JP2016221941A - Structure for reducing thermal strain in composite material structure - Google Patents
Structure for reducing thermal strain in composite material structure Download PDFInfo
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- JP2016221941A JP2016221941A JP2015139192A JP2015139192A JP2016221941A JP 2016221941 A JP2016221941 A JP 2016221941A JP 2015139192 A JP2015139192 A JP 2015139192A JP 2015139192 A JP2015139192 A JP 2015139192A JP 2016221941 A JP2016221941 A JP 2016221941A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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Abstract
Description
本発明は,複合材料治具の加熱により生じる熱歪みを低減する構造に関する。The present invention relates to a structure for reducing thermal distortion caused by heating of a composite material jig.
従来の複合材料治具は,加熱を行うと各層の部材の線膨張係数が異なるため、層間の膨張量が異なる。治具の各層は精度を保持するために固定しており、その固定部から各層の間に歪みを生成し、それが形状の変形をもたらしていた。精度の高い部品を保持する場合には、変形により高精度に保持できない場合がある。また、温度が高くなると、部材によっては破壊する部分もあった。When the conventional composite material jig is heated, the linear expansion coefficients of the members of the respective layers are different, so that the expansion amounts between the layers are different. Each layer of the jig is fixed in order to maintain accuracy, and strain is generated between the layers from the fixed portion, which causes deformation of the shape. When holding a highly accurate part, there is a case where it cannot be held with high accuracy due to deformation. Moreover, when the temperature was high, some parts were destroyed.
複合材料治具は、熱伝導性の向上などの目的で各層を別の材料で構成させており、図1に示すように、各層の熱膨張が異なるため、連結をすると、カンチレバー効果により、変形が生じており、精度の高い部品を固定するなどに支障をきたしていた。In the composite material jig, each layer is made of a different material for the purpose of improving the thermal conductivity, and as shown in FIG. 1, the thermal expansion of each layer is different. This has caused problems such as fixing highly accurate parts.
本発明は,温度を上昇させて使用する高精度部品を把持する軸対称形状の治具などが有していた問題を解決しようとするものであり,熱膨張の差を変形に影響させない構造を提案すること目的とするものである。The present invention is intended to solve the problem of an axially symmetric jig that grips high-precision parts to be used at an elevated temperature, and has a structure that does not affect the deformation by the difference in thermal expansion. The purpose is to propose.
本発明は上記目的を達成するために,1層上の外周部分(1−2)に、下の層(2)と同じ材質の基板を用いることにより、下の層(2)と上の層(1−2)の連結部の熱歪みをなくする(温度が均一ならば歪みはない)ことにより、層間の熱歪みを解消する。そして、上層の内側基板(1−1)を、耐熱性を有しかつすべり易いPTFE、ポリイミド、PEEKなどの樹脂膜(1−3)などを用いて、外側基板(1−2)で保持することにより、下層(2)と上層(1)の変形をすべりにより変形量の差を吸収する構造を持つ。そのことにより、カンチレバー効果による変形を防ぐ。In order to achieve the above object, the present invention uses a substrate made of the same material as that of the lower layer (2) for the outer peripheral portion (1-2) on one layer, thereby lower layer (2) and upper layer. The thermal strain between the layers is eliminated by eliminating the thermal strain of the connecting portion of (1-2) (no strain if the temperature is uniform). Then, the upper inner substrate (1-1) is held by the outer substrate (1-2) using a resin film (1-3) such as PTFE, polyimide or PEEK which has heat resistance and is easy to slide. As a result, the lower layer (2) and the upper layer (1) have a structure that absorbs the difference in deformation amount by slipping. This prevents deformation due to the cantilever effect.
上下の熱膨張関係が逆でも対応できる。It is possible to cope with the reverse thermal expansion relationship.
上記の構造は、2層以上の多層構造にも適用可能である。The above structure can also be applied to a multilayer structure having two or more layers.
内側の構造にも、適用可能である。It can also be applied to the inner structure.
上記の構造は,軸対称形状だけでなく,平板,棒などの構造にも,適用可能である。The above structure can be applied not only to an axially symmetric shape but also to a structure such as a flat plate or a bar.
治具の各層の材質には、アルミ、SUS、セラミック、銅、鉄、鉄系の合金、ヒーター、断熱版などを使用できる。また、外周で変形を滑らす膜(1−3)は、PTFE,ポリイミド,PEEK,フッ素塗料、温度によっては、シリコン樹脂などが使用可能である。As the material of each layer of the jig, aluminum, SUS, ceramic, copper, iron, an iron-based alloy, a heater, a heat insulating plate, or the like can be used. The membrane (1-3) that slides around the outer periphery can be made of PTFE, polyimide, PEEK, fluorine paint, or silicon resin depending on the temperature.
各層を連結する部分が同一材質のため、カンチレバー効果による変形は防げ、耐熱滑り膜により、各層の熱膨張の差を吸収することが可能となり、従来の変形を1/2から1/3以下に減らすことが可能となった。Because the parts connecting the layers are made of the same material, deformation due to the cantilever effect can be prevented, and the heat-resistant sliding film can absorb the difference in thermal expansion of each layer, reducing the conventional deformation from 1/2 to 1/3 or less. It became possible to reduce.
各層を熱膨張率が異なる材料を用いても、連結部に同じ材料を用いることにより熱膨張差がなくなり、さらに、異なる材料間は、滑りやすい樹脂などで、押さえることにより、熱膨張差を逃がす構造を特徴とする。Even if materials with different coefficients of thermal expansion are used for each layer, there is no difference in thermal expansion by using the same material for the connecting part, and furthermore, the difference in thermal expansion is released by pressing between different materials with a slippery resin. Characterized by structure.
上層にセラミック、下層にアルミ、下層の下にヒーター、ヒータの下に断熱層の4層で、φ300の円形形状の治具を作成し、300℃に加熱したが、変形は全面で1mm以内に抑えることができた。The upper layer was ceramic, the lower layer was aluminum, the lower layer was a heater, and the lower layer was a heat insulation layer. Four φ300 jigs were made and heated to 300 ° C. I was able to suppress it.
このような構造は,高精度の加温治具,MEMS,温度変化の激しい自動車部品,燃料電池などの構造体に利用が可能である。Such a structure can be used for structures such as high-precision heating jigs, MEMS, automobile parts that undergo rapid temperature changes, and fuel cells.
1:上層基板
1−1:上層基板内側
1−2:上層基板外側
1−3:滑り易い樹脂
2:下層基板1: Upper layer substrate 1-1: Upper layer substrate inner side 1-2: Upper layer substrate outer side 1-3: Slippery resin 2: Lower layer substrate
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JP2015139192A JP2016221941A (en) | 2015-06-03 | 2015-06-03 | Structure for reducing thermal strain in composite material structure |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07130459A (en) * | 1993-10-29 | 1995-05-19 | Kyocera Corp | Ceramic heater mounting structure and fluid heating device |
JP2006339344A (en) * | 2005-06-01 | 2006-12-14 | Disco Abrasive Syst Ltd | Chuck table |
JP3147015U (en) * | 2008-09-29 | 2008-12-11 | 株式会社島津製作所 | Differential scanning calorimeter |
JP2010064406A (en) * | 2008-09-12 | 2010-03-25 | Meiki Co Ltd | Injection molding mold and outer peripheral stamper holder of injection molding mold |
JP2013168394A (en) * | 2012-02-14 | 2013-08-29 | Techno Horon:Kk | Wafer holding tool |
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2015
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07130459A (en) * | 1993-10-29 | 1995-05-19 | Kyocera Corp | Ceramic heater mounting structure and fluid heating device |
JP2006339344A (en) * | 2005-06-01 | 2006-12-14 | Disco Abrasive Syst Ltd | Chuck table |
JP2010064406A (en) * | 2008-09-12 | 2010-03-25 | Meiki Co Ltd | Injection molding mold and outer peripheral stamper holder of injection molding mold |
JP3147015U (en) * | 2008-09-29 | 2008-12-11 | 株式会社島津製作所 | Differential scanning calorimeter |
JP2013168394A (en) * | 2012-02-14 | 2013-08-29 | Techno Horon:Kk | Wafer holding tool |
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