JP2017004788A - Conductive pattern formation substrate, and substrate production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive pattern formation substrate in which a conductive pattern is further high-defined, and further, damage to a conductive pattern and a transparent substrate is suppressed.SOLUTION: In a conductive pattern formation substrate 1 provided with a transparent substrate 101, a transparent conductive layer 102 and a conductive pattern 110, the conductive pattern 110 includes: a patterned transparent conductive layer 111 formed on the surface of the transparent substrate 101 into a prescribed pattern continuously to the transparent conductive layer 102; and a patterned metal layer 112 formed of a conductive material essentially consisting of metal grains on the surface of the patterned transparent conductive layer 111.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a conductive pattern forming substrate and a substrate manufacturing method.

  For example, in the flat panel display (FPD) such as a liquid crystal display, an organic EL display, and a plasma display, the following conductive pattern forming substrate is used. That is, a conductive pattern forming substrate in which a conductive pattern is formed on a transparent substrate is used.

  In recent years, the following are known as conductive pattern forming substrates having high-definition conductive patterns required for FPD. For example, a conductive pattern forming substrate is known in which a conductive film is formed by performing pattern formation by laser light irradiation on a metal film formed by sputtering on a transparent substrate (for example, Patent Document 1 and Patent). Reference 2). In addition, a conductive pattern formation substrate in which a metal film before laser light irradiation is formed by vapor deposition of aluminum is also known (see, for example, Patent Document 3).

  Here, in the field of FPDs with advanced functions, there is a demand for further refinement of the conductive pattern on the conductive pattern forming substrate as described above. A conductive pattern such as an electrode pattern is required to have a low electric resistance. However, in order to suppress a high-definition conductive pattern having a narrow pattern width, it is necessary to increase the thickness of the conductive pattern to some extent. However, sputtering or vapor deposition cannot form a metal film that is a source of a conductive pattern so thickly, and the techniques described in Patent Documents 1 to 3 above naturally have a limit in increasing the definition of the conductive pattern. Even if the metal film can be formed thick, the following problems remain in removing unnecessary portions from the thick metal film by, for example, laser irradiation. That is, there remains a problem that unnecessary portions must be sufficiently removed so as not to cause a short circuit between the conductive patterns, and damage to the conductive pattern and the transparent substrate after the removal must be suppressed as much as possible.

  Accordingly, an object of the present invention is to provide a conductive pattern forming substrate in which the conductive pattern is further refined and damage to the conductive pattern and the transparent substrate is suppressed.

  In order to solve the above-mentioned problem, the invention according to claim 1 is a conductive pattern comprising a transparent substrate having translucency and insulation, and a predetermined pattern of conductive patterns formed on the surface of the transparent substrate. In the formation substrate, the conductive pattern is formed on the surface of the transparent substrate, the patterned transparent conductive layer formed in the predetermined pattern and having translucency and conductivity, and metal particles on the surface of the patterned transparent conductive layer. And a patterned metal layer formed of a conductive material containing as a main component.

  According to the first aspect of the present invention, it is possible to provide a conductive pattern forming substrate in which the conductive pattern is further refined and damage to the conductive pattern and the transparent substrate is suppressed.

1 is a schematic plan view showing a conductive pattern forming substrate according to an embodiment of the present invention. It is a typical enlarged view of area | region A1 in FIG. In the substrate manufacturing method for manufacturing the conductive pattern forming substrate shown in FIG. 1 and FIG. 2, each process until the formation of the laminated film that is the basis of the conductive pattern is shown in a schematic plan view similar to FIG. FIG. Each of the processes up to the formation of the laminated film that is the basis of the conductive pattern is a process shown in a schematic cross-sectional view. It is a figure which shows the process in which a conductive pattern is formed from the formed laminated film with the typical sectional drawing similar to FIG. It is a figure which shows the enlarged photograph of the conductive pattern in the conductive pattern formation board | substrate of 1st Example with the cross-sectional shape. It is a figure which shows the enlarged photograph of the conductive pattern in the conductive pattern formation board | substrate of 2nd Example with the cross-sectional shape. It is an enlarged photograph of the conductive pattern in the conductive pattern formation board | substrate of 3rd Example. It is an enlarged photograph of the conductive pattern in the conductive pattern formation board | substrate of a 1st comparative example. It is an enlarged photograph of the conductive pattern in the conductive pattern formation board of the 2nd comparative example.

  A conductive pattern forming substrate according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic plan view showing a conductive pattern forming substrate according to an embodiment of the present invention. FIG. 2 is a schematic enlarged view of a region A1 in FIG. 2A is a schematic enlarged plan view of the region A1 in FIG. 1, and FIG. 2B is a schematic view taken along the V1-V1 cutting line in FIG. 2A. A cross-sectional view is shown.

  The conductive pattern forming substrate 1 of this embodiment is used for the above-described FPD, and includes a transparent substrate 101, a transparent conductive layer 102, and a conductive pattern 110.

  The transparent substrate 101 is a substrate having a light transmitting property and an insulating property, and examples thereof include a substrate formed of a transparent plastic represented by PET (Polyethylene terephthalate), a substrate formed of glass, and the like.

  The transparent conductive layer 102 is a layer that is formed on the surface of the transparent substrate 101 and has translucency and conductivity, and is formed with a pattern corresponding to FPD. Examples of a material for forming the transparent conductive layer 102 include oxides such as tin-doped indium oxide (ITO), indium-doped zinc oxide (IZO), and zinc oxide (ZO). Among these materials, ITO is preferable from the viewpoint of low electric resistance. The thickness of the transparent conductive layer 102 is desirably in the range of 10 nm to 50 nm, and more desirably in the range of 10 nm to 20 nm from the viewpoint of high transparency.

  The conductive pattern 110 is a pattern formed on the surface of the transparent substrate 101 and electrically connected to the transparent conductive layer 102, and serves as an electrode pattern for the transparent conductive layer 102.

  Here, in this embodiment, as shown in FIG. 2A, the conductive pattern 110 is a high-definition fine line pattern in which a plurality of conductive patterns 110 are arranged in parallel with each other at a predetermined interval. Each conductive pattern 110 is obtained by laminating a patterned transparent conductive layer 111 and a patterned metal layer 112 on the surface of the transparent substrate 101 as shown in FIG.

  The patterned transparent conductive layer 111 is formed on the surface of the transparent substrate 101 in the above-described high-definition pattern shape continuously with the transparent conductive layer 102. This patterned transparent conductive layer 111 is a pattern made of a material such as ITO and having the same thickness as the transparent conductive layer 102 in the same manner as the transparent conductive layer 102.

  The patterned metal layer 112 is formed of a conductive material mainly composed of metal particles on the surface of the patterned transparent conductive layer 111. Specifically, it is formed as described later using a conductive silver paste in which silver particles and a resin binder are mixed in a paste form, and becomes a layer in which silver particles are bound by a resin binder. Yes. The patterned metal layer 112 preferably has a thickness of more than 1 μm from the viewpoint of suppressing the electrical resistance of the high-definition conductive pattern 110, and has a thickness of 15 μm or less from the viewpoint of ease of formation described later. It is desirable to be.

  Next, a substrate manufacturing method for manufacturing the conductive pattern forming substrate 1 shown in FIGS. 1 and 2 will be described with reference to FIGS.

  This substrate manufacturing method is a manufacturing method in which a conductive film 110 is formed by forming a laminated film that is a base of a conductive pattern 110 having a predetermined pattern, and removing regions other than the pattern of the conductive pattern 110 from the laminated film. . FIG. 3 is a schematic view similar to FIG. 1 showing each process until the formation of the laminated film that is the basis of the conductive pattern in the substrate manufacturing method for manufacturing the conductive pattern forming substrate shown in FIG. 1 and FIG. FIG. FIG. 4 is a schematic cross-sectional view showing each process up to the formation of the laminated film that is the basis of the conductive pattern. FIG. 5 is a schematic cross-sectional view similar to FIG. 4 showing the process of forming a conductive pattern from the formed laminated film.

  In this substrate manufacturing method, as shown in FIG. 3 and FIG. 4 as step S1, first, the transparent conductive layer 102 and the envelope-shaped transparent conductive layer 103 are formed on the surface of the transparent substrate 101 ( First layer formation process). The envelope-shaped transparent conductive layer 103 is a pattern that is continuous with the transparent conductive layer 102 and has an envelope shape including the pattern of the conductive pattern 110.

  In this embodiment, the pattern formation in step S1 includes the formation of a thin film made of a material such as ITO by sputtering or vapor deposition, and the pattern formation by a photolithography method. In pattern formation, pattern formation for the transparent conductive layer 102 and pattern formation for the envelope-shaped transparent conductive layer 103 are simultaneously performed.

  Pattern formation by the photolithography method is performed by the following procedure. First, a photoresist is applied to the surface of the formed thin film, and the photoresist is pre-baked. In pre-baking, the photoresist is solidified by heating.

  Subsequently, mask exposure is performed. In the mask exposure, a mask on which the pattern of the transparent conductive layer 102 and the envelope pattern of the envelope-shaped transparent conductive layer 103 are drawn is used, and the photoresist is exposed through this mask. After this mask exposure, development with a developer is performed. Photoresist other than the portion altered by the exposure is removed by development. By this development, a mask pattern composed of the pattern of the transparent conductive layer 102 and the envelope pattern of the envelope-shaped transparent conductive layer 103 is drawn on the thin film with a photoresist. After the development, washing with a rinse liquid such as ultrapure water is performed, and further, the rinse liquid is removed by heating in post-baking.

  Thereafter, the excess thin film deviated from the mask pattern is removed by etching, so that the patterned transparent conductive layer 102 and the envelope-shaped transparent conductive layer 103 are formed. Finally, the photoresist as a mask pattern is removed, and pattern formation by photolithography is completed.

  After step S1, as shown in FIG. 3 and FIG. 4 as step S2, an envelope-shaped metal layer 104 is formed on the surface of the envelope-shaped transparent conductive layer 103 (second layer forming process). By this step S2, the laminated film 120 of the envelope-shaped transparent conductive layer 103 and the envelope-shaped metal layer 104 is formed.

  Here, in the present embodiment, the envelope-shaped metal layer 104 is formed by screen printing using a conductive silver paste in which silver particles having a particle diameter of about several hundred nm to 1 μm and a resin binder are mixed in a paste form. It is performed by baking after printing. As the conductive silver paste, one suitable for laser patterning is desirable. In screen printing, a conductive silver paste is printed on the surface of the envelope-shaped transparent conductive layer 103 in the same shape as the envelope-shaped transparent conductive layer 103.

  The printed conductive silver paste is baked to form the envelope-shaped metal layer 104. The conductive silver paste is in a paste form by including a solvent component. This solvent component is skipped by firing, and the silver particles are bound by the resin binder. In this embodiment, screen printing is performed so that the thickness of the envelope-shaped metal layer 104 after firing falls within a range of 1 μm to 15 μm.

  Next, the conductive pattern 110 is formed by removing an extra region other than the portion left as the conductive pattern 110 from the laminated film 120 of the envelope-shaped transparent conductive layer 103 and the envelope-shaped metal layer 104 (pattern formation). process). The removal of the extra area is performed by laser irradiation as shown in step S3 in FIG. In this embodiment, a pulse laser capable of laser oscillation with a fundamental wave having a wavelength of 1030 to 1100 nm is used as the laser used for laser irradiation.

  When the excess region is irradiated with the laser beam L, the envelope-shaped transparent conductive layer 103 as a base layer thinner than the envelope-shaped metal layer 104 causes ablation. As a result, the envelope-shaped metal layer 104 in the excess region is completely removed together with the envelope-shaped transparent conductive layer 103, and a smooth and non-electrically shorted substrate surface is exposed at the divided portions between the conductive patterns 110. It will be.

  At this time, since the envelope-shaped transparent conductive layer 103 that causes ablation functions as an easily peelable layer base, the intensity of the laser beam L to be irradiated can be suppressed. Thereby, it is possible to suppress damage to the patterned transparent conductive layer 111 and the patterned metal layer 112 constituting the conductive pattern 110, and further to the surface of the transparent substrate 101 exposed at the divided portion between the conductive patterns 110. . Such an effect of suppressing damage is particularly effective when using a transparent substrate formed of a transparent plastic that is more easily damaged by laser irradiation than glass.

  In addition, as described above, in the present embodiment, the conductive pattern 110 is formed by irradiation with laser light having a fundamental wavelength of 1030 to 1100 nm. By using such fundamental laser light for pattern formation, for example, damage to the surface of the transparent substrate 101 can be suppressed as compared with the case where second harmonic laser light is used for pattern formation. That is, the wavelength of the second harmonic laser beam is shorter than that of the fundamental laser beam. When the transparent substrate 101 is formed of PET or the like other than glass, the second harmonic laser beam is easily absorbed by the transparent substrate 101 because of its shorter wavelength than the fundamental laser beam. It becomes easy to damage the surface of the transparent substrate 101 at the time of irradiation. In the present embodiment, since the fundamental laser beam is used for pattern formation, damage to the surface of the transparent substrate 101 can be suppressed even if the transparent substrate 101 is formed of PET or the like.

  In the conductive pattern forming substrate 1 of the present embodiment manufactured as described above, the patterned metal layer in which the conductive pattern 110 is formed on the surface of the patterned transparent conductive layer 111 with a conductive material mainly composed of metal particles. 112 is provided. The patterned metal layer 112 is mainly responsible for the conductivity of the conductive pattern 110. For this reason, even in the case of the conductive pattern 110 having a high definition and a narrow pattern width, in order to keep the electric resistance sufficiently low, the patterned metal layer 112 needs to have a certain thickness or more. Here, the thickness of the patterned metal layer 112 depends on the particle diameter of the metal particles. Therefore, by adopting metal particles having a particle diameter corresponding to a desired thickness in the patterned metal layer 112 as the metal particles, both high definition of the conductive pattern 110 and suppression of electric resistance of the conductive pattern 110 are achieved. Can be made. In the present embodiment, metal particles (silver particles) having a particle diameter of about several hundred nm to 1 μm are employed. Since this coexistence is possible, in the conductive pattern formation board | substrate 1 of this embodiment, further refinement | definition of the conductive pattern 110 is possible.

  In addition, as described above, in the present embodiment, the envelope-shaped transparent conductive layer 103 in the laminated film 120 that is the basis of the conductive pattern 110 causes ablation at the time of laser irradiation and serves as a base for an easily peelable layer. As a result, the envelope-shaped metal layer 104 in the excess region is completely removed together with the envelope-shaped transparent conductive layer 103, and a smooth and non-electrically shorted substrate surface is exposed at the divided portions between the conductive patterns 110. . And since the function of such a foundation | substrate is anticipated, even if it forms the envelope-shaped metal layer 104 thick as mentioned above, the intensity | strength of the laser beam L to irradiate can be suppressed. Thereby, damage to the surface of the conductive pattern 110 or the transparent substrate 101 can be suppressed.

  As described above, in the conductive pattern forming substrate 1 of the present embodiment, the conductive pattern 110 is further refined, and damage to the conductive pattern 110 and the transparent substrate 101 is suppressed.

  Moreover, in the conductive pattern formation board | substrate 1 of this embodiment, the thickness of the patterned metal layer 112 becomes thickness in the range of 1 micrometer-15 micrometers. The patterned metal layer 112 preferably has a thickness of more than 1 μm from the viewpoint of suppressing electrical resistance in the high-definition conductive pattern 110, and has a thickness of 15 μm or less from the viewpoint of ease of processing by laser irradiation. It is desirable that

  Moreover, in this embodiment, the conductive pattern 110 is formed by removing an extra area | region from the laminated film 120 of the envelope shape transparent conductive layer 103 and the envelope shape metal layer 104 by laser irradiation. In the present embodiment, the high-definition conductive pattern 110 is formed with high processing accuracy by laser irradiation. In addition, since the laser irradiation is performed on the laminated film 120, as described above, the conductive pattern forming substrate 1 of the present embodiment can suppress damage to the surfaces of the conductive pattern 110 and the transparent substrate 101. It has become a thing.

  In the present embodiment, the conductive material forming the patterned metal layer 112 is obtained by firing a conductive paste (conductive silver paste) in which metal particles (silver particles) and a resin binder are mixed in a paste. The metal particles are bound by a resin binder. By employing such a material as the conductive material, the patterned metal layer 112 can be formed through a simple and inexpensive operation through screen printing of a conductive paste. As a result, the manufacturing cost of the conductive pattern forming substrate 1 of the present embodiment is reduced.

  In the present embodiment, silver particles are employed as the metal particles contained in the conductive material. A conductive material containing silver particles is preferable in terms of low electrical resistance and ease of pattern formation by laser irradiation.

  In addition, according to the substrate manufacturing method of the present embodiment described with reference to FIGS. 3 to 5, both the high definition of the conductive pattern 110 and the suppression of the electric resistance of the conductive pattern 110 are achieved as described above. The conductive pattern forming substrate 1 can be manufactured.

  In addition, according to the substrate manufacturing method of the present embodiment, the manufacturing cost can be reduced by adopting screen printing using a conductive paste, and the pattern formation by laser irradiation can be adopted, so that the high-definition conductive pattern 110 can be formed. Formation with high processing accuracy is possible.

  The above-described embodiment is merely a representative form of the present invention, and the present invention is not limited to this embodiment. That is, various modifications can be made without departing from the scope of the present invention. Of course, such modifications are included in the scope of the present invention as long as they have the configuration of the conductive pattern forming substrate and the substrate forming method of the present invention.

  For example, in the above-described embodiment, the conductive pattern forming substrate 1 used for a flat panel display (FPD) is illustrated as an example of the conductive pattern forming substrate according to the present invention. However, the conductive pattern forming substrate referred to in the present invention is not limited to this, and the specific usage mode is not questioned.

  In the above-described embodiment, as an example of the conductive pattern referred to in the present invention, a plurality of conductive patterns 110 arranged in parallel with each other with a predetermined interval are illustrated. However, the conductive pattern referred to in the present invention is not limited to this, and the specific pattern shape is not questioned.

  In the embodiment described above, silver particles are exemplified as an example of metal particles contained in the conductive material forming the conductive pattern referred to in the present invention. However, the metal particles mentioned here are not limited to this, and may be particles made of a metal other than silver. However, as described above, the conductive material containing silver particles is preferable in terms of low electrical resistance and ease of pattern formation by laser irradiation.

  Next, an example in which a conductive pattern forming substrate was actually manufactured will be described together with a comparative example for comparison with the example. 1 to 5 referred to in the description of the embodiment are also referred to in the description of the following examples and comparative examples. In the following embodiments, various dimensions and materials will be specifically described. However, these dimensions and materials are merely examples, and the present invention is not limited to these dimensions and materials.

(First embodiment)
In the first example, a substrate made of PET and having a thickness of 150 μm was used as the transparent substrate. And the process of step S1 of FIG.3 and FIG.4 was performed.

  First, an ITO thin film having a thickness of 20 nm, which is the base of the transparent conductive layer and the envelope-shaped transparent conductive layer, was formed on the surface of the transparent substrate by a sputtering method. Next, unnecessary portions other than the transparent conductive layer and the envelope-shaped transparent conductive layer were removed from the ITO thin film by the photolithography method described above to form a transparent conductive layer and an envelope-shaped transparent conductive layer.

  Then, the process of step S2 of FIG.3 and FIG.4 was performed, and the envelope shape metal layer was formed on the surface of the envelope shape transparent conductive layer by the screen printing using a conductive silver paste, and the baking after printing. In this example, “RA FS 110S” manufactured by Toyochem Co., Ltd. was employed as the conductive silver paste for laser patterning. As the conductive silver paste for laser patterning, “LS-470L-2F” manufactured by Asahi Chemical Research Co., Ltd. or the like may be employed. Moreover, baking after printing was performed at around 130 ° C. for about 30 minutes. In this example, screen printing was performed so that the thickness of the envelope-shaped metal layer after firing was 6 to 7 μm.

  Here, in the conductive silver paste, the solvent component is skipped by baking after printing. The composition ratio after baking is such that the ratio of silver particles is 72 to 78% and the ratio of resin binder (polyester or urethane). Is a ratio of 22 to 28%.

  Next, the process of step S3 of FIG. 5 was performed, and an extra region other than a portion left as a conductive pattern was removed from the laminated film of the envelope-shaped transparent conductive layer and the envelope-shaped metal layer.

  In this embodiment, the conductive pattern arrangement pitch is 60 μm, the conductive pattern width is 40 to 45 μm, and the distance between the conductive patterns is 15 to 20 μm. Further, as a laser used for forming such a conductive pattern, a pulse fiber laser capable of laser oscillation with a fundamental wave having a wavelength of 1050 nm and an average output of 13 W was used. The laser irradiation conditions were a beam condensing diameter of 30 μm, an average output of 12 W, and a scanning speed of 3000 mm / s.

  Through the above processing, the conductive pattern forming substrate of the first example was obtained.

  FIG. 6 is a view showing an enlarged photograph of the conductive pattern on the conductive pattern forming substrate of the first embodiment together with its cross-sectional shape. FIG. 6A shows an enlarged photograph of the conductive pattern 110-1 on the conductive pattern forming substrate 1-1 of the first embodiment, and FIG. 6B shows a mutual pattern of adjacent conductive patterns 110-1. The measured cross-sectional shape of the divided part is shown.

  As shown in FIG. 6, in the conductive pattern forming substrate 1-1 of the first example, a smooth and non-electrically shorted substrate surface is exposed at the divided portions between the conductive patterns 110-1. . It was also confirmed by visual observation that there was almost no damage to the exposed surface of the transparent substrate 101-1 and the conductive patterns 110-1 on both sides.

  In addition, when laser irradiation is performed as in the process of step S3 of FIG. 5 and an extra region other than a portion left as a conductive pattern is removed, traces that allow visual confirmation of formation by laser irradiation are present in the conductive pattern. Remain in. That is, as shown in the enlarged photograph of FIG. 6A, the edge portion of the conductive pattern 110-1 has a slightly uneven shape within an allowable range, and the shape melted by the heat of laser irradiation. Remains. Further, when the pulse laser is irradiated, the beam spot shape (circular shape) of the laser light appears on the processing trace as a continuously overlapping shape. However, it goes without saying that this processing trace is also an allowable range.

(Second embodiment)
In the second embodiment, the arrangement pitch of the conductive patterns is 40 μm, the pattern width of the conductive patterns is 20 to 25 μm, and the interval between the conductive patterns is 15 to 20 μm. Laser irradiation conditions were such that the beam condensing diameter was 30 μm, the average output was 9 W, and the scanning speed was 3000 mm / s. Except for the above, a conductive pattern forming substrate of the second example was obtained under the same conditions as in the first example.

  FIG. 7 is a view showing an enlarged photograph of the conductive pattern on the conductive pattern forming substrate of the second embodiment together with its cross-sectional shape. FIG. 7A shows an enlarged photograph of the conductive pattern 110-2 on the conductive pattern formation substrate 1-2 of the second embodiment, and FIG. 7B shows the mutual connection between the adjacent conductive patterns 110-2. The measured cross-sectional shape of the divided part is shown.

  As shown in FIG. 7, even in the conductive pattern forming substrate 1-2 of the second embodiment, a smooth and electrical short-circuit is formed between the conductive patterns 110-2 having higher definition than that of the first embodiment. The surface of the substrate is exposed. It was also confirmed by visual observation that there was almost no damage to the exposed surface of the transparent substrate 101-2 and the conductive patterns 110-2 on both sides.

(Third embodiment)
In the third embodiment, a pulse YAG laser capable of lasing with a fundamental wave having a wavelength of 1064 nm and an average output of 15 W was used as the laser used for forming the conductive pattern. Except for this point, the conductive pattern forming substrate of the third example was obtained under the same conditions as in the first example.

  FIG. 8 is an enlarged photograph of the conductive pattern on the conductive pattern forming substrate of the third embodiment. As shown in FIG. 8, in the conductive pattern forming substrate 1-3 of the third embodiment, as in the first embodiment, a smooth and electrical short circuit is formed between the divided portions between the conductive patterns 110-3. The surface of the substrate is exposed. It was also confirmed by visual observation that there was almost no damage to the exposed surface of the transparent substrate 101-3 and the conductive patterns 110-3 on both sides.

(First comparative example)
In the first comparative example, only the transparent conductive layer was formed without forming the envelope-shaped transparent conductive layer in the process of step S1 of FIGS. 3 and 4. Except this point, the conductive pattern formation board of the 1st comparative example was obtained on the same conditions as the 1st example mentioned above.

  FIG. 9 is an enlarged photograph of the conductive pattern on the conductive pattern forming substrate of the first comparative example. In the first comparative example, laser irradiation is performed on an envelope-shaped metal layer having a thickness of 6 to 7 μm formed directly on the surface of the transparent substrate 101-4 without an envelope-shaped transparent conductive layer as a base. . In the conductive pattern forming substrate 1-4 of the first comparative example, as shown in the area A2 and the area A3 in the enlarged photograph of FIG. 9, unnecessary portions are not sufficiently removed, and the adjacent conductive pattern 110-4. There is a short circuit between them. If the average output of the laser is further increased in order to eliminate such a short circuit, for example, the pattern width of the conductive pattern 110-4 may be narrowed and damage such as disconnection may occur.

(Second comparative example)
In the second comparative example, as in the first comparative example, only the transparent conductive layer was formed without forming the envelope-shaped transparent conductive layer in the process of step S1 in FIGS. In the second comparative example, the arrangement pitch of the conductive patterns was 40 μm, the pattern width of the conductive patterns was 20 to 25 μm, and the interval between the conductive patterns was 15 to 20 μm.

  Furthermore, in the second comparative example, a pulse YAG laser capable of laser oscillation with a second harmonic of a wavelength of 532 nm and an average output of 10 W was used as the laser used for forming the conductive pattern. The laser irradiation conditions were a beam condensing diameter of 30 μm, an average output of 10 W, and a scanning speed of 3000 mm / s. Except for the above, a conductive pattern forming substrate of the second comparative example was obtained under the same conditions as in the first example.

  FIG. 10 is an enlarged photograph of the conductive pattern on the conductive pattern forming substrate of the second comparative example. In the second comparative example, a wavelength of 532 nm is applied to an envelope-shaped metal layer having a thickness of 6 to 7 μm that is directly formed on the surface of the transparent substrate 101-5 without an envelope-shaped transparent conductive layer as a base. Second harmonic laser light is irradiated. In the conductive pattern forming substrate 1-5 of the second comparative example, as shown in the enlarged photograph of FIG. 10, the beam spot is formed on the surface of the transparent substrate 101-5 exposed in the divided portion between the conductive patterns 110-5. Damage like drowning has occurred. In the second comparative example, as the transparent substrate 101-5, a substrate made of PET other than glass is used, and the above damage appears remarkably.

(Evaluation)
About the 1st-3rd Example, from the enlarged photograph of FIGS. 6-8, the high-definition conductive patterns 110-1 to 110-3 are the conductive patterns 110-1 to 110-3 and the transparent substrates 101-1 to 101. It can be seen that the damage to -3 is suppressed. Moreover, it can be seen from the comparison between the first embodiment and the second embodiment that the conductive patterns 110-1 and 110-2 can be further refined while suppressing damage in this way.

  From the comparison between the first to third examples and the first and second comparative examples, even if the envelope-shaped metal layer is formed thick for high definition, the envelope-shaped transparent conductive layer can be easily peeled off. It can be seen that the unnecessary portion is sufficiently removed and damage is suppressed by the function as the base.

1, 1-1, 1-2, 1-3 Conductive pattern forming substrate 101, 101-1, 101-2, 101-3 Transparent substrate 102 Transparent conductive layer 103 Envelope shape transparent conductive layer 104 Envelope shape metal layer 110, 110 -1,110-2,110-3 Conductive pattern 111 Patterned transparent conductive layer 112 Patterned metal layer 120 Multilayer film

Japanese Patent No. 5488461 JP 2013-152514 A International Publication No. WO2012 / 096232 Pamphlet

Claims (7)

In a conductive pattern forming substrate comprising a transparent substrate having translucency and insulation, and a conductive pattern of a predetermined pattern formed on the surface of the transparent substrate,
The conductive pattern is
On the surface of the transparent substrate, a patterned transparent conductive layer formed in the predetermined pattern and having translucency and conductivity;
On the surface of the patterned transparent conductive layer, a patterned metal layer formed of a conductive material mainly composed of metal particles,
A conductive pattern forming substrate comprising:   The conductive pattern forming substrate according to claim 1, wherein the patterned metal layer has a thickness in a range of 1 μm to 15 μm.   An envelope-shaped transparent conductive layer formed in an envelope shape including the predetermined pattern on the surface of the transparent substrate and having translucency and conductivity, and formed on the surface of the envelope-shaped transparent conductive layer with the conductive material 3. The conductive pattern according to claim 1, wherein the conductive pattern is formed by removing a region other than the predetermined pattern from a laminated film having an envelope-shaped metal layer by laser irradiation. Pattern forming substrate.   The conductive material is obtained by baking a conductive paste in which the metal particles and a resin binder are mixed in a paste form, and the metal particles are bound by the resin binder. The conductive pattern forming substrate according to any one of Items 1 to 3.   The conductive pattern forming substrate according to claim 4, wherein the metal particles are silver particles. In a substrate manufacturing method for manufacturing a conductive pattern forming substrate comprising a transparent substrate having translucency and insulation, and a conductive pattern having a predetermined pattern formed on the surface of the transparent substrate,
A first layer forming process for forming an envelope-shaped transparent conductive layer having an envelope shape including the predetermined pattern on the surface of the transparent substrate and having translucency and conductivity;
Forming an envelope-shaped metal layer made of a conductive material containing metal particles as a main component on the surface of the envelope-shaped transparent conductive layer to form a laminated film of the envelope-shaped transparent conductive layer and the envelope-shaped metal layer; 2 layer formation process,
A pattern forming process for forming the conductive pattern by removing regions other than the predetermined pattern from the laminated film;
A substrate manufacturing method comprising: The second layer forming process is a process of forming the envelope-shaped metal layer by screen printing using a conductive paste in which the metal particles and a resin binder are mixed in a paste and baking after printing.
The substrate manufacturing method, wherein the pattern forming process is a process of removing regions other than the predetermined pattern from the laminated film by laser irradiation.