JP2016201386A - Resistor and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resistor, and the like, with less variation in quality.SOLUTION: At first, conductors 5a are arranged on a resistor 3 with a gap. For example, the conductors 5a are arranged obliquely so that one conductor 5a approaches the resistor 3. An explosive 7 is arranged on the upper surface (the surface on the side reverse to the opposite surface of the resistor 3) of the conductor 5a. The explosive 7 is in powder form, for example. Furthermore, a conductive pipe 9, i.e., the initiation device of the explosive 7, is arranged. When the explosive 7 is initiated by feeding electricity to the conductive pipe 9, the conductor 5a is crimped to the opposite surface of the resistor 3, from the initiation side at high speed. At this time, so-called metal jet is generated on the collision surface of the conductor 5a and resistor 3 and oxides, and the like, are removed from respective surfaces. The interface of the resistor 3 and conductor 5a is corrugated in the crimp direction.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resistor comprising a conductor and a resistor, and a method for manufacturing the same.

  For example, a low-resistance resistor such as a shunt resistor is manufactured by joining a resistor and a conductor. As a method for joining the resistor and the conductor, for example, there is a method by spot welding or the like.

  However, since welding is performed by melting and joining metals, an alloy region is formed by melting the conductor component and the resistor component at the joint, and the quality tends to become unstable. In addition, for example, electron beam welding has a problem that productivity is poor and equipment costs are increased because high vacuum is required. Therefore, a method of joining the resistor and the conductor by a method other than welding has been proposed.

  For example, there is a joining method by a friction stir method in which a tool that can be moved while rotating is inserted in a state in which a resistor to be joined and a conductor are abutted, and joining is performed at a temperature below the melting point. (For example, patent document 1).

JP2013-52425A

  However, the friction stir welding described in Patent Document 1 stirs the object to be joined at the insertion margin at the tip of the tool, so even if the surfaces perpendicular to the thickness direction can be joined, The planar portions of the members cannot be joined together.

  The present invention has been made in view of such problems, and an object thereof is to provide a resistor or the like with little variation in quality.

  In order to achieve the above-described object, the first invention provides a step a in which a first conductor is arranged at an interval with respect to one surface of the resistor, and the resistor and the first conductor. The step b of shock-bonding, the step c of disposing the second conductor at an interval with respect to the other surface of the resistor, and the shock-bonding of the resistor and the second conductor And d for manufacturing the resistor.

  The step b and the step d are explosive pressure bonding steps, and include the step e of arranging explosive powder on the first conductor before the step b, and the step b includes the explosive powder. Is detonated at the end of the first conductor, and the resistor and the first conductor are shock-bonded to the explosive on the second conductor before the step d. A step (f) of disposing a powder, wherein the step (d) is a step of detonating the explosive powder at an end of the second conductor and shock-bonding the resistor and the second conductor. There may be.

  Further, the first conductor and the second conductor are made of copper, the resistor is an alloy composed of 86% by mass of copper, 12% by mass of manganese, and 2% by mass of nickel, and the resistor is a shunt. It may be a resistor.

  According to the first invention, since the conductor and the resistor are joined by impact pressure bonding, the alloy region due to melting of the conductor component and the resistor component is not formed thickly by welding or the like, and the quality is improved. Difficult to occur. In addition, the conductor and the resistor can be reliably surface-bonded.

  Thus, the resistor joined so that the resistor is sandwiched between the conductors can be used as, for example, a shunt resistor. At this time, stable performance can be obtained by using, for example, Manganin (registered trademark) as the resistor.

  A second invention has a laminated structure in which a resistor is sandwiched and crimped by a pair of conductors, and an interface between the conductor and the resistor is a waveform in a cross section. It is.

  According to the second invention, since the joint surface between the conductor and the resistor has a waveform, the joint strength is high and the contact area is also large, so that stable performance can be obtained.

  According to the present invention, it is possible to provide a resistor or the like with little variation in quality.

It is a figure which shows the resistor 1, (a) is sectional drawing of the thickness direction, (b) is the A section enlarged view of (a). The figure which shows the process of joining the conductor 5 to one surface of the resistor 3. FIG. The figure which shows the process of joining the conductor 5 to the other surface of the resistor 3. FIG.

  Hereinafter, the resistor 1 concerning embodiment of this invention is demonstrated. 1A is a schematic cross-sectional view of the resistor 1, and FIG. 1B is an enlarged view of a portion A in FIG. 1A. The resistor 1 is, for example, a shunt resistor, and a conductor 5 (5a, 5b) is bonded to both surfaces of the resistor 3.

  The resistor 3 is, for example, Manganin (registered trademark), and is an alloy composed of 86% by mass of copper, 12% by mass of manganese, and 2% by mass of nickel. Manganin (registered trademark) is desirable because the resistance value is stable over a long period of time and the temperature coefficient of resistance is small. In the following example, Manganin (registered trademark) plate material (thickness 5 mm, 8 mm, 10 mm) is used as the resistor 3, but the material of the resistor 3 is not limited to the above-described example. -Mn-based, Ni-Cu-based, Ni-Cr-based, Fe-Cr-based, Mn-Ni-Cu-based alloys, and the like can be applied.

  The conductor 5 is made of metal such as copper. The conductor 5 serves as a terminal of the resistor 1. The thickness of the resistor 3 is appropriately set in accordance with the required characteristics of the resistor 1, and can be, for example, about 0.2 to 30 mm, preferably about 1 to 15 mm. In the following example, a phosphorous deoxidized copper plate (C1220P 1 / 4h: thickness 3 mm, 5 mm is used as the conductor 5. For convenience of testing, the conductor 5 having the same thickness is provided on both sides of the resistor 3. However, other pure copper materials may be used.

  As shown in FIG. 1B, an alloy region due to melting of the material of the resistor 3 and the material of the conductor 5 is not formed at the bonding interface between the conductor 5 and the resistor 3, In addition, a corrugated shape appears at the bonding interface between the conductor 5 and the resistor 3 due to the generation of a metal jet generated during bonding. An intermetallic compound or the like is present at the bonding interface, but this intermetallic compound does not adversely affect the characteristics of the resistor 1 unlike an alloy region caused by melting of a conductor component and a resistor component. .

  Next, a method for manufacturing the resistor 1 will be described. Here, a method by so-called explosion pressure bonding will be described. First, as shown in FIG. 2A, the conductor 5a is disposed on the resistor 3 with a gap. For example, as shown in the drawing, the conductor 5a is disposed obliquely so that one of the conductors 5a is close to the resistor 3.

  An explosive 7 is disposed on the upper surface of the conductor 5a (the surface opposite to the surface facing the resistor 3). The explosive 7 is in a powder form, for example. Moreover, the electric tube 9 which is a detonator of the explosive 7 is arranged. In the illustrated example, the electric tube 9 is disposed in the vicinity of the end on the side where the conductor 5a and the resistor 3 are close to each other.

  When electricity is passed through the electric tube 9 and the explosive 7 is detonated, as shown in FIG. 2 (b), the conductor 5a is crimped to the opposing surface of the resistor 3 at high speed from the initiation side (arrow B in the figure). . At this time, a so-called metal jet is generated on the collision surface between the conductor 5a and the resistor 3, and oxides and the like on the respective surfaces are removed. At this time, the interface between the resistor 3 and the conductor 5a has a wave shape with respect to the direction in which the crimping proceeds.

  Next, as shown in FIG. 3A, the resistor 3 to which the conductor 5a is crimped is turned over, and the conductor 5b is disposed on the resistor 3 (the surface opposite to the conductor 5a). The conductor 5b is arranged in the same manner as the conductor 5a described above. Further, the explosive 7 and the electric tube 9 are arranged on the conductor 5b in the same manner as described above.

  When electricity is passed through the electric tube 9 and the explosive 7 is detonated, as shown in FIG. 3 (b), the conductor 5a is pressed against the opposing surface of the resistor 3 from the initiation side at high speed (arrow C in the figure). . As described above, the conductors 5a and 5b can be explosively bonded to both surfaces of the resistor 3. That is, the resistor 3 can be sandwiched between the conductors 5a and 5b. In addition, since such explosive pressure bonding is instantaneously completed, there is no room for explosive heat to be transmitted to the conductors 5a and 5b.

  Finally, the desired resistor 1 can be obtained by cutting the laminated structure in which the conductor 5a, the resistor 3, and the conductor 5b are laminated according to the required resistance value.

  In addition, when the resistor 1 was manufactured by this manufacturing method, the thickness was reduced by several percent after the conductors 5a and 5b were crimped, but almost no variation occurred. In addition, the bonding strength was sufficient regardless of the thickness of the resistor 3 and the conductor 5.

  As described above, according to the present embodiment, the conductors 5a and 5b can be bonded to both surfaces of the resistor 3 by explosive pressure bonding. At this time, an alloy region due to melting of the conductor component and the resistor component or the like is not formed at the bonding interface, so that the bonding interface substantially has two layers of the resistor 3 and the conductor 5. For this reason, there is substantially only one type of thermoelectromotive force generated at this bonding interface, and the influence on the resistance value is small.

  In addition, since the alloy region due to melting of the conductor component and the resistor component is not formed, the alloy region is not affected by variations in the composition and thickness of the alloy region. For this reason, the dispersion | variation in quality can be suppressed.

  In the present invention, instead of the explosive pressure bonding, an electromagnetic force impact pressure bonding method, an electromagnetic seam welding method, or the like may be applied. For example, in the electromagnetic shock bonding method, first, in a state in which the resistor 3 is fixed, the conductor 5a is arranged so as to overlap the resistor 3 with a gap below one surface of the resistor 3. Further, a flat plate-shaped one-turn coil is disposed below the conductor 5a via an insulator. In this state, when a discharge pulse of a large current is passed through the flat plate-shaped one-turn coil, an electromagnetic force can be generated by the action of the generated magnetic flux and the eddy current generated on the surface of the metal plate. Due to this electromagnetic force, the conductor 5a moves at a high speed toward one surface of the resistor 3, and is subjected to impact pressure bonding.

  In the electromagnetic force impact bonding method, the time required for bonding is as short as several ms, and there is no macroscopic temperature rise due to bonding. In this respect, it is in common with the aforementioned explosive pressure bonding method. Further, since it is necessary to generate an eddy current on the surface of the conductor 5a in order to generate electromagnetic force, the conductor 5a to be moved at high speed is suitable for a metal having good conductivity. 5a is suitable because it is made of copper, for example.

  After crimping the conductor 5a to one surface of the resistor 3, the conductor 5b is placed on the resistor 3 with a gap below the other surface of the resistor 3 with the resistor 3 fixed. To place. Furthermore, a flat plate-shaped one-turn coil is disposed below the conductor 5b via an insulator. In this state, when a large-current discharge pulse is passed through the flat plate-shaped one-turn coil, the conductor 5b moves at a high speed toward the other surface of the resistor 3 and is subjected to impact pressure bonding.

  In addition, the joining material bonded by electromagnetic force shock bonding can usually obtain a joining material that is strong enough to break at the base material part without breaking from the joining interface in the tensile shear test, regardless of the combination of the same kind or different metals. . That is, since an alloy region due to melting of the conductor component and the resistor component or the like is not formed at the bonding interface, there are substantially two layers of the resistor 3 and the conductor 5 at each bonding interface. For this reason, there is substantially only one type of thermoelectromotive force generated at this bonding interface, and the influence on the resistance value is small.

  In addition, it is known that the bonding interface of the bonding material subjected to electromagnetic force shock bonding exhibits a wave shape similar to explosion pressure bonding. As described above, in the present invention, the thermoelectromotive force generated at the bonding interface is substantially only one by performing the pressure bonding by the impact pressure bonding method, and the influence on the resistance value is small. Since the alloy region due to melting with the body component or the like is not formed, it is not affected by variations in the composition and thickness of the alloy region. For this reason, the dispersion | variation in quality can be suppressed.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

1 ... Resistor 3 ... Resistors 5, 5a, 5b ... Conductor 7 ... Explosive 9 ... Electric tube

Claims (4)

A step a for disposing a first conductor at an interval with respect to one surface of the resistor;
A step b of impact-bonding the resistor and the first conductor;
A step c of disposing a second conductor at an interval with respect to the other surface of the resistor;
A step d of impact-bonding the resistor and the second conductor;
A method of manufacturing a resistor, comprising: The step b and the step d are explosive pressure bonding steps,
Before the step b, comprising a step e of arranging explosive powder on the first conductor,
The step b is a step of detonating the explosive powder at an end portion of the first conductor and impact-bonding the resistor and the first conductor,
Before the step d, comprising the step f of arranging explosive powder on the second conductor,
2. The step d is a step of detonating the explosive powder at an end portion of the second conductor and shock-bonding the resistor and the second conductor. Method of manufacturing the resistor.   The first conductor and the second conductor are made of copper, the resistor is an alloy composed of 86 mass% copper, 12 mass% manganese, and 2 mass% nickel, and the resistor is a shunt resistor. 3. The method of manufacturing a resistor according to claim 1, wherein the resistor is provided. It has a laminated structure in which a resistor is sandwiched between a pair of conductors and crimped,
A resistor characterized in that an interface between the conductor and the resistor has a waveform in a cross section.

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