is resin-sealed by injection molding, the molten resin, which is an injection coating material that directly covers the thermistor, is in direct contact with the mold during injection molding, so it is quenched and hardened. However, there is a problem that cracks are likely to occur when stress is applied. For example, when an environmental test such as a pressure cooker test (121 ° C., 2 atm, 50 hours) is performed, cracks occur due to stress.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a resin-sealed electronic component that is excellent in environmental resistance and can be manufactured in a short time and at a low cost with a simple structure.

  The present invention employs the following configuration in order to solve the above problems. That is, the resin-encapsulated electronic component according to the first invention includes a chip-shaped electronic component main body, a cylindrical member that accommodates the electronic component main body therein, and a space between the electronic component main body and the cylindrical member. And a sealing material that seals the electronic component main body, and the sealing material injects the resin material into the cylindrical member in a state in which the electronic component main body is inserted into the cylindrical member. The cylindrical member is formed by filling, is formed to cover at least one end surface of the cylindrical member, and extends along the circumferential direction on the end surface of the cylindrical member covered with the sealing material. A plurality of grooves are formed.

In the resin-sealed electronic component of the present invention, the sealing material is formed by filling the cylindrical member with the resin material by injection molding in a state where the electronic component main body is inserted into the cylindrical member. It has excellent resistance and a relatively simple structure, and can be manufactured in a short time and at low cost.
In particular, since the electronic component main body is covered with a soft sealing material that is injection-molded without touching the mold, even if stress is applied, the sealing material is relaxed and cracks and the like are unlikely to occur. In addition, the stress due to the difference in thermal expansion coefficient between the electronic member main body and the resin material acts in the shear direction at the interface between the cylindrical member and the sealing material, so that the cylindrical member is less prone to cracks and the like. It does n’t come. In addition, since the sealing material injection-molded inside the cylindrical member does not directly touch the mold, it deforms softly and flexibly, and the stress is in the shear direction at the interface between the cylindrical member and the post-molding sealing material. work. Moreover, since the electronic component main body is covered by integral molding by injection molding into a cylindrical member, high airtightness and watertightness can be obtained, and it can be manufactured by a relatively simple construction method, and can be manufactured in a short time and at low cost. .
Further, since the plurality of grooves extending along the circumferential direction are formed on the end surface covered with the sealing member of the cylindrical member, the creeping distance from the outer peripheral surface to the inner peripheral surface of the cylindrical member is long. At the same time, the contact area at the end face increases, and high adhesion and airtightness can be ensured.

The resin-encapsulated electronic component according to the second invention is characterized in that, in the first invention, the cylindrical member and the sealing material are formed of the same resin material.
That is, in this resin-encapsulated electronic component, since the cylindrical member and the sealing material are formed of the same resin material, stress hardly occurs against expansion and contraction due to thermal expansion or water absorption.

The resin-encapsulated electronic component according to a third invention is the resin-sealed electronic component according to the first or second invention, wherein the groove portion is formed between a plurality of ridge portions extending along the circumferential direction and having top portions or corner portions. It is characterized by being.
That is, in this resin-encapsulated electronic component, the groove is formed between a plurality of protrusions extending along the circumferential direction and having tops or corners, so that the tops of the plurality of protrusions or The corner portion is easily dissolved in the sealing material when injection-molded, and higher adhesion can be obtained.

The resin-encapsulated electronic component according to a fourth invention is characterized in that, in any one of the first to third inventions, the electronic component main body is a thermistor body.
That is, in this resin-encapsulated electronic component, since the electronic component main body is a thermistor body, it becomes a temperature sensor that is excellent in environmental resistance and can be manufactured in a short time and with a simple structure.

The present invention has the following effects.
That is, according to the resin-sealed electronic component according to the present invention, the sealing material is formed by filling a resin material into the cylindrical member by injection molding in a state where the electronic component main body is inserted into the cylindrical member. Therefore, stress is hardly generated with respect to expansion and contraction, and even if stress is applied, cracks and the like are hardly generated.
Further, since the plurality of grooves extending along the circumferential direction are formed on the end surface covered with the sealing member of the cylindrical member, the creeping distance from the outer peripheral surface to the inner peripheral surface of the cylindrical member is long. At the same time, the contact area at the end face increases, and high adhesion and airtightness can be ensured.
Therefore, high adhesion and confidentiality can be ensured even under severe temperature environment changes, and it can be produced by a relatively simple construction method, and can be produced in a short time and at low cost. Since it is excellent in environmental resistance as described above, it is possible to adopt an inexpensive general-purpose plastic that meets the heat-resistant specification as a resin material without using an expensive, high-strength, high-toughness engineer plastic or the like.

It is the perspective view seen from the front end side which shows 1st Embodiment of the resin sealing type electronic component which concerns on this invention. In 1st Embodiment, it is the perspective view seen from the rear end side which shows the resin-sealed type electronic component. In 1st Embodiment, it is the figure which fractured | ruptured the front end side of the cylindrical member. In 1st Embodiment, it is the figure which fractured | ruptured the rear end side of the cylindrical member. In 1st Embodiment, it is an expanded sectional view which shows a groove part. In 1st Embodiment, it is sectional drawing of the axial direction which shows the resin sealing type electronic component. It is the sectional view on the AA line of FIG. In 2nd Embodiment of the resin-encapsulated electronic component which concerns on this invention, it is an expanded sectional view which shows a groove part. In 3rd Embodiment of the resin-encapsulated electronic component which concerns on this invention, it is an expanded sectional view which shows a groove part. In 4th Embodiment of the resin-encapsulated electronic component which concerns on this invention, it is an expanded sectional view which shows a groove part. In 5th Embodiment of the resin-encapsulated electronic component which concerns on this invention, it is an expanded sectional view which shows a groove part. In 5th Embodiment, it is sectional drawing of the axial direction which shows the resin sealing type electronic component.

  Hereinafter, a first embodiment of a resin-encapsulated electronic component according to the present invention will be described with reference to FIGS. In each drawing used for the following description, the scale is appropriately changed in order to make each member recognizable or easily recognizable.

As shown in FIGS. 1 and 2, the resin-encapsulated electronic component 1 of the present embodiment includes a chip-shaped electronic component body 2, a cylindrical member 3 that houses the electronic component body 2, and an electronic component body. 2 and a cylindrical member 3, and a sealing material 4 for sealing the electronic component main body 2 is provided.
The cylindrical member 3 and the sealing material 4 are formed of the same resin material. For example, general-purpose plastics such as polypropylene (PP) can be used as the resin material.

The sealing material 4 is formed by filling the cylindrical member 3 with a resin material by injection molding in a state where the electronic component main body 2 is inserted into the cylindrical member 3, and at least one of the cylindrical members 3. It is formed so as to cover the end face. In the present embodiment, the sealing material 4 covers both end faces of the cylindrical member 3.
In addition, a plurality of groove portions 7 extending along the circumferential direction are formed on the distal end surface of the cylindrical member 3 covered with the sealing material 4.

  As shown in FIG. 3, these groove portions 7 are formed between a plurality of ridge portions 7 a extending along the circumferential direction and having top portions. That is, in this embodiment, as shown in FIG. 5, each groove portion 7 is formed between a plurality of ridge portions 7 a having an isosceles triangle cross section.

As shown in FIGS. 6 and 7, the cylindrical member 3 includes an outer peripheral surface layer 3a exposed on the outer peripheral surface, an inner peripheral surface layer 3b exposed on the inner peripheral surface, an outer peripheral surface layer 3a, and an inner peripheral surface layer. And an inner layer 3c interposed between the inner layer 3b and the inner layer 3b.
The inner layer 3c and the sealing material 4 are softer than the outer peripheral surface layer 3a and the inner peripheral surface layer 3b. That is, the outer peripheral surface layer 3 a and the inner peripheral surface layer 3 b are denser and harder layers than the inner layer 3 c and the sealing material 4. Since the outer peripheral surface layer 3a and the inner peripheral surface layer 3b are portions where the molten resin directly contacts the mold when the cylindrical member 3 is molded, the outer peripheral surface layer 3a and the inner peripheral surface layer 3b are quenched and become denser and harder than the inner layer 3c.
Moreover, in the opening part of the both ends of the cylindrical member 3, the outer peripheral surface layer 3a, the inner peripheral surface layer 3b, and the inner layer 3c are united, and a dense and hard layer is formed.

  As shown in FIGS. 6 and 7, a pair of terminal electrode portions 2a is formed at both ends of the electronic component body 2, and one end of a pair of lead wires 5 is connected to the pair of terminal electrode portions 2a. The other end side of the pair of lead wires 5 protrudes from one opening of the cylindrical member 3. Note that the lead wire 5 and the terminal electrode portion 2a are connected by a conductive adhesive such as a solder material or a conductive paste. Moreover, as the terminal electrode part 2a, an Ag electrode etc. are employ | adopted, for example.

The cylindrical member 3 is a cylindrical pipe, and the sealing material 4 is exposed from both end openings of the cylindrical member 3.
Similarly to the outer peripheral surface layer 3a and the inner peripheral surface layer 3b, the surface of the sealing material 4 exposed from the opening also becomes a dense and hard layer because the molten resin is in direct contact with the mold.
The sealing material 4 is formed in a convex shape in the protruding direction of the lead wire 5 from the opening from which the other end side of the lead wire 5 of the cylindrical member 3 protrudes. In the present embodiment, the sealing material 4 is formed in a convex shape in both openings of the cylindrical member 3.

The electronic component body 2 is a thermistor body. As the material of the thermistor element body of the electronic component main body 2, there are thermistor materials such as NTC type, PTC type, CTR type, etc. In this embodiment, for example, an NTC type thermistor is adopted. This thermistor material is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material.
In particular, the thermistor body of the present embodiment is, for example, Mn—Co based composite metal oxide (for example, Mn ₃ O ₄ —Co ₃ O ₄ based composite metal oxide) or Mn—Co based composite metal oxide, A spinel-based composite metal comprising a composite metal oxide (for example, Mn ₃ O ₄ —Co ₃ O ₄ —Fe ₂ O ₃ composite metal oxide) containing at least one element of Ni, Fe, Cu, and Al It has an oxide film.

Another example of the thermistor body is a metal oxide sintered body containing a perovskite oxide, for example, a general formula: La _1-y Ca _y (Cr _1-x Mn _x ) O ₃ ( It may be composed of a sintered body containing a composite oxide represented by 0.0 ≦ x ≦ 1.0 and 0.0 <y ≦ 0.7). For example, Y ₂ O ₃ , ZrO ₂ , MgO, Al ₂ O ₃ , or CeO ₂ may be added to the sintered body as an insulator material.
Further, as the thermistor body, a ceramic sintered body containing metal oxides of Mn, Co and Fe, that is, a body formed of a Mn—Co—Fe based material may be adopted.

  The electronic component body 2 is covered with a coating layer 6 made of glass paste or the like together with the connecting portion of the lead wire 5.

In the manufacturing method of the resin-encapsulated electronic component 1 of the present embodiment, the cylindrical member 3 is first formed by molding with a resin material. At this time, the outer peripheral surface layer 3a and the inner peripheral surface layer 3b which are skin layers of the cylindrical member 3 are denser and harder than the inner layer 3c which is a core layer.
Next, the electronic component main body 2 to which the lead wire 5 is connected and covered with the coating layer 6 is inserted into the cylindrical member 3 and set in an injection mold in this state, and the same resin as the cylindrical member 3 is inserted. The inside of the cylindrical member 3 and the opening parts at both ends of the cylindrical member 3 are integrally formed of a material.

At this time, the sealing material 4 is formed by covering the groove portion 7 formed on the distal end surface of the cylindrical member 3 so that the resin material is buried, and the top portion of the protruding portion 7a is dissolved in the resin material. It is joined to the sealing material 4 by cooling and curing.
Thereafter, the resin-encapsulated electronic component 1 is manufactured in a short time by taking out from the injection mold.

As described above, in the resin-encapsulated electronic component 1 of the present embodiment, the sealing material 4 is filled with the resin material in the cylindrical member 3 by injection molding in a state where the electronic component main body 2 is inserted into the cylindrical member 3. Therefore, it is excellent in environmental resistance, has a relatively simple structure, and can be manufactured in a short time and at low cost.
In particular, since the electronic component body 2 is covered with a soft sealing material 4 that is injection-molded without touching the mold, cracks and the like occur due to the sealing material 4 relaxing even when stress is applied. hard.

  Further, the stress due to the difference in thermal expansion coefficient between the electronic component main body 2 and the resin material acts in the shear direction at the interface between the cylindrical member 3 and the sealing material 4, and the cylindrical member 3 is unlikely to be cracked. The member 3 is not destroyed. In addition, since the sealing material 4 injection-molded inside the cylindrical member 3 does not directly touch the mold, it deforms softly and flexibly, and the stress is an interface between the cylindrical member 3 and the post-molding sealing material 4. Works in the shear direction. For example, as shown in FIGS. 6 and 7, when the coating layer 6 is thermally expanded and stress is generated, the flexible sealing material 4 is deformed in the axial direction of the cylindrical member 3 to relieve the stress. be able to.

Moreover, since the electronic component main body 2 is covered by integral molding by injection molding into the cylindrical member 3, high airtightness and watertightness can be obtained, and it can be manufactured by a relatively simple construction method, and can be manufactured in a short time and at low cost. It is.
Further, the outer peripheral surface layer 3a and the inner peripheral surface layer 3b of the cylindrical member 3 pre-formed with a resin material are dense and hard and difficult to extend, but the inner layer 3c and the sealing material 4 are the outer peripheral surface layer 3a and the inner peripheral surface layer. Since it is softer than 3b, the inner layer 3c and the sealing material 4 flexibly relieve the stress, thereby suppressing the occurrence of cracks and the like.

Moreover, since the sealing material 4 is exposed from the opening parts at both ends of the cylindrical member 3, the stress is released from the opening parts at both ends of the cylindrical member 3, and the occurrence of cracks and the like can be further suppressed.
Furthermore, since the sealing material 4 is formed in a convex shape in the protruding direction of the lead wire 5 from the opening portion where the other end side of the lead wire 5 of the cylindrical member 3 protrudes, from the opening portion of the cylindrical member 3 By covering the protruding lead wire 5 with the soft sealing material 4 for protection, the protruding lead wire 5 can be made difficult to cut.

Furthermore, since the several groove part 7 extended along the circumferential direction is formed in the end surface covered with the sealing material 4 of the cylindrical member 3, from the outer peripheral surface of the cylindrical member 3 to an inner peripheral surface As the creepage distance increases, the contact area at the end surface increases, and high adhesion and airtightness can be ensured.
Moreover, since the cylindrical member 3 and the sealing material 4 are formed of the same resin material, it is difficult for stress to occur with respect to expansion and contraction due to thermal expansion or water absorption.

In addition, since the groove portion 7 extends along the circumferential direction and is formed between the plurality of ridge portions 7a having a substantially triangular cross section, the seal when the tops of the plurality of ridge portions 7a are injection-molded is formed. It can be easily dissolved in the stopper 4 and higher adhesion can be obtained.
Therefore, the resin-encapsulated electronic component 1 according to the present embodiment has a temperature sensor that is excellent in environmental resistance, can be manufactured in a short time and with a simple structure by using the electronic component body 2 as a thermistor body. It is done.

  Next, second to fifth embodiments of the resin-encapsulated electronic component according to the present invention will be described below with reference to FIGS. 8 to 12. In the following description of each embodiment, the same constituent elements described in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.

The difference between the second embodiment and the first embodiment is that, in the first embodiment, the groove portion 7 has an isosceles triangular cross section, whereas the resin-encapsulated electronic component of the second embodiment is shown in FIG. As shown in FIG. 4, the groove 27 of the cylindrical member 23 has a semicircular cross section. That is, in the second embodiment, the ridge portion 27a has a substantially isosceles triangular cross section having an apex angle that is sharper than that of the first embodiment.
Therefore, the resin-encapsulated electronic component of the second embodiment is easier to melt the sharp apex of the protrusion 27a at the time of injection molding than the first embodiment, and higher adhesion is obtained.

Next, the difference between the third embodiment and the first embodiment is that, in the first embodiment, the groove portion 7 has an isosceles triangular cross section, whereas the resin-encapsulated electronic component of the third embodiment As shown in FIG. 9, the groove portion 37 of the cylindrical member 33 has a triangular cross section. That is, in 3rd Embodiment, the protrusion part 37a is made into the cross-sectional right triangle shape.
Therefore, similarly to the first embodiment, the resin-encapsulated electronic component of the third embodiment can ensure high adhesion and airtightness by the protrusion 37a having the top.

Next, the difference between the fourth embodiment and the first embodiment is that, in the first embodiment, the groove 7 has an isosceles triangular cross section, whereas the resin-encapsulated electronic component of the fourth embodiment As shown in FIG. 10, the groove portion 47 of the tubular member 43 has a rectangular cross section. That is, in 4th Embodiment, the protrusion 47a is made into the rectangular cross section which has a pair of corner | angular part.
Therefore, in the resin-encapsulated electronic component of the fourth embodiment, the pair of corners of the protrusion 47a is easily melted during injection molding, and high adhesion can be obtained.

  Next, the difference between the fifth embodiment and the first embodiment is that, in the first embodiment, a plurality of grooves 7 having an isosceles cross section are arranged in both end faces in a direction (radial direction) perpendicular to the axis. In contrast, in the resin-encapsulated electronic component 51 of the fifth embodiment, as shown in FIGS. 11 and 12, a plurality of groove portions 57 are arranged in a stepwise manner on both end surfaces in an oblique direction with respect to the axis. It is a point.

That is, in the fifth embodiment, the length of the cylindrical member 53 is shorter on the inner peripheral surface side than on the outer peripheral surface side, and both end surfaces are configured in a stepped shape formed by a plurality of groove portions 57 and protrusions 57a. .
Therefore, the resin-encapsulated electronic component 51 of the fifth embodiment is formed by arranging the groove portions 57 in a stepped manner, and as in the above embodiments, compared to the case where the end surface is configured as a flat surface. As a result, the contact area is increased, and the adhesion and airtightness are increased.

The technical scope of the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the invention is applied to a thermistor element that employs a thermistor body in an electronic component body. However, as other electronic component bodies, an IC chip, a chip-shaped RFID, a resistor component or a capacitor component that employs a resistor or a capacitor, It does not matter.

  DESCRIPTION OF SYMBOLS 1 ... Resin sealing type electronic component, 2 ... Electronic component main body, 2a ... Terminal electrode part, 3, 23, 33, 43, 53 ... Cylindrical member, 3a ... Outer peripheral surface layer, 3b ... Inner peripheral surface layer, 3c ... Inner layer, 4 ... Sealing material, 5 ... Lead wire, 6 ... Coating layer, 7, 27, 37, 47, 57 ... Groove, 7a, 27a, 37a, 47a, 57a ... Projection

Claims (4)

A chip-shaped electronic component body;
A cylindrical member that houses the electronic component body therein;
A sealing material filled between the electronic component body and the tubular member and sealing the electronic component body;
The sealing material is formed by filling the cylindrical member with a resin material by injection molding in a state where the electronic component main body is inserted into the cylindrical member, and at least one of the cylindrical members Formed over the end face,
A resin-encapsulated electronic component, wherein a plurality of grooves extending along a circumferential direction are formed on an end surface of the cylindrical member covered with the sealing material. The resin-encapsulated electronic component according to claim 1,
The resin-sealed electronic component, wherein the cylindrical member and the sealing material are formed of the same resin material. In the resin-sealed electronic component according to claim 1 or 2,
The resin-sealed electronic component, wherein the groove is formed between a plurality of ridges extending in the circumferential direction and having tops or corners. In the resin-encapsulated electronic component according to any one of claims 1 to 3,
A resin-sealed electronic component, wherein the electronic component body is a thermistor body.

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