JP6321248B2 - Mask suction device and solder ball printer having the same - Google Patents

Description

  The present invention relates to a mask suction device including a substrate receiving plate capable of mounting a substrate so as to face the mask, and a mask suction portion having a plurality of members including permanent magnets arranged on the back side of the substrate receiving plate, and a solder ball The present invention relates to a solder ball printer that prints on an electrode formed on a substrate surface.

  In conventional solder ball printers, when a solder ball is placed on the mask and the solder ball is filled into the mask opening, the gap between the mask and the substrate is kept constant, and the magnetic mask is fixed. doing. Therefore, a protruding post is provided on the back surface of the mask, and a magnet part is provided on the table side with the substrate interposed therebetween.

  An example of such a solder ball printing machine is disclosed in Patent Document 1. In the apparatus described in this publication, in order to more accurately and reliably mount the conductive ball on the terminal area of the substrate, the apparatus has a backup plate and a metal mask for mounting the substrate so that the terminal area is opened. Yes. Further, a transfer mask having a plurality of through holes corresponding to a plurality of terminal areas of the substrate, a fixing block for fixing the end of the transfer mask so that the transfer mask faces one surface of the substrate, and the transfer mask as a magnetic force Therefore, it has a magnet part to be pulled to the backup plate side. And the magnet part makes the attracting force of the center part of a transfer mask smaller than the attracting force of a peripheral part.

  Another example of a conventional solder ball printer is disclosed in Patent Document 2. In the solder paste printing apparatus described in this publication, even if a fine pitch solder paste is used, solder paste is prevented from entering between the substrate and the mask, and printing with high accuracy is attempted. Therefore, the mask is brought into contact with the upper surface of the substrate held on the stage, the solder paste is placed on the mask, and the squeegee is moved along the upper surface of the mask. The mask is made of a magnetic material, and an electromagnet that attracts the mask through a substrate is provided on the stage.

JP 2008-192818 A JP 2012-19000 A

  As described above, it is known that a magnet is disposed on a table to attract the mask, the mask is attracted to the substrate side with the substrate attracted by the attraction force of the magnet, and the mask and the substrate are brought into close contact with each other. However, since the thickness of the mask is usually as thin as 20 μm to 100 μm, in order to securely attract the mask to the substrate, it is necessary to bring the magnet and the mask close to within a few millimeters, and the substrate receiving plate member that supports the substrate is thin. It must be composed of plates. When the substrate receiving plate is thinned, the substrate and the substrate receiving plate are attracted to the mask with warping, and it is difficult to maintain flatness.

  On the other hand, in order to maintain the accuracy of the mask, a predetermined tension is applied to the mask. Therefore, even if the mask is attracted by a magnet arranged on the table, it is difficult to completely adhere the mask and the substrate. If the substrate and the mask are not completely in close contact with each other, when a ball is filled on the substrate through the mask pattern holes, each of the mask holes in which the predetermined hole pattern is formed is originally filled with one ball. It should be noted that one or more holes may be filled with two or more balls. This is a so-called double ball or extra ball phenomenon in which extra balls are filled in the pads on the substrate.

  Further, when the mask is separated from the substrate, the substrate is separated from the mask while maintaining the magnetic force, so that the mask is vigorously separated from the outer periphery of the substrate while being bent. For this reason, a phenomenon occurs in which the ball mounted on the folding substrate moves from a predetermined position and deviates from a normal mounting position called a so-called shift ball. In addition, when the mask moves away, the ball mounted on the substrate is blown off, and the ball remains attached to the side surface of the mask pattern hole.

  In the microball mounting apparatus described in Patent Document 1, when the mask is attracted to the substrate by the magnetic force of the magnet part that attracts the mask, the magnitude of the attracting force is made smaller at the center part than the peripheral part, and uniform adsorption I am trying. However, in this apparatus, although there is a difference in relative suction force, since the mask is always sucked, the following problems may occur. In other words, when mounting the solder balls on one substrate and separating the mask from the substrate, the suction force at the center is reduced, in other words, the mask always has the force to attract the mask when viewed from the substrate side. Does not act to eliminate the deflection of the mask on the entire surface. Therefore, in a situation where the outer diameter of the solder ball becomes smaller year by year, it becomes difficult to stably mount the solder ball.

  In Patent Document 2, an electromagnet is embedded on a table to adsorb a mask and a substrate. However, when an electromagnet is used, it is necessary to attach a large number of electromagnets. Further, since the magnetic force remains even if the current supply to the electromagnet is turned off, a control device having a degaussing function is required. Furthermore, since the electromagnet emits heat to the outside due to heat generation, a cooling function is required to avoid deformation of the table due to heat, and the structure of the table becomes complicated and expensive.

  Accordingly, the present invention provides a mask suction device capable of maintaining the planar accuracy of a substrate, and a pad on the substrate reliably and accurately without holding a gap between the solder ball and the gap between the mask and the substrate. A solder ball printer capable of mounting a ball on the machine.

  In order to solve the above-described problems, a mask suction device according to the present invention includes a substrate receiving plate on which a substrate is mounted so as to face the mask and a plurality of bottomed holes are formed on the back side, and a back surface of the substrate receiving plate. A mask attracting portion having a plurality of members including columnar permanent magnets that can be fitted into each of the plurality of bottomed hole portions formed on the side, and at least an upper end portion of the member including the columnar permanent magnets of the mask attracting portions. The substrate receiving plate moves toward and away from the bottom surface of the bottomed hole portion between the bottom surface of the corresponding bottomed hole portion of the substrate receiving plate and the opening of the bottomed hole portion. Drive means for moving.

  In the mask attracting apparatus according to the present invention, the mask attracting portion includes a magnetic pin extending in a columnar axial direction below the columnar permanent magnet.

  Furthermore, the mask suction device according to the present invention is characterized in that the columnar permanent magnet and the columnar magnetic pin are integrated by suction.

  Further, in the mask suction device according to the present invention, the columnar permanent magnet and the magnetic pin are cylindrical, and a plurality of bottomed holes formed on the back side of the substrate receiving plate are hollowed out. It has a shape.

  A solder ball printer according to the present invention is a solder ball which is inserted into a plurality of openings formed in a mask and the solder balls are mounted on a plurality of electrode portions formed on a surface of a substrate facing the mask. In a ball printing machine, a substrate is mounted so as to face the mask, a substrate receiving plate having a plurality of bottomed holes formed on the back side, and a plurality of bottomed holes formed on the back side of the substrate receiving plate A plurality of members including a columnar permanent magnet that can be fitted to each of the plurality of members, and at least an upper end portion of the member including the columnar permanent magnets of the mask attracting portion corresponds to the plurality of the substrate receiving plates. A mask suction device comprising: a driving unit that moves toward and away from the bottom surface of the bottomed hole portion between the bottom surface of the bottomed hole portion and the opening of the bottomed hole portion. With And wherein the door.

  The solder ball printer according to the present invention is characterized in that the mask attracting portion has a magnetic pin extending in a columnar axial direction below the columnar permanent magnet.

  Furthermore, the solder ball printer according to the present invention is a mask suction portion for preventing a member including the columnar permanent magnet from slipping out from a plurality of bottomed holes formed on the back side of the substrate receiving plate. A lower end stopper is provided.

  The solder ball printer according to the present invention includes a substrate mounting table having the substrate receiving plate and a plurality of substrate receiving plate support members that support the substrate receiving plate in a vertical direction, and the substrate mounting table. An XYθ stage capable of driving a mounted table in a horizontal plane, and the substrate and the mask are aligned by the XYθ stage.

  The solder ball printer according to the present invention is characterized in that the columnar permanent magnet and the columnar magnetic pin are integrated by adsorption.

  In the solder ball printer according to the present invention, the columnar permanent magnet and the magnetic pin are cylindrical, and the plurality of bottomed holes formed on the back side of the substrate receiving plate are formed by hollowing out the column. It has a different shape.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the mask adsorption | suction apparatus which can maintain the planar accuracy of a board | substrate. Specifically, it is possible to prevent the substrate receiving plate having a substrate mounted so as to face the mask and having a plurality of bottomed holes on the back side from warping. In addition, according to the present invention, a solder ball printing machine is provided which can accurately hold a gap between a mask and a substrate, and can accurately and accurately mount a ball on a pad on the substrate without causing a positional shift of the solder ball. It becomes possible to do.

1 is a front view of an embodiment of a solder ball printer according to the present invention. It is a front view explaining the operation state of the mask adsorption | suction part of the solder ball printer shown in FIG. It is a front view explaining the operation state of the mask adsorption | suction part of the solder ball printer shown in FIG. It is a front view explaining the printing operation state of the solder ball printer shown in FIG. It is a flowchart which shows the printing method of a solder ball. It is a figure explaining printing operation of the solder ball printer concerning the present invention. It is a figure explaining the printing operation of the conventional solder ball printer. It is a perspective view of the mask adsorption | suction part with which the solder ball printer shown in FIG. 1 is provided. It is a perspective view of the other Example of a mask adsorption | suction part.

  In a solder ball printer that prints solder balls on pads (electrode parts) on a substrate, the pitch of the printing object tends to be as small as 150 μm or less, and with this shortening of the pitch, the size of the solder balls is also φ20 to φ100 μm And small size ones are used. Therefore, there is a need for an apparatus that can reliably and accurately print even a small solder ball. The present invention relates to a solder ball printer corresponding to this fine pitch, and several embodiments of the solder ball printer according to the present invention will be described below with reference to the drawings.

  An embodiment of the solder ball printer 20 according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a front partial sectional view of an embodiment of a solder ball printer 20 according to the present invention, and shows a state in which a substrate 2, which will be described in detail later, is separated from a mask 1. FIG. 2 is a front partial cross-sectional view of the solder ball printer 20 shown in FIG. 1 and shows a state in which the substrate 2 is approaching the mask 1. FIG. 3 is a front partial sectional view of the solder ball printer 20 shown in FIG. 1 and shows a state in which the mask 1 is sucked after the substrate 2 approaches the mask 1. FIG. 4 is a front partial sectional view of the solder ball printer 20 shown in FIG. 1 and shows a state in which solder balls are printed after the mask 1 is sucked.

  FIG. 5 is a flowchart showing a procedure of solder ball printing in the solder ball printer 20 according to the present invention. FIG. 6 shows a state during the processing of the mask portion when solder ball printing is performed according to the flowchart shown in FIG. FIG. FIG. 7 is a diagram corresponding to FIG. 6 and is a diagram for explaining a conventional printing method.

  In the solder ball printing machine 20, the substrate mounting table 6 is fixedly mounted on the printing table 12. The printing table 12 allows the upper surface member forming the upper surface of the printing table 12 to move in the vertical direction. The printing table cylinder 14 is driven by air pressure, and X and Y are two directions in the horizontal plane. , And an XYθ stage 13 that enables the printing table 12 to move in the θ direction that is the rotational direction in the horizontal plane.

  The substrate placement table 6 placed on the printing table 12 includes a substrate receiving plate 4 extending in the horizontal direction, and a substrate receiving plate support member 5 that supports the substrate receiving plate 4 in the vertical direction and is provided in a plurality. doing. The printing table 12 further includes a mask suction portion 11 having a portion that fits into each of the plurality of holes 4 a formed in the substrate receiving plate 4.

  As will be described later (see FIG. 8), the mask attracting portion 11 has a magnet 7 disposed on the upper end side and a magnetic pin 8 attached to the lower side of the magnet 7. A plurality of integrated bodies of magnets 7 and magnetic pins 8 formed in a columnar shape are attached to a magnetic plate 9 whose bottom surface is a rectangular flat plate by adsorption. By moving the magnetic body plate 9 up and down, a plurality of integrated bodies of the magnet 7 and the magnetic body pins 8 move up and down together, and each integrated body is fitted into the hole 4 a formed in the substrate receiving plate 4. Here, a permanent magnet such as neodymium, a ferrite magnet, a samarium cobalt magnet, an alnico magnet or the like can be used as the material of the magnet 7, and the material of the magnet is not particularly limited.

  A mask suction portion cylinder 10 that uses air pressure as a drive source is connected to the bottom surface of the magnetic plate 9 that forms the lower portion of the mask suction portion 11. The mask suction cylinder 10 is fixedly placed on the printing table 12 and allows the mask suction portion 11 to move up and down. Naturally, the mask suction part 11 can move up and down relative to the fixed substrate mounting table 6. In order to limit the lowering amount of the mask suction part 11, a mask suction part lower end stopper 16 is attached to the upper surface of the base plate constituting the lower part of the substrate mounting table 6. Is prevented from coming out of the mask hole 4a.

  The substrate receiving plate 4 of the substrate mounting table 6 is formed with a large number of pores that open on the upper surface side and extend in the vertical direction, and a flow path that connects the numerous formed pores in the horizontal direction is also formed. Yes. These pores and flow paths form a vacuum suction flow path 17. The vacuum suction channel 17 communicates with the vacuum suction pump P. When the vacuum pump P is operated, the opening at the tip of the vacuum suction channel 17 becomes negative pressure, and the substrate 2 is sucked by vacuum onto the upper surface of the substrate receiving plate 4. Thereby, the substrate 2 is fixed to the substrate receiving plate 4.

  The operation of the solder ball printer configured as described above will be described below using the flowchart shown in FIG. 5 and the front view of the solder ball printer shown in FIGS. FIG. 1 is a diagram illustrating a state during the substrate positioning operation in step S1 of FIG. 5, and is a diagram illustrating a state in which the substrate 2 is placed on the substrate placement table 6 by a transport unit (not shown). Before starting the printing of the solder balls, the printing table cylinder 14 for moving the printing table 12 up and down is contracted to the lowest position, and the magnetic body plate of the mask suction unit 11 contacts the mask suction unit lower end stopper 16. It is in the state (descent state). Since the printing table cylinder 14 is in the lowered state, the substrate mounting table 6 is lowered to the lowest end of the movement range. Since the substrate placement table 6 is in the lowered state, the substrate 2 placed on the substrate placement table 6 is lowered and the mask 1 and the substrate 2 are separated. However, the mask 1 is located not far from the substrate 2.

  In the state shown in FIG. 1, a camera (not shown) is moved between the mask 1 and the substrate 2 to image a positioning mark formed in advance on the mask 1 and the substrate 2. That is, in the upward visual field of the camera, a mark formed on the lower surface of the mask 1 is imaged, and the installation posture of the mask 1 is recognized as the target position. In the downward visual field of the camera, the mark formed on the substrate 2 is imaged. Then, a control device (not shown) instructs the XYθ stage 13 to perform a correction operation so as to correct the misalignment between the mark position on the mask 1 and the mark position on the substrate 2, and the mark on the substrate 2 is changed to the mark on the mask 1. Align to. The camera and mark are not shown here.

  Incidentally, the state shown in FIG. 1 is a lowered state in which the mask suction portion cylinder 10 is also contracted to the lowest position. Since the mask suction cylinder 10 is in the lowered state, the mask suction portion 11 connected to the tip of the mask suction cylinder 10 is also in the lowered state. In this state, the magnet 7 and the mask 1 are greatly separated from each other. The attracting force with which the magnet 7 attracts the mask 1 is extremely small, and there is no possibility that the mask 1 is bent downward by the magnet 7.

  FIG. 2 shows a state where the printing table cylinder 14 is extended from the state shown in FIG. 1 and the printing table 12 is raised. FIG. 2 shows a state during the substrate alignment operation shown in step S2 of FIG. Since the printing table cylinder 14 is extended as indicated by the arrow and the printing table 12 is raised, the gap between the upper surface of the substrate 2 and the lower surface of the mask 1 is reduced, and finally the upper surface of the substrate 2 and the lower surface of the mask 1 are Contact.

  Since a plurality of small projections 15 (see FIG. 6) smaller than the solder ball diameter are provided on the lower surface of the mask 1, the mask 1 and the substrate 2 are in a point contact state at the plurality of posts 15 portions. It becomes. As a result, the mask 1 and the substrate 2 are managed in a predetermined minute gap separated by the height of the post 15 except for the post 15 portion. Further, during the transition from step S1 to step S2, the print table cylinder 14 continues to extend. In this state, the upper surface of the magnet 7 maintains a distance of F from the upper surface of the substrate mounting table 6, that is, the distance between the mask 1 and the magnet 7 is maintained, and the attractive force acting on the mask 1 is extremely small. There is no possibility that the mask 1 bends downward on the magnet 7 side.

  Further, in order to proceed with the solder ball printing process, the mask suction cylinder 10 is extended so that the integrated body of the magnet 7 and the magnetic pin 8 of the mask suction portion 11 is fitted into the hole 4a formed in the substrate receiving plate 4. The state is shown in FIG. FIG. 3 is a diagram illustrating a state of the solder ball printer 20 during the mask suction process in step S3 of FIG.

  When the mask suction portion cylinder 10 extends as indicated by an arrow, the mask suction portion 11 rises. At that time, the magnet 7 portion at the tip of the integrated body of the plurality of magnets 7 and the magnetic pins 8 formed in a columnar shape shortens the distance from the mask 1 first, and finally the mask 1 passes through the post 15. Adheres closely to the substrate 2. Here, the gap between the mask 1 and the substrate 2 that are in close contact with each other via the post 15 is only the height of the post 15, so that the flux previously applied to the upper surface of the substrate 2 does not adhere to the lower surface of the mask 1. I have to. Therefore, when the mask 1 is attracted by the magnetic force of the magnet 7, the post 15 of the mask 1 and the substrate 2 are already in contact with each other, so that the mask 1 is not bent. When the mask attracting cylinder 10 is fully extended and the magnet 7 is raised to the rising end, the state is maintained and the mask 1 and the substrate 2 are securely adhered.

  As described above, in this embodiment, after the operation of bringing the substrate 2 close to the mask 1 using the printing table cylinder 14 and the mask attracting part 11 having the magnet 7 ascends and approaches the substrate 2, the magnet 7 Thus, the operation of sucking the mask 1 onto the substrate 2 is performed separately. Therefore, the mask 1 and the substrate 2 can be brought into contact with each other without being bent and can be fixed by suction. In addition, the flatness of the substrate 2 can be maintained in the processing state of the solder ball printer 20.

  Since the substrate 2 is positioned and fixed in a state where solder ball printing is possible, the process proceeds to solder ball printing shown in step S4 in FIG. FIG. 4 is a front view of the solder ball printer 20 showing the solder ball printing state. In FIG. 4, solder balls 18 are filled on the pads (electrode portions) 19 of the substrate 2 through a plurality of apertures 1 a formed in advance in the mask 1 in accordance with a pattern.

  A head driving mechanism (not shown) is driven to lower the squeegee (transfer head) 3 to a predetermined position above the mask 1 and bring the squeegee 3 into contact with the upper surface of the mask 1 with a predetermined pressing force. The width of the squeegee 3 is approximately equal to the width direction of the substrate 2 or larger than the width of the substrate 2. For this reason, usually, if the squeegee 3 is moved once or once in the horizontal direction (direction parallel to the upper surface of the substrate 2), the solder ball 18 is filled in the opening 1a of the mask 1. However, in order to reliably fill the opening 1a of the mask 1 with the solder ball 18, it is preferable to move the squeegee 3 twice or more to fill the opening 1a of the mask 1. When the squeegee 3 is moved in the horizontal direction, a rotation drive mechanism (not shown) provided on the squeegee 3 is driven to rotate the squeegee 3. The squeegee 3 rotates at a relatively low speed of 5 rotations per second or less.

  The details of the processing after the filling processing of the solder ball 18 in this solder ball printing will be described with reference to the detailed view of the mask 1 portion shown in FIG. FIG. 6A is a diagram in the middle of moving the squeegee 3 only once in the horizontal direction (right to left in the figure) while rotating to the right. The solder ball 18 passes through the opening 1a of the mask 1 and is filled on the pad (electrode part) 19 to which the flux of the substrate 2 is applied.

  FIG. 6B is a diagram showing a state after the filling operation of the solder balls 18 by the squeegee 3 is completed. FIG. 6 is a diagram showing a state in which a mask suction release process shown in step S5 of FIG. 5 and a plate separation process in which the substrate 2 is separated from the mask 1 shown in step S6 are being executed.

  In order to execute the process of step S5, the mask suction portion cylinder 10 (not shown in FIG. 6B) is contracted, and the mask suction portion 11 is moved downward as indicated by a small arrow in the figure. As the mask attracting part 11 moves downward, the magnet 7 disposed at the tip of the integrated body of the magnet 7 of the mask attracting part 11 and the magnetic pin 8 increases the distance from the mask 1. If the distance between the magnet 7 and the mask 1 continues to increase, the attracting force of the magnet 7 is gradually released, but the mask 1 remains in close contact with the substrate 2 via the post 15, so that the mask 1 is not bent. Does not occur.

  Next, in order to execute the processing of step S6 in FIG. 5, the print table cylinder 14 not shown in FIG. 6B is contracted, and the print table 12 is moved downward as indicated by the large arrow in the figure. Move. Along with this, the distance between the upper surface of the substrate 2 and the lower surface of the mask 1 becomes sufficiently large, and the substrate 2 is separated from the mask 1.

  As described above, according to the present embodiment, during the series of operations for solder ball printing in steps S1 to S6, the operation of moving the mask suction unit 11 downward and the substrate mounting table 6 are moved downward. Can be performed independently. In that case, the mask 1 can be separated from the upper surface of the substrate mounting table 6 while the magnet 7 is kept away from the mask 1. In this state, the mask 1 and the substrate 2 are separated from each other, the attractive force of the magnet 7 does not reach the mask 1, and there is no possibility that the mask 1 bends even if the substrate mounting table 6 is lowered.

  For reference, FIG. 7 shows a conventional process in which the magnet 7 is embedded in the substrate receiving plate 4 and integrated, and the substrate 2 is separated from the mask 1. It is a figure corresponding to FIG. FIG. 7A shows a state in which the solder balls 18 are filled on the pads (electrode portions) 19 coated with the flux of the substrate 2 while passing through the openings 1a of the mask 1 by the printing process.

  Here, even if the substrate 2 is separated from the mask 1, since the distance between the magnet 7 and the post 15 formed on the back surface of the mask 1 is constant, the attractive force of the magnet 7 acts on the mask 1 and the substrate 2 is In the process of gradually moving away from the mask 1, the mask 1 begins to bend. Since the opening 1a of the mask 1 is only slightly larger than the outer diameter of the solder ball 18 in order to improve the positional accuracy, the opening 1a of the mask 1 often comes into contact with the solder ball 18.

  When the substrate 2 further moves away from the mask 1, the tension of the mask 1 is greater than the attractive force of the magnet 7, and the bending is released as shown in FIG. At this time, the solder ball 18 on the substrate 2 that has been in contact with the mask 1 through the opening 1a or the like is moved, and the solder ball 18 is moved from the pad 19 on the substrate 2 to cause misalignment. Alternatively, the solder balls 18 are accompanied by the mask 1 and the solder balls 18 disappear from the substrate 2 (states C and D in the figure). These cause the quality of the substrate 2 to deteriorate. Further, when the bending of the mask 1 is released, vibration is generated in the mask 1. This vibration causes the remaining solder balls 18 on the mask 1 to move from a predetermined holding position of the solder balls 18 and disperse, and have an adverse effect such as being unable to be used effectively during the next printing operation.

  On the other hand, in the solder ball printing machine described in this embodiment, the mask 1 and the substrate 2 are moved closer to each other, the mask suction part 11 is lifted and moved closer to the mask 1, and the suction force of the magnet 7 is applied to the mask 1. Separates acting. Therefore, in the state where the attractive force of the magnet 7 is not applied to the mask 1, the approach operation of the mask 1 and the substrate 2 and the operation of separating the mask 1 and the substrate 2 (plate separation) can be executed.

  Next, several examples of the mask suction unit 11 provided in the solder ball printer 20 shown in FIG. 1 will be described with reference to FIGS. FIG. 8 is a perspective view of an embodiment of the mask suction unit 11 and is a detailed view of a part A in FIG. In the mask attracting portion 11, a large number of magnets 7 and magnetic pins 8 are arranged on the magnetic plate 9 so that the magnet 7 can apply a large and uniform attractive force over a wide area on the back side of the substrate 2. A mask suction portion 11 is formed.

  Specifically, the cylindrical magnet 7 is simply placed on and integrated with the magnetic body pin 8 whose outer diameter is substantially the same as the magnet 7 and whose axial length is longer than the magnet 7. A plurality of cylindrical integrated objects are simply placed on the rectangular magnetic plate 9. For this reason, in this embodiment, a large number of columnar integrated objects composed of the magnets 7 and the magnetic pins 8 standing upright on the magnetic plate 9 can be fixed and used without using fastening members such as screws. This is because the magnetic pin 8 and the magnetic plate 9 are both magnetic bodies, so that the magnetic force is transmitted only by bringing the magnet 7, the magnetic pin 8 and the magnetic plate 9 into contact with each other, and the magnetic pin 8 and the magnetic plate 9 are fixed to each other. It is because it uses.

  In the case where the mask suction part 11 is moved up and down using the mask suction part cylinder 10 and the limit (lowering state) in which the mask suction part cylinder 10 is contracted, the lower end of the mask suction part fixed to the substrate mounting table 6 The bottom surface of the mask suction portion 11 comes into contact with the stopper 16, and the mask suction cylinder 10 stops contracting.

  According to the present embodiment, even when the mask attracting portion 11 is in the lowered state, the upper end surface of the magnet 7 is located above the lower surface of the substrate receiving plate 4, so that the magnetic body pins 8 and the magnets 7 are connected to the substrate receiving plate 4. Never fall out of it. In addition, the magnet 7, the magnetic pin 8, and the magnetic plate 9 are merely attracted to each other by the magnetic force generated by the magnet 7, and no screws are required, so that a large number of screws can be removed and attached during maintenance. Further, the thickness of the substrate receiving plate 4 indicated by the dimension “E” in FIG. 1 can be increased to 20 mm or more. As a result, conventionally, since the plate thickness is small, the rigidity at the time of manufacture is small and the processing is difficult. However, a substrate receiving plate having a plane accuracy within 30 μm suitable for a fine solder ball can be easily manufactured.

  Next, another embodiment of the mask suction portion 11a used in the solder ball printer 20 shown in FIG. 1 is shown in a perspective view in FIG. The mask suction part 11a shown in FIG. 9 is different from the mask suction part 11 described in the above embodiment in that a prismatic magnet extending in the horizontal direction is used instead of the cylindrical pin 8 and the cylindrical magnet 7. 7a and a bar 8a extending in the horizontal direction on which the magnet 7a is placed. Therefore, the hole 4a formed on the back side of the substrate mounting plate 4 of the substrate mounting table 6 has a plurality of parallel groove shapes.

  The number of magnetic pins is further reduced and the magnetic force is made uniform. The longitudinal direction of the prismatic magnetic bar 8a is aligned with the width direction of the substrate 2, and the magnetic bar 8a is equal to the length of the substrate 2 in the length direction of the substrate 2 (direction perpendicular to the width direction). A plurality are arranged so as to cover the range beyond that. Both ends in the longitudinal direction of the magnetic bar 8a are supported by magnetic columns 8b fixed to the support plate 9 with screws or the like. At the contracted end (lowered state) of the mask suction portion cylinder 10, the bottom surface of the mask suction portion 11a is brought into contact with the mask suction portion lower end stopper 16 and stopped, as in the above embodiment.

  In the present embodiment, the magnet 7a only needs to apply an attractive force only to the magnetic bar 8a except for the mask 1, and it is not necessary to apply the attractive force to the support plate 9a. Moreover, since the magnet 7a extends long, it is possible to reduce the variation in the magnetic force between the magnets 7a and 7a.

  As described above, according to each embodiment of the present invention, since the operation of moving the substrate relative to the mask and the operation of attracting the magnet between the mask and the substrate can be performed separately, there is no suction force to the mask 1. In this state, an approach operation of the mask 1 and the substrate 2 and an operation of separating the mask 1 and the substrate 2 (plate separation) can be executed. As a result, it is possible to mount the solder ball 18 and release the plate without deforming the mask 1 and maintaining the flatness of the substrate 2 in the printing of the solder ball printing machine and the processes before and after the printing. It can be stably mounted on the substrate 2.

DESCRIPTION OF SYMBOLS 1 ... Mask 1a ... Opening 2 ... Substrate 3 ... Squeegee 4 ... Substrate receiving plate 4a ... Hole 5 ... Substrate receiving plate support member 6 ... Substrate mounting table 7, 7a ... (Permanent) Magnet 8 ... Magnetic body pin (Magnetic body) Element)
8a ... Magnetic bar (magnetic member)
8b: support column 9 ... magnetic material plate 9a ... support plate 10 ... cylinder for mask suction part (second vertical drive means)
DESCRIPTION OF SYMBOLS 11 ... Mask adsorption | suction part 12 ... Print table 13 ... XY (theta) stage 14 ... Cylinder for print tables (1st vertical motion drive means)
15 ... Post 16 ... Mask suction part lower end stopper 17 ... Vacuum suction channel 18 ... Solder ball 19 ... Pad (electrode part)
20 ... Solder ball printing machine

Claims (6)

In a solder ball printer in which solder balls are fitted into a plurality of openings formed in a mask and the solder balls are mounted on a plurality of electrode portions formed on the surface of the substrate facing the mask,
A substrate receiving plate on which a substrate is mounted so as to face the mask, and a plurality of bottomed holes are formed on the back side;
A mask adsorbing portion having a plurality of members including columnar permanent magnets that can be fitted into each of the plurality of bottomed hole portions formed on the back side of the substrate receiving plate;
At least the upper end portion of the member including the columnar permanent magnet of the mask attracting portion is located between the bottom surface of the plurality of bottomed hole portions corresponding to the substrate receiving plate and the opening of the bottomed hole portion. Drive means for moving closer to the bottom surface of the hole and moving away from the bottom surface of the bottomed hole,
A solder ball printer, comprising: a mask suction device having: The solder ball printing machine according to claim 1,
2. The solder ball printing machine according to claim 1, wherein the mask attracting portion has a magnetic pin extending in a columnar axial direction below the columnar permanent magnet. The solder ball printer according to claim 2,
Solder ball printing, characterized in that to obtain Bei said substrate receiving mask suction unit bottom stop to prevent the escape is member including the columnar permanent magnet from a plurality of bottomed holes formed on the back side of the plate Machine . The solder ball printer according to claim 3.
A substrate mounting table having the substrate receiving plate and a plurality of substrate receiving plate support members for vertically supporting the substrate receiving plate ;
An XYθ stage capable of driving a table on which the substrate mounting table is mounted in a horizontal plane;
A solder ball printer, wherein the substrate and the mask are aligned by the XYθ stage . In the solder ball printing machine according to claim 3 or 4 ,
Wherein a columnar permanent magnet and the columnar magnetic pin, solder ball printing machine, characterized that you have been integrated by adsorption. The solder ball printer according to claim 5,
The columnar permanent magnet and the magnetic pin are cylindrical ,
The solder ball printing machine, wherein the plurality of bottomed hole portions formed on the back side of the substrate receiving plate have a shape in which a cylinder is hollowed out .

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