JP2016206362A - Electronic apparatus having configuration for preventing loose of connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a configuration that makes mating of connectors easy, and prevents mating of connectors from being uncoupled with no additional member.SOLUTION: An imaging device includes: a substrate having an implementation surface and a rectangular cavity provided on the implementation surface; electronic components disposed inside of the cavity of the substrate; and a flexible substrate 58 connected with the electric components electrically. The flexible substrate has a reinforcement board and the reinforcement board is press-fitted relative to the cavity.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device such as a digital camera or a video camera.

  In recent years, a large-scale electronic circuit is often provided in accordance with an improvement in the performance of an electronic device, while miniaturization is progressing in order to improve the usability of the electronic device.

  In such an electronic device, electronic circuits are mounted on a plurality of substrates and laid out in a limited space. In addition, in order to reduce the size, particularly in the thickness direction of electronic equipment, a plurality of substrates are often laid out in substantially the same plane. As a method of connecting the plurality of substrates, a method of connecting with a flexible substrate is known. In this method, a connector is mounted on one or both of a plurality of substrates and electrically connected by a flexible substrate.

  The connection portion by the connector needs to have a configuration that prevents the connector from being disconnected due to a drop impact or the like of the imaging device. For example, in the case of a vertical fitting type connector, a restricting member is provided on the mechanical member on the back of the connector to elastically press the connector connecting portion so that the connectors are not separated beyond the effective fitting length of the connector connecting portion. A method is known (see Patent Document 1).

  There is also known a configuration in which a fixing member is provided in an imaging element of an imaging device and a connector connecting portion is covered with a protective member attached to the fixing member (see Patent Document 2).

JP 2006-339206 A JP 2013-130861 A

  However, in the conventional technique disclosed in Patent Document 1 described above, since the position of the imaging substrate is adjusted in the imaging apparatus, the distance from the mechanical member on the back surface of the connector is not constant. Therefore, the distance between the restricting member provided on the mechanical member on the back of the connector and the connector connecting portion is not constant, and an effect for preventing the connector from coming off cannot be expected.

  In the prior art disclosed in Patent Document 2, a new pressing member is provided for the connector connecting portion, which may increase the space and cost in the imaging apparatus.

  Accordingly, an object of the present invention is to provide an imaging apparatus that can reliably prevent the connector from being detached from a substrate whose position is adjusted in the imaging apparatus without adding a new dedicated member. It is in.

  In order to achieve the above object, an imaging apparatus according to claim 1 is disposed inside a mounting surface, a substrate having a rectangular recess provided on the mounting surface, and the recess of the substrate. An electronic component and a flexible substrate electrically connected to the electronic component are provided, the flexible substrate has a reinforcing plate, and the reinforcing plate is press-fitted and fixed to the recess.

  According to the present invention, it is possible to provide an imaging apparatus that can reliably prevent the connector from coming off even with respect to a board whose position is adjusted in the imaging apparatus without adding a new dedicated member. .

A diagram in which a flexible substrate is mounted on the imaging substrate in this embodiment. External perspective view of a digital single-lens reflex camera to which the present invention is applied Block diagram of a digital single-lens reflex camera in this embodiment Configuration diagram of the camera body with the exterior unit removed An exploded perspective view of the camera body with the exterior unit removed as seen from the front side of the camera External view and layer configuration diagram of imaging substrate in this example The figure which shows the mounting state of the imaging board in a present Example, and sectional drawing External view of flexible substrate in this example The figure by which the flexible substrate was mounted | worn with the imaging substrate in another aspect The figure by which the flexible substrate was mounted | worn with the imaging substrate in another aspect

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 2 is an external perspective view of a digital single-lens reflex camera to which the present invention is applied. FIG. 3 is a block diagram of the digital single-lens reflex camera in the present embodiment.

  When the main power switch 107 provided on the top surface exterior cover 101 of the camera body 100 is operated to the ON position, the camera microcomputer 10 activates the camera in a predetermined sequence. Normally, the flash unit 103 is held in the storage position when the power is off.

  In addition to the viewfinder eyepiece window 112, a color liquid crystal monitor 110 capable of displaying pre-photographing information and setting contents of the camera, captured images, and the like is provided above the camera body 100.

  The camera body 100 includes a storage unit 113 that stores an external memory such as a CompactFlash (CF) card or an SD card that records captured images.

  When the operation microcomputer 12 detects the operation of the operation member by the operation detection circuit 12, the camera microcomputer 10 performs a corresponding setting. For example, when the shooting mode dial 108 is operated to select a shooting mode, a program diagram for determining a combination of shutter speed and aperture corresponding to the selected shooting mode is set. When the electronic dial 105 is operated, settings such as exposure correction are performed. When the ISO sensitivity setting button 106 is operated, the ISO sensitivity condition is set.

  A series of shooting operations when the automatic setting mode is selected with the shooting mode dial 108 will be described. When the operation detection circuit 12 detects that the release button 104 has been pushed to the first position, the camera microcomputer 10 drives the shooting condition control circuit 13 to determine an appropriate shutter speed and aperture value. The subject light is measured by a photometric sensor (not shown) provided in the vicinity of the viewfinder 112.

  When it is determined from the obtained photometric result that the subject light is lower than the predetermined luminance, the camera microcomputer 10 drives the motor control circuit 14 and drives a motor (not shown) to move the flash unit 103 to the light emission position. Then, it moves to a predetermined position by the rotational movement (state shown in FIG. 2).

  When the operation detection circuit 12 detects that the release button 104 has been pushed to the second position, the camera microcomputer 10 drives the motor control circuit 14 so that the subject light reaches an image sensor (not shown), The mirror unit is retracted to a predetermined position, a shutter (not shown) is opened, the flash control circuit 11 is driven, and light is emitted at a predetermined timing to irradiate the subject with appropriate light.

  After the light emission, the camera microcomputer 10 drives the motor control circuit 14 to put the shutter in a light-shielded state for a predetermined time. The camera microcomputer 10 drives the image sensor driving circuit 15 in a state where the subject light has reached the image sensor, and acquires the subject light as electronic data by photoelectric conversion. The acquired electronic data is subjected to predetermined data processing such as amplification, conversion, and correction by the data processing circuit 16, and becomes photographed image data.

  The camera microcomputer 10 drives the recording processing circuit 17 to record the obtained captured image data in a memory (not shown). When the photographer operates an image playback button (not shown), the camera microcomputer 10 drives the playback processing circuit 18 to display the captured image stored in the memory on the display device 110 provided on the back side of the camera.

  4A and 4B are perspective views of the camera body with the exterior unit of the digital single-lens reflex camera to which the present invention is applied, as viewed from the front side of the camera and FIG. 4B from the back side of the camera. FIG. 5 is an exploded perspective view of FIG.

  50 is a main base which is a skeleton of the camera body. The subject image is provided to the photographer by the pentaprism 51 and the mirror 20 fixed to be rotatable.

  The main base 50 is fixed with an ear ring 59a, which is a first metal ring, and an ear ring 59b, which is a second metal ring, for a camera user to attach a camera accessory such as a strap (not shown). The material of the ear rings 59a and 59b is a metal material such as stainless steel.

  A first substrate (main substrate) 55 and a second substrate (imaging substrate) 56 are fixed to the main base 50, and the main substrate 55 and the imaging substrate 56 are electrically connected to each other via a flexible substrate 58. It is connected to the.

  The main board 55 is substantially U-shaped, and many of the various electric circuits shown in FIG.

  An A / D (analog / digital) conversion element is mounted on the imaging substrate 56, and converts an analog signal from the imaging element 60 into a digital signal.

  6A is a cross-sectional view taken along line AA showing the layer configuration of the imaging substrate 56, and FIG.

  The imaging board 56 in the present embodiment is a printed wiring board (hereinafter referred to as PWB), and has six layers including six conductive layers from L1 to L6 and insulating layers from i1 to i5 that insulate each conductive layer. PWB. Specifically, the conductor layer L3, the conductor layer L4, and the two-layer PWB composed of the insulating layer i3 are used as the core, and the conductor layers L2 and L1 and the conductor layers L5 and L6 as the build-up layers are laminated on the front and back sides. It is a 6-layer build-up wiring board with -2 configuration.

  The imaging board 56 is a so-called cavity board in which a recess 63 having a height lower than the component mounting surface 64 is provided in a partial area of the board, and an electronic component can be mounted in the area of the recess 63. is there. The side surface of the recess 63 is configured by side surface portions 63a, 63b, 63c, and 63d.

  FIG. 7A is a diagram illustrating a state in which various mounting components are mounted on the imaging substrate 56. FIG. 7B is a cross-sectional view taken along the line B-B in FIG. 7A. In this embodiment, a B to B (Board to Board) connector 80 is mounted in the recess 63 of the imaging substrate 56. For simplification, the mounting components other than the BtoB connector 80 are omitted in FIG.

  FIG. 8A is a view of the flexible board 58 electrically connected to the imaging board 56 as seen from the back side (the non-mounting surface of the component).

  The flexible substrate 58 includes a base material portion 70 made of a conductive pattern layer and an insulating layer (not shown), and reinforcing plates 71 and 72 for reinforcing the back surface of the component mounting portion.

  FIG. 8B is a diagram showing the back surface of the flexible substrate 58 shown in FIG. 8A, that is, the component mounting surface.

  On the flexible substrate 58, a BtoB connector 81 for connecting to the imaging substrate 56 and a BtoB connector 82 for connecting to the main substrate 55 are mounted, and reinforcing plates 71 and 72 are provided on the respective back surfaces. Further, the reinforcing plate 71 is provided with a protrusion 71a and a slit 71c in the vicinity thereof. Similarly, a slit 71d is provided in the protrusion 71b and the vicinity thereof.

  FIG. 1B, which is a CC cross section in FIGS. 1A and 1A, shows a flexible substrate 58 on the imaging substrate 56, a BtoB connector 80 on the imaging substrate side, and a BtoB connector 81 on the flexible substrate 58 side. The figure is shown via the connection.

  When the BtoB connectors 80 and 81 are fitted, the protrusion 71a provided on the reinforcing plate 71 of the flexible substrate 58 contacts the side surface portion 63a of the recess 63 provided on the imaging substrate 56. At this time, reaction force from the side surface portion 63a of the imaging substrate 56 is generated in the protrusion 71a, but displacement occurs on the reinforcing plate 71 side by the slit 71c provided in the vicinity of the protrusion 71a, and the side surface portion 63a of the imaging substrate 56 It becomes possible to reduce the reaction force against.

  Similarly, the protrusion 71b provided on the reinforcing plate 71 of the flexible substrate 58 contacts the side surface portion 63c of the recess 63, but is displaced toward the reinforcing plate 71 by the slit 71d provided in the vicinity of the protrusion 71b. As a result, reaction force against the side surface portion 63c of the imaging substrate 56 can be reduced.

  With such a structure that absorbs the reaction force due to the slit, excessive stress is not generated on both the imaging substrate 56 and the reinforcing plate 71 of the flexible substrate 58, and damage to the substrate and the flexible substrate can be prevented. Further, since the displacement of the reinforcing plate 71 is absorbed by the slit, the assembly workability is also good.

  In addition, the flexible substrate 58 may extend in a direction other than the side surface portions 63a and 63c of the concave portion 63 with which the protrusions 71a and 71b of the reinforcing plate 71 abut, thereby restricting wiring in the flexible substrate 58. Absent.

  In the above embodiment, the slits are provided in the reinforcing plate 71 of the flexible substrate 58. However, as another aspect, as shown in FIG. 9A, slits 74a and 74b can be provided in the imaging substrate 56. . Thereby, when the reinforcing plate 71 of the flexible board 58 is press-fitted into the side surface parts 63a and 63c of the imaging board 56 when the BtoB connectors 80 and 81 are fitted, the slits 74a and 74b provided on the imaging board 56 side Generation of excessive stress can be prevented.

  Further, as shown in FIG. 9B, which is a DD cross-sectional view in FIG. 9A, the slit provided in the imaging substrate 56 penetrates above the conductor layer L4. Thereby, there is no space restriction on the wiring below the conductor layer L4. However, depending on the wiring in the substrate, the conductor layer L4 or lower may be penetrated.

  As another aspect, as shown in FIG. 10, when the concave portion 63 is provided at the substrate end of the imaging substrate 56, the protrusion provided on the reinforcing plate 71 of the flexible substrate 58 with respect to two adjacent sides of the concave portion 63. The parts 71a and 71b are brought into contact with each other. Slits 71c and 71d are provided in the vicinity of the protrusions 71a and 71b, respectively, and excessive stress on the recess 63 of the imaging substrate 56 when the protrusions 71a and 71b are brought into contact with each other can be prevented.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

56 Image board, 58 Flexible board, 64 Image board component mounting surface,
70 Flexible substrate base material, 71 Flexible substrate reinforcement plate,
72 Reinforcement plate of flexible substrate, 71a Projection provided on reinforcement plate of flexible substrate,
71b Projections provided on the reinforcing plate of the flexible substrate,
71c Slits on the flexible board reinforcement plate,
71d Slit on the flexible board reinforcement plate

Claims (5)

  A substrate (56) having a mounting surface (64), a rectangular recess (63) provided on the mounting surface (64), and an electron disposed in the recess (63) of the substrate (56) A component (80) and a flexible substrate (58) electrically connected to the electronic component (80), the flexible substrate (58) having a reinforcing plate (71), the reinforcing plate (71) Is press-fitted and fixed to the recess (63).   The imaging device according to claim 1, wherein the electronic component (80) disposed inside the recess (63) is a connector.   The reinforcing plate (71) of the flexible substrate (58) has protrusions (71a) and (71b) that come into contact with the side surfaces (63a) and (63c) of the recess (63) of the substrate (56). The imaging apparatus according to claim 1.   The imaging according to claim 1, wherein the reinforcing plate (71) of the flexible substrate (58) has slits (71c) and (71d) in the vicinity of the protrusions (71a) and (71b). apparatus.   The flexible substrate (58) extends in a direction other than the side surfaces (63a) and (63c) of the recess (63) with which the protrusions (71a) and (71b) of the reinforcing plate (71) abut. The imaging apparatus according to claim 1.