CN114781182B - Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material - Google Patents

Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material Download PDF

Info

Publication number
CN114781182B
CN114781182B CN202210551909.0A CN202210551909A CN114781182B CN 114781182 B CN114781182 B CN 114781182B CN 202210551909 A CN202210551909 A CN 202210551909A CN 114781182 B CN114781182 B CN 114781182B
Authority
CN
China
Prior art keywords
auxiliary
interface
piezoelectric
piezomagnetic
field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202210551909.0A
Other languages
Chinese (zh)
Other versions
CN114781182A (en
Inventor
朱帅
于红军
郝留磊
果立成
申振
闫佳
黄灿杰
杨宇宁
王标
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Institute of Technology
Original Assignee
Harbin Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harbin Institute of Technology filed Critical Harbin Institute of Technology
Priority to CN202210551909.0A priority Critical patent/CN114781182B/en
Publication of CN114781182A publication Critical patent/CN114781182A/en
Application granted granted Critical
Publication of CN114781182B publication Critical patent/CN114781182B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10Complex mathematical operations
    • G06F17/15Correlation function computation including computation of convolution operations
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00Details relating to the application field
    • G06F2113/26Composites
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14Force analysis or force optimisation, e.g. static or dynamic forces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Physics (AREA)
  • Data Mining & Analysis (AREA)
  • Computational Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Analysis (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Algebra (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • Databases & Information Systems (AREA)
  • Software Systems (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The invention discloses an interaction integration method for solving the thermal fracture problem of a piezoelectric piezomagnetic composite material, which considers the influence of thermal load on the constitutive equation of the piezoelectric piezomagnetic material and the change of the interaction integration form, and obtains a new form of the interaction integration method of the piezoelectric piezomagnetic material containing a complex material interface under the thermal load through strict theoretical derivation, thereby providing a method for solving the strength factor of the piezoelectric piezomagnetic composite material under the thermal load. The interaction integration method is suitable for piezoelectric piezomagnetic materials with complex interfaces, and strict theoretical derivation proves that the material interfaces do not influence the value of interaction integration, so that the application range of the traditional interaction integration method is expanded to a great extent. Through the setting of the composite material attribute, the calculation of the thermal fracture problem of the piezoelectric piezomagnetic composite materials with different arrangement modes can be realized.

Description

Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material
Technical Field
The invention belongs to the technical field of fracture mechanics, relates to an interaction integration method, and particularly relates to an interaction integration method for solving a stress intensity factor, an electric displacement intensity factor and a magnetic induction intensity factor of a piezoelectric piezomagnetic composite material crack tip under the action of thermal load.
Background
Piezoelectric piezomagnetic materials have been widely used in the field of intelligent structures, such as sensors, brakes, aerospace, and the like, due to their excellent magnetoelectric coupling effect. The piezoelectric piezomagnetic material is a composite material containing both piezoelectric material phase and piezomagnetic material phase, and has a new material property, namely electromagnetic property, besides the piezoelectric and piezomagnetic properties of the component phases. However, due to the limitation of the manufacturing process, a large number of defects exist in the material, and in addition, the intrinsic brittleness of the piezoelectric phase and the piezomagnetic phase is very easy to break and damage in the service process. In addition, severe temperature loading further exacerbates fracture failure of piezomagnetic materials. Therefore, for the reliability requirement of the piezoelectric piezomagnetic material, the fracture mechanism of the piezoelectric piezomagnetic composite material containing a complex material interface under the thermal load needs to be deeply researched.
In the piezoelectric piezomagnetic material line elastic fracture mechanics, the intensity factor is an important parameter for evaluating the fracture behavior of the material, and comprises a stress intensity factor, an electric displacement intensity factor and a magnetic induction intensity factor. The current main methods for solving the stress intensity factor comprise a displacement method, a stress method, J integral and interaction integral. The displacement method and the stress method are high in experience, and accuracy of a calculation result is difficult to evaluate. Although J integration can be very effective in calculating the stress intensity factor, it is not easy to separate the stress intensity factors of type I and type II using J integration for the mixed crack problem. The interaction integration method well solves the problem and is a known method for solving the stress intensity factor with higher accuracy.
However, the current fracture mechanics has no suitable method for obtaining the strength factor of the crack tip of the piezoelectric piezomagnetic material containing the complex material interface under the thermal load. Therefore, in order to accurately evaluate the fracture behavior of the piezoelectric piezomagnetic composite material under the thermal load, it is very important to establish an interaction integration method of the piezoelectric piezomagnetic material containing the complex interface under the thermal load to solve the intensity factor.
Disclosure of Invention
Aiming at solving the defects existing in the research in the background technology, the invention provides an interaction integration method for solving the thermal fracture problem of the piezoelectric-magnetic composite material under the condition of heat load. The invention considers the influence of the thermal load on the constitutive equation of the piezoelectric piezomagnetic material and the change of the interaction integral form, and obtains a new form of the interaction integral method of the piezoelectric piezomagnetic material containing a complex material interface under the thermal load through strict theoretical derivation, thereby providing a method capable of solving the strength factor of the piezoelectric piezomagnetic composite material under the thermal load.
The purpose of the invention is realized by the following technical scheme:
an interaction integration method for solving a piezoelectric piezomagnetic composite material thermal fracture problem comprises the following steps:
the method comprises the following steps: in consideration of the influence of the heat load, obtaining a constitutive equation, a kinematic equation and a balance equation of the piezoelectric piezomagnetic material related to the heat load; establishing a J integral form of the piezoelectric piezomagnetic material under the thermal load, and substituting the uniform material crack tip field serving as an auxiliary field into the J integral form;
step two: the method comprises the steps of obtaining a line integral form of interaction integration by extracting an interaction part of a real field and an auxiliary field, converting the line integral into area integration, dividing the interaction integral form into a uniform term and a non-uniform term, and deducing the non-uniform term by substituting a balance equation, definitions of a strain, an electric field and a magnetic field and a definition of the auxiliary field to obtain the mutual integral form of the piezoelectric piezomagnetic material under the heat load;
step three: the influence of the introduction of an integration area into a material interface on interaction integration needs to be researched, so that the integration area is divided into two different material parts, a line integration form along the material interface is given, the characteristic of good bonding of the material interface is set, and a curve coordinate system is given based on the material interface;
step four: introducing the characteristics on the material interface into an interface integral term, deducing line integral along the material interface by using a chain rule, giving a line integral form along the material interface under the thermal load, and obtaining the influence on an interaction integral form;
step five: and solving the corresponding stress intensity factor, electric displacement intensity factor and magnetic induction intensity factor by taking different values of the auxiliary intensity factor according to the relationship between the interaction integral and the intensity factor in the piezoelectric piezomagnetic material.
Compared with the prior art, the invention has the following advantages:
1. the invention provides an interaction integration method for solving the intensity factor of the crack tip of the piezoelectric piezomagnetic composite material under the thermal load by introducing the influence of the thermal load and the material interface, enlarges the application range of the interaction integration method, and establishes the solution method for the intensity factor of the piezoelectric piezomagnetic composite material containing the complex interface under the thermal load.
2. The interaction integration method is suitable for piezoelectric piezomagnetic materials with complex interfaces, and strict theoretical derivation proves that the material interfaces do not influence the value of interaction integration, so that the application range of the traditional interaction integration method is expanded to a great extent. Through setting the properties of the piezoelectric magnetic composite material, the calculation of the thermal fracture problem of the piezoelectric magnetic composite material with different arrangement modes can be realized.
3. The method has good applicability and stability, can be combined with the existing calculation methods such as finite element, finite element expansion and the like, realizes the solution of the strength factors of different types of piezoelectric piezomagnetic composite materials, and is developed into a commercial program to flexibly adapt to the change of the required problems.
Drawings
FIG. 1 is a block diagram of a process for calculating an intensity factor based on an integral of an interaction involving a complex interface piezoelectric piezomagnetic composite under thermal load;
FIG. 2 is a graph of the integrated area of a magnetoelectroelastic material having an interface;
FIG. 3 is a diagram of a laminated piezoelectric magnetic material sheet containing an oblique crack;
FIG. 4 is a schematic diagram of finite element mesh size and different integration regions;
FIG. 5 is a graph showing the calculation results of the stress intensity factor, the electric displacement intensity factor and the magnetic induction intensity factor for different integration regions
FIG. 6 is a graph showing the variation of stress intensity factor, electric displacement intensity factor and magnetic induction with piezomagnetic phase volume fraction.
Detailed Description
The technical solutions of the present invention are further described below with reference to the drawings, but the present invention is not limited thereto, and any modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
The invention provides an interaction integration method for solving a piezoelectric piezomagnetic composite material thermal fracture problem, which comprises the following steps of:
the method comprises the following steps: in consideration of the influence of the heat load, obtaining a constitutive equation, a kinematic equation and a balance equation of the piezoelectric piezomagnetic material related to the heat load; and establishing a J integral form of the piezoelectric magnetic material under the thermal load, and substituting the uniform material crack tip field as an auxiliary field into the J integral form. The method comprises the following specific steps:
under the conditions of no physical force, no free charge, no magnetic flux and no heat source, the balance equation of the piezoelectric piezomagnetic material is as follows:
σ ij,j =0,D i,i =0,B i,i =q i,i =0;
the kinematic equation is:
Figure BDA0003650368090000051
for a linear piezomagnetic material subjected to a thermal load, the total strain ε kl Total electric field E l And the total magnetic field H l Two parts are divided, one caused by the magnetoelectric elastic load (marked with the superscript "m") and one caused by the thermal load (marked with the superscript "th"):
Figure BDA0003650368090000052
the constitutive equation of a piezomagnetic material can be expressed as:
Figure BDA0003650368090000053
the constitutive equation of a piezomagnetic material can also be expressed as:
Figure BDA0003650368090000054
wherein u is i 、σ ij And ε ij Elastic displacement, stress and total strain; phi, D i And E i Electric potential, electrokinetic displacement and electric field, respectively;
Figure BDA0003650368090000061
B i and H i Respectively magnetic potential, magnetic induction intensity and magnetic field; material parameter C ijkl 、e lij 、h lij 、κ ij 、μ il And gamma ij Respectively, the elastic rigidity, the piezoelectric coefficient, the piezomagnetic coefficient, the dielectric constant, the electromagnetic coefficient and the magnetic conductivity; s ijkl 、η lij 、g lij 、β ij 、α il And λ ij Respectively, elastic flexibility coefficient, piezoelectric strain coefficient, piezomagnetic strain coefficient, dielectric isolation rate, magnetoelectric coefficient and magnetic resistance rate; f. of kl 、υ i And ω l Respectively is a thermal expansion coefficient, a thermal electric field constant and a thermal magnetic field constant; the heat flux defines q by the change in temperature i =-k i ΔT,k i And Δ T is the heat transfer coefficient and the absolute temperature difference between the current temperature and the stress-free initial temperature. Variables labeled with the symbol indices i, j, k, and l (i, j, k, l =1,2, 3) are components of a vector or tensor.
Assisted displacement in a polar coordinate system of the crack tip
Figure BDA0003650368090000062
Auxiliary potential phi aux And an auxiliary magnetic potential->
Figure BDA0003650368090000063
Is defined as: />
Figure BDA0003650368090000064
Auxiliary stress
Figure BDA0003650368090000065
Auxiliary potential shift->
Figure BDA0003650368090000066
And auxiliary magnetic induction->
Figure BDA0003650368090000067
Is defined as follows:
Figure BDA0003650368090000068
auxiliary strain
Figure BDA0003650368090000069
Auxiliary electric field->
Figure BDA00036503680900000610
And an auxiliary magnetic field->
Figure BDA00036503680900000611
The following equation is used to obtain:
Figure BDA0003650368090000071
wherein,
Figure BDA0003650368090000072
and &>
Figure BDA0003650368090000073
Respectively as type I, type II and type III auxiliary stress intensity factors, auxiliary electric displacement intensity factors and auxiliary magnetic induction intensity factors;
Figure BDA0003650368090000074
v N (theta) and w N (θ) is an angular function of the uniform material crack tip field, and the subscript N = { II, I, III, IV, V } corresponds to different cracking modes.
For a two-dimensional non-uniform crack-containing voltage magnet, the J-integral is defined as follows:
Figure BDA0003650368090000075
wherein F is the density of electromagnetic enthalpy, and the expression is
Figure BDA0003650368090000076
δ ij Is a kronecker symbol; n is j Is a contour line gamma 0 The unit outer normal vector of (1); sigma ij 、D j And B j Stress, electric displacement and magnetic induction intensity respectively; u. of i Phi and/or>
Figure BDA0003650368090000077
Respectively displacement, potential and magnetic potential.
According to the condition that the crack surface is set to have no traction force and the electromagnetism is not conducted, the J integral can be written as:
Figure BDA0003650368090000078
wherein m is j Is a contour line
Figure BDA0003650368090000079
Q is an arbitrary smooth weight function with a value of Γ 0 1 is taken up at gamma 1 The upper value is 0.
Superimposing the auxiliary field on the actual field results in a new state, and then the J integral corresponding to the superimposed state is represented as:
Figure BDA00036503680900000710
wherein, J act+aux Is a J integral form of superposition of the real field and the auxiliary field.
Step two: the method comprises the steps of obtaining a line integral form of interaction integration by extracting interaction parts of a real field and an auxiliary field, converting the line integral into area integration, dividing the interaction integral form into a uniform term and a non-uniform term, and deducing the non-uniform term by utilizing a balance equation, definitions of a strain, an electric field and a magnetic field and a definition of the auxiliary field to obtain the mutual integral form of the piezoelectric piezomagnetic material under the heat load. The method comprises the following specific steps:
the J integration corresponding to the superimposed state can be divided into three parts, namely:
J act+aux =J act +J aux +I;
wherein, J act Is a form of J integration where only real fields exist, J aux Is a J integral form in which only the auxiliary field is present, and the terms in which both the real field and the auxiliary field are present are interaction terms, i.e. interaction integrals:
Figure BDA0003650368090000081
to avoid a potential source of inaccuracy in the numerical calculations, the line integrals are converted to area integrals. By the law of divergence, the form of area integral can be obtained:
I=I h +I nonh
Figure BDA0003650368090000082
Figure BDA0003650368090000083
wherein, I h Is defined as a homogeneous term, I nonh Defined as a non-uniform term.
Using equilibrium equations, heterogeneous term integrals I nonh Can be simplified as follows:
Figure BDA0003650368090000091
using definition of strain, electric field and magnetic field
Figure BDA0003650368090000092
Figure BDA0003650368090000093
Figure BDA0003650368090000094
It is possible to obtain:
Figure BDA0003650368090000095
according to the definition of the auxiliary field, there are:
Figure BDA0003650368090000096
wherein,
Figure BDA0003650368090000097
and &>
Figure BDA0003650368090000098
Is the material parameter at the crack tip. Corresponding to (I) nonh Can be expressed as:
Figure BDA0003650368090000099
to further discuss the contribution of thermal load, we use an independent variable I thermal To represent the above formula I nonh The second integral term of (1). This integral I takes into account the change in temperature Δ T thermal Expressed as:
Figure BDA0003650368090000101
step three: the influence of the introduction of the integration region into the material interface on the interaction integration needs to be studied, so that the integration region is divided into two different material portions, a line integration form along the material interface is given, the property of good bonding of the material interface is set, and a curvilinear coordinate system is given based on the material interface. The method comprises the following specific steps:
if a material interface exists inside the integration region, the integration region needs to be divided into regions not including the material interface. As shown in FIG. 2, the integration region includes an arbitrary curve material interface Γ interface . The integration region A is bounded by an interface F interface Divided into closed circuits Γ B1 And Γ B2 Two enclosed sub-areas A 1 And A 2 The closed loop is respectively
Figure BDA0003650368090000102
And &>
Figure BDA0003650368090000103
The corresponding interaction integral is then of the form:
Figure BDA0003650368090000104
integral along material interface I interface The expression is as follows:
Figure BDA0003650368090000105
wherein for two areas A 1 And A 2 Corresponding different materials 1 and 2, corresponding different material areas are indicated by superscripts (1) and (2).
It is noted that the auxiliary displacement in the whole area
Figure BDA0003650368090000106
Auxiliary stress->
Figure BDA0003650368090000107
Auxiliary potential phi aux Auxiliary potential shift->
Figure BDA0003650368090000108
Auxiliary magnetic potential->
Figure BDA0003650368090000109
And auxiliary magnetic induction->
Figure BDA00036503680900001010
Is defined by the analytical solution of cracks in the homogeneous piezomagnetic solid. Thus, these auxiliary variables and their derivatives are continuous across the interface, with the following relationships:
Figure BDA0003650368090000111
Figure BDA0003650368090000112
as shown in FIG. 2, a curvilinear coordinate system ([ xi ] s) is established based on the material interface 12 ) The relationship between the coordinates of the curve and the point P in a material is:
Figure BDA0003650368090000113
wherein, Q (x) 10 ,x 20 ) Is a thin film transistor located at a material interface interface One point above and closest to point P.
The material interface is in an equilibrium state, and the gamma ray is arranged at the material interface interface The mechanical traction, electrical displacement and magnetic induction on both sides are equal, so:
Figure BDA0003650368090000114
because the material interface is set to be bonded completely, and relative slip does not occur between the interfaces, the displacement, the electric potential and the magnetic potential on the two sides of the interface are opposite to the curved coordinate xi 2 The derivatives of the directions are equal, as are:
Figure BDA0003650368090000115
step four: and introducing the characteristics on the material interface into an interface integral term, deducing the line integral along the material interface by using a chain rule, giving a line integral form along the material interface under the thermal load, and obtaining the influence on an interaction integral form. The method comprises the following specific steps:
depending on the continuity condition at the interface, the interface fraction can be expressed as:
Figure BDA0003650368090000121
according to stress-strain relationship and auxiliary stress
Figure BDA0003650368090000122
The first term of interface integration can be expressed as:
Figure BDA0003650368090000123
using chain rules and expressions
Figure BDA0003650368090000124
It is possible to obtain:
Figure BDA0003650368090000125
analogously, applying the electric displacement-potential relationship, the magnetic induction intensity-magnetic potential relationship, the chain-derivative rule and
Figure BDA0003650368090000126
it is possible to obtain:
Figure BDA0003650368090000127
Figure BDA0003650368090000128
Figure BDA0003650368090000129
Figure BDA00036503680900001210
Figure BDA00036503680900001211
substituting the expression obtained above into a line integral expression can obtain the interface area as:
Figure BDA0003650368090000131
the finally obtained integral expression of the interaction of the piezoelectric magnetic material containing the interface under the thermal load is as follows:
Figure BDA0003650368090000132
it can be seen that the new interaction integration method proposed by the present invention is effective for both non-uniform under thermal load and magnetoelectric elastic materials with complex interfaces, and does not need to consider the continuity of material properties at each interface.
Step five: and solving the corresponding stress intensity factor, electric displacement intensity factor and magnetic induction intensity factor by taking different values of the auxiliary intensity factor according to the relationship between the interaction integral and the intensity factor in the piezoelectric piezomagnetic material. The method comprises the following specific steps:
the energy release rate at the crack tip is equal to the J integral, which is related to the intensity factor as follows:
Figure BDA0003650368090000133
here, K = [ K = II K I K III K IV K V ] T Y is a (5 × 5) Irwin matrix, which is a vector of five intensity factors.
Considering the equilibrium state resulting from the superposition of the real field and the auxiliary field, the J integral is:
Figure BDA0003650368090000141
wherein, I is integrated as: i = K T YK aux
In the two-dimensional case, K III If K is taken out of K =0 aux =[1,0,0,0,0] T 、K aux =[0,1,0,0,0] T And K aux =[0,0,0,1,0] T And K aux =[0,0,0,0,1] T Then, it can be simplified to:
I (II) =K II Y 11 +K I Y 12 +K IV Y 14 +K V Y 15
I (I) =K II Y 12 +K I Y 22 +K IV Y 24 +K V Y 25
I (IV) =K II Y 41 +K I Y 42 +K IV Y 44 +K V Y 45
I (V) =K II Y 51 +K I Y 52 +K IV Y 54 +K V Y 55
and solving four equations simultaneously, namely solving the stress intensity factor, the electric displacement intensity factor and the magnetic induction intensity factor respectively.
To illustrate the applicability of the above-described aspects of the present invention, the following description is further presented in conjunction with an example of the thermal loading of a magnetoelectronics elastic material with a complex interface.
Calculation example: research on thermal fracture problem of multi-interface-containing magnetoelectric elastic composite material plate
As shown in fig. 3, a square piezoelectric piezomagnetic composite plate has an oblique crack in the middle, the width of the plate is W =2, the length of the crack is 2a, and the oblique angle is θ. Left temperature of the panel is set to T 1 =0 ℃ and T on the right 2 = 20 ℃, initial temperature of the entire panel is set to T 0 =0 ℃. X at upper and lower ends of setting plate 2 Displacement in direction, limiting x by the midpoint between the upper and lower ends of the plate 1 The displacements in the directions are all 0. The model parameters used were: a (-0.304, -0.268), B (0.304, 0.268), v f =v f (V PM ) =2l/W =0.2 to 0.8. The influence of the boundary conditions of the crack surfaces of thermal insulation and thermal conduction in the piezoelectric magnetic material on the crack strength factor is researched. The type I and type II stress intensity factors, the electric displacement intensity factor and the magnetic induction intensity factor respectively pass through
Figure BDA0003650368090000142
Figure BDA0003650368090000151
And &>
Figure BDA0003650368090000152
Performing dimensionless, dimensionless parameters
Figure BDA0003650368090000153
And &>
Figure BDA0003650368090000154
To describe the relative proportions of the two materials in the piezomagnetic and piezoelectric phases occupied in the piezomagnetic material, the volume fraction is defined as:
v f =V PM /(V PE +V PM )=V PM /V MEE
wherein v is f Volume fraction, V, occupied by magnetic phases in place of gauge pressure PM Represents the volume occupied by the piezomagnetic phase; v PE Representing the volume occupied by the piezoelectric phase; v MEE Representing the volume occupied by the entire piezoelectric magnetic phase.
As shown in fig. 4 for v f =v f (V PM ) The effectiveness of the interaction integration method provided by the invention on piezoelectric piezomagnetic materials with complex interfaces is tested in the case of = 50%. Respectively selecting 12 different integration regions R I /h e Zone R as an integration zone of =1 to 500 I /h e = 1-200 does not include a material interface and R I /h e =250 to 500 contains a material interface. The relative deviation of the calculation result of the intensity factor obtained from the calculation result of fig. 5 is within 0.8%, which shows that the interaction integration method provided by the invention is applicable to piezomagnetic materials containing complex material interfaces, the material interfaces do not influence the calculation accuracy, and the application range of the interaction integration method is greatly expanded.
Stress intensity factor, as shown in FIGS. 6 (a) - (d)
Figure BDA0003650368090000155
And &>
Figure BDA0003650368090000156
The intensity factor of the electric displacement of the crack tip in the piezomagnetic phase is greater as the volume fraction of the piezomagnetic phase increases>
Figure BDA0003650368090000157
First increasing and then decreasing with increasing volume fraction of the piezomagnetic phase, at volume fraction v f Peak is reached when = 0.5. Crack tip in piezomagnetic phase->
Figure BDA0003650368090000158
Close to 0, indicating a volume fraction pair +>
Figure BDA0003650368090000159
Has little effect. Magnetic induction factor of crack tip in piezomagnetic phase with increasing volume fraction
Figure BDA00036503680900001510
The change is significant, and the magnetic induction factor of the crack tip in the piezoelectric phase->
Figure BDA00036503680900001511
The variation is not significant.
The above calculation examples verify the correctness and applicability of the above scheme of the present invention.

Claims (4)

1. An interaction integration method for solving a piezoelectric piezomagnetic composite thermal fracture problem is characterized by comprising the following steps of:
the method comprises the following steps: in consideration of the influence of the heat load, obtaining a constitutive equation, a kinematic equation and a balance equation of the piezoelectric piezomagnetic material related to the heat load; establishing a J integral form of the piezoelectric piezomagnetic material under the thermal load, and substituting the uniform material crack tip field as an auxiliary field into the J integral form;
under the conditions of no physical force, no free charge, no magnetic flux and no heat source, the balance equation of the piezoelectric piezomagnetic material is as follows:
σ ij,j =0,D i,i =0,B i,i =q i,i =0;
the kinematic equation is:
Figure FDA0003885133850000011
for a linear piezomagnetic material subjected to a thermal load, the total strain ε kl Total electric field E l And the total magnetic field H l Divided into two parts, one part caused by the magnetoelectric elastic load, denoted by the superscript "m", and one part caused by the thermal load, denoted by the superscript "th", there are:
Figure FDA0003885133850000012
the constitutive equation of a piezomagnetic material can be expressed as:
Figure FDA0003885133850000013
can also be expressed as:
Figure FDA0003885133850000021
wherein u is i 、σ ij And ε ij Elastic displacement, stress and total strain; phi, D i And E i Electric potential, electrokinetic displacement and electric field, respectively;
Figure FDA0003885133850000022
B i and H i Respectively magnetic potential, magnetic induction intensity and magnetic field; material parameter C ijkl 、e lij 、h lij 、κ ij 、μ il And gamma ij Respectively, the elastic rigidity, the piezoelectric coefficient, the piezomagnetic coefficient, the dielectric constant, the electromagnetic coefficient and the magnetic conductivity; s ijkl 、η lij 、g lij 、β ij 、α il And λ ij Respectively, elastic flexibility coefficient, piezoelectric strain coefficient, piezomagnetic strain coefficient, dielectric isolation rate, magnetoelectric coefficient and magnetic resistance rate; f. of kl 、υ i And ω l Respectively is a thermal expansion coefficient, a thermal electric field constant and a thermal magnetic field constant; the heat flux defines q by the change in temperature i =-k i ΔT,k i And Δ T is the heat transfer coefficient and the absolute temperature difference between the current temperature and the stress-free initial temperature; the variables labeled with the symbol indices i, j, k, and l are components of a vector or tensor, i, j, k, l =1,2,3;
the method comprises the following specific steps of establishing a J integral form of the piezoelectric piezomagnetic material under the thermal load, and substituting the crack tip field of the uniform material as an auxiliary field into the J integral form:
for a two-dimensional non-uniform crack-containing voltage magnet, the J-integral is defined as follows:
Figure FDA0003885133850000023
wherein F is the electromagnetic enthalpy density; delta ij Is a kronecker symbol; n is j Is a contour line gamma 0 The unit outer normal vector of (1); sigma ij 、D j And B j Stress, electric displacement and magnetic induction intensity respectively; u. u i Phi and
Figure FDA0003885133850000024
respectively displacement, potential and magnetic potential;
depending on the condition that the crack plane is set to non-tractive, electromagnetically non-conductive, the J integral can be written as:
Figure FDA0003885133850000025
wherein m is j Is a contour line
Figure FDA0003885133850000031
Q is an arbitrary smooth weight function with a value of Γ 0 Taking 1 above gamma 1 The upper value is 0;
superimposing the auxiliary field on the actual field results in a new state, and then the J integral corresponding to the superimposed state is expressed as:
Figure FDA0003885133850000032
wherein, J act+aux Is a J integral form of superposition of the real field and the auxiliary field,
Figure FDA0003885133850000033
is an auxiliary displacement, phi aux Is the auxiliary potential(s) of the electric field,
Figure FDA0003885133850000034
is the auxiliary magnetic potential of the magnetic field,
Figure FDA0003885133850000035
it is the auxiliary stress that is applied,
Figure FDA0003885133850000036
is the auxiliary electric potential shift and the auxiliary electric potential shift,
Figure FDA0003885133850000037
is used for assisting the magnetic induction intensity,
Figure FDA0003885133850000038
it is the auxiliary strain that is applied,
Figure FDA0003885133850000039
is an auxiliary electric field, and the electric field,
Figure FDA00038851338500000310
is an auxiliary magnetic field;
step two: the method comprises the steps of obtaining a line integral form of interaction integration by extracting an interaction part of a real field and an auxiliary field, converting the line integral into area integration, dividing the interaction integral form into a uniform term and a non-uniform term, and deducing the non-uniform term by substituting a balance equation, definitions of a strain, an electric field and a magnetic field and a definition of the auxiliary field to obtain the mutual integral form of the piezoelectric piezomagnetic material under the heat load;
step three: dividing the integration area into two different material parts, giving a line integration form along a material interface, setting the characteristic of good bonding of the material interface, and giving a curve coordinate system based on the material interface;
step four: introducing the characteristics on the material interface into an interface integral term, deducing line integral along the material interface by using a chain rule, giving a line integral form along the material interface under the thermal load, and obtaining the influence on an interaction integral form;
step five: and solving the corresponding stress intensity factor, electric displacement intensity factor and magnetic induction intensity factor by taking different values of the auxiliary intensity factor according to the relationship between the interaction integral and the intensity factor in the piezoelectric piezomagnetic material.
2. The interaction integration method for solving the piezoelectric piezomagnetic composite thermal fracture problem according to claim 1, characterized in that the specific steps of the second step are as follows:
the J integration corresponding to the superimposed state can be divided into three parts, namely:
J act+aux =J act +J aux +I;
wherein, J act Is a form of J integration where only real fields exist, J aux Is a J integral form in which only the auxiliary field is present, and the terms in which both the real field and the auxiliary field are present are interaction terms, i.e. interaction integrals:
Figure FDA0003885133850000041
to avoid potential sources of inaccuracy in the numerical calculations, the line integrals are converted into area integrals, which, by the divergence theorem, can be obtained in the form of area integrals:
I=I h +I nonh
Figure FDA0003885133850000042
Figure FDA0003885133850000043
wherein, I h Defined as a homogeneous term, I nonh Defined as a non-uniform term;
using equilibrium equations, heterogeneous term integrals I nonh Can be simplified as follows:
Figure FDA0003885133850000051
using definition of strain, electric field and magnetic field
Figure FDA0003885133850000052
Figure FDA0003885133850000053
Figure FDA0003885133850000054
It is possible to obtain:
Figure FDA0003885133850000055
according to the definition of the auxiliary field, there are:
Figure FDA0003885133850000056
wherein,
Figure FDA0003885133850000057
and
Figure FDA0003885133850000058
is the material parameter at the crack tip; corresponding to (I) nonh Can be expressed as:
Figure FDA0003885133850000059
3. the interaction integration method for solving the piezoelectric piezomagnetic composite thermal fracture problem according to claim 1, characterized in that the specific steps of the third step are as follows:
if a material interface is present in the integration region, the integration region needs to be divided into regions not including the material interface, and the integration region includes an arbitrary curve material interface Γ interface The integration region A is bounded by an interface F interface Divided into closed circuits Γ B1 And Γ B2 Two enclosed sub-areas A 1 And A 2 The closed loop is respectively
Figure FDA0003885133850000061
And
Figure FDA0003885133850000062
the corresponding interaction integral is of the form:
Figure FDA0003885133850000063
integration along material interfaceI interface The expression is as follows:
Figure FDA0003885133850000064
wherein for two areas A 1 And A 2 Corresponding dissimilar materials 1 and 2, with superscripts (1) and (2) denoting corresponding dissimilar material regions;
auxiliary displacement in the entire area
Figure FDA0003885133850000065
Auxiliary stress
Figure FDA0003885133850000066
Auxiliary potential phi aux Auxiliary electric potential shift
Figure FDA0003885133850000067
Auxiliary magnetic potential
Figure FDA0003885133850000068
And auxiliary magnetic induction
Figure FDA0003885133850000069
Defined by an analytical solution for cracks in a homogeneous piezomagnetic solid, these auxiliary variables and their derivatives are continuous at the interface, with the following relationships:
Figure FDA00038851338500000610
Figure FDA0003885133850000071
a curve coordinate system (xi) is established based on the material interface 12 ) The relationship between the coordinates of the curve and the point P in a material is:
Figure FDA0003885133850000072
wherein, Q (x) 10 ,x 20 ) Is a thin film transistor located at a material interface interface One point above and closest to point P;
the material interface is in an equilibrium state, and the gamma ray is arranged at the material interface interface The mechanical traction, electrical displacement and magnetic induction on both sides are equal, so:
Figure FDA0003885133850000073
because the material interface is set to be bonded completely, and relative slip does not occur between the interfaces, the displacement, the electric potential and the magnetic potential on the two sides of the interface are opposite to each other along the curve coordinate xi 2 The derivatives of the directions are equal, with:
Figure FDA0003885133850000074
4. the interaction integration method for solving the piezoelectric piezomagnetic composite thermal fracture problem according to claim 1, characterized in that the specific steps of the fourth step are as follows:
depending on the continuity condition at the interface, the interface fraction can be expressed as:
Figure FDA0003885133850000075
according to stress-strain relationship and auxiliary stress
Figure FDA0003885133850000076
The first term of interface integration can be expressed as:
Figure FDA0003885133850000081
using chain rules and expressions
Figure FDA0003885133850000082
It is possible to obtain:
Figure FDA0003885133850000083
using the electric displacement-potential relationship, magnetic induction intensity-magnetic potential relationship, chain-type derivation rule and
Figure FDA0003885133850000084
it is possible to obtain:
Figure FDA0003885133850000085
Figure FDA0003885133850000086
Figure FDA0003885133850000087
Figure FDA0003885133850000088
Figure FDA0003885133850000089
substituting the expression obtained above into a line integral expression can obtain the interface area as:
Figure FDA00038851338500000810
the finally obtained integral expression of the interaction of the piezoelectric magnetic material containing the interface under the thermal load is as follows:
Figure FDA0003885133850000091
CN202210551909.0A 2022-05-18 2022-05-18 Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material Active CN114781182B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210551909.0A CN114781182B (en) 2022-05-18 2022-05-18 Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210551909.0A CN114781182B (en) 2022-05-18 2022-05-18 Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material

Publications (2)

Publication Number Publication Date
CN114781182A CN114781182A (en) 2022-07-22
CN114781182B true CN114781182B (en) 2023-03-24

Family

ID=82408982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210551909.0A Active CN114781182B (en) 2022-05-18 2022-05-18 Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material

Country Status (1)

Country Link
CN (1) CN114781182B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115510709A (en) * 2022-09-27 2022-12-23 哈尔滨工业大学 Interaction integration method for solving dynamic intensity factor of magnetoelectric elastic composite material
CN117649901B (en) * 2023-11-29 2024-07-09 哈尔滨工业大学 Interaction integration method for solving stress intensity factors of cracks of revolving body

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112765818A (en) * 2021-01-22 2021-05-07 中南大学 Stress intensity factor measuring method for multi-round-hole multi-crack anisotropic material
WO2021248850A1 (en) * 2020-06-11 2021-12-16 大连理工大学 Method for predicting structural damage by using strength criterion-driven near-field dynamic model

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835463B2 (en) * 2002-04-18 2004-12-28 Oakland University Magnetoelectric multilayer composites for field conversion
CN107976483B (en) * 2017-11-30 2021-11-19 石家庄铁道大学 Electromagnetic flaw detector for detecting interface cracks of piezoelectric-magnetic laminated structure and detection method
US10458937B2 (en) * 2018-03-08 2019-10-29 Shijiazhuang Tiedao University Electromagnetic detector for detection of interface cracks in a piezoelectric-piezomagnetic laminated structure
CN110657809A (en) * 2019-09-12 2020-01-07 中国人民解放军战略支援部队航天工程大学 Hall sensor installation method for magnetically suspended control sensitive gyroscope
CN111523237B (en) * 2020-04-24 2023-01-17 南京航空航天大学 Prediction method for creep rupture behavior of woven ceramic matrix composite
CN112945802B (en) * 2021-02-03 2023-02-10 南京航空航天大学 Novel surface energy testing method and system
CN114491831B (en) * 2021-12-24 2023-07-18 哈尔滨工业大学 Non-uniform material diffusion crack J integration method based on fracture phase field method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021248850A1 (en) * 2020-06-11 2021-12-16 大连理工大学 Method for predicting structural damage by using strength criterion-driven near-field dynamic model
CN112765818A (en) * 2021-01-22 2021-05-07 中南大学 Stress intensity factor measuring method for multi-round-hole multi-crack anisotropic material

Also Published As

Publication number Publication date
CN114781182A (en) 2022-07-22

Similar Documents

Publication Publication Date Title
CN114781182B (en) Interaction integration method for solving thermal fracture problem of piezoelectric piezomagnetic composite material
Gao et al. Mixed-dimensional modeling of delamination in rare earth-barium-copper-oxide coated conductors composed of laminated high-aspect-ratio thin films
Fazzolari Natural frequencies and critical temperatures of functionally graded sandwich plates subjected to uniform and non-uniform temperature distributions
Alaimo et al. A finite element formulation for large deflection of multilayered magneto-electro-elastic plates
Nguyen et al. Finite element analysis of free-edge stresses in composite laminates under mechanical an thermal loading
Chróścielewski et al. Nonlinear FEM 2D failure onset prediction of composite shells based on 6-parameter shell theory
Garg et al. Modelling of laminated composite plates with weakly bonded interfaces using scaled boundary finite element method
Pelassa et al. Explicit solutions for multi-layered wide plates and beams with perfect and imperfect bonding and delaminations under thermo-mechanical loading
CN114841041B (en) Interaction integration method for solving dynamic fracture strength factor of piezoelectric composite material
Liu et al. High order solutions for the magneto-electro-elastic plate with non-uniform materials
Li et al. 2D fracture analysis of magnetoelectroelastic composites by the SBFEM
Viet et al. Interlaminar shear stress function for adhesively bonded multi-layer metal laminates
Lerpiniere et al. The LS1 model for delamination propagation in multilayered materials at 0°/θ° interfaces: A comparison between experimental and finite elements strain energy release rates
Zhen et al. A global-local higher order theory for multilayered shells and the analysis of laminated cylindrical shell panels
Upadhyay et al. Post-buckling behavior of composite and sandwich skew plates
Bacigalupo et al. Overall thermomechanical properties of layered materials for energy devices applications
Dumont et al. Numerical validation of multiphysic imperfect interfaces models
Yousefsani et al. An analytical investigation on thermomechanical stress analysis of adhesively bonded joints undergoing heat conduction
Khezri et al. A state space augmented generalised RKPM for three-dimensional analysis of thick and laminated composite plates
CN115312141B (en) Interaction integration method for solving thermal fracture problem of magnetoelastic material
Matsunaga Thermal buckling of cross-ply laminated composite shallow shells according to a global higher-order deformation theory
Ramdane et al. Electromagnetic and thermal modeling of composite materials using multilayer shell elements
Ma et al. Theoretical analysis of in-plane problem in functionally graded nonhomogeneous magnetoelectroelastic bimaterials
CN115510709A (en) Interaction integration method for solving dynamic intensity factor of magnetoelectric elastic composite material
Khandelwal et al. Effect of interfacial imperfection on bending behavior of composites and sandwich laminates by an efficient C0 FE model

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant