JP2016525798A - 自冷式光源 - Google Patents

自冷式光源 Download PDF

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Publication number
JP2016525798A
JP2016525798A JP2016525492A JP2016525492A JP2016525798A JP 2016525798 A JP2016525798 A JP 2016525798A JP 2016525492 A JP2016525492 A JP 2016525492A JP 2016525492 A JP2016525492 A JP 2016525492A JP 2016525798 A JP2016525798 A JP 2016525798A
Authority
JP
Japan
Prior art keywords
light
led
thermally conductive
light source
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016525492A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016525798A5 (enExample
Inventor
ライブセイ，ウィリアム
ジマーマン，スコット
エル． ロス，リチャード
エル． ロス，リチャード
デアンダ，エドゥアルド
Original Assignee
ゴールデンアイ，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/042,569 external-priority patent/US8704262B2/en
Application filed by ゴールデンアイ，インコーポレイテッド filed Critical ゴールデンアイ，インコーポレイテッド
Publication of JP2016525798A publication Critical patent/JP2016525798A/ja
Publication of JP2016525798A5 publication Critical patent/JP2016525798A5/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016525492A 2013-07-10 2014-07-10 自冷式光源 Pending JP2016525798A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361957768P 2013-07-10 2013-07-10
US61/957,768 2013-07-10
US14/042,569 2013-09-30
US14/042,569 US8704262B2 (en) 2011-08-11 2013-09-30 Solid state light sources with common luminescent and heat dissipating surfaces
PCT/US2014/046205 WO2015006593A1 (en) 2013-07-10 2014-07-10 Self cooling light source

Publications (2)

Publication Number Publication Date
JP2016525798A true JP2016525798A (ja) 2016-08-25
JP2016525798A5 JP2016525798A5 (enExample) 2017-08-17

Family

ID=52280611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016525492A Pending JP2016525798A (ja) 2013-07-10 2014-07-10 自冷式光源

Country Status (5)

Country Link
EP (1) EP3019790B1 (enExample)
JP (1) JP2016525798A (enExample)
KR (1) KR20160030225A (enExample)
CN (1) CN105579763B (enExample)
WO (1) WO2015006593A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018172628A (ja) * 2017-02-28 2018-11-08 日亜化学工業株式会社 波長変換部材の製造方法
WO2020137760A1 (ja) * 2018-12-27 2020-07-02 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP2022145708A (ja) * 2016-09-01 2022-10-04 スリーディ ライブ インコーポレイテッド 立体表示装置を製造する方法
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

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TWI606158B (zh) * 2015-12-10 2017-11-21 Far Eastern New Century Corp Active light-emitting fabric
CN105909989B (zh) * 2016-06-17 2022-02-01 上海策元实业有限公司 一种截光式led平板灯
CN108954039B (zh) * 2017-05-19 2020-07-03 深圳光峰科技股份有限公司 波长转换装置及其制备方法
DE102017209375B4 (de) * 2017-06-02 2022-08-04 BSH Hausgeräte GmbH Wäschepflegegerät mit einer Beleuchtungseinrichtung
CN107168590B (zh) * 2017-06-30 2023-07-07 成都成电光信科技股份有限公司 一种触摸屏用表贴式复合式红外管
US11773016B2 (en) 2018-12-14 2023-10-03 Corning Incorporated Diffuse reflector and methods of use
CN110185978A (zh) * 2019-04-30 2019-08-30 天津中创天地科技发展有限公司 一种博物馆专用环境投光灯
DE102019213150A1 (de) * 2019-08-30 2021-03-04 Würth Elektronik eiSos Gmbh & Co. KG Strahler und Verfahren zum Abstrahlen von Licht
CN111740309B (zh) * 2020-07-23 2024-12-06 江苏科慧半导体研究院有限公司 防激光泄露的发光器件
CN111880259B (zh) * 2020-09-07 2022-10-18 上海科世达-华阳汽车电器有限公司 一种新型显示装置和汽车部件
CN112909578B (zh) * 2021-01-20 2022-03-04 西安电子科技大学 低剖面宽带全金属传输阵天线
US12344552B2 (en) 2021-10-08 2025-07-01 Corning Incorporated Spacer and methods for optimizing optical fiber curing process
CN117387013B (zh) * 2023-12-13 2024-02-09 深圳迪亚士照明科技有限公司 一种带有锁定机构的led软灯带

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JP2007142173A (ja) * 2005-11-18 2007-06-07 Koha Co Ltd 照明装置
US20130099264A1 (en) * 2011-08-11 2013-04-25 Scott M. Zimmerman Solid state light sources based on thermally conductive luminescent elements containing interconnects

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KR20110002555U (ko) * 2009-09-07 2011-03-15 주식회사 엘 앤 에프 적외선 방사제가 코팅된 엘이디 모듈용 방열판 및 이를 갖는 엘이디 조명장치
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WO2004005216A1 (ja) * 2002-07-09 2004-01-15 Kenichiro Miyahara 薄膜形成用基板、薄膜基板、光導波路、発光素子、及び発光素子搭載用基板
JP2007142173A (ja) * 2005-11-18 2007-06-07 Koha Co Ltd 照明装置
US20130099264A1 (en) * 2011-08-11 2013-04-25 Scott M. Zimmerman Solid state light sources based on thermally conductive luminescent elements containing interconnects

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022145708A (ja) * 2016-09-01 2022-10-04 スリーディ ライブ インコーポレイテッド 立体表示装置を製造する方法
JP7432666B2 (ja) 2016-09-01 2024-02-16 リミナル スペース インコーポレイテッド 立体表示装置を製造する方法
JP2018172628A (ja) * 2017-02-28 2018-11-08 日亜化学工業株式会社 波長変換部材の製造方法
WO2020137760A1 (ja) * 2018-12-27 2020-07-02 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JPWO2020137760A1 (ja) * 2018-12-27 2021-11-11 デンカ株式会社 蛍光体基板、発光基板及び照明装置
JP7491849B2 (ja) 2018-12-27 2024-05-28 デンカ株式会社 蛍光体基板、発光基板及び照明装置
US12027652B2 (en) 2018-12-27 2024-07-02 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12040436B2 (en) 2018-12-27 2024-07-16 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12068438B2 (en) 2018-12-27 2024-08-20 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12100788B2 (en) 2018-12-27 2024-09-24 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device
US12107196B2 (en) 2018-12-27 2024-10-01 Denka Company Limited Phosphor substrate, light emitting substrate, and lighting device

Also Published As

Publication number Publication date
CN105579763A (zh) 2016-05-11
CN105579763B (zh) 2018-06-01
WO2015006593A1 (en) 2015-01-15
EP3019790A1 (en) 2016-05-18
EP3019790A4 (en) 2017-03-01
KR20160030225A (ko) 2016-03-16
EP3019790B1 (en) 2020-02-12

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