JP2016213437A - Element with built-in coil, coil antenna, electronic apparatus and manufacturing method for element with built-in coil - Google Patents

Element with built-in coil, coil antenna, electronic apparatus and manufacturing method for element with built-in coil Download PDF

Info

Publication number
JP2016213437A
JP2016213437A JP2016018791A JP2016018791A JP2016213437A JP 2016213437 A JP2016213437 A JP 2016213437A JP 2016018791 A JP2016018791 A JP 2016018791A JP 2016018791 A JP2016018791 A JP 2016018791A JP 2016213437 A JP2016213437 A JP 2016213437A
Authority
JP
Japan
Prior art keywords
coil
built
insulator
coil pattern
auxiliary member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016018791A
Other languages
Japanese (ja)
Inventor
修一 毛塚
Shuichi Kezuka
修一 毛塚
邦明 用水
Kuniaki Yosui
邦明 用水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to CN201620395821.4U priority Critical patent/CN205621552U/en
Publication of JP2016213437A publication Critical patent/JP2016213437A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Details Of Aerials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an element with a built-in coil, where a coil having a large coil diameter or coil opening is built in a laminate, without cutting the laminate by a special method, and to provide a coil antenna, an electronic apparatus including the same, and a manufacturing method for an element with a built-in coil.SOLUTION: In an element with a built-in coil where a plurality of insulator layers, each having flexibility and including an insulator layer having a coil pattern formed by a conductor, are laminated and a coil is constituted by a coil pattern, in a laminate of insulator layers, an auxiliary member is arranged at a position in the laminate overlapping a part of the coil pattern, in the plan view of the insulator layer from the lamination direction, and deformed in the lamination direction in a region where the insulator layer on which a coil pattern is formed, out of the plurality of insulator layers, overlaps the auxiliary member.SELECTED DRAWING: Figure 2

Description

本発明は、積層体内にコイルが設けられたコイル内蔵素子、それを備えたコイルアンテナ、電子機器およびコイル内蔵素子の製造方法に関する。   The present invention relates to a coil built-in element in which a coil is provided in a laminate, a coil antenna including the coil, an electronic apparatus, and a method for manufacturing the coil built-in element.

例えば、チップインダクタやチップコイルアンテナ等、内部にコイルを含む電子部品において、コイルを絶縁性基体の内部に備える場合、絶縁体層の積層体内にコイルが設けられることが多い。   For example, in an electronic component including a coil inside, such as a chip inductor or a chip coil antenna, when the coil is provided inside an insulating substrate, the coil is often provided in a laminate of insulator layers.

インダクタにおいて、限られたサイズの絶縁性基体に所定の大きなインダクタンスのコイルを設ける場合や、コイルアンテナにおいて、鎖交する磁束を多くする場合には、コイル開口の大きなコイルを形成することが重要である。また、回路基板への実装面に対してコイルに鎖交する磁束の向きが重要になる場合がある。   In inductors, it is important to form a coil with a large coil opening when a coil with a predetermined large inductance is provided on an insulating substrate of a limited size, or when a large amount of interlinkage magnetic flux is provided in a coil antenna. is there. Moreover, the direction of the magnetic flux linked to the coil with respect to the mounting surface on the circuit board may be important.

特許文献1には、内部にコイルが形成された直方体状の積層体を斜めにカットすることで、積層体内にコイル開口が傾斜したコイルを設けることが示されている。   Patent Document 1 shows that a rectangular parallelepiped laminated body having a coil formed therein is cut obliquely to provide a coil having a coil opening inclined in the laminated body.

特許第5516552号公報Japanese Patent No. 5516552

特許文献1に示されるコイル内蔵素子においては、絶縁体層の積層方向に積層体をカットすることは製造上の難易度が高い。また、製造コストが嵩むおそれがある。   In the coil-embedded element disclosed in Patent Document 1, it is difficult to manufacture the laminate in the stacking direction of the insulator layers. Moreover, there exists a possibility that manufacturing cost may increase.

本発明の目的は、積層体を特殊な方法でカットすることなく、積層体内にコイル径またはコイル開口の大きなコイルを内蔵するコイル内蔵素子、それを備えたコイルアンテナ、電子機器およびコイル内蔵素子の製造方法を提供することにある。   An object of the present invention is to provide a coil built-in element in which a coil having a large coil diameter or coil opening is built in the laminated body without cutting the laminated body by a special method, a coil antenna including the coil, an electronic device, and a coil built-in element It is to provide a manufacturing method.

(1)本発明のコイル内蔵素子は、
導体によるコイルパターンが形成された絶縁体層を含む、それぞれ可撓性を有する複数の絶縁体層が積層されて、前記絶縁体層の積層による積層体内に、前記コイルパターンによるコイルが構成されたコイル内蔵素子において、
前記絶縁体層の積層方向からの平面視で、前記コイルパターンの一部に重なる、前記積層体内の位置に補助部材が配置され、
前記複数の絶縁体層のうち前記コイルパターンが形成された絶縁体層が、補助部材と重なる領域で、前記積層方向に変形していることを特徴とする。
(1) The coil built-in element of the present invention is
A plurality of flexible insulator layers each including an insulator layer in which a coil pattern is formed by a conductor is laminated, and a coil by the coil pattern is formed in a laminate formed by laminating the insulator layers. In the coil built-in element,
In a plan view from the stacking direction of the insulator layer, an auxiliary member is disposed at a position in the stack that overlaps a part of the coil pattern,
Of the plurality of insulator layers, the insulator layer on which the coil pattern is formed is deformed in the stacking direction in a region overlapping the auxiliary member.

上記構造により、積層された絶縁体層のうち最外層の面に対してコイル開口が傾斜したコイルが積層体内に配置されることになり、そのことで、コイル径またはコイル開口の大きなコイルを内蔵するコイル内蔵素子が得られる。   With the above structure, a coil having a coil opening inclined with respect to the outermost surface of the laminated insulator layers is disposed in the laminated body, thereby incorporating a coil having a large coil diameter or coil opening. Thus, a coil built-in element is obtained.

(2)上記(1)において、前記コイルパターンが形成された絶縁体層の、前記積層方向への変形により、前記コイルの開口は、積層された前記絶縁体層のうち最外層の面に対して傾斜していることが好ましい。すなわち、そのことで、コイル径またはコイル開口の大きなコイルを内蔵するコイル内蔵素子が得られる。 (2) In the above (1), due to the deformation of the insulator layer in which the coil pattern is formed in the laminating direction, the opening of the coil is in contact with the outermost surface of the laminated insulator layer. It is preferable to be inclined. That is, the coil built-in element which incorporates a coil with a large coil diameter or coil opening by that is obtained.

(3)上記(1)または(2)において、前記補助部材は、平面視で異なる複数の領域にそれぞれ配置され、前記複数の領域は、前記コイルパターン形成層の上層側に前記補助部材が多く形成されている領域と、下層側に前記補助部材が多く形成されている領域とを有することが好ましい。これにより、コイル開口が効率よく傾斜する。 (3) In the above (1) or (2), the auxiliary members are arranged in a plurality of different regions in plan view, and the plurality of regions include a large number of the auxiliary members on the upper layer side of the coil pattern forming layer. It is preferable to have the area | region currently formed and the area | region where many said auxiliary members are formed in the lower layer side. Thereby, coil opening inclines efficiently.

(4)上記(1)から(3)のいずれかにおいて、前記補助部材は、前記コイルパターンと同じ材質で構成されていれば、補助部材専用の材料を用意する必要がなく、製造コストのアップが避けられる。 (4) In any one of the above (1) to (3), if the auxiliary member is made of the same material as the coil pattern, it is not necessary to prepare a dedicated material for the auxiliary member, which increases the manufacturing cost. Can be avoided.

(5)上記(1)から(3)のいずれかにおいて、前記補助部材は、前記絶縁体層と同じ材質で構成されていれば、補助部材専用の材料を用意する必要がなく、製造コストのアップが避けられる。 (5) In any one of the above (1) to (3), if the auxiliary member is made of the same material as the insulator layer, it is not necessary to prepare a dedicated material for the auxiliary member, and the manufacturing cost is reduced. Up is avoided.

(6)上記(1)から(3)のいずれかにおいて、前記補助部材は、前記絶縁体層とは誘電率の異なる材料で構成されていてもよい。これにより、コイルパターンとその近傍の導体との間の容量を定め易くなる。 (6) In any one of (1) to (3), the auxiliary member may be made of a material having a dielectric constant different from that of the insulator layer. Thereby, it becomes easy to determine the capacity | capacitance between a coil pattern and the conductor of the vicinity.

(7)上記(1)から(3)のいずれかにおいて、前記補助部材は、前記絶縁体層とは透磁率の異なる材料で構成されていてもよい。これにより、コイルに対する磁性体部材の配置関係によって、例えば磁路の形成や磁束の向きの制御が可能となる。 (7) In any one of (1) to (3), the auxiliary member may be made of a material having a magnetic permeability different from that of the insulator layer. Thereby, for example, formation of a magnetic path and control of the direction of magnetic flux are attained by the arrangement relationship of the magnetic body member with respect to the coil.

(8)上記(1)から(7)のいずれかにおいて、前記積層体の上面または下面は、前記積層体の全面を覆う絶縁体の層であることが好ましい。これにより、積層体の上面または下面に層界面が露出せず、表面に凹凸が生じ難くなる。 (8) In any one of the above (1) to (7), the upper surface or the lower surface of the stacked body is preferably an insulating layer that covers the entire surface of the stacked body. Thereby, the layer interface is not exposed on the upper surface or the lower surface of the laminate, and the surface is less likely to be uneven.

(9)上記(1)から(8)のいずれかにおいて、複数の絶縁体層に形成された前記コイルパターンのうち、積層方向の中央に近い絶縁体層に形成されたコイルパターンは、前記中央から離れた絶縁体層に形成されたコイルパターンに比べて径が大きいことが好ましい。これにより、積層体内へのコイルパターンの配置が容易になり、積層体内のスペースを有効に利用できる。また、異なる絶縁体層に形成されたコイルパターン同士が重なりにくくできるので、コイルパターン間の不所望な層間容量を抑えられる。 (9) In any one of the above (1) to (8), among the coil patterns formed on a plurality of insulator layers, the coil pattern formed on the insulator layer close to the center in the stacking direction is the center It is preferable that the diameter is larger than that of the coil pattern formed on the insulator layer away from the coil. Thereby, arrangement | positioning of the coil pattern in a laminated body becomes easy, and the space in a laminated body can be utilized effectively. In addition, since coil patterns formed on different insulator layers can be hardly overlapped, an undesired interlayer capacitance between coil patterns can be suppressed.

(10)本発明のコイルアンテナは、
上記(1)から(8)のいずれかに記載のコイル内蔵素子を備え、前記積層体の外面に、前記コイルパターンに導通する端子電極が形成されたことを特徴とする。
(10) The coil antenna of the present invention is
The coil-embedded element according to any one of (1) to (8) is provided, and a terminal electrode that is electrically connected to the coil pattern is formed on the outer surface of the laminate.

(11)本発明の電子機器は、
回路基板を備え、前記回路基板に上記(1)から(8)のいずれかに記載のコイル内蔵素子が実装されたことを特徴とする。
(11) The electronic apparatus of the present invention
A circuit board is provided, and the coil built-in element according to any one of (1) to (8) is mounted on the circuit board.

上記構成により、占有面積の小さなコイル内蔵素子が回路基板に実装されるので、電子機器が小型化できる。また、回路基板に対してコイル開口面が傾斜したコイルを配置することにより、回路基板に形成された導体パターンとの干渉や結合を制御できる。   With the above configuration, since the coil-embedded element with a small occupied area is mounted on the circuit board, the electronic device can be reduced in size. Further, by arranging the coil having the coil opening surface inclined with respect to the circuit board, it is possible to control interference and coupling with the conductor pattern formed on the circuit board.

(12)本発明のコイル内蔵素子の製造方法は、
導体によるコイルパターンが形成された絶縁体層を含む、それぞれ可撓性を有する複数の絶縁体層が積層されて、前記絶縁体層の積層による積層体内に、前記コイルパターンによるコイルが構成されたコイル内蔵素子の製造方法であって、
前記複数の絶縁体層に相当する複数の絶縁性基材を用意する第1工程と、
前記複数の絶縁性基材のうち所定の絶縁性基材に前記コイルパターンを形成する第2工程と、
前記絶縁性基材の平面視で、前記コイルパターンの一部に重なるように、前記絶縁性基材に対して補助部材を配置し、前記複数の絶縁性基材を積層して積層体を形成する第3工程と、
前記積層体を加圧することにより、前記コイルパターンの形成層を積層方向に変形させる第4工程と、
を有することを特徴とする。
(12) A method for manufacturing a coil built-in element according to the present invention includes:
A plurality of flexible insulator layers each including an insulator layer in which a coil pattern is formed by a conductor is laminated, and a coil by the coil pattern is formed in a laminate formed by laminating the insulator layers. A method for manufacturing an element with a built-in coil,
A first step of preparing a plurality of insulating substrates corresponding to the plurality of insulator layers;
A second step of forming the coil pattern on a predetermined insulating substrate among the plurality of insulating substrates;
In a plan view of the insulating base material, an auxiliary member is disposed on the insulating base material so as to overlap a part of the coil pattern, and the plurality of insulating base materials are stacked to form a laminate. A third step to perform,
A fourth step of deforming the coil pattern forming layer in the stacking direction by pressurizing the stack;
It is characterized by having.

上記構成により、積層された絶縁体層のうち最外層の面に対してコイル開口が傾斜するコイルが積層体内に配置されたコイル内蔵素子が得られる。   With the above configuration, a coil built-in element is obtained in which a coil whose coil opening is inclined with respect to the outermost surface of the laminated insulator layers is arranged in the laminate.

(12)上記(11)において、前記絶縁性基材は熱可塑性樹脂からなり、前記第4工程は、前記積層体を加熱プレスにより一体成型する工程であることが好ましい。これにより、樹脂流動性によって、コイルパターンの形成層を積層方向へ大きく変形させることができる。 (12) In the above (11), the insulating base material is preferably made of a thermoplastic resin, and the fourth step is preferably a step of integrally molding the laminate by a hot press. Thereby, the formation layer of a coil pattern can be greatly deform | transformed in the lamination direction by resin fluidity | liquidity.

本発明によれば、積層された絶縁体層のうち最外層の面に対してコイル開口が傾斜したコイルが積層体内に配置されることになり、そのことで、コイル径またはコイル開口の大きなコイルを内蔵するコイル内蔵素子や、鎖交する磁束の向きが定められたコイル内蔵素子が得られる。また、そのコイル内蔵素子を備えるコイルアンテナおよび電子機器が得られる。   According to the present invention, a coil whose coil opening is inclined with respect to the outermost surface of the laminated insulator layers is disposed in the laminated body, and thus a coil having a large coil diameter or coil opening is arranged. And a built-in coil element in which the direction of the interlinkage magnetic flux is determined. In addition, a coil antenna and an electronic device including the coil built-in element can be obtained.

図1は第1の実施形態に係るコイル内蔵素子101の斜視図である。FIG. 1 is a perspective view of a coil built-in element 101 according to the first embodiment. 図2はコイル内蔵素子101の分解斜視図である。FIG. 2 is an exploded perspective view of the coil built-in element 101. 図3は、コイル内蔵素子101の図1におけるA−A部分の断面図である。3 is a cross-sectional view of the AA portion in FIG. 図4(A)はコイル内蔵素子101の断面図、図4(B)は比較例のコイル内蔵素子101Sの断面図である。4A is a cross-sectional view of the coil built-in element 101, and FIG. 4B is a cross-sectional view of the coil built-in element 101S of the comparative example. 図5(A)はコイル内蔵素子101の断面図、図5(B)は図5(A)において楕円で囲んだ部分の拡大図、図5(C)は楕円で囲んだ部分の、積層加圧前の状態を示す断面図である。5A is a cross-sectional view of the coil built-in element 101, FIG. 5B is an enlarged view of a portion surrounded by an ellipse in FIG. 5A, and FIG. It is sectional drawing which shows the state before pressing. 図6は第2の実施形態に係るコイル内蔵素子102の分解斜視図である。FIG. 6 is an exploded perspective view of the coil built-in element 102 according to the second embodiment. 図7は第3の実施形態に係るコイル内蔵素子103の分解斜視図である。FIG. 7 is an exploded perspective view of the coil built-in element 103 according to the third embodiment. 図8はコイル内蔵素子103の断面図である。FIG. 8 is a cross-sectional view of the coil built-in element 103. 図9は第4の実施形態に係るコイル内蔵素子104の斜視図である。FIG. 9 is a perspective view of the coil built-in element 104 according to the fourth embodiment. 図10は第5の実施形態に係るコイル内蔵素子105の分解斜視図である。FIG. 10 is an exploded perspective view of the coil built-in element 105 according to the fifth embodiment. 図11はコイル内蔵素子105の断面図である。FIG. 11 is a cross-sectional view of the coil built-in element 105. 図12(A)は、回路基板200にコイル内蔵素子101が実装された状態での斜視図であり、図12(B)はその状態での断面図である。FIG. 12A is a perspective view in a state where the coil built-in element 101 is mounted on the circuit board 200, and FIG. 12B is a cross-sectional view in that state.

以降、図を参照して幾つかの具体的な例を挙げて、本発明を実施するための複数の形態を示す。各図中には同一箇所に同一符号を付している。要点の説明または理解の容易性を考慮して、便宜上実施形態を分けて示すが、異なる実施形態で示した構成の部分的な置換または組み合わせが可能である。第2の実施形態以降では第1の実施形態と共通の事柄についての記述を省略し、異なる点についてのみ説明する。特に、同様の構成による同様の作用効果については実施形態毎には逐次言及しない。   Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but the components shown in different embodiments can be partially replaced or combined. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

《第1の実施形態》
図1は第1の実施形態に係るコイル内蔵素子101の模式的な斜視図である。図1では、積層体90の内部を透視したように表している。このコイル内蔵素子101は例えばコイルアンテナとして使用される。
<< First Embodiment >>
FIG. 1 is a schematic perspective view of a coil built-in element 101 according to the first embodiment. In FIG. 1, the inside of the laminate 90 is shown as seen through. The coil built-in element 101 is used as a coil antenna, for example.

コイル内蔵素子101は、導体によるコイルパターン11,12が形成された絶縁体層を含む。絶縁体層の積層による積層体90内に、コイルパターン11,12およびビア導体V11,V12,V13によるコイルが構成されている。コイル内蔵素子101の実装面(積層体90の外面)には端子電極51,52が形成されている。ここで、端子電極51,52も含めると、端子電極51→ビア導体V11→コイルパターン11→ビア導体V12→コイルパターン12→ビア導体V13→端子電極52の経路で、約1.5ターン分のコイルが構成される。   The coil built-in element 101 includes an insulator layer in which coil patterns 11 and 12 are formed of a conductor. A coil 90 composed of coil patterns 11 and 12 and via conductors V11, V12, and V13 is formed in a laminate 90 formed by laminating insulator layers. Terminal electrodes 51 and 52 are formed on the mounting surface of the coil built-in element 101 (the outer surface of the multilayer body 90). Here, when the terminal electrodes 51 and 52 are also included, about 1.5 turns in the path of the terminal electrode 51 → the via conductor V11 → the coil pattern 11 → the via conductor V12 → the coil pattern 12 → the via conductor V13 → the terminal electrode 52. A coil is configured.

積層体90は直方体状であり、図1に示す直交座標系でX−Y面に平行な面を実装面とすれば、コイルパターン11,12によるコイルの巻回軸はZ軸方向から傾いている。図1に示す例では、Y軸回りでθ方向に傾いている。   The laminated body 90 has a rectangular parallelepiped shape, and if the surface parallel to the XY plane in the orthogonal coordinate system shown in FIG. 1 is a mounting surface, the winding axis of the coil by the coil patterns 11 and 12 is inclined from the Z-axis direction. Yes. In the example shown in FIG. 1, it is inclined in the θ direction around the Y axis.

図2はコイル内蔵素子101の分解斜視図である。図3は、コイル内蔵素子101の図1におけるA−A部分の断面図である。コイル内蔵素子101の積層体90は、絶縁体層S1,S2,S3,S4、第1補助部材61,62および第2補助部材71,72を含む。絶縁体層S2の下面にコイルパターン11、絶縁体層S3の下面にコイルパターン12がそれぞれ形成されている。絶縁体層S1の下面には端子電極51,52が形成されている。   FIG. 2 is an exploded perspective view of the coil built-in element 101. 3 is a cross-sectional view of the AA portion in FIG. The laminated body 90 of the coil built-in element 101 includes insulator layers S1, S2, S3, S4, first auxiliary members 61 and 62, and second auxiliary members 71 and 72. A coil pattern 11 is formed on the lower surface of the insulator layer S2, and a coil pattern 12 is formed on the lower surface of the insulator layer S3. Terminal electrodes 51 and 52 are formed on the lower surface of the insulator layer S1.

絶縁体層S1〜S4および補助部材61,62,71,72は、例えばそれぞれ液晶ポリマー(LCP)シート等の可撓性を有するシートであり、コイルパターン11,12は、例えばパターン化されたCu箔等の金属箔である。   The insulator layers S1 to S4 and the auxiliary members 61, 62, 71 and 72 are each a flexible sheet such as a liquid crystal polymer (LCP) sheet, and the coil patterns 11 and 12 are, for example, patterned Cu. Metal foil such as foil.

第1補助部材61,62および第2補助部材71,72は、絶縁体層S1〜S4の積層方向(Z軸方向)からの平面視で、コイルパターン11,12の一部に重なる。   The first auxiliary members 61 and 62 and the second auxiliary members 71 and 72 overlap a part of the coil patterns 11 and 12 in a plan view from the stacking direction (Z-axis direction) of the insulator layers S1 to S4.

第1補助部材61,62および第2補助部材71,72は、平面視で異なる複数の領域にそれぞれ配置される。この複数の領域は、コイルパターン11,12の形成層の上層側に補助部材が多く形成されている領域と下層側に補助部材が多く形成されている領域を有する。本実施形態では、第1補助部材61,62はコイルパターン11,12より下層側でX軸方向の一方端寄り(図2、図3に示す視点で右寄り)に配置され、第2補助部材71,72はコイルパターン11,12より上層側でX軸方向の他方端寄り(図2、図3に示す視点で左寄り)に配置される。すなわち、絶縁体層の面に沿ってコイル巻回領域の中心を通る線に対し左右非対称位置に補助部材が配置されている。   The first auxiliary members 61 and 62 and the second auxiliary members 71 and 72 are respectively arranged in a plurality of different regions in plan view. The plurality of regions include a region in which many auxiliary members are formed on the upper layer side of the formation layer of the coil patterns 11 and 12 and a region in which many auxiliary members are formed on the lower layer side. In the present embodiment, the first auxiliary members 61 and 62 are disposed on the lower layer side of the coil patterns 11 and 12 and closer to one end in the X-axis direction (rightward from the viewpoint shown in FIGS. 2 and 3). , 72 are arranged on the upper layer side of the coil patterns 11 and 12 and closer to the other end in the X-axis direction (leftward from the viewpoint shown in FIGS. 2 and 3). That is, the auxiliary member is disposed at an asymmetrical position with respect to a line passing through the center of the coil winding region along the surface of the insulator layer.

第1補助部材61,62の形状・大きさは異なる。コイルパターン11,12に積層方向に近い側の補助部材62は遠い側の補助部材61に比べて、積層体90の端面から内方への延伸量が小さい。また、第2補助部材71,72の形状・大きさは異なる。コイルパターン11,12に積層方向に近い側の補助部材72は遠い側の補助部材71に比べて、積層体90の端面から内方への延伸量が小さい。   The shapes and sizes of the first auxiliary members 61 and 62 are different. The auxiliary member 62 on the side closer to the coil pattern 11, 12 in the laminating direction has a smaller amount of extension from the end face of the laminated body 90 inward than the auxiliary member 61 on the far side. The shape and size of the second auxiliary members 71 and 72 are different. The auxiliary member 72 closer to the coil pattern 11, 12 in the stacking direction has a smaller amount of extension from the end face of the stacked body 90 inward than the auxiliary member 71 farther from the coil pattern 11, 12.

コイル内蔵素子101は例えば次の工程により製造される。   The coil built-in element 101 is manufactured by the following process, for example.

[第1工程]
金属箔を一方主面に有する複数の絶縁性基材、例えばCu箔を一方主面に有する、熱可塑性樹脂である液晶ポリマー(LCP)シートを用意する。
[First step]
A plurality of insulating substrates having a metal foil on one main surface, for example, a liquid crystal polymer (LCP) sheet, which is a thermoplastic resin, having a Cu foil on one main surface is prepared.

[第2工程]
複数の絶縁性基材のうち所定の絶縁性基材(後に絶縁体層S2,S3となる絶縁性基材)に金属箔をパターニングすることによりコイルパターン11,12を形成する。また、ビア導体V11,V12,V13に対応する位置に穴を形成し、その穴に導電性ペーストを充填することにより、ビア導体V11,V12,V13を形成する。
[Second step]
Coil patterns 11 and 12 are formed by patterning a metal foil on a predetermined insulating base material (insulating base material that will later become insulator layers S2 and S3) among the plurality of insulating base materials. Also, via conductors V11, V12, and V13 are formed by forming holes at positions corresponding to the via conductors V11, V12, and V13 and filling the holes with a conductive paste.

[第3工程]
絶縁性基材の平面視で、コイルパターン11,12の一部に重なるように、絶縁性基材に対して絶縁性基材と同一の材料からなる補助部材61,62,71,72を配置し、複数の絶縁性基材を積層してマザー基板状態の積層体を形成する。
[Third step]
Auxiliary members 61, 62, 71, 72 made of the same material as the insulating base material are arranged on the insulating base material so as to overlap a part of the coil patterns 11, 12 in a plan view of the insulating base material. Then, a plurality of insulating base materials are laminated to form a laminated body in a mother substrate state.

[第4工程]
マザー基板状態の積層体を加熱プレスにより一体成型することにより、コイルパターン11,12の形成層を積層方向に変形させる。その後、マザー基板状態の積層体から個別の積層体90に切り出す。
[Fourth step]
By integrally molding the laminated body in a mother substrate state with a heat press, the formation layers of the coil patterns 11 and 12 are deformed in the laminating direction. Thereafter, the laminate is cut into individual laminates 90 from the mother substrate state laminate.

図2に示した各絶縁体層S1〜S4と補助部材61,62,71,72とを積層し、加圧することにより、絶縁体層S2,S3に補助部材61,62,71,72によって偶力のモーメントが加わり、変形する。それに伴い、コイルパターン11,12の部分的な積層方向の位置が変位する。その結果、図1、図2、図3に示したように、コイル巻回軸AXが積層方向(Z軸方向)から傾いた(積層された絶縁体層のうちの最外層の面に対してコイル開口が傾斜した)コイルが積層体90内に構成される。   Each of the insulator layers S1 to S4 and the auxiliary members 61, 62, 71, 72 shown in FIG. A force moment is applied and deformed. Accordingly, the positions of the coil patterns 11 and 12 in the partial stacking direction are displaced. As a result, as shown in FIGS. 1, 2, and 3, the coil winding axis AX is inclined from the stacking direction (Z-axis direction) (with respect to the outermost surface of the stacked insulator layers). A coil having a coil opening inclined is formed in the laminate 90.

図4(A)は、本実施形態のコイル内蔵素子101の断面図、図4(B)は比較例のコイル内蔵素子101Sの断面図である。比較例のコイル内蔵素子101Sは、補助部材が無く、絶縁体層S1,S2間に絶縁体層S5が設けられ、絶縁体層S3,S4間に絶縁体層S6を設けられている。   FIG. 4A is a cross-sectional view of the coil built-in element 101 of the present embodiment, and FIG. 4B is a cross-sectional view of a coil built-in element 101S of the comparative example. The coil-embedded element 101S of the comparative example has no auxiliary member, an insulator layer S5 is provided between the insulator layers S1 and S2, and an insulator layer S6 is provided between the insulator layers S3 and S4.

コイルパターン11,12の部分的な積層方向の変位により、コイル内蔵素子101が備えるコイルの開口径Aは、比較例のコイル内蔵素子101Sが備えるコイルの開口径Bより大きい。このように、積層体90の外形サイズの割に(相対的に)、コイル径、コイル開口の大きなコイルを内蔵するコイル内蔵素子が得られる。このコイル内蔵素子をコイルアンテナとして用いる場合に、通信相手側アンテナとの結合度の高いコイルアンテナとなる。   Due to the partial displacement of the coil patterns 11 and 12 in the stacking direction, the coil opening diameter A of the coil built-in element 101 is larger than the coil opening diameter B of the coil built-in element 101S of the comparative example. In this way, a coil built-in element that incorporates a coil having a large coil diameter and coil opening (relatively) relative to the outer size of the laminate 90 is obtained. When this coil built-in element is used as a coil antenna, the coil antenna has a high degree of coupling with the communication partner antenna.

図5(A)はコイル内蔵素子101の断面図、図5(B)は図5(A)において楕円で囲んだ部分の拡大図、図5(C)は上記楕円で囲んだ部分の、積層加圧前の状態を示す断面図である。図5(A)において楕円で囲んだ部分は、第2補助部材71、絶縁体層S3および絶縁体層S4の三面界面である。このような三面界面は、相対的に大きな樹脂流動が生じる箇所であるため、凹凸が生じやすく、いびつな形状となる場合がある。しかし、絶縁体層S4は積層体90の全面を覆う層であるので、上記三面界面は絶縁体層S4の内面側に内包される。そのため、絶縁体層S4は上記凹凸を吸収し、積層体90の上面は平坦となる。   5A is a cross-sectional view of the coil built-in element 101, FIG. 5B is an enlarged view of a portion surrounded by an ellipse in FIG. 5A, and FIG. 5C is a stacked portion of the portion surrounded by the ellipse. It is sectional drawing which shows the state before pressurization. In FIG. 5A, the part surrounded by an ellipse is the three-surface interface of the second auxiliary member 71, the insulator layer S3, and the insulator layer S4. Since such a three-surface interface is a portion where a relatively large resin flow occurs, irregularities are likely to occur, and an irregular shape may occur. However, since the insulator layer S4 is a layer that covers the entire surface of the multilayer body 90, the three-surface interface is included in the inner surface side of the insulator layer S4. Therefore, the insulator layer S4 absorbs the unevenness, and the upper surface of the stacked body 90 becomes flat.

図5(B)(C)では、絶縁体層S4を含む三面界面について示したが、絶縁体層S1を含む三面界面についても同様であり、積層体90の下面も平坦となる。   5B and 5C show the three-surface interface including the insulator layer S4, the same applies to the three-surface interface including the insulator layer S1, and the lower surface of the stacked body 90 is also flat.

本実施形態によれば、絶縁体層と補助部材とを、同一の熱可塑性樹脂による絶縁性基材で構成したので、接着剤を用いることなく、加熱・加圧により簡単な工法で一体化できる。また、異種材料の界面を少なくでき、界面での剥離が起こりにくい素子が構成される。   According to this embodiment, since the insulator layer and the auxiliary member are made of an insulating base material made of the same thermoplastic resin, they can be integrated by a simple construction method by heating and pressing without using an adhesive. . In addition, an element can be formed in which the interface between different materials can be reduced and peeling at the interface hardly occurs.

《第2の実施形態》
第2の実施形態では、補助部材の形状および材質が第1の実施形態とは異なるコイル内蔵素子102について示す。
<< Second Embodiment >>
In the second embodiment, a coil built-in element 102 in which the shape and material of the auxiliary member are different from those in the first embodiment is shown.

図6は第2の実施形態に係るコイル内蔵素子102の分解斜視図である。コイル内蔵素子102は、絶縁体層S1,S2,S3,S4,S5,S6、第1補助部材60および第2補助部材70を含む。絶縁体層S4の下面にコイルパターン11、絶縁体層S5の下面にコイルパターン12がそれぞれ形成されている。絶縁体層S1の下面には端子電極51,52が形成されている。   FIG. 6 is an exploded perspective view of the coil built-in element 102 according to the second embodiment. The coil built-in element 102 includes insulator layers S1, S2, S3, S4, S5 and S6, a first auxiliary member 60 and a second auxiliary member 70. A coil pattern 11 is formed on the lower surface of the insulator layer S4, and a coil pattern 12 is formed on the lower surface of the insulator layer S5. Terminal electrodes 51 and 52 are formed on the lower surface of the insulator layer S1.

絶縁体層S1〜S6は、例えばそれぞれ液晶ポリマー(LCP)のシートであり、コイルパターン11,12は、例えばパターン化されたCu箔である。第1補助部材60および第2補助部材70はそれぞれポリテトラフルオロエチレン(PTFE)の部材である。   The insulator layers S1 to S6 are, for example, liquid crystal polymer (LCP) sheets, and the coil patterns 11 and 12 are, for example, patterned Cu foils. The first auxiliary member 60 and the second auxiliary member 70 are each made of polytetrafluoroethylene (PTFE).

第1補助部材60および第2補助部材70は、絶縁体層S1〜S6の積層方向(Z軸方向)からの平面視で、コイルパターン11,12の一部に重なる。本実施形態では、第1補助部材60はコイルパターン11,12より下層側でX軸方向の一方端寄り(図6に示す視点で右寄り)に配置され、第2補助部材70はコイルパターン11,12より上層側でX軸方向の他方端寄り(図6に示す視点で左寄り)に配置される。   The first auxiliary member 60 and the second auxiliary member 70 overlap a part of the coil patterns 11 and 12 in a plan view from the stacking direction (Z-axis direction) of the insulator layers S1 to S6. In the present embodiment, the first auxiliary member 60 is disposed on the lower layer side of the coil patterns 11 and 12 and closer to one end in the X-axis direction (rightward from the viewpoint shown in FIG. 6), and the second auxiliary member 70 includes the coil patterns 11 and 12. 12 on the upper layer side and closer to the other end in the X-axis direction (to the left from the viewpoint shown in FIG. 6).

図6に示した各絶縁体層S1〜S6と補助部材60,70とを積層し、加熱・加圧することで一体成型する。その加熱・加圧の際、絶縁体層S3,S4,S5に補助部材60,70によって偶力のモーメントが加わり、変形する。それに伴い、コイルパターン11,12の部分的な積層方向の位置が変位する。その結果、第1の実施形態で示したコイル内蔵素子101と同様に、コイル巻回軸が積層方向(Z軸方向)から傾いたコイルが積層体内に構成される。   Each insulator layer S1 to S6 and auxiliary members 60 and 70 shown in FIG. 6 are laminated and integrally molded by heating and pressing. During the heating and pressurization, a moment of couple is applied to the insulator layers S3, S4, and S5 by the auxiliary members 60 and 70, and the insulator layers S3, S4, and S5 are deformed. Accordingly, the positions of the coil patterns 11 and 12 in the partial stacking direction are displaced. As a result, like the coil built-in element 101 shown in the first embodiment, a coil in which the coil winding axis is inclined from the stacking direction (Z-axis direction) is formed in the stack.

本実施形態によれば、補助部材60,70は絶縁体層S1〜S6よりも低誘電率であるので、コイルパターン11,12とこれらに対向する位置に形成される導体パターンとの間に補助部材60,70を配置することにより、上記導体パターンとコイルパターン11,12との間に生じる容量を低減できる。図6に示した例では、コイルパターン11と端子電極52との間に生じる容量が低減される。   According to the present embodiment, since the auxiliary members 60 and 70 have a lower dielectric constant than the insulator layers S1 to S6, the auxiliary members 60 and 70 are auxiliary between the coil patterns 11 and 12 and the conductor pattern formed at a position facing them. By disposing the members 60 and 70, the capacitance generated between the conductor pattern and the coil patterns 11 and 12 can be reduced. In the example shown in FIG. 6, the capacitance generated between the coil pattern 11 and the terminal electrode 52 is reduced.

なお、補助部材60,70を絶縁体層S1〜S6よりも高誘電率の部材とすることもできる。その場合には、コイルパターン11,12とこれらに対向する位置に形成される導体パターンとの間に補助部材60,70を配置することにより、上記導体パターンとコイルパターン11,12との間に生じる容量を増大させることができる。例えば、その容量でコイルアンテナの共振周波数の調整(設定)を行ってよい。また、上記容量とコイルとでフィルタを構成することもできる。   The auxiliary members 60 and 70 may be members having a higher dielectric constant than the insulator layers S1 to S6. In that case, the auxiliary members 60 and 70 are arranged between the coil patterns 11 and 12 and the conductor patterns formed at positions facing them, so that the conductor patterns and the coil patterns 11 and 12 are interposed. The resulting capacity can be increased. For example, the resonance frequency of the coil antenna may be adjusted (set) with the capacity. Moreover, a filter can also be comprised with the said capacity | capacitance and a coil.

《第3の実施形態》
第3の実施形態では、補助部材を磁芯として利用する例を示す。図7は第3の実施形態に係るコイル内蔵素子103の分解斜視図であり、図8はコイル内蔵素子103の断面図である。
<< Third Embodiment >>
In 3rd Embodiment, the example which utilizes an auxiliary member as a magnetic core is shown. FIG. 7 is an exploded perspective view of the coil built-in element 103 according to the third embodiment, and FIG. 8 is a cross-sectional view of the coil built-in element 103.

コイル内蔵素子103は、絶縁体層S1,S2,S3,S4,S5,S6、磁性体部材80、第1補助部材60および第2補助部材70を含む。絶縁体層S4の下面にコイルパターン11、絶縁体層S5の下面にコイルパターン12がそれぞれ形成されている。絶縁体層S1の下面には端子電極51,52が形成されている。   The coil built-in element 103 includes insulator layers S1, S2, S3, S4, S5 and S6, a magnetic member 80, a first auxiliary member 60 and a second auxiliary member 70. A coil pattern 11 is formed on the lower surface of the insulator layer S4, and a coil pattern 12 is formed on the lower surface of the insulator layer S5. Terminal electrodes 51 and 52 are formed on the lower surface of the insulator layer S1.

絶縁体層S1〜S6は、例えばそれぞれ液晶ポリマー(LCP)のシートであり、コイルパターン11,12は、例えばパターン化されたCu箔である。第1補助部材60および第2補助部材70はそれぞれ磁性体フェライトの部材である。磁性体部材80も同様の磁性体フェライトの部材である。これにより、絶縁体層S1〜S6と、第1補助部材60および第2補助部材70とは透磁率が異なる材料で構成されている。   The insulator layers S1 to S6 are, for example, liquid crystal polymer (LCP) sheets, and the coil patterns 11 and 12 are, for example, patterned Cu foils. The first auxiliary member 60 and the second auxiliary member 70 are each a magnetic ferrite member. The magnetic member 80 is also a similar magnetic ferrite member. Thereby, the insulator layers S1 to S6 and the first auxiliary member 60 and the second auxiliary member 70 are made of materials having different magnetic permeability.

コイルパターン11,12に対する補助部材60,70の配置位置は、第2の実施形態で図6に示したコイル内蔵素子102と同様である。磁性体部材80は、補助部材60,70の中間的な位置に配置される。そして、磁性体部材80はコイルパターン11,12およびビア導体V11,V12,V13によるコイルの内部に配置される。   The arrangement positions of the auxiliary members 60 and 70 with respect to the coil patterns 11 and 12 are the same as those of the coil built-in element 102 shown in FIG. 6 in the second embodiment. The magnetic member 80 is disposed at an intermediate position between the auxiliary members 60 and 70. And the magnetic body member 80 is arrange | positioned inside the coil by the coil patterns 11 and 12 and the via conductors V11, V12, and V13.

上記補助部材60,70および磁性体部材80はコイルのインダクタンスを高める。また、補助部材60,70および磁性体部材80配置方向は、積層方向(Z軸方向)から傾いているので、その方向に磁束が向く。したがって、このコイル内蔵素子103をコイルアンテナとして使用する場合、補助部材60,70および磁性体部材80配置方向によって指向性もたせることができる。   The auxiliary members 60 and 70 and the magnetic member 80 increase the inductance of the coil. Further, since the auxiliary members 60 and 70 and the magnetic member 80 are disposed in the direction inclined from the stacking direction (Z-axis direction), the magnetic flux is directed in that direction. Therefore, when this coil-embedded element 103 is used as a coil antenna, directivity can be given depending on the arrangement direction of the auxiliary members 60 and 70 and the magnetic member 80.

なお、上記補助部材60,70および磁性体部材80には、焼結磁性体以外に、磁性体フェライトフィラーを分散させたポリイミド(PI)や液晶ポリマー(LCP)などの樹脂シートを用いてもよい。   The auxiliary members 60 and 70 and the magnetic member 80 may be made of a resin sheet such as polyimide (PI) or liquid crystal polymer (LCP) in which a magnetic ferrite filler is dispersed in addition to the sintered magnetic body. .

《第4の実施形態》
第4の実施形態は、これまでに示した実施形態とは異なるコイルパターンを備えるコイル内蔵素子について示す。
<< Fourth Embodiment >>
The fourth embodiment shows a coil built-in element having a coil pattern different from the embodiments shown so far.

図9は第4の実施形態に係るコイル内蔵素子104の模式的な斜視図である。コイル内蔵素子104は、導体によるコイルパターン11,12,13が形成された絶縁体層を含む。絶縁体層の積層による積層体90内に、コイルパターン11,12,13およびビア導体V11,V12,V13,V14によるコイルが構成されている。コイル内蔵素子104の実装面(積層体90の外面)には端子電極51,52が形成されている。ここで、端子電極51,52も含めると、端子電極51→ビア導体V11→コイルパターン11→ビア導体V12→コイルパターン12→ビア導体V13→コイルパターン13→ビア導体V14→端子電極52の経路で、約1.5ターン分のコイルが構成される。   FIG. 9 is a schematic perspective view of the coil built-in element 104 according to the fourth embodiment. The coil built-in element 104 includes an insulator layer in which coil patterns 11, 12, and 13 are formed of a conductor. In the laminate 90 formed by laminating insulator layers, coils are formed by the coil patterns 11, 12, 13 and via conductors V11, V12, V13, V14. Terminal electrodes 51 and 52 are formed on the mounting surface of the coil built-in element 104 (the outer surface of the multilayer body 90). Here, when the terminal electrodes 51 and 52 are also included, the path of the terminal electrode 51 → the via conductor V11 → the coil pattern 11 → the via conductor V12 → the coil pattern 12 → the via conductor V13 → the coil pattern 13 → the via conductor V14 → the terminal electrode 52. A coil of about 1.5 turns is configured.

第1の実施形態で図1に示した例と異なり、コイルパターン11,12,13のそれぞれは約1/2ターンのパターンである。このように、各層のコイルパターンの長さが短い場合にも適用できる。   Unlike the example shown in FIG. 1 in the first embodiment, each of the coil patterns 11, 12, and 13 is a pattern of about 1/2 turn. Thus, the present invention can also be applied when the length of the coil pattern of each layer is short.

《第5の実施形態》
第5の実施形態では、これまでに示した実施形態とは更に異なるコイルパターンを備えるコイル内蔵素子について示す。
<< Fifth Embodiment >>
In the fifth embodiment, a coil built-in element having a coil pattern that is further different from the embodiments shown so far will be described.

図10は第5の実施形態に係るコイル内蔵素子105の模式的な斜視図である。図11は、コイル内蔵素子105の主要部の断面図である。コイル内蔵素子105は複数の絶縁体層S1,S2,S3,S4,S5,S6,S7、第1補助部材60および第2補助部材70を含む。絶縁体層S2,S3,S4,S5,S6には、導体によるコイルパターン11,12,13,14,15がそれぞれ形成されている。絶縁体層S1〜S6にはビア導体V11〜V16が形成されている。絶縁体層S1の下面には端子電極51,52が形成されている。   FIG. 10 is a schematic perspective view of the coil built-in element 105 according to the fifth embodiment. FIG. 11 is a cross-sectional view of the main part of the coil built-in element 105. The coil built-in element 105 includes a plurality of insulator layers S1, S2, S3, S4, S5, S6, S7, a first auxiliary member 60, and a second auxiliary member 70. Insulator layers S2, S3, S4, S5, and S6 are formed with coil patterns 11, 12, 13, 14, and 15 of conductors, respectively. Via conductors V11 to V16 are formed in the insulator layers S1 to S6. Terminal electrodes 51 and 52 are formed on the lower surface of the insulator layer S1.

絶縁体層S1〜S7は、例えばそれぞれ液晶ポリマー(LCP)のシートであり、コイルパターン11〜15は、例えばパターン化されたCu箔である。第1補助部材60および第2補助部材70はそれぞれ液晶ポリマー(LCP)のシートまたはポリテトラフルオロエチレン(PTFE)等の部材である。   The insulator layers S1 to S7 are, for example, liquid crystal polymer (LCP) sheets, and the coil patterns 11 to 15 are, for example, patterned Cu foils. The first auxiliary member 60 and the second auxiliary member 70 are members such as a liquid crystal polymer (LCP) sheet or polytetrafluoroethylene (PTFE), respectively.

絶縁体層S5,S6および第2補助部材70は、それらの左側端部がコイル内蔵素子105の左端に寄せられ、絶縁体層S2,S3および第1補助部材60は、それらの右側端部がコイル内蔵素子105の右端に寄せられた状態に配置される。絶縁体層S1,S4,S7のX軸方向の幅は絶縁体層S5のX軸方向の幅より大きい。また、絶縁体層S3,S5のX軸方向の幅は絶縁体層S2,S6のX軸方向の幅より大きい。さらに、絶縁体層S2,S6のX軸方向の幅は補助部材60,70のX軸方向の幅より大きい。   The insulator layers S5 and S6 and the second auxiliary member 70 have their left end portions brought close to the left end of the coil-embedded element 105, and the insulator layers S2 and S3 and the first auxiliary member 60 have their right end portions The coil built-in element 105 is arranged in a state of being brought close to the right end. The width of the insulator layers S1, S4, S7 in the X-axis direction is larger than the width of the insulator layer S5 in the X-axis direction. The width of the insulator layers S3 and S5 in the X-axis direction is larger than the width of the insulator layers S2 and S6 in the X-axis direction. Further, the width of the insulator layers S2, S6 in the X-axis direction is larger than the width of the auxiliary members 60, 70 in the X-axis direction.

これら絶縁体層の積層による積層体90内に、コイルパターン11〜15およびビア導体V11〜V16によるコイルが構成されている。端子電極51,52も含めると、端子電極51→ビア導体V11→コイルパターン15→ビア導体V12→コイルパターン14→ビア導体V13→コイルパターン13→ビア導体V14→コイルパターン12→ビア導体V15→コイルパターン11→ビア導体V16→端子電極52の経路で、約4.5ターン分のコイルが構成される。   In the laminate 90 formed by laminating these insulator layers, coils are formed by the coil patterns 11 to 15 and the via conductors V11 to V16. If the terminal electrodes 51 and 52 are also included, the terminal electrode 51 → via conductor V11 → coil pattern 15 → via conductor V12 → coil pattern 14 → via conductor V13 → coil pattern 13 → via conductor V14 → coil pattern 12 → via conductor V15 → coil A coil of about 4.5 turns is formed in the path of pattern 11 → via conductor V16 → terminal electrode 52.

図11に表れているように、複数の絶縁体層に形成されたコイルパターン11〜15のうち、積層方向の中央に近い絶縁体層に形成されたコイルパターンは、中央から離れた絶縁体層に形成されたコイルパターンに比べて径が大きい。本実施形態では、絶縁体層S4に形成されたコイルパターン13の径は他の絶縁体層に形成されたコイルパターンの径より大きい。   As shown in FIG. 11, among the coil patterns 11 to 15 formed in the plurality of insulator layers, the coil pattern formed in the insulator layer near the center in the stacking direction is the insulator layer separated from the center. The diameter is larger than the coil pattern formed on. In this embodiment, the diameter of the coil pattern 13 formed in the insulator layer S4 is larger than the diameter of the coil patterns formed in other insulator layers.

本実施形態によれば、各絶縁体層に径の等しいコイルパターンを形成する場合に比べて、積層体90内へのコイルパターンの配置が容易になり、積層体90内のスペースを有効に利用できる。また、異なる絶縁体層に形成されたコイルパターン同士が重なりにくくできるので、コイルパターン間の不所望な層間容量を抑えられる。   According to this embodiment, compared with the case where coil patterns having the same diameter are formed in each insulator layer, the coil pattern can be easily arranged in the laminate 90, and the space in the laminate 90 can be used effectively. it can. In addition, since coil patterns formed on different insulator layers can be hardly overlapped, an undesired interlayer capacitance between coil patterns can be suppressed.

なお、絶縁体層S2と絶縁体層S6のX軸方向の幅は異なっていてもよい。同様に、絶縁体層S3と絶縁体層S5のX軸方向の幅は異なっていてもよい。また、補助部材60と補助部材70のX軸方向の幅は異なっていてもよい。   Note that the widths of the insulator layer S2 and the insulator layer S6 in the X-axis direction may be different. Similarly, the width of the insulator layer S3 and the insulator layer S5 in the X-axis direction may be different. Further, the widths of the auxiliary member 60 and the auxiliary member 70 in the X-axis direction may be different.

《第6の実施形態》
第6の実施形態では、コイル内蔵素子を備える電子機器の例を示す。図12(A)は、回路基板200にコイル内蔵素子101が実装された状態での斜視図であり、図12(B)はその状態での断面図である。回路基板200には導体パターン91,92,93,94,95等が設けられている。電子機器は、コイル内蔵素子101が実装された回路基板200を備える。コイル内蔵素子101の構成は第1の実施形態で示したとおりである。
<< Sixth Embodiment >>
In the sixth embodiment, an example of an electronic device including a coil built-in element is shown. FIG. 12A is a perspective view in a state where the coil built-in element 101 is mounted on the circuit board 200, and FIG. 12B is a cross-sectional view in that state. The circuit board 200 is provided with conductor patterns 91, 92, 93, 94, 95 and the like. The electronic device includes a circuit board 200 on which the coil built-in element 101 is mounted. The configuration of the coil built-in element 101 is as shown in the first embodiment.

図12(B)に表れているように、コイル内蔵素子101内の下部に導体パターン91,92が存在するが、その間に所定の隙間がある。コイル内蔵素子101のコイル巻回軸AXは上記隙間の方向を向くように、回路基板200の実装面の法線方向に対して傾いている。そのため、コイルアンテナの指向性はコイル巻回軸AX方向に傾き、コイルを鎖交する磁束は導体パターン91,92の影響を受けにくい。   As shown in FIG. 12B, conductor patterns 91 and 92 are present in the lower part of the coil built-in element 101, and there is a predetermined gap therebetween. The coil winding axis AX of the coil built-in element 101 is inclined with respect to the normal direction of the mounting surface of the circuit board 200 so as to face the gap. Therefore, the directivity of the coil antenna is inclined in the direction of the coil winding axis AX, and the magnetic flux interlinking the coils is not easily affected by the conductor patterns 91 and 92.

図12(B)に示した例では、磁束が導体パターン91,92間を通過する例を示したが、面状に広がるグランド導体等で、コイル内蔵素子101の下方全体が覆われていてもよい。その場合でも、磁束φで示すように、コイル内蔵素子101の側方を通過することができるので、コイルアンテナとして作用する。   In the example shown in FIG. 12B, an example is shown in which the magnetic flux passes between the conductor patterns 91 and 92. However, even if the entire lower part of the coil built-in element 101 is covered with a ground conductor or the like spreading in a planar shape. Good. Even in that case, as shown by the magnetic flux φ, it can pass through the side of the coil built-in element 101, so that it acts as a coil antenna.

本実施形態によれば、コイル内蔵素子101の近傍に導体パターンや周辺部品が存在する場合に、磁束の通る通路を曲げて、上記近傍の導体パターンや周辺部品に接近しない経路で磁束が通るように設計することができる。そのことにより、周辺部品との不要な結合が抑制できる。また、限られた体積の積層体に対して有効サイズの大きなアンテナコイルを形成することができる。   According to the present embodiment, when a conductor pattern or a peripheral component is present in the vicinity of the coil-embedded element 101, a path through which the magnetic flux passes is bent so that the magnetic flux passes through a path that does not approach the nearby conductor pattern or the peripheral component. Can be designed to As a result, unnecessary coupling with peripheral components can be suppressed. In addition, an antenna coil having a large effective size can be formed for a laminated body having a limited volume.

《他の実施形態》
以上に示した各実施形態では、積層体の上面または下面が、積層体の全面を覆う絶縁体の層で構成されている例を示したが、この全面を覆う絶縁体の層は絶縁体層とは別の材質の層であってもよい。例えば、レジスト膜であってもよい。
<< Other embodiments >>
In each of the embodiments described above, the example in which the upper surface or the lower surface of the stacked body is configured by an insulating layer that covers the entire surface of the stacked body has been described. The insulating layer that covers the entire surface is an insulating layer. It may be a layer made of a different material. For example, a resist film may be used.

以上に示した各実施形態では、補助部材に絶縁体を用いたが、導体パターンを補助部材として設けてもよい。その場合の導体パターンは、ダミーの導体パターンであることが他の導体パターンと意図しない短絡を起こしてしまう等の電気特性の変化を起こりにくくできるので好ましい。但し、導体パターンはコイルパターンと電気的に導通していてもよい。   In each of the embodiments described above, an insulator is used as the auxiliary member, but a conductor pattern may be provided as the auxiliary member. In this case, it is preferable that the conductor pattern is a dummy conductor pattern because it is difficult to cause a change in electrical characteristics such as an unintended short circuit with other conductor patterns. However, the conductor pattern may be electrically connected to the coil pattern.

なお、絶縁体層と補助部材とを、同一の熱可塑性樹脂による絶縁性基材で構成することは、接着剤を用いることなく、加熱・加圧により簡単な工法で一体化でき、また、異種材料の界面を少なくでき、界面での剥離が起こりにくい素子が構成される点で好ましい。   It should be noted that the insulator layer and the auxiliary member are made of an insulating base material made of the same thermoplastic resin, and can be integrated by a simple construction method by heating and pressing without using an adhesive. This is preferable in that an interface between materials can be reduced and an element in which peeling at the interface hardly occurs is configured.

以上に示した各実施形態では、直方体状の、またはそれを重ねたステップ状の、補助部材を設ける例を示したが、補助部材は、コイルの中央方向を向く稜部を面取りした、または丸めた、台形状であってもよい。そのことにより、コイルパターンが形成された絶縁体層はスロープ状に滑らかに傾斜しやすくなり、コイル開口面の全体が傾斜しやすくなる。   In each of the embodiments described above, an example in which the auxiliary member having a rectangular parallelepiped shape or a step shape in which the auxiliary members are stacked is shown. However, the auxiliary member has a chamfered or rounded ridge portion facing the central direction of the coil. It may also be trapezoidal. As a result, the insulator layer on which the coil pattern is formed easily slopes smoothly in a slope shape, and the entire coil opening surface easily tilts.

以上に示した各実施形態では、第1補助部材と第2補助部材を設ける例を示したが、いずれか一方の補助部材だけを設けてもよい。また、コイルパターンの上下に、平面視で重なる位置にそれぞれ補助部材が配置されてもよい。その場合でも、平面視で異なる複数の領域に補助部材がそれぞれ配置されていて、コイルパターンの形成層の上層側に補助部材が多く形成されている領域と、補助部材が下層側に多く形成されている領域とを有すればよい。   In each embodiment shown above, although the example which provides a 1st auxiliary member and a 2nd auxiliary member was shown, you may provide only any one auxiliary member. In addition, auxiliary members may be arranged above and below the coil pattern at positions overlapping in plan view. Even in such a case, the auxiliary members are arranged in a plurality of different regions in plan view, and the auxiliary member is formed on the upper layer side of the coil pattern forming layer and the auxiliary member is formed on the lower layer side. It is sufficient to have a region that has

以上に示した各実施形態では、主にコイルアンテナとして用いる例を示したが、インダクタ部品として用いてもよい。その場合でもコイル開口を大きくとれ、限られた体積の積層体に対して有効サイズが大きく、インダクタンスの大きいインダクタ部品を得ることができる。また、コイルの磁束の向きが傾斜するので、例えば周辺部品や回路基板との不要な結合も抑制できる。   In each embodiment shown above, although the example mainly used as a coil antenna was shown, you may use as an inductor component. Even in that case, the coil opening can be made large, and an inductor component having a large effective size and a large inductance can be obtained with respect to the laminated body having a limited volume. Further, since the direction of the magnetic flux of the coil is inclined, unnecessary coupling with peripheral components and a circuit board can be suppressed, for example.

最後に、上述の実施形態の説明は、すべての点で例示であって、制限的なものではない。当業者にとって変形および変更が適宜可能である。例えば、異なる実施形態で示した構成の部分的な置換または組み合わせが可能である。本発明の範囲は、上述の実施形態ではなく、特許請求の範囲によって示される。さらに、本発明の範囲には、特許請求の範囲内と均等の範囲内での実施形態からの変更が含まれる。   Finally, the description of the above embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. For example, partial replacements or combinations of the configurations shown in the different embodiments are possible. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

AX…コイル巻回軸
S1,S2,S3,S4,S5,S6,S7…絶縁体層
V11,V12,V13,V14,V15,V16…ビア導体
11,12,13,14,15…コイルパターン
51,52…端子電極
60,61,62…第1補助部材
70,71,72…第2補助部材
80…磁性体部材
90…積層体
91,92,93,94,95…導体パターン
101,102,103,104,105…コイル内蔵素子
101S…比較例のコイル内蔵素子
200…回路基板
AX ... Coil winding axis S1, S2, S3, S4, S5, S6, S7 ... Insulator layers V11, V12, V13, V14, V15, V16 ... Via conductors 11, 12, 13, 14, 15 ... Coil pattern 51 , 52 ... terminal electrodes 60, 61, 62 ... first auxiliary members 70, 71, 72 ... second auxiliary member 80 ... magnetic body member 90 ... laminates 91, 92, 93, 94, 95 ... conductor patterns 101, 102, 103, 104, 105... Coil-embedded element 101S...

Claims (13)

導体によるコイルパターンが形成された絶縁体層を含む、それぞれ可撓性を有する複数の絶縁体層が積層されて、前記絶縁体層の積層による積層体内に、前記コイルパターンによるコイルが構成されたコイル内蔵素子において、
前記絶縁体層の積層方向からの平面視で、前記コイルパターンの形成層の一部に重なる、前記積層体内の位置に補助部材が配置され、
前記複数の絶縁体層のうち前記コイルパターンが形成された絶縁体層が、補助部材と重なる領域で、前記積層方向に変形していることを特徴とする、コイル内蔵素子。
A plurality of flexible insulator layers each including an insulator layer in which a coil pattern is formed by a conductor is laminated, and a coil by the coil pattern is formed in a laminate formed by laminating the insulator layers. In the coil built-in element,
In a plan view from the stacking direction of the insulator layer, an auxiliary member is disposed at a position in the stack that overlaps a part of the coil pattern forming layer,
The coil built-in element, wherein an insulator layer in which the coil pattern is formed among the plurality of insulator layers is deformed in the stacking direction in a region overlapping with an auxiliary member.
前記コイルパターンが形成された絶縁体層の、前記積層方向への変形により、前記コイルの開口は、積層された前記絶縁体層のうち最外層の面に対して傾斜している、請求項1に記載のコイル内蔵素子。   The opening of the coil is inclined with respect to the surface of the outermost layer of the laminated insulator layers by deformation of the insulator layer on which the coil pattern is formed in the lamination direction. The coil built-in element of description. 前記補助部材は、平面視で異なる複数の領域にそれぞれ配置され、前記複数の領域は、前記コイルパターンの形成層の上層側に前記補助部材が多く形成されている領域と、下層側に前記補助部材が多く形成されている領域とを有する、請求項1または2に記載のコイル内蔵素子。   The auxiliary members are respectively arranged in a plurality of different regions in plan view, and the plurality of regions include a region where many auxiliary members are formed on the upper layer side of the coil pattern forming layer and the auxiliary members on a lower layer side. The element with a built-in coil according to claim 1, having a region in which many members are formed. 前記補助部材は、前記コイルパターンと同じ材質で構成されている、請求項1から3のいずれかに記載のコイル内蔵素子。   The coil built-in element according to claim 1, wherein the auxiliary member is made of the same material as the coil pattern. 前記補助部材は、前記絶縁体層と同じ材質で構成されている、請求項1から3のいずれかに記載のコイル内蔵素子。   The coil built-in element according to claim 1, wherein the auxiliary member is made of the same material as the insulator layer. 前記補助部材は、前記絶縁体層とは誘電率の異なる材料で構成されている、請求項1から3のいずれかに記載のコイル内蔵素子。   The coil built-in element according to claim 1, wherein the auxiliary member is made of a material having a dielectric constant different from that of the insulator layer. 前記補助部材は、前記絶縁体層とは透磁率の異なる材料で構成されている、請求項1から3のいずれかに記載のコイル内蔵素子。   The coil built-in element according to claim 1, wherein the auxiliary member is made of a material having a magnetic permeability different from that of the insulator layer. 前記積層体の上面および下面は、前記積層体の全面を覆う絶縁体の層である、請求項1から7のいずれかに記載のコイル内蔵素子。   The coil built-in element according to any one of claims 1 to 7, wherein an upper surface and a lower surface of the multilayer body are insulator layers covering the entire surface of the multilayer body. 複数の絶縁体層に形成された前記コイルパターンのうち、積層方向の中央に近い絶縁体層に形成されたコイルパターンは、前記中央から離れた絶縁体層に形成されたコイルパターンに比べて径が大きい、請求項1から8のいずれかに記載のコイル内蔵素子。   Of the coil patterns formed on the plurality of insulator layers, the coil pattern formed on the insulator layer close to the center in the stacking direction has a diameter larger than that of the coil pattern formed on the insulator layer away from the center. The coil built-in element according to any one of claims 1 to 8, wherein: 請求項1から9のいずれかに記載のコイル内蔵素子を備え、前記積層体の外面に、前記コイルパターンに導通する端子電極が形成されたコイルアンテナ。   A coil antenna comprising the coil built-in element according to claim 1, wherein a terminal electrode that is electrically connected to the coil pattern is formed on an outer surface of the laminated body. 回路基板を備えた電子機器において、前記回路基板に請求項1から8のいずれかに記載のコイル内蔵素子が実装された電子機器。   The electronic device provided with the circuit board, The electronic device by which the element with a built-in coil in any one of Claim 1 to 8 was mounted in the said circuit board. 導体によるコイルパターンが形成された絶縁体層を含む、それぞれ可撓性を有する複数の絶縁体層が積層されて、前記絶縁体層の積層による積層体内に、前記コイルパターンによるコイルが構成されたコイル内蔵素子の製造方法であって、
前記複数の絶縁体層に相当する複数の絶縁性基材を用意する第1工程と、
前記複数の絶縁性基材のうち所定の絶縁性基材に前記コイルパターンを形成する第2工程と、
前記絶縁性基材の平面視で、前記コイルパターンの一部に重なるように、前記絶縁性基材に対して補助部材を配置し、前記複数の絶縁性基材を積層して積層体を形成する第3工程と、
前記積層体を加圧することにより、前記コイルパターンの形成層を積層方向に変形させる第4工程と、
を有する、コイル内蔵素子の製造方法。
A plurality of flexible insulator layers each including an insulator layer in which a coil pattern is formed by a conductor is laminated, and a coil by the coil pattern is formed in a laminate formed by laminating the insulator layers. A method for manufacturing an element with a built-in coil,
A first step of preparing a plurality of insulating substrates corresponding to the plurality of insulator layers;
A second step of forming the coil pattern on a predetermined insulating substrate among the plurality of insulating substrates;
In a plan view of the insulating base material, an auxiliary member is disposed on the insulating base material so as to overlap a part of the coil pattern, and the plurality of insulating base materials are stacked to form a laminate. A third step to perform,
A fourth step of deforming the coil pattern forming layer in the stacking direction by pressurizing the stack;
The manufacturing method of the element with a built-in coil which has.
前記絶縁性基材は熱可塑性樹脂からなり、前記第4工程は、前記積層体を加熱プレスにより一体成型する工程である、請求項12に記載のコイル内蔵素子の製造方法。   The method for manufacturing a coil built-in element according to claim 12, wherein the insulating base is made of a thermoplastic resin, and the fourth step is a step of integrally forming the laminate by a hot press.
JP2016018791A 2015-05-08 2016-02-03 Element with built-in coil, coil antenna, electronic apparatus and manufacturing method for element with built-in coil Pending JP2016213437A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620395821.4U CN205621552U (en) 2015-05-08 2016-05-04 Coil embeds component, coil antenna and electronic equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015095645 2015-05-08
JP2015095645 2015-05-08

Publications (1)

Publication Number Publication Date
JP2016213437A true JP2016213437A (en) 2016-12-15

Family

ID=57550095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016018791A Pending JP2016213437A (en) 2015-05-08 2016-02-03 Element with built-in coil, coil antenna, electronic apparatus and manufacturing method for element with built-in coil

Country Status (1)

Country Link
JP (1) JP2016213437A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111986874A (en) * 2019-05-24 2020-11-24 株式会社村田制作所 Laminated coil component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111986874A (en) * 2019-05-24 2020-11-24 株式会社村田制作所 Laminated coil component

Similar Documents

Publication Publication Date Title
KR102672445B1 (en) wireless charging coil
JP5381956B2 (en) Coil parts
JP5614479B2 (en) Coil parts manufacturing method
US8159322B2 (en) Laminated coil
US9520223B2 (en) Inductor and method for manufacturing the same
US10374305B2 (en) Multilayer substrate and electronic device
JP2019016743A (en) Multilayer substrate
JP6070895B2 (en) Multilayer coil element, antenna module, and wireless communication module
WO2012053439A1 (en) Coil component and method for producing same
US11424063B2 (en) Multilayer substrate and method for manufacturing same
US9196410B2 (en) Chip inductor and method of manufacturing the same
US9934905B2 (en) Method of manufacturing multilayer board, multilayer board, and electromagnet
JP6388015B2 (en) Coil parts and coil equipment
US11540393B2 (en) Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device
JP2018182024A (en) Coil component
JP2019016742A (en) Multilayer substrate
US9742051B2 (en) High-frequency signal transmission line and manufacturing method thereof
US11217372B2 (en) Coil component
US11309113B2 (en) Multilayer substrate, actuator, and method of manufacturing multilayer substrate
US20220130592A1 (en) Multilayer resin substrate and method of manufacturing multilayer resin substrate
KR20160040446A (en) Layered inductor
CN104637650A (en) Multi-layer type inductor
JP2016213437A (en) Element with built-in coil, coil antenna, electronic apparatus and manufacturing method for element with built-in coil
US20220130593A1 (en) Multilayer resin substrate and method of manufacturing multilayer resin substrate
TWI810628B (en) Method for manufacturing electronic component