JP2016530913A - 保護被膜を有する指紋感知システム - Google Patents
保護被膜を有する指紋感知システム Download PDFInfo
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- JP2016530913A JP2016530913A JP2016525326A JP2016525326A JP2016530913A JP 2016530913 A JP2016530913 A JP 2016530913A JP 2016525326 A JP2016525326 A JP 2016525326A JP 2016525326 A JP2016525326 A JP 2016525326A JP 2016530913 A JP2016530913 A JP 2016530913A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/08—Methods or arrangements for sensing record carriers, e.g. for reading patterns by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3178—Coating or filling in grooves made in the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
さらに、本発明の種々の実施形態は、スマートフォン、タブレットコンピュータ等のようなタッチスクリーンアプリケーションにも使われうる。
Claims (15)
- 指紋感知装置において、
感知素子のアレイであって、前記感知素子のそれぞれが、前記感知素子と前記指紋感知装置の表面に置かれた指との電磁結合を示す信号を提供するよう構成される、感知素子のアレイと、
前記感知素子のアレイを覆うよう配置される第一誘電層であって、前記第一誘電層は、前記第一誘電層の上面に複数の凹部を備え、前記凹部は、前記凹部の近接するもの同士の間の空間が400μmより少なく前記感知素子のアレイにわたって分布する、第一誘電層と、
前記第一誘電層の前記上面に配置される上部疎水性層であって、前記上部疎水性層が前記指紋感知装置の使用を通して消耗した時、疎水性材料が、前記疎水性材料を摩耗から保護する前記凹部に留まるよう、前記凹部の中および前記凹部の間に、前記指が置かれる前記感知装置の前記表面を提供する上部疎水性層と、を備える指紋感知装置。 - 前記第一誘電層は、前記上部疎水性層よりも摩耗に耐性のある、請求項1に記載の指紋感知装置。
- 前記上部疎水性層の厚さは、前記凹部のそれぞれの最大深さよりも小さい、請求項1または2に記載の指紋感知装置。
- 前記凹部のそれぞれの深さは、少なくとも5μmである、請求項1から3のいずれか一項に記載の指紋感知装置。
- 前記凹部のそれぞれは、前記第一誘電層を貫通することなく、前記第一誘電層を通って部分的に延在する、請求項1から4のいずれか一項に記載の指紋感知装置。
- 前記第一誘電層の厚さは、少なくとも50μmである、請求項1から5のいずれか一項に記載の指紋感知装置。
- 前記凹部のそれぞれは、前記指が置かれる前記指紋感知装置の前記表面に平行な平面に略円形の断面を有する、請求項1から6のいずれか一項に記載の指紋感知装置。
- 前記凹部は、複数の長溝の形状で提供され、各長溝は、少なくとも前記感知素子の一つの辺に対応する距離に延在する、請求項1から6のいずれか一項に記載の感知装置。
- 前記凹部は、前記感知素子の近接するものの間の境界線と整合して配置される、請求項1から8のいずれか一項に記載の感知装置。
- 前記凹部は、前記指紋感知装置にわたって延在する連続溝の格子として提供され、前記溝は、前記感知素子間の境界線と整合されている、請求項9に記載の感知システム。
- 前記凹部のそれぞれの最小幅は少なくとも10μmである、請求項1から10のいずれか一項に記載の感知装置。
- 前記上部疎水性層は、疎油性表面特性を付加的に有する、請求項1から11のいずれか一項に記載の感知装置。
- 前記第二誘電層の厚さは、100nmより少ない、請求項1から12のいずれか一項に記載の感知装置。
- 指紋感知装置を製造するための方法であって、
基板の上面に複数の感知素子を備える前記基板を提供する工程と、
前記基板の前記上面に前記感知素子を覆うための第一誘電層を提供する工程と、
前記第一誘電層に複数の凹部を形成する工程であって、前記凹部は、前記感知素子のアレイにわたって、前記凹部の近接したものの間の空間が400μmより少なくなるよう分布する工程と、
前記第一層上の上部疎水性層を、前記凹部の中および前記凹部同士の間に提供する工程と、を備える方法。 - 前記凹部は、前記第一誘電層から材料を除去することによって形成される、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP13176103.3 | 2013-07-11 | ||
EP13176103 | 2013-07-11 | ||
PCT/SE2014/050830 WO2015005851A1 (en) | 2013-07-11 | 2014-07-01 | Fingerprint sensing device with protective coating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016530913A true JP2016530913A (ja) | 2016-10-06 |
JP6403767B2 JP6403767B2 (ja) | 2018-10-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016525326A Active JP6403767B2 (ja) | 2013-07-11 | 2014-07-01 | 保護被膜を有する指紋感知システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US9449214B2 (ja) |
EP (1) | EP3019998B1 (ja) |
JP (1) | JP6403767B2 (ja) |
KR (1) | KR101698144B1 (ja) |
CN (1) | CN105359164B (ja) |
WO (1) | WO2015005851A1 (ja) |
Families Citing this family (13)
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US8485442B2 (en) | 2009-07-02 | 2013-07-16 | Biometric Payment Solutions | Electronic transaction verification system with biometric authentication |
SE1551288A1 (en) * | 2015-06-08 | 2016-12-09 | Fingerprint Cards Ab | Fingerprint sensing device with interposer structure |
US9842243B2 (en) * | 2015-06-08 | 2017-12-12 | Fingerprint Cards Ab | Fingerprint sensing device with heterogeneous coating structure comprising a mold |
US10282583B2 (en) * | 2015-12-22 | 2019-05-07 | Gemalto Sa | Fingerprint imaging systems comprising self-wetting adhesive, films and methods |
US10387707B2 (en) | 2016-06-24 | 2019-08-20 | Idex Asa | Reinforcement panel for fingerprint sensor cover |
CN106250849B (zh) * | 2016-08-01 | 2019-06-04 | 京东方科技集团股份有限公司 | 指纹识别装置及其制作方法、显示设备 |
JP7084702B2 (ja) | 2016-09-02 | 2022-06-15 | アイデックス バイオメトリクス エーエスエー | 指紋センサに適したカバー部材を製造する方法 |
EP3370187A4 (en) * | 2017-01-19 | 2018-10-31 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition device |
EP3432195A4 (en) * | 2017-02-10 | 2019-06-12 | Shenzhen Goodix Technology Co., Ltd. | BIOSENSOR |
SE1750770A1 (en) * | 2017-06-16 | 2018-12-17 | Fingerprint Cards Ab | Fingerprint sensor module and method for manufacturing a fingerprint sensor module |
US11295189B2 (en) | 2018-06-07 | 2022-04-05 | Fingerprint Cards Anacatum Ip Ab | Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard |
US11157717B2 (en) * | 2018-07-10 | 2021-10-26 | Next Biometrics Group Asa | Thermally conductive and protective coating for electronic device |
KR102582647B1 (ko) * | 2018-10-10 | 2023-09-25 | 삼성디스플레이 주식회사 | 커버 윈도우 부재 및 이를 갖는 표시 장치 |
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-
2014
- 2014-07-01 US US14/894,162 patent/US9449214B2/en active Active
- 2014-07-01 JP JP2016525326A patent/JP6403767B2/ja active Active
- 2014-07-01 WO PCT/SE2014/050830 patent/WO2015005851A1/en active Application Filing
- 2014-07-01 EP EP14822466.0A patent/EP3019998B1/en active Active
- 2014-07-01 KR KR1020157033798A patent/KR101698144B1/ko active IP Right Grant
- 2014-07-01 CN CN201480036705.7A patent/CN105359164B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6310371B1 (en) * | 1999-10-08 | 2001-10-30 | United Microelectronics Corp. | Fingerprint sensor chip |
JP2002071307A (ja) * | 2000-09-01 | 2002-03-08 | Sony Corp | 半導体装置およびその製造方法 |
JP2003232604A (ja) * | 2002-02-08 | 2003-08-22 | Nippon Telegr & Teleph Corp <Ntt> | 表面形状認識用センサおよびその製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
CN105359164A (zh) | 2016-02-24 |
US20160125220A1 (en) | 2016-05-05 |
US9449214B2 (en) | 2016-09-20 |
WO2015005851A1 (en) | 2015-01-15 |
EP3019998A4 (en) | 2017-04-05 |
EP3019998B1 (en) | 2020-08-12 |
EP3019998A1 (en) | 2016-05-18 |
KR20160029738A (ko) | 2016-03-15 |
CN105359164B (zh) | 2017-04-05 |
JP6403767B2 (ja) | 2018-10-10 |
KR101698144B1 (ko) | 2017-01-19 |
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