JP2016502072A5 - - Google Patents

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Publication number
JP2016502072A5
JP2016502072A5 JP2015540185A JP2015540185A JP2016502072A5 JP 2016502072 A5 JP2016502072 A5 JP 2016502072A5 JP 2015540185 A JP2015540185 A JP 2015540185A JP 2015540185 A JP2015540185 A JP 2015540185A JP 2016502072 A5 JP2016502072 A5 JP 2016502072A5
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JP
Japan
Prior art keywords
sensor
attached
communication link
connecting element
wireless communication
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Application number
JP2015540185A
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English (en)
Japanese (ja)
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JP2016502072A (ja
JP6259461B2 (ja
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Priority claimed from US13/670,856 external-priority patent/US9703751B2/en
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Publication of JP2016502072A publication Critical patent/JP2016502072A/ja
Publication of JP2016502072A5 publication Critical patent/JP2016502072A5/ja
Application granted granted Critical
Publication of JP6259461B2 publication Critical patent/JP6259461B2/ja
Active legal-status Critical Current
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JP2015540185A 2012-11-07 2013-10-23 装置及びその装置へのアタッチメント用センサ Active JP6259461B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/670,856 US9703751B2 (en) 2012-11-07 2012-11-07 Apparatus and sensors for attachment to the apparatus
US13/670,856 2012-11-07
PCT/FI2013/051000 WO2014072572A1 (en) 2012-11-07 2013-10-23 An apparatus and sensors for attachment to the apparatus

Publications (3)

Publication Number Publication Date
JP2016502072A JP2016502072A (ja) 2016-01-21
JP2016502072A5 true JP2016502072A5 (enExample) 2016-10-27
JP6259461B2 JP6259461B2 (ja) 2018-01-10

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ID=50623151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015540185A Active JP6259461B2 (ja) 2012-11-07 2013-10-23 装置及びその装置へのアタッチメント用センサ

Country Status (6)

Country Link
US (1) US9703751B2 (enExample)
EP (1) EP2917900B1 (enExample)
JP (1) JP6259461B2 (enExample)
KR (1) KR101818828B1 (enExample)
CN (1) CN104769651B (enExample)
WO (1) WO2014072572A1 (enExample)

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KR102463572B1 (ko) * 2020-12-07 2022-11-07 주식회사 텍쎈 체온계를 이용한 체온 정보 제공 방법, iot 기반 신체 탈부착형 센서 단말의 제어 방법, 및 iot 기반 신체 탈부착형 센서 단말
KR102587757B1 (ko) * 2021-01-20 2023-10-12 주식회사 레인테크 부착장치 및 부착방법
US11606111B2 (en) 2021-05-26 2023-03-14 Getac Technology Corporation Adaptive power and communication routing for body-worn devices
JP7345117B2 (ja) * 2021-06-02 2023-09-15 パナソニックＩｐマネジメント株式会社 温度センサ及び温度測定装置
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