JP2016212989A - Method for producing dendritic copper powder, copper paste, conductive coating material and conductive sheet using the dendritic copper powder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for industrially efficiently producing dendritic copper powder, in dendritic copper powder, capable of controlling a specific surface area value to a suitable range at a low cost, and a conductive paste, a conductive coating material and a conductive sheet using the dendritic copper powder obtained by the production method.SOLUTION: Provided is a method for producing dendritic copper powder where electrolysis is performed using copper ions and an alkylene oxide derivative to precipitate dendritic copper powder at the cathode, in which the concentration of the alkylene oxide derivative in the sulfuric acid acidic solution is 1 to 10,000 mg/L.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for producing a dendritic copper powder, and more specifically, a method for producing a fine dendritic copper powder by controlling a specific surface area, and a mixture of one or more kinds of the obtained dendritic copper powder. The present invention relates to a conductive copper paste, a conductive paint, and a conductive sheet.

  For the formation of wiring layers, electrodes, and the like in electronic devices, pastes using metal fillers such as silver powder and copper powder, such as resin pastes and fired pastes, are frequently used. That is, after applying or printing a metal filler paste of silver or copper on various substrates, a conductive film that becomes a wiring layer, an electrode, or the like can be formed by heat curing or heat firing.

  For example, a resin-type conductive paste is made of a metal filler, a resin, a curing agent, a solvent, etc., printed on a conductor circuit pattern or terminal, and cured by heating at 100 ° C. to 200 ° C. An electrode is formed. In the resin-type conductive paste, since the thermosetting resin is cured and contracted by heat, when the metal filler is pressed and brought into contact, the metal filler overlaps and an electrically connected current path is formed. Since this resin-type conductive paste is processed at a curing temperature of 200 ° C. or less, it is used for a substrate using a heat-sensitive material such as a printed wiring board.

  Firing-type conductive paste is made of a metal filler, glass, solvent, etc., printed on a conductor circuit pattern or terminal, and heated and fired at 600 ° C. to 800 ° C. to form wiring and electrodes as a conductive film. To do. The fired conductive paste is processed at a high temperature to sinter the metal filler and ensure conductivity. Although this firing-type conductive paste has a high firing temperature, it cannot be used for printed wiring boards that use resin materials, but it can realize low resistance because the metal filler is sintered by high-temperature treatment. Become. Therefore, the fired conductive paste is used for an external electrode of a multilayer ceramic capacitor.

  Silver powder is often used as the metal filler used in such resin-type conductive pastes and fired-type conductive pastes, but due to the demand for lower costs, copper powder that is cheaper than silver powder tends to be used. It is in.

  Well, regarding the copper powder, electrolytic copper powder deposited in dendritic shape called dendritic shape is known, and since the shape is dendritic, the surface area is large, and formability and sinterability are excellent Therefore, it is used as a raw material for oil-impregnated bearings and machine parts for powder metallurgy.

  In particular, oil-impregnated bearings and the like have been reduced in size, and accordingly, the copper powder used as a raw material is required to have a porous shape and a reduced thickness, and a more complicated shape. In order to satisfy such a demand, in Patent Document 1, by developing a dendritic shape, the adjacent branches of copper powder are intertwined and firmly connected at the time of compression molding, resulting in high strength. It has been shown that it can be molded.

  Moreover, when using as a conductive paste or a metal filler for electromagnetic wave shielding, since it is dendritic shape, it can utilize that a contact can be increased compared with spherical copper powder. However, when using dendritic copper powder for applications such as conductive paste, the particle size of ordinary dendritic copper powder is very large. Therefore, in patent document 2, it is supposed that after making the oil for antioxidants adhere to dendritic copper powder, it grind | pulverizes with a jet mill and refines | miniaturizes.

  Moreover, in patent document 3, manufacture of the rod-shaped copper powder obtained by pulverizing particle-shaped dendritic copper powder as a copper powder for conductive paint which has good solderability and can be soldered A method is disclosed. Specifically, dendritic copper powder having a maximum particle size of 44 μm or less is crushed with a pulverizer to form rod-shaped copper powder having an average particle size of 10 μm or less, and this copper powder is pickled with an inorganic acid or an organic acid. It shows a method for producing a copper powder for conductive paint that can be soldered by processing, dissolving and removing the oxide film on the surface of the copper powder, washing with water, spraying a quick-drying organic solvent, and drying with hot air.

  Also in Patent Document 4, since the dendritic electrolytic copper powder cannot be used as it is in order to use it as a metal filler such as a conductive paste, a high-pressure jet stream swirl vortex method in an air atmosphere or an inert atmosphere Is used to obtain spherical or granular fine copper powder having an average particle diameter of 1 to 6 μm.

  Furthermore, as a method for producing dendritic copper powder, Patent Document 5 discloses that the size of the electrolytic cell, the number of electrodes, the distance between the electrodes, and the circulation amount of the electrolytic solution are adjusted, and the copper ion concentration of the electrolytic solution near the electrode is adjusted. It is shown that a suitable dendrite-like copper powder can be obtained by adjusting it so that the copper ion concentration of the electrolyte solution between the electrodes is always thinner than the copper ion concentration of the electrolyte solution at the bottom of the electrolytic cell. Has been.

  Further, Patent Document 6 shows that a fine copper powder of several μm can be obtained by adding gelatin and chlorine to an acidic copper sulfate electrolytic bath to produce an electrolytic copper powder.

Japanese Patent No. 46976643 Japanese Patent No. 4230017 JP-A-6-158103 Japanese Patent No. 5181434 Japanese Patent No. 5320442 Japanese Patent Laid-Open No. 2-138491

  Here, when the dendritic copper powder is used as a metal filler such as a conductive paste or an electromagnetic shielding resin, the dendritic copper powder is intertwined when the metal filler in the resin has a dendritic shape. Patent Document 1 points out that there is a problem that agglomeration occurs and the resin does not uniformly disperse in the resin, and that the viscosity of the paste increases due to agglomeration, causing a problem in wiring formation by printing.

  However, in order to improve the electrical conductivity, the above-mentioned dendritic shape is easier to secure the contact than the granular shape, so that it is possible to ensure high conductivity as a conductive paste or electromagnetic wave shield. It can be said that it is an effective shape. Therefore, if the shape can be controlled while ensuring high conductivity and the dendritic copper powder does not aggregate, it can be used as a metal filler such as a more effective conductive paste or electromagnetic shielding resin. It becomes possible. When the dendritic shape is represented by another index, it is considered effective to use the specific surface area as an index. The higher the specific surface area value, the finer and denser the dendritic shape is.

  On the other hand, when trying to apply the technique described in Patent Document 5 to a mass production process of actual operation, it is not easy to manage the above-described manufacturing conditions uniformly, and in particular, copper concentration ions in the electrolytic cell are unevenly distributed. Management requires technically sophisticated management. The technique described in Patent Document 6 is to obtain fine copper powder by growing copper powder to be electrodeposited in a specific orientation by the interaction between gelatin and chlorine, and the shape of the obtained copper powder is spherical. It is not dendritic.

  The present invention has been proposed in view of the above-described circumstances, and in a dendritic copper powder, a dendron capable of controlling the specific surface area value within an appropriate range at an industrially efficient and low cost. It aims at providing the manufacturing method of a copper-like powder. Moreover, it aims at providing a conductive paste, a conductive coating material, and a conductive sheet using the dendritic copper powder obtained by such a manufacturing method.

  The inventors of the present invention have made extensive studies in order to solve the above-described problems. As a result, it has been found that dendritic copper powder having a controlled specific surface area can be obtained by an electrolytic method using a sulfuric acid acidic copper bath containing an alkylene oxide derivative at a specific ratio, and the present invention has been completed. That is, the present invention provides the following.

  (1) According to a first aspect of the present invention, dendritic copper powder is deposited on a cathode by electrolysis using a sulfuric acid acidic solution containing copper ions and an alkylene oxide derivative, and the alkylene in the sulfuric acid acidic solution is The density | concentration of an oxide derivative is 1 mg / L-10000 mg / L, It is a manufacturing method of the dendritic copper powder characterized by the above-mentioned.

［式（１）中、ＥＯは−ＣＨ_２ＣＨ_２Ｏ−を示す。ここで、ａ、ｂ、ｃ、ｄはＥＯの平均付加モル数であり、ａ、ｂ、ｃ、ｄの合計平均付加モル数は１０〜２０である。］

［式（２）中、ＰＯは−ＣＨ_２ＣＨ（ＣＨ_３）Ｏ−を示す。ここで、ｅ、ｆ、ｇ、ｈはＰＯの平均付加モル数であり、ｅ、ｆ、ｇ、ｈの合計平均付加モル数は１０〜２０である。］ (2) According to a second invention of the present invention, in the first invention, the alkylene oxide derivative is at least one selected from the group of compounds represented by the following formula (1) and the following formula (2). It is the manufacturing method of the dendritic copper powder characterized.

[In the formula (1), EO represents —CH ₂ CH ₂ O—. Here, a, b, c and d are the average added mole numbers of EO, and the total average added mole number of a, b, c and d is 10 to 20. ]

[In the formula (2), PO represents —CH ₂ CH (CH ₃ ) O—. Here, e, f, g, and h are average addition mole numbers of PO, and the total average addition mole number of e, f, g, and h is 10-20. ]

  (3) According to a third aspect of the present invention, in the first or second aspect, the sulfuric acid acidic solution contains chloride ions at a ratio of 0 mg / L to 500 mg / L. It is a manufacturing method of a copper powder.

  (4) A fourth invention of the present invention is the method for producing a dendritic copper powder according to the third invention, wherein the chloride ion is hydrochloric acid or sodium chloride.

  (5) A fifth invention of the present invention is the dendritic copper powder according to any one of the first to fourth inventions, wherein the concentration of the copper ions is 1 g / L to 20 g / L. It is a manufacturing method.

It (6) Sixth aspect of the present invention, in any of the first to fifth, the specific surface area of the dendritic copper powder ^is 0.6m ² /g~5.0m 2 / g It is the manufacturing method of the dendritic copper powder characterized by these.

  (7) According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the crystallite diameter in the Miller index of the (111) plane by X-ray diffraction of the dendritic copper powder is from 500 to 3000 mm. It is the manufacturing method of the dendritic copper powder characterized by being.

  (8) The eighth invention of the present invention is obtained by mixing one type of dendritic copper powder obtained by the production method according to any one of the first to seventh inventions or two or more types having different specific surface areas. It is a metal filler characterized by this.

  (9) A ninth invention of the present invention is a conductive paste comprising a metal filler according to the eighth invention mixed with a resin.

  (10) The tenth invention of the present invention is an electromagnetic wave shielding conductive paint characterized in that the metal filler according to the eighth invention is dispersed in a resin.

  (11) An eleventh invention of the present invention is an electromagnetic wave shielding conductive sheet, wherein the metal filler according to the eighth invention is dispersed in a resin.

  According to the method for producing a dendritic copper powder according to the present invention, by an electrolytic method using an acidic copper bath containing an alkylene oxide derivative, the specific surface area of the dendritic copper powder can be controlled according to its use, A fine and optimally shaped dendritic copper powder can be produced. Furthermore, the specific surface area of the dendritic copper powder can be more appropriately controlled by including chloride ions in the sulfuric acid copper bath.

  Moreover, the dendritic copper powder obtained by this manufacturing method can be suitably used as a conductive paste or an electromagnetic shielding application by mixing two or more kinds of dendritic copper powders having different specific surface areas into a metal filler. it can.

It is a graph which shows the relationship of the BET specific surface area with respect to the density | concentration of the polyoxyethylene methyl glucoside (addition mole number 10) in Example 1 (brand name: Macbiobride MG-10E). 6 is a graph showing the relationship of the BET specific surface area to the chloride ion concentration in Example 2. FIG. It is a graph which shows the relationship of the crystallite diameter with respect to the density | concentration of the polyoxyethylene methyl glucoside (addition mole number 10) in Example 3 (brand name: Macbiobride MG-10E). It is a graph which shows the relationship of the BET specific surface area with respect to the density | concentration of the polyoxypropylene methyl glucoside (addition mole number 10) in Example 4 (brand name: Macbiobride MG-10P). The concentration of polyoxyethylene methyl glucoside (added mole number 10) in Example 5 (trade name: Macbiobride MG-10E) was adjusted to 1000 mg / L, and polyoxypropylene methyl glucoside (added mole number 10) (product) It is a graph which shows the relationship of a BET specific surface area when the density | concentration of a name: Macbiobride MG-10P) is changed.

  Hereinafter, a specific embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described in detail. The present invention is not limited to the following embodiments, and can be implemented with appropriate modifications within the scope of the object of the present invention. Further, in this specification, the expression “X to Y” (X and Y are arbitrary numerical values) means “X or more and Y or less”.

<< 1. Dendritic copper powder shape >>
When the copper powder according to the present embodiment is observed using a scanning electron microscope (SEM), the copper powder exhibits a dendritic precipitation state, and the dendritic copper powder (hereinafter referred to as “dendritic copper”). the specific surface area of also called powder ") is 0.6m ² /g~5.0m ² / g, more preferably 1.0m ² /g~2.5m ² / g. The specific surface area value becomes an index representing the dendritic shape, and the higher the specific surface area value, the finer and denser the dendritic shape becomes. The dendritic copper powder is characterized in that the crystallite diameter in the Miller index of the (111) plane by X-ray diffraction belongs to the range of 500 Å (angstrom) to 3000 Å.

  The specific surface area and crystallite diameter of these dendritic copper powders can be controlled by changing the electrolysis conditions described later. In addition, the specific surface area of the dendritic copper powder can be further adjusted to a desired value by adding mechanical grinding such as jet mill, sample mill, cyclone mill, and bead mill as necessary. is there.

Regarding the specific surface area value, when the specific surface area value of the dendritic copper powder is less than 0.6 m ² / g, the average particle diameter is large, and the development of the tree branches of each particle is insufficient, resulting in a rough shape. Therefore, when it uses as metal fillers, such as an electrically conductive paste, the contact between the dendritic copper powders decreases and electroconductivity may fall. On the other hand, when the specific surface area value of the dendritic copper powder exceeds 5.0 m ² / g, the average particle diameter is small, and the dendrites of each particle are developed and densely formed. When used as a filler, dendritic copper powders may be entangled and aggregated to reduce dispersibility, and the paste may thicken and printability may decrease. In addition, a specific surface area value can be measured based on JISZ8830: 2013 as a BET specific surface area.

  In addition, regarding the crystallite diameter, if the crystallite diameter of the dendritic copper powder is less than 500 mm, the shape tends to be rounded and approach a spherical shape instead of a dendritic shape, and a sufficiently large contact area can be secured. It becomes difficult and there is a possibility that the conductivity is lowered. On the other hand, if the crystallite diameter exceeds 3000 mm, moldability may be deteriorated when mixed with a resin with a conductive paste or the like or dispersed in the resin.

Here, the crystallite diameter is obtained from a diffraction pattern obtained by an X-ray diffraction measurement device based on Scherrer's calculation formula shown below, and is a (111) plane mirror by X-ray diffraction. It is the crystallite diameter in the index.
D = 0.9λ / βcos θ
(D: crystallite diameter (Å), β: diffraction peak spread (rad) depending on crystallite size, λ: X-ray wavelength [CuKα] (Å), θ: diffraction angle (°).

≪2. Method for producing dendritic copper powder >>
The fine dendritic copper powder according to the present embodiment can be produced by a predetermined electrolytic method using, for example, a sulfuric acid acidic solution containing copper ions and an alkylene oxide derivative as an electrolytic solution. Moreover, you may make a chloride ion contain in a sulfuric acid acidic solution as needed.

  In electrolysis (electrolysis), for example, the above-described sulfuric acid-containing electrolytic solution containing copper ions in an electrolytic cell in which metallic copper is used as an anode (anode) and a stainless plate or titanium plate is used as a cathode (cathode) And electrolytic treatment is performed by applying a direct current to the electrolytic solution at a predetermined current density. Thereby, a fine dendritic copper powder can be deposited (electrodeposited) on the cathode with energization. In particular, in the present embodiment, a fine dendritic copper powder having a controlled specific surface area and crystallite diameter can be precipitated by adding an alkylene oxide derivative to a sulfuric acid copper sulfate solution.

[Copper ion]
Copper ions can be supplied using a water-soluble copper salt. Examples of the water-soluble copper salt include, but are not limited to, copper sulfate such as copper sulfate pentahydrate and copper nitrate. Alternatively, copper oxide may be used as the water-soluble copper salt, and it may be dissolved in a sulfuric acid solution described later to form a sulfuric acid acidic solution containing copper ions.

  Although it does not specifically limit as copper ion concentration in electrolyte solution, It is preferable that it is 1g / L-20g / L, More preferably, it is 5g / L-15g / L, 5g / L-10g / L. Is more preferable. If the copper ion concentration is too high, it becomes difficult to form dendritic copper powder on the cathode during electrolysis, and a film-like electrolytic copper may be formed, but a copper ion concentration of 20 g / L or less. Therefore, dendritic copper powder can be deposited without any problem. On the other hand, the lower limit of the copper ion concentration is preferably 1 g / L or more in consideration of efficiently depositing dendritic copper powder from the cathode during electrolysis.

[Sulfuric acid (sulfuric acid electrolyte)]
In the present embodiment, the electrolytic solution is sulfuric acid. It contains sulfuric acid to make a sulfuric acid electrolyte.

  The concentration of sulfuric acid in the electrolytic solution is preferably 20 g / L to 300 g / L, more preferably 50 g / L to 150 g / L, as the free sulfuric acid concentration. Since the sulfuric acid concentration affects the conductivity of the electrolyte, it affects the uniformity of the copper powder obtained on the cathode. The concentration of sulfuric acid also affects the solubility of copper ions. Whether the sulfuric acid concentration is too low or too high, the solubility of copper ions becomes low, and copper sulfate crystals may be deposited in the electrolyte.

[Additive]
In the present embodiment, an alkylene oxide derivative is included as an additive in a sulfuric acid electrolyte. In this electrolysis, dendritic copper powder having a different specific surface area is deposited according to the amount of the additive added to the electrolytic solution. Therefore, it is necessary to change the amount added according to the desired specific surface area. For example, alkylene oxide derivatives, by adding so as to contain a concentration of 1mg / L~10000mg / L, the specific surface area to obtain a dendritic copper powder 0.6m ² /g~5.0m ² / g be able to. Further, dendritic copper powder having a crystallite diameter of 500 to 3000 Å can be obtained according to the content concentration of the alkylene oxide derivative.

  By including chloride ions in the sulfuric acid acidic electrolyte, the specific surface area and crystallite diameter of the obtained dendritic copper powder can be controlled more appropriately. The content concentration of chloride ions is not particularly limited, but is preferably 1 mg / L to 500 mg / L.

(Alkylene oxide derivatives)
Specifically, the type of the alkylene oxide derivative is not particularly limited, but one type of alkylene oxide derivative having a different molecular structure or molecular weight may be used alone, or two or more types may be used in combination.

  As specific examples of the alkylene oxide derivative, for example, one or more selected from the group of compounds represented by the following formula (1) and the following formula (2) can be used.

The compound represented by formula (1) is as follows, in the formula (1) in, EO represents an _-CH 2 _CH 2 O-. Here, a, b, c and d are the average added mole numbers of EO, and the total average added mole number of a, b, c and d is 10 to 20. The total average added mole number can be determined by measuring the weight average molecular weight.

  Examples of the compound represented by the formula (1) include polyoxyethylene methyl glucoside (EO total average 10 mol adduct), polyoxyethylene methyl glucoside (EO total average 20 mol adduct), and the like.

Moreover, it is as follows of the compound represented by formula (2), in the formula (2), PO is _-CH 2 CH _(CH 3) O- are shown. Here, e, f, g, and h are average addition mole numbers of PO, and the total average addition mole number of e, f, g, and h is 10-20. The total average added mole number can be determined by measuring the weight average molecular weight.

  Examples of the compound represented by the formula (2) include polyoxypropylene methyl glucoside (PO total average 10 mol adduct), polyoxypropylene methyl glucoside (PO total average 20 mol adduct), and the like.

  Moreover, alkylene oxide derivatives other than the compounds represented by the above formula (1) and the above formula (2) can also be used. Specifically, for example, polyethylene glycol, polypropylene glycol, polyoxyethylene polyoxypropylene glycol, polyoxypropylene glyceryl ether, polyoxyethylene polyoxypropylene glyceryl ether, polyoxyethylene polyoxypropylene trimethylolpropane, polyoxypropylene diethylene Glyceryl ether, polyoxyethylene polyoxypropylene pentaerythritol ether, polyoxypropylene sorbitol, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, polyoxyethylene alkyl (C12-14 ) Ether, polyoxyethylene tridecyl ether, polyoxy Tylene myristyl ether, polyoxyethylene isostearyl ether, polyoxyethylene behenyl ether, polyoxyethylene cholesteryl ether, polyoxypropylene butyl ether, polyoxypropylene myristyl ether, polyoxypropylene cetyl ether, polyoxypropylene stearyl ether, polyoxypropylene lanolin Alcohol ether, polyoxyethylene polyoxypropylene butyl ether, polyoxyethylene polyoxypropylene lauryl ether, polyoxyethylene polyoxypropylene myristyl ether, polyoxyethylene polyoxypropylene cetyl ether, polyoxyethylene polyoxypropylene stearyl ether, polyethylene monolaurate Glycol, Polyethylene glycol stearate, polypropylene glycol laurate, castor oil fatty acid polypropylene glycol (5.5 PO), butylene glycol laurate, butylene glycol stearate, butylene glycol distearate, butylene glycol dilaurate, butylene glycol dioleate, butylene dimyristate Glycol, poly (1,4-butanediol) -9 dipalmitate, and the like.

(Chloride ion)
As a chloride ion, it can be made to contain by adding the compound (chloride ion source) which supplies a chloride ion in electrolyte solution. Although it does not specifically limit as a chloride ion source, Hydrochloric acid, sodium chloride, etc. can be mentioned.

[Electrolytic treatment]
In the method for producing a dendritic copper powder according to the present embodiment, for example, the electrolytic treatment is performed using the electrolytic solution having the composition as described above, so that the copper powder is deposited and produced on the cathode.

As the electrolysis method, a known method can be used. For example, the current density is preferably 5 A / dm ^{2 to} 40 A / dm ² and more preferably 10 A / dm ^{2 to} 30 A / dm ² when electrolysis is performed using a sulfuric acid electrolytic solution. . In order to deposit fine dendritic copper powder, it is necessary to perform electrolysis under conditions where hydrogen is generated at the cathode, and it is necessary to select conditions of current density, copper concentration, and electrolysis temperature. If the current density is less than 5 A / dm ² , production efficiency may be significantly reduced. On the other hand, the higher the current density, the faster the production speed. However, when the current density exceeds 40 A / dm ² , hydrogen generation is increased more than necessary, which may lower the production efficiency.

  In order to deposit uniform dendritic copper powder, it is preferable to energize the electrolytic solution while stirring.

  The liquid temperature (bath temperature) of the electrolytic solution is preferably 20 ° C. to 60 ° C., and more preferably 25 ° C. to 50 ° C. When the liquid temperature of the electrolytic solution is less than 20 ° C., the current efficiency is remarkably lowered and the production efficiency may be lowered. On the other hand, when the liquid temperature exceeds 60 ° C., decomposition of the added alkylene oxide derivative may proceed faster.

≪3. Applications of conductive paste, conductive paint, etc. >>
Dendritic copper powder obtained by the production method described above, the specific surface area of 0.6m ² /g~5.0m ² / g. According to such a dendritic copper powder, it is possible to secure a larger number of contacts than spherical copper powder and to exhibit excellent conductivity.

  Moreover, according to the fine dendritic copper powder having such a specific surface area, even when it is a copper paste or the like, it is possible to suppress aggregation, and to uniformly disperse in the resin, In addition, it is possible to suppress the occurrence of poor printability due to an increase in the viscosity of the paste. Therefore, such dendritic copper powder can be suitably used for applications such as conductive paste and conductive paint. Furthermore, the dendritic copper powder has a crystallite diameter of 500 to 3000 mm, can secure a larger number of contacts than the spherical copper powder, and exhibits excellent conductivity.

  Specifically, the above-mentioned dendritic copper powder can be used as a metal filler by mixing one kind or two or more kinds having different specific surface areas. By using a metal filler having such a configuration, for example, when the metal filler is used in a conductive paste, it can be uniformly dispersed in the resin, and the viscosity of the paste is excessively increased, resulting in poor printability. Etc. can be prevented. Moreover, the electroconductivity excellent as an electrically conductive paste can be exhibited by using the dendritic copper powder. Of course, the metal filler is not limited to the above-described dendritic copper powder composed of only one kind or two or more kinds having different specific surface areas, and further mixed with another form of copper powder, for example, spherical copper powder. Can also be used as a metal filler.

  For example, as a conductive paste (copper paste), the dendritic copper powder according to the present embodiment is included as a metal filler, a binder resin, a solvent, and further additives such as an antioxidant and a coupling agent as necessary. And kneading.

  Although it does not specifically limit as binder resin, An epoxy resin, a phenol resin, etc. can be used.

  Moreover, as a solvent, organic solvents, such as ethylene glycol, diethylene glycol, triethylene glycol, glycerol, and terpineol, can be used. Further, the amount of the organic solvent added is not particularly limited, but the amount added is adjusted in consideration of the particle size of the dendritic copper powder so that the viscosity is suitable for a conductive film forming method such as screen printing or a dispenser. It is preferable.

  Furthermore, other resin components can be added for viscosity adjustment. For example, as the resin component, a cellulose resin typified by ethyl cellulose and the like can be mentioned, and the resin component can be added as an organic vehicle dissolved in an organic solvent such as terpineol. In addition, it is necessary to suppress the addition amount of the resin component to an extent that does not impair the sinterability, and is preferably 5% by mass or less of the whole.

  Moreover, as an additive, in order to improve the electroconductivity after baking, antioxidant etc. can be added. Although it does not specifically limit as antioxidant, For example, a hydroxycarboxylic acid etc. can be mentioned. More specifically, hydroxycarboxylic acids such as citric acid, malic acid, tartaric acid, and lactic acid are preferable, and citric acid or malic acid having a high adsorptive power to copper is particularly preferable. The addition amount of the antioxidant can be, for example, about 1% by mass to 15% by mass in consideration of the antioxidant effect, the viscosity of the paste, and the like.

  Next, even when the metal filler according to the present embodiment is used as an electromagnetic shielding material, it is not limited to use under particularly limited conditions, but a general method, for example, using a metal filler as a resin Can be used as a mixture.

  For example, when forming the electromagnetic wave shielding layer of the conductive sheet for electromagnetic wave shielding, the resin to be used is not particularly limited, and vinyl chloride resin, vinyl acetate resin, vinylidene chloride, which are conventionally used, are not limited. Resin, acrylic resin, polyurethane resin, polyester resin, olefin resin, chlorinated olefin resin, polyvinyl alcohol resin, alkyd resin, thermoplastic resin made of various polymers and copolymers, thermosetting resin, radiation A curable resin or the like can be used as appropriate.

  As a method for producing an electromagnetic shielding material, for example, the above-described metal filler and resin are dispersed or dissolved in a solvent to form a coating material, and the coating material is applied or printed on the substrate to form the electromagnetic shielding layer. It can be manufactured by forming and drying to such an extent that the surface solidifies. Moreover, a metal filler can also be utilized for the conductive adhesive layer of a conductive sheet.

  Further, even when the metal filler according to the present embodiment is used as the material for the conductive coating for electromagnetic wave shielding, it is not limited to use under particularly limited conditions, but a general method such as a metal filler Can be mixed with a resin and a solvent, and further mixed with an antioxidant, a thickener, an anti-settling agent, etc., if necessary, and kneaded to obtain a conductive paint.

  The binder resin and solvent used at this time are not particularly limited, and vinyl chloride resin, vinyl acetate resin, acrylic resin, polyester resin, fluororesin, silicon resin, and phenol resin as conventionally used are used. Etc. can be used. As for the solvent, alcohols such as isopropanol, aromatic hydrocarbons such as toluene, esters such as methyl acetate, ketones such as methyl ethyl ketone, and the like, which have been conventionally used, can be used. In addition, as an antioxidant as an additive, a fatty acid amide, a higher fatty acid amine, a phenylenediamine derivative, a titanate coupling agent, and the like that are conventionally used can be used.

  Hereinafter, the present invention will be described in more detail by showing examples of the present invention together with comparative examples. The present invention is not limited to the following examples.

≪Evaluation method≫
For the copper powders obtained in the following examples and comparative examples, the following methods were used to observe the shape, measure the BET specific surface area, measure the crystallite diameter, measure the specific resistance value, and evaluate the electromagnetic shielding characteristics. .

(Observation of shape)
20 fields of view were arbitrarily observed with a scanning electron microscope (JSM-7100F, manufactured by JEOL Ltd.) at a field of magnification of 10,000 times, and the copper powder contained in the field of view was observed.

(BET specific surface area)
The BET specific surface area was measured using a specific surface area / pore distribution measuring apparatus (manufactured by Cantachrome, QUADRASORB SI).

(Measurement of crystallite diameter)
The crystallite size was calculated from a diffraction pattern obtained by an X-ray diffraction measurement apparatus (manufactured by PANalytical, X'Pert PRO) using a known method generally known as Scherrer's equation.

(Specific resistance measurement)
About the specific resistance value of a film, a sheet resistance value is measured by a four-terminal method using a low resistivity meter (manufactured by Mitsubishi Chemical Corporation, Loresta-GP MCP-T600), while a surface roughness shape measuring instrument (Tokyo) The film thickness of the film was measured by SURFCO M130A) manufactured by Seimitsu Co., Ltd., and the sheet resistance value was divided by the film thickness.

(Electromagnetic wave shielding characteristics)
The electromagnetic shielding characteristics were evaluated by measuring the attenuation rate of the samples obtained in the examples and comparative examples using an electromagnetic wave having a frequency of 1 GHz. Specifically, the level of Comparative Example 2 in which no dendritic silver-coated copper powder was used was set as “Δ”, and the level worse than that of Comparative Example 2 was set as “X”. The case where it was better than the level was evaluated as “◯”, and the case where it was further superior was evaluated as “◎”.

  Moreover, in order to evaluate also about the flexibility of an electromagnetic wave shield, the produced electromagnetic wave shield was bent and it was confirmed whether the electromagnetic wave shielding characteristic changed.

<Example>
<Preparation of electrolytic copper powder>
[Example 1]
Using a titanium electrode plate with a cathode area of 200 mm × 200 mm as a cathode and a copper electrode plate with an electrode area of 200 mm × 200 mm as an anode in an electrolytic cell having a capacity of 100 L, a direct current is passed through the copper electrode Powder was deposited on the cathode plate.

  At this time, the electrolytic solution composition was a sulfuric acid electrolytic solution having a copper ion concentration of 10 g / L and a sulfuric acid concentration of 100 g / L. Furthermore, a hydrochloric acid solution (manufactured by Wako Pure Chemical Industries, Ltd.) was added to this electrolytic solution so that the chloride ion (chlorine ion) concentration was 50 mg / L, and polyoxyethylene methyl glucoside (addition mole) was added as an alkylene oxide derivative. 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E), the concentrations in the electrolyte solution are 0, 50, 100, 200, 500, 1000, 2000, 5000, and 10000 mg / L, respectively. Were added in such a manner.

The current density of the cathode was 20 A / dm ^{2 under} the condition that the temperature (electrolyte temperature) was maintained at 30 ° C. while circulating each electrolyte adjusted to the above concentration at a flow rate of 10 L / min. It energized so that copper powder might be deposited on the cathode plate. The electrolytic copper powder deposited on the cathode plate was mechanically scraped off and collected, washed with pure water, and then dried in a vacuum dryer.

  As a result of observing the thus obtained electrolytic copper powder by the method using the scanning electron microscope (SEM) described above, it was confirmed to be a copper powder having a dendritic shape (dendritic copper powder).

  Moreover, the result of having measured the BET specific surface area about the obtained dendritic copper powder in FIG. 1 is shown. As shown in the results of FIG. 1, the specific surface area of the precipitated dendritic copper powder changes depending on the concentration of polyoxyethylene methylglucoside (added mole number 10) to be added to the electrolytic solution. It was found that can be made.

[Example 2]
In the electrolyte solution, polyoxyethylene methyl glucoside (addition mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) as an alkylene oxide derivative is adjusted to 1000 mg / L in the electrolyte solution. Add a hydrochloric acid solution (manufactured by Wako Pure Chemical Industries, Ltd.) so that the chloride ion concentration in the electrolyte solution is 0, 10, 20, 50, 100, 200, 300, 400, 500 mg / L, respectively. And added. In addition, copper powder was deposited on the same conditions as Example 1 except it.

  As a result of observing the thus obtained electrolytic copper powder by the method using the scanning electron microscope (SEM) described above, it was confirmed to be a copper powder having a dendritic shape (dendritic copper powder).

  Moreover, the result of having measured the BET specific surface area about the obtained dendritic copper powder in FIG. 2 is shown. As shown in the results of FIG. 2, it was found that the specific surface area of the precipitated dendritic copper powder was changed depending on the chloride ion concentration added and contained in the electrolytic solution, and a finer dendritic copper powder could be produced.

Here, the chloride ion concentration in the electrolyte solution is 0 mg / L, that is, only polyoxyethylene methyl glucoside (addition mole number 10) is added to the electrolyte solution at a content of 1000 mg / L, and chloride ions are added. Even if not, the BET specific surface area of the dendritic copper powder is 0.63 m ² / g as shown in FIG. 2, and the polyoxyethylene methyl glucoside (added mole number 10) is 0 mg / g as shown in FIG. Under the condition of L (chloride ion is 50 mg / L), the BET specific surface area of the dendritic copper powder was 0.50 m ² / g. From this fact, if an alkylene oxide derivative typified by polyoxyethylene methyl glucoside (addition mole number 10) is added and contained in the electrolytic solution, finer dendritic electrolysis can be achieved without adding chloride ions. It has also been found that powder can be made.

[Example 3]
A hydrochloric acid solution is added to the electrolytic solution so that the chloride ion concentration in the electrolytic solution is 2 mg / L, and polyoxyethylene methyl glucoside (addition mole number 10) as an alkylene oxide derivative (manufactured by NOF Corporation, trade name) : Macbiobride MG-10E) was added while changing the concentration in the electrolyte solution to 0, 50, 100, 200, 500, 1000, 2000, 5000, and 10000 mg / L, respectively. In addition, copper powder was deposited on the same conditions as Example 1 except it.

  As a result of observing the thus obtained electrolytic copper powder by the method using the scanning electron microscope (SEM) described above, it was confirmed to be a copper powder having a dendritic shape (dendritic copper powder).

  Moreover, the crystallite diameter was computed for the obtained dendritic copper powder using the X-ray-diffraction measuring apparatus mentioned above. FIG. 3 shows the measurement results of the crystallite diameter. As shown in the results of FIG. 3, the crystallite diameter of the precipitated dendritic copper powder varies depending on the concentration of polyoxyethylene methylglucoside (added mole number 10) to be added, and dendritic copper having a desired crystallite diameter. It was found that powder could be made.

[Example 4]
Polyoxypropylene methyl glucoside (addition mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10P) as an alkylene oxide derivative in the electrolytic solution, and the concentration in the electrolytic solution is 0, 50, 100, respectively. , 200, 500, 1000, 2000, 5000, and 10,000 mg / L, and a hydrochloric acid solution (manufactured by Wako Pure Chemical Industries, Ltd.) was added to a chloride ion concentration of 100 mg / L. . In addition, copper powder was deposited on the same conditions as Example 1 except it.

  As a result of observing the thus obtained electrolytic copper powder by the method using the scanning electron microscope (SEM) described above, it was confirmed to be a copper powder having a dendritic shape (dendritic copper powder).

  Moreover, the result of having measured the BET specific surface area about the obtained dendritic copper powder in FIG. 4 is shown. As shown in the results of FIG. 4, it was found that the specific surface area of the precipitated dendritic copper powder changes depending on the concentration of the polyoxypropylene methyl glucoside to be added, and a finer dendritic copper powder can be produced.

[Example 5]
In the electrolyte solution, polyoxyethylene methyl glucoside (addition mole number 10) as an alkylene oxide derivative (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is set to 10,000 mg / L, and polyoxypropylene methyl Glucosides (addition mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10P), the concentration in the electrolyte is 0, 50, 100, 200, 500, 1000, 2000, 5000, 10000 mg, respectively. In addition, a hydrochloric acid solution (manufactured by Wako Pure Chemical Industries, Ltd.) was added at a chloride ion concentration of 100 mg / L. In addition, copper powder was deposited on the same conditions as Example 1 except it.

  As a result of observing the thus obtained electrolytic copper powder by the method using the scanning electron microscope (SEM) described above, it was confirmed to be a copper powder having a dendritic shape (dendritic copper powder).

  Moreover, the result of having measured the BET specific surface area about the obtained dendritic copper powder in FIG. 5 is shown. As shown in the results of FIG. 5, it was found that the specific surface area of the precipitated dendritic copper powder changes depending on the concentration of the two kinds of alkylene oxide derivatives to be added, and a finer dendritic copper powder can be produced.

<Preparation of conductive paste>
[Example 6]
In Example 1, the concentration of polyoxyethylene methyl glucoside (addition mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 1000 mg / L, and the concentration of chloride ions is 50 mg / L. In addition to 55 parts by mass of dendritic copper powder having a specific surface area of 1.46 m ² / g, obtained by the electrolyte solution added as such, 15 parts by mass of phenol resin (manufactured by Gunei Chemical Co., Ltd., PL-2211) , 10 parts by mass of butyl cellosolve (manufactured by Kanto Chemical Co., Ltd., deer special grade) is mixed, and kneading at 1200 rpm for 3 minutes is repeated 3 times using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1). And pasted.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the coatings obtained by curing were 9.3 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 3.2 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes these results.

[Example 7]
In Example 4, the concentration of polyoxypropylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10P) was 500 mg / L, and the concentration of chloride ions was 100 mg / L. 55 parts by mass of a dendritic copper powder having a specific surface area of 1.25 m ² / g, obtained by each of the electrolytes added as described above, 15 parts by mass of a phenol resin (manufactured by Gunei Chemical Co., Ltd., PL-2211), and butyl cellosolve (Kanto Chemical Co., Ltd., deer special grade) 10 parts by mass are mixed, and using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1), paste by repeating kneading at 1200 rpm for 3 minutes three times. Turned into.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the films obtained by curing were 9.7 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 3.8 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes these results.

[Example 8]
In Example 1, the concentration of polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 5000 mg / L, and the concentration of chloride ions is 50 mg / L. As described above, 55 parts by mass of dendritic copper powder having a specific surface area of 2.45 m ² / g obtained from the electrolyte solution added to each, 15 parts by mass of phenol resin (PL-2211 manufactured by Gunei Chemical Co., Ltd.), butyl cellosolve ( Paste by mixing 10 parts by weight of Kanto Chemical Co., Ltd., deer special grade) and repeating kneading 3 times at 1200 rpm for 3 minutes using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1). did.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the films obtained by curing were 7.0 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 1.5 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes these results.

[Example 9]
In Example 1, the concentration of polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 500 mg / L, and the concentration of chloride ions is 50 mg / L. Resinous copper powder having a specific surface area of 0.98 m ² / g (denoted as dendritic copper powder [1] in Table 1) obtained by the electrolyte solution added as described above, and Example 2 In polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E), the concentration is 1000 mg / L and the concentration of chloride ions is 200 mg / L, respectively. Two different dendritic shapes obtained from the added electrolytic solution and resinous copper powder having a specific surface area of 2.35 m ² / g (indicated as dendritic copper powder [2] in Table 1) Copper powder, each mass The total amount of 55 parts by mass with a ratio of 50% and 50% is 15 parts by mass of phenol resin (manufactured by Gunei Chemical Co., Ltd., PL-2211), 10 parts by mass of butyl cellosolve (manufactured by Kanto Chemical Co., Ltd., deer special grade) Were mixed using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1), and kneaded at 1200 rpm for 3 minutes three times to form a paste.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the films obtained by curing were 6.8 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 1.2 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes these results.

[Example 10]
In Example 1, the concentration of polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 100 mg / L, and the concentration of chloride ions is 50 mg / L. In this way, 55 parts by mass of dendritic copper powder having a specific surface area of 0.61 m ² / g obtained by each of the added electrolytes, 15 parts by mass of phenol resin (manufactured by Gunei Chemical Co., Ltd., PL-2211), butyl cellosolve (Kanto Chemical Co., Ltd., deer special grade) 10 parts by mass are mixed, and using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1), paste by repeating kneading at 1200 rpm for 3 minutes three times. Turned into.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the coatings obtained by curing were 12.5 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 6.3 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes these results.

<Preparation of electromagnetic shielding layer>
[Example 11]
In Example 1, the concentration of polyoxyethylene methyl glucoside (addition mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 1000 mg / L, and the concentration of chloride ions is 50 mg / L. As described above, dendritic copper powder having a specific surface area of 1.46 m ² / g obtained by each of the added electrolytes was dispersed in a resin to obtain an electromagnetic wave shielding material.

  That is, 100 g of vinyl chloride resin and 200 g of methyl ethyl ketone were mixed with 40 g of the dendritic copper powder obtained in Example 1, and kneading at 1200 rpm for 3 minutes was repeated three times using a small kneader. To make a paste. During pasting, the copper powder was uniformly dispersed in the resin without agglomeration. This was coated and dried on a base material made of a transparent polyethylene terephthalate sheet having a thickness of 100 μm using a Mayer bar to form an electromagnetic wave shielding layer having a thickness of 25 μm.

  The electromagnetic shielding characteristics were evaluated by measuring the attenuation rate using an electromagnetic wave having a frequency of 1 GHz. Table 1 shows the results of the characteristic evaluation.

[Example 12]
In Example 1, the concentration of polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 5000 mg / L, and the concentration of chloride ions is 50 mg / L. As described above, dendritic copper powder having a specific surface area of 2.45 m ² / g obtained by each of the added electrolytes was dispersed in a resin to obtain an electromagnetic shielding material.

  That is, 100 g of vinyl chloride resin and 200 g of methyl ethyl ketone were mixed with 40 g of the dendritic copper powder obtained in Example 1, and kneading at 1200 rpm for 3 minutes was repeated three times using a small kneader. To make a paste. During pasting, the copper powder was uniformly dispersed in the resin without agglomeration. This was coated and dried on a base material made of a transparent polyethylene terephthalate sheet having a thickness of 100 μm using a Mayer bar to form an electromagnetic wave shielding layer having a thickness of 25 μm.

  The electromagnetic shielding characteristics were evaluated by measuring the attenuation rate using an electromagnetic wave having a frequency of 1 GHz. Table 1 shows the results of the characteristic evaluation.

[Example 13]
In Example 1, the concentration of polyoxyethylene methyl glucoside (added mole number 10) (manufactured by NOF Corporation, trade name: Macbiobride MG-10E) is 100 mg / L, and the concentration of chloride ions is 50 mg / L. Thus, the dendritic copper powder having a specific surface area of 0.61 m ² / g obtained by each of the added electrolytes was dispersed in a resin to obtain an electromagnetic wave shielding material.

  That is, 100 g of vinyl chloride resin and 200 g of methyl ethyl ketone were mixed with 40 g of the dendritic copper powder obtained in Example 1, and kneading at 1200 rpm for 3 minutes was repeated three times using a small kneader. To make a paste. During pasting, the copper powder was uniformly dispersed in the resin without agglomeration. This was coated and dried on a base material made of a transparent polyethylene terephthalate sheet having a thickness of 100 μm using a Mayer bar to form an electromagnetic wave shielding layer having a thickness of 25 μm.

  The electromagnetic shielding characteristics were evaluated by measuring the attenuation rate using an electromagnetic wave having a frequency of 1 GHz. Table 1 shows the results of the characteristic evaluation.

≪Comparative example≫
<Production of electrolytic copper powder, production of conductive paste>
[Comparative Example 1]
Copper powder was deposited under the same conditions as in the Examples except that the conditions were such that the alkylene oxide derivative was not added to the electrolytic solution.

As a result, the specific surface area of the obtained electrolytic copper powder was 0.50 m ² / g. In addition, as a result of observing the obtained electrolytic copper powder by the method by SEM, it was confirmed that it is a copper powder (dendritic copper powder) having a dendritic shape.

Next, to 55 parts by mass of the obtained dendritic copper powder having a specific surface area of 0.50 m ² / g, 15 parts by mass of phenol resin (manufactured by Gunei Chemical Co., Ltd., PL-2211), butyl cellosolve (manufactured by Kanto Chemical Co., Ltd., Deer special grade) 10 parts by mass was mixed, and using a small kneader (Nippon Seiki Seisakusho, non-bubbling kneader NBK-1), 1200 rpm for 3 minutes kneading was repeated three times to make a paste.

  The obtained conductive paste was printed on a glass with a metal squeegee and cured at 150 ° C. and 200 ° C. for 30 minutes in an air atmosphere.

The specific resistance values of the films obtained by curing were 15.1 × 10 ⁻⁵ Ω · cm (curing temperature 150 ° C.) and 8.4 × 10 ⁻⁵ Ω · cm (curing temperature 200 ° C.), respectively. . Table 1 summarizes the results.

<Preparation of electromagnetic shielding layer>
[Comparative Example 2]
Dendritic copper powder having a specific surface area of 0.5 m ² / g prepared in Comparative Example 1 was dispersed in a resin to obtain an electromagnetic wave shielding material.

That is, 100 g of vinyl chloride resin and 200 g of methyl ethyl ketone were added to 40 g of dendritic copper powder having a specific surface area of 0.5 m ² / g prepared under the conditions in which no alkylene oxide derivative was added (others were the same as in Example 1). Each was mixed and made into a paste by repeating kneading at 1200 rpm for 3 minutes three times using a small kneader. During pasting, the copper powder was uniformly dispersed in the resin without agglomeration. This was coated and dried on a base material made of a transparent polyethylene terephthalate sheet having a thickness of 100 μm using a Mayer bar to form an electromagnetic wave shielding layer having a thickness of 25 μm.

  The electromagnetic shielding characteristics were evaluated by measuring the attenuation rate using an electromagnetic wave having a frequency of 1 GHz. Table 1 shows the results of the characteristic evaluation.

≪Summary of evaluation results≫
Table 1 below collectively shows the results of the property evaluation results of the conductive pastes of Examples 6 to 10 and Comparative Example 1, and the property evaluation results of the electromagnetic wave shields of Examples 11 to 13 and Comparative Example 2.

Claims (11)

By depositing dendritic copper powder on the cathode by electrolysis using a sulfuric acid acidic solution containing copper ions and an alkylene oxide derivative,
The density | concentration of the said alkylene oxide derivative in the said sulfuric acid acidic solution is 1 mg / L-10000 mg / L. The manufacturing method of the dendritic copper powder characterized by the above-mentioned. The said alkylene oxide derivative is 1 or more types chosen from the compound group represented by following formula (1) and following formula (2), The manufacturing method of the dendritic copper powder of Claim 1 characterized by the above-mentioned.

[In the formula (1), EO represents —CH ₂ CH ₂ O—. Here, a, b, c and d are the average added mole numbers of EO, and the total average added mole number of a, b, c and d is 10 to 20. ]

[In the formula (2), PO represents —CH ₂ CH (CH ₃ ) O—. Here, e, f, g, and h are average addition mole numbers of PO, and the total average addition mole number of e, f, g, and h is 10-20. ]   The method for producing a dendritic copper powder according to claim 1 or 2, wherein the sulfuric acid acidic solution contains chloride ions at a rate of 0 mg / L to 500 mg / L.   The said chloride ion uses hydrochloric acid or sodium chloride, The manufacturing method of the dendritic copper powder of Claim 3 characterized by the above-mentioned.   The density | concentration of the said copper ion is 1 g / L-20 g / L, The manufacturing method of the dendritic copper powder of any one of Claims 1 thru | or 4 characterized by the above-mentioned. The specific surface area of the dendritic copper powder, 0.6m ² /g~5.0m ² / method for producing dendritic copper powder according to any one of claims 1 to 5, characterized in that ^g is .   7. The dendritic copper powder according to claim 1, wherein the dendritic copper powder has a crystallite diameter in a Miller index of (111) plane by X-ray diffraction of 500 to 3000 mm. Manufacturing method.   A metal filler obtained by mixing one type of dendritic copper powder obtained by the production method according to claim 1 or two or more types having different specific surface areas.   A conductive paste comprising the metal filler according to claim 8 mixed with a resin.   A conductive paint for electromagnetic wave shielding, wherein the metal filler according to claim 8 is dispersed in a resin.   A conductive sheet for electromagnetic wave shielding, wherein the metal filler according to claim 8 is dispersed in a resin.

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