JP2016222836A5 - - Google Patents
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- Publication number
- JP2016222836A5 JP2016222836A5 JP2015111949A JP2015111949A JP2016222836A5 JP 2016222836 A5 JP2016222836 A5 JP 2016222836A5 JP 2015111949 A JP2015111949 A JP 2015111949A JP 2015111949 A JP2015111949 A JP 2015111949A JP 2016222836 A5 JP2016222836 A5 JP 2016222836A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- component
- resin composition
- casting
- thermistor sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 claims description 16
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- 238000005266 casting Methods 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- CKNWGKWITWNVEY-UHFFFAOYSA-N 2-(dodecoxymethyl)oxirane;2-(tetradecoxymethyl)oxirane;2-(tridecoxymethyl)oxirane Chemical compound CCCCCCCCCCCCOCC1CO1.CCCCCCCCCCCCCOCC1CO1.CCCCCCCCCCCCCCOCC1CO1 CKNWGKWITWNVEY-UHFFFAOYSA-N 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000004432 carbon atoms Chemical group C* 0.000 claims description 2
- 239000003085 diluting agent Substances 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000001681 protective Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
Description
すなわち本発明は、以下の内容からなるものである。
［１］（Ａ）ビスフェノールＡ型エポキシ樹脂、（Ｂ）アミン当量が２５０〜７００の範囲である硬化剤、(Ｃ）反応性希釈剤、（Ｄ）無機充填剤を含有するエポキシ樹脂組成物であって、前記（Ｃ）成分が、炭素数が１〜４であるアルキルグリシジルエーテルであり、前記（Ａ）成分と（Ｃ）成分中のエポキシ基と前記（Ｂ）成分中のアミノ基の当量比が０．４５〜０．５５の範囲であるサーミスタセンサ注型用エポキシ樹脂組成物。
That is, the present invention comprises the following contents.
[1] An epoxy resin composition containing (A) a bisphenol A type epoxy resin, (B) a curing agent having an amine equivalent in the range of 250 to 700, (C) a reactive diluent, and (D) an inorganic filler. The component (C) is an alkyl glycidyl ether having 1 to 4 carbon atoms, and the equivalents of the epoxy group in the component (A) and the component (C) and the amino group in the component (B) An epoxy resin composition for thermistor sensor casting having a ratio in the range of 0.45 to 0.55.
本発明のサーミスタセンサ注型用エポキシ樹脂組成物には、前記成分の他、流展剤、難燃剤、顔料、カップリング剤、消泡剤などの慣用の補助成分を適宜配合することができる。 In the epoxy resin composition for casting the thermistor sensor of the present invention, conventional auxiliary components such as a spreading agent, a flame retardant, a pigment, a coupling agent, and an antifoaming agent can be appropriately blended in addition to the above components.
本発明のサーミスタセンサ注型用エポキシ樹脂組成物の粘度は回転粘度計を用い、０．１〜３Ｐａ・ｓの範囲とすることが好ましい。粘度をこの範囲とすることによりエポキシ樹脂組成物を保護ケースに容易に注型することができる。なお、試験条件については後述する。 The viscosity of the thermistor sensor casting epoxy resin composition of the present invention is preferably in the range of 0.1 to 3 Pa · s using a rotational viscometer. By setting the viscosity within this range, the epoxy resin composition can be easily cast into a protective case. Test conditions will be described later.
本発明のサーミスタセンサ注型用エポキシ樹脂組成物の粘度、エポキシ樹脂組成物の硬化物の耐ヒートサイクル性は、（Ａ）成分の配合量、（Ｂ）成分の種類とその配合量、（Ｃ）成分の種類とその配合量、（Ｄ）成分の種類とその配合量などによって調節することができる。 The viscosity of the epoxy resin composition for casting the thermistor sensor of the present invention and the heat cycle resistance of the cured product of the epoxy resin composition are the blending amount of component (A), the type and blending amount of component (B), (C It can be adjusted according to the type of component) and the amount thereof, and the type and amount of component (D).
（製造方法）
本発明のサーミスタセンサ注型用エポキシ樹脂組成物は使用時にこれらの各成分を任意の順序で添加し、均一に混合することによって調製される。また所望により、（Ｂ）成分を第二液とし、第二液以外の成分を混合したものを第一液としてあらかじめ調製しておき、使用の際に第一液と第二液を混合して用いると、作業効率などの面で有利である。
(Production method)
The epoxy resin composition for casting the thermistor sensor of the present invention is prepared by adding each of these components in an arbitrary order at the time of use and mixing them uniformly. In addition, if desired, the component (B) is used as the second solution, and the mixture of components other than the second solution is prepared in advance as the first solution, and the first solution and the second solution are mixed during use. When used, it is advantageous in terms of work efficiency.
（サーミスタセンサの製造方法）
本発明のサーミスタセンサを製造するにあたっては、予め本発明のサーミスタセンサ注型用エポキシ樹脂組成物を注入した保護ケース内に、サーミスタ素子本体を挿入し、その後、サーミスタセンサ注型用エポキシ樹脂組成物を硬化させるようにしてもよく、あるいは、サーミスタ素子本体を保護ケース内に挿入した後に、本発明のサーミスタセンサ注型用エポキシ樹脂組成物を注入し、硬化させるようにしてもよい。硬化条件は絶縁被覆材の材質に応じて適宜設定すればよく、絶縁被覆材が塩化ビニル樹脂である場合には１００〜１０５℃の温度範囲で２〜１０時間程度であることが好ましい。
(Thermistor sensor manufacturing method)
In producing the thermistor sensor of the present invention, the thermistor element body is inserted into a protective case into which the thermistor sensor casting epoxy resin composition of the present invention has been injected in advance, and then the thermistor sensor casting epoxy resin composition. Alternatively, after the thermistor element body is inserted into the protective case, the thermistor sensor casting epoxy resin composition of the present invention may be injected and cured. Curing conditions may be appropriately set according to the material of the insulating coating material, and when the insulating coating material is a vinyl chloride resin, it is preferably about 2 to 10 hours in a temperature range of 100 to 105 ° C.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015111949A JP6558959B2 (en) | 2015-06-02 | 2015-06-02 | Epoxy resin composition for thermistor sensor casting and thermistor sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015111949A JP6558959B2 (en) | 2015-06-02 | 2015-06-02 | Epoxy resin composition for thermistor sensor casting and thermistor sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016222836A JP2016222836A (en) | 2016-12-28 |
| JP2016222836A5 true JP2016222836A5 (en) | 2018-07-05 |
| JP6558959B2 JP6558959B2 (en) | 2019-08-14 |
Family
ID=57745523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015111949A Active JP6558959B2 (en) | 2015-06-02 | 2015-06-02 | Epoxy resin composition for thermistor sensor casting and thermistor sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6558959B2 (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08311157A (en) * | 1995-03-15 | 1996-11-26 | Tokuyama Corp | Curable electroconductive composition |
| JPH09151303A (en) * | 1995-09-25 | 1997-06-10 | Nissan Chem Ind Ltd | Epoxy resin composition |
| JPH10316894A (en) * | 1997-05-20 | 1998-12-02 | Nippon Kayaku Co Ltd | Powder coating composition |
| JP4037603B2 (en) * | 2000-11-24 | 2008-01-23 | 株式会社リコー | Epoxy resin composition and method of manufacturing ink jet head using the same |
| JP2003026766A (en) * | 2001-07-13 | 2003-01-29 | New Japan Chem Co Ltd | Epoxy-based reactive diluent and liquid epoxy resin composition containing the same |
| JP5025884B2 (en) * | 2003-07-03 | 2012-09-12 | 中国塗料株式会社 | Curable composition for concrete crack repair |
| JP5530313B2 (en) * | 2010-09-03 | 2014-06-25 | 京セラケミカル株式会社 | Thermistor sensor casting resin composition and thermistor sensor |
| WO2012138755A1 (en) * | 2011-04-08 | 2012-10-11 | Dongchan Ahn | Method of preparing gas selective membrane using epoxy-functional siloxanes |
| JP5659946B2 (en) * | 2011-05-10 | 2015-01-28 | 日立化成株式会社 | Semiconductor sealing adhesive, method for manufacturing the same, and semiconductor device |
| JP6491459B2 (en) * | 2014-10-31 | 2019-03-27 | 京セラ株式会社 | Thermistor sensor casting resin composition and thermistor sensor |
| CN105778051B (en) * | 2015-01-08 | 2021-03-12 | 索马龙株式会社 | Resin composition, sensor casting, and temperature sensor |
| JP6291442B2 (en) * | 2015-03-12 | 2018-03-14 | 京セラ株式会社 | Thermistor sensor casting resin composition and thermistor sensor |
-
2015
- 2015-06-02 JP JP2015111949A patent/JP6558959B2/en active Active
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