CN105385397B - A kind of preparation method of luminous adhesive - Google Patents
A kind of preparation method of luminous adhesive Download PDFInfo
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- CN105385397B CN105385397B CN201510929336.0A CN201510929336A CN105385397B CN 105385397 B CN105385397 B CN 105385397B CN 201510929336 A CN201510929336 A CN 201510929336A CN 105385397 B CN105385397 B CN 105385397B
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- epoxy resin
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- fluorescent powder
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Abstract
The invention discloses a kind of preparation methods of luminous adhesive, are made of the following steps：(1) extracting epoxy resin (when room temperature is less than 20 DEG C, the viscosity of epoxy resin is larger, and impregnation is very inconvenient, is not easy to mix well, and such case is taken again after can heating epoxy resin by water-bath)；(2) 50~120% fluorescent powders are added in epoxy resin, and stir 30min in blender, until fluorescent powder is fully immersed into epoxy resin；(3) 650 polyamides 100% (plasticizer) are added in epoxy resin composition, are mixed thoroughly；Appropriate filler is added again, is mixed thoroughly；(4) amine curing agent is finally slowly added at room temperature for 24 hours to cure.It obtains Luminescence gel and sticks agent.The present invention, which is a kind of luminous adhesive produced, has that photism, water resistance, durability, stability is good and is easily achieved, is easy to operate, the preparation method of the luminous adhesive of the low characteristic of production cost.
Description
Technical field
The present invention relates to a kind of preparation methods of adhesive, more particularly to a kind of preparation method of luminous adhesive.
Background technology
The performance of epoxy resin is good, and splicing power is strong, shrinkage is small, solidification is convenient.Its shrinkage is small, is because of asphalt mixtures modified by epoxy resin
Fat is added curing agent and does not generate by-product, bubble will not be generated, so shrinking percentage very little.It is glued power by force can be from structure
On find out, due to containing three kinds of hydroxyl, ether and epoxy group functional groups, be all extremely active key, be easy and contact interface shape
At certain power, so the splicing power of epoxy resin is especially strong.In addition, the solidification of epoxy resin is very convenient.Its selection is various not
Same curing agent, epoxy-resin systems can almost cure in 0~180 DEG C of temperature range.
Epoxy resin has most of material, such as timber, metal, glass, plastics, rubber, leather, ceramics, fiber
Good bonding property.It is only poor to a few materials, such as the bonding property that polystyrene, polyvinyl chloride, Sai Lu are coughed up.But at present
Epoxy resin adhesive in that fluorescent powder is not added, apply in furniture and Wood craft, cannot night or it is dark when
It is allowed to send out different brilliance.
Invention content
Technical problem to be solved by the invention is to provide a kind of luminous adhesives produced to have photism, water-fast
The preparation method of the luminous adhesive of property, the good characteristic of durability, stability.
In order to solve the above technical problem, the present invention provides luminous adhesive preparation method, be made of the following steps：
It is made of the following steps：(1) extracting epoxy resin；(2) 50~120% fluorescent powder of quality for accounting for epoxy resin is added
Into epoxy resin, and 30min~1h is stirred in blender, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin
Mixture；(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100% is added to epoxy resin mixing
In object, mix thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20%~25% is added again, is mixed thoroughly；(4) finally delay
It is slow be added account for the curing agent ethylene diamine of epoxy resin composition quality 20%~25% at room temperature 22h~26h solidifications to get to
Shine adhesive.
The fluorescent powder is strontium aluminate fluorescent powder, grain size 20nm.
In above-mentioned steps (1), when room temperature is less than 20 DEG C, taken again after epoxy resin is heated by water-bath.
Using the preparation method of the luminous adhesive of above-mentioned technical proposal, the performance of epoxy resin is good, and splicing power is strong, shrinks
Property is small, solidification is convenient.Its shrinkage is small, will not be generated because epoxy resin is added curing agent and does not generate by-product
Bubble, so shrinking percentage very little.It is glued power can find out by force from structure, due to containing three kinds of hydroxyl, ether and epoxy group
Functional group is all extremely active key, is easy to form certain power with contact interface, so the splicing power of epoxy resin is especially strong.
In addition, the solidification of epoxy resin is very convenient.It selects a variety of different curing agent, epoxy-resin systems almost can 0~
Solidification in 180 DEG C of temperature ranges.
Epoxy resin has most of material, such as timber, metal, glass, plastics, rubber, leather, ceramics, fiber
Good bonding property.It is only poor to a few materials, such as the bonding property that polystyrene, polyvinyl chloride, Sai Lu are coughed up.In epoxy
Fluorescent powder is added in Resin adhesive, applies in furniture and Wood craft, allows it to send out at night or dark different
It is honorable.
Epoxy resin wraps up fluorescent powder so that and there is one layer of insoluble insoluble organic film on fluorescent powder grain surface, exclusion of water,
High temperature resistant, while solving the problems, such as that fluorescent powder poor water resistance and heat-resisting quantity are poor.And the epoxy resin after curing, have excellent
Good alkali resistance.
The characteristic that the luminous adhesive produced has photism, water resistance, durability, stability good.
There is photism, water resistance, durability, steady in conclusion the present invention is a kind of luminous adhesive produced
It is qualitative to get well and be easily achieved, be easy to operate, the preparation method of the luminous adhesive of the low characteristic of production cost.
Specific implementation mode
The present invention, but following implementations can further be expressly understood by the specific embodiment of invention now given below
Example is not limitation of the invention.
Embodiment 1：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 50% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
30min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) curing agent ethylene diamine for being finally slowly added to account for epoxy resin composition quality 23% cures for 24 hours at room temperature,
It obtains Luminescence gel and sticks agent.
Embodiment 2：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 60% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
35min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 25% is added again, is mixed thoroughly；
(4) curing agent ethylene diamine for being finally slowly added to account for epoxy resin composition quality 23% cures for 24 hours at room temperature,
It obtains Luminescence gel and sticks agent.
Embodiment 3：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 70% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
40min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 25% is added again, is mixed thoroughly；
(4) curing agent ethylene diamine for being finally slowly added to account for epoxy resin composition quality 23% cures for 24 hours at room temperature,
It obtains Luminescence gel and sticks agent.
Embodiment 4：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 80% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
45min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 23% is added again, is mixed thoroughly；
(4) curing agent ethylene diamine for being finally slowly added to account for epoxy resin composition quality 20% cures for 24 hours at room temperature,
It obtains Luminescence gel and sticks agent.
Embodiment 5：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 90% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
50min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 23% is added again, is mixed thoroughly；
(4) curing agent ethylene diamine for being finally slowly added to account for epoxy resin composition quality 23% cures for 24 hours at room temperature,
It obtains Luminescence gel and sticks agent.
Embodiment 6：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 100% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
55min, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) it is finally slowly added to account for the curing agent ethylene diamine 26h solidifications at room temperature of epoxy resin composition quality 25%,
It obtains Luminescence gel and sticks agent.
Embodiment 7：
Preparation method is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 120% for accounting for epoxy resin is added in epoxy resin, and is stirred in blender
1h, until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) it is mixed to be added to epoxy resin for 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%
It closes in object, mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) it is finally slowly added to account for the curing agent ethylene diamine 26h solidifications at room temperature of epoxy resin composition quality 25%,
It obtains Luminescence gel and sticks agent.
Claims (8)
1. a kind of preparation method of luminous adhesive, it is characterized in that：It is made of the following steps：(1) extracting epoxy resin；(2) it will account for
50~120% fluorescent powder of quality of epoxy resin is added in epoxy resin, and 30min~1h is stirred in blender, until
Fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；(3) plasticising of epoxy resin composition quality 100% will be accounted for
650 polyamide of agent, is added in epoxy resin composition, mixes thoroughly；To account for again epoxy resin composition quality 20%~
25% filler glass fibre is added, and mixes thoroughly；(4) it is finally slowly added to account for consolidating for epoxy resin composition quality 20%~25%
Agent ethylenediamine at room temperature 22h~26h solidifications to get to luminous adhesive；
Wherein, the fluorescent powder is strontium aluminate fluorescent powder, and grain size 20nm, the luminous adhesive is for Wood craft
In；
In above-mentioned steps (1), when room temperature is less than 20 DEG C, taken again after epoxy resin is heated by water-bath.
2. the preparation method of luminous adhesive according to claim 1, it is characterized in that：It is made of the following steps：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 50% for accounting for epoxy resin is added in epoxy resin, and stirs 30min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) be finally slowly added to account for epoxy resin composition quality 23% curing agent ethylene diamine cure for 24 hours at room temperature to get
To luminous adhesive.
3. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 60% for accounting for epoxy resin is added in epoxy resin, and stirs 35min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 25% is added again, is mixed thoroughly；
(4) be finally slowly added to account for epoxy resin composition quality 23% curing agent ethylene diamine cure for 24 hours at room temperature to get
To luminous adhesive.
4. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 70% for accounting for epoxy resin is added in epoxy resin, and stirs 40min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 25% is added again, is mixed thoroughly；
(4) be finally slowly added to account for epoxy resin composition quality 23% curing agent ethylene diamine cure for 24 hours at room temperature to get
To luminous adhesive.
5. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 80% for accounting for epoxy resin is added in epoxy resin, and stirs 45min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 23% is added again, is mixed thoroughly；
(4) be finally slowly added to account for epoxy resin composition quality 20% curing agent ethylene diamine cure for 24 hours at room temperature to get
To luminous adhesive.
6. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 90% for accounting for epoxy resin is added in epoxy resin, and stirs 50min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 23% is added again, is mixed thoroughly；
(4) be finally slowly added to account for epoxy resin composition quality 23% curing agent ethylene diamine cure for 24 hours at room temperature to get
To luminous adhesive.
7. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 100% for accounting for epoxy resin is added in epoxy resin, and stirs 55min in blender,
Until fluorescent powder is fully immersed into epoxy resin and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) be finally slowly added to account for the curing agent ethylene diamine of epoxy resin composition quality 25% at room temperature 26h solidifications to get
To luminous adhesive.
8. the preparation method of luminous adhesive according to claim 1, it is characterized in that：Preparation method is by the following steps structure
At：
(1) extracting epoxy resin；
(2) fluorescent powder for the quality 120% for accounting for epoxy resin is added in epoxy resin, and stirs 1h in blender, directly
It is fully immersed into epoxy resin to fluorescent powder and forms epoxy resin composition；
(3) 650 polyamide of plasticizer that will account for epoxy resin composition quality 100%, is added to epoxy resin composition
In, it mixes thoroughly；The filler glass fibre for accounting for epoxy resin composition quality 20% is added again, is mixed thoroughly；
(4) be finally slowly added to account for the curing agent ethylene diamine of epoxy resin composition quality 25% at room temperature 26h solidifications to get
To luminous adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510929336.0A CN105385397B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method of luminous adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510929336.0A CN105385397B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method of luminous adhesive |
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| Publication Number | Publication Date |
|---|---|
| CN105385397A CN105385397A (en) | 2016-03-09 |
| CN105385397B true CN105385397B (en) | 2018-07-17 |
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| CN201510929336.0A Active CN105385397B (en) | 2015-12-15 | 2015-12-15 | A kind of preparation method of luminous adhesive |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110452651A (en) * | 2019-09-26 | 2019-11-15 | 深圳市宏进科技有限公司 | A kind of novel fire resistant epoxy glue and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| CN103320023A (en) * | 2013-06-27 | 2013-09-25 | 苏州工业园区依利电子贸易有限公司 | Fluorescent adhesive |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
-
2015
- 2015-12-15 CN CN201510929336.0A patent/CN105385397B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| CN103320023A (en) * | 2013-06-27 | 2013-09-25 | 苏州工业园区依利电子贸易有限公司 | Fluorescent adhesive |
| CN104017526A (en) * | 2014-05-29 | 2014-09-03 | 绍兴光彩显示技术有限公司 | Fluorescent-powder dispensing glue for white-light SMD nixie tube and application method thereof |
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| CN105385397A (en) | 2016-03-09 |
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