JP2016525798A - 自冷式光源 - Google Patents

自冷式光源 Download PDF

Info

Publication number
JP2016525798A
JP2016525798A JP2016525492A JP2016525492A JP2016525798A JP 2016525798 A JP2016525798 A JP 2016525798A JP 2016525492 A JP2016525492 A JP 2016525492A JP 2016525492 A JP2016525492 A JP 2016525492A JP 2016525798 A JP2016525798 A JP 2016525798A
Authority
JP
Japan
Prior art keywords
light
led
thermally conductive
light source
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016525492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016525798A5 (enExample
Inventor
ライブセイ，ウィリアム
ジマーマン，スコット
エル． ロス，リチャード
エル． ロス，リチャード
デアンダ，エドゥアルド
Original Assignee
ゴールデンアイ，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/042,569 external-priority patent/US8704262B2/en
Application filed by ゴールデンアイ，インコーポレイテッド filed Critical ゴールデンアイ，インコーポレイテッド
Publication of JP2016525798A publication Critical patent/JP2016525798A/ja
Publication of JP2016525798A5 publication Critical patent/JP2016525798A5/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016525492A 2013-07-10 2014-07-10 自冷式光源 Pending JP2016525798A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361957768P 2013-07-10 2013-07-10
US61/957,768 2013-07-10
US14/042,569 2013-09-30
US14/042,569 US8704262B2 (en) 2011-08-11 2013-09-30 Solid state light sources with common luminescent and heat dissipating surfaces
PCT/US2014/046205 WO2015006593A1 (en) 2013-07-10 2014-07-10 Self cooling light source

Publications (2)

Publication Number Publication Date
JP2016525798A true JP2016525798A (ja) 2016-08-25
JP2016525798A5 JP2016525798A5 (enExample) 2017-08-17

Family

ID=52280611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016525492A Pending JP2016525798A (ja) 2013-07-10 2014-07-10 自冷式光源

Country Status (5)

Country Link
EP (1) EP3019790B1 (enExample)
JP (1) JP2016525798A (enExample)
KR (1) KR20160030225A (enExample)
CN (1) CN105579763B (enExample)
WO (1) WO2015006593A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018172628A (ja) * 2017-02-28 2018-11-08 日亜化学工業株式会社 波長変換部材の製造方法
WO2020137760A1 (ja) * 2018-12-27 2020-07-02 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP2022145708A (ja) * 2016-09-01 2022-10-04 スリーディ ライブ インコーポレイテッド 立体表示装置を製造する方法
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI606158B (zh) * 2015-12-10 2017-11-21 Far Eastern New Century Corp Active light-emitting fabric
CN105909989B (zh) * 2016-06-17 2022-02-01 上海策元实业有限公司 一种截光式led平板灯
CN108954039B (zh) * 2017-05-19 2020-07-03 深圳光峰科技股份有限公司 波长转换装置及其制备方法
DE102017209375B4 (de) * 2017-06-02 2022-08-04 BSH Hausgeräte GmbH Wäschepflegegerät mit einer Beleuchtungseinrichtung
CN107168590B (zh) * 2017-06-30 2023-07-07 成都成电光信科技股份有限公司 一种触摸屏用表贴式复合式红外管
US11773016B2 (en) 2018-12-14 2023-10-03 Corning Incorporated Diffuse reflector and methods of use
CN110185978A (zh) * 2019-04-30 2019-08-30 天津中创天地科技发展有限公司 一种博物馆专用环境投光灯
DE102019213150A1 (de) * 2019-08-30 2021-03-04 Würth Elektronik eiSos Gmbh & Co. KG Strahler und Verfahren zum Abstrahlen von Licht
CN111740309B (zh) * 2020-07-23 2024-12-06 江苏科慧半导体研究院有限公司 防激光泄露的发光器件
CN111880259B (zh) * 2020-09-07 2022-10-18 上海科世达-华阳汽车电器有限公司 一种新型显示装置和汽车部件
CN112909578B (zh) * 2021-01-20 2022-03-04 西安电子科技大学 低剖面宽带全金属传输阵天线
US12344552B2 (en) 2021-10-08 2025-07-01 Corning Incorporated Spacer and methods for optimizing optical fiber curing process
CN117387013B (zh) * 2023-12-13 2024-02-09 深圳迪亚士照明科技有限公司 一种带有锁定机构的led软灯带

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004005216A1 (ja) * 2002-07-09 2004-01-15 Kenichiro Miyahara 薄膜形成用基板、薄膜基板、光導波路、発光素子、及び発光素子搭載用基板
JP2007142173A (ja) * 2005-11-18 2007-06-07 Koha Co Ltd 照明装置
US20130099264A1 (en) * 2011-08-11 2013-04-25 Scott M. Zimmerman Solid state light sources based on thermally conductive luminescent elements containing interconnects

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2490404Y (zh) * 2001-04-20 2002-05-08 林美汝 改进的水管灯
US7040774B2 (en) * 2003-05-23 2006-05-09 Goldeneye, Inc. Illumination systems utilizing multiple wavelength light recycling
KR101240999B1 (ko) * 2005-04-27 2013-03-08 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 발광 반도체 장치용 냉각 장치 및 그러한 냉각 장치의 제조방법
US20070018182A1 (en) * 2005-07-20 2007-01-25 Goldeneye, Inc. Light emitting diodes with improved light extraction and reflectivity
CN101449100B (zh) * 2006-05-05 2012-06-27 科锐公司 照明装置
CN101408302A (zh) * 2007-10-11 2009-04-15 富士迈半导体精密工业（上海）有限公司 具良好散热性能的光源模组
US20090140271A1 (en) * 2007-11-30 2009-06-04 Wen-Jyh Sah Light emitting unit
CN101603636B (zh) * 2008-06-10 2012-05-23 展晶科技(深圳)有限公司 光源装置
RU2538100C2 (ru) * 2009-05-28 2015-01-10 Конинклейке Филипс Электроникс Н.В. Осветительное устройство с корпусом, заключающим в себе источник света
KR20110002555U (ko) * 2009-09-07 2011-03-15 주식회사 엘 앤 에프 적외선 방사제가 코팅된 엘이디 모듈용 방열판 및 이를 갖는 엘이디 조명장치
WO2011037876A1 (en) * 2009-09-25 2011-03-31 Cree, Inc. Lighting device having heat dissipation element
CN103443537B (zh) * 2011-01-11 2018-09-21 飞利浦照明控股有限公司 照明设备
TWI436002B (zh) * 2011-07-06 2014-05-01 光遠科技股份有限公司 發光燈泡
CN103148446A (zh) * 2013-02-28 2013-06-12 冠捷显示科技（厦门）有限公司 大角度扩散的散热光学透镜

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004005216A1 (ja) * 2002-07-09 2004-01-15 Kenichiro Miyahara 薄膜形成用基板、薄膜基板、光導波路、発光素子、及び発光素子搭載用基板
JP2007142173A (ja) * 2005-11-18 2007-06-07 Koha Co Ltd 照明装置
US20130099264A1 (en) * 2011-08-11 2013-04-25 Scott M. Zimmerman Solid state light sources based on thermally conductive luminescent elements containing interconnects

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022145708A (ja) * 2016-09-01 2022-10-04 スリーディ ライブ インコーポレイテッド 立体表示装置を製造する方法
JP7432666B2 (ja) 2016-09-01 2024-02-16 リミナル スペース インコーポレイテッド 立体表示装置を製造する方法
JP2018172628A (ja) * 2017-02-28 2018-11-08 日亜化学工業株式会社 波長変換部材の製造方法
WO2020137760A1 (ja) * 2018-12-27 2020-07-02 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JPWO2020137760A1 (ja) * 2018-12-27 2021-11-11 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP7491849B2 (ja) 2018-12-27 2024-05-28 デンカ株式会社 蛍光体基板、発光基板及び照明装置
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12107196B2 (en) 2018-12-27 2024-10-01 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

Also Published As

Publication number Publication date
KR20160030225A (ko) 2016-03-16
CN105579763A (zh) 2016-05-11
WO2015006593A1 (en) 2015-01-15
EP3019790A1 (en) 2016-05-18
EP3019790A4 (en) 2017-03-01
CN105579763B (zh) 2018-06-01
EP3019790B1 (en) 2020-02-12

Similar Documents

Publication Publication Date Title
US9057499B2 (en) Solid state light sources with common luminescent and heat dissipating surfaces
CN105579763B (zh) 自冷却光源
US10121950B2 (en) Lightweight solid state light source with common light emitting and heat dissipating surface
US10125931B2 (en) Barrier with integrated self cooling solid state light sources
US9214616B2 (en) Solid state light sources based on thermally conductive luminescent elements containing interconnects
US8159131B2 (en) Light emitting device having a transparent thermally conductive layer
CN103003625B (zh) 固态灯
US8076833B2 (en) Methods and apparatuses for enhancing heat dissipation from a light emitting device
CN101449100B (zh) 照明装置
US20140268631A1 (en) Remote lumiphor solid state lighting devices with enhanced light extraction
CN109791968A (zh) 发光二极管、组件和相关方法
JP5608684B2 (ja) Ｌｅｄに基づくランプ及びそのランプのための熱管理システム
US20120261703A1 (en) Self-cooling solid-state emitters
US20140362563A1 (en) Fixtures for large area directional and isotropic solid state lighting panels
CN110622325B (zh) 可调谐的集成光学led组件及方法
US20140268698A1 (en) Self cooling, magnetically connected fixtures for large area directional and isotropic solid state lighting panels
JP4417757B2 (ja) 発光装置およびその製造方法ならびに照明装置
WO2015066730A1 (en) Lightweight solid state light source with common light emitting and heat dissipating surface
WO2015066703A2 (en) Barrier with integrated self-cooling solid state light sources
RU2550740C1 (ru) Светодиодная лампа с широкой диаграммой излучения (варианты)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170710

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170710

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20170712

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180531

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180612

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180906

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181029

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190122

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190410

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20191001