JP2016208018A - 清浄な／汚れた基板のハンドリングのためのエンドエフェクタアセンブリ - Google Patents

清浄な／汚れた基板のハンドリングのためのエンドエフェクタアセンブリ Download PDF

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Publication number
JP2016208018A
JP2016208018A JP2016077712A JP2016077712A JP2016208018A JP 2016208018 A JP2016208018 A JP 2016208018A JP 2016077712 A JP2016077712 A JP 2016077712A JP 2016077712 A JP2016077712 A JP 2016077712A JP 2016208018 A JP2016208018 A JP 2016208018A
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Japan
Prior art keywords
substrate
substrate support
height
end effector
support pads
Prior art date
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Pending
Application number
JP2016077712A
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English (en)
Japanese (ja)
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JP2016208018A5 (https=
Inventor
ロス・エンバートソン
Embertson Ross
ブランドン・セン
Senn Brandon
オースティン・ンゴ
Ngo Austin
マシュー・ジェイ．・ロドニック
J Rodnick Matthew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2016208018A publication Critical patent/JP2016208018A/ja
Publication of JP2016208018A5 publication Critical patent/JP2016208018A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
JP2016077712A 2015-04-15 2016-04-08 清浄な／汚れた基板のハンドリングのためのエンドエフェクタアセンブリ Pending JP2016208018A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/687,506 2015-04-15
US14/687,506 US9779977B2 (en) 2015-04-15 2015-04-15 End effector assembly for clean/dirty substrate handling

Publications (2)

Publication Number Publication Date
JP2016208018A true JP2016208018A (ja) 2016-12-08
JP2016208018A5 JP2016208018A5 (https=) 2019-05-16

Family

ID=57128876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016077712A Pending JP2016208018A (ja) 2015-04-15 2016-04-08 清浄な／汚れた基板のハンドリングのためのエンドエフェクタアセンブリ

Country Status (4)

Country Link
US (2) US9779977B2 (https=)
JP (1) JP2016208018A (https=)
KR (2) KR20160123248A (https=)
TW (1) TWI693989B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6630591B2 (ja) * 2016-02-26 2020-01-15 川崎重工業株式会社 基板把持ハンド及び基板搬送装置
KR102397110B1 (ko) * 2016-06-13 2022-05-12 도쿄엘렉트론가부시키가이샤 기판 반송 장치 및 기판 반송 방법
US10943805B2 (en) 2018-05-18 2021-03-09 Applied Materials, Inc. Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing
JP7740921B2 (ja) * 2020-08-17 2025-09-17 東京エレクトロン株式会社 搬送装置およびエンドエフェクタ
TWI744078B (zh) * 2020-11-06 2021-10-21 三和技研股份有限公司 控制複數承接件間距之機械手臂
US11970403B2 (en) * 2022-06-27 2024-04-30 Saudi Arabian Oil Company Method of zeolite synthesis including pH-modified water-soluble oxidized disulfide oil composition
US11958751B2 (en) * 2022-06-27 2024-04-16 Saudi Arabian Oil Company Method of synthesizing materials integrating supernatant recycle
USD1106977S1 (en) * 2023-04-10 2025-12-23 Asm Ip Holding B.V. End effector
USD1106082S1 (en) * 2025-03-06 2025-12-16 Asm Ip Holding B.V. End effector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687531A (ja) * 1992-09-09 1994-03-29 Hitachi Ltd 受け渡し治具および装置
JP2002299405A (ja) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd 基板搬送装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3143770B2 (ja) 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5700046A (en) 1995-09-13 1997-12-23 Silicon Valley Group, Inc. Wafer gripper
EP1114440B1 (de) * 1998-09-02 2007-12-12 Tec-Sem AG Vorrichtung und verfahren zum handhaben von einzelnen wafern
US7048316B1 (en) * 2002-07-12 2006-05-23 Novellus Systems, Inc. Compound angled pad end-effector
US20090101067A1 (en) 2005-07-08 2009-04-23 Bonora Anthony C Method and apparatus for wafer support
JP4976811B2 (ja) * 2006-10-30 2012-07-18 東京エレクトロン株式会社 基板処理システム、基板搬送装置、基板搬送方法、および記録媒体
US9437469B2 (en) 2007-04-27 2016-09-06 Brooks Automation, Inc. Inertial wafer centering end effector and transport apparatus
KR101534357B1 (ko) * 2009-03-31 2015-07-06 도쿄엘렉트론가부시키가이샤 기판 지지 장치 및 기판 지지 방법
JP5141707B2 (ja) * 2010-03-24 2013-02-13 株式会社安川電機 被処理体の支持機構、支持方法およびそれを備えた搬送システム
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
US20140056679A1 (en) * 2011-04-15 2014-02-27 Tazmo Co., Ltd. Wafer exchange apparatus and wafer supporting hand
US8864202B1 (en) * 2013-04-12 2014-10-21 Varian Semiconductor Equipment Associates, Inc. Spring retained end effector contact pad
US20160155658A1 (en) * 2014-12-02 2016-06-02 Macronix International Co., Ltd. Semiconductor wafer holder and wafer carrying tool using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0687531A (ja) * 1992-09-09 1994-03-29 Hitachi Ltd 受け渡し治具および装置
JP2002299405A (ja) * 2001-03-29 2002-10-11 Dainippon Screen Mfg Co Ltd 基板搬送装置

Also Published As

Publication number Publication date
TW201707897A (zh) 2017-03-01
US9779977B2 (en) 2017-10-03
KR20230145013A (ko) 2023-10-17
TWI693989B (zh) 2020-05-21
US20160303742A1 (en) 2016-10-20
US10707113B2 (en) 2020-07-07
KR20160123248A (ko) 2016-10-25
US20180005865A1 (en) 2018-01-04

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