JP2016221891A - Integrally molded part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an integrally molded part in which antenna structure can be arranged at a high positional precision.SOLUTION: Provided is a resin molded part obtained by integrating a resin component (I) made of a thermoplastic resin in which at least a part of the surface is provided with a metallic layer and a resin component (II) made of a fiber-reinforced thermoplastic resin in which electromagnetic shield properties measured by the KEC method lie in the range of more than 0dB and below 20dB in the frequency 1GHz zone. The resin component (I) and the resin component (II) are integrated via a common boundary face, at least a part of the metallic layer is exposed, and further, the ratio of the area of the boundary face to the total area of the resin component (I) lies in the range of 0.3 to 0.9.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molded product in which a resin component including a metal layer and a fiber reinforced thermoplastic resin are integrated.

  In recent years, an electronic device such as a mobile phone or a personal computer is equipped with an antenna structure for wireless communication. A molded circuit component (MID) for forming such an electronic component antenna structure is generally composed of a plastic substrate on which a conductive element or a conductive path is formed. is there.

  When this antenna structure is incorporated into a mobile phone or a personal computer, it is generally attached directly to the casing of the electronic device using an adhesive or an adhesive tape. However, there has been a problem that the antenna structure cannot be put in a predetermined position and the antenna performance cannot be sufficiently exhibited due to misalignment or inclination at the time of pasting, or an operation error at the time of pasting. Even when affixing is performed using a machine, there is a concern that the position accuracy is not stable due to variations in the amount of adhesive applied or the thickness of the pressure-sensitive adhesive, resulting in variations in antenna performance. Further, in the case of manual pasting, there is a problem that the antenna structure is deformed and the antenna performance is deteriorated.

  Patent Document 1 describes a resin molded product in which a secondary material formed by injection molding is integrated with a primary material having an antenna element on the surface. Patent Document 1 is characterized by providing a ridge on the primary material side for the purpose of reducing residual stress and preventing warping during integral molding. However, although there is a description related to the joining of the primary material and the secondary material, there is no description related to securing positioning accuracy, such as the primary material being displaced by injection pressure or the like. In addition, no attention is paid to the problem that the antenna performance is deteriorated by covering the antenna element.

JP 2014-213516 A

  An object of the present invention is to provide an integrally molded product in which an antenna structure can be arranged with high positional accuracy.

The present invention for solving the above problems employs the following configuration. That is,
(1) Resin component (I) made of a thermoplastic resin provided with a metal layer on at least a part of its surface, and a fiber having an electromagnetic wave shielding property measured by the KEC method in a range of 0 dB or more and less than 20 dB in a frequency of 1 GHz band The resin part (II) made of reinforced thermoplastic resin is integrated with the resin part (I), and the resin part (I) and the resin part (II) are integrated via a common interface, A resin molded product in which at least a part of the metal layer is exposed and a ratio of an area of the boundary surface to a total surface area of the resin component (I) is in a range of 0.3 to 0.9.
(2) The resin molded product according to (1), wherein the resin molded product has an antenna transmission / reception function.
(3) The resin molded product according to (1) or (2), wherein at least a part of the metal layer is in contact with the resin component (II).
(4) The resin molded product according to any one of (1) to (3), wherein the thermoplastic resin used in the resin component (I) is a polycarbonate resin.
(5) The resin molded product according to any one of (1) to (3), wherein the thermoplastic resin used in the resin component (I) is a polyamide resin.
(6) The resin molded product according to any one of (1) to (5), wherein the resin used for the resin component (I) is made of a fiber-reinforced thermoplastic resin.
(7) The resin molded product according to any one of (1) to (6), wherein the resin component (I) has an uneven portion in at least a part of a cross section perpendicular to the longitudinal direction.
(8) The resin molded product according to any one of (1) to (7), wherein the resin component (I) has an L-shaped cross section perpendicular to the longitudinal direction.
(9) The resin molded product according to any one of (1) to (8), wherein the resin component (I) includes a metal complex.
(10) A housing including at least one resin molded product according to any one of (1) to (9).
It is.

  ADVANTAGE OF THE INVENTION According to this invention, the integrated molded product which can arrange | position an antenna structure with high positional accuracy can be provided.

It is a perspective view of the resin molded product with which resin part (I) provided with the metal layer of this invention and resin part (II) consisting of a fiber reinforced thermoplastic resin were integrated. It is a perspective view of the resin component (I) which has uneven | corrugated shape in a part of cross section perpendicular | vertical to the longitudinal direction of this invention. FIG. 3 is a perspective view of a resin molded product in which the resin component (I) and the resin component (II) of FIG. 2 are integrated. It is a perspective view of resin part (I) which has L shape in the section perpendicular to the longitudinal direction of the present invention. FIG. 5 is a perspective view of a resin molded product in which the resin component (I) and the resin component (II) of FIG. 4 are integrated. It is a perspective view of the housing | casing by which several resin components (I) and resin components (II) of this invention are integrated. It is a perspective view of the housing | casing in which the resin molded product and member which integrated several resin components (I) and resin components (II) of this invention were integrated.

  Hereinafter, the manufacturing method of the composite molded product of this invention is demonstrated, using drawing.

  FIG. 1 shows a resin molded product 1 in which a resin part (I) 2 made of a thermoplastic resin having a metal layer 3 on its surface and a resin part (II) 4 are integrated with a common interface. It is a schematic diagram. The resin part (I) 2 is an MID in which an electric circuit, an electrode, and a pattern are formed on, for example, an injection molded product, and the entire resin structure can be freely formed by forming an electric circuit on the resin structure only by plating or vapor deposition technology. Circuit patterns, electrodes, and shields can be formed.

  Among MIDs, the LDS (Laser-direct-structuring) method performs injection molding using a molding resin material mixed with metal particles, etc., and activates a region where a circuit is to be formed by a laser. Make particles conductive. This is a method of forming a circuit by performing electroless plating on the conductor portion, and the antenna structure for wireless communication incorporated in the electronic device can be miniaturized and enhanced in function.

  The metal layer 3 draws a certain pattern on the surface of the resin component (I) 2 so as to have an antenna transmission / reception function of a specific frequency band, and not only the one surface of the resin component (I) 2 but also the resin component (I) It may exist three-dimensionally on the side surface or back surface of the two. By drawing a pattern three-dimensionally, the resin component (I) 2 can be downsized. The metal type of the metal layer 3 is not particularly limited, but a metal having high conductivity is preferably used, and a laminate of two or more layers is also preferable in order to provide a function such as rust prevention.

  It is important that the resin component (I) 2 and the resin component (II) 4 form a common boundary surface on the surface where the components contact each other. The common boundary surface means that another type of component is joined between the resin component (I) 2 and the resin component (II) 4 without being sandwiched. That is, in joining two parts, instead of using a third type material such as an adhesive or an adhesive material, the material on one side is welded or fused without using the third type material. It means that the surface is integrated by such a method. Since the resin part (I) 2 and the resin part (II) 4 form a common boundary surface and are integrated, and the third type material is not sandwiched between the parts, the resin part (I) for the resin part (II) 4 2) The positional accuracy of 2 can be improved as compared with the case where the third type material is included. This is because when the third type material is included, the distance between the resin component (I) 2 and the resin component (II) 4 and the inclination of each change depending on the thickness variation.

  As a method of forming the common boundary surface and integrating the resin component (I) 2 and the resin component (II) 4, integration by injection molding can be mentioned. Pre-molded resin part (I) 2 is set and fixed in an injection mold, and thermoplastic resin is injection-molded to form resin part (II) 4 and integrated with resin part (I) 2 By doing so, the integrated molded product 1 can be obtained. A common boundary surface can be formed by the thermoplastic resin melted at the time of injection molding contacting the resin component (I) 2. Integration of the surface of the resin part (I) 2 that is a thermoplastic resin with the molten thermoplastic resin increases the bonding strength between the resin part (I) 2 and the resin part (II) 4. This is preferable.

  Since the position of the resin part (I) 2 is determined by being set in an injection mold, the position with respect to the resin part (II) 4 is always at the same position after being integrated. The accuracy can be increased. When the resin component (I) 2 has an antenna transmission / reception function, the position can be stabilized even from the viewpoint of antenna characteristics, and variations can be reduced. The resin component (I) 2 is also preferably formed with a positioning shape, for example, a hole shape, for setting in an injection mold. If the injection mold has a positioning shape and the resin part (I) 2 has a hole, making the shape of the pin to be inserted into the hole facilitates the setting and improves the positional accuracy. It is preferable because it becomes easy to do.

  It is important that the ratio of the area of the common boundary formed by the resin part (I) 2 and the resin part (II) 4 to the total surface area of the resin part (I) 2 is 0.3 to 0.9. If it is less than 0.3, the bonding strength between the resin component (I) 2 and the resin component (II) 4 is insufficient, and the resin component (I) 2 comes off when the integrated molded product 1 is handled. There are concerns. When integrating by melt bonding such as caulking, there is a concern that the area that can be melt bonded is limited and the bonding strength is insufficient. If it is greater than 0.9, it is necessary to dispose the resin part (II) 4 over almost the entire surface of the resin part (I) 2 which may have a complicated shape. It is not preferable in terms of quantity. As described above, in the integrally molded product 1 of the resin component (I) 2 and the resin component (II) 4, the boundary area ratio is 0 in order to expose at least a part of the metal layer 3 on the surface. Is preferably less than .9.

  The metal layer 3 formed on the surface layer of the resin component (I) 2 is at least partially exposed on the surface of the molded product in which the resin component (I) 2 and the resin component (II) 4 are integrated. Is preferred. When the metal layer 3 has an antenna transmission / reception function, a conductive cable is installed on a part of the metal layer 3 in order to control the antenna function, so that the conductive part of the metal layer 3 is exposed on the surface. Necessary. The metal layer 3 may be partially sandwiched between the resin component (I) 2 and the resin component (II) 4 as long as a part of the metal layer 3 is exposed on the surface.

  When the metal layer 3 formed on the surface layer of the resin component (I) 2 has an antenna transmission / reception function, the resin component (II) 4 integrated with the resin component (I) 2 has the antenna function of the metal layer 3. In order not to be damaged, it is necessary to have radio wave permeability. It is important that the resin component (II) 4 has an electromagnetic wave shielding property measured by the KEC method in a range of 0 dB or more and less than 20 dB in the frequency 1 GHz band. The electromagnetic wave shielding property is measured using a molded product having the same equivalent thickness under the same process conditions as in the production of the resin component (II) 4. The same equivalent thickness here is a target thickness of ± 0.05 mm. If the electromagnetic wave shielding property measured by the KEC method is in the range of 0 dB to less than 20 dB in the frequency 1 GHz band, sufficient radio wave permeability can be obtained.

  Although there is no restriction | limiting in particular as a thermoplastic resin used for resin component (I) 2, a polyethylene terephthalate (PET) resin, a polybutylene terephthalate (PBT) resin, a polytrimethylene terephthalate (PTT) resin, a polyethylene naphthalate (PEN) Polyester resin such as resin, liquid crystal polyester resin, polyolefin resin such as polyethylene (PE) resin, polypropylene (PP) resin, polybutylene resin, styrene resin, polyoxymethylene (POM) resin, polyamide (PA) Resin, polycarbonate (PC) resin, polymethylene methacrylate (PMMA) resin, polyvinyl chloride (PVC) resin, polyphenylene sulfide (PPS) resin, polyphenylene ether (PPE) resin, modified PPE resin, thermoplastic Reimide (PI) resin, polyamideimide (PAI) resin, polyetherimide (PEI) resin, polysulfone (PSU) resin, modified PSU resin, polyethersulfone (PES) resin, polyketone (PK) resin, polyetherketone (PEK) ) Resin, polyether ether ketone (PEEK) resin, polyether ketone ketone (PEKK) resin, polyarylate (PAR) resin, polyether nitrile (PEN) resin, thermoplastic phenol resin, phenoxy resin, polytetrafluoroethylene resin Fluorine resins such as polystyrene resins, polyolefin resins, polyurethane resins, polyester resins, polyamide resins, polybutadiene resins, polyisoprene resins, thermoplastic resins such as fluorine resins, etc. Copolymers, modification products, and two or more blended resins. In particular, from the viewpoint of heat resistance and chemical resistance, polyphenylene sulfide resin is used, and from the viewpoint of molded product appearance and dimensional stability, polycarbonate resin, polyphenylene ether resin, and styrene resin are used from the viewpoint of strength and impact resistance of the molded product. Is more preferably a polyamide resin. Furthermore, it is also preferable to use a resin containing non-conductive reinforcing fibers as the resin of the resin component (I) 2 in order to increase the strength and rigidity of the molded product. Non-conductive reinforcing fibers are preferably organic fibers such as aramid, PBO, polyphenylene sulfide, polyester, acrylic, nylon and polyethylene, and ceramic fibers such as glass, silicon carbide and silicon nitride. You may use together. These fibers can be subjected to a treatment with a coupling agent, a treatment with a sizing agent, an additive adhesion treatment, or the like as a surface treatment. Among them, it is particularly preferable that at least glass fiber is included from the viewpoint of radio wave permeability and specific rigidity. In addition, when used in electronic parts and the like, flame retardants and flame retardant aids are preferably used because UL94V-0, which is a flame retardant standard for electronic parts, is required. The flame retardant is not particularly limited, and an organic flame retardant and an inorganic flame retardant can be used, but it is particularly preferable to use a phosphorus flame retardant.

  When the resin part (I) 2 is molded by the LDS method, it is also preferable to contain a laser-sensitive special metal complex. The metal complex can be kneaded into the thermoplastic resin in the resin compounding step. When an infrared laser beam having a wavelength of 1,064 nm is applied to the resin component (I) 2, the metal complex is decomposed into a single metal (for example, copper) and a residual organic group. By this laser treatment, the surface of the resin component (I) 2 is engraved with a three-dimensional conduction path, and by applying a plating treatment, an optimum fixing property of the circuit can be obtained. It can be accumulated as it is.

  There is no restriction | limiting in particular as a thermoplastic resin used for resin component (II) 4, The above-mentioned thermoplastic resin is used suitably. It is preferable to use the above-mentioned non-conductive reinforcing fiber as the reinforcing fiber. When the integrally molded product 1 is used as a casing of an electronic component, a flame retardant or a flame retardant aid is preferably used because UL94V-0, which is a flame retardant standard for electronic components, is required. The flame retardant is not particularly limited, and an organic flame retardant and an inorganic flame retardant can be used, but it is particularly preferable to use a phosphorus flame retardant.

  FIG. 2 is a schematic view showing an example of a suitable shape used as the resin component (I) 2. FIG. 3 is a perspective view of an integrally molded product 1 in which the resin component (I) 2 and the resin component (II) 4 shown in FIG. 2 are integrated. The shape of the resin part (I) 2 is not limited, but in order to obtain a useful bonding strength when integrated with the resin part (II) 4, at least part of the cross section perpendicular to the longitudinal direction is uneven. Is preferably formed. By forming the concavo-convex portion, the bonding area can be increased in the case of integration on a plane perpendicular to the longitudinal direction, so that the bonding strength can be improved. Moreover, since the shape which exhibits an anchor effect with respect to a longitudinal direction is provided, it is preferable from the physical strength of joining also improving.

  FIG. 4 is a schematic diagram showing an example of a suitable shape used as the resin component (I) 2. FIG. 5 is a perspective view of an integrally molded product 1 in which the resin part (I) 2 and the resin part (II) 4 having a preferable shape shown in FIG. 4 are integrated. When the resin component (I) 2 is used as an antenna structure of an electronic device, the final product size can be reduced by downsizing. The resin component (I) 2 is preferable because it has an L-shaped cross-sectional shape in the longitudinal direction, and can exhibit antenna performance with a small volume. In addition, the L-shaped shape allows it to be placed as a part of a standing wall on the side surface of the housing when integrated with the housing of the electronic device, thereby freeing up space for other parts of the electronic device. It is also preferable from the viewpoint that it can be widely taken.

  FIG. 6 is a perspective view showing an integrally molded product 1 in which a housing formed of the resin component (II) 4 and a plurality of resin components (I) 2 are integrated with each other by forming a common boundary surface. Electronic device products often require a plurality of antenna functions having different frequency bands, and thus a plurality of antenna structures may be required. As shown in FIG. 6, it is possible to satisfy various frequency band requirements by integrating a plurality of resin parts (I) 2 having different structures into a resin part (II) 4 having a casing shape. .

  FIG. 7 is a perspective view of a housing in which a member 5 is further integrated with an integrated molded product 1 in which a plurality of resin parts (I) 2 and resin parts (II) 4 are integrated. As shown in FIG. 6, the resin component (II) 4 may be formed in a casing shape, but using a separate material such as the member 5 that is lightweight and rigid can also improve the performance of the entire casing. It is preferable also from raising. The material used for the member 5 is not particularly limited, but a resin composition containing reinforcing fibers is preferably used. Examples of reinforcing fibers include metal fibers such as aluminum fibers, brass fibers and stainless steel fibers, carbon fibers such as polyacrylonitrile (PAN), rayon, lignin, and pitch, graphite fibers, glass fibers, and silicon carbide fibers. Inorganic fibers such as silicon nitride fibers, organic fibers such as aramid fibers, polyparaphenylene benzobisoxazole (PBO) fibers, polyphenylene sulfide fibers, polyester fibers, acrylic fibers, nylon fibers, and polyethylene fibers can be used. These reinforcing fibers may be used alone or in combination of two or more. Among these, carbon fibers are preferable from the viewpoint of the balance of specific strength, specific rigidity, and lightness, and at least polyacrylonitrile-based carbon fibers are preferably included from the viewpoint of excellent specific strength and specific elastic modulus.

  The member 5 may be a sheet composed of a plurality of layers containing reinforcing fibers. If the reinforcing fiber is a continuous reinforcing fiber, it is preferable because higher strength and higher rigidity can be obtained. A sheet containing continuous reinforcing fibers is a sheet in which continuous reinforcing fibers having a length of 10 mm or more are arranged inside the sheet (or in a layer containing reinforcing fibers constituting the sheet), and is not necessarily a sheet (or The layer including the reinforcing fibers constituting the sheet) does not need to be continuous over the whole, and there is no particular problem even if it is divided in the middle. Specific examples of the continuous reinforcing fiber include filaments, woven fabrics (cross), unidirectional alignment (UD), and braids (blades). From the viewpoint of process, cloth and UD are preferably used. Is done. Moreover, these forms may be used independently or may use 2 or more types together. Among these, multi-filaments that are aligned in one direction are preferable because strength and rigidity can be obtained more efficiently.

  As the member 5, a metal material may be used. Specifically, at least one selected from the group consisting of metals such as iron, stainless steel, aluminum, magnesium, copper, brass, nickel, zinc and the like is preferable, but the metal component is mainly aluminum or magnesium. Is preferable from the viewpoint of weight reduction. Here, each metal material includes an alloy.

  As an application of the integrated molded product 1 obtained by the present invention, for example, it is suitably used as a housing of a product incorporating a wireless antenna structure such as a personal computer, an OA device, a mobile phone, and a portable information terminal.

1 Integrated molded product 2 Resin parts (I)
3 Metal layer 4 Resin parts (II)
5 members

Claims (10)

Resin component (I) made of a thermoplastic resin provided with a metal layer on at least a part of its surface, and fiber-reinforced thermoplastic whose electromagnetic shielding properties measured by the KEC method are in the range of 0 dB or more and less than 20 dB in the frequency 1 GHz band A resin molded product in which a resin component (II) made of resin is integrated, wherein the resin component (I) and the resin component (II) are integrated through a common interface, and the metal layer A resin molded product in which at least a part of the resin surface is exposed and the ratio of the area of the boundary surface to the total surface area of the resin component (I) is in the range of 0.3 to 0.9. The resin molded product according to claim 1, wherein the resin molded product has an antenna transmission / reception function. The resin molded product according to claim 1 or 2, wherein at least a part of the metal layer is in contact with the resin component (II). The resin molded article according to any one of claims 1 to 3, wherein the thermoplastic resin used in the resin component (I) is a polycarbonate resin. The resin molded article according to any one of claims 1 to 3, wherein the thermoplastic resin used in the resin component (I) is a polyamide resin. The resin molded product according to any one of claims 1 to 5, wherein the resin used for the resin component (I) is made of a fiber-reinforced thermoplastic resin. The resin molded product according to any one of claims 1 to 6, wherein the resin component (I) has an uneven portion in at least a part of a cross section perpendicular to the longitudinal direction. The resin molded product according to any one of claims 1 to 7, wherein the resin component (I) has an L-shaped cross section perpendicular to the longitudinal direction. The resin molded product according to any one of claims 1 to 8, wherein the resin component (I) contains a metal complex. A housing including at least one resin molded product according to claim 1.

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