JP2016209906A - Laser machining machine and laser machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laser machining machine which prevents a machining nozzle from colliding with work or a work support at a part of an edge of the work.SOLUTION: A laser machining machine 100 performing laser machining while keeping a distance between work 12 placed on a work support 30 and a machining nozzle 28 constant, by copy control based on a detection result of a distance sensor 19, is equipped with dummy work 29 which generates capacitance same as a case that the work 12 exists on the whole of a detection range of the distance sensor 19, while the machining nozzle 28 is positioned on a part of an edge of the work 12; and a cylinder 31 which moves the dummy work 29 on the work support 30, and contacts that along the edge of the work 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser processing machine and a laser processing method for performing laser processing while keeping a distance between a processing nozzle and a workpiece constant by scanning control.

  Conventionally, a laser beam machine during laser machining keeps the distance between a machining nozzle and a workpiece constant by scanning control. As disclosed in Patent Document 1, in the copying control, a distance between a workpiece located immediately below the machining nozzle and the machining nozzle is electromagnetically detected by a non-contact type sensor.

JP 2003-181474 A

  However, in the above conventional technique, when the machining nozzle is positioned on the edge portion of the workpiece and the workpiece exists only in a part of the detection range of the non-contact type sensor, the distance between the workpiece and the machining nozzle. Is detected to be larger than the actual distance. Therefore, when the machining nozzle reaches the edge of the workpiece, control is performed to reduce the distance between the workpiece and the nozzle by scanning control. Therefore, the machining nozzle may collide with the workpiece or a workpiece support that supports the workpiece. It was.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser beam machine that prevents a machining nozzle from colliding with a workpiece or a workpiece support at an edge portion of the workpiece.

  In order to solve the above-described problems and achieve the object, the present invention keeps the distance between the workpiece placed on the workpiece support and the machining nozzle constant by scanning control based on the detection result of the electrostatic sensor. This is a laser processing machine that performs laser processing. The present invention moves a dummy workpiece on the workpiece support that generates the same capacitance as when the workpiece exists in the entire detection range of the electrostatic sensor in a state where the machining nozzle is positioned on the edge portion of the workpiece. And a drive mechanism that makes contact along the edge of the workpiece.

  According to the present invention, it is possible to prevent the machining nozzle from colliding with the workpiece or the workpiece support at the edge portion of the workpiece.

1 is a configuration diagram of a laser beam machine according to a first embodiment of the present invention. Top view of the processing pallet of the laser beam machine according to the first embodiment. Flowchart showing a procedure of laser processing by the laser processing machine according to the first embodiment. Top view of the processing pallet of the laser beam machine according to the first embodiment. The figure which shows the modification structural example of the laser beam machine concerning Embodiment 1. FIG. Top view of the processing pallet of the laser beam machine according to the second embodiment of the present invention. Sectional drawing of the process pallet of the laser beam machine concerning Embodiment 3 of this invention.

  Hereinafter, a laser beam machine and a laser beam machining method according to embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a configuration diagram of a laser beam machine according to the first embodiment of the present invention. The laser processing machine 100 includes a numerical control unit 10 that controls each part of the laser processing machine 100, a distance sensor 19 that detects a distance L between the processing nozzle 28 and the workpiece 12, and sensor data that processes a detection result of the distance sensor 19. A processing unit 18, an X servo motor 23 that moves the machining head 7 in the X-axis direction, an X servo control unit 20 that controls the X servo motor 23, and a Y servo motor 24 that moves the machining head 7 in the Y-axis direction, The Y servo control unit 21 that controls the Y servo motor 24, the Z servo motor 25 that moves the machining head 7 in the Z direction, the Z servo control unit 22 that controls the Z servo motor 25, and the laser that irradiates the workpiece 12 A laser oscillator 26 that emits light, a machining pallet 27 on which the workpiece 12 is placed, a dummy workpiece 29 placed on the machining pallet 27, Comprises a work support 30 for supporting the installed workpiece 12 in Engineering pallet 27, and a cylinder 31 for moving the dummy workpiece 29 sliding on the work support 30. The cylinder 31 is a drive mechanism that moves the dummy workpiece 29 on the workpiece support 30 and makes contact with the edge of the workpiece 12.

  The machining head 7 is driven in the XYZ axial directions by an X servo motor 23, a Y servo motor 24, and a Z servo motor 25. The X axis and the Y axis are included in a plane parallel to the surface on which the workpiece 12 is placed. The Z axis is perpendicular to the surface on which the workpiece 12 is placed.

  For convenience of drawing, the workpiece 12 is illustrated inside the laser processing machine 100 in FIG. 1, but the workpiece 12 is not a component of the laser processing machine 100.

  The numerical control unit 10 includes a main control unit 13 that controls the overall operation of the laser processing machine 100, a processing machine control unit 14 that sends commands to the laser transmitter 26 and controls on / off of the laser, and X servo control. A position control unit 15 that outputs position commands in the X-axis direction and the Y-axis direction to the unit 20 and the Y servo control unit 21, a height control unit 17 that outputs a position command in the Z-axis direction to the Z servo control unit 22, A cylinder control unit 32 that controls the cylinder 31.

  The distance sensor 19 is a capacitance-type electrostatic sensor that detects the distance from the workpiece 12 by a non-contact method, and is an electrostatic voltage value corresponding to the capacitance between the machining nozzle 28 and the workpiece 12. Measure the scanning voltage. The sensor data processing unit 18 takes in a voltage value from the distance sensor 19 and calculates a distance L between the machining nozzle 28 and the workpiece 12. The distance sensor 19 and the sensor data processing unit 18 constitute a sensor that measures the distance between the machining nozzle 28 and the workpiece 12.

  The X servo control unit 20 outputs the movement amount in the X axis direction to the X servo motor 23 and moves the machining head 7 along the X axis. The Y servo control unit 21 outputs the amount of movement in the Y axis direction to the Y servo motor 24, and moves the machining head 7 along the Y axis. The Z servo control unit 22 outputs the amount of movement in the Z-axis direction to the Z servo motor 25 and moves the machining head 7 along the Z axis. The X servo motor 23, the Y servo motor 24, and the Z servo motor 25 have a position detector for each axis of XYZ, and are input from the X servo control unit 20, the Y servo control unit 21, or the Z servo control unit 22. The machining head 7 is moved according to the movement amount of each axis of XYZ.

  The laser oscillator 26 turns on and off the laser beam used for processing the workpiece 12 based on a command from the processing machine control unit 14.

  Control in the case of performing machining according to the numerical control program will be described with reference to FIG. The main control unit 13 analyzes a numerical control program for laser processing, and gives information corresponding to the command content of the program to the processing machine control unit 14, the position control unit 15, and the height control unit 17.

  When the program command is a command for the laser oscillator 26, the main control unit 13 gives a command to the processing machine control unit 14. A specific example of a command for the laser oscillator 26 is turning on and off the laser beam. A signal from the laser oscillator 26 is transmitted to the main control unit 13 via the processing machine control unit 14. Therefore, the numerical control unit 10 can know the status of the laser oscillator 26.

  When the program command is a position command, the main control unit 13 gives the position control unit 15 information on the moving position and the moving speed. The position control unit 15 calculates the movement distance based on the given information, distributes the movement distance to the X and Y axes, and outputs the movement amount to the X servo control unit 20 and the Y servo control unit 21. The position control unit 15 also manages the actual position of the machining head 7 based on the output movement position and information from the X servo control unit 20 and the Y servo control unit 21. The X servo control unit 20 and the Y servo control unit 21 drive the X servo motor 23 and the Y servo motor 24 to move the machining head 7 relative to the workpiece 12. Laser machining is performed by moving the machining head 7 in a state where a laser is emitted from the machining nozzle 28 in accordance with an instruction of the numerical control program. Further, the position control unit 15 informs the main control unit 13 of information on the movement position, the movement amount and the remaining movement distance.

  When the program command is a command to turn on / off the scanning control, the main control unit 13 gives command information to the height control unit 17. When the height control unit 17 is instructed to turn on the scanning control, the height control unit 17 performs the scanning control to keep the distance between the machining nozzle 28 and the workpiece 12 at a constant distance. When performing the copying control, the height control unit 17 compares the information on the distance L input from the sensor data processing unit 18 with a preset distance, and eliminates the difference, so as to eliminate the difference. The movement amount is output to. The Z servo control unit 22 drives the Z servo motor 25 to move the machining head 7 up and down. The distance sensor 19 outputs sensor data corresponding to the distance L between the machining nozzle 28 and the workpiece 12, and the sensor data is fed back to the height control unit 17 via the sensor data processing unit 18. As described above, when the distance L changes due to the distortion of the work 12, the sensor data changes. By changing the Z-axis position based on the change of the sensor data, the distance L between the machining head 7 and the work 12 becomes constant. Kept. Further, the height control unit 17 informs the main control unit 13 of trace status information.

  When the program command is an execution command for an approach operation, the main control unit 13 gives information on the approach speed and nozzle height to the height control unit 17. The height control unit 17 calculates the movement distance based on the given information, and outputs an amount of movement in the Z-axis direction to the Z servo control unit 22 when commanded to execute the approach operation. The Z servo control unit 22 drives the Z servo motor 25 based on the movement amount in the Z-axis direction given from the height control unit 17 to move the machining head 7 downward. The distance sensor 19 outputs sensor data corresponding to the distance L between the machining nozzle 28 and the workpiece 12, and the sensor data is fed back to the height control unit 17 via the sensor data processing unit 18. The height control unit 17 lowers the machining head 7 based on the sensor data fed back from the sensor data processing unit 18.

  When notified from the main control unit 13 that the work 12 has been placed on the work support 30 of the processing pallet 27, the cylinder control unit 32 controls the cylinder 31 to place the dummy work 29 on the edge of the work 12. Touch along. A hydraulic or pneumatic type can be applied to the cylinder 31. Although the laser processing machine also has a configuration such as a light guide optical system, the same one as a general laser processing machine can be applied and is not directly related to the features of the present invention, and is not shown.

  The processing pallet 27 is provided with a plurality of work supports 30, and the work 12 is disposed on the work support 30.

  A dummy word 29 is attached to the cylinder 31. The dummy workpiece 29 is made of the same material as the workpiece 12, has the same thickness as the workpiece 12, and is disposed on the workpiece support 30. The dummy work 29 has a width equal to or larger than the radius of the detection range of the distance sensor 19. When the cylinder controller 32 operates the cylinder 31, the dummy workpiece 29 slides on the workpiece support 30. Since the dummy workpiece 29 is disposed on the workpiece support 30, the workpiece 12 and the dummy workpiece 29 are electrically connected and kept at the same potential.

  FIG. 2 is a top view of the processing pallet of the laser beam machine according to the first embodiment. The laser beam machine 100 according to the first embodiment includes four dummy workpieces 29, and each dummy workpiece 29 has the same length as each of the four sides of the workpiece 12.

  After the workpiece 12 is placed at the reference position of the machining pallet 27, the cylinder control unit 32 controls the cylinder 31 to bring the dummy workpiece 29 closer to the workpiece 12, and the dummy workpiece 29 moves when the dummy workpiece 29 comes into contact with the workpiece 12. Stop. As a result, the workpiece 12 is surrounded by the dummy workpiece 29 on all sides, and the dummy workpiece 29 is stationary along the edge of the workpiece 12.

  FIG. 3 is a flowchart of a laser processing procedure performed by the laser processing machine according to the first embodiment. In step S <b> 1, the workpiece 12 is placed on the workpiece support 30 installed on the processing pallet 27. In step S <b> 2, the dummy workpiece 29 is placed on the workpiece support 30 with a space from each side of the workpiece 12. In step S <b> 3, the dummy work 29 is slid on the work support 30 by the cylinder 31, and the dummy work 29 is brought into contact with each side of the work 12. In step S4, a machining program is executed and the workpiece 12 is machined with a laser. If the weight of the dummy work 29 is such that it can be slid on the work support 30 even by manual work, the dummy work 29 is brought into contact with each side of the work 12 by hand without using the cylinder 31. You may let them. That is, when the dummy workpiece 29 having a weight that can slide on the workpiece support 30 even by manual work is used, even if the laser processing machine is configured without the cylinder control unit 32 and the cylinder 31, Laser processing can be performed according to the procedure shown in FIG.

  According to the above procedure, the laser processing machine 100 performs laser processing by keeping the distance between the work 12 placed on the work support 30 and the processing nozzle 28 constant by scanning control based on the detection result of the distance sensor 19. Do.

  FIG. 4 is a diagram illustrating the movement of the machining head of the laser beam machine according to the first embodiment. 4A shows a state in which the machining head 7 is positioned on the center of the work 12, and FIG. 4B shows a state in which the machining head 7 is located immediately above the edge of the work 12. 4 (c) is a state in which the machining head 7 is positioned on the dummy workpiece 29. As shown in FIG. 4 (a), when the machining head 7 that has progressed while performing scanning control from the center of the work 12 reaches the upper part of the edge of the work 12 as shown in FIG. The workpiece 12 is present only in a part of the 19 detection ranges 19a. However, since the dummy workpiece 29 is disposed around the workpiece 12, the distance sensor 19 also detects the capacitance generated between the dummy workpiece 29. The dummy workpiece 29 is formed of the same material as the workpiece 12, has the same thickness as the workpiece 12, and has a width equal to or larger than the radius of the detection range 19 a of the distance sensor 19. When located directly above the edge, the dummy workpiece 29 exists in the detection range 19a of the distance sensor 19, and the same distance as when the workpiece 12 exists in the entire detection range 19a is detected. That is, the dummy workpiece 29 generates the same capacitance as when the workpiece 12 exists in the entire detection range 19 a of the distance sensor 19 in a state where the machining nozzle 28 is positioned on the edge portion of the workpiece 12. Therefore, the laser beam machine 100 according to the first embodiment can prevent the machining nozzle 28 from colliding with the workpiece 12 or the workpiece support 30 even if scanning control is performed at the edge portion of the workpiece 12.

  At the end of laser processing, as shown in FIG. 4C, the workpiece 12 does not exist under the processing head 7, but a dummy workpiece 29 having the same material and thickness as the workpiece 12 is detected by the distance sensor 19. Since it exists in the whole 19a, even if the scanning control is continued until the end of the laser machining, the machining nozzle 28 is prevented from colliding with the workpiece 12 or the workpiece support 30.

  As described above, since the laser processing machine 100 according to the first embodiment arranges the dummy workpiece 29 around the workpiece 12, the machining nozzle 7 can move the workpiece 12 even if the copying control is performed at the edge portion of the workpiece 12. Alternatively, collision with the work support 30 can be prevented.

  In the above description, the dummy work 29 is moved using the cylinder 31, but the dummy work 29 may be moved using a servo motor instead of the cylinder 31.

  FIG. 5 is a diagram illustrating a modified configuration example of the laser beam machine according to the first embodiment. The dummy work 29 and the work 12 are connected using a wiring 33. Even if an oxide film is formed on the lower surface of the dummy workpiece 29 or the workpiece 12 or a non-conductive coating is applied, the dummy workpiece 29 and the workpiece 12 are connected by the wiring 33 to connect the workpiece 12 The dummy workpiece 29 can be set to the same potential. Thereby, the effect of preventing the machining nozzle 7 from colliding with the workpiece 12 or the workpiece support 30 by the copying control at the edge portion of the workpiece 12 can be obtained regardless of the conduction state of the lower surfaces of the workpiece 12 and the dummy workpiece 29. .

  FIG. 5 shows a configuration in which each of the four dummy workpieces 29 is directly connected to the workpiece 12 by the wiring 33. However, any one of the plurality of dummy workpieces 29 is directly connected to the workpiece 12 by the wiring 33. The other dummy work 29 can be configured to be connected to the dummy work 29 already connected to the work 12 by wiring.

Embodiment 2. FIG.
FIG. 6 is a top view of a processing pallet of the laser beam machine according to the second embodiment of the present invention. The configuration of the laser beam machine according to the second embodiment is the same as that of the laser beam machine 100 according to the first embodiment, but is different in that the dummy workpiece 29 is arranged only on two sides of the workpiece 12. Therefore, the apparatus configuration can be simplified as compared with the laser processing machine 100 according to the first embodiment.

  The laser beam machine according to the second embodiment can obtain an effect of preventing the machining nozzle 7 from colliding with the workpiece 12 or the workpiece support 30 at the edge portion of the workpiece 12 only on the side where the dummy workpiece 29 is disposed. However, on the side where the dummy workpiece 29 is not arranged, the main control unit 13 executes a control program in which the machining head 7 is not moved on the edge of the workpiece 12, thereby allowing the machining nozzle 7 and the workpiece 12 or the workpiece support 30 to be executed. Can avoid collisions.

Embodiment 3 FIG.
FIG. 7 is a cross-sectional view of the processing pallet of the laser beam machine according to the third embodiment of the present invention. In the laser beam machine according to the third embodiment, the end portion 29a of the dummy workpiece 29 ′ that is not adjacent to the workpiece 12 is warped upward.

  The detection range of the distance sensor 19 is not only directly under the processing nozzle 7 but also a circular region having the processing nozzle 7 as the center and a diameter larger than the outer shape of the processing nozzle 7. Therefore, by causing the end portion 29a of the dummy workpiece 29 'that is not adjacent to the workpiece 12 to warp upward, the capacitance detected by the distance sensor 19 becomes larger than when there is no warp. As a result, even if the width of the dummy workpiece 29 ′ is narrower than that of the dummy workpiece 29 of the first embodiment, the machining nozzle 7 collides with the workpiece 12 or the workpiece support 30 by the copying control at the edge portion of the workpiece 12. The effect which prevents doing is acquired.

  According to the third embodiment, the size of the laser processing machine is reduced by using the dummy workpiece 29 ′ having a narrower width than the dummy workpiece 29 whose end portion not adjacent to the workpiece 12 is not warped upward. be able to.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  7 Processing Head, 10 Numerical Control Unit, 12 Workpiece, 13 Main Control Unit, 14 Processing Machine Control Unit, 15 Position Control Unit, 17 Height Control Unit, 18 Sensor Data Processing Unit, 19 Distance Sensor, 19a Detection Range, 20 X Servo control unit, 21 Y servo control unit, 22 Z servo control unit, 23 X servo motor, 24 Y servo motor, 25 Z servo motor, 26 laser oscillator, 27 machining pallet, 28 machining nozzle, 29 dummy workpiece, 30 workpiece support , 31 cylinder, 32 cylinder control unit, 100 laser processing machine.

Claims (4)

A laser processing machine for performing laser processing by keeping a distance between a work placed on a work support and a processing nozzle constant by scanning control based on a detection result of an electrostatic sensor,
In a state where the machining nozzle is positioned on the edge portion of the workpiece, a dummy workpiece that generates the same capacitance as that in the case where the workpiece exists in the entire detection range of the electrostatic sensor is formed on the workpiece support. A laser processing machine comprising a drive mechanism that is moved and brought into contact with an edge of a workpiece.   The laser processing machine according to claim 1, wherein the dummy workpiece has a width equal to or larger than a radius of a detection range of the electrostatic sensor.   The laser processing machine according to claim 1, wherein the dummy workpiece is warped upward on a side not adjacent to the workpiece. A laser processing method for performing laser processing by keeping a distance between a work placed on a work support and a processing nozzle constant by scanning control based on a detection result of an electrostatic sensor,
Placing the workpiece on the workpiece support;
In a state where the machining nozzle is positioned on the edge portion of the workpiece, dummy workpieces that generate the same capacitance as when the workpiece exists in the entire detection range of the electrostatic sensor are arranged on each side of the workpiece. And placing on the work support in a state of being spaced apart,
Contacting the dummy workpiece along the edges of the sides of the workpiece;
And a step of processing the workpiece with a laser.

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