AU2021101207A4 - Preparation method of luminous adhesive - Google Patents
Preparation method of luminous adhesive Download PDFInfo
- Publication number
- AU2021101207A4 AU2021101207A4 AU2021101207A AU2021101207A AU2021101207A4 AU 2021101207 A4 AU2021101207 A4 AU 2021101207A4 AU 2021101207 A AU2021101207 A AU 2021101207A AU 2021101207 A AU2021101207 A AU 2021101207A AU 2021101207 A4 AU2021101207 A4 AU 2021101207A4
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- AU
- Australia
- Prior art keywords
- epoxy resin
- resin mixture
- fluorescent powder
- uniformly mixing
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
- C09K11/641—Chalcogenides
- C09K11/643—Chalcogenides with alkaline earth metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
The present disclosure discloses a preparation method of a luminous adhesive, including the
following steps: (1) taking an amount of epoxy resin (when the room temperature is lower than
20°C, the viscosity of the epoxy resin is relatively high, it is not easy to conduct adhesive mixing or
uniformly mixing the epoxy resin. In this case, the epoxy resin can be used after being heated in a
water bath); (2) adding fluorescent powder 50-120wt.% of the epoxy resin to the epoxy resin, and
stirring in a mixer for 30 min until the fluorescent powder is completely blended in the epoxy resin;
(3) adding a plasticizer 650 polyamide resin 100wt.% of an epoxy resin mixture to the epoxy resin
mixture, uniformly mixing, adding an appropriate amount of filler, and uniformly mixing; and (4)
slowly adding an amine curing agent, and curing at room temperature for 24 h, to obtain the
luminous adhesive. The present disclosure provides a preparation method of a luminous adhesive,
which can produce a luminous adhesive with characteristics of luminescence, water resistance,
durability, desirable stability, easy implementation, convenient operation, and low production costs.
Description
The present disclosure relates to a preparation method of an adhesive, and in particular, to a preparation method of a luminous adhesive.
Epoxy resin has desirable performance, strong bonding force, and small shrinkage, and can be cured conveniently. Epoxy resin has small shrinkage because neither by-products nor bubbles are produced after a curing agent is added to epoxy resin. Therefore, a shrinkage rate of epoxy resin is very small. It can be learned from the structure of epoxy resin that epoxy resin has strong bonding force. Since epoxy resin contains three types of functional groups: hydroxide group, ether group, and epoxy group, and all these groups are extremely active bonds and easily form specific force with the contact interface, epoxy resin has particularly strong bonding force. In addition, epoxy resin can be cured very conveniently. Various different curing agents can be selected for epoxy resin, and an epoxy resin system can be cured almost in a temperature range of 0-180°C.
Epoxy resin can be well bonded to most materials such as wood, metal, glass, plastic, rubber, leather, ceramics, and fiber, but cannot be well bonded to only a few materials such as polystyrene, polyvinyl chloride, and celluloid. However, no fluorescent powder is added to a current epoxy resin adhesive, and when the epoxy resin adhesive is used in furniture and wooden crafts, the furniture and wooden crafts cannot present different gloss at night or in the dark.
A technical problem to be resolved in the present disclosure is to provide a preparation method of a luminous adhesive, which can produce a luminous adhesive with characteristics of luminescence, water resistance, durability, and desirable stability.
To resolve the above technical problem, the preparation method of a luminous adhesive provided in the present disclosure includes the following steps:
(1) taking an amount of epoxy resin; (2) adding fluorescent powder 50-120wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 30 min to 1 h until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture; (3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 20-25wt.% of the epoxy resin mixture, and uniformly mixing; and (4) slowly adding a curing agent ethylenediamine 20-25wt.% of the epoxy resin mixture, and curing at room temperature for 22-26 h to obtain the luminous adhesive.
The fluorescent powder may be strontium aluminate fluorescent powder with a particle size of nm.
In step (1), when the room temperature is lower than 20°C, the epoxy resin may be heated in a water bath before use.
According to the preparation method of a luminous adhesive in the above technical solution, the epoxy resin has desirable performance, strong bonding force, and small shrinkage, and can be cured conveniently. Epoxy resin has small shrinkage because neither by-products nor bubbles are produced after a curing agent is added to epoxy resin. Therefore, a shrinkage rate of epoxy resin is very small. It can be learned from the structure of epoxy resin that epoxy resin has strong bonding force. Since epoxy resin contains three types of functional groups: hydroxide group, ether group, and epoxy group, and all these groups are extremely active bonds and easily form specific force with the contact interface, epoxy resin has particularly strong bonding force. In addition, epoxy resin can be cured very conveniently. Various different curing agents can be selected for epoxy resin, and an epoxy resin system can be cured almost in a temperature range of 0-180°C.
Epoxy resin can be well bonded to most materials such as wood, metal, glass, plastic, rubber, leather, ceramics, and fiber, and cannot be well bonded to only a few materials such as polystyrene, polyvinyl chloride, and celluloid. The fluorescent powder is added to the epoxy resin adhesive, and when the epoxy resin adhesive is used in furniture and wooden crafts, the furniture and wooden crafts can present different gloss at night or in the dark.
The fluorescent powder is coated with epoxy resin, so that the surface of fluorescent powder particles has an insoluble and unmeltable organic film layer, which isolates water and has high temperature resistance, and resolves problems of poor water resistance and high-temperature resistance of the fluorescent powder. In addition, the cured epoxy resin has excellent alkaline resistance.
The produced luminous adhesive has characteristics of luminescence, water resistance, durability, and desirable stability.
In summary, the present disclosure provides a preparation method of a luminous adhesive, which can produce a luminous adhesive with characteristics of luminescence, water resistance, durability, desirable stability, easy implementation, convenient operation, and low production costs.
The term "comprise" and variants of the term such as "comprises" or "comprising" are used herein to denote the inclusion of a stated integer or stated integers but not to exclude any other integer or any other integers, unless in the context or usage an exclusive interpretation of the term is required.
Any reference to publications cited in this specification is not an admission that the disclosures constitute common general knowledge in Australia or elsewhere.
Specific examples of the present disclosure are given below to further clarify the present disclosure, but the following examples are not intended to limit the present disclosure.
Example 1:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 50wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 30 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 23wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
Example 2:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 60wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 35 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 25wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 2 3wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
Example 3:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 70wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 40 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 2 5wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 2 3wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
Example 4:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 80wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 45 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 2 3wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 20wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
Example 5:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 90wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 50 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 23wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 23wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
Example 6:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 100wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 55 min until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 25wt.% of the epoxy resin mixture, and curing at room temperature for 26 h to obtain the luminous adhesive.
Example 7:
A preparation method of a luminous adhesive includes the following steps:
(1) taking an amount of epoxy resin;
(2) adding fluorescent powder 120wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 1 h until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture;
(3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding a curing agent ethylenediamine 25wt.% of the epoxy resin mixture, and curing at room temperature for 26 h to obtain the luminous adhesive.
Claims (5)
1. A preparation method of a luminous adhesive, comprising the following steps: (1) taking an amount of epoxy resin; (2) adding fluorescent powder 50-120wt.% of the epoxy resin to the epoxy resin, and stirring in a mixer for 30 min to 1 h until the fluorescent powder is completely blended in the epoxy resin to form an epoxy resin mixture; (3) adding a plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding a filler fiberglass -25wt.% of the epoxy resin mixture, and uniformly mixing; and (4) slowly adding a curing agent ethylenediamine 20-25wt.% of the epoxy resin mixture, and curing at room temperature for 22-26 h to obtain the luminous adhesive.
2. The preparation method of a luminous adhesive according to claim 1, wherein the fluorescent powder is strontium aluminate fluorescent powder with a particle size of 20 nm.
3. The preparation method of a luminous adhesive according to claim 1 or 2, wherein in step (1), when the room temperature is lower than 20°C, the epoxy resin is heated in a water bath before use.
4. The preparation method of a luminous adhesive according to claim 1 or 2, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 50wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 30 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 23wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive.
5. The preparation method of a luminous adhesive according to claim 1 or 2, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 60wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 35 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 25wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 2 3wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive;
or, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 70wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 40 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 25wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 2 3wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive;
or, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 80wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 45 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 2 3wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 20wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive;
or, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 90wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 50 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 2 3wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 2 3wt.% of the epoxy resin mixture, and curing at room temperature for 24 h to obtain the luminous adhesive;
or, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 100wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 55 min until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 25wt.% of the epoxy resin mixture, and curing at room temperature for 26 h to obtain the luminous adhesive;
or, comprising the following steps:
(1) taking an amount of the epoxy resin;
(2) adding the fluorescent powder 1 2 0wt.% of the epoxy resin to the epoxy resin, and stirring in the mixer for 1 h until the fluorescent powder is completely blended in the epoxy resin to form the epoxy resin mixture;
(3) adding the plasticizer 650 polyamide resin 100wt.% of the epoxy resin mixture to the epoxy resin mixture, uniformly mixing, adding the filler fiberglass 20wt.% of the epoxy resin mixture, and uniformly mixing; and
(4) slowly adding the curing agent ethylenediamine 25wt.% of the epoxy resin mixture, and curing at room temperature for 26 h to obtain the luminous adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2021101207A AU2021101207A4 (en) | 2021-03-08 | 2021-03-08 | Preparation method of luminous adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2021101207A AU2021101207A4 (en) | 2021-03-08 | 2021-03-08 | Preparation method of luminous adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2021101207A4 true AU2021101207A4 (en) | 2021-05-13 |
Family
ID=75829019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2021101207A Ceased AU2021101207A4 (en) | 2021-03-08 | 2021-03-08 | Preparation method of luminous adhesive |
Country Status (1)
| Country | Link |
|---|---|
| AU (1) | AU2021101207A4 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088163A (en) * | 2021-05-20 | 2021-07-09 | 赵青山 | Quick-setting road marking paint with noctilucent identification function and preparation method thereof |
-
2021
- 2021-03-08 AU AU2021101207A patent/AU2021101207A4/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088163A (en) * | 2021-05-20 | 2021-07-09 | 赵青山 | Quick-setting road marking paint with noctilucent identification function and preparation method thereof |
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| FGI | Letters patent sealed or granted (innovation patent) | ||
| MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |