JP2016206636A - Pattern drawing device, and pattern drawing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern drawing device that repeatedly scans a drawing beam projected on an object to be irradiated by rotating a rotary polygon mirror to draw a predetermined pattern on an object to be irradiated.SOLUTION: A pattern drawing device comprises: an origin detection part 60 which generates an origin signal when it is detected that a second reflection surface RPb reflecting a drawing beam LB1, which is different from a first reflection surface RPa, out of a plurality of reflection surfaces RP of a rotary polygon mirror PM is at a predetermined angular position; and a controller which instructs drawing start by the drawing beam LB1 at predetermined delayed timing from generation of the origin signal by using a predetermined time determined by rotational speed of the rotary polygon mirror PM from a point where the origin signal is generated until the second reflection surface RPb becomes the first reflection surface RPa as a reference.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a pattern drawing apparatus and a pattern drawing method for drawing a pattern by scanning spot light of a beam irradiated on an irradiated object.

  As disclosed in the following Patent Document 1, a laser beam from one laser beam light source is divided into two by a laser beam distributing means such as a half mirror, and each of the divided two laser beams responds to drawing data. There is known a laser drawing apparatus in which two laser beams are scanned on an object to be drawn by being modulated by an AOM (acousto-optic element) that is turned on / off and then incident on two polygon mirrors. Furthermore, in Patent Document 1, the rotation speed and rotation angle position (phase) of both polygon mirrors are synchronized using an origin signal detected by a sensor (photo interrupter) for the origin defined for each of the two polygon mirrors. Control is disclosed.

JP 2001-133710 A

  According to a first aspect of the present invention, there is provided a pattern drawing apparatus for repeatedly scanning a drawing beam projected on an irradiated object by rotation of a rotary polygon mirror and drawing a predetermined pattern on the irradiated object, An origin detection unit that generates an origin signal when it is detected that a second reflecting surface different from the first reflecting surface that reflects the drawing beam is at a predetermined angular position among a plurality of reflecting surfaces of the rotary polygon mirror. And a predetermined delay from the generation of the origin signal on the basis of a predetermined time determined by the rotational speed of the rotary polygon mirror from when the origin signal is generated until the second reflecting surface becomes the first reflecting surface. And a control device for instructing start of drawing by the drawing beam at the timing.

  A second aspect of the present invention is a pattern drawing method for drawing a predetermined pattern on the irradiated body by repeatedly scanning a drawing beam projected on the irradiated body by rotation of a rotary polygon mirror, Generating an origin signal when detecting that a second reflecting surface different from the first reflecting surface that reflects the drawing beam among a plurality of reflecting surfaces of the rotary polygon mirror has reached a predetermined angular position; Timing delayed by a predetermined delay from the generation of the origin signal with reference to a predetermined time determined by the rotational speed of the rotary polygon mirror from when the origin signal is generated until the second reflecting surface becomes the first reflecting surface. And instructing to start drawing by the drawing beam.

It is a figure which shows schematic structure of the device manufacturing system containing the exposure apparatus which performs the exposure process to the board | substrate of 1st Embodiment. FIG. 2 is a detailed view of the rotating drum of FIG. 1 around which a substrate is wound. It is a figure which shows the drawing line of a spot light, and the alignment mark formed on the board | substrate. It is a figure which shows the structure of a light source device. It is a block diagram of a beam switching member. FIG. 6A is a diagram of switching of the optical path of the beam by the selection optical element when viewed from the + Z direction side, and FIG. 6B is a diagram of switching of the optical path of the beam by the selection optical element when viewed from the −Y direction side. It is a figure which shows the optical structure of a scanning unit. It is a figure which shows the structure of the origin sensor provided in the periphery of the polygon mirror of FIG. It is a figure which shows the relationship between the generation | occurrence | production timing of an origin signal, and a drawing start timing. It is a figure explaining the maximum scanning rotation angle range of the polygon mirror which the polygon mirror of a scanning unit can scan spot light on the to-be-irradiated surface of a board | substrate. It is a sub origin generation circuit diagram for generating a sub origin signal in which the origin signal is thinned and the generation timing is delayed by a predetermined time. It is a figure which shows the time chart of the sub origin signal produced | generated by the sub origin production | generation circuit of FIG. It is a block diagram which shows the electric structure of exposure apparatus. It is a time chart which shows the timing which an origin signal, a sub origin signal, and serial data are output. It is a figure which shows the structure of the drawing data output control part shown in FIG. It is a figure which shows the time chart of the signal state of each part at the time of the standard pattern drawing by a scanning unit, and the oscillation state of a beam. It is a block diagram of the beam switching member of the 2nd Embodiment. It is a figure which shows an optical path when the position of the arrangement | positioning switching member of FIG. 17 becomes a 1st position. It is a figure which shows the structure of the beam switching control part in 2nd Embodiment. FIG. 20 is a diagram illustrating a configuration of the logic circuit of FIG. FIG. 21 is a diagram illustrating a timing chart for explaining the operation of the logic circuit of FIG. 20. It is a block diagram of the beam switching member by the 3rd embodiment. It is a figure which shows the structure in the case of rotating 90 degree | times arrangement | positioning of the optical element for selection (acousto-optic modulation element) in 3rd Embodiment. It is a figure which shows the arrangement | positioning relationship between the conveyance form of a board | substrate by the modification 3, and a drawing line. It is a figure which shows the structure of the driver circuit of the optical element for selection (acousto-optic modulation element) by the modification 5. FIG. FIG. 26 is a diagram showing a modification of the driver circuit in FIG.

  DESCRIPTION OF EMBODIMENTS A pattern drawing apparatus and a pattern drawing method according to an aspect of the present invention will be described in detail below with reference to the accompanying drawings with preferred embodiments. In addition, the aspect of this invention is not limited to these embodiment, What added the various change or improvement is included. That is, the constituent elements described below include those that can be easily assumed by those skilled in the art and substantially the same elements, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the gist of the present invention.

[First Embodiment]
FIG. 1 is a diagram illustrating a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (irradiated body) FS according to the first embodiment. In the following description, unless otherwise specified, an XYZ orthogonal coordinate system in which the gravity direction is the Z direction is set, and the X direction, the Y direction, and the Z direction will be described according to the arrows shown in the drawing.

  The device manufacturing system 10 is a manufacturing system in which a manufacturing line for manufacturing a flexible display, a flexible wiring, a flexible sensor, or the like as an electronic device is constructed. The following description is based on the assumption that a flexible display is used as the electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out a substrate FS from a supply roll (not shown) obtained by winding a flexible sheet-like substrate (sheet substrate) FS in a roll shape, and continuously performs various processes on the delivered substrate FS. After the application, the substrate FS after various treatments is wound up by a collection roll (not shown), and has a so-called roll-to-roll structure. The substrate FS has a strip shape in which the moving direction of the substrate FS is the longitudinal direction (long) and the width direction is the short direction (short). The substrate FS sent from the supply roll is sequentially subjected to various processes by the process apparatus PR1, the exposure apparatus (drawing apparatus, beam scanning apparatus) EX, the process apparatus PR2, and the like, and is taken up by the collection roll.

  The X direction is a direction (conveyance direction) from the process apparatus PR1 to the process apparatus PR2 through the exposure apparatus EX in a horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction (short direction) of the substrate FS. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.

  For the substrate FS, for example, a resin film or a foil (foil) made of a metal or alloy such as stainless steel is used. Examples of the material of the resin film include polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin. Among them, one containing at least one or more may be used. Further, the thickness and rigidity (Young's modulus) of the substrate FS may be in a range that does not cause folds due to buckling or irreversible wrinkles in the substrate FS when passing through the transport path of the exposure apparatus EX. As a base material of the substrate FS, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is typical of a suitable sheet substrate.

  Since the substrate FS may receive heat in each process performed by the process apparatus PR1, the exposure apparatus EX, and the process apparatus PR2, it is preferable to select the substrate FS having a material whose thermal expansion coefficient is not significantly large. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, or silicon oxide. The substrate FS may be a single layer of ultrathin glass having a thickness of about 100 μm manufactured by a float process or the like, or a laminate in which the above resin film, foil, etc. are bonded to the ultrathin glass. It may be.

  By the way, the flexibility of the substrate FS means a property that the substrate FS can be bent without being sheared or broken even when a force of its own weight is applied to the substrate FS. . In addition, flexibility includes a property of bending by a force of about its own weight. The degree of flexibility varies depending on the material, size, and thickness of the substrate FS, the layer structure formed on the substrate FS, the environment such as temperature and humidity, and the like. In any case, when the substrate FS is correctly wound around the conveyance direction changing members such as various conveyance rollers and rotary drums provided in the conveyance path in the device manufacturing system 10 according to the first embodiment, If the substrate FS can be smoothly transported without being bent and creased or damaged (breaking or cracking), it can be said to be a flexible range.

  The process apparatus PR1 performs a pre-process on the substrate FS subjected to the exposure process by the exposure apparatus EX. The process apparatus PR1 sends the substrate FS that has been processed in the previous process toward the exposure apparatus EX. By this pre-process, the substrate FS sent to the exposure apparatus EX is a substrate (photosensitive substrate) having a photosensitive functional layer (photosensitive layer, photosensitive layer) formed on the surface thereof.

  This photosensitive functional layer is applied as a solution on the substrate FS and dried to form a layer (film). A typical photosensitive functional layer is a photoresist (in liquid or dry film form), but as a material that does not require development processing, the photosensitivity of the part that has been irradiated with ultraviolet rays is modified. There is a silane coupling agent (SAM), or a photosensitive reducing agent in which a plating reducing group is exposed on a portion irradiated with ultraviolet rays. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate FS is modified from lyophobic to lyophilic. Therefore, by selectively applying conductive ink (ink containing conductive nanoparticles such as silver or copper) or a liquid containing a semiconductor material on the lyophilic portion, a thin film transistor (TFT) or the like A pattern layer to be an electrode, a semiconductor, insulation, or a wiring or electrode for connection can be formed. When a photosensitive reducing agent is used as the photosensitive functional layer, the plating reducing group is exposed to the pattern portion exposed to ultraviolet rays on the substrate. Therefore, after exposure, the substrate FS is immediately immersed in a plating solution containing palladium ions for a certain period of time, so that a pattern layer of palladium is formed (deposited). Such a plating process is an additive process. However, in the case where an etching process as a subtractive process is premised, the substrate FS sent to the exposure apparatus EX has a base material of PET or the like. PEN may be formed by depositing a metallic thin film such as aluminum (Al) or copper (Cu) on the entire surface or selectively, and further laminating a photoresist layer thereon.

  In the first embodiment, the exposure apparatus EX as a beam scanning apparatus is a direct drawing type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus. The exposure apparatus EX irradiates the irradiated surface (photosensitive surface) of the substrate FS supplied from the process apparatus PR1 with a light pattern corresponding to a predetermined pattern for an electronic device, circuit, wiring, or the like for display. . As will be described in detail later, the exposure apparatus EX transmits the spot light SP of the exposure beam LB on the surface to be irradiated of the substrate FS in a predetermined manner while transporting the substrate FS in the + X direction (sub-scanning direction). While performing one-dimensional scanning (main scanning) in the scanning direction (Y direction), the intensity of the spot light SP is modulated (ON / OFF) at high speed according to pattern data (drawing data). Thereby, a light pattern corresponding to a predetermined pattern such as an electronic device, a circuit, or a wiring is drawn and exposed on the surface to be irradiated of the substrate FS. That is, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate FS by the sub-scanning of the substrate FS and the main scanning of the spot light SP, and a predetermined pattern is drawn and exposed on the substrate FS. . Further, since the substrate FS is transported along the transport direction (+ X direction), the exposure region W where the pattern is exposed by the exposure apparatus EX is spaced at a predetermined interval along the longitudinal direction of the substrate FS. A plurality are provided (see FIG. 3). Since an electronic device is formed in the exposure area W, the exposure area W is also an electronic device formation area. Since the electronic device is configured by superimposing a plurality of pattern layers (layers on which patterns are formed), a pattern corresponding to each layer may be exposed by the exposure apparatus EX.

  The process apparatus PR2 performs post-process processing (for example, plating processing, development / etching processing, etc.) on the substrate FS exposed by the exposure apparatus EX. By this subsequent process, a pattern layer of the device is formed on the substrate FS.

  As described above, since the electronic device is configured by superimposing a plurality of pattern layers, one pattern layer is generated through at least each process of the device manufacturing system 10. Therefore, in order to generate an electronic device, each process of the device manufacturing system 10 as shown in FIG. 1 must be performed at least twice. Therefore, a pattern layer can be laminated | stacked by mounting | wearing another device manufacturing system 10 with the collection | recovery roll by which board | substrate FS was wound up as a supply roll. Such an operation is repeated to form an electronic device. Therefore, the processed substrate FS is in a state in which a plurality of electronic device formation regions are connected along the longitudinal direction of the substrate FS at a predetermined interval. That is, the substrate FS is a multi-sided substrate.

  The collection roll that collects the substrate FS formed in a state where the electronic device formation region (exposure region W) is continuous may be mounted on a dicing apparatus (not shown). The dicing apparatus equipped with the collection roll divides the processed substrate FS into electronic device forming regions (dicing) to form a plurality of electronic devices. As for the dimension of the substrate FS, for example, the dimension in the width direction (short direction) is about 10 cm to 2 m, and the dimension in the length direction (long direction) is 10 m or more. In addition, the dimension of the board | substrate FS is not limited to an above-described dimension.

  Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in the temperature control chamber ECV. This temperature control chamber ECV suppresses a shape change due to the temperature of the substrate FS transported inside by keeping the inside at a predetermined temperature. The temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via passive or active vibration isolation units SU1, SU2. The anti-vibration units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be the floor surface of the factory itself, or may be a surface on an installation base (pedestal) installed on the floor surface in order to obtain a horizontal surface. The exposure apparatus EX includes at least a substrate transport mechanism 12, a light source device 14, a beam switching member (beam delivery unit) 16, an exposure head 18, a control device 20, and a plurality of alignment microscopes AMm (AM1 to AM4). I have.

  The substrate transport mechanism 12 transports the substrate FS transported from the process apparatus PR1 at a predetermined speed in the exposure apparatus EX, and then sends the substrate FS to the process apparatus PR2 at a predetermined speed. The substrate transport mechanism 12 defines a transport path for the substrate FS transported in the exposure apparatus EX. The substrate transport mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotating drum (cylindrical drum) DR, a tension adjusting roller RT2, in order from the upstream side (−X direction side) in the transport direction of the substrate FS. A driving roller R2 and a driving roller R3 are provided.

  The edge position controller EPC adjusts the position in the width direction (the Y direction and the short direction of the substrate FS) of the substrate FS transported from the process apparatus PR1. That is, in the edge position controller EPC, the position at the end (edge) in the width direction of the substrate FS being transported in a state where a predetermined tension is applied is about ± 10 μm to several tens μm with respect to the target position. The position of the substrate FS in the width direction is adjusted by moving the substrate FS in the width direction so that it falls within the range (allowable range). The edge position controller EPC has a roller over which the substrate FS is stretched, and an edge sensor (edge detection unit) (not shown) that detects the position of the edge (edge) in the width direction of the substrate FS. Based on the detection signal, the roller of the edge position controller EPC is moved in the Y direction to adjust the position in the width direction of the substrate FS. The driving roller R1 rotates while holding both front and back surfaces of the substrate FS conveyed from the edge position controller EPC, and conveys the substrate FS toward the rotating drum DR. The edge position controller EPC appropriately adjusts the position in the width direction of the substrate FS so that the longitudinal direction of the substrate FS wound around the rotating drum DR is always orthogonal to the central axis AXo of the rotating drum DR. The parallelism between the rotation axis of the roller and the Y axis of the edge position controller EPC may be adjusted as appropriate so as to correct the tilt error in the traveling direction of the substrate FS.

  The rotary drum DR has a central axis AXo extending in the Y direction and extending in a direction intersecting with the direction in which gravity works, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo. The substrate FS is transported in the + X direction by rotating around the central axis AXo while supporting a part of the substrate FS in the longitudinal direction following the above. The rotating drum DR supports the exposure area (part) on the substrate FS on which the beam LB (spot light SP) from the exposure head 18 is projected on its circumferential surface. On both sides in the Y direction of the rotating drum DR, shafts Sft supported by annular bearings are provided so that the rotating drum DR rotates around the central axis AXo. The shaft Sft rotates around the central axis AXo when a rotational torque from a rotation driving source (not shown) (for example, a motor or a speed reduction mechanism) controlled by the control device 20 is applied. For convenience, a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane Poc.

  The driving rollers R2 and R3 are arranged at a predetermined interval along the transport direction (+ X direction) of the substrate FS, and give a predetermined slack (play) to the exposed substrate FS. Similarly to the drive roller R1, the drive rollers R2 and R3 rotate while holding both front and back surfaces of the substrate FS, and transport the substrate FS toward the process apparatus PR2. The drive rollers R2 and R3 are provided on the downstream side (+ X direction side) in the transport direction with respect to the rotating drum DR, and the drive roller R2 is located on the upstream side (−X in the transport direction) with respect to the drive roller R3. (Direction side). The tension adjusting rollers RT1 and RT2 are urged in the −Z direction, and apply a predetermined tension in the longitudinal direction to the substrate FS that is wound around and supported by the rotary drum DR. Thereby, the longitudinal tension applied to the substrate FS applied to the rotary drum DR is stabilized within a predetermined range. In addition, the control apparatus 20 rotates drive roller R1-R3 by controlling the rotational drive source (For example, a motor, a reduction gear, etc.) which is not shown in figure.

  The light source device 14 has a light source (pulse light source) and emits a pulsed beam (pulse light, laser) LB. The beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the light emission frequency (oscillation frequency) of the beam LB is Fs. The beam LB emitted from the light source device 14 enters the exposure head 18 via the beam switching member 16. The light source device 14 emits and emits the beam LB at the emission frequency Fs under the control of the control device 20. The configuration of the light source device 14 will be described in detail later. In the first embodiment, a semiconductor laser element that generates pulsed light in the infrared wavelength region, a fiber amplifier, and an amplified pulse in the infrared wavelength region. It is composed of a wavelength conversion element (harmonic generation element) that converts light into pulsed light in the ultraviolet wavelength range, etc., an oscillation frequency Fs of several hundred MHz, and a high-intensity ultraviolet light whose emission time of one pulse light is about picoseconds. A fiber amplifier laser light source capable of obtaining pulsed light is used.

  In the beam switching member 16, the beam LB from the light source device 14 is incident on one scanning unit Un that performs one-dimensional scanning of the spot light SP among a plurality of scanning units Un (U 1 to U 6) constituting the exposure head 18. Thus, the optical path of the beam LB is switched. The beam switching member 16 will be described in detail later.

  The exposure head 18 includes a plurality of scanning units Un (U1 to U6) into which the beam LB is incident. The exposure head 18 draws a pattern on a part of the substrate FS supported by the circumferential surface of the rotary drum DR by a plurality of scanning units Un (U1 to U6). The exposure head 18 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) having the same configuration are arranged. Since the exposure head 18 repeatedly performs the pattern exposure for the electronic device on the substrate FS, the exposure area W (electronic device formation area) where the pattern is exposed is a predetermined interval along the longitudinal direction of the substrate FS. A plurality are provided with a gap (see FIG. 3). As shown in FIG. 1, the odd-numbered scanning units U1, U3, and U5 are arranged on the upstream side (−X direction side) in the transport direction of the substrate FS with respect to the center plane Poc and along the Y direction. Are arranged. The even-numbered scanning units U2, U4, and U6 are arranged on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc, and are arranged along the Y direction. The odd-numbered scanning units U1, U3, and U5 and the even-numbered scanning units U2, U4, and U6 are provided symmetrically with respect to the center plane Poc.

  The scanning unit Un projects the beam LB from the light source device 14 so as to converge on the spot light SP on the irradiated surface of the substrate FS, and the spot light SP on the irradiated surface of the substrate FS has a predetermined linear shape. A one-dimensional scan is performed by a rotating polygon mirror PM (see FIG. 7) along a simple drawing line (scanning line) SLn. The configuration of the scanning unit Un will be described in detail later.

  The plurality of scanning units Un (U1 to U6) are arranged in a predetermined arrangement relationship. In the plurality of scanning units Un (U1 to U6), the drawing lines SLn of the plurality of scanning units Un (U1 to U6) are arranged in the Y direction (the width direction of the substrate FS, the main scanning direction) as shown in FIGS. ) With respect to each other without being separated from each other. Hereinafter, the drawing line SLn of the scanning unit U1 may be represented as SL1, and the drawing line SLn of the scanning units U2 to U6 may be represented as SL2 to SL6. Note that the beams LB incident on the scanning units Un (U1 to U6) may be represented as LB1 to LB6, respectively. The beam LB incident on the scanning unit Un is a linearly polarized light (P-polarized light or S-polarized light) polarized in a predetermined direction, and is a P-polarized beam in the first embodiment. In the following description, the beams LB1 to LB6 incident on each of the six scanning units U1 to U6 may be represented as a beam LBn.

  As shown in FIG. 3, each scanning unit Un (U1 to U6) shares the scanning area so that all of the plurality of scanning units Un (U1 to U6) cover all of the width direction of the exposure area W. Yes. Thereby, each scanning unit Un (U1-U6) can draw a pattern for every some area | region divided | segmented in the width direction of the board | substrate FS. For example, if the scanning length in the Y direction (the length of the drawing line SLn) by one scanning unit Un is about 30 to 60 mm, the odd numbered scanning units U1, U3, U5 and the even numbered scanning unit U2 , U4, and U6, a total of six scanning units Un in the Y direction, the width in the Y direction that can be drawn is increased to about 180 to 360 mm. In principle, the lengths of the drawing lines SL1 to SL6 are the same. That is, the scanning distance of the spot light SP of the beam LBn scanned along each of the drawing lines SL1 to SL6 is basically the same. If it is desired to increase the width of the exposure region W, it can be handled by increasing the length of the drawing line SLn itself or increasing the number of scanning units Un arranged in the Y direction.

  Each actual drawing line SLn (SL1 to SL6) is set slightly shorter than the maximum length that the spot light SP can actually scan on the irradiated surface. For example, if the maximum length of the drawing line SLn on which pattern drawing is possible is 30 mm when the drawing magnification in the main scanning direction (Y direction) is an initial value (no magnification correction), the maximum scanning on the irradiated surface of the spot light SP is performed. The length is set to about 31 mm with a margin of about 0.5 mm on each of the scanning start point side and the scanning end point side of the drawing line SLn. With this setting, the position of the 30 mm drawing line SLn can be finely adjusted in the main scanning direction and the drawing magnification can be finely adjusted within the maximum scanning length of 31 mm of the spot light SP. Become. The maximum scanning length of the spot light SP is not limited to 31 mm, but is mainly determined by the aperture of the fθ lens FT (see FIG. 7) provided after the polygon mirror (rotating polygon mirror) PM in the scanning unit Un. It may be the above.

  The plurality of drawing lines SLn (SL1 to SL6) are arranged in two rows in the circumferential direction of the rotary drum DR with the center plane Poc interposed therebetween. The odd-numbered drawing lines SL1, SL3, and SL5 are positioned on the irradiated surface of the substrate FS on the upstream side (−X direction side) in the transport direction of the substrate FS with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, and SL6 are positioned on the irradiated surface on the substrate FS on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate FS, that is, the central axis AXo of the rotary drum DR.

  The drawing lines SL1, SL3, and SL5 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. Similarly, the drawing lines SL2, SL4, and SL6 are arranged on a straight line at a predetermined interval along the width direction (scanning direction) of the substrate FS. At this time, the drawing line SL2 is arranged between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate FS. Similarly, the drawing line SL3 is disposed between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate FS. The drawing line SL4 is arranged between the drawing line SL3 and the drawing line SL5 with respect to the width direction of the substrate FS, and the drawing line SL5 is arranged between the drawing line SL4 and the drawing line SL6 with respect to the width direction of the substrate FS. Has been.

  The scanning direction of the spot light SP of the beam LBn scanned along each of the odd-numbered drawing lines SL1, SL3, SL5 is a one-dimensional direction and is the same direction. The scanning direction of the spot light SP of the beam LBn scanned along each of the even-numbered drawing lines SL2, SL4, SL6 is a one-dimensional direction and is the same direction. The scanning direction of the spot light SP of the beam LBn scanned along the drawing lines SL1, SL3, and SL5 is different from the scanning direction of the spot light SP of the beam LBn scanned along the drawing lines SL2, SL4, and SL6. The reverse direction. Specifically, the scanning direction of the spot light SP of the beam LBn scanned along the drawing lines SL1, SL3, SL5 is the -Y direction, and the spot light of the beam LBn scanned along the drawing lines SL2, SL4, SL6. The SP scanning direction is the + Y direction. As a result, the drawing start positions of the drawing lines SL1, SL3, and SL5 (positions of drawing start points (scanning start points)) and the drawing start positions of the drawing lines SL2, SL4, and SL6 are adjacent (or partially overlapped) in the Y direction. ) The drawing end positions (drawing end points (scan end points)) of the drawing lines SL3 and SL5 and the drawing end positions of the drawing lines SL2 and SL4 are adjacent (or partially overlap) in the Y direction. When arranging each drawing line SLn so that the ends of the drawing lines SLn adjacent in the Y direction partially overlap, for example, the drawing start position or the drawing end with respect to the length of each drawing line SLn It is preferable to overlap within a range of several percent or less in the Y direction including the position.

  Note that the width of the drawing line SLn in the sub-scanning direction is a thickness corresponding to the size (diameter) φ of the spot light SP. For example, when the size φ of the spot light SP is 3 μm, the width of the drawing line SLn is also 3 μm. The spot light SP may be projected along the drawing line SLn so as to overlap by a predetermined length (for example, half the size φ of the spot light SP). Also, when the drawing lines SLn (for example, the drawing line SL1 and the drawing line SL2) adjacent in the Y direction are adjacent to each other (in the case of connection), only a predetermined length (for example, half the size φ of the spot light SP). It is better to overlap.

In the case of the first embodiment, since the beam LB from the light source device 14 is pulsed light, the spot light SP projected on the drawing line SLn during the main scanning corresponds to the oscillation frequency Fs of the beam LB. And become discrete. Therefore, it is necessary to overlap the spot light SP projected by one pulse light of the beam LB and the spot light SP projected by the next one pulse light in the main scanning direction. The amount of overlap is set by the size φ of the spot light SP, the scanning speed of the spot light SP, and the oscillation frequency Fs of the beam LB, but when the intensity distribution of the spot light SP is approximated by a Gaussian distribution, It is preferable to overlap the effective diameter size φ determined by 1 / e ² (or 1/2) of the SP peak intensity by about φ / 2. Therefore, also in the sub-scanning direction (direction perpendicular to the drawing line SLn), the substrate FS effectively applies the spot light SP between one scanning of the spot light SP along the drawing line SLn and the next scanning. It is desirable to set so as to move by a distance of about half or less of a large size φ. In addition, the exposure amount to the photosensitive functional layer on the substrate FS can be set by adjusting the peak value of the beam LB (pulse light), but the exposure amount can be increased in a situation where the intensity of the beam LB cannot be increased. If so, the main scanning of the spot light SP is caused by either a decrease in the scanning speed of the spot light SP in the main scanning direction, an increase in the oscillation frequency Fs of the beam LB, or a decrease in the transport speed in the sub scanning direction of the substrate FS. The overlap amount in the direction or the sub-scanning direction may be increased to ½ or more of the effective size φ.

  The plurality of scanning units Un (U1 to U6) repeatedly scan the spot light SP of the beam LBn according to a predetermined order (predetermined order). For example, when the order of the scanning units Un that scan the spot light SP is U1 → U2 → U3 → U4 → U5 → U6, first, the scanning unit U1 scans the spot light SP once. . When the scanning of the spot light SP of the scanning unit U1 is completed, the scanning unit U2 performs the scanning of the spot light SP once, and when the scanning is completed, the scanning unit U3 performs the scanning of the spot light SP once. In addition, the plurality of scanning units Un (U1 to U6) scan the spot light SP once in a predetermined order. Then, when the scanning of the spot light SP of the scanning unit U6 is completed, the scanning returns to the scanning of the spot light SP of the scanning unit U1. As described above, the plurality of scanning units Un (U1 to U6) repeat the scanning of the spot light SP in a predetermined order.

  Each scanning unit Un (U1 to U6) irradiates each beam LBn toward the substrate FS so that each beam LBn travels toward the central axis AXo of the rotary drum DR at least in the XZ plane. Thereby, the optical path (beam central axis) of the beam LBn traveling from each scanning unit Un (U1 to U6) toward the substrate FS is coaxial (parallel) with the normal line of the irradiated surface of the substrate FS in the XZ plane. . Further, each scanning unit Un (U1 to U6) is configured such that the beam LBn irradiated to the drawing line SLn (SL1 to SL6) is perpendicular to the irradiated surface of the substrate FS in a plane parallel to the YZ plane. The beam LBn is irradiated toward the substrate FS. That is, the beam LBn (LB1 to LB6) projected onto the substrate FS is scanned in a telecentric state with respect to the main scanning direction of the spot light SP on the irradiated surface. Here, a line (or an optical axis) perpendicular to the irradiated surface of the substrate FS through each midpoint of the drawing lines SLn (SL1 to SL6) defined by each scanning unit Un (U1 to U6), Called the irradiation center axis Len (Le1 to Le6).

  Each irradiation central axis Len (Le1 to Le6) is a line connecting the drawing lines SL1 to SL6 and the central axis AXo on the XZ plane. The irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 are in the same direction in the XZ plane, and the irradiation center axes Le2 of the even-numbered scanning units U2, U4, U6. , Le4 and Le6 are in the same direction in the XZ plane. Further, the irradiation center axes Le1, Le3, Le5 and the irradiation center axes Le2, Le4, Le6 are set so that the angle is ± θ with respect to the center plane Poc in the XZ plane (see FIG. 1).

  The alignment microscope AMm (AM1 to AM4) shown in FIG. 1 is for detecting alignment marks MKm (MK1 to MK4) formed on the substrate FS as shown in FIG. A plurality (four in the first embodiment) are provided. The alignment marks MKm (MK1 to MK4) are reference marks for relatively aligning (aligning) the predetermined pattern drawn in the exposure region W on the irradiated surface of the substrate FS and the substrate FS. . The alignment microscope AMm (AM1 to AM4) detects the alignment mark MKm (MK1 to MK4) on the substrate FS supported by the circumferential surface of the rotary drum DR. The alignment microscope AMm (AM1 to AM4) has a substrate FS that is more than the irradiated region (region surrounded by the drawing lines SL1 to SL6) on the substrate FS by the spot light SP of the beam LBn (LB1 to LB6) from the exposure head 18. Is provided on the upstream side (−X direction side) in the transport direction.

  The alignment microscope AMm (AM1 to AM4) obtains an enlarged image of a local region (observation region) including a light source that projects alignment illumination light onto the substrate FS and an alignment mark MKm (MK1 to MK4) on the surface of the substrate FS. An observation optical system (including an objective lens) and an imaging element such as a CCD or CMOS that captures an enlarged image of the observation optical system with a high-speed shutter while the substrate FS is moving in the transport direction. Imaging signals (image data) ig (ig1 to ig4) captured by the alignment microscope AMm (AM1 to AM4) are sent to the control device 20. The control device 20 analyzes the image of the imaging signal ig (ig1 to ig4), information on the rotational position of the rotating drum DR at the moment of imaging (measured values by the encoders EN1a and EN1b that read the scale portion SD shown in FIG. 2), and Based on the above, the position of the alignment mark MKm (MK1 to MK4) is detected, and the position of the substrate FS is measured with high accuracy. Note that the illumination light for alignment is light in a wavelength region that has little sensitivity to the photosensitive functional layer on the substrate FS, for example, light having a wavelength of about 500 to 800 nm.

  The alignment marks MK1 to MK4 are provided around each exposure area W. A plurality of alignment marks MK1 and MK4 are formed on both sides of the exposure region W in the width direction of the substrate FS at a constant interval Dh along the longitudinal direction of the substrate FS. The alignment mark MK1 is formed on the −Y direction side in the width direction of the substrate FS, and the alignment mark MK4 is formed on the + Y direction side in the width direction of the substrate FS. Such alignment marks MK1 and MK4 are located at the same position in the longitudinal direction (X direction) of the substrate FS when the substrate FS is not deformed due to a large tension or a thermal process. Be placed. Further, alignment marks MK2 and MK3 are between alignment mark MK1 and alignment mark MK4, and extend in the width direction (short direction) of substrate FS in the margins of exposure region W between the + X direction side and the −X direction side. Is formed. The alignment marks MK2 and MK3 are formed between the exposure area W and the exposure area W. The alignment mark MK2 is formed on the −Y direction side in the width direction of the substrate FS, and the alignment mark MK3 is formed on the + Y direction side of the substrate FS.

  Further, the Y-direction interval between the alignment mark MK1 and the margin alignment mark MK2 arranged at the −Y direction side edge of the substrate FS, the Y-direction interval between the margin alignment mark MK2 and the alignment mark MK3, and The interval in the Y direction between the alignment mark MK4 arranged at the side edge in the + Y direction of the substrate FS and the alignment mark MK3 in the blank portion is set to the same distance. These alignment marks MKm (MK1 to MK4) may be formed together when the first pattern layer is formed. For example, when the pattern of the first layer is exposed, the alignment mark pattern may be exposed around the exposure area W where the pattern is exposed. The alignment mark MKm may be formed in the exposure area W. For example, it may be formed in the exposure area W along the outline of the exposure area W. Further, when the alignment mark MKm is formed in the exposure region W, a pattern portion at a specific position or a specific shape portion in the pattern of the electronic device formed in the exposure region W may be used as the alignment mark MKm. Good.

  The alignment microscope AM1 is arranged so as to image the alignment mark MK1 existing in the observation region (detection region) Vw1 by the objective lens. Similarly, the alignment microscopes AM2 to AM4 are arranged so as to image the alignment marks MK2 to MK4 existing in the observation areas Vw2 to Vw4 by the objective lens. Therefore, the plurality of alignment microscopes AM1 to AM4 are provided in order of the alignment microscopes AM1 to AM4 from the −Y direction side of the substrate FS corresponding to the positions of the plurality of alignment marks MK1 to MK4. In the alignment microscope AMm (AM1 to AM4), with respect to the X direction, the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw (Vw1 to Vw4) of the alignment microscope AMm is greater than the length of the exposure region W in the X direction. Is also provided to be shorter. The number of alignment microscopes AMm provided in the Y direction can be changed according to the number of alignment marks MKm formed in the width direction of the substrate FS. The size of the observation regions Vw1 to Vw4 on the surface to be irradiated of the substrate FS is set according to the size of the alignment marks MK1 to MK4 and the alignment accuracy (position measurement accuracy), but is about 100 to 500 μm square. That's it.

  As shown in FIG. 2, scale parts SD (SDa, SDb) having scales formed in an annular shape over the entire circumferential direction of the outer peripheral surface of the rotary drum DR are provided at both ends of the rotary drum DR. Yes. The scale portion SD (SDa, SDb) is a diffraction grating in which concave or convex grating lines are engraved at a constant pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotary drum DR, and an incremental scale. Configured as The scale portion SD (SDa, SDb) rotates integrally with the rotary drum DR around the central axis AXo. In addition, a plurality of encoders (scale reading heads) ENn are provided so as to face the scale portion SD (SDa, SDb). This encoder ENn optically detects the rotational position of the rotary drum DR. Three encoders ENn (EN1a, EN2a, EN3a) are provided to face the scale portion SDa provided at the end portion on the −Y direction side of the rotary drum DR. Similarly, three encoders ENn (EN1b, EN2b, EN3b) are provided so as to face the scale part SDb provided at the + Y direction side end of the rotary drum DR.

  The encoder ENn (EN1a to EN3a, EN1b to EN3b) projects a measurement light beam toward the scale part SD (SDa, SDb), and photoelectrically detects the reflected light beam (diffracted light), thereby generating a pulse signal. A certain detection signal is output to the control device 20. The control device 20 counts the detection signal (pulse signal) with the counter circuit 106a (see FIG. 13), thereby measuring the rotation angle position and the angle change of the rotary drum DR with submicron resolution. The counter circuit 106a individually counts the detection signals of the encoders ENn (EN1a to EN3a, EN1b to EN3b). The control device 20 can also measure the transport speed of the substrate FS from the angle change of the rotary drum DR. The counter circuit 106a that individually counts the detection signals of the respective encoders ENn (EN1a to EN3a, EN1b to EN3b) is configured such that each encoder ENn (EN1a to EN3a, EN1b to EN3b) is one in the circumferential direction of the scale portions SDa and SDb. When the origin mark (origin pattern) ZZ formed on the part is detected, the count value corresponding to the encoder ENn is reset to zero.

  The encoders EN1a and EN1b are arranged on the installation direction line Lx1. The installation azimuth line Lx1 is a line connecting the projection position (reading position) of the light beam for measurement of the encoders EN1a and EN1b onto the scale part SD (SDa, SDb) and the central axis AXo on the XZ plane. Yes. Further, the installation orientation line Lx1 is a line connecting the observation region Vw (Vw1 to Vw4) of each alignment microscope AMm (AM1 to AM4) and the central axis AXo on the XZ plane.

  The encoders EN2a and EN2b are provided on the upstream side (−X direction side) in the transport direction of the substrate FS with respect to the center plane Poc, and further downstream (+ X direction) in the transport direction of the substrate FS from the encoders EN1a and EN1b. Side). The encoders EN2a and EN2b are arranged on the installation direction line Lx2. The installation orientation line Lx2 is a line connecting the projection position of the measurement light beam on the scale part SD (SDa, SDb) of the encoders EN2a, EN2b and the central axis AXo on the XZ plane. The installation azimuth line Lx2 overlaps with the irradiation center axes Le1, Le3, Le5 at the same angular position in the XZ plane.

  The encoders EN3a and EN3b are provided on the downstream side (+ X direction side) in the transport direction of the substrate FS with respect to the center plane Poc. The encoders EN3a and EN3b are arranged on the installation direction line Lx3. The installation azimuth line Lx3 is a line connecting the projection position of the measurement light beam on the scale part SD (SDa, SDb) of the encoders EN3a, EN3b and the central axis AXo on the XZ plane. This installation orientation line Lx3 overlaps with the irradiation center axes Le2, Le4, and Le6 at the same angular position in the XZ plane.

  The detection signal count value (rotation angle position) from the encoders EN1a and EN1b, the detection signal count value (rotation angle position) from the encoders EN2a and EN2b, and the detection signal count value (rotation angle) from the encoders EN3a and EN3b. The angle position) is reset to zero at the moment when each encoder ENn detects the origin mark ZZ provided at one place in the rotating direction of the rotary drum DR. Therefore, when the count value based on the encoders EN1a and EN1b is a first value (for example, 100), the position on the installation direction line Lx1 of the substrate FS wound around the rotary drum DR (each of the alignment microscopes AM1 to AM4). When the first positions on the substrate FS are transferred to positions on the installation azimuth line Lx2 (positions of the drawing lines SL1, SL3, and SL5) when the observation areas Vw1 to Vw4 are set to the first position. The count value based on the encoders EN2a and EN2b is a first value (for example, 100). Similarly, when the first position on the substrate FS is transported to the position on the installation direction line Lx3 (the positions of the drawing lines SL2, SL4, and SL6), the count value of the detection signal based on the encoders EN3a and EN3b is the first value. (For example, 100).

  Incidentally, the substrate FS is wound inside the scale portions SDa and SDb at both ends of the rotary drum DR. In FIG. 1, the radius from the central axis AXo of the outer peripheral surface of the scale part SD (SDa, SDb) is set smaller than the radius from the central axis AXo of the outer peripheral surface of the rotating drum DR. However, as shown in FIG. 2, the outer peripheral surface of the scale part SD (SDa, SDb) may be set to be the same surface as the outer peripheral surface of the substrate FS wound around the rotary drum DR. That is, the radius (distance) from the central axis AXo of the outer peripheral surface of the scale part SD (SDa, SDb) and the radius from the central axis AXo of the outer peripheral surface (irradiated surface) of the substrate FS wound around the rotary drum DR ( The distance may be set to be the same. Thereby, the encoder ENn (EN1a, EN1b, EN2a, EN2b, EN3a, EN3b) detects the scale portion SD (SDa, SDb) at the same radial position as the irradiated surface of the substrate FS wound around the rotary drum DR. It is possible to reduce the Abbe error caused by the difference between the measurement position by the encoder ENn and the processing positions (drawing lines SL1 to SL6) in the radial direction of the rotary drum DR.

  From the above, based on the position of the alignment mark MKm (MK1 to MK4) detected by the alignment microscope AMm (AM1 to AM4) (count value by the encoders EN1a and EN1b), the control device 20 performs the longitudinal direction of the substrate FS. The drawing exposure start position in the exposure area W in the (X direction) is determined, and the count value based on the encoders EN1a and EN1b is set to a first value (for example, 100). In this case, when the count value based on the encoders EN2a and EN2b becomes a first value (for example, 100), the drawing exposure start position of the exposure region W in the longitudinal direction of the substrate FS is on the drawing lines SL1, SL3, and SL5. Located in. Accordingly, the scanning units U1, U3, and U5 can start scanning the spot light SP based on the count values of the encoders EN2a and EN2b. When the count value based on the encoders EN3a and EN3b becomes a first value (for example, 100), the drawing exposure start position of the exposure region W in the longitudinal direction of the substrate FS is positioned on the drawing lines SL2, SL4, and SL6. To do. Therefore, the scanning units U2, U4, and U6 can start scanning the spot light SP based on the count values of the encoders EN3a and EN3b.

  FIG. 4 is a diagram showing the configuration of the light source device (pulse light source device, pulse laser device) 14. The light source device 14 as a fiber laser device includes a DFB semiconductor laser element 30, a DFB semiconductor laser element 32, a polarization beam splitter 34, an electro-optic element 36 as a drawing light modulator, a drive circuit 36a for the electro-optic element 36, a polarization A control circuit 52 including a beam splitter 38, an absorber 40, an excitation light source 42, a combiner 44, a fiber optical amplifier 46, wavelength conversion optical elements 48 and 50, a plurality of lens elements GL, and a clock generator 52a is provided.

  The DFB semiconductor laser element (first solid-state laser element) 30 generates sharp or sharp pulsed seed light (laser light) S1 at a predetermined frequency Fs, and the DFB semiconductor laser element (second solid-state laser element) 32 The pulsed seed light (laser light) S2 is generated at a predetermined frequency Fs. The seed light S1 generated by the DFB semiconductor laser element 30 and the seed light S2 generated by the DFB semiconductor laser element 32 have substantially the same energy per pulse, but the polarization states are different from each other, and the peak intensity is the seed light. S1 is stronger. In the first embodiment, the polarization state of the seed light S1 generated by the DFB semiconductor laser element 30 will be described as S-polarized light, and the polarization state of the seed light S2 generated by the DFB semiconductor laser element 32 will be described as P-polarized light. The DFB semiconductor laser elements 30 and 32 are seeded at a predetermined frequency (oscillation frequency) Fs by electrical control of the control circuit 52 in response to the clock signal LTC (predetermined frequency Fs) generated by the clock generator 52a. Control is performed to emit light S1 and S2. The control circuit 52 is controlled by the control device 20.

  The clock signal LTC, which will be described in detail later, is a clock signal CLK supplied to each of the counter units CN1 to CN6 (see FIG. 15) for designating addresses in the memory circuit of the bitmap-like drawing data. The clock signal LTC is obtained by dividing the clock signal LTC by n (n is preferably an integer of 2 or more). The clock generator 52a also has a function of adjusting a predetermined frequency (basic frequency) Fs of the clock signal LTC by ± ΔF, that is, a function of finely adjusting the time interval of pulse oscillation of the beam LB. Accordingly, for example, even if the scanning speed of the spot light SP slightly varies, the dimension (drawing magnification) of the pattern drawn over the drawing line SLn (scanning line) can be adjusted by finely adjusting the predetermined frequency Fs. Can be kept precise.

  The polarization beam splitter 34 transmits S-polarized light and reflects P-polarized light, and includes seed light S1 generated by the DFB semiconductor laser element 30 and seed light S2 generated by the DFB semiconductor laser element 32. Is guided to the electro-optic element 36. Specifically, the polarization beam splitter 34 transmits the S-polarized seed light S1 generated by the DFB semiconductor laser element 30 to guide the seed light S1 to the electro-optical element 36, and the P-polarized light generated by the DFB semiconductor laser element 32. The seed light S2 is guided to the electro-optic element 36 by reflecting the seed light S2. The DFB semiconductor laser elements 30 and 32 and the polarization beam splitter 34 constitute a laser light source unit 35 that generates seed lights S1 and S2.

  The electro-optic element 36 is transmissive to the seed lights S1 and S2, and for example, an electro-optic modulator (EOM) is used. In response to the high / low state of the drawing bit string data Sdw (or serial data DLn), the electro-optical element 36 switches the polarization states of the seed lights S1 and S2 that have passed through the polarization beam splitter 34 by the drive circuit 36a. is there. The drawing bit string data Sdw is generated based on pattern data (bit pattern) corresponding to the pattern to be exposed by each of the scanning units U1 to U6. The seed light S1 and S2 from each of the DFB semiconductor laser element 30 and the DFB semiconductor laser element 32 has a long wavelength range of 800 nm or more, and therefore, the electro-optic element 36 having a polarization state switching response of about GHz is used. Can do.

  The pattern data is provided for each scanning unit Un, and this pattern data has the direction along the scanning direction (main scanning direction, Y direction) of the spot light SP as the row direction, and the transport direction (sub-scanning direction, This is bitmap data composed of a plurality of pixel data decomposed two-dimensionally so that the direction along the (X direction) is the column direction. This pixel data is 1-bit data of “0” or “1”. The pixel data “0” means that the intensity of the spot light SP irradiated on the substrate FS is set to a low level, and the pixel data “1” is a level where the intensity of the spot light SP irradiated on the substrate FS is high. That means Pixel data for one column of pattern data corresponds to one drawing line SLn (SL1 to SL6), and is projected onto the substrate FS along one drawing line SLn (SL1 to SL6). The intensity of the spot light SP is modulated according to the pixel data for one column. This one column of pixel data is called serial data DLn. That is, the pattern data is bitmap data in which serial data DLn are arranged in the column direction. Serial data DLn of the pattern data of the scanning unit U1 is represented by DL1, and similarly, serial data DLn of the pattern data of the scanning units U2 to U6 is represented by DL2 to DL6.

  Further, since the plurality of scanning units U1 to U6 repeat the operation of scanning the spot light SP once in a predetermined order, the serial data DLn of the pattern data of each scanning unit Un correspondingly corresponds to the predetermined data. Are output to the drive circuit 36a in this order. The serial data DLn sequentially output to the drive circuit 36a is referred to as drawing bit string data Sdw. For example, when the predetermined order is U1 → U2 →... → U6, first, serial data DL1 for one column is output to the drive circuit 36a, and then serial data for one column. The serial data DL1 to DL6 for one column constituting the drawing bit string data Sdw is sequentially output to the drive circuit 36a, such as DL2 is output to the drive circuit 36a. Thereafter, the serial data DL1 to DL6 of the next column are sequentially output to the drive circuit 36a as the drawing bit string data Sdw. A specific configuration for outputting the drawing bit string data Sdw to the drive circuit 36a will be described in detail later.

  When the 1-bit pixel data of the drawing bit string data Sdw (or serial data DLn) input to the drive circuit 36a is in the low (“0”) state, the electro-optical element 36 does not change the polarization state of the seed lights S1 and S2. To the polarization beam splitter 38 as it is. On the other hand, when the 1-bit pixel data of the drawing bit string data Sdw (or DLn) input to the drive circuit 36a is in a high (“1”) state, the electro-optical element 36 is in the polarization state of the incident seed lights S1 and S2. Is changed, that is, the polarization direction is changed by 90 degrees and guided to the polarization beam splitter 38. By driving the electro-optical element 36 in this manner, the electro-optical element 36 causes the S-polarized seed light S1 when the pixel data of the drawing bit string data Sdw (or serial data DLn) is in a high state (“1”). Is converted to P-polarized seed light S1, and P-polarized seed light S2 is converted to S-polarized seed light S2.

  The polarization beam splitter 38 transmits P-polarized light and guides it to the combiner 44 via the lens element GL, and reflects S-polarized light to the absorber 40. The excitation light source 42 generates excitation light, and the generated excitation light is guided to the combiner 44 through the optical fiber 42a. The combiner 44 combines the seed light and the excitation light irradiated from the polarization beam splitter 38 and outputs the combined light to the fiber optical amplifier 46. The fiber optical amplifier 46 is doped with a laser medium that is pumped by pumping light. Therefore, in the fiber optical amplifier 46 that transmits the synthesized seed light and pump light, the seed light is amplified by exciting the laser medium with the pump light. As the laser medium doped in the fiber optical amplifier 46, rare earth elements such as erbium (Er), ytterbium (Yb), thulium (Tm) are used. The amplified seed light is emitted from the emission end 46 a of the fiber optical amplifier 46 with a predetermined divergence angle, converged or collimated by the lens element GL, and enters the wavelength conversion optical element 48.

The wavelength conversion optical element (first wavelength conversion optical element) 48 generates the incident seed light (wavelength λ) by the second harmonic generation (SHG) into the second half of the wavelength λ. Convert to harmonics. As the wavelength conversion optical element 48, a PPLN (Periodically Poled LiNbO ₃ ) crystal which is a quasi phase matching (QPM) crystal is preferably used. It is also possible to use a PPLT (Periodically Poled LiTaO ₃ ) crystal or the like.

  The wavelength conversion optical element (second wavelength conversion optical element) 50 includes the second harmonic (wavelength λ / 2) converted by the wavelength conversion optical element 48 and the seed light remaining without being converted by the wavelength conversion optical element 48. A third frequency with a wavelength of 1/3 of λ is generated by sum frequency generation (SFG) with (wavelength λ). This third harmonic becomes ultraviolet light (beam LB) having a peak wavelength in a wavelength band of 370 mm or less.

  As described above, when the 1-bit pixel data of the drawing bit string data Sdw (or serial data DLn) applied to the drive circuit 36a is low (“0”), the electro-optic element 36 has the incident seed light S1, The light is guided to the polarization beam splitter 38 as it is without changing the polarization state of S2. Therefore, the seed light passing through the polarization beam splitter 38 becomes seed light S2. Therefore, the P-polarized beam LB finally output from the light source device 14 has the same oscillation profile (time characteristic) as the seed light S2 from the DFB semiconductor laser element 32. In other words, in this case, the beam LB has a low pulse peak intensity and has a time-broad and dull characteristic. Since the fiber optical amplifier 46 has low amplification efficiency with respect to the seed light S2 having such a low peak intensity, the beam LB emitted from the light source device 14 becomes light that is not amplified to the energy required for exposure. Therefore, from the viewpoint of exposure, the light source device 14 has substantially the same result as not emitting the beam LB. That is, the intensity of the spot light SP irradiated on the substrate FS is at a low level. However, in the period when the pattern is not exposed (non-exposure period), the ultraviolet light beam LB derived from the seed light S2 is continuously irradiated even at a slight intensity, so that the drawing lines SL1 to SL6 have a long time. When the state at the same position on the substrate FS continues (for example, when the substrate FS is stopped due to a trouble in the transport system), a movable shutter is provided on the exit window (not shown) of the beam LB of the light source device 14. And close the exit window.

  On the other hand, when the 1-bit pixel data of the drawing bit string data Sdw (or serial data DLn) applied to the drive circuit 36a is high (“1”), the electro-optic element 36 causes the polarization of the incident seed lights S1 and S2 to be polarized. The state is changed and guided to the polarization beam splitter 38. Therefore, the seed light transmitted through the polarization beam splitter 38 becomes the seed light S1. Therefore, the beam LB emitted from the light source device 14 is generated from the seed light S 1 from the DFB semiconductor laser element 30. Since the seed light S1 from the DFB semiconductor laser element 30 has a high peak intensity, the P-polarized beam LB that is efficiently amplified by the fiber optical amplifier 46 and output from the light source device 14 is energy required for exposure of the substrate FS. have. That is, the intensity of the spot light SP irradiated on the substrate FS is at a high level.

  As described above, since the electro-optic element 36 serving as the drawing light modulator is provided in the light source device 14, the scanning unit Un (U1 to U6) scans by controlling one electro-optic element 36. The intensity of the spot light SP can be modulated according to the pattern to be drawn. Therefore, the beam LB emitted from the light source device 14 becomes a drawing beam whose intensity is modulated.

  In the configuration of FIG. 4, the DFB semiconductor laser element 32 and the polarization beam splitter 34 are omitted, and only the seed light S1 from the DFB semiconductor laser element 30 is switched by switching the polarization state of the electro-optic element 36 based on the drawing data. It is also conceivable to guide the fiber optical amplifier 46 in a burst wave shape. However, when this configuration is adopted, the periodicity of incidence of the seed light S1 on the fiber optical amplifier 46 is greatly disturbed according to the pattern to be drawn. That is, when the seed light S1 from the DFB semiconductor laser element 30 does not enter the fiber optical amplifier 46 and then the seed light S1 enters the fiber optical amplifier 46, the seed light S1 immediately after the incident is more than normal. There is a problem that a beam is amplified with a large amplification factor and a beam having a greater intensity than specified is generated from the fiber optical amplifier 46. Therefore, in the first embodiment, as a preferable aspect, the seed light S2 (broad pulse light with low peak intensity) from the DFB semiconductor laser element 32 is used in a period in which the seed light S1 is not incident on the fiber optical amplifier 46. By entering the fiber optical amplifier 46, such a problem is solved.

  Although the electro-optic element 36 is switched, the DFB semiconductor laser elements 30 and 32 may be driven based on the drawing bit string data Sdw (or serial data DLn). That is, the control circuit 52 controls the DFB semiconductor laser elements 30 and 32 based on the drawing bit string data Sdw (or serial data DLn), and selectively selects the seed lights S1 and S2 that oscillate in a pulse shape at the predetermined frequency Fs. (Alternatively) generated. In this case, the polarization beam splitters 34 and 38, the electro-optic element 36, and the absorber 40 are not necessary, and one of the seed lights S1 and S2 selectively pulse-oscillated from any one of the DFB semiconductor laser elements 30 and 32. Is directly incident on the combiner 44. At this time, the control circuit 52 prevents the seed light S1 from the DFB semiconductor laser element 30 and the seed light S2 from the DFB semiconductor laser element 32 from entering the fiber optical amplifier 46 at the same time. 32 drive is controlled. That is, when the spot light SP of each beam LBn is irradiated onto the substrate FS, the DFB semiconductor laser element 30 is controlled so that only the seed light S1 enters the fiber optical amplifier 46. When the substrate FS is not irradiated with the spot light SP of each beam LBn (the intensity of the spot light SP is extremely low), the DFB semiconductor laser element 32 is set so that only the seed light S2 enters the fiber optical amplifier 46. Control. As described above, whether or not the substrate FS is irradiated with the beam LBn is determined based on the pixel data (H or L). In this case, the polarization states of the seed lights S1 and S2 may be P-polarized light.

  FIG. 5 is a configuration diagram of the beam switching member 16. The beam switching member 16 includes a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of reflection mirrors M1 to M12, a plurality of unit side incident mirrors IM1 to IM6, It has several collimating lenses CL1-CL6 and absorber TR. The selection optical elements AOMn (AOM1 to AOM6) are transmissive to the beam LB, and are acousto-optic modulators (AOMs) driven by ultrasonic signals. These optical members (selection optical elements AOM1 to AOM6, condensing lenses CD1 to CD6, reflecting mirrors M1 to M12, unit side incident mirrors IM1 to IM6, collimating lenses CL1 to CL6, and absorber TR) are: It is supported by a plate-like support member IUB. The support member IUB supports these optical members from below (the −Z direction side) above the plurality of scanning units Un (U1 to U6). Therefore, the support member IUB also has a function of insulating between the selection optical element AOMn (AOM1 to AOM6) serving as a heat generation source and the plurality of scanning units Un (U1 to U6).

  The beam LB from the light source device 14 is guided by the reflecting mirrors M <b> 1 to M <b> 12 so that its optical path is bent in a spiral shape and guided to the absorber TR. Hereinafter, the case where all the optical elements for selection AOMn (AOM1 to AOM6) are in an off state (a state where no ultrasonic signal is applied) will be described in detail. A beam LB (parallel light beam) from the light source device 14 travels in the + Y direction in parallel with the Y axis and enters the reflection mirror M1 through the condenser lens CD1. The beam LB reflected by the reflecting mirror M1 toward the −X direction side passes straight through the first selection optical element AOM1 disposed at the focal position (beam waist position) of the condenser lens CD1, and is again reflected by the collimating lens CL1. It is made a parallel light beam and reaches the reflection mirror M2. The beam LB reflected on the + Y direction side by the reflection mirror M2 is reflected on the + X direction side by the reflection mirror M3 after passing through the condenser lens CD2.

  The beam LB reflected by the reflecting mirror M3 passes straight through the second selection optical element AOM2 arranged at the focal position (beam waist position) of the condenser lens CD2, and is converted into a parallel beam again by the collimating lens CL2. To the reflection mirror M4. The beam LB reflected on the + Y direction side by the reflection mirror M4 passes through the condenser lens CD3 and then is reflected on the −X direction side by the reflection mirror M5. The beam LB reflected by the reflecting mirror M5 toward the −X direction side passes straight through the third selection optical element AOM3 disposed at the focal position (beam waist position) of the condenser lens CD3, and is collimated by the collimating lens CL3. The light beam is again converted into a parallel light beam and reaches the reflection mirror M6. The beam LB reflected on the + Y direction side by the reflection mirror M6 passes through the condenser lens CD4 and then is reflected on the + X direction side by the reflection mirror M7.

  The beam LB reflected by the reflection mirror M7 passes straight through the fourth selection optical element AOM4 arranged at the focal position (beam waist position) of the condenser lens CD4, and is converted into a parallel beam again by the collimator lens CL4. To the reflection mirror M8. The beam LB reflected on the + Y direction side by the reflection mirror M8 passes through the condenser lens CD5 and then is reflected on the -X direction side by the reflection mirror M9. The beam LB reflected by the reflecting mirror M9 in the −X direction side passes straight through the fifth selection optical element AOM5 disposed at the focal position (beam waist position) of the condenser lens CD5, and is collimated by the collimating lens CL5. The light beam is again converted into a parallel light beam and reaches the reflection mirror M10. The beam LB reflected on the + Y direction side by the reflection mirror M10 is reflected on the + X direction side by the reflection mirror M11 after passing through the condenser lens CD6. The beam LB reflected by the reflecting mirror M11 passes straight through the sixth selection optical element AOM6 disposed at the focal position (beam waist position) of the condenser lens CD6, and is converted into a parallel beam again by the collimating lens CL6. Then, after being reflected by the reflecting mirror M12 toward the −Y direction, the light reaches the absorber TR. The absorber TR is an optical trap that absorbs the beam LB in order to suppress leakage of the beam LB to the outside.

  As described above, the selection optical elements AOM1 to AOM6 are arranged so as to sequentially transmit the beam LB from the light source device 14, and each of the selection optical elements AOM1 to AOM6 is selected by the condenser lenses CD1 to CD6 and the collimator lenses CL1 to CL6. The optical elements AOM1 to AOM6 are arranged so that the beam waist of the beam LB is formed inside. As a result, the diameter of the beam LB incident on the selection optical elements AOM1 to AOM6 (acousto-optic modulation elements) is reduced to increase the diffraction efficiency and improve the responsiveness.

  Each optical element for selection AOMn (AOM1 to AOM6) diffracts an incident beam LB (0th order light) with a diffraction angle corresponding to a high frequency when an ultrasonic signal (high frequency signal) is applied. The next diffracted light is generated as an exit beam (beam LBn). In the first embodiment, the beams LBn emitted as the first-order diffracted light from each of the plurality of selection optical elements AOMn (AOM1 to AOM6) are referred to as beams LB1 to LB6, and the selection optical elements AOMn (AOM1 to AOM6). ) Is treated as having the function of deflecting the optical path of the beam LB from the light source device 14. However, since the actual acousto-optic modulation element has a generation efficiency of the first-order diffracted light of about 80% of the zero-order light, the beams LB1 to LB6 deflected by the selection optical elements AOMn (AOM1 to AOM6) are It is lower than the intensity of the original beam LB. Further, when any one of the optical elements for selection AOMn (AOM1 to AOM6) is in the on state, about 20% of zero-order light that travels straight without being diffracted remains, but is finally absorbed by the absorber TR. .

  Further, since the optical element for selection AOMn is a diffraction grating that causes a periodic coarse / fine change in refractive index in a predetermined direction in the transmission member by ultrasonic waves, the incident beam LB is linearly polarized light (P-polarized light or S-polarized light). In some cases, the polarization direction and the periodic direction of the diffraction grating are set so that the generation efficiency (diffraction efficiency) of the first-order diffracted light is the highest. As shown in FIG. 5, when the beam LB on which the selection optical element AOMn is incident is diffracted and deflected in the Z direction, the periodic direction of the diffraction grating generated in the selection optical element AOMn is also the Z direction. Therefore, the polarization direction of the beam LB from the light source device 14 is set (adjusted) so as to match it.

  Furthermore, as shown in FIG. 5, each of the plurality of optical elements for selection AOMn (AOM1 to AOM6) has deflected beams LB1 to LB6 (first-order diffracted light) in the −Z direction with respect to the incident beam LB. Installed to deflect. Beams LB1 to LB6 deflected and emitted from each of the selection optical elements AOMn (AOM1 to AOM6) are incident on the unit side provided at positions separated from each of the selection optical elements AOMn (AOM1 to AOM6) by a predetermined distance. The light is projected onto the mirrors IM1 to IM6, and is reflected so as to be parallel (coaxial) to the irradiation center axes Le1 to Le6 in the -Z direction. The beams LB1 to LB6 reflected by the unit side incident mirrors IM1 to IM6 (hereinafter also simply referred to as mirrors IM1 to IM6) pass through each of the openings TH1 to TH6 formed in the support member IUB and pass through the irradiation center axis Le1. It is incident on each of the scanning units Un (U1 to U6) along -Le6.

  The configurations, functions, functions, etc. of the optical elements for selection AOMn (AOM1 to AOM6) may be the same. The plurality of optical elements for selection AOMn (AOM1 to AOM6) turn on / off the generation of diffracted light obtained by diffracting the incident beam LB in accordance with on / off of a drive signal (high frequency signal) from the control device 20. For example, the selection optical element AOM1 transmits the incident beam LB without being diffracted when the drive signal (high-frequency signal) from the control device 20 is not applied and is in the off state. Therefore, the beam LB transmitted through the selection optical element AOM1 is transmitted through the collimator lens CL1 and is incident on the reflection mirror M2. On the other hand, the selection optical element AOM1 diffracts the incident beam LB toward the mirror IM1 when the drive signal from the control device 20 is applied and is on. That is, the selection optical element AOM1 is switched by this drive signal. The mirror IM1 reflects the beam LB1 diffracted by the selection optical element AOM1 toward the scanning unit U1. The beam LB1 reflected by the mirror IM1 enters the scanning unit U1 along the irradiation center axis Le1 through the opening TH1 of the support member IUB. Therefore, the mirror IM1 reflects the incident beam LB1 so that the optical axis of the reflected beam LB1 is coaxial with the irradiation center axis Le1. Further, when the selection optical element AOM1 is in the on state, the 0th-order light (intensity of about 20% of the incident beam) of the beam LB that is transmitted straight through the selection optical element AOM1 is the collimating lenses CL1 to CL6 thereafter. The light passes through the condenser lenses CD2 to CD6, the reflection mirrors M2 to M12, and the optical elements for selection AOM2 to AOM6 and reaches the absorber TR.

  6A is a diagram of switching of the optical path of the beam LB by the selection optical element AOM1 from the + Z direction side, and FIG. 6B is a diagram of switching of the optical path of the beam LB by the selection optical element AOM1 from the −Y direction side. It is. When the drive signal is OFF, the selection optical element AOM1 transmits the incident beam LB directly toward the reflection mirror M2 without being diffracted. On the other hand, when the drive signal is on, the selection optical element AOM1 generates a beam LB1 obtained by diffracting the incident beam LB in the −Z direction, and directs the beam LB1 toward the mirror IM1. Therefore, in the XY plane, the beam LB1 (1) is related to the Z direction without changing the traveling direction of the beam LB (0th order light) emitted from the selection optical element AOM1 and the deflected beam LB1 (first order diffracted light). The traveling direction of the next diffracted light is changed. In this way, the control device 20 switches the selection optical element AOM1 by turning on / off (high / low) the drive signal (high frequency signal) to be applied to the selection optical element AOM1, and thereby the beam LB. Switches to the subsequent selection optical element AOM2 or the deflected beam LB1 goes to the scanning unit U1.

  Similarly, when the drive signal (high frequency signal) from the control device 20 is off, the selection optical element AOM2 is incident on the beam LB (the beam LB transmitted without being diffracted by the selection optical element AOM1). Is transmitted to the collimator lens CL2 side (reflection mirror M4 side) without being diffracted, and when the drive signal from the control device 20 is on, the beam LB2, which is the diffracted light of the incident beam LB, is directed to the mirror IM2. Dodge. The mirror IM2 reflects the beam LB2 diffracted by the selection optical element AOM2 toward the scanning unit U2. The beam LB2 reflected by the mirror IM2 passes through the opening TH2 of the support member IUB and enters the scanning unit U2 coaxially with the irradiation center axis Le2. Further, when the drive signal (high frequency signal) from the control device 20 is in an off state, the selection optical elements AOM3 to AOM6 do not diffract the incident beam LB (the reflection mirror M6, When the drive signal from the control device 20 is on, the beams LB3 to LB6 that are the first-order diffracted lights of the incident beam LB are directed to the mirrors IM3 to IM6. The mirrors IM3 to IM6 reflect the beams LB3 to LB6 diffracted by the selection optical elements AOM3 to AOM6 toward the scanning units U3 to U6. The beams LB3 to LB6 reflected by the mirrors IM3 to IM6 are coaxial with the irradiation center axes Le3 to Le6 and enter the scanning units U3 to U6 through the openings TH3 to TH6 of the support member IUB. In this way, the control device 20 turns on / off (high / low) the drive signals (high-frequency signals) to be applied to the selection optical elements AOM2 to AOM6, whereby the selection optical elements AOM2 to AOM6 are switched. Either one of them is switched so that the beam LB goes to the subsequent selection optical element AOM3 to AOM6 or the absorber TR, or one of the deflected beams LB2 to LB6 goes to the corresponding scanning unit U2 to U6 Switch.

  As described above, the beam switching member 16 includes a plurality of selection optical elements AOMn (AOM1 to AOM6) arranged in series along the traveling direction of the beam LB from the light source device 14, and thereby the optical path of the beam LB. , And one scanning unit Un on which the beam LBn is incident can be selected. For example, when the beam LB1 is to be incident on the scanning unit U1, the selection optical element AOM1 is turned on. When the beam LB3 is to be incident on the scanning unit U3, the selection optical element AOM3 is turned on. . The plurality of selection optical elements AOMn (AOM1 to AOM6) are provided corresponding to the plurality of scanning units Un (U1 to U6), and switch whether or not the beam LBn is incident on the corresponding scanning unit Un. .

  Since the plurality of scanning units Un (U1 to U6) repeat the operation of scanning the spot light SP in a predetermined order, the beam switching member 16 corresponds to this, and any one of the beams LB1 to LB6 is incident. The scanning units U1 to U6 to be switched are switched. For example, when the order of the scanning units Un that perform the scanning of the spot light SP is U1 → U2 →... → U6, the beam switching member 16 also receives the beam LBn corresponding thereto. The scanning unit Un is switched in the order of U1 → U2 →.

  From the above, each optical element for selection AOMn (AOM1 to AOM6) of the beam switching member 16 is only for one scanning period of the spot light SP by each polygon mirror PM of the scanning unit Un (U1 to U6). As long as it is in the on state. As will be described in detail later, when the number of reflection surfaces of the polygon mirror PM is Np and the rotation speed of the polygon mirror PM is Vp (rpm), the time Tss corresponding to the rotation angle of one surface of the reflection surface RP of the polygon mirror PM is Tss = 60 / (Np × Vp) [seconds]. For example, when the number of reflecting surfaces Np is 8 and the rotation speed Vp is 30,000, one rotation of the polygon mirror PM is 2 milliseconds, and the time Tss is 0.25 milliseconds. This is 4 kHz in terms of frequency, and an acoustic wave having a considerably lower response frequency than an acousto-optic modulation element for modulating a beam LB having a wavelength in the ultraviolet region at a high speed of about several tens of MHz in response to drawing data. This means that an optical modulation element may be used. Therefore, the beams LB1 to LB6 (first order diffracted light) deflected with respect to the incident beam LB (0th order light) having a large diffraction angle can be used, and pass straight through the optical elements for selection AOM1 to AOM6. The arrangement of mirrors IM1 to IM6 (FIGS. 5, 6A, and 6B) for separating the deflected beams LB1 to LB6 is facilitated with respect to the path of the beam LB.

  Next, the optical configuration of the scanning units Un (U1 to U6) will be described with reference to FIG. In addition, since each scanning unit Un (U1-U6) has the same structure, only the scanning unit U1 is demonstrated and the description is abbreviate | omitted about the other scanning unit Un. In FIG. 7, the direction parallel to the irradiation center axis Len (Le1) is the Zt direction, and the substrate FS is on the plane orthogonal to the Zt direction, and the substrate FS passes from the process apparatus PR1 through the exposure apparatus EX to the process apparatus PR2. The direction going to the Xt direction is defined as the Yt direction, and the direction perpendicular to the Xt direction on the plane orthogonal to the Zt direction is defined as the Yt direction. That is, the three-dimensional coordinates Xt, Yt, and Zt in FIG. 7 are the same as the three-dimensional coordinates X, Y, and Z in FIG. 1, and the Z-axis direction is parallel to the irradiation center axis Len (Le1). The three-dimensional coordinates rotated as described above.

  As shown in FIG. 7, in the scanning unit U1, along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the irradiated surface of the substrate FS, the reflection mirror M20, the beam expander BE, the reflection mirror M21, and the polarization Beam splitter BS, reflection mirror M22, image shift optical member SR, field aperture FA, reflection mirror M23, λ / 4 wavelength plate QW, cylindrical lens CYa, reflection mirror M24, polygon mirror PM, fθ lens FT, reflection mirror M25, cylindrical A lens CYb is provided. Further, in the scanning unit U1, an optical lens system G10 and a photodetector DT1 for detecting reflected light from the irradiated surface of the substrate FS via the polarization beam splitter BS are provided.

  The beam LB1 incident on the scanning unit U1 travels in the −Zt direction, and is incident on the reflection mirror M20 inclined by 45 ° with respect to the XtYt plane. The axis of the beam LB1 incident on the scanning unit U1 is incident on the reflection mirror M20 so as to be coaxial with the irradiation center axis Le1. The reflection mirror M20 functions as an incident optical member that causes the beam LB1 to enter the scanning unit U1, and the incident beam LB1 is directed toward the reflection mirror M21 along the optical axis set parallel to the Xt axis in the −Xt direction. reflect. Therefore, the optical axis of the beam LB1 traveling parallel to the Xt axis is orthogonal to the irradiation center axis Le1 in a plane parallel to the XtZt plane. The beam LB1 reflected by the reflection mirror M20 passes through the beam expander BE arranged along the optical axis of the beam LB1 traveling in parallel with the Xt axis and enters the reflection mirror M21. The beam expander BE expands the diameter of the transmitted beam LB1. The beam expander BE includes a condensing lens Be1 and a collimating lens Be2 that collimates the beam LB1 that diverges after being converged by the condensing lens Be1.

  The reflection mirror M21 is disposed with an inclination of 45 ° with respect to the YtZt plane, and reflects the incident beam LB1 in the −Yt direction toward the polarization beam splitter BS. The polarization separation surface of the polarization beam splitter BS is inclined by 45 ° with respect to the YtZt plane, reflects a P-polarized beam, and transmits a linearly polarized (S-polarized) beam polarized in a direction orthogonal to the P-polarized light. Is. Since the beam LB1 incident on the scanning unit U1 is a P-polarized beam, the polarization beam splitter BS reflects the beam LB1 from the reflection mirror M21 in the -Xt direction and guides it to the reflection mirror M22 side.

  The reflection mirror M22 is disposed with an inclination of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the −Zt direction toward the reflection mirror M23 that is separated from the reflection mirror M22 in the −Zt direction. The beam LB1 reflected by the reflection mirror M22 passes through the image shift optical member SR and the field aperture (field stop) FA along the optical axis parallel to the Zt axis, and enters the reflection mirror M23. The image shift optical member SR two-dimensionally adjusts the center position in the cross section of the beam LB1 in a plane (XtYt plane) orthogonal to the traveling direction of the beam LB1. The image shift optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis of the beam LB1 traveling parallel to the Zt axis, and the parallel plate Sr1 can be tilted around the Xt axis. The parallel flat plate Sr2 can be tilted around the Yt axis. The parallel plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, so that the position of the center of the beam LB1 is shifted two-dimensionally by a minute amount on the XtYt plane orthogonal to the traveling direction of the beam LB1. The parallel plates Sr1 and Sr2 are driven by an actuator (drive unit) (not shown) under the control of the control device 20.

  The beam LB1 that has passed through the image shift optical member SR passes through the circular aperture of the field aperture FA and reaches the reflection mirror M23. The circular aperture of the field aperture FA is a stop that cuts the skirt portion of the intensity distribution in the cross section of the beam LB1 expanded by the beam expander BE. If a variable iris diaphragm having an adjustable aperture of the circular aperture of the field aperture FA is used, the intensity (luminance) of the spot light SP can be adjusted.

  The reflection mirror M23 is disposed at an angle of 45 ° with respect to the XtYt plane, and reflects the incident beam LB1 in the + Xt direction toward the reflection mirror M24 that is separated from the reflection mirror M23 in the + Xt direction. The beam LB1 reflected by the reflection mirror M23 passes through the λ / 4 wavelength plate QW and the cylindrical lens CYa and enters the reflection mirror M24. The reflection mirror M24 reflects the incident beam LB1 toward the polygon mirror (rotating polygon mirror, scanning deflection member) PM. The polygon mirror PM reflects the incident beam LB1 in the + Xt direction toward the fθ lens FT having the optical axis AXf parallel to the Xt axis. The polygon mirror PM deflects (reflects) the incident beam LB1 in a plane parallel to the XtYt plane in order to scan the spot light SP of the beam LB1 on the irradiated surface of the substrate FS. Specifically, the polygon mirror PM includes a rotation axis AXp extending in the Zt axis direction, and a plurality of reflection surfaces RP (eight reflection surfaces RP in the first embodiment) formed around the rotation axis AXp. Have By rotating the polygon mirror PM around the rotation axis AXp in a predetermined rotation direction, the reflection angle of the pulsed beam LB1 irradiated on the reflection surface RP can be continuously changed. Thereby, the reflection direction of the beam LB1 is deflected by one reflection surface RP, and the spot light SP of the beam LB1 irradiated on the irradiated surface of the substrate FS is along the scanning direction (the width direction of the substrate FS, the Yt direction). Can be scanned.

  The spot light SP of the beam LB1 can be scanned along the drawing line SL1 by one reflecting surface RP. For this reason, the number of drawing lines SL1 in which the spot light SP is scanned on the irradiated surface of the substrate FS by one rotation of the polygon mirror PM is eight, which is the same as the number of the reflecting surfaces RP. The polygon mirror PM is rotated at a constant speed by a polygon driving unit RM including a motor and the like. The rotation of the polygon mirror PM by the polygon drive unit RM is controlled by the control device 20. As described above, the effective length (for example, 30 mm) of the drawing line SL1 is set to a length equal to or shorter than the maximum scanning length (for example, 31 mm) that allows the spot light SP to be scanned by the polygon mirror PM. In the initial setting (design), the center point of the drawing line SL1 (the irradiation center axis Le1 passes) is set at the center of the maximum scanning length.

  As an example, the effective length of the drawing line SL1 is set to 30 mm, and the spot light SP is overlapped with the substrate line FS along the drawing line SL1 while overlapping the spot light SP having an effective size φ of 3 μm by 1.5 μm. In this case, the number of spot lights SP (number of pulses of the beam LB from the light source device 14) irradiated in one scan is 20000 (30 mm / 1.5 μm). Further, if the scanning time of the spot light SP along the drawing line SL1 is 200 μsec, the pulsed spot light SP must be irradiated 20000 times during this period, so the emission frequency Fs of the light source device 14 is Fs ≧ 20000. Times / 200 μsec = 100 MHz.

  The cylindrical lens CYa converges the incident beam LB1 in a slit shape on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) of the polygon mirror PM. Even if the reflecting surface RP is inclined with respect to the Zt direction (inclination of the reflecting surface RP with respect to the normal line of the XtYt plane) by the cylindrical lens CYa in which the generatrix is parallel to the Yt direction, the influence is exerted. It can suppress, and it suppresses that the irradiation position of beam LB1 irradiated on the to-be-irradiated surface of board | substrate FS shifts | deviates to a Xt direction.

  The fθ lens FT having the optical axis AXf extending in the Xt axis direction is a telecentric scan lens that projects the beam LB1 reflected by the polygon mirror PM onto the reflection mirror M25 so as to be parallel to the optical axis AXf on the XtYt plane. It is. The incident angle θ of the beam LB1 to the fθ lens FT changes according to the rotation angle (θ / 2) of the polygon mirror PM. The fθ lens FT projects the beam LB1 to the image height position on the irradiated surface of the substrate FS in proportion to the incident angle θ through the reflection mirror M25 and the cylindrical lens CYb. When the focal length is fo and the image height position is y, the fθ lens FT is designed to satisfy the relationship y = fo · θ. Therefore, the fθ lens FT enables the beam LB1 (spot light SP) to be scanned accurately at a constant speed in the Yt direction (Y direction). When the incident angle θ to the fθ lens FT is 0 degree, the beam LB1 incident on the fθ lens FT travels along the optical axis AXf.

  The reflection mirror M25 reflects the incident beam LB1 in the −Zt direction toward the substrate FS via the cylindrical lens CYb. By the fθ lens FT and the cylindrical lens CYb in which the generatrix is parallel to the Yt direction, the beam LB1 projected onto the substrate FS is a minute spot light having a diameter of about several μm (for example, 3 μm) on the irradiated surface of the substrate FS. Converged to SP. Further, the spot light SP projected on the irradiated surface of the substrate FS is one-dimensionally scanned by the polygon mirror PM along the drawing line SL1 extending in the Yt direction. The optical axis AXf of the fθ lens FT and the irradiation center axis Le1 are on the same plane, and the plane is parallel to the XtZt plane. Therefore, the beam LB1 traveling on the optical axis AXf is reflected in the −Zt direction by the reflecting mirror M25, and is projected on the substrate FS so as to be coaxial with the irradiation center axis Le1. In the first embodiment, at least the fθ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the irradiated surface of the substrate FS. Further, at least the reflecting members (reflecting mirrors M21 to M25) and the polarizing beam splitter BS function as an optical path deflecting member that bends the optical path of the beam LB1 from the reflecting mirror M20 to the substrate FS. By this optical path deflecting member, the incident axis of the beam LB1 incident on the reflection mirror M20 and the irradiation center axis Le1 can be made substantially coaxial. With respect to the XtZt plane, the beam LB1 passing through the scanning unit U1 travels in the −Zt direction and is projected onto the substrate FS after passing through a substantially U-shaped or U-shaped optical path.

  Thus, by scanning the spot light SP of the beam LBn one-dimensionally in the scanning direction (Y direction) by each scanning unit Un (U1 to U6) while the substrate FS is being transported in the X direction, The spot light SP can be relatively two-dimensionally scanned on the irradiated surface of the substrate FS. Therefore, a predetermined pattern can be drawn and exposed on the exposure region W of the substrate FS.

  The photodetector DT1 includes a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotary drum DR. The portion on the rotating drum DR on which the reference pattern is formed is made of a material having a low reflectance (10 to 50%) with respect to the wavelength region of the beam LB1, and on the rotating drum DR on which the reference pattern is not formed. The other part is made of a material having a reflectance of 10% or less or a material that absorbs light. Therefore, when the spot light SP of the beam LB1 is irradiated from the scanning unit U1 to the region where the reference pattern of the rotating drum DR is formed in a state where the substrate FS is not wound (or a state where the substrate FS is passed through the transparent portion), The reflected light is a cylindrical lens CYb, a reflection mirror M25, an fθ lens FT, a polygon mirror PM, a reflection mirror M24, a cylindrical lens CYa, a λ / 4 wavelength plate QW, a reflection mirror M23, a field aperture FA, an image shift optical member SR, Then, the light passes through the reflection mirror M22 and enters the polarization beam splitter BS. Here, a λ / 4 wavelength plate QW is provided between the polarizing beam splitter BS and the substrate FS, specifically, between the reflection mirror M23 and the cylindrical lens CYa. As a result, the beam LB1 irradiated to the substrate FS is converted from P-polarized light to circularly-polarized light by the λ / 4 wavelength plate QW, and reflected light incident on the polarization beam splitter BS from the substrate FS is converted to the λ / 4 wavelength plate. QW converts circularly polarized light into S polarized light. Therefore, the reflected light from the substrate FS passes through the polarization beam splitter BS and enters the photodetector DT1 through the optical lens system G10.

  At this time, in a state where the pulsed beam LB1 (preferably the beam LB1 derived from the seed light S1) is continuously incident on the scanning unit U1, the scanning unit U1 emits the spot light SP by rotating the rotary drum DR. By scanning, the outer peripheral surface of the rotary drum DR is irradiated with the spot light SP two-dimensionally. Therefore, the image of the reference pattern formed on the rotary drum DR can be acquired by the photodetector DT1. Specifically, the intensity change of the photoelectric signal output from the photodetector DT1 is changed at each scanning time in response to a clock pulse signal (generated in the light source device 14) for pulse emission of the spot light SP. Is obtained as one-dimensional image data in the Yt direction by digital sampling, and in response to a measurement value of the encoder ENn that measures the rotational angle position of the rotary drum DR, for example, a certain distance in the sub-scanning direction (for example, the spot light SP) By arranging one-dimensional image data in the Yt direction in the Xt direction every 1/2) of the size φ, the two-dimensional image information on the surface of the rotating drum DR is obtained. The control device 20 measures the inclination of the drawing line SL1 of the scanning unit U1 based on the acquired two-dimensional image information of the reference pattern of the rotating drum DR. The inclination of the drawing line SL1 may be a relative inclination between the scanning units Un (U1 to U6), or may be an inclination (absolute inclination) with respect to the central axis AXo of the rotary drum DR. . In addition, it cannot be overemphasized that the inclination of each drawing line SL2-SL6 can also be measured similarly.

  As shown in FIG. 8, an origin sensor (origin detector) 60 is provided around the polygon mirror PM of the scanning unit U1. The origin sensor 60 outputs a pulsed origin signal SZ indicating the start of scanning of the spot light SP by each reflecting surface RP. The origin sensor 60 outputs an origin signal SZ when the rotational position of the polygon mirror PM comes to a predetermined position immediately before the scanning of the spot light SP by the reflecting surface RP is started. Since the polygon mirror PM can deflect the beam LB1 projected on the substrate FS within the scanning angle range θs, the reflection direction (deflection direction) of the beam LB1 reflected by the polygon mirror PM is within the scanning angle range θs. The reflected beam LB1 enters the fθ lens FT. Accordingly, the origin sensor 60 outputs the origin signal SZ when the rotational position of the polygon mirror PM comes to a predetermined position immediately before the reflection direction of the beam LB1 reflected by the reflecting surface RP enters the scanning angle range θs. Since the polygon mirror PM has eight reflecting surfaces RP, the origin sensor 60 outputs the origin signal SZ eight times during the period in which the polygon mirror PM rotates once. The origin signal SZ detected by the origin sensor 60 is sent to the control device 20. After the origin sensor 60 outputs the origin signal SZ, scanning along the drawing line SL1 of the spot light SP is started.

  The origin sensor 60 is a reflection surface RP adjacent to the reflection surface RP that performs the scanning of the spot light SP (deflection of the beam LB1) from now on (in the first embodiment, the reflection just before the rotation direction of the polygon mirror PM). The origin signal SZ is output using the surface RP). In order to distinguish each reflection surface RP, for convenience, in FIG. 8, the reflection surface RP that is currently deflecting the beam LB1 is represented by RPa, and the other reflection surfaces RP are rotated counterclockwise (the rotation direction of the polygon mirror PM). RPb to RPh in the opposite direction).

  The origin sensor 60 emits a laser beam Bga in a non-photosensitive wavelength region such as a semiconductor laser, and a mirror that reflects the laser beam Bga from the light source unit 62 and projects it onto the reflection surface RPb of the polygon mirror PM. And a beam transmission system 60 a including 64 and 66. The origin sensor 60 also includes a light receiving unit 68, mirrors 70 and 72 that guide the reflected light (reflected beam Bgb) of the laser beam Bga reflected by the reflection surface RPb to the light receiving unit 68, and a reflected beam Bgb reflected by the mirror 72. A beam receiving system 60b including a lens system 74 for condensing the light into a minute spot light. The light receiving unit 68 includes a photoelectric conversion element that converts the spot light of the reflected beam Bgb collected by the lens system 74 into an electric signal. Here, the position at which the laser beam Bga is projected onto each reflecting surface RP of the polygon mirror PM is set to be the pupil plane (focal position) of the lens system 74.

  The beam transmitting system 60a and the beam receiving system 60b are configured so that the beam transmitting system 60a is rotated when the rotational position of the polygon mirror PM reaches a predetermined position immediately before the scanning of the spot light SP by the reflecting surface RP is started. It is provided at a position where the reflected light beam Bgb of the emitted laser beam Bga can be received by the beam receiving system 60b. That is, the beam transmitting system 60a and the beam receiving system 60b receive the reflected beam Bgb of the laser beam Bga emitted from the beam transmitting system 60a when the angle of the reflecting surface RP reaches a predetermined angle position. It is provided at a position where In addition, the code | symbol Msf of FIG. 8 is a shaft of the rotary motor of the polygon drive part RM (refer FIG. 7) arrange | positioned coaxially with the rotating shaft AXp.

  A light-shielding body having a very small slit opening is provided immediately before the light-receiving surface of the photoelectric conversion element in the light-receiving unit 68 (not shown). While the angle position of the reflecting surface RPb is within a predetermined angle range, the reflected beam Bgb is incident on the lens system 74, and the spot light of the reflected beam Bgb scans the light shield in the light receiving unit 68 in a certain direction. To do. During the scanning, the spot light of the reflected beam Bgb that has passed through the slit opening of the light shield is received by the photoelectric conversion element of the light receiving unit 68, and the received light signal is amplified by an amplifier and output as a pulsed origin signal SZ. The

  As described above, the origin sensor 60 detects the origin signal SZ by using the reflection surface RPb immediately before the reflection surface RPa that deflects the beam LB1 (scans the spot light SP). Therefore, if the angle ηj formed between the adjacent reflecting surfaces RP (for example, the reflecting surfaces RPa and RPb) has an error with respect to the design value (135 degrees when there are eight reflecting surfaces RP), Due to variations in error, as shown in FIG. 9, the generation timing of the origin signal SZ may differ for each reflection surface RP.

  In FIG. 9, the origin signal SZ generated using the reflecting surface RPb is SZb. Similarly, the origin signal SZ generated using the reflecting surfaces RPc, RPd, RPe,... Is SZc, SZd, SZe,. When the angle ηj formed between the adjacent reflecting surfaces RP of the polygon mirror PM is a design value, the interval between the generation timings of the origin signals SZ (SZb, SZc, SZd,...) Is the time Tpx. The predetermined time Tpx is a time required for the polygon mirror PM to rotate by one surface of the reflection surface RP. However, in FIG. 9, the timing of the origin signals SZc and SZd generated using the reflection surfaces RPc and RPd is shifted from the normal generation timing due to the error of the angle ηj formed by the reflection surface RP of the polygon mirror PM. Yes. Further, the time intervals Tp1, Tp2, Tp3,... At which the origin signals SZb, SZc, SZd, SZe,... Are generated are not constant in the order of μ seconds due to manufacturing errors of the polygon mirror PM. In the time chart shown in FIG. 9, Tp1 <Tpx, Tp2> Tpx, and Tp3 <Tpx. If the number of reflecting surfaces RP is Np and the rotational speed of the polygon mirror PM is Vp, Tpx is represented by Tpx = 60 / (Np × Vp) [seconds]. For example, if Vp is 30,000 rpm and Np is 8, Tpx is 250 μsec.

  Therefore, due to the error of the angle ηj formed between the adjacent reflecting surfaces RP of the polygon mirror PM, the drawing line SL1 on the irradiated surface of the substrate FS of the spot light SP drawn by each reflecting surface RP (RPa to RPh). The position of the drawing start point (scanning start point) varies in the main scanning direction. Thereby, the position of the drawing end point of the drawing line SL1 also varies in the main scanning direction. That is, since the position of the drawing line SL1 of the spot light SP drawn by each reflecting surface RP is shifted along the scanning direction (Y direction), the positions of the drawing start point and drawing end point of each drawing line SLn are X. Do not be linear along the direction. This is because Tp1, Tp2, Tp3,... = Tpx do not cause the positions of the drawing start point and the drawing end point of the drawing line SL1 of the spot light SP to vary in the main scanning direction.

  Therefore, in the first embodiment, as shown in the time chart of FIG. 9, the drawing of the spot light SP is started with the drawing start point after the time Tpx after the generation of one pulse-like origin signal SZ. To do. That is, the control device 20 controls the beam switching member 16 so that the beam LB1 is incident on the scanning unit U1 after the time Tpx from the generation of the origin signal SZ, and the drive circuit for the light source device 14 shown in FIG. In 36a, the drawing bit string data Sdw of the scanning unit U1 to be scanned from now on, that is, the serial data DL1 is output. Thereby, the reflective surface RPb used for detecting the origin signal SZ and the reflective surface RP that actually scans the spot light SP can be made the same reflective surface.

  More specifically, the control device 20 applies a certain time (on time Ton) to the selection optical element AOM1 of the beam switching member 16 a time Tpx after the origin sensor 60 of the scanning unit U1 outputs the origin signal SZb. Outputs an ON drive signal. The predetermined time (on time Ton) when the selection optical element AOM1 is turned on is a predetermined time, and the spot light SP is scanned once along the drawing line SL1 by one reflecting surface RP of the polygon mirror PM. Is set so as to cover the period (scanning period) to be performed. Then, the control device 20 outputs the serial data DL1 in a specific column, for example, the first column to the drive circuit 36a of the light source device 14. Accordingly, since the beam LB1 is incident on the scanning unit U1 during the scanning time in which the scanning unit U1 scans the spot light SP, the scanning unit U1 converts the serial data DL1 into a specific column (for example, the first column). A corresponding pattern can be drawn. Thus, since the scanning unit U1 scans the spot light SP after the time Tpx since the origin sensor 60 of the scanning unit U1 outputs the origin signal SZb, the reflection surface RPb used for detecting the origin signal SZb The spot light SP caused by the origin signal SZb can be scanned.

  Next, the control device 20 drives the selection optical element AOM1 of the beam switching member 16 to be on for a certain time (on time Ton) after a time Tpx after the origin sensor 60 of the scanning unit U1 outputs the origin signal SZd. Output a signal. Then, the control device 20 outputs the serial data DL1 in the next column, for example, the second column to the drive circuit 36a of the light source device 14. Thereby, the beam LB1 is incident on the scanning unit U1 during the time including the time necessary for the scanning unit U1 to scan the spot light SP, so that the scanning unit U1 is in the next column (for example, the second column). A pattern corresponding to the serial data DL1 can be drawn. Thus, since the scanning unit U1 scans the spot light SP after the time Tpx after the origin sensor 60 of the scanning unit U1 outputs the origin signal SZd, the reflection surface RPb used for detecting the origin signal SZd The spot light SP caused by the origin signal SZd can be scanned. If the scanning of the spot light SP is not performed for each continuous reflection surface RP of the polygon mirror PM but by skipping one surface, the drawing process is performed by skipping one origin signal SZ (every other). Do. The reason for the drawing process by one skip will be described in detail later.

  In this way, the control device 20 controls the beam switching member 16 so that the scanning unit U1 scans the spot light SP after the time Tpx after the origin sensor 60 of the scanning unit U1 outputs the origin signal SZ. At the same time, serial data DL1 is output to the drive circuit 36a of the light source device 14. Further, the control device 20 sets the columns of the serial data DL1 to be output every time scanning by the scanning unit U1 is started, such as the first column, the second column, the third column, the fourth column, and so on. Shift in the column direction. In addition, the scanning of the spot light SP by the other scanning units Un (scanning units U2 to U6) is performed in order between the scanning of the spot light SP by the scanning unit U1 and the next scanning. The scanning of the spot light SP by the other scanning units Un (U2 to U6) is the same as the scanning of the scanning unit U1. Further, the origin sensor 60 is provided for each scanning unit Un (U1 to U6).

  As described above, by performing the scanning of the spot light SP using the reflection surface RP used for detecting the origin signal SZb of the scanning unit U1, an error is caused in each angle ηj formed between the adjacent reflection surfaces RP of the polygon mirror PM. Even in the case where there is, the positions of the drawing start point and the drawing end point on the irradiated surface of the substrate FS of the spot light SP drawn by each reflecting surface RP (RPa to RPh) vary in the main scanning direction. Can be suppressed.

  For this purpose, the time Tpx for which the polygon mirror PM rotates 45 degrees is accurate on the order of microseconds, that is, it is necessary to rotate the polygon mirror PM evenly and precisely at a constant speed. When the polygon mirror PM is rotated precisely at the same speed, the reflecting surface RP used for generating the origin signal SZ always rotates exactly 45 degrees after the time Tpx, and the beam LB1 is changed to fθ. The angle is reflected toward the lens FT. Therefore, by increasing the rotational isokineticity of the polygon mirror PM and reducing the speed unevenness during one rotation as much as possible, the position of the reflection surface RP used for generating the origin signal SZ and the beam LB1 are deflected to generate the spot light SP. The position of the reflection surface RP used for scanning can be made different. That is, since the generation timing of the origin signal SZ is delayed by the time Tpx, the operation is equivalent to detecting the origin signal SZ using the reflection surface RP that scans the spot light SP as a result. Thereby, the freedom degree of arrangement | positioning of the origin sensor 60 improves, and the origin sensor of a rigid and stable structure can be provided. Further, the reflection surface RP to be detected by the origin sensor 60 is one before the rotation direction of the reflection surface RP that deflects the beam LB1, but it may be just before the rotation direction of the polygon mirror PM. Not limited to. In this case, when the reflection surface RP to be detected by the origin sensor 60 is positioned n (an integer greater than or equal to 1) in the rotation direction of the reflection surface RP that deflects the beam LB1, the origin signal SZ is generated. The drawing start point may be set after n × time Tpx.

  Further, for each of the origin signals SZb, SZd,... Generated every other origin sensor 60, the drawing start point is set after n × time Tpx, so that each drawing line SL1 is set. There is a margin in the processing time for the pixel data string readout operation, data transfer (communication) operation, or correction calculation corresponding to the above. Therefore, it is possible to reliably avoid pixel data string transfer errors, pixel data string errors, and partial disappearance.

  FIG. 10 is a diagram for explaining the maximum scanning rotation angle range α of the polygon mirror PM in which the polygon mirror PM of the scanning unit Un can scan the spot light SP on the irradiated surface of the substrate FS. A period during which the polygon mirror PM rotates by the maximum scanning rotation angle range α is an effective scanning period (maximum scanning time) of the spot light SP. The maximum scanning rotation angle range α corresponds to the above-described maximum scanning length of the drawing line SLn, and the maximum scanning length increases as the maximum scanning rotation angle range α increases. The rotation angle β by which the polygon mirror PM of the scanning unit Un rotates by one surface of the reflection surface RP is defined by the number Np of the reflection surfaces RP of the polygon mirror PM, and can be expressed as β = 360 / Np. In the first embodiment, since Np = 8, β = 45 degrees. Accordingly, the reflecting surface RP of the polygon mirror PM of the scanning unit Un cannot scan the spot light SP on the irradiated surface of the substrate FS, that is, the reflected light reflected by the reflecting surface RP enters the fθ lens FT. The non-scanning rotation angle range γ of the polygon mirror PM that cannot be expressed can be expressed by γ = β−α = 45 degrees−α. A period during which the polygon mirror PM rotates by the non-scanning rotation angle range γ is an invalid scanning period of the spot light SP. This maximum scanning rotation angle range α varies depending on conditions such as the distance between the polygon mirror PM and the fθ lens FT. For example, in the first embodiment, if the maximum scanning rotation angle range α is 15 degrees, the non-scanning rotation angle range γ is 30 degrees, and the scanning efficiency of the polygon mirror PM in FIG. 1/3. That is, the beam LBn incident on the polygon mirror PM is wasted while the polygon mirror PM of the scanning unit Un rotates by the non-scanning rotation angle range γ (30 degrees). Note that the scanning angle range θs and the maximum scanning rotation angle range α in FIG. 8 have a relationship of θs = 2 × α.

  Accordingly, when the rotation angle of the polygon mirror PM of one scanning unit Un (for example, the scanning unit U1) is outside the maximum scanning rotation angle range α, that is, during the non-scanning rotation angle range γ, the scanning unit. The beam LBn is incident on the scanning unit Un other than U1, and the spot light SP is scanned by the polygon mirror PM of the other scanning unit Un. Here, since the scanning efficiency of the polygon mirror PM is 1/3, the beam LBn is applied to the two scanning units Un other than the scanning unit U1 after the scanning unit U1 scans the spot light SP until the next scanning is performed. And spot light SP can be scanned. That is, while the polygon mirror PM of the scanning unit U1 is rotated by one surface, the corresponding beam LBn can be distributed to each of the three scanning units Un including the scanning unit U1, and the spot light SP can be scanned. It is.

  However, since the scanning efficiency of the polygon mirror PM is 1/3, when each scanning unit Un scans the spot light SP in the maximum scanning rotation angle range α (15 degrees), the polygon mirror PM of the scanning unit U1 is the reflecting surface. The beam LBn cannot be distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1 while rotating for one surface of the RP (β = 45 degrees). That is, the beam LBn is distributed to three or more scanning units Un (U2 to U6) other than the scanning unit U1 during a period from the start of scanning of the spot light SP of the scanning unit U1 to the start of scanning of the next spot light SP. It is not possible. Therefore, in the period from the start of scanning by the spot light SP of the scanning unit U1 to the start of the next scanning, the beam LBn is distributed to each of the other five scanning units Un (U2 to U6), and scanning by the spot light SP is performed. The following methods can be considered to perform the above.

  Even when the maximum scanning rotation angle range α is 15 degrees, the scanning rotation angle range α ′ of the polygon mirror PM that can actually scan the spot light SP is set to the maximum scanning rotation angle range α (α = 15 degrees). Set smaller. Specifically, the number of scanning units Un to which the beam LBn is to be distributed is 6 while each polygon mirror PM of the scanning units Un (U1 to U6) rotates by one surface of the reflecting surface RP (β = 45 degrees). Therefore, the scanning rotation angle range α ′ is set to α ′ = 45/6 = 7.5 degrees. That is, the swing angle around the optical axis AXf of the beam LBn incident on the fθ lens FT in FIG. 7 is limited to ± 7.5 degrees. Thus, the beam LBn is changed to any one of the six scanning units Un (U1 to U6) while the polygon mirror PM of each scanning unit Un rotates 45 degrees (while rotating by one surface of the reflection surface RP). The light beams can be incident in order, and the scanning units Un (U1 to U6) can perform scanning with the spot light SP in order. However, in this case, the scanning rotation angle range α ′ in which the spot light SP can be actually scanned becomes too small, and the maximum scanning range length in which the spot light SP is scanned, that is, the maximum scanning of the drawing line SLn. There is a problem that the length becomes too short. In order to avoid such a problem, an fθ lens FT having a long focal length is prepared so as not to change the maximum scanning length in which the spot light SP is scanned, and the distance from the reflection surface RP of the polygon mirror PM to the fθ lens FT. (Working distance) will be set longer. In this case, the fθ lens FT is increased in size, the size of the scanning unit Un (U1 to U6) in the Xt direction is increased, and there is a concern that the stability of the beam scanning is lowered due to the long working distance.

  On the other hand, it is conceivable that the number of reflection surfaces RP of the polygon mirror PM is reduced and the rotation angle β at which the polygon mirror PM rotates by one surface of the reflection surface RP is increased. In this case, the polygon mirror PM of the scanning unit Un (U1 to U6) is one surface of the reflection surface RP while suppressing the drawing line SLn from being shortened or from increasing the size of the scanning unit Un (U1 to U6). During the rotation (rotation angle β), the beam LBn is distributed and the six scanning units Un (U1 to U6) can sequentially scan the spot light SP. For example, when the number of reflection surfaces RP of the polygon mirror PM is four, that is, when the shape of the polygon mirror PM is square, the rotation angle β at which the reflection surface RP of the polygon mirror PM rotates by one surface is 90. Degree. Therefore, in the case where the beam LBn is distributed and the spot light SP is scanned by the six scanning units Un (U1 to U6) while the polygon mirror PM of the scanning unit U1 rotates by one reflection surface RP, the spot light SP is actually scanned. The scanning rotation angle range α ′ of the polygon mirror PM capable of scanning with the spot light SP is α ′ = 90/6 = 15 degrees, which is equal to the maximum scanning rotation angle range α described above.

  However, when a polygonal polygon mirror PM having a small number of reflecting surfaces such as triangles and squares is rotated at a high speed, air resistance (windage loss) becomes too large, and the rotation speed and the number of rotations decrease (rule). For example, even when it is desired to rotate the polygon mirror PM at a high speed of tens of thousands of rpm (rotation per minute), the rotational speed is reduced by about 20 to 30% due to air resistance, and a desired high speed rotation speed and high rotation speed are obtained. It is not possible. A method of increasing the size of the outer shape of the polygon mirror PM is also conceivable, but the weight of the polygon mirror PM becomes too large, and a desired high speed rotation speed and high rotation speed cannot be obtained. As a method of reducing windage loss during rotation even if the number of reflecting surfaces of the polygon mirror PM is reduced, the entire polygon mirror PM is installed in a vacuum environment, or a gas having a molecular weight smaller than air (such as helium). It is also possible to install it within the environment. In that case, an airtight structure for creating such an environment is provided around the polygon mirror PM, which leads to an increase in the size of the scanning unit Un (U1 to U6).

  Therefore, in the first embodiment, a polygon mirror PM that can actually scan the spot light SP while using a polygon having a relatively large number of reflecting surfaces, that is, an octagonal polygon mirror PM closer to a circle. Is set to a maximum scanning rotation angle range α (α = 15 degrees), and every other reflecting surface RP of the polygon mirror PM that performs scanning of the spot light SP (deflection of the beam LBn) is set. That is, the scanning of the spot light SP by each of the scanning units Un (U1 to U6) is repeated for every other surface (one surface skipping) of the reflecting surface RP of the polygon mirror PM. Therefore, the beam LB2 to LB6 is sequentially distributed to each of the five scanning units U2 to U6 other than the scanning unit U1 until the next scanning is performed after the scanning unit U1 scans the spot light SP. Scanning with the light SP can be performed. That is, the beam LB1 is applied to each of the six scanning units Un (U1 to U6) while the polygon mirror PM of one scanning unit Un of interest among the six scanning units Un (U1 to U6) rotates by two planes. By assigning ˜LB6, all of the six scanning units Un (U1 to U6) can scan the spot light SP. In this case, the polygon mirror PM is rotated by two surfaces (90 degrees) from the time when each scanning unit Un (U1 to U6) starts scanning the spot light SP until the next spot light SP starts scanning. become. In order to perform such a drawing operation, the polygon mirrors PM of the six scanning units Un (U1 to U6) are synchronously controlled so as to have the same rotation speed, and the reflecting surface RP of each polygon mirror PM is also controlled. Are controlled so as to have a predetermined phase relationship with each other.

  In addition, since the reflecting surface RP of the polygon mirror PM that performs the scanning of the spot light SP (deflection of the beam LBn) is set every other surface, the polygon mirror PM of each scanning unit Un (U1 to U6) is rotated once. The number of scans of the spot light SP along each of the drawing lines SLn (SL1 to SL6) is four. Therefore, the drawing line SLn is compared with the case where the scanning of the spot light SP (deflection of the beam LBn) is repeated for each continuous reflecting surface RP of the polygon mirror PM, that is, compared with the case where it is performed on each reflecting surface RP of the polygon mirror PM. Therefore, it is preferable to reduce the conveyance speed of the substrate FS by half. When it is not desired to halve the conveyance speed of the substrate FS, the rotation speed and the oscillation frequency Fs of the polygon mirror PM of each scanning unit Un (U1 to U6) are increased twice. For example, the rotation speed of the polygon mirror PM when the scanning of the spot light SP (deflection of the beam LBn) is repeated for each continuous reflecting surface RP of the polygon mirror PM is 20,000 rpm, and the oscillation frequency of the beam LB from the light source device 14 When Fs is 200 MHz, when the scanning of the spot light SP (deflection of the beam LBn) is repeated for every other reflecting surface RP of the polygon mirror PM, the rotational speed of the polygon mirror PM is 40,000 rpm, and the light source device The oscillation frequency Fs of the beam LB from 14 is set to 400 MHz.

  Here, the control device 20 manages which scanning unit Un among the plurality of scanning units Un (U1 to U6) scans the spot light SP based on the origin signal SZ. However, since the origin sensor 60 of each scanning unit Un (U1 to U6) generates an origin signal SZ when each reflecting surface RP reaches a predetermined angular position, if this origin signal SZ is used as it is, the control device 20 is used. Determines that each scanning unit Un (U1 to U6) scans the spot light SP for each continuous reflecting surface RP. Therefore, the beam LBn cannot be distributed to the other five scanning units Un until one scanning unit Un scans the spot light SP and then performs the next scanning. Therefore, in order to set every other reflecting surface RP of the polygon mirror PM that scans the spot light SP, it is necessary to generate a sub-origin signal (sub-origin pulse signal) ZP obtained by thinning the origin signal SZ. Further, as described above, since the origin signal SZ is detected by using the reflection surface RP just before the rotation direction of the reflection surface RP that scans (deflects) the spot light SP, the origin signal SZ is generated. It is necessary to generate the sub origin signal ZP with the timing delayed by the time Tpx. The configuration of the sub origin generation circuit CA that generates the sub origin signal ZP will be described below.

  FIG. 11 is a configuration diagram of a sub origin generating circuit CA for generating a sub origin signal ZP in which the origin signal SZ is thinned and the generation timing thereof is delayed by time Tpx, and FIG. 12 is a sub origin generation circuit CA of FIG. FIG. 6 is a diagram showing a time chart of a sub origin signal ZP generated by The sub origin generation circuit CA includes a frequency divider 80 and a delay circuit 82. The frequency divider 80 divides the frequency of the generation timing of the origin signal SZ by ½ and outputs it to the delay circuit 82 as the origin signal SZ ′. The delay circuit 82 delays the sent origin signal SZ ′ by a time Tpx and outputs it as a sub origin signal ZP. A plurality of sub origin generation circuits CA are provided corresponding to the origin sensors 60 of the respective scanning units Un (U1 to U6).

  The sub origin generation circuit CA corresponding to the origin sensor 60 of the scanning unit Un may be represented by CAn. That is, the sub origin generation circuit CA corresponding to the origin sensor 60 of the scanning unit U1 may be represented by CA1, and the sub origin generation circuit CA corresponding to the origin sensor 60 of the scanning units U2 to U6 may be represented by CA2 to CA6. In addition, the origin signal SZ output from the origin sensor of the scanning unit Un may be represented by SZn. That is, the origin signal SZ output from the origin sensor 60 of the scanning unit U1 may be represented by SZ1, and the origin signal SZ output from the origin sensor 60 of the scanning units U2 to U6 may be represented by SZ2 to SZ6. In some cases, the origin signal SZ ′ and the sub origin signal ZP generated based on the origin signal SZn are represented by SZn ′ and ZPn. That is, the origin signal SZ ′ and the sub origin signal ZP generated based on the origin signal SZ1 are represented by SZ1 ′ and ZP1, and similarly, the origin signal SZ ′ and the sub origin signal generated based on the origin signals SZ2 to SZ6. ZP may be represented by SZ2 ′ to SZ6 ′ and ZP2 to ZP6.

  FIG. 13 is a block diagram showing an electrical configuration of the exposure apparatus EX, and FIG. 14 is a time chart showing timings at which the origin signals SZ1 to SZ6, sub origin signals ZP1 to ZP6, and serial data DL1 to DL6 are output. It is. The control device 20 of the exposure apparatus EX includes a rotation control unit 100, a beam switching control unit 102, a drawing data output control unit 104, and an exposure control unit 106. Further, the exposure apparatus EX includes motor drive circuits Drm1 to Drm6 that drive the polygon drive unit RM including the motors and the like of the respective scanning units Un (U1 to U6).

  The rotation control unit 100 controls the rotation of the polygon mirror PM of each scanning unit Un (U1 to U6) by controlling the motor drive circuits Drm1 to Drm6. The rotation control unit 100 controls the motor drive circuits Drm1 to Drm6 to perform a plurality of scans so that the rotation angle positions of the polygon mirrors PM of the plurality of scan units Un (U1 to U6) have a predetermined phase relationship with each other. The polygon mirror PM of the unit Un (U1 to U6) is rotated synchronously. Specifically, the rotation control unit 100 includes a plurality of rotation units 100 so that the rotation speeds (rotational speeds) of the polygon mirrors PM of the scanning units U1 to U6 are the same, and the phase of the rotation angle position is shifted by a certain angle. The rotation of the polygon mirror PM of the scanning units Un (U1 to U6) is controlled. Note that reference symbols PD1 to PD6 in FIG. 13 represent control signals output from the rotation control unit 100 to the motor drive circuits Drm1 to Drm6.

  In the first embodiment, the rotational speed Vp of the polygon mirror PM is set to 39,000 rpm (650 rps). Further, since the number of reflecting surfaces Np is set to 8, the scanning efficiency (α / β) is set to 1/3, and the reflecting surfaces RP for scanning the spot light SP are set every other surface, rotation between the six polygon mirrors PM is performed. The phase difference of the angular position is set to the maximum scanning rotation angle range α, that is, 15 degrees. The scanning of the spot light SP is performed in the order of U1 → U2 →... → U6. Accordingly, in this order, the rotation control unit 100 performs synchronous control so that the rotation angle position of each polygon mirror PM of each of the six scanning units U1 to U6 rotates at a constant speed while being shifted by 15 degrees. As a result, the phase shift between the rotation angle positions of the scanning unit U1 and the scanning unit U4 is 45 degrees corresponding to the rotation angle of one surface. Therefore, the phases of the rotational angular positions of the scanning unit U1 and the scanning unit U4, that is, the generation timings of the origin signals SZ1, SZ4 may be aligned. Similarly, the rotational angular positions of the scanning unit U2 and the scanning unit U5 and the phase shifts of the rotational angular positions of the scanning unit U3 and the scanning unit U6 are both 45 degrees, so that each of the scanning units U2 and U5 The generation timings of the origin signals SZ2 and SZ5 and the generation timings of the origin signals SZ3 and SZ6 from each of the scanning unit U3 and the scanning unit U6 may be aligned on the time axis.

  Specifically, the rotation control unit 100 rotates the polygon mirror PM of the scanning unit U1 and the scanning unit U4, rotates the polygon mirror PM of the scanning unit U2 and the scanning unit U5, and polygons of the scanning unit U3 and the scanning unit U6. The rotation of the polygon mirror PM of each of the scanning units U1 to U6 is controlled via each of the motor drive circuits Drm1 to Drm6 so that each of the rotations of the mirror PM is in the first control state. This first control state is a state in which the phase difference of the circulating pulse signal that is output each time the polygon mirror PM rotates once is 0 (zero). That is, the polygon mirror PM of the scanning unit U1 and the scanning unit U4 is set so that the phase difference between the circular pulse signals output each time the polygon mirror PM of the scanning unit U1 and the scanning unit U4 makes one rotation becomes 0 (zero). Control the rotation. Similarly, scanning is performed so that the phase difference of the circular pulse signal output each time the polygon mirror PM of the scanning unit U2 and the scanning unit U5 and the scanning unit U3 and the scanning unit U6 rotates once becomes 0 (zero). The rotation of the polygon mirror PM of the unit U2 and the scanning unit U5, and the scanning unit U3 and the scanning unit U6 is controlled.

  This circular pulse signal may be a signal output once every time the origin signal SZn of the scanning unit Un is output eight times by a frequency divider (not shown). Further, the circular pulse signal may be a signal output from an encoder (not shown) provided in the polygon driving unit RM of each scanning unit Un (U1 to U6). A sensor for detecting the circulating pulse signal may be provided in the vicinity of the polygon mirror PM. In the example shown in FIG. 14, it is assumed that a round pulse signal is generated once every time the origin signal SZn of the scanning unit Un is output eight times, and a part of the origin signal SZn corresponding to the generation of the round pulse signal is generated. Is represented by a dotted line. Each origin signal SZ1 and each origin signal SZ4 are time periods unless the error (see FIG. 8) of the angles ηj formed between the adjacent reflecting surfaces RP (for example, the reflecting surfaces RPa and RPb) is considered. The phases are all in agreement on the axis. Similarly, each origin signal SZ2 and each origin signal SZ5, and each origin signal SZ3 and each origin signal SZ6 must take into account errors in angles ηj formed by adjacent reflecting surfaces RP (see FIG. 8). The phases are all in agreement on the time axis. In FIG. 14, for the sake of easy understanding, it is assumed that there is no error in the angle ηj formed between adjacent reflecting surfaces RP.

  Then, the rotation control unit 100 maintains the first control state, and the phase of the rotation angle position of the polygon mirror PM of the scanning units U2 and U5 with respect to the rotation angle position of the polygon mirror PM of the scanning units U1 and U4. The rotation of the polygon mirror PM of the scanning units U2 and U5 is controlled so that is deviated by 15 degrees. Similarly, the rotation control unit 100 maintains the first control state, and the phase of the rotational angular position of the polygon mirror PM of the scanning units U3 and U6 with respect to the rotational angular position of the polygon mirror PM of the scanning units U1 and U4. The rotation of the scanning units U3 and U6 is controlled so that is shifted by 30 degrees. The time for which the polygon mirror PM rotates by 15 degrees (the maximum scanning time of the beam LBn) is Ts.

  Specifically, the rotation control unit 100 performs scanning so that the circular pulse signals obtained by the scanning units U2 and U5 are delayed by the time Ts with respect to the circular pulse signals obtained by the scanning units U1 and U4. The rotation of the polygon mirror PM of the units U2 and U5 is controlled (see FIG. 14). Similarly, the rotation control unit 100 performs scanning so that the circular pulse signals obtained by the scanning units U3 and U6 are delayed by the time 2 × Ts with respect to the circular pulse signals obtained by the scanning units U1 and U4. The rotation of the polygon mirror PM of the units U3 and U6 is controlled (see FIG. 14). When the rotational speed Vp of the polygon mirror PM is 39,000 rpm (650 rps), the time Ts is Ts = [1 / (Vp × Np)] × (α / β) = 1 / (650 × 8 × 3) Second [about 64.1 μsec]. In this way, by controlling the rotation of the polygon mirror PM of each of the scanning units U1 to U6, each of the scanning units U1 to U6 scans the spot light SP in the order of U1 → U2 →. It becomes possible to perform by dividing.

  The beam switching control unit 102 controls the optical element AOMn (AOM1 to AOM6) for selection of the beam switching member 16, and the light source device from when one scanning unit Un starts scanning until the next scanning starts. The beam LB from 14 is distributed to six scanning units Un (U1 to U6). Therefore, the beam switching control unit 102 is configured so that the scanning (deflection) of the beam LBn of the polygon mirror PM of each scanning unit Un (U1 to U6) is repeated for every other reflection surface RP of the polygon mirror PM. Any one of the beams LB1 to LB6 generated from the beam LB by the selection optical elements AOM1 to AOM6 is incident on each scanning unit Un (U1 to U6) in a time division manner.

  More specifically, the beam switching control unit 102 generates the sub origin signal ZPn (ZP1 to ZP6) based on the origin signal SZn (SZ1 to SZ6) as shown in FIG. To CA6). When the secondary origin signal ZPn (ZP1 to ZP6) is generated by the secondary origin generation circuit CAn (CA1 to CA6), it corresponds to the scanning unit Un (U1 to U6) derived from the generation of the secondary origin signal ZPn (ZP1 to ZP6). The optical element for selection AOMn (AOM1 to AOM6) is turned on for a certain time (on time Ton). For example, when the sub origin signal ZP1 is generated, the selection optical element AOM1 corresponding to the scanning unit U1 derived from the generation of the sub origin signal ZP1 is turned on for a predetermined time (on time Ton). The sub origin signal ZPn is generated based on the origin signal SZn output from the origin sensor 60, and the frequency of the origin signal SZn is divided by half, that is, the origin signal SZn is thinned in half. And delayed by time Tpx. This fixed time (on time Ton) is a period from the time when the sub origin signal ZPn is generated to the time when the sub origin signal ZPn is generated from the scanning unit Un that performs the next scan, that is, the polygon mirror PM is only 15 degrees. This corresponds to the time Ts required for rotation. When the on-time Ton of the selection optical element AOMn is set to be equal to or longer than the time Ts, a period in which two of the selection optical elements AOMn are turned on at the same time occurs, and the scanning unit Un to perform the drawing operation with the spot light SP In addition, the beams LB1 to LB6 cannot be correctly introduced. Therefore, the on time Ton is set to Ton ≦ Ts.

  At this time, each origin signal SZ1 and each origin signal SZ4 are all on the time axis unless the error of the angle ηj formed between the adjacent reflecting surfaces RP (for example, the reflecting surfaces RPa and RPb) is taken into consideration. The sub-origin signal ZP1 and the sub-origin signal ZP4 are set so as to be out of phase by about a half cycle (see FIG. 14). The shift of the half-cycle of the phase between the sub origin signal ZP1 and the sub origin signal ZP4 is performed by the frequency divider 80 of the sub origin generation circuit CAn (CA1 to CA6). That is, the frequency divider 80 shifts the timing for thinning the origin signal SZ1 and the timing for thinning the origin signal SZ4 by approximately a half cycle.

  Similarly, the relationship between the sub origin signal ZP2 and the sub origin signal ZP5 is set by the frequency divider 80 so that the phases of the sub origin signal ZP2 and the sub origin signal ZP5 are shifted by about a half cycle (see FIG. 14). Similarly, the relationship between the sub origin signal ZP3 and the sub origin signal ZP6 is set by the frequency divider 80 so that the phases of the sub origin signal ZP3 and the sub origin signal ZP6 are shifted by about a half cycle (see FIG. 14). ).

  Therefore, as shown in FIG. 14, the generation timings of the sub origin signals ZP1 to ZP6 generated for each of the scanning units U1 to U6 are shifted by the time Ts. In the first embodiment, the order of the scanning units Un that perform the scanning of the spot light SP is U1 → U2 →... → U6, so that the secondary origin signal ZPn is also the secondary origin signal ZP1. Are generated at time Ts intervals in the order of ZP1, ZP2,..., ZP6. Therefore, the beam switching control unit 102 controls the selection optical elements AOMn (AOM1 to AOM6) of the beam switching member 16 in accordance with the generated sub origin signal ZPn (ZP1 to ZP6), so that U1 → U2 →. The corresponding beams LB1 to LB6 can be incident on each of the scanning units Un in the order of U6. That is, the scanning units Un (U1 to U6) are repeated so that the scanning (deflection) of the beam LBn by the polygon mirror PM of each scanning unit Un (U1 to U6) is repeated for every other reflecting surface RP of the polygon mirror PM. ) Can be switched in a time division manner.

  The drawing data output control unit 104 outputs serial data DLn for one column corresponding to a pattern of one drawing line SLn scanned by the spot light SP by the scanning unit Un to the driving circuit 36a of the light source device 14 as drawing bit string data Sdw. To do. Since the order of the scanning units Un that perform the scanning of the spot light SP is U1 → U2 →... → U6, the drawing data output control unit 104 determines that the serial data DLn for one column is DL1 → DL2. The drawing bit string data Sdw repeated in the order of... → DL6 is output.

  The configuration of the drawing data output control unit 104 will be described in detail with reference to FIG. The drawing data output control unit 104 includes six generation circuits 110, 112, 114, 116, 118, 120 corresponding to each of the scanning units U1 to U6, and an OR circuit GT10. The generation circuit 110 includes a memory unit BM1, a counter unit CN1, and a gate unit GT1, and the generation circuit 112 includes a memory unit BM2, a counter unit CN2, and a gate unit GT2. The generation circuit 114 includes a memory unit BM3, a counter unit CN3, and a gate unit GT3, and the generation circuit 116 includes a memory unit BM4, a counter unit CN4, and a gate unit GT4. The generation circuit 118 includes a memory unit BM5, a counter unit CN5, and a gate unit GT5. The generation circuit 120 includes a memory unit BM6, a counter unit CN6, and a gate unit GT6.

  The memory units BM1 to BM6 are memories that store pattern data (bitmaps) corresponding to patterns to be drawn and exposed by the scanning units Un (U1 to U6). The counter units CN1 to CN6 synchronize serial data DL1 to DL6 for one drawing line SLn to be drawn next among the pattern data stored in the memory units BM1 to BM6, one pixel at a time in synchronization with the clock signal CLK. This is a counter for output. As shown in FIG. 14, the counter units CN1 to CN6 output one serial data DL1 to DL6 after the sub origin signals ZP1 to ZP6 are output from the sub origin generation circuits CA1 to CA6 of the beam switching control unit 102. Let

  In the pattern data stored in each of the memory units BM1 to BM6, the serial data DL1 to DL6 output is shifted in the column direction by an address counter (not shown) or the like. That is, the columns read by the address counter (not shown) are shifted as the first column, the second column, the third column, and so on. For example, in the case of the memory unit BM1 corresponding to the scanning unit U1, the shift is performed at the timing when the sub origin signal ZP2 corresponding to the scanning unit U2 to be scanned next is generated after the output of the serial data DL1. Is called. Similarly, the shift of the serial data DL2 of the pattern data stored in the memory unit BM2 is the timing at which the sub origin signal ZP3 corresponding to the scanning unit U3 that performs the next scanning is generated after the serial data DL2 has been output. Done in Similarly, the serial data DL3 to DL6 of the pattern data stored in the memory units BM3 to BM6 are shifted to the scanning units U4 to U6 and U1 that perform scanning next after the serial data DL3 to DL6 are output. This is performed at the timing when the corresponding sub origin signals ZP4 to ZP6, ZP1 are generated. The spot light SP is scanned in the order of U1 → U2 → U3 →... → U6.

  In this way, serial data DL1 to DL6 that are sequentially output are ORed with 6 inputs through the gate portions GT1 to GT6 that are opened within a predetermined time (on time Ton) after the sub origin signals ZP1 to ZP6 are applied. Applied to the circuit GT10. The OR circuit GT10 outputs the serial data DLn, which is repeatedly synthesized in the order of serial data DL1, DL2, DL3, DL4, DL5, DL6, DL1,. In this way, each scanning unit Un (U1 to U6) can perform exposure of the pattern according to the pattern data while simultaneously scanning the spot light SP.

  In the first embodiment, pattern data is prepared for each scanning unit Un (U1 to U6), and scanning is performed to scan the spot light SP from the pattern data of each scanning unit Un (U1 to U6). The serial data DL1 to DL6 are output according to the order of the unit Un. However, since the order of the scanning units Un that scan the spot light SP is determined in advance, one pattern data is prepared by combining the serial data DL1 to DL6 of the pattern data of each scanning unit Un (U1 to U6). May be. That is, one pattern data in which serial data DLn (DL1 to DL6) of each column of pattern data of each scanning unit Un (U1 to U6) is arranged according to the order of the scanning units Un that scan the spot light SP. You may make it build. In this case, if the serial data DLn of one pattern data is sequentially output from the first column in accordance with the sub origin signal ZPn (ZP1 to ZP6) based on the origin sensor 60 of each scanning unit Un (U1 to U6). Good.

  Incidentally, the exposure control unit 106 shown in FIG. 13 controls the rotation control unit 100, the beam switching control unit 102, the drawing data output control unit 104, and the like. The exposure control unit 106 analyzes the image signals ig (ig1 to ig4) captured by the alignment microscope AMm (AM1 to AM4), and detects the position of the alignment mark MKm (MK1 to MK4) on the substrate FS. Then, the exposure control unit 106 detects (determines) the drawing exposure start position of the exposure region W on the substrate FS based on the detected position of the alignment mark MKm (MK1 to MK4). The exposure control unit 106 includes a counter circuit 106a, and the counter circuit 106a counts detection signals detected by the encoders EN1a to EN3a and EN1b to EN3b shown in FIG. The exposure control unit 106 counts based on the encoders EN1a and EN1b (mark detection position) when the drawing exposure start position is detected, and counts based on the encoders EN2a and EN2b (positions of odd-numbered drawing lines SLn). Based on the above, it is determined whether or not the drawing exposure start position of the substrate FS is located on the drawing lines SL1, SL3, SL5. When the exposure control unit 106 determines that the drawing exposure start position is located on the drawing lines SL1, SL3, and SL5, the exposure control unit 106 controls the drawing data output control unit 104 to scan the spot units SP with the scanning units U1, U3, and U5. To start. The rotation control unit 100 and the beam switching control unit 102 are controlled by the exposure control unit 106 based on the circulation pulse signal and the sub-origin signal ZPn (ZP1 to ZP6), for each scanning unit Un (U1 to U6). It is assumed that the rotation of the polygon mirror PM and the distribution of the beam LBn by the beam switching member 16 are controlled.

  The exposure control unit 106 counts based on the encoders EN1a and EN1b when the drawing exposure start position is detected (mark detection position), and count values based on the encoders EN3a and EN3b (positions of even-numbered drawing lines) Based on the above, it is determined whether or not the drawing exposure start position of the substrate FS is located on the drawing lines SL2, SL4, SL6. When the exposure control unit 106 determines that the drawing exposure start position is located on the drawing lines SL2, SL4, and SL6, the exposure control unit 106 controls the drawing data output control unit 104 to scan the spot units SP with the scanning units U2, U4, and U6. To start.

  As shown in FIG. 3, the drawing exposure in each of the drawing lines SL1, SL3, and SL5 precedes and the substrate FS is transported by a predetermined distance in accordance with the transport direction (+ X direction) of the substrate FS. Drawing exposure is performed on each of the lines SL2, SL4, and SL6. On the other hand, since the polygon mirrors PM of the six scanning units U1 to U6 are rotationally controlled while maintaining a constant angle phase with each other, the sub origin signals ZP1 to ZP6 are sequentially shifted by the time Ts as shown in FIG. It continues to occur with a phase difference. Therefore, the gate part GT2 in FIG. 15 is also received by the sub origin signals ZP2, ZP4, ZP6 from the start of the drawing exposure at the drawing lines SL1, SL3, SL5 to immediately before the start of the drawing exposure at the drawing lines SL2, SL4, SL6. GT4 and GT6 are opened, and the selection optical elements AOM2, AOM4, and AOM6 are repeatedly turned on for a predetermined time Ton. Therefore, in the configuration of FIG. 13, the beam switching control unit 102 includes sub-origins generated based on the count values of the encoders EN1a and EN1b determined by the exposure control unit 106 or the count values of the encoders EN2a and EN2b. It is preferable to provide a selection gate circuit for selecting whether to send or prohibit each of the signals ZP1 to ZP6 to the drawing data output control unit 104. In addition, each of the driver circuits DRVn (DRV1 to DRV6) (see FIG. 19) of the selection optical elements AOM1 to AOM6 corresponding to each of the scanning units U1 to U6 is also connected to the sub origin signals ZP1 to ZP1 through the selection gate circuit. ZP6 should be given.

  Here, as described above, since the drawing lines SL1, SL3, and SL5 are positioned upstream of the drawing lines SL2, SL4, and SL6 in the transport direction of the substrate FS, the drawing exposure of the exposure region W of the substrate FS is started. The position first reaches the drawing lines SL1, SL3, and SL5, and then reaches the drawing lines SL2, SL4, and SL6 after a certain period of time. Therefore, until the drawing exposure start position reaches the drawing lines SL2, SL4, and SL6, pattern drawing exposure is performed only by the scanning units U1, U3, and U5. Therefore, when the selection gate circuit for the sub origin signals ZP1 to ZP6 as described above is not provided in the beam switching control unit 102, the exposure control unit 106 outputs the drawing bit string data Sdw to be output to the drive circuit 36a of the light source device 14. Among them, the pixel data of the portions corresponding to the serial data DL2, DL4, DL6 are all set to low “(0)”, thereby substantially canceling the drawing exposure by the scanning units U2, U4, U6. During the cancel period, the columns of serial data DL2, DL4, DL6 output from the memory units BM2, BM4, BM6 are not shifted and remain in the first column. Then, after the drawing exposure start position in the exposure area W reaches the drawing lines SL2, SL4, and SL6, the output of the serial data DL2, DL4, and DL6 is started, and the serial data DL2, DL4, and DL6 are output in the column direction. Shifts are made.

  Similarly, the drawing exposure end position in the exposure area W first reaches the drawing lines SL1, SL3, and SL5, and then reaches the drawing lines SL2, SL4, and SL6 after a certain period of time. Therefore, after the drawing exposure end position reaches the drawing lines SL1, SL3, and SL5, the pattern drawing exposure is performed only by the scanning units U2, U4, and U6 until reaching the drawing lines SL2, SL4, and SL6. Become. Therefore, when the selection gate circuit for the sub origin signals ZP1 to ZP6 as described above is not provided in the beam switching control unit 102, the exposure control unit 106 outputs the drawing bit string data Sdw to be output to the drive circuit 36a of the light source device 14. Among them, the pixel data of the portions corresponding to the serial data DL1, DL3, DL5 are all set to low “(0)”, thereby substantially canceling the drawing exposure by the scanning units U1, U3, U5. If the selection gate circuit is not provided, the beams LB1, LB3, and LB5 are introduced into the scanning units U1, U3, and U5 in which the drawing exposure is canceled even when the drawing exposure is being canceled. The selecting optical elements AOM1, AOM3, and AOM5 are repeatedly turned on for a predetermined time Ton selectively in response to the sub-origin signals ZP1, ZP3, and ZP5.

  FIG. 16 is a diagram showing a time chart of the signal states of the respective parts and the oscillation state of the beam LB at the time of standard pattern drawing by the scanning unit U1. The two-dimensional matrix Gm represents a bit pattern PP of pattern data to be drawn. For one pixel (pixel) on the substrate FS, for example, the dimension Py in the Y direction is set to 3 μm and the dimension Px in the X direction is set to 3 μm. Has been. In FIG. 16, SL1-1, SL1-2, SL1-3,..., SL1-6 indicated by arrows are drawn lines SL1 as the substrate FS moves in the X direction (long-direction sub-scanning). , SL1-6 in the X direction is, for example, 1 / pixel size Px. The conveyance speed of the substrate FS is set to be 2.

Furthermore, the dimension (spot size φ) of the spot light SP projected onto the substrate FS in the XY direction is set to be the same as or slightly larger than the size of one pixel. Therefore, the size φ of the spot light SP is set to about 3 to 4 μm as an effective diameter (the width of 1 / e ² of the Gaussian distribution or the full width at half maximum of the peak intensity), and is spotted along the drawing line SL1. When the light SP is continuously projected, for example, the light emission frequency Fs (pulse time interval) of the beam LB and the spot light by the polygon mirror PM are overlapped so as to overlap with ½ of the effective diameter of the spot light SP. SP scanning speed is set. That is, if the seed light beam emitted from the polarization beam splitter 38 in the light source device 14 shown in FIG. 4 is Lse, the seed light beam Lse is the clock signal LTC output from the control circuit 52 (clock generator 52a). In response to each of the pulses, it is emitted as shown in FIG.

  The clock signal LTC and the clock signal CLK supplied to the counter unit CN1 in the generation circuit 110 in FIG. 15 are set to a frequency ratio of 2: 1. When the clock signal LTC is 100 MHz, the clock signal CLK is Set to 50 MHz. Note that the frequency ratio between the clock signal LTC and the clock signal CLK may be an integral multiple. For example, the set frequency of the clock signal CLK is lowered to 25 MHz, which is 1/4 of the clock signal LTC, and the scanning speed of the spot light SP is also set. It may be set to drop in half.

  The drawing bit string data Sdw shown in FIG. 16 corresponds to the serial data DL1 output from the generation circuit 110, and here corresponds to, for example, a pattern on the drawing line SL1-2 of the bit pattern PP. Since the drive circuit 36a in the light source device 14 switches the polarization state of the electro-optic element 36 in response to the drawing bit string data Sdw (see FIG. 4), the seed light beam Lse has a high ("1") drawing bit string data Sdw. ) Is generated by the seed light S1 from the DFB semiconductor laser element 30 in FIG. 4, and while the drawing bit string data Sdw is low (“0”), the seed from the DFB semiconductor laser element 32 in FIG. Generated by light S2. The above-described drawing exposure operation of the scanning unit U1 shown in FIG. 16 is the same in the other scanning units U2 to U6.

  As described above, in the first embodiment, the beam is deflected (scanned) by the polygon mirror PM repeatedly for every other reflecting surface RP of the polygon mirror PM of the scanning unit Un (U1 to U6). The switching control unit 102 controls the beam switching member 16 to cause each of the plurality of scanning units Un (U1 to U6) to perform one-dimensional scanning of the spot light SP in order. Accordingly, one beam LB can be distributed to a plurality of scanning units Un (U1 to U6) without shortening the length of the drawing lines SLn (SL1 to SL6) scanned with the spot light SP, which is effective. The beam LB can be utilized. Further, since the shape of the polygon mirror PM (polygon shape) can be made close to a circle, it is possible to prevent the rotation speed of the polygon mirror PM from being lowered, and the polygon mirror PM can be rotated at high speed.

  The beam switching member 16 is arranged in series along the traveling direction of the beam LB from the light source device 14, and selects any one of the n beams LBn deflected by diffracting the beam LB. The optical element for selection AOMn (AOM1 to AOM6) is introduced into the scanning unit Un. Therefore, any one of the scanning units Un (U1 to U6) on which the beam LBn should be incident can be easily selected, and the beam LB from the light source device 14 can be efficiently applied to one scanning unit Un to be subjected to drawing exposure. It can be concentrated and a high exposure amount can be obtained. For example, the beam LB emitted from the light source device 14 is amplitude-divided into six using a plurality of beam splitters, and each of the divided six beams LBn (LB1 to LB6) is converted into serial data DL1 to DL6 of drawing data. When led to the six scanning units U1 to U6 via the acoustooptic modulator for drawing to be modulated, the attenuation of the beam intensity at the acoustooptic modulator for drawing is 20%, and the beam intensity within the scanning unit Un is reduced. When the attenuation is 30%, the intensity of the spot light SP in one scanning unit Un is about 9.3% when the intensity of the original beam LB is 100%. On the other hand, when the beam LB from the light source device 14 is deflected by the optical element AOMn for selection and is incident on one of the six scanning units Un as in the first embodiment, When the attenuation of the beam intensity at the optical element AOMn is 20%, the intensity of the spot light SP in one scanning unit Un is about 56% of the intensity of the original beam LB.

  The rotation control unit 100 controls the rotation of the polygon mirrors PM of the plurality of scanning units Un (U1 to U6) so that the rotation speeds are the same and the phase of the rotation angle position is shifted by a certain angle. Thus, the one-dimensional scanning of the spot light SP by the plurality of other scanning units Un is sequentially performed during the period from the one-dimensional scanning of the spot light SP by one scanning unit Un until the next one-dimensional scanning is performed. It becomes possible.

  In the first embodiment, one beam LB is distributed to six scanning units Un. However, one beam LB from the light source device 14 is distributed to nine scanning units Un (U1 to U9). You may distribute. In this case, if the scanning efficiency (α / β) of the polygon mirror PM is 1/3, the beam LBn is distributed to the nine scanning units U1 to U9 while the polygon mirror PM rotates by the three reflecting surfaces RP. Therefore, the spot light SP is scanned every two reflecting surfaces RP. This allows the other eight scanning units Un to sequentially scan the spot light SP until the next spot light SP is scanned after the scanning of the spot light SP by one scanning unit Un. it can. Further, if the scanning efficiency of the polygon mirror PM is 1/3, the polygon mirror PM can be rotated by three reflecting surfaces RP and one beam LB can be distributed to nine scanning units Un. The frequency divider 80 of CAn divides the frequency of the generation timing of the origin signal SZn by 1/3. In this case, the circulating pulse signals of the scanning units U1, U4, and U7 are synchronized (in phase on the time axis). Similarly, the circulating pulse signals of the scanning units U2, U5, U8 are synchronized, and the circulating pulse signals of the scanning units U3, U6, U9 are synchronized. The circular pulse signals of the scanning units U2, U5, U8 are generated with a delay of time Ts from the circular pulse signals of the scanning units U1, U4, U7, and the circular pulse signals of the scanning units U3, U6, U9 are It occurs with a delay of 2 × time Ts with respect to the circulating pulse signals of the scanning units U1, U4, U7. The generation timings of the sub origin signals ZP1, ZP4, ZP7 of the scanning units U1, U4, U7 are out of phase by 1/3 of one cycle. Similarly, the sub origin signals of the scanning units U2, U5, U8 The generation timings of ZP2, ZP5 and ZP8 and the generation timings of the sub origin signals ZP3, ZP6 and ZP9 of the scanning units U3, U6 and U9 are also shifted in phase by 1/3 of one cycle. The time Ts is a time for the polygon mirror PM to rotate by the scanning rotation angle range α ′ of the polygon mirror PM that can scan the spot light SP. The time Ts is an angle β at which the polygon mirror PM rotates by one reflecting surface RP. A value obtained by multiplying the scanning efficiency is a scanning rotation angle range α ′.

  When the scanning efficiency of the polygon mirror PM is 1/3 and one beam LB is distributed to 12 scanning units Un (U1 to U12), 12 polygon mirrors PM are rotated while four reflecting surfaces RP are rotated. Since the beam LBn can be distributed to the scanning units U1 to U12, the spot light SP is scanned for every third reflecting surface RP. If the scanning efficiency of the polygon mirror PM is 1/3, the polygon mirror PM is rotated by four reflecting surfaces RP, and the 12 selection optical elements AOMn in which the beams LB from the light source device 14 are arranged in series are arranged. Since the beams LBn (LB1 to LB12) selectively deflected by (AOM1 to AOM12) can be incident on one corresponding scanning unit Un (U1 to U12), the frequency division of the sub origin generation circuit CAn The device 80 divides the frequency of the generation timing of the origin signal SZn by 1/4. In this case, the circulation pulse signals of the scanning units U1, U4, U7, U10 are synchronized (in phase on the time axis). Similarly, the circulating pulse signals of the scanning units U2, U5, U8, U11 are synchronized, and the circulating pulse signals of the scanning units U3, U6, U9, U12 are synchronized. The circular pulse signals of the scanning units U2, U5, U8, and U11 are generated by a time Ts later than the circular pulse signals of the scanning units U1, U4, U7, and U10, and the scanning units U3, U6, U9, and U12 are generated. The round pulse signal is generated with a delay of 2 × time Ts with respect to the round pulse signals of the scanning units U1, U4, U7, and U10. In addition, the generation timings of the sub origin signals ZP1, ZP4, ZP7, and ZP10 of the scanning units U1, U4, U7, and U10 are shifted by ¼ of one cycle. Similarly, the scanning units U2, U5, and U8 , U11 sub origin signal ZP2, ZP5, ZP7, ZP11 generation timing, and scanning unit U3, U6, U9, U12 sub origin signal ZP3, ZP6, ZP9, ZP12 generation timing are also 1/4 of one cycle. The phase is shifted by one.

  In the first embodiment, the scanning efficiency of the polygon mirror PM of the scanning unit Un is described as 1/3. However, the scanning efficiency may be 1/2 or 1/4. Good. When the scanning efficiency is ½, the beam LBn can be distributed to the two scanning units Un while the polygon mirror PM rotates by one reflecting surface RP, so that one beam LBn is divided into six scanning units Un. When it is desired to distribute the spotlight SP, the spot light SP is scanned for every two reflecting surfaces RP of the polygon mirror PM. That is, when the scanning efficiency of the polygon mirror PM is ½, the beam LBn can be distributed to the six scanning units Un while the polygon mirror PM rotates by the three reflecting surfaces RP. This allows the other five scanning units Un to sequentially scan the spot light SP after the spot light SP is scanned by one scanning unit Un until the next spot light SP is scanned. it can. Further, when the scanning efficiency of the polygon mirror PM is halved, the polygon mirror PM rotates by three reflecting surfaces RP and one beam LB can be distributed to the six scanning units Un. The frequency divider 80 of CAn divides the frequency of the generation timing of the origin signal SZn by 1/3. In this case, the circulating pulse signals of the scanning units U1, U3, U5 are synchronized. Similarly, the circulating pulse signals of the scanning units U2, U4, U6 are synchronized. The circular pulse signals of the scanning units U2, U4, U6 are generated with a delay of time Ts from the circular pulse signals of the scanning units U1, U3, U5. Further, the generation timings of the sub origin signals ZP1, ZP3, ZP5 of the scanning units U1, U3, U5 are out of phase by 1/3 of one cycle, and the sub origin signals ZP2, ZP4 of the scanning units U2, U4, U6. The generation timing of ZP6 is also shifted in phase by 1/3 of one cycle.

  When the scanning efficiency of the polygon mirror PM is 1/4, the beam LBn can be distributed to the four scanning units Un while the polygon mirror PM rotates by one reflecting surface RP. When it is desired to distribute to the two scanning units Un, the spot light SP is scanned for every other reflecting surface RP of the polygon mirror PM. That is, when the scanning efficiency of the polygon mirror PM is 1/4, the beam LBn can be distributed to the eight scanning units Un while the polygon mirror PM rotates by two reflecting surfaces RP. This allows the other seven scanning units Un to sequentially scan the spot light SP until the next spot light SP is scanned after the scanning of the spot light SP by one scanning unit Un. it can. Further, if the scanning efficiency of the polygon mirror PM is 1/4, the polygon mirror PM rotates by two reflecting surfaces RP, and one beam LB can be distributed to eight scanning units Un. The frequency divider 80 for CAn divides the frequency of the generation timing of the origin signal SZn by half. In this case, the circulation pulse signals of the scanning units U1 and U5 are synchronized, and the circulation pulse signals of the scanning units U2 and U6 are synchronized. Similarly, the circulation pulse signals of the scanning units U3 and U7 are synchronized, and the circulation pulse signals of the scanning units U4 and U8 are synchronized. The circular pulse signals of the scanning units U2 and U6 are generated with a delay of time Ts from the circular pulse signals of the scanning units U1 and U5. The circular pulse signals of the scanning units U3 and U7 are generated with a delay of 2 × time Ts from the circular pulse signals of the scanning units U1 and U5, and the circular pulse signals of the scanning units U4 and U8 are generated by the scanning units U1 and U5. It occurs with a delay of 3 × time Ts with respect to the circulating pulse signal. The generation timings of the sub origin signals ZP1 and ZP5 of the scanning units U1 and U5 are shifted by 1/2 of one cycle, and the generation timings of the sub origin signals ZP2 and ZP6 of the scanning units U2 and U6 are also 1 The phase is shifted by half of the period. Similarly, the generation timings of the sub-origin signals ZP3 and ZP7 of the scanning units U3 and U7 and the sub-origin signals ZP4 and ZP8 of the scanning units U4 and U8 are also shifted in phase by 1/2 of one period.

  In the first embodiment, the polygon mirror PM has an octagonal shape (eight reflecting surfaces RP). However, it may be a hexagonal or heptagonal shape or more than a hexagonal shape. It may be. This also changes the scanning efficiency of the polygon mirror PM. In general, as the number of reflection surfaces of the polygon mirror PM having a polygonal shape increases, the scanning efficiency of one reflection surface RP of the polygon mirror PM increases, and as the number of reflection surfaces decreases, the scanning efficiency of the polygon mirror PM increases. Becomes smaller.

  The maximum scanning rotation angle range α of the polygon mirror PM that can be scanned by the spot light SP projected onto the substrate FS is determined by the incident angle of view of the fθ lens FT (corresponding to the angle θs in FIG. 10). A polygon mirror PM having an optimal number of reflecting surfaces can be selected corresponding to the corner. As in the previous example, in the case of an fθ lens FT having an incident angle of view (θs) of less than 30 degrees, the polygon mirror PM of 24 faces whose reflection surface RP changes by half of the rotation of 15 degrees, or for 30 degrees. It is also possible to use a 12-surface polygon mirror PM whose reflection surface RP changes with rotation. In this case, since the scanning efficiency (α / β) is larger than ½ and smaller than 1.0 in the 24-surface polygon mirror PM, the 24-surface polygons of each of the 6 scanning units U1 to U6. The mirror PM is controlled to scan the spot light SP by skipping five surfaces. Further, since the scanning efficiency of the 12-sided polygon mirror PM is greater than 1/3 and less than 1/2, the 12-sided polygon mirror PM of each of the 6 scanning units U1 to U6 is skipped by 2 sides. The spot light SP is controlled to be scanned.

[Second Embodiment]
In the first embodiment, the scanning (deflection) of the spot light SP is always repeated for every other reflection surface RP of the polygon mirror PM. However, in the second embodiment, the scanning (deflection) of the spot light SP is performed in the first state that is repeated for each continuous reflection surface RP of the polygon mirror PM, or the reflection surface RP of the polygon mirror PM is changed. It was made possible to arbitrarily switch between the second state that is repeated every other surface. In other words, the beam LB is distributed to the three scanning units Un in a time division or from the six scanning units Un in a time division until the scanning unit U1 starts the scanning of the spot light SP and starts the next scanning. Can be switched.

  Since the scanning efficiency of the polygon mirror PM is 1/3, when the scanning of the spot light SP is repeated for each continuous reflecting surface RP of the polygon mirror PM, for example, the next scanning is performed after the scanning unit U1 scans the spot light SP. In the meantime, the beam LB can be distributed only to two scanning units Un other than the scanning unit U1. Accordingly, two beams LB are prepared, the first beam LB is distributed to the three scanning units Un in a time division manner, and the second beam LB is distributed to the remaining three scanning units Un in a time division manner. Therefore, the scanning of the spot light SP is performed in parallel by the two scanning units Un. Two beams LB may be generated by providing two light source devices 14, or two beams LB may be generated by dividing a beam LB from one light source device 14 by a beam splitter or the like. The exposure apparatus EX according to the second embodiment shown in FIGS. 17 to 21 includes two light source devices 14 (see FIG. 19). Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and only different portions will be described.

  FIG. 17 is a configuration diagram of a beam switching member (beam delivery unit) 16A according to the second embodiment. Similar to the beam switching member 16 of FIG. 5, the beam switching member 16A includes a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condenser lenses CD1 to CD6, a plurality of reflection mirrors M1 to M12, and a plurality of mirrors IM1. To IM6 and a plurality of collimating lenses CL1 to CL6, and in addition, reflecting mirrors M13 and M14 and absorbers TR1 and TR2. The absorber TR1 corresponds to the absorber TR of FIG. 5 shown in the first embodiment, and absorbs the beam LB reflected by the reflection mirror M12.

  The selection optical elements AOM1 to AOM3 constitute an optical element module (first optical element module) OM1, and the selection optical elements AOM4 to AOM6 constitute an optical element module (second optical element module) OM2. As described in the first embodiment, the selection optical elements AOM1 to AOM3 of the first optical element module OM1 are arranged in series along the traveling direction of the beam LB. Similarly, the selection optical elements AOM4 to AOM6 of the second optical element module OM2 are also arranged in series along the traveling direction of the beam LB. The scanning units U1 to U3 corresponding to the selection optical elements AOM1 to AOM3 of the first optical element module OM1 are defined as the first scanning module. Further, the scanning units U4 to U6 corresponding to the selection optical elements AOM4 to AOM6 of the second optical element module OM2 are set as the second scanning module. The scanning units U1 to U3 of the first scanning module and the scanning units U4 to U6 of the second scanning module are arranged in a predetermined arrangement relationship as described in the first embodiment.

  In the second embodiment, the reflecting mirrors M6, M13, and M14 are in a first arrangement state in which the first optical element module OM1 and the second optical element module OM2 are arranged in parallel with respect to the traveling direction of the beam LB. And an arrangement switching member (movable member) SWE for switching to a second arrangement state in which the first optical element module OM1 and the second optical element module OM2 are arranged in series. The arrangement switching member SWE includes a slide member SE that supports the reflection mirrors M6, M13, and M14, and the slide member SE is movable in the X direction with respect to the support member IUB. The movement of the slide member SE (placement switching member SWE) in the X direction is performed by an actuator AC (see FIG. 19). The actuator AC is driven by the control of the drive control unit 102a (see FIG. 19) of the beam switching control unit 102.

  In the first arrangement state, the beams LB from the two light source devices 14 are incident on each of the first optical element module OM1 and the second optical element module OM2 in parallel. In the state, the beam LB from one light source device 14 enters the first optical element module OM1 and the second optical element module OM2. That is, in the second arrangement state, the beam LB transmitted through the first optical element module OM1 is incident on the second optical element module OM2. FIG. 17 shows a state in which the first optical element module OM1 and the second optical element module OM2 are in the second arrangement state arranged in series by the arrangement switching member SWE. That is, in the second arrangement state, all the selection optical elements AOM1 to AOM6 of the first optical element module OM1 and the second optical element module OM2 are arranged in series along the traveling direction of the beam LB. This is the same as FIG. 5 shown in the first embodiment. Therefore, as in the first embodiment, the first optical element module OM1 and the second optical element module OM2 arranged in series each select optical element AOMn (AOM1 to AOM6). One scanning unit Un on which any one deflected beam LBn is incident can be selected from the scanning module and the second scanning modules (U1 to U6). Note that the position of the arrangement switching member SWE in FIG. 17 is referred to as a second position. Further, the beam LB incident on the first optical element module OM1 (AOM1 to AOM3) in the first arrangement state is called a beam LBa from the first light source device 14A, and in the first arrangement state A beam incident on the second optical element module OM2 (AOM4 to AOM6) is referred to as a beam LBb from the second light source device 14B.

  When the arrangement switching member SWE moves to the −X direction side and reaches the first position, the first optical element module OM1 and the second optical element module OM2 are in the first arrangement state in which they are arranged in parallel. Become. FIG. 18 is a diagram illustrating the optical paths of the beams LBa and LBb when the position of the arrangement switching member SWE is the first position. In the first arrangement state, the beam LBa is incident on the first optical element module OM1, and the beam LBb is incident on the second optical element module OM2. In order to distinguish the beam LB incident on each of the first optical element module OM1 and the second optical element module OM2, the beam LB incident on the first optical element module OM1 is represented by LBa, and the second optical element module A beam LB that is directly incident on the OM2 is denoted by LBb.

  As shown in FIG. 18, when the arrangement switching member SWE moves to the first position, the position of the reflection mirror M6 shifts in the −X direction, so that the beam LBa reflected by the reflection mirror M6 is absorbed not by the reflection mirror M7. Incident on the body TR2. Therefore, the beam LBa incident on the first optical element module OM1 is incident only on the first optical element module OM1 (selection optical elements AOM1 to AOM3), and is not incident on the second optical element module OM2. That is, the beam LBa can pass only through the selection optical elements AOM1 to AOM3. When the position of the arrangement switching member SWE is the first position, the beam LBb that is emitted from the second light source device 14B and proceeds in the + Y direction toward the reflection mirror M13 is guided to the reflection mirror M7 by the reflection mirrors M13 and M14. It is burned. Accordingly, the beam LBb can pass only through the second optical element module OM2 (selection optical elements AOM4 to AOM6).

  Accordingly, the first optical element module OM1 is provided with a beam beam on one of the three scanning units U1 to U3 constituting the first scanning module by the three selection optical elements AOM1 to AOM3 arranged in series. Any one of the beams LB1 to LB3 deflected from LBa can be made incident. In addition, the second optical element module OM2 is configured such that the three selection optical elements AOM4 to AOM6 arranged in series give one of the three scanning units U4 to U6 constituting the second scanning module a beam. Any one of the beams LB4 to LB6 deflected from LBb can be made incident. Accordingly, the first scanning module (U1 to U3) and the second scanning are performed by the first optical element module OM1 (AOM1 to AOM3) and the second optical element module OM2 (AOM4 to AOM6) arranged in parallel. One scanning unit Un on which the beam LB is incident can be selected from the modules (U4 to U6). In this case, the exposure operation by scanning along the drawing line SLn of the spot light SP is performed in parallel by any one scanning unit Un of the first scanning module and any one scanning unit Un of the second scanning module. Done.

  The beam switching control unit 102 controls the actuator AC in the first state (first drawing mode) in which the scanning (deflection) of the spot light SP is repeated for each continuous reflecting surface RP of the polygon mirror PM. Then, the arrangement switching member SWE is arranged at the first position. In addition, the beam switching control unit 102 controls the actuator AC to control the arrangement switching member in the second state (second drawing mode) repeated for every other reflection surface RP of the polygon mirror PM. The SWE is placed at the second position.

  FIG. 19 is a diagram illustrating a configuration of the beam switching control unit 102 according to the second embodiment. In FIG. 19, the optical elements AOM1 to AOM6 for selection and the light source device 14 which are controlled by the beam switching control unit 102 are also illustrated. In the second embodiment, the light source device 14 that enters the beam LBa from the first optical element module OM1 is represented by 14A, and the light source device 14 that directly enters the beam LBb only to the second optical element module OM2 is 14B. It is represented by

  When the arrangement switching member SWE is in the second position, the beam LBa (LB) from the light source device 14A is selected in the order of AOM1, AOM2, AOM3,..., AOM6 as shown in FIG. The beam LBa that can pass through (transmit) the optical element for light AOMn and has passed through the optical element for selection AOM6 enters the absorber TR1. When the arrangement switching member SWE moves to the first position, the beam LBa from the light source device 14A can pass through the selection optical element AOMn in the order of AOM1, AOM2, and AOM3, and pass through the selection optical element AOM3. The beam LBa is incident on the absorber TR2. Further, in a state where the arrangement switching member SWE has moved to the first position, the beam LBb from the light source device 14B can pass through the selection optical element AOMn in the order of AOM4 → AOM5 → AOM6, and the selection optical element The beam LB that has passed through the AOM 6 enters the absorber TR1. Note that the arrangement switching member SWE in FIG. 19 is a conceptual diagram, and is different from the actual configuration of the arrangement switching member SWE shown in FIGS. 17 and 18. In the example shown in FIG. 19, the arrangement switching member SWE is in the second position, that is, in the second arrangement state in which the first optical element module OM1 and the second optical element module OM2 are arranged in series. This shows a case where the selection optical element AOM5 is in an ON state. As a result, the beam LB5 deflected by diffraction from the beam LBa from the light source device 14A enters the scanning unit U5.

  The beam switching control unit 102 includes a driver circuit DRVn (DRV1 to DRV6) that drives each of the selection optical elements AOM1 to AOM6 with an ultrasonic (high frequency) signal, and an origin sensor 60 of each scanning unit Un (U1 to U6). Sub origin generating circuits CAan (CAa1 to CAa6) for generating sub origin signals ZPn (ZP1 to ZP6) according to the origin signals SZn (SZ1 to SZ6). The driver circuit DRVn (DRV1 to DRV6) receives, from the exposure control unit 106, information on the on time Ton for turning on the selection optical elements AOM1 to AOM6 for a predetermined time after receiving the sub origin signal ZPn (ZP1 to ZP6). Sent. When the sub origin signal ZP1 is sent from the sub origin generation circuit CAa1, the driver circuit DRV1 turns on the optical element for selection AOM1 for the on time Ton. Similarly, when the sub origin signals ZP2 to ZP6 are sent from the sub origin generation circuits CAa2 to CAa6, the driver circuits DRV2 to DRV6 turn on the selection optical elements AOM2 to AOM6 for the on time Ton. When changing the rotation speed of the polygon mirror PM, the exposure control unit 106 changes the length of the on-time Ton accordingly. The driver circuits DRVn (DRV1 to DRV6) are similarly provided in the beam switching control unit 102 of FIG. 13 in the first embodiment.

  The sub origin generation circuit CAan (CAa1 to CAa6) includes a logic circuit LCC and a delay circuit 82. The origin signal SZn (SZ1 to SZ6) from the origin sensor 60 of each scanning unit Un (U1 to U6) is input to the logic circuit LCC of the sub origin generation circuit CAan (CAa1 to CAa6). That is, the origin signal SZ1 is input to the logic circuit LCC of the sub origin generation circuit CAa1, and similarly, the origin signals SZ2 to SZ6 are input to the logic circuit LCC of the sub origin generation circuits CAa2 to CAa6. Further, the status signal STS is input to the logic circuit LCC of each of the sub origin generation circuits CAan (CAa1 to CAa6). This status signal (logical value) STS is set to “1” in the case of the first state that is repeated for each continuous reflection surface RP of the polygon mirror PM, and is set every other reflection surface RP of the polygon mirror PM. In the case of the second state to be repeated, “0” is set. This status signal STS is sent from the exposure control unit 106.

  Each logic circuit LCC generates an origin signal SZn ′ (SZ1 ′ to SZ6 ′) based on the input origin signal SZn (SZ1 to SZ6) and outputs it to each delay circuit 82. Each delay circuit 82 delays the input origin signal SZn ′ (SZ1 ′ to SZ6 ′) by a time Tpx and outputs the sub origin signal ZPn (ZP1 to ZP6).

  FIG. 20 is a diagram illustrating a configuration of a logic circuit LCC that inputs the origin signal SZn (SZ1 to SZ6) and the status signal STS. The logic circuit LCC includes a two-input OR gate LC1, a two-input AND gate LC2, and a one-shot pulse generator LC3. The status signal STS is applied as one input signal of the OR gate LC1. The output signal (logical value) of the OR gate LC1 is applied as one input signal of the AND gate LC2, and the origin signal SZn is applied as the other input signal of the AND gate LC2. The output signal (logical value) of the AND gate LC2 is input to the delay circuit 82 as the origin signal SZn ′. The one-shot pulse generator LC3 normally outputs a signal SDo having a logical value “1”, but when the origin signal SZn ′ (SZ1 ′ to SZ6 ′) is generated, the signal SDo having a logical value “0” for a certain time Tdp. Is output. That is, when the origin signal SZn ′ (SZ1 ′ to SZ6 ′) is generated, the one-shot pulse generator LC3 inverts the logical value of the signal SDo for a certain time Tdp. The time Tdp is set to a relationship of 2 × Tpx> Tdp> Tpx, and is preferably set to Tdp≈1.5 × Tpx.

  FIG. 21 is a timing chart illustrating the operation of the logic circuit LCC in FIG. The left half of FIG. 21 shows the case of the first state where the scanning of the spot light SP by each scanning unit Un (U1 to U6) is performed for each continuous reflection surface RP without skipping the surface, and the right half is In the second state, the scanning of the spot light SP by each scanning unit Un (U1 to U6) is performed by skipping one reflection surface RP. In FIG. 21, for easy understanding, there is no error in the angle ηj formed between the adjacent reflecting surfaces RP (for example, the reflecting surfaces RPa and RPb) of the polygon mirror PM, and the origin signal SZn has the time Tpx. It is assumed that it occurs exactly at intervals.

  Since the status signal STS is “1” in the first state where the spot light SP is scanned for each reflection surface RP without skipping the surface, the output signal of the OR gate LC1 is related to the state of the signal SDo. It is always “1”. Therefore, the output signal (origin signal SZn ′) output from the AND gate LC2 is output at the same timing as the origin signal SZn. That is, in the first state, the origin signal SZn and the origin signal SZn ′ can be regarded as the same. In the first state, the time interval Tpx of the origin signal SZn ′ applied to the one-shot pulse generator LC3 is smaller than the time Tpd. Therefore, the signal SDo from the one-shot pulse generator LC3 remains “0”. Even when there is an error in the angle ηj formed between the reflecting surfaces RP of the polygon mirror PM, the time interval of the origin signal SZn ′ is still smaller than the time Tpd.

  When the second state in which scanning of the spot light SP is performed by skipping one surface of the reflection surface RP, the status signal STS is switched to “0”. Therefore, the output signal of the OR gate LC1 becomes “1” only when the signal SDo is “1”. In a state where the signal SDo is “1” (in this case, the output signal of the OR gate LC1 is also “1”), an origin signal SZn (for convenience, this origin signal SZn is referred to as the first origin signal SZn) is applied. In response to this, the AND gate LC2 also outputs the origin signal SZn ′. However, when the origin signal SZn ′ is generated, the signal SDo from the one-shot pulse generator LC3 changes to “0” for a time Tpd. Therefore, during the time Tpd, the two inputs of the OR gate LC1 both become “0” signals, and the output signal of the OR gate LC1 remains “0”. As a result, during the time Tpd, the output signal of the AND gate LC2 also remains “0”. Therefore, even if the second origin signal SZn is applied to the AND gate LC2 before the time Tpd elapses, the AND gate LC2 does not output the origin signal SZn ′.

  When the time Tpd elapses, the signal SDo from the one-shot pulse generator LC3 is inverted to “1”, so that the third applied after the time Tpd elapses as in the case of the first origin signal SZn. The origin signal SZn ′ corresponding to the origin signal SZn is output from the AND gate LC2. By repeating such an operation, the logic circuit LCC converts the origin signal SZn repeatedly generated every time Tpx into an origin signal SZn ′ repeatedly generated every 2 × time Tpx. From another viewpoint, the logic circuit LCC generates the origin signal SZn ′ by thinning out every other pulse of the origin signal SZn that is repeatedly generated every time Tpx, that is, the generation timing of the origin signal SZn. The frequency is divided by half. Note that the logic circuit LCC of the sub origin generation circuit CAan may be replaced with the frequency divider 80 (FIG. 11) of the sub origin generation circuit CAn described in the first embodiment. When the frequency divider 80 is replaced, the frequency divider 80 divides the origin signal SZn by 1/2 in the second state, and does not divide the origin signal SZn in the first state. What should I do? Further, the sub origin generation circuit CAn of the first embodiment may be replaced with the sub origin generation circuit CAan of the second embodiment. In the second state, the origin signal SZ1 ′ output from the logic circuit LCC of the sub origin generation circuit CAa1 and the origin signal SZ4 ′ output from the logic circuit LCC of the sub origin generation circuit CAa4 are half a cycle. Out of phase. Similarly, origin signals SZ2 ′ and SZ3 ′ output from the logic circuit LCC of the sub origin generation circuits CAa2 and CAa3, and origin signals SZ5 ′ and SZ6 ′ output from the logic circuit LCC of the sub origin generation circuits CAa5 and CAa6, Is out of phase with the half cycle.

  As described above, the spot light SP is generated for each continuous reflection surface RP of the polygon mirror PM only by inverting the value of the status signal STS input to the logic circuit LCC of each of the sub origin generation circuits CAa1 to CAa6 of the beam switching control unit 102. Switching between the first state in which the drawing exposure by scanning is repeated or the second state in which the drawing exposure by scanning of the spot light SP is repeated for every other reflection surface RP of the polygon mirror PM. Can do.

  In the second embodiment, the rotation control of the polygon mirror PM of each scanning unit Un (U1 to U6) is the same as that in the first embodiment. That is, each scanning unit Un (U1 to U6) is set so that the origin signals SZn (SZ1 to SZ6) output from the origin sensor 60 of each scanning unit Un (U1 to U6) have a relationship as shown in FIG. The rotation of the polygon mirror PM is controlled. Therefore, in the first state in which the scanning of the spot light SP is performed for each reflection surface RP without skipping the surface, the scanning units U1 to U3 scan the spot light SP in the order of U1 → U2 → U3. The scanning units U4 to U6 can repeatedly scan the spot light SP in the order of U4 → U5 → U6.

  It is preferable that the time Tpd set in the one-shot pulse generator LC3 can be changed according to information on the rotational speed of the polygon mirror PM from the exposure control unit 106. Further, even when the spot light SP is scanned not only by skipping one surface but by skipping two surfaces, the time Tpd is (n + 1) × Tpx> Tdp> n × Tpx as long as the configuration shown in FIG. You can respond by simply setting the relationship. Note that n represents the number of reflecting surfaces RP to be skipped. For example, when n is 2, it means that the spot light SP is scanned every two reflection surfaces RP, and when n is 3, the spot light SP is scanned every three reflection surfaces RP. Means to be done.

  Next, in the first state in which the spot light SP is scanned for each reflection surface RP without skipping the surface, the drawing data output control unit 104 performs drawing on the drive circuit 36a of the light source devices 14A and 14B. The output control of the bit string data Sdw will be briefly described. In the first state, the spot light SP is scanned in parallel by the first scanning module (scanning units U1 to U3) and the second scanning module (scanning units U4 to U6). For this reason, the drawing data output control unit 104 supplies serial data DL1 to DL3 corresponding to each of the scanning units U1 to U3 to the drive circuit 36a of the light source device 14A that emits the beam LBa incident on the first scanning module. Serial data DL4˜ corresponding to each of the scanning units U4˜U6 is output to the drive circuit 36a of the light source device 14B which outputs the drawing bit string data Sdw synthesized in series and emits the beam LBb incident on the second scanning module. The drawing bit string data Sdw obtained by synthesizing DL6 in time series is output.

  Also, the drawing data output control unit 104 shown in FIG. 15 can be used as it is regardless of whether the status signal STS is “1” or “0”. In the first state where the spot light SP is scanned for each reflecting surface RP without skipping the surface, the sub origin signal ZP2 is generated after the time Ts after the generation of the sub origin signal ZP1, and further after the time Ts. A secondary origin signal ZP3 is generated. Therefore, the serial data DL1 to DL3 are repeatedly output in the order of DL1 → DL2 → DL3 by the counter units CN1 to CN3. The serial data DL1 to DL3 that are sequentially output through the gate portions GT1 to GT3 that are opened during a predetermined time (on time Ton) after the sub origin signals ZP1 to ZP3 are applied are first drawn bit string data Sdw. Is input to the drive circuit 36a of the light source device 14A. Similarly, in the first state in which the scanning of the spot light SP is performed for each reflection surface RP without skipping the surface, the sub origin signal ZP5 is generated after the time Ts after the generation of the sub origin signal ZP4. Sub time origin signal ZP6 is generated after time Ts. Therefore, the counter units CN4 to CN6 repeatedly output the serial data DL4 to DL6 in the order of DL4 → DL5 → DL6. The serial data DL4 to DL6 that are sequentially output through the gate portions GT4 to GT6 that are opened during a predetermined time (on time Ton) after the sub-origin signals ZP4 to ZP6 are applied are the second drawing bit string data Sdw. Is input to the drive circuit 36a of the light source device 14B.

  Next, the shift of the serial data DL1 to DL6 in the first state will be briefly described. The serial data DL1 is shifted in the column direction at the timing when the sub-origin signal ZP2 corresponding to the scanning unit U2 to be scanned next is generated after the serial data DL1 has been output. The serial data DL2 is shifted in the column direction at the timing when the sub-origin signal ZP3 corresponding to the scanning unit U3 that performs the next scanning is generated after the serial data DL2 is output. The serial data DL3 is shifted in the column direction at the timing when the sub-origin signal ZP1 corresponding to the scanning unit U1 to be scanned next is generated after the serial data DL3 has been output. The serial data DL4 is shifted in the column direction at the timing when the sub-origin signal ZP5 corresponding to the scanning unit U5 that performs the next scanning is generated after the serial data DL4 is output. The serial data DL5 is shifted in the column direction at the timing when the sub-origin signal ZP6 corresponding to the scanning unit U6 that performs the next scanning is generated after the serial data DL5 is output. The serial data DL6 is shifted in the column direction at the timing when the sub-origin signal ZP4 corresponding to the scanning unit U4 that performs the next scanning is generated after the serial data DL6 is output. Note that the output control of the drawing bit string data Sdw in the second state is the same as that in the first embodiment, and a description thereof will be omitted.

  Further, in the second state in which the scanning of the spot light SP is performed by skipping one surface of the reflection surface RP, each scanning unit Un is compared with the first state performed for each reflection surface RP without skipping the surface. The scanning start interval of the spot light SP of (U1 to U6) is long. For example, in the case where the spot light SP is scanned by skipping one surface of the reflection surface RP, the scanning start interval of the spot light SP of each scanning unit Un (U1 to U6) is doubled compared to the case where the surface skip is not performed. Become. In addition, when the reflection surface RP is skipped by two surfaces, the scanning start interval of the spot light SP is tripled compared to when the reflection surface RP is not skipped. Therefore, if the rotation speed of the polygon mirror PM and the transport speed of the substrate FS are the same in the first state and the second state, the exposure results differ in the first state and the second state. End up.

  Therefore, at least one of the rotation speed of the polygon mirror PM and the transport speed of the substrate FS is changed (corrected) between the first state and the second state, and the exposure results in the first state and the second state are obtained. The exposure control unit 106 may have a control mode for making the same state. For example, when the scanning start interval of the spot light SP in the first state and the scanning start interval of the spot light SP in the second state are 1: 2, the exposure control unit 106 is in the first state. The rotation control unit 100 is controlled so that the ratio of the rotation speed of the polygon mirror PM at the time of the rotation speed of the polygon mirror PM at the second state is 1: 2. Specifically, the rotational speed of the polygon mirror PM in the first state is set to 20,000 rpm, and the rotational speed of the polygon mirror PM in the second state is set to 40,000 rpm. At the same time, the light emission frequency Fs of the beam LB (LBa, LBb) of the light source device 14 (14A, 14B) is set to, for example, 200 MHz in the first state and 400 MHz in the second state. Thereby, the interval of the generation timing of the sub origin signal ZPn in the first state and the interval of the generation timing of the sub origin signal ZPn in the second state can be made substantially the same.

  For example, when the scanning start interval of the spot light SP in the first state and the scanning start interval of the spot light SP in the second state are 1: 2, the substrate in the first state An exposure control unit controls a control mode for controlling the rotational speeds of the driving rollers R1 to R3 and the rotary drum DR so that the ratio of the transport speed of the FS and the transport speed of the substrate FS in the second state is 2: 1. 106 may be provided. As described above, the control mode (scanning correction mode) for correcting the rotation speed and light emission frequency Fs (frequency of the clock signal LTC) of the polygon mirror PM, or the control mode (transport correction mode) for correcting the transport speed of the substrate FS. By either one, the interval in the X direction of the drawing lines SLn (SL1 to SL6) on the substrate FS in the first state and the drawing lines SLn (SL1 to SL6) on the substrate FS in the second state The distance in the X direction can be the same distance (for example, 1.5 μm). Furthermore, the pattern data (bitmap) stored in each of the memory units BM1 to BM6 in the drawing data output control unit 104 in the first state and the second state is used without any correction. be able to.

  Further, by using both the scanning correction mode and the conveyance correction mode, the pattern drawn on the substrate FS in the first state is equivalent to the pattern drawn on the substrate FS in the second state. You may correct | amend so that it may. For example, in the first state (in the case of beam scanning for each reflection surface RP of the polygon mirror PM), the rotation speed of the polygon mirror PM is 20,000 rpm, and the light emission frequency Fs of the beam LB of the light source device 14 (14A, 14B). Is 200 MHz, and the transport speed of the substrate FS is 5 mm / second, in the second state (in the case of beam scanning by skipping one reflecting surface RP of the polygon mirror PM), the transport speed of the substrate FS is not halved to -25. %, The rotation speed of the polygon mirror PM may be set to 30,000 rpm which is 1.5 times, and the light emission frequency Fs of the beam LB is also set to 300 MHz which is 1.5 times. . As described above, when both the scanning correction mode and the conveyance correction mode are combined, it is not necessary to reduce the conveyance speed of the substrate FS to half in the case of the second state, so that an extreme decrease in productivity can be suppressed. .

  In the second embodiment, as described in the first embodiment, the number of scanning units Un that distribute the beams LBa and LBb may be arbitrarily changed. Further, the scanning efficiency of the polygon mirror PM may be arbitrarily changed. In the second embodiment, since the scanning efficiency of the polygon mirror PM is 1/3 and the number of scanning units Un is six, the six selection optical elements AOMn (AOM1 to AOM6) are divided into two optical elements. The modules are divided into modules OM1 and OM2, and the corresponding six scanning units Un (U1 to U6) are divided into two scanning modules. However, when the scanning efficiency of the polygon mirror PM is 1 / M and the number of the scanning unit Un and the selection optical element AOMn is Q, the Q selection optical elements AOMn are converted into Q / M optical element modules OM1 and OM2. ,..., Q scanning units Un may be divided into Q / M scanning modules. In this case, the number of optical elements AOMn for selection included in each of the optical element modules OM1, OM2,... Is equal, and the number of scanning units Un included in each of the Q / M scanning modules is also equal. It is preferable to do this. The Q / M is preferably a positive number. That is, Q is preferably a multiple of M.

  For example, when the scanning efficiency of the polygon mirror PM is 1/2 and the number of scanning units Un and selection optical elements AOMn is six, the six selection optical elements AOMn are equal to the three optical element modules OM1, OM2, and OM3. The six scanning units Un may be equally divided into three scanning modules. In the case of the first state, the three optical element modules OM1, OM2, and OM3 are arranged in parallel, and the beams LB (from the three light source devices 14 to each of the three optical element modules OM1, OM2, and OM3) ( In this case, LBa, LBb, and LBc) are incident in parallel. In the second state, three optical element modules OM1, OM2, and OM3 are arranged in series, and one light source device 14 The beam LB may be incident so that it passes through the three optical element modules OM1, OM2, and OM3 serially.

  As described above, in the second embodiment, the deflection (scanning) of the beam LBn (spot light SP) by the polygon mirror PM of the scanning unit Un is repeated for each continuous reflection surface RP of the polygon mirror PM. So that the beam is switched to one of the state (first drawing mode) and the second state (second drawing mode) repeated for every other reflecting surface RP of the polygon mirror PM. The switching control unit 102 controls the beam switching member 16A to sequentially perform the one-dimensional scanning of the spot light SP by each of the plurality of scanning units Un. As a result, the same effects as those of the first embodiment can be obtained, and switching between scanning of the spot light SP with skipping of the surface or scanning of the spot light SP without skipping of the surface can be performed. it can.

  In the case of the first state, when the scanning efficiency (α / β) of the polygon mirror PM is less than ½, the number of scanning units Un according to the reciprocal of the scanning efficiency is grouped as one scanning module, Using a plurality of the grouped scanning modules, one scanning unit Un of each scanning module performs one-dimensional scanning of the spot light SP. Thereby, the same number of drawing lines SLn as the number of scanning modules among the plurality of drawing lines SLn can be simultaneously scanned with the spot light SP. In the second state, since the beam scanning is controlled for every other reflecting surface RP of the polygon mirror PM, it corresponds to the reciprocal of the scanning efficiency (α / β) of the polygon mirror PM. Even if there are a plurality of scanning units Un larger than the number, all of the plurality of scanning units Un can scan the spot light SP along the drawing line SLn while effectively using the beam LB.

  In the case of the first state, since the beams LBa and LBb from the light source devices 14A and 14B are incident on the two grouped scanning modules in parallel, the selection is made in the beam switching member 16A. Each of the optical elements AOM1 to AOM6 is turned on / off so that the beams LB1 to LB6 are incident on the corresponding scanning units U1 to U6 in a time-division manner in units of scanning modules grouped by the beam switching control unit 102. Be switched.

  The arrangement switching member SWE provided on the beam switching member 16A transmits the beam LBa from the first light source device 14A to the three scanning units U1 to U3 among the six scanning units U1 to U6. And the three selection optics along the optical path of the beam LBa so that the beam LBb from the second light source device 14B is distributed to each of the remaining three scanning units U4 to U6 as beams LB4 to LB6. The first arrangement state in which the elements AOM1 to AOM3 are connected in series and the optical elements for selection AOM4 to AOM6 are connected in series along the optical path of the beam LBb and the beam LBa from one light source device 14A are scanned six times. Six along the optical path of the beam LBa so as to be distributed to each of the units U1 to U6 as beams LB1 to LB6. Selective optical element AOM1~AOM6 which switches the second arrangement state linked in series.

  Thereby, in the case of the first state, each of the scanning units U1 to U6 is set to the spot light for each continuous reflection surface RP of the polygon mirror PM by setting the first arrangement state by the arrangement switching member SWE. The scanning by the SP can be repeated, and two of the six scanning units U1 to U6 can perform the scanning by the spot light SP almost simultaneously. Further, in the case of the second state, by setting the second arrangement state by the arrangement switching member SWE, the beam scanning is performed for each reflection surface RP of at least every other mirror of the polygon mirror PM. Scanning with the spot light SP can be repeated in all of U1 to U6.

  Therefore, according to the second embodiment, in the initial setup of the drawing apparatus, the arrangement switching member SWE is set so as to be in the second arrangement state by using one light source device 14A, and thereafter In order to increase the transport speed of the substrate FS, the second light source device 14B is added and the arrangement switching member SWE is set so as to be in the first arrangement state. The drawing apparatus can be upgraded by a simple operation such as expansion or switching of the arrangement switching member SWE.

  In each of the above embodiments, the origin signal SZn is detected using the reflection surface RP that is one before the rotation direction of the polygon mirror PM with respect to the reflection surface RP that deflects the beam LBn of the polygon mirror PM. However, the origin signal SZn may be detected by using the reflection surface RP itself that deflects the beam LBn. In this case, since it is not necessary to delay the origin signal SZn or the origin signal SZn ′ obtained from the origin signal SZn by the time Tpx, the origin signal SZn or the origin signal SZn ′ may be used as the sub origin signal ZPn.

  In each of the above embodiments, the electro-optic element 36 as the drawing light modulator of the light source device 14 (14A, 14B) is switched using the drawing bit string data Sdw. A drawing optical element AOM may be used. The drawing optical element AOM is an acousto-optic modulator (AOM). That is, in the first embodiment, the drawing optical element AOM is disposed between the light source device 14 and the first-stage selection optical element AOM1, and the beam from the light source device 14 that has passed through the drawing optical element AOM is transmitted. LB may enter the selection optical element AOM1. In this case, the drawing optical element AOM is switched according to the drawing bit string data Sdw. Even in this case, the same effect as that of the first embodiment can be obtained.

  In the second embodiment, between the first light source device 14A and the first-stage selection optical element AOM1 of the first optical element module OM1, and between the second light source device 14B and the second optical element. The drawing optical elements AOM (AOMa, AOMb) are respectively arranged between the first selection optical element AOM4 of the element module OM2. That is, the beam LBa from the light source device 14A that has passed through the drawing optical element AOMa enters the selection optical element AOM1, and the beam LBb from the light source device 14B that has passed through the drawing optical element AOMb enters the selection optical element AOM4. To do. In this case, in the first state, the drawing optical element AOMa is switched in accordance with the drawing bit string data Sdw composed of the serial data DL1 to DL3, and the drawing optical element AOMb is switched to the serial data DL4 to DL6. Is switched according to the drawing bit string data Sdw. In the second state, only the drawing optical element AOMa is switched according to the drawing bit string data Sdw including the serial data DL1 to DL6.

  Further, the drawing optical element AOM may be provided for each scanning unit Un. In this case, the drawing optical element AOM may be provided in front of the reflection mirror M20 (see FIG. 7) of each scanning unit Un. The drawing optical element AOM of each scanning unit Un (U1 to U6) is switched according to each serial data DLn (DL1 to DL6). For example, the drawing optical element AOM of the scanning unit U3 is switched according to the serial data DL3.

[Third Embodiment]
FIG. 22 shows the configuration of a beam switching member (beam delivery unit) 16B according to the third embodiment. Here, the beam LBw emitted from one light source device 14 and incident on the beam switching member 16B is circularly polarized. It is assumed that it is a parallel light beam. The beam switching member 16B includes six selection optical elements AOM1 to AOM6, two absorbers TR1 and TR2, six lens systems CG1 to CG6, mirrors M30, M31 and M32, a condensing lens CG0, and a polarization beam splitter. BS1 and two drawing optical elements (acousto-optic modulation elements) AOMa and AOMb are provided. Note that the same reference numerals are assigned to the same configurations as those in the first embodiment or the second embodiment.

  The beam LBw incident on the beam switching member 16B passes through the condenser lens CG0 and is separated into a linear P-polarized beam LBp and a linear S-polarized beam LBs by the polarizing beam splitter BS1. The S-polarized beam LBs reflected by the polarization beam splitter BS1 enters the drawing optical element AOMa. The beam LBs incident on the drawing optical element AOMa is converged so as to be a beam waist in the drawing optical element AOMa by the focusing action of the condenser lens CG0. The drawing bit string data Sdw (DLn) as shown in FIG. 16 is applied to the drawing optical element AOMa via the driver circuit DRVn. The drawing bit string data Sdw is obtained by synthesizing serial data DL1, DL3, DL5 corresponding to each of odd-numbered scanning units U1, U3, U5. Accordingly, the drawing optical element AOMa is turned on when the drawing bit string data Sdw (DLn) is “1”, and the first-order diffracted light of the incident beam LBs is deflected to the deflected drawing beam (intensity modulated). Beam) toward the mirror M31. The drawing beam reflected by the mirror M31 enters the selection optical element AOM1 through the lens system CG1. Further, when the drawing bit string data Sdw (DLn) is “0”, the 0th-order light (LBs) emitted from the drawing optical element AOMa is reflected by the mirror M31, but does not enter the subsequent lens system CG1. Proceed at an angle. The lens system CG1 condenses the drawing beam emitted from the drawing optical element AOMa at the diffraction portion of the selection optical element AOM1 to form a beam waist.

  The drawing beam that has passed through the selection optical element AOM1 enters the selection optical element AOM3 via the lens system CG3 similar to the lens system CG1, and the drawing beam that has passed through the selection optical element AOM3 is the same as in the lens system CG1. Enters the optical element for selection AOM5 through the lens system CG5. In FIG. 22, three selection optical elements AOM1, AOM3, and AOM5 are arranged in series along the beam optical path, and only the selection optical element AOM3 is turned on, and the intensity is modulated by the drawing optical element AOMa. The drawn beam is incident on the corresponding scanning unit U3 as a beam LB3. The lens systems CG1, CG3, and CG5 correspond to a combination of one collimator lens CL and one condenser lens CD in FIGS.

  On the other hand, the P-polarized beam LBp that has passed through the polarization beam splitter BS1 is reflected by the mirror M30 and enters the drawing optical element AOMb. The beam LBp incident on the drawing optical element AOMb is converged so as to be a beam waist in the drawing optical element AOMb by the focusing action of the condenser lens CG0. The drawing bit string data Sdw (DLn) as shown in FIG. 16 is applied to the drawing optical element AOMb via the driver circuit DRVn. The drawing bit string data Sdw is a combination of serial data DL2, DL4, and DL6 corresponding to each of the even-numbered scanning units U2, U4, and U6. Therefore, the drawing optical element AOMb is turned on when the drawing bit string data Sdw (DLn) is “1”, and the first-order diffracted light of the incident beam LBp is deflected to the deflected drawing beam (intensity modulated). Beam) toward the mirror M32. The drawing beam reflected by the mirror M32 enters the selection optical element AOM2 through a lens system CG2 similar to the lens system CG1. Further, the zero-order light (LBp) emitted from the drawing optical element AOMb when the drawing bit string data Sdw (DLn) is “0” is reflected by the mirror M32, but does not enter the subsequent lens system CG2. Proceed at an angle. The lens system CG2 condenses the drawing beam emitted from the drawing optical element AOMb at the diffraction portion of the selection optical element AOM2 to form a beam waist.

  The drawing beam transmitted through the selection optical element AOM2 is incident on the selection optical element AOM4 via the lens system CG4 similar to the lens system CG1, and the drawing beam transmitted through the selection optical element AOM4 is the same as in the lens system CG1. Is incident on the optical element for selection AOM6 via the lens system CG6. In FIG. 22, three optical elements for selection AOM2, AOM4, and AOM6 are arranged in series along the beam optical path, and only the optical element for selection AOM2 is turned on, and the intensity is modulated by the optical element for drawing AOMb. The drawn beam is incident on the corresponding scanning unit U2 as a beam LB2. The lens systems CG2, CG4, and CG6 correspond to a combination of one collimator lens CL and one condenser lens CD in FIGS.

  When the beam switching member (beam delivery unit) 16B as shown in FIG. 22 is used, the beam LBw from one light source device 14 is divided into two by the polarization beam splitter BS1, and the drawing optics is obtained from one of the beams LBs. The drawing beam (LB1, LB3, LB5) generated by the element AOMa is sequentially incident on any one of the odd-numbered scanning units U1, U3, U5, and the other beam LBp divided by the polarization beam splitter BS1. The drawing beam (LB2, LB4, LB6) generated by the drawing optical element AOMb can be sequentially incident on any one of the even-numbered scanning units U2, U4, U6.

  In the third embodiment, after the beam LBw from the light source device 14 is split into two by the polarization beam splitter BS1, the intensity modulation of the beam LB based on the pattern data is performed by the drawing optical elements AOMa and AOMb. Therefore, the intensity of the spot light SP by each of the six scanning units U1 to U6 is −50% attenuation at the polarization beam splitter BS1, and attenuation at the drawing optical elements AOMa and AOMb and each selection optical element AOMn−. Assuming 20% and the attenuation in each of the scanning units U1 to U6 is −30%, this is about 22.4% of the intensity (100%) of the original beam LBw. However, when the scanning efficiency of the polygon mirror PM of each of the six scanning units U1 to U6 is 1/3 or less and the beam LBw from one light source device 14 is used, the reflection surface RP of the polygon mirror PM is one surface. A pattern can be drawn by scanning the spot light SP on each of the six drawing lines SLn without performing beam scanning by skipping.

[Modification 1]
As in the third embodiment, the polarization directions of the beams LBs incident on the odd selection optical elements AOM1, AOM3, and AOM5 and the beams LBp incident on the even selection optical elements AOM2, AOM4, and AOM6. Are orthogonal to each other, the odd-numbered selection optical element AOMn and the even-numbered selection optical element AOMn need to be relatively rotated by 90 degrees around the beam incident axis. FIG. 23 shows a configuration in which, for example, the selection optical element AOM3 among the odd-numbered selection optical elements AOM1, AOM3, and AOM5 is rotated 90 degrees with respect to the even-numbered selection optical element AOMn. . Since the selection optical element AOM3 receives the S-polarized drawing beam that has passed through the lens system CG3, the direction in which the diffraction efficiency is high is the Y direction parallel to the XY plane. In other words, the selection optical element AOM3 is rotated 90 degrees so that the periodic direction of the diffraction grating generated in the selection optical element AOM3 is the Y direction.

  With such an arrangement of the selection optical element AOM3, the beam LB3 deflected and emitted when the selection optical element AOM3 is in the ON state is inclined in the Y direction with respect to the traveling direction of the zero-order light. Therefore, the beam LB3 is separated from the optical path of the zero-order light, and the beam LB3 from the selection optical element AOM3 is reflected in the XY plane so that the beam LB3 passes through the opening portion TH3 of the support member IUB in the Z direction. A mirror IM3a and a mirror IM3b that reflects the beam LB3 reflected by the mirror IM3a in the −Z direction so as to pass through the opening TH3 are provided. Similarly, each of the other odd-numbered selection optical elements AOM1 and AOM5 is provided with a set of mirrors IM1a and IM1b and a set of mirrors IM5a and IM5b. Further, in the configuration of FIG. 22, since the polarization directions of the beams LBs and LBp incident on the drawing optical elements AOMa and AOMb are orthogonal, the drawing optical elements AOMa and AOMb are relatively around the beam incident axis. They are arranged in a relationship rotated 90 degrees.

  However, when the polarization beam splitter BS1 in FIG. 22 is an amplitude division beam splitter or a half mirror, if the polarization direction of the beam LBw is set to only one direction (for example, P polarization), the drawing optical elements AOMa and AOMb On the other hand, it is not necessary to arrange one of the odd-numbered selection optical element AOMn and the even-numbered selection optical element AOMn by relatively rotating 90 degrees as shown in FIG.

[Modification 2]
In the third embodiment, all of the scanning units U1 to U6 corresponding to each of the six selection optical elements AOM1 to AOM6 are arranged on each of the drawing lines SL1 to SL6 for every reflecting surface RP of the polygon mirror PM. The configuration is such that the spot light SP can be scanned along. Therefore, the selection optical element AOM5 in FIG. 22 and the absorption are absorbed so that the drawing beam (beam modulated by the drawing optical element AOMa) that has passed through the odd selection optical elements AOM1, AOM3, and AOM5 in order is incident. Three additional selection optical elements AOM7, AOM9, and AOM11 are provided in series between the body TR2, and a drawing beam that has passed through the even-numbered selection optical elements AOM2, AOM4, and AOM6 in order (with the drawing optical element AOMb). Further, three selection optical elements AOM8, AOM10, and AOM12 are provided in series between the selection optical element AOM6 and the absorber TR1 so that a modulated beam is incident. Then, six scanning units U7 to U12 into which the beams LB7 to LB12 deflected (switched) by the selection optical elements AOM7 to AOM12 are introduced are added, and a total of twelve scanning units U1 to U12 are connected to the substrate FS. Arrange in the width direction (Y direction). Thereby, joint drawing exposure of 12 drawing lines SL1 to SL12 becomes possible, and the maximum exposure width in the Y direction can be doubled.

  In this case, when the scanning efficiency of the polygon mirror PM of each of the scanning units U1 to U12 is 1/3 or less, the odd-numbered scanning units U1, U3, U5, U7, U9 grouped as the first drawing module. , U11, and even-numbered scanning units U2, U4, U6, U8, U10, and U12 grouped as the second drawing module all provide beams LBn for every other reflection surface RP of the polygon mirror PM. Scan. In this way, even when the width of the substrate FS in the Y direction is increased, pattern drawing for a large exposure region W (FIG. 3) can be performed only by adding scanning units U7 to U12, optical elements for selection AOM7 to AOM12, and the like. Is possible. As described above, the configuration in which the six scanning units U7 to U12 and the selection optical elements AOM7 to AOM12 are added to form 12 scanning units U1 to U12 is the same as that of the second embodiment (FIGS. 17 to 17). The same applies to the case of using the two light source devices 14A and 14B described in 19).

[Modification 3]
FIG. 24 shows the positional relationship between the transport mode of the substrate FS and the scanning unit Un (drawing line SLn) according to the third modification. Here, twelve scanning units U1 to U12 are provided as in the second modification, The drawing lines SL1 to SL12 of the scanning unit Un are arranged on the rotary drum DR so that the drawing exposure can be performed in the Y direction. Further, the length of the rotary drum DR and various rollers R1 to R3, RT1, RT2, etc. in the substrate transport mechanism 12 shown in FIG. The maximum drawing width in the Y direction that can be exposed is Sh (Sh <Hd), and the maximum support width of the substrate FS0 that can be exposed is Td. Each of the twelve scanning units U1 to U12 corresponding to each of the twelve drawing lines SL1 to SL12 in the third modification is configured to generate a beam LBw from one light source device 14 as shown in FIG. 22 (third embodiment). Beam switching member (beam delivery unit) 16B that splits the beam into two with a beam splitter or half mirror, or beams from each of the two light source devices 14A and 14B as shown in FIG. 19 (second embodiment). Twelve corresponding beams LB1 to LB12 are incident in a time division manner from a beam switching member (beam delivery unit) 16A using a system using LBa and LBb. Therefore, for example, when the length of each drawing line SL1 to SL12 in the Y direction is 50 mm, the maximum drawing width Sh is 600 mm. As an example, the width of the substrate FS0 serving as the maximum support width Td is 650 mm, and the length Hd of the rotating drum DR. Can be about 700 mm.

  When performing exposure of the substrate FS0 having the same width as the maximum support width Td by the drawing apparatus as shown in FIG. 24, the four alignment microscopes AM1 to AM4 (observation regions Vw1 to Vw4) shown in FIGS. In addition, three alignment microscopes AM5 to AM7 (observation regions Vw5 to Vw7) are added in the Y direction. In that case, the alignment microscope AM1 (observation region Vw1) and the alignment microscope AM7 (observation region Vw7) located on both sides in the width direction of the substrate FS0 have alignment marks formed at a constant pitch in the X direction on both sides of the substrate FS0. To detect. In addition, the alignment microscope AM4 (observation region Vw4) is disposed so as to be positioned at the approximate center of the maximum support width Td.

  Further, in the case of the substrate FS1 on which the pattern can be drawn in the exposure region W by the drawing lines SL1 to SL6 by each of the six scanning units U1 to U6 as described in each of the previous embodiments, the width Td1 is a rotating drum. Since it is about half of the maximum support width Td of DR, the substrate FS1 is transported toward the −Y direction side of the outer peripheral surface of the rotary drum DR, for example. At that time, each of the alignment marks MK1 to MK4 (FIG. 3) on the substrate FS1 can be detected by the observation regions Vw1 to Vw4 of the four alignment microscopes AM1 to AM4. In the case of exposure of the substrate FS1, since only six scanning units U1 to U6 need be used, each of the scanning units U1 to U6 performs beam scanning for each continuous reflecting surface RP of the polygon mirror PM, or polygons. Spot scanning along each drawing line SL1 to SL6 is possible in both modes of beam scanning of the mirror PM on one reflecting surface RP.

  For example, when the beams LBa and LBb from each of the two light source devices 14A and 14B are set to be used together as in the second embodiment, the beam LBa from the light source device 14A has an odd number. The optical switching elements AOM1, AOM3, AOM5, AOM7, AOM9, and AOM11 corresponding to each of the scanning units U1, U3, U5, U7, U9, and U11 are grouped in the beam switching member 16A so as to pass through in series. The beam LBa from the light source device 14A is transmitted in series through the optical elements for selection AOM2, AOM4, AOM6, AOM8, AOM10, and AOM12 corresponding to each of the even-numbered scanning units U2, U4, U6, U8, U10, and U12. As such, they are grouped within the beam switching member 16A. When the substrate FS1 is exposed, only the three origin signals SZ1, SZ3, SZ5 output for each continuous reflection surface RP of the polygon mirror PM are used to detect the odd-numbered scanning units U1, U3, U5. In order, the beam scanning for each continuous reflecting surface RP of the polygon mirror PM is controlled to be repeated, and only based on the three origin signals SZ2, SZ4, SZ6 output for each continuous reflecting surface RP of the polygon mirror PM. Thus, control is performed so that beam scanning is repeated for each of the continuous reflecting surfaces RP of the polygon mirror PM in the order of the even-numbered scanning units U2, U4, and U6.

  Further, when exposure is performed on the substrate FS2 having a width Td2 smaller than the maximum support width Td and larger than the width Td1 of the substrate FS1, the substrate FS2 is aligned with the center portion of the maximum support width Td of the rotary drum DR. Transport. At this time, the exposure area W on the substrate FS2 is drawn by drawing lines SL3 to SL10 by the eight scanning units U3 to U10 connected in the Y direction. In such a case, the odd-numbered four selection optical elements AOM3, AOM5, AOM7, and AOM9 that receive the beam LBa (intensity-modulated drawing beam) from the light source device 14A are time-divided into the beams LB3, LB5, and LB7. , LB9 are sequentially generated, and four even-numbered selection optical elements AOM4, AOM6, AOM8, and AOM10 that receive the beam LBb (intensity-modulated drawing beam) from the light source device 14B are Control is performed so as to sequentially generate any one of the beams LB4, LB6, LB8, and LB10 in the division. Therefore, each of the at least eight scanning units U3 to U10 is set to the beam scanning mode for every reflecting surface RP of the polygon mirror PM.

  When the substrate FS2 is exposed, four sub-origin signals ZP3, ZP5, ZP7, which are output every one reflecting surface RP of each polygon mirror PM of the odd-numbered scanning units U3, U5, U7, U9, Based on only ZP9, the odd-numbered scanning units U3, U5, U7, and U9 are controlled in such a manner that the beam scanning is repeated for each reflection surface RP of the polygon mirror PM, and even-numbered scanning units U4, U4, Based on only the four sub-origin signals ZP4, ZP6, ZP8, and ZP10 that are output every one reflecting surface RP of each polygon mirror PM of U6, U8, and U10, even-numbered scanning units U4, U6, U8, and U10 In this order, beam scanning is repeated for every reflecting surface RP of the polygon mirror PM. In FIG. 24, alignment marks (corresponding to the marks MK1 and MK4 in FIG. 3) formed on both sides in the width direction on the substrate FS2 are detected by the observation regions Vw2 and Vw6 of the alignment microscopes AM2 and AM6. Although arranged in such a relationship, depending on the size of the exposure region W in the Y direction, it may not be necessarily arranged in such a relationship. In that case, it is preferable to provide a configuration in which some of the seven alignment microscopes AM1 to AM7 can be moved in the Y direction so that the position intervals in the Y direction of the observation regions Vw1 to Vw7 can be adjusted.

  According to the third modification described above, it is possible to perform efficient exposure using only the necessary scanning unit Un according to the width of the substrate FS to be exposed and the dimension in the Y direction of the exposure region W. In addition, when the scanning efficiency of each polygon mirror PM of each of the twelve scanning units U1 to U12 is 1/3 or less as shown in FIG. 24, for example, beam scanning is performed every three reflecting surfaces RP of each polygon mirror PM. By doing so, even with a beam from one light source device 14, it is possible to satisfactorily draw a pattern over the maximum drawing width Sh.

  Further, when the drawing apparatus is configured by nine scanning units U1 to U9, five odd-numbered scanning units U1, U3, U5, U7, and U9 and four even-numbered scanning units U2, U4, U6 and U8 are used. Therefore, when pattern drawing is performed in the exposure area W by the drawing lines SL1 to SL9 by all nine scanning units U1 to U9, when the scanning efficiency of the polygon mirror PM is 1/3 or less, for example, each polygon mirror PM. The beam may be scanned every other reflecting surface RP. However, in this case, only the sub origin signals ZP1, ZP3, ZP5, ZP7, and ZP9 generated from the origin signals SZn of the odd-numbered scanning units U1, U3, U5, U7, and U9 are referred to in that order. By repeating this, spot scanning is performed on each of the odd-numbered drawing lines SL1, SL3, SL5, SL7, and SL9, and is generated from the origin signal SZn of each of the even-numbered scanning units U2, U4, U6, and U8. It is only necessary to perform spot scanning on each of even-numbered drawing lines SL2, SL4, SL6, and SL8 by repeatedly referencing only the sub origin signals ZP2, ZP4, ZP6, and ZP8 in that order.

  As described above, in the third modification, the plurality of scanning units Un that scan the spot light SP of the beam from the light source device 14 along the drawing line SLn is used to draw the pattern drawn by each drawing line SLn on the substrate FS. A pattern drawing method using a drawing device that is arranged so as to be connected in the direction of the main scanning direction (the main scanning direction) and relatively moves the plurality of scanning units and the substrate FS in the sub-scanning direction intersecting the main scanning direction. Among the scanning units Un, a specific scanning unit corresponding to the width of the substrate FS in the main scanning direction, the width of the exposure region on the substrate FS in the main scanning direction, or the position of the exposure region is selected. And based on the pattern data to be drawn in each of the specific scanning units via the beam delivery unit for delivering the beam from the light source device 14. Pattern exposure method comprising Te and that the intensity modulated drawn beam alternatively sequentially supplied to each of the particular scan unit, is provided. Thereby, in the modification 3, even if the width | variety of the board | substrate FS changes or the width | variety and position of the exposure area | region W on the board | substrate FS change, it is high by determining the conveyance position of the Y direction of the board | substrate FS appropriately. Precise pattern drawing while maintaining splicing accuracy is possible. At that time, the rotation speed and the rotation angle phase are not synchronized among all the polygon mirrors PM of the plurality of scanning units, but only between the polygon mirrors PM of a specific scanning unit contributing to pattern drawing. The rotation speed and the rotation angle phase may be synchronized.

[Modification 4]
Further, as another configuration of the drawing apparatus using nine scanning units U1 to U9, instead of grouping into odd numbers and even numbers, it is simply divided into two groups in the order in which the scanning units Un are arranged. You can also. That is, it is divided into a first scanning module by six scanning units U1 to U6 and a second scanning module by three scanning units U7 to U9. For the first scanning module, the first light source The beam LBa from the device 14A may be supplied, and the beam LBb from the second light source device 14B may be supplied to the second scanning module. In that case, if the scanning efficiency (α / β) of the polygon mirror PM is 1/4 <(α / β) ≦ 1/3, each of the six scanning units U1 to U6 in the first scanning module. In the same manner as in the first embodiment (FIG. 13), the spot light SP is scanned along the drawing lines SL1 to SL6 by beam scanning every one reflecting surface RP of the polygon mirror PM. Become.

  On the other hand, each of the three scanning units U7 to U9 in the second scanning module can perform beam scanning for every reflecting surface RP of the polygon mirror PM. Therefore, if each of the three scanning units U7 to U9 performs the beam scanning for every reflecting surface RP of the polygon mirror PM as it is, each drawing line SL1 to each of the six scanning units U1 to U6 is used. The repetition time interval ΔTc1 of scanning of the spot light SP in SL6 and the scanning repetition time interval ΔTc2 of the spot light SP in each of the drawing lines SL7 to SL9 by each of the three scanning units U7 to U9 have a relationship of ΔTc1 = 2ΔTc2. Therefore, the pattern drawn on the substrate FS by the drawing lines SL1 to SL6 is different from the pattern drawn on the substrate FS by the drawing lines SL7 to SL9, and good joint exposure cannot be performed.

  Therefore, each of the three scanning units U7 to U9 capable of performing beam scanning for every reflecting surface RP of the polygon mirror PM is controlled to perform beam scanning for every reflecting surface RP of the polygon mirror PM. . In such a control, the origin signals SZ7 to SZ9 generated from each of the scanning units U7 to U9 are input to the circuit of FIG. 11 or the sub origin generation circuit CAan in FIG. 19 to input the sub origin signals ZP7 to ZP9. In response to the sub-origin signals ZP7 to ZP9, the corresponding selection optical elements AOM7 to AOM9 are sequentially turned on for a predetermined time Ton and drawn on each of the drawing lines SL7 to SL9. This can be realized by sequentially sending each of the drawing serial data DL7 to DL9 corresponding to the pattern to the drive circuit 36a of the electro-optic element 36 in the second light source device 14B.

[Modification 5]
FIG. 25 shows a configuration of the driver circuit DRVn of the selection optical element AOMn according to the fifth modification. As described in the previous embodiments and modifications, when each of the plurality of scanning units Un performs beam scanning at intervals of one reflecting surface RP of the polygon mirror PM, the light source device 14 (14A, 14B). Beam LB (LBa, LBb) emitted from the laser beam and beams LBs, LBp emitted from the drawing optical elements AOMa, AOMb pass through a plurality of optical elements AOMn for selection arranged along the optical path. In FIG. 25, after the beam LB passes through the selection optical elements AOM1 and AOM2, the beam LB is switched by the selection optical element AOM3 to generate the beam LB3 toward the scanning unit U3. In general, the optical material in the selection optical element AOMn has a relatively high transmittance with respect to the beam LB in the ultraviolet wavelength region (for example, a wavelength of 355 nm), but has an attenuation factor of about several percent.

When the transmittance of each of the selection optical elements AOMn is 95%, when the selection optical element AOM3 is turned on as shown in FIG. 25, the intensity of the beam LB incident on the selection optical element AOM3 is two. Since it is attenuated by the selection optical elements AOM1 and AOM2, it is about 90% (0.95 ² ) with respect to the original beam intensity (100%) incident on the selection optical element AOM1. Further, when six selection optical elements AOM1 to AOM6 are connected, the intensity of the beam LB incident on the last selection optical element AOM6 is attenuated by the five selection optical elements AOM1 to AOM5. The beam intensity (100%) is about 77% (0.95 ⁵ ).

  From this, the intensity of the beam LB incident on each of the six selection optical elements AOM1 to AOM6 becomes 100%, 95%, 90%, 85%, 81%, and 77% in order. This means that the intensities of the beams LB1 to LB6 that are deflected and emitted by the selection optical elements AOM1 to AOM6 also change depending on the ratio. Therefore, in the fifth modification, the driving conditions of the selection optical elements AOM1 to AOM6 are adjusted in the driver circuits DRVn of the plurality of selection optical elements AOMn shown in FIG. Control to reduce fluctuations.

  In FIG. 25, since the driver circuits DRV1 to DRV6 (DRV5 and DRV6 are not shown) have the same configuration, detailed description will be given only for the driver circuit DRV1. As shown in FIG. 19, the on-state times Ton of the selection optical elements AOM1 to AOM6 (in FIG. 25, AOM5 and AOM6 are omitted) are set in each of the driver circuits DRV1 to DRV6. And the sub origin signals ZP1 to ZP6 are input. In the configuration of FIG. 25, a high-frequency transmission source 200 for applying ultrasonic waves to each of the selection optical elements AOM1 to AOM6 is provided in common. The driver circuit DRV1 receives a high-frequency signal from the high-frequency transmission source 200 and transmits it to the amplifier 202 that amplifies the high-frequency signal to a high voltage amplitude, and information for setting the time Ton. Based on the sub-origin signal ZP1, the logic circuit 203 that controls the opening and closing of the switching element 201 and the amplification factor (gain) of the amplifier 202 are adjusted to adjust the amplitude of the high-frequency high-frequency signal applied to the selection optical element AOM1. A gain adjuster 204.

  When the amplitude of the high-frequency high-frequency signal applied to the selection optical element AOM1 is changed within an allowable range, the diffraction efficiency of the selection optical element AOM1 can be finely adjusted, and the intensity of the deflected beam LB1 (first-order diffracted light) is changed. It is possible. Therefore, in the fifth modification, the selection optical elements are arranged in the order of the driver circuit DRV1 of the selection optical element AOM1 closer to the light source device 14 and the driver circuit DRV6 of the selection optical element AOM6 away from the light source device 14. The gain adjuster 204 is adjusted so that the amplitude of the high-frequency high-frequency signal applied to the element AOMn is increased. For example, the amplitude of the high-frequency high-frequency signal applied to the optical element for selection AOM6 at the end of the optical path of the beam LB is set to a value Va6 that gives the highest diffraction efficiency, and the first optical element for selection in the optical path of the beam LB The amplitude of the high-frequency high-frequency signal applied to the AOM 1 is set to a value Va1 so that the diffraction efficiency is lowered within an allowable range. The amplitudes Va2 to Va5 of the high-frequency high-frequency signals applied to the selection optical elements AOM2 to AOM5 are set so that Va1 <Va2 <Va3 <Va4 <Va5 <Va6.

  With the above settings, intensity variations of the beams LB1 to LB6 emitted from each of the six selection optical elements AOM1 to AOM6 can be reduced or suppressed. As a result, variations in the exposure amount of the pattern drawn by each of the drawing lines SL1 to SL6 can be suppressed, and highly accurate pattern drawing can be performed. The amplitudes Va1 to Va6 of the high-frequency high-frequency signals set by the driver circuits DRV1 to DRV6 do not need to be gradually increased in that order. For example, Va1 = Va2 <Va3 = Va4 <Va5 = Va6. May be. Further, the method of adjusting the intensity of the drawing beams LB1 to LB6 to be the spot light SP for each of the scanning units U1 to U6 is not limited to the method as in the modified example 5, but the optical path in each of the scanning units U1 to U6. A method of providing a neutral density filter (ND filter) having a predetermined transmittance may be used.

  In the driver circuit DRVn of FIG. 25, it is assumed that whether or not the high frequency signal from the high frequency transmission source 200 is transmitted to the amplifier 202 by the switching element 201 is switched. However, in order to improve the response (rise characteristic) when switching on / off of the optical element AOMn for selection, the diffraction efficiency is considered to be substantially zero, for example, the intensity of the first-order diffracted light is set to the intensity when turned on. On the other hand, a low-level high-frequency signal that is 1/1000 or less is continuously applied to the selection optical element AOMn, and an appropriate high-level high-frequency signal is applied to the selection optical element AOMn only in the ON state. It may be. FIG. 26 shows the configuration of such a driver circuit DRVn. Here, the configuration of the driver circuit DRV1 is representatively shown, and the same members as those in FIG. 25 are denoted by the same reference numerals.

  In the configuration of FIG. 26, two resistors RE1 and RE2 connected in series are added. The series circuit of the resistors RE1 and RE2 is inserted in parallel to the high-frequency transmission source 200 before the switching element 201, and the high-frequency signal from the high-frequency transmission source 200 divided by the resistance ratio RE2 / (RE1 + RE2) is always supplied to the amplifier 202. Is applied. When the resistor RE2 is a variable resistor and the switching element 201 is off (non-conducting), the first-order diffracted light emitted from the selection optical element AOM1, that is, the intensity of the beam LB1 is sufficiently small (for example, the original intensity). The level of the high-frequency signal applied to the selection optical element AOM1 is adjusted so as to be 1/1000 or less of the above. As described above, the responsiveness can be improved by applying the bias (raising) of the high frequency signal to the selection optical element AOM1 by the resistors RE1 and RE2. In this case, the beam LB1 is incident on the corresponding scanning unit U1 even though the switching element 201 is in an off (non-conducting) state. When the transport speed is reduced or stopped, the shutter provided at the exit of the light source device 14 (14A, 14B) is closed or a neutral density filter is inserted.

[Modification 6]
In each of the above embodiments and modifications, each of the plurality of scanning units Un is formed on the surface of the substrate FS curved in a cylindrical surface with the sheet-like substrate FS in close contact with the outer peripheral surface of the rotary drum DR. The pattern is drawn along the drawing line SLn. However, as disclosed in, for example, International Publication No. 2013/150677, the exposure processing may be performed while feeding the substrate FS in the longitudinal direction while supporting the substrate FS in a planar shape. In this case, if the surface of the substrate FS is set parallel to the XY plane, for example, the irradiation center axes Le1, Le3, Le5 of the odd-numbered scanning units U1, U3, U5 shown in FIGS. And the irradiation center axes Le2, Le4, Le6 of the even-numbered scanning units U2, U4, U6 are parallel to the Z axis when viewed in a plane parallel to the XZ plane, and at a constant interval in the X direction. A plurality of scanning units U1 to U6 may be arranged so as to be positioned at.

DESCRIPTION OF SYMBOLS 10 ... Device manufacturing system 12 ... Board | substrate conveyance mechanism 14, 14A, 14B ... Light source device 16, 16A, 16B ... Beam switching member 18 ... Exposure head 20 ... Control apparatus 30, 32 ... DFB semiconductor laser element 34, 38 ... Deflection beam splitter DESCRIPTION OF SYMBOLS 35 ... Laser light source part 36 ... Electro-optical element 36a ... Drive circuit 42 ... Excitation light source 44 ... Combiner 46 ... Fiber optical amplifier 48, 50 ... Wavelength conversion optical element 52 ... Control circuit 52a ... Clock generator 60 ... Origin sensor 60a ... Beam Light transmission system 60b Beam receiving system 80 Frequency divider 82 Delay circuit 100 Rotation control unit 102 Beam switching control unit 102a Drive control unit 104 Drawing data output control unit 106 Exposure control unit 106a Counter circuit 110 , 112, 114, 116, 118, 120 ... generating circuit 200 ... high frequency Transmission source 201 ... Switching element 202 ... Amplifier 203 ... Logic circuit 204 ... Gain adjuster AMm ... Alignment microscope AOMn ... Optical element for selection AOM, AOMa, AOMb ... Optical element for drawing BM1 to BM6 ... Memory unit CAn, CAan ... Sub origin Generation circuits CN1 to CN6 ... counter unit DLn ... serial data DR ... rotating drum ENn ... encoder EX ... exposure apparatus Fs ... emission frequency (oscillation frequency)
FS, FS0 to FS2 ... Substrate FT ... fθ lens IUB ... Support member LCC ... Logic circuits LB, LBn, LBp, LBs, LBw ... Beams OM1, OM2, OM3 ... Optical element module PM ... Polygon mirror RP ... Reflecting surface SD, SDa , SDb ... scale part Sdw ... drawing bit string data SLn ... drawing line SP ... spot light SWE ... arrangement switching member SZn, SZn '... origin signal Un ... scanning unit ZPn ... sub origin signal

Claims (14)

A pattern drawing apparatus that repeatedly scans a drawing beam projected onto an irradiated object by rotating a rotary polygon mirror and draws a predetermined pattern on the irradiated object,
An origin detection unit that generates an origin signal when it is detected that a second reflecting surface different from the first reflecting surface that reflects the drawing beam is at a predetermined angular position among a plurality of reflecting surfaces of the rotary polygon mirror. When,
Timing delayed by a predetermined delay from the generation of the origin signal with reference to a predetermined time determined by the rotational speed of the rotary polygon mirror from when the origin signal is generated until the second reflecting surface becomes the first reflecting surface. A controller for instructing to start drawing with the drawing beam;
A pattern drawing apparatus. The pattern drawing apparatus according to claim 1,
The pattern drawing apparatus, wherein the second reflecting surface is set next to the first reflecting surface with respect to the rotation direction of the rotary polygon mirror. The pattern drawing apparatus according to claim 2,
The pattern writing apparatus, wherein the control device rotates the rotary polygon mirror in a direction in which the second reflection surface detected by the origin detection unit becomes the first reflection surface and reflects the drawing beam. It is a pattern drawing apparatus of Claim 3, Comprising:
The predetermined time is determined by 60 / (Np × Vp) [second], where Np is the number of reflecting surfaces of the rotating polygon mirror and Vp [rpm] is the number of rotations per minute of the rotating polygon mirror. Drawing device. It is a pattern drawing apparatus of any one of Claims 1-4,
The origin detection unit receives a beam transmission system that projects a beam different from the drawing beam toward the second reflecting surface, and receives the reflected beam reflected by the second reflecting surface at a predetermined position. And a beam receiving system for outputting the origin signal. It is a pattern drawing apparatus of any one of Claims 1-5,
The drawing beam is irradiated as spot light on the irradiated object, and the spot light is scanned at a predetermined scanning speed in the main scanning direction on the irradiated object by rotation of the rotary polygon mirror to draw the pattern. And
The drawing beam light source device oscillates the drawing beam at a frequency such that the spot light overlaps at an interval smaller than an effective dimension of the spot light. It is a pattern drawing apparatus of Claim 6, Comprising:
In the first drawing mode, the control device scans the drawing beam for each continuous reflecting surface of the rotary polygon mirror, draws the pattern with the spot light, and performs the second drawing. In the case of the mode, the pattern drawing device that scans the drawing beam for every n-th reflective surface of the rotary polygon mirror and draws the pattern by the spot light. A pattern drawing method in which a drawing beam projected on an irradiated body is repeatedly scanned by rotation of a rotary polygon mirror to draw a predetermined pattern on the irradiated body,
Generating an origin signal when detecting that a second reflecting surface different from the first reflecting surface that reflects the drawing beam among a plurality of reflecting surfaces of the rotary polygon mirror has reached a predetermined angular position;
Timing delayed by a predetermined delay from the generation of the origin signal with reference to a predetermined time determined by the rotational speed of the rotary polygon mirror from when the origin signal is generated until the second reflecting surface becomes the first reflecting surface. Instructing to start drawing with the drawing beam;
A pattern drawing method including: The pattern drawing method according to claim 8,
The pattern drawing method, wherein the second reflecting surface is set adjacent to the first reflecting surface with respect to the rotation direction of the rotary polygon mirror. The pattern drawing method according to claim 9,
A pattern drawing method in which the rotary polygon mirror rotates in a direction in which the second reflecting surface used for generating the origin signal becomes the first reflecting surface and reflects the drawing beam. The pattern drawing method according to claim 10,
The predetermined time is determined by 60 / (Np × Vp) [second], where Np is the number of reflecting surfaces of the rotating polygon mirror and Vp [rpm] is the number of rotations per minute of the rotating polygon mirror. Drawing method. The pattern drawing method according to any one of claims 8 to 11,
Generating the origin signal means projecting a beam different from the drawing beam toward the second reflecting surface, and receiving the reflected beam reflected by the second reflecting surface at a predetermined position. And outputting the origin signal. The pattern drawing method according to any one of claims 8 to 12,
The drawing beam is irradiated as spot light on the irradiated object, and the spot light is scanned at a predetermined scanning speed in the main scanning direction on the irradiated object by rotation of the rotary polygon mirror to draw the pattern. And
A pattern drawing method in which a light source device oscillates the drawing beam at a frequency such that the spot light overlaps at an interval smaller than an effective dimension of the spot light. The pattern drawing method according to claim 13,
In the case of the first drawing mode, the drawing beam is scanned for each continuous reflecting surface of the rotary polygon mirror, and the pattern is drawn by the spot light. In the case of the second drawing mode, A pattern drawing method, wherein the drawing beam is drawn by scanning the drawing beam for each n-plane reflecting surface of a rotary polygon mirror.

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