JP2017000990A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device which inhibits occurrence of airflow flowing in through holes without complicating a structure of a stage.SOLUTION: A holding surface of a stage holds a substrate provided with through holes. Suction holes open on the holding surface. A negative pressure is generated in each suction hole. A first plug member is detachably stuffed into each suction hole. The first plug member closes the suction hole while stuffed into the suction hole. An inner surface of the suction hole is formed into a shape which supports the first plug member.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a substrate processing apparatus for processing a substrate by attracting the substrate to a stage.

  Patent Documents 1 and 2 below disclose a technique for forming a film on the surface of a substrate by forming a film material into droplets from an inkjet head and discharging the film material. An example of a substrate on which a film is formed is a printed board on which through holes are formed. When the film is formed, the substrate is adsorbed on the stage. A plurality of suction holes are provided in the stage. By making the inside of the suction hole negative, the substrate is adsorbed on the stage.

  When the through hole of the substrate and the suction hole of the stage overlap, an airflow passing through the through hole is generated. The flight path of the droplets ejected from the inkjet head may be affected by this air flow. When the droplet flight path deviates from the target path, the shape of the formed film is distorted.

  In the apparatus disclosed in Patent Document 1, airflow is prevented from occurring by closing a suction hole overlapping with the through hole. As a mechanism for closing the suction hole, an actuator such as an electromagnetic valve is cited. Other examples include a movable member that closes the suction hole by being displaced by the generation of an air current.

  In the apparatus disclosed in Patent Document 2, overlapping of the through hole and the suction hole is avoided by displacing a part of the suction hole of the stage. In order to displace some suction holes of the stage, the stage is divided into a plurality of parts in the in-plane direction. A part of the suction holes can be displaced by changing the relative positions of the divided parts.

JP 2014-108388 A JP 2014-116391 A

  In the conventional apparatus, an actuator and a movable part are provided on the stage in order to suppress the generation of airflow through the through hole of the substrate. For this reason, the structure of the stage becomes complicated. The objective of this invention is providing the substrate processing apparatus which can suppress generation | occurrence | production of the airflow which passes along a through hole, without making the structure of a stage complicated.

According to one aspect of the invention,
A stage having a holding surface for holding a substrate on which a through hole is formed;
A plurality of suction holes that open to the holding surface and have negative pressure inside;
Removably packed inside each of the plurality of suction holes, and having a first plug member that closes the suction holes in a state packed in the suction holes,
A substrate processing apparatus is provided in which the inner surface of the suction hole is shaped to support the first plug member.

  By filling the first plug member into the suction hole that overlaps the through hole, it is possible to suppress the generation of airflow through the through hole. Since the first plug member is detachable, the suction hole overlapping the through hole can be easily closed according to the type of the substrate.

FIG. 1 is a schematic view of a substrate manufacturing apparatus according to an embodiment. FIG. 2A is a plan view of the stage of the substrate manufacturing apparatus according to the embodiment, and FIG. 2B is a plan view of the substrate to be processed. FIG. 3 is a diagram illustrating an example of information output to the output device of the substrate manufacturing apparatus according to the embodiment. FIG. 4A is a partial cross-sectional view of the stage and the head unit of the substrate manufacturing apparatus according to the embodiment, and FIG. 4B is a perspective view of the first plug member. FIG. 5A is a cross-sectional view of a stage of a substrate processing apparatus according to another embodiment, and FIGS. 5B and 5C are perspective views of a first plug member and a second plug member, respectively. FIG. 6 is a sectional view of a stage of a substrate processing apparatus according to still another embodiment. 7A is a plan view of a first plug member used in a substrate processing apparatus according to still another embodiment, FIG. 7B is a cross-sectional view taken along one-dot chain line 7B-7B in FIG. 7A, and FIG. FIG. 7D is a cross-sectional view taken along one-dot chain line 7D-7D in FIG. 7C. 8A and 8B are cross-sectional views of modifications of the first plug member used in the embodiment shown in FIGS. 4A to 4B, and FIGS. 8C and 8D are FIGS. 5A to 5C, respectively. FIG. 8E is a cross-sectional view of a variation of the first plug member and the second plug member used in the illustrated embodiment, and FIG. 8E illustrates the first plug used in the embodiment illustrated in FIGS. 7A to 7D. FIG. 8F is a sectional view taken along one-dot chain line 8F-8F in FIG. 8E. 9A and 9B are cross-sectional views of a stage and a first plug member of a substrate processing apparatus according to still another embodiment. 10A and 10B are cross-sectional views of the stage and the first plug member of the substrate processing apparatus according to a modification of the embodiment shown in FIGS. 9A and 9B.

  FIG. 1 is a schematic view of a substrate manufacturing apparatus according to an embodiment. A stage 22 is supported on the surface plate 20 by a moving mechanism 21. A substrate 50 such as a printed wiring board is held on the upper surface (holding surface) of the stage 22. The moving mechanism 21 moves the stage 22 in two directions parallel to the horizontal plane.

  The head unit 30 and the imaging device 33 are supported by the support member 24 above the surface plate 20. As the support member 24, for example, a portal frame is used. The head unit 30 is supported by the support member 24 via the support mechanism 31 and can be moved up and down with respect to the stage 22.

  The imaging device 33 images a wiring pattern, an alignment mark, a film pattern formed on the substrate 50, and the like formed on the surface of the substrate 50. Image data obtained by imaging is input to the control device 70. The head unit 30 includes an inkjet head and a curing light source. Droplets (for example, droplets of solder resist, etc.) of a photo-curable (for example, ultraviolet curable) film material are ejected from a plurality of nozzle holes of the inkjet head toward the substrate 50. The discharged film material adheres to the surface of the substrate 50. When the film material adhering to the substrate 50 is irradiated with ultraviolet rays from a curing light source, the film material is cured.

  The control device 70 controls the moving mechanism 21, the head unit 30, and the imaging device 33. The control device 70 includes a storage device 73. The storage device 73 stores a computer program executed by the processing unit of the control device 70 and various data necessary for the operation of the control device 70. An operator inputs various commands (commands) and numerical data necessary for control to the control device 70 through the input device 71. The control device 70 outputs various information from the output device 72 to the operator.

  FIG. 2A shows a plan view of the stage 22. A plurality of suction holes 40 are distributed on the holding surface 23 of the stage 22. The plurality of suction holes 40 are distributed in a matrix, for example, in the plane of the holding surface 23. A positioning structure 41 for positioning the substrate 50 (FIG. 1) is provided on the holding surface 23. The positioning structure 41 includes, for example, protrusions provided at three or four locations. By positioning the edge of the substrate 50 against these protrusions, the substrate 50 is positioned with respect to the stage 22.

  FIG. 2B shows a plan view of the substrate 50. A plurality of through holes 51 are formed in the substrate 50. The arrangement of the through holes 51 differs depending on the type of the substrate 50. Further, metal patterns such as a wiring pattern 52 and a ground pattern 53 are formed.

  In the storage device 73 (FIG. 1) of the control device 70, image data defining the shape of the film pattern to be formed on the substrate 50, position data defining the position of the through hole 51 formed in the substrate, and formation on the stage 22 The position data defining the position of the suction hole 40 is stored. Information from an encoder attached to the moving mechanism 21 (FIG. 1) is input to the control device 70. The control device 70 can detect the position of the stage 22 based on information from the encoder.

  The control device 70 (FIG. 1) is configured to hold the substrate 50 on the holding surface 23 based on the position data of the through hole 51 and the position data of the suction hole 40 stored in the storage device 73. The suction hole 40 that overlaps is extracted. Further, information specifying the extracted suction hole 40 is output to the output device 72.

  FIG. 3 shows an example of information output to the output device 72. The output device 72 includes a display screen for displaying an image. On the display screen of the output device 72, an image 22A of the stage 22 (FIG. 2A) and an image 40A of the plurality of suction holes 40 (FIG. 2A) are displayed. Among the images 40A of the plurality of suction holes 40, an identification mark 42 is attached to the image 40A of the suction holes 40 that overlaps the through holes 51. In FIG. 3, the circumference surrounding the image 40 </ b> A of the suction hole 40 is used as the identification mark 42. In addition, the color, size, shape, and the like of the image 40 </ b> A may be different from those of the other suction holes 40 in order to identify the suction holes 40 that overlap with the through holes 51.

  FIG. 4A shows a partial cross-sectional view of the stage 22 and the head unit 30. A substrate 50 is placed on the holding surface 23 of the stage 22. A plurality of through holes 51 are formed in the substrate 50. A head unit 30 is supported above the stage 22. The head unit 30 includes an inkjet head 35 and a curing light source (not shown in FIG. 4A). A plurality of nozzle holes 36 are provided on the bottom surface of the inkjet head 35. A droplet 37 of a film material is discharged from the nozzle hole 36 toward the substrate 50.

  A plurality of suction holes 40 are provided in the stage 22. Each of the suction holes 40 opens in the holding surface 23. Further, each of the suction holes 40 is connected to a suction flow path 45 formed in the stage 22. The suction pump 46 sucks the internal space of the suction hole 40 through the suction flow path 45. Thereby, the inside of the suction hole 40 becomes negative pressure (pressure lower than atmospheric pressure). Thereby, the substrate 50 is attracted to the stage 22. A first plug member 60 is packed in the suction hole 40 </ b> B overlapping the through hole 51 of the substrate 50. The first plug member 60 can be attached to and detached from the suction hole 40.

  FIG. 4B shows a perspective view of the first plug member 60. The external shape of the first plug member 60 is a columnar shape, and the flat cross section thereof substantially matches the flow path cross section of the suction hole 40. The inner surface of the suction hole 40 (FIG. 4A) is shaped to support the first plug member 60. For example, a step 43 is formed on the inner surface of the suction hole 40, and the step 43 supports the first plug member 60. The upper surface of the first plug member 60 is supported at the same height as the holding surface 23 or at a position lower than the holding surface 23. For this reason, when the substrate 50 is held on the holding surface 23, the first stopper member 60 does not hinder the adsorption of the substrate 50.

  When the first plug member 60 closes the suction hole 40, no airflow is generated in the suction hole 40 in which the first plug member 60 is packed. For this reason, the airflow which passes through the through hole 51 which overlaps with the suction hole 40 is not generated. Since no airflow is generated, the flight path of the droplets ejected from the inkjet head 35 does not change under the influence of the airflow.

  In the embodiment, the suction hole 40 overlapping the through hole 51 is displayed on the output device 72 (FIG. 3). For this reason, the operator can easily identify the suction hole 40 into which the first plug member 60 should be packed by confirming the information displayed on the output device 72 (FIG. 3).

  In the above embodiment, there is no need to attach a movable mechanism for suppressing the generation of airflow through the through hole 51 to the stage 22. For this reason, it is possible to avoid an increase in the cost of the stage 22 and an increase in the occurrence frequency of failures. Since the first plug member 60 can be attached and detached, it is possible to easily cope with the substrates 50 in which the through holes 51 are arranged differently.

  In the above embodiment, the substrate manufacturing apparatus including the inkjet head has been described. However, the configuration including the stage 22, the suction hole 40, and the first plug member 60 according to the above embodiment may be applied to other substrate processing apparatuses. Is possible. In particular, a remarkable effect can be expected when an air flow locally generated in a space on the substrate surface adversely affects the substrate processing.

  Next, another embodiment will be described with reference to FIGS. 5A to 5C. Hereinafter, differences from the embodiment shown in FIGS. 1 to 4B will be described, and description of common configurations will be omitted.

  FIG. 5A shows a cross-sectional view of the stage 22 of the substrate processing apparatus according to the present embodiment. In the embodiment shown in FIGS. 1 to 4B, the first plug member 60 is packed only in the suction hole 40 that overlaps the through hole 51. In this embodiment, all the suction holes 40 are filled with either the first plug member 60 or the second plug member 61.

  The first plug member 60 is packed into the suction hole 40B that overlaps with the through hole 51, and the second plug member 61 is packed into the suction hole 40C that does not overlap with the through hole 51.

  5B and 5C are perspective views of the first plug member 60 and the second plug member 61, respectively. Both the first plug member 60 and the second plug member 61 have a cylindrical outer shape. The first plug member 60 has a cylindrical shape filled with the contents, but the second plug member 61 has a through-hole 62 reaching from the bottom surface to the top surface. The outer diameter of the second plug member 61 is the same as the outer diameter of the first plug member 60.

  When the first plug member 60 is packed in the suction hole 40 (FIG. 5A), the suction hole 40 is almost completely closed. For this reason, an airflow passing through the suction hole 40 is not generated. On the other hand, even if the second plug member 61 is packed in the suction hole 40, an air flow can be generated through the through hole 62. The first plug member 60 is packed into the suction hole 40B that overlaps with the through hole 51, and the second plug member 61 is packed into the suction hole 40C that does not overlap with the through hole 51.

  By filling the first plug member 60 into the suction hole 40 </ b> B that overlaps with the through hole 51, it is possible to suppress the generation of airflow through the through hole 51. Since the second plug member 61 having the through hole 62 is packed in the suction hole 40 that does not overlap with the through hole 51, the substrate 50 can be adsorbed through the through hole 62. The second plug member 61 has a function of reducing the flow path cross section of the suction hole 40.

  In the embodiment shown in FIGS. 4A and 4B, the outer diameter of the first plug member 60 is equal to the inner diameter of the opening disposed on the holding surface 23. On the other hand, in the embodiment shown in FIGS. 5A to 5C, the dimension of the through hole 62 of the second plug member 61 corresponds to the dimension of the suction hole 40 of the embodiment shown in FIGS. 4A and 4B. The outer diameters of the first plug member 60 and the second plug member 61 are larger than the inner diameter of the through hole 62. The first plug member 60 and the second plug member 61 used in the embodiment shown in FIGS. 5A to 5C are larger than the first plug member 60 used in the embodiment shown in FIGS. 4A and 4B. Is possible. Therefore, the first plug member 60 and the second plug member 61 can be handled more easily than in the embodiment shown in FIGS. 4A and 4B.

  Next, still another embodiment will be described with reference to FIG. Hereinafter, differences from the embodiment shown in FIGS. 1 to 4B will be described, and description of common configurations will be omitted.

  FIG. 6 is a sectional view of the stage 22 of the substrate processing apparatus according to this embodiment. In the present embodiment, the suction hole 40 includes a large diameter portion 401 and a small diameter portion 402. The large diameter portion 401 opens in the holding surface 23. The small-diameter portion 402 is continuous with the large-diameter portion 401 on the bottom surface of the large-diameter portion 401 and has a smaller channel cross section than the large-diameter portion 401.

  The first plug member 60 is packed in the large diameter portion 401 of the suction hole 40B that overlaps the through hole 51. The suction hole 40C that does not overlap with the through hole 51 is in an open state. The flow rate of the airflow flowing through the suction hole 40 is mainly limited by the size of the cross section of the small diameter portion 402. As an example, the channel cross section of the small diameter portion 402 is substantially equal to the channel cross section of the suction hole 40 of the embodiment shown in FIG. 4A.

  The first plug member 60 can be enlarged by increasing the inner diameter of the large diameter portion 401. Thereby, handling of the 1st stopper member 60 becomes easy. Even if the large diameter portion 401 is enlarged, the flow rate of the airflow flowing through the suction hole 40 is limited by the inner diameter of the small diameter portion 402. For this reason, it is possible to maintain a desired flow rate independently of the size of the large diameter portion 401.

  Next, still another embodiment will be described with reference to FIGS. 7A to 7D. Hereinafter, differences from the embodiment shown in FIGS. 5A to 5C will be described, and description of common configurations will be omitted.

  In the embodiment shown in FIGS. 5A to 5C, a first plug member 60 that closes the suction hole 40 and a second plug member 61 that reduces the flow path cross section of the suction hole 40 are prepared. In the embodiment shown in FIGS. 7A to 7D, only one type of first plug member 60 is prepared.

  FIG. 7A shows a plan view of the first plug member 60, and FIG. 7C shows a bottom view of the first plug member 60. 7B and 7D are cross-sectional views taken along one-dot chain line 7B-7B in FIG. 7A and cross-sectional views along one-dot chain line 7D-7D in FIG. 7C, respectively.

  A relay channel 67 (FIGS. 7B and 7D) connected to the inside of the first plug member 60 from the first location 65 (FIG. 7A) to the second location 66 (FIG. 7C) on the surface of the first plug member 60. ) Is formed. The first location 65 is located on the upper surface of the first plug member 60, and the second location 66 is located on the bottom surface of the first plug member 60.

  The suction hole 40 includes a large diameter portion 401 and a small diameter portion 402, similarly to the suction hole 40 shown in FIG. The first plug member 60 is packed in the large diameter portion 401.

  FIG. 7B shows a state in which the first plug member 60 is packed in the large-diameter portion 401 in a posture (second posture) with its upper surface facing upward. In this state, the second portion 66 is disposed at a position shifted from the opening of the small diameter portion 402. For this reason, the opening of the small diameter portion 402 connected to the large diameter portion 401 is blocked by the bottom surface of the first plug member 60. Thereby, the state where the airflow which passes along the suction hole 40 does not generate | occur | produce is obtained.

  FIG. 7D shows a state in which the first plug member 60 is packed in the large-diameter portion 401 in a posture (first posture) with the bottom surface facing upward. In this state, the first portion 65 of the first plug member 60 overlaps the opening of the small diameter portion 402. For this reason, the small diameter portion 402 is connected to the relay flow path 67. Thereby, the state which the airflow which passes along the suction hole 40 generate | occur | produces is obtained.

  In the embodiment shown in FIGS. 7A to 7D, by changing the posture of the first plug member 60 packed in the large-diameter portion 401, a state where an air flow passing through the suction hole 40 can be generated and an air flow is not generated. One of the states is realized.

  In order to easily distinguish the second posture in which the upper surface of the first plug member 60 faces upward and the first posture in which the bottom surface faces upward, the upper surface and the bottom surface of the first plug member 60 are Different colors may be used. Thereby, it can be easily determined whether or not each suction hole 40 is in a state where no airflow is generated.

  Next, a modification of the above embodiment will be described with reference to FIGS. 8A to 8F.

  FIG. 8A shows a modification of the first plug member 60 used in the embodiment shown in FIGS. 4A to 4B. In the modification shown in FIG. 8A, the first plug member 60 includes an embedded member 68 made of a ferromagnetic material or a permanent magnet. The portions of the first plug member 60 other than the embedding member 68 are made of resin, for example. As shown in FIG. 8B, a screw screwed into the resin member may be used as the embedding member 68. It is also possible to use a potato screw (headless screw) as the screw to be embedded. When a part of the surface of the embedded member 68 is exposed, it is preferable to perform a surface treatment of the exposed region for rust prevention.

  Since the embedded member 68 made of a ferromagnetic material or a permanent magnet is embedded in the first plug member 60, the first plug member 60 is moved by bringing the magnet or the ferromagnetic material close to the first plug member 60. It can be easily taken out from the suction hole 40 (FIG. 4A).

  8C and 8D show modified examples of the first plug member 60 and the second plug member 61 used in the embodiment shown in FIGS. 5A to 5C, respectively. The first plug member 60 and the second plug member 61 include an embedded member 68. The embedded member 68 is formed of a ferromagnetic material or a permanent magnet.

  FIG. 8E shows a modification of the first plug member 60 used in the embodiment shown in FIGS. 7A to 7D. 8E shows a plan view of the first plug member 60, and FIG. 8F shows a cross-sectional view taken along one-dot chain line 8F-8F in FIG. 8E. The first plug member 60 includes an embedded member 68 therein. The embedded member 68 is formed of a ferromagnetic material or a permanent magnet.

  8C to 8F, the first plug member 60 is attracted to the suction hole 40 (FIG. 4A) by bringing a magnet or a ferromagnetic material closer to the first plug member 60 or the second plug member 61. ) Easily.

  Next, a substrate processing apparatus according to still another embodiment will be described with reference to FIGS. 9A to 9B. Hereinafter, differences from the embodiment shown in FIGS. 7A to 7C will be described, and description of common configurations will be omitted.

  9A and 9B are sectional views of the stage 22 and the first plug member 60 of the substrate processing apparatus according to this embodiment. The first plug member 60 is packed in the large diameter portion 401 of the suction hole 40. A relay channel 67 is formed in the first plug member 60. FIG. 9A shows a state where the first plug member 60 blocks the opening of the small diameter portion 402. FIG. 9B shows a state where the small diameter portion 402 is connected to the relay flow path 67 in the first plug member 60. The posture of the first plug member 60 illustrated in FIG. 9B is referred to as a “first posture”, and the posture of the first plug member 60 illustrated in FIG. 9A is referred to as a “second posture”.

  The first plug member 60 has an outer shape that can be turned upside down while being packed in the large-diameter portion 401. For this reason, the posture of the first plug member 60 can be changed from the first posture to the second posture and vice versa in the large-diameter portion 401. For example, the first plug member 60 has a spherical outer shape and can freely rotate in the large diameter portion 401.

  When the first plug member 60 takes the first posture or the second posture, the first plug member 60 is excited so that the direction of the magnetic flux is parallel to the vertical direction. The first plug member 60 itself may be formed of a ferromagnetic material, and this ferromagnetic material may be excited, or a permanent magnet may be embedded in the resin material. As an example, when the first plug member 60 takes the first posture (FIG. 9B), when the S pole faces upward, and when the second posture (FIG. 9A) takes, the N pole faces upward. Has been.

  When the S pole or N pole of the magnet 80 is brought close to the first plug member 60, the first plug member 60 is switched from the first position to the second position or vice versa by the magnetic force. For this reason, it is possible to easily switch between a state where an airflow passing through the suction hole 40 can be generated and a state where no airflow is generated.

  10A and 10B show a modification of the first plug member 60 shown in FIGS. 9A and 9B. 10A and 10B, the first plug member 60 has a disk shape (meteorite shape) with a raised center. The first plug member 60 is packed in the large diameter portion 401 of the suction hole 40. 10A and 10B show a state in which the first plug member 60 is in the second posture and the first posture, respectively.

  The outer peripheral edge of the first plug member 60 and the side surface of the large-diameter portion 401 are in contact with a substantially circumferential line, not a cylindrical surface. For this reason, similarly to the embodiment shown in FIGS. 9A and 9B, the upper and lower sides of the first plug member 60 can be easily inverted by bringing the magnet 80 closer to the first plug member 60.

  As shown in FIGS. 9A and 9B, when the outer shape of the first plug member 60 is spherical, the first plug member 60 can take various postures other than the first posture and the second posture. On the other hand, in the embodiments shown in FIGS. 10A and 10B, postures other than the first posture and the second posture are unstable. For this reason, it can avoid that the 1st plug member 60 takes attitudes other than a 1st attitude | position and a 2nd attitude | position.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

20 Surface plate 21 Moving mechanism 22 Stage 22A Stage image 23 Holding surface 24 Support member 30 Head unit 31 Support mechanism 33 Imaging device 35 Inkjet head 36 Nozzle hole 37 Film material droplet 40 Suction hole 40A Suction hole image 40B Through hole Suction hole 41 that overlaps with through hole 51 Suction hole 41 that does not overlap with through hole 51 Positioning structure 42 Identification mark 43 Step 45 Suction channel 46 Suction pump 50 Substrate 51 Through hole 52 Wiring pattern 53 Ground pattern 60 First plug member 61 Second plug Member 62 Through-hole 65 First location 66 Second location 67 Relay channel 68 Embedding member 70 Control device 71 Input device 72 Output device 73 Storage device 80 Magnet 401 Large diameter portion 402 Small diameter portion

Claims (7)

A stage having a holding surface for holding a substrate on which a through hole is formed;
A plurality of suction holes that open to the holding surface and have negative pressure inside;
Removably packed inside each of the plurality of suction holes, and having a first plug member that closes the suction holes in a state packed in the suction holes,
The substrate processing apparatus, wherein an inner surface of the suction hole is configured to support the first plug member. further,
A control device;
An output device,
The controller is
A storage device for storing position data of the through holes formed in the substrate and position data of the suction holes in the holding surface;
Based on the position data of the through hole stored in the storage device and the position data of the suction hole, the suction hole overlapping the through hole is extracted in a state where the substrate is held on the holding surface, The substrate processing apparatus according to claim 1, wherein information specifying the extracted suction holes is output to the output device. Furthermore, it has an inkjet head for discharging droplets of a film material toward the substrate held on the stage,
The substrate processing apparatus according to claim 2, wherein the control device controls ejection of droplets from the inkjet head.   The substrate processing apparatus according to claim 1, wherein the first plug member includes a permanent magnet or a ferromagnetic material. further,
5. The device according to claim 1, further comprising: a second plug member that is detachably packed in each of the plurality of suction holes, and that reduces a cross-section of the flow path of the suction holes in a state of being packed in the suction holes. 2. The substrate processing apparatus according to item 1. Each of the suction holes is
A large diameter portion opening in the holding surface;
Including a small-diameter portion that is continuous with the large-diameter portion at the bottom surface of the large-diameter portion and has a smaller channel cross-section than the channel cross-section of the large-diameter portion,
Inside the first plug member, a relay channel that is connected from the first location to the second location on the surface of the first plug member is formed,
When the first plug member is packed into the large diameter portion in the first posture, the small diameter portion is connected to the relay flow path, whereby the substrate is sucked through the relay flow path,
5. The device according to claim 1, wherein when the first plug member is packed into the large-diameter portion in the second posture, the small-diameter portion is blocked by the first plug member, and the substrate is not sucked. The substrate processing apparatus according to claim 1. The first plug member includes a permanent magnet;
The substrate processing apparatus according to claim 6, wherein the substrate processing apparatus is switched from the first posture to the second posture or from the second posture to the first posture by a magnetic force.

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