JP2016191541A - Heat reserve and radiation unit, chemical heat pump, and unelectrified cooling unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve improvement of the heat exchange efficiency in a heat reserve and radiation unit having a reaction vessel which may be deformed by a pressure difference between an exterior side and an interior side of the reaction vessel.SOLUTION: A heat reserve and radiation unit includes: a reaction material compact which conducts heat exchange with a reaction medium; a reaction vessel which stores the reaction material compact and provides/receives heat to/from the reaction material compact; and a reaction medium flow part which is connected with the reaction vessel and supplies the reaction medium to the reaction vessel or discharges the reaction medium from the reaction vessel. The reaction material compact has: a plate-like heat transmission plate which contacts with the reaction vessel; a heat transmission member extending from one surface of the heat transmission plate in a substantially vertical direction; and a reaction material molding part which includes the heat transmission member so as to expose part of the heat transmission member. The reaction vessel may be deformed by a pressure difference between an exterior side and an interior side of the reaction vessel.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a heat storage / dissipation unit, a chemical heat pump, and a non-electric cooling unit.

  In recent years, a heat recovery system for recovering and using a heat source such as waste heat, such as a chemical heat pump and an adsorption refrigeration apparatus, has attracted attention from the viewpoint of energy saving. In the heat recovery system, an accumulator / heat dissipating unit having a reaction material with a reaction medium, an evaporator for evaporating the reaction medium, and a condenser for condensing the reaction medium are connected via an opening / closing mechanism.

  In such a heat recovery system, if the contact area between the reaction medium and the reaction material in the heat storage / dissipation unit is small, heat exchange may not be sufficiently performed between the reaction medium and the reaction material. Therefore, conventionally, a porous material is provided between a pair of reaction materials, and the porous material is used as a flow path for the reaction medium to promote the movement of the reaction medium, and the reaction medium and the reaction material. A technique for increasing the contact area between the two is known.

  Further, in the heat recovery system, when the capacity of the reaction container is large, the sensible heat loss in the reaction container increases. Thus, conventionally, a technique for reducing the volume of the reaction vessel and reducing the sensible heat loss by using a reaction vessel constituted by a sheet-like member is known.

  However, in a heat storage / dissipation unit that uses a porous material as a reaction medium flow path, if a sheet-like member is used as a reaction vessel, the porous material is compressed due to the pressure difference between the inside and the outside of the reaction vessel. The function of the medium as a channel may deteriorate. For this reason, in a heat storage and heat dissipation unit having a reaction vessel using a sheet-like member, it may not be possible to obtain sufficient heat exchange efficiency.

  It is an object of the disclosed technology to improve heat exchange efficiency in a heat storage / dissipation unit having a reaction vessel that can be deformed by a pressure difference between the outside and the inside of the reaction vessel.

  In the disclosed technology, a reaction material molded body that exchanges heat with a reaction medium, a reaction container that houses the reaction material molded body and exchanges heat with the reaction material molded body, and is connected to the reaction container A reaction medium flow section for supplying the reaction medium to the reaction container or discharging the reaction medium from the reaction container, and the reaction material molded body has a plate-like heat transfer in contact with the reaction container A plate, a heat transfer member that extends substantially perpendicularly from one surface of the heat transfer plate, and a reaction material molding portion that includes the heat transfer member so that a part of the heat transfer member is exposed. The reaction container is deformable by a pressure difference between the outer side and the inner side of the reaction container.

  It is possible to improve the heat exchange efficiency in the heat storage / dissipation unit having a reaction vessel that can be deformed by a pressure difference between the outside and the inside of the reaction vessel.

It is the schematic of the reaction material molded object which concerns on this embodiment. It is a schematic sectional drawing of the reaction material molded object which concerns on this embodiment. It is a schematic perspective view of the heat-transfer plate which concerns on this embodiment. It is a schematic plan view (the 1) of the heat-transfer plate which concerns on this embodiment. It is a schematic plan view (the 2) of the heat-transfer plate which concerns on this embodiment. It is a schematic plan view (the 3) of the heat-transfer plate which concerns on this embodiment. It is a schematic plan view (the 4) of the heat-transfer plate which concerns on this embodiment. It is a schematic perspective view of the reaction material molded object which concerns on this embodiment. It is a figure explaining the structural example-1 of the thermal storage / dissipation unit which concerns on this embodiment. It is a schematic sectional drawing of the thermal storage / dissipation unit which concerns on 1st Embodiment. It is a schematic sectional drawing of the thermal storage / dissipation unit which concerns on 2nd Embodiment. It is a schematic sectional drawing of the thermal storage / dissipation unit which concerns on 3rd Embodiment. It is a schematic sectional drawing of the thermal storage unit in the comparative example 1. It is a schematic block diagram of an example of a chemical heat pump. It is a schematic block diagram of an example of a non-electric cooling unit. It is a figure explaining the example-2 of a structure of the thermal storage / dissipation unit which concerns on this embodiment. It is a figure explaining the example 3 of a structure of the thermal storage unit based on this embodiment. It is a figure explaining the structure of the reaction material molded object of the structural example-3 of the thermal storage / radiation unit which concerns on this embodiment. It is a figure explaining the modification of the structural example-3 of the thermal storage / radiation unit which concerns on this embodiment. It is a figure explaining the structure of the reaction material molded object in the modification of the structural example-3 of the thermal storage / radiation unit which concerns on this embodiment.

  Hereinafter, the present embodiment will be described with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, the duplicate description is abbreviate | omitted by attaching | subjecting the same code | symbol.

(Reaction material compact)
An example of the reaction material molded body used in the heat storage / radiation unit of the present embodiment will be described. FIG. 1 is a schematic view of a reaction material molded body according to the present embodiment. FIG. 2 is a schematic cross-sectional view of the reaction material molded body according to the present embodiment, showing a cross section taken along line AA in FIG.

  The reaction material molded body 10 reacts with the reaction medium to generate heat or release the reaction medium by heating. As shown in FIG. 1, the reaction material molded body 10 includes a heat transfer plate 11, a heat transfer member 12, and a reaction material molding portion 13.

  The heat transfer plate 11 is a plate-like member.

  The heat transfer member 12 is a member that extends substantially vertically from one surface of the heat transfer plate 11. The shape of the heat transfer member 12 can be, for example, a pin shape or a plate shape. The heat transfer member 12 is exposed from the surface opposite to the side where the heat transfer plate 11 of the reaction material molding part 13 is provided and / or the side of the reaction material molding part 13 where the heat transfer plate 11 is provided. The exposed portion 12b is exposed from the surface.

  In FIG. 1, a reaction material molded body 10 </ b> A having an exposed portion 12 a where the heat transfer member 12 is exposed from the surface of the reaction material forming portion 13 opposite to the side where the heat transfer plate 11 is provided is shown. FIG. 2A shows a reaction material molded body 10B having an exposed portion 12b where the heat transfer member 12 is exposed from the surface of the reaction material forming portion 13 on the side where the heat transfer plate 11 is provided. In FIG. 2B, the exposed portion 12 a where the heat transfer member 12 is exposed from the surface of the reaction material forming portion 13 opposite to the side where the heat transfer plate 11 is provided and the heat transfer plate 11 of the reaction material forming portion 13 are shown. 10C shows a reaction material molded body 10C having an exposed portion 12b exposed from the provided side surface.

  The details of the heat transfer plate 11 and the heat transfer member 12 will be described later.

  The reaction material molding unit 13 includes the heat transfer member 12 so that a part of the heat transfer member 12 is exposed. The reaction material molding unit 13 is formed, for example, by molding and solidifying the reaction material.

  The material of the reaction material is not particularly limited as long as it can be reversibly adsorbed and desorbed with the reaction medium and is in the form of a solid or gel in the process of adsorption and desorption.

  As the reaction medium, for example, water, ammonia, or methanol can be used. When water is used as the reaction medium, examples of the reaction material include calcium sulfate, sodium sulfate, calcium chloride, magnesium chloride, manganese chloride, calcium oxide, magnesium oxide, sodium acetate, sodium carbonate, and calcium bromide. Further, an adsorbent typified by silica gel and zeolite can also be used.

  When ammonia is used as the reaction medium, for example, manganese chloride, magnesium chloride, nickel chloride, barium chloride, or calcium chloride can be used as the reaction material. When methanol is used as the reaction medium, for example, magnesium chloride can be used as the reaction material. One kind of these reaction materials may be used alone, or two or more kinds may be mixed and used.

  In addition, the above-mentioned reaction material includes a substance having deliquescence, but even such a reaction material is mixed with expanded graphite or the like and impregnated, so that heat storage and heat dissipation can be performed. Any device that has a fixed form can be used.

  The method for forming the reaction material molded body 10 is not particularly limited. For example, the heat transfer plate 11 integrally formed with the heat transfer member 12 is set in a desired mold, and the reaction material is slurried (hemihydrate). Is preferably dissolved in water and cast into a solid. Further, for example, a method of forming into a desired shape using a known binder may be used. Thereby, since the reaction material molded object 10 can be shape | molded easily, mass-productivity improves.

  In such a reaction material molded body 10, when the reaction material molded body 10 is accommodated in a reaction vessel 20 described later, the heat transfer member 12 exposed from the reaction material molded portion 13 has a cross-linked structure, and the reaction medium flow path ( Hereinafter, it is referred to as “reaction medium flow path 14”).

(Heat transfer plate)
Next, the heat transfer plate according to the present embodiment will be described. FIG. 3 is a schematic perspective view of the heat transfer plate according to the present embodiment. FIG. 4 is a schematic plan view of the heat transfer plate according to the present embodiment. Specifically, FIG. 3 shows the heat transfer plate after the heat transfer member is bent, and FIG. 4 shows the heat transfer plate before the heat transfer member is bent. In the following, the X direction in FIGS. 3 and 4 is the horizontal direction, and the Y direction is the vertical direction.

  As shown in FIG. 3, the heat transfer plate 11 is formed integrally with the heat transfer plate 11, and includes a plurality of heat transfer members 12 having a shape bent substantially perpendicularly to one surface of the heat transfer plate 11. Have. The heat transfer plate 11 is provided so as to penetrate the upper and lower surfaces of the heat transfer plate 11 by bending at least a part of the heat transfer plate 11 substantially perpendicular to the upper surface of the heat transfer plate 11. Through-hole 111.

  The material for the heat transfer plate 11 is not particularly limited as long as it is a plate-like member, good workability, and excellent thermal conductivity. For example, a metal material containing aluminum or copper is preferable from the viewpoint of realizing a structure capable of performing good heat transfer with the reaction material molded body.

  The heat transfer member 12 preferably has a pin shape. Thereby, heat can be efficiently transferred among the heat transfer plate 11, the heat transfer member 12, and the reaction vessel 20.

  In addition, as shown in FIG. 4, the heat transfer member 12 has a cutout structure 112 formed on the heat transfer plate 11 bent substantially perpendicularly to the upper surface of the heat transfer plate 11 as shown in FIG. 3. It is preferably formed by. The method of forming the cutout structure 112 is a simple method, and from the viewpoint of being suitable for mass production, for example, a method using wire cutting, cutting with a blade, or bending is preferable.

  The angle of the heat transfer member 12 with respect to the upper surface of the heat transfer plate 11 is not particularly limited as long as it is substantially vertical, but it is 70 ° from the viewpoint of promoting heat transfer to the reaction material at a position away from the heat transfer plate 11. The angle is preferably 110 ° or less. Further, from the viewpoint of equally distributing the heat transfer promoting effect to the reaction material within the surface of the heat transfer plate 11, it is particularly preferably 80 ° or more and 100 ° or less.

  In addition, the orientation of each of the plurality of heat transfer members 12 is preferably aligned in the same direction with respect to the upper surface of the heat transfer plate 11. When the direction of each of the plurality of heat transfer members 12 is different from the upper surface of the heat transfer plate 11, the adjacent heat transfer members 12 may interfere with each other.

  Although it does not specifically limit as a size of the heat-transfer member 12, For example, the width W of the heat-transfer member 12 can be 1 mm, and height H can be 5 mm. The arrangement of the plurality of heat transfer members 12 is not particularly limited. For example, the horizontal pitch P1 can be set to 3.2 mm, and the vertical pitch P2 can be set to 7.5 mm.

  The through hole 111 is a hole that penetrates the upper surface and the lower surface of the heat transfer plate 11. The through hole 111 is formed by bending a cutout structure 112 formed in the heat transfer plate 11.

  In addition, for example, calcium sulfate in the form of a slurry is poured into the heat transfer plate 11 and solidified so as to include the heat transfer member 12, thereby obtaining a reaction material molded body 10 </ b> A as shown in FIG. 8, for example. In this molding, it is preferable to prepare a resin mold or the like in advance.

  Note that the arrangement of the plurality of heat transfer members 12 formed on the heat transfer plate 11 is not limited to the arrangement shown in FIG. 4, and is arranged substantially perpendicular to the upper surface of the heat transfer plate 11. I can do it. However, from the viewpoint of equal distribution of the heat transfer promotion effect in the surface of the heat transfer plate 11, it is preferable that the heat transfer members 12 are evenly arranged in the surface of the heat transfer plate 11.

  Another example of the heat transfer plate 11 will be described with reference to FIGS. 5 to 7 are schematic plan views of the heat transfer plate according to the present embodiment.

  As another example of the heat transfer plate 11 according to the present embodiment, as shown in FIG. 5, for example, a configuration in which the direction of the adjacent cutout structure 112 (the direction in which the adjacent heat transfer member 12 is bent) is the same. It can be. For example, as shown in FIG. 6, the cutout structure 112 may be formed continuously in the lateral direction.

  Further, for example, as shown in FIG. 7, the heat transfer member 12 may have a plate shape. As the heat transfer plate 11 having the plate-shaped heat transfer member 12, for example, the heat transfer member 12 having a width W of 20 mm and a height H of 5 mm has a horizontal pitch P1 of 25 mm and a vertical pitch P2 of 7. It can be set as the structure arrange | positioned so that it may become 0.5 mm.

  The heat transfer plate 11 according to the present embodiment has been described above, but the present invention is not limited to this. For example, the heat transfer member 12 extending substantially perpendicularly from one surface of the heat transfer plate 11 is formed by welding a pin-shaped, plate-shaped or sword-shaped member to the heat transfer plate 11. Also good.

(Configuration example 1 of heat storage / dissipation unit)
Next, the heat storage / dissipation unit according to the present embodiment will be described. FIG. 9 is a diagram for explaining a configuration example-1 of the heat storage / dissipation unit according to the present embodiment. Specifically, FIG. 9A is a schematic side view of the heat storage unit before the reaction material molded body is accommodated in the reaction vessel. Moreover, FIG.9 (b) is a schematic plan view of the thermal storage / radiation unit after accommodating the reaction material molded object in the reaction container. Moreover, FIG.9 (c) is a schematic side view of the thermal storage / dissipation unit after accommodating the reaction material molded object in the reaction container.

  As shown in FIG. 9A, the heat storage / dissipation unit 100 according to this embodiment includes a reaction material molded body 10 and a reaction vessel 20. For example, as shown in FIG. 9B and FIG. 9C, the heat storage / dissipation unit 100 is formed by housing the reaction material molded body 10 in the reaction container 20 and then joining the reaction container 20.

  The reaction container 20 is a container that houses the reaction material molded body 10 and exchanges heat with the reaction material molded body 10. The reaction vessel 20 is a flexible structure that can be deformed by a pressure difference between the outside and the inside of the reaction vessel 20.

  The reaction container 20 includes a seal part 21, a reaction material storage part 22, and a reaction medium circulation part 23.

  The seal portion 21 is a portion (a portion outside the broken line in FIG. 9B) formed along the outer edge portion of the reaction vessel 20.

  The reaction material storage portion 22 is a portion for storing the reaction material molded body 10.

  The reaction medium flow part 23 is formed at a part of the outer edge of the reaction vessel 20, and supplies the reaction medium to the reaction material molded body 10 accommodated in the reaction container 20, or is detached from the reaction material molded body 10. The reaction medium is discharged.

  All the outer edge portions of the reaction vessel 20 are formed by the seal portion 21 or the reaction medium flow portion 23. For this reason, the supply or discharge of the reaction medium in the reaction material storage unit 22 is performed only via the reaction medium flow unit 23.

  As the reaction vessel 20, for example, a sheet-like member having a rectangular or circular shape can be used. As the sheet-like member, for example, a foil material (metal foil) using a metal such as aluminum or copper excellent in heat transfer performance can be used. Although it does not specifically limit as a film thickness of metal foil, For example, when using aluminum, it can be set to 30-200 micrometers, For example, when using copper, it can be set to 10-100 micrometers. . Further, a plastic sheet may be used as the sheet-like member.

  The joining method in the seal portion 21 of the reaction vessel 20 is not particularly limited, and when the reaction vessel 20 is made of metal, a joining method by a construction method such as diffusion joining may be used. It may be a joining method using a known adhesive.

(Configuration example 2 of heat storage / dissipation unit)
Next, another configuration example of the heat storage / dissipation unit according to the present embodiment will be described. FIG. 16 is a diagram for explaining a configuration example-2 of the heat storage / dissipation unit according to the present embodiment. Specifically, FIG. 16A is an exploded view of the heat storage and heat dissipation unit, and FIG. 16B is a schematic view of the heat storage and heat dissipation unit after the reaction material molded body is housed in the reaction container.

  As shown in FIG. 16A, the heat storage / radiation unit 110 according to the present embodiment includes a reaction material molded body 10, a reaction container 20, a reaction medium circulation part 23, and a lid part 24. As shown by the arrow in FIG. 16A, the heat storage / radiation unit 110 is formed by housing the reaction material molded body 10 in the reaction vessel 20 and joining the reaction vessel 20 and the lid portion 24 at the seal portion 21. The

  The reaction vessel 20 has a bottom portion 20b and is formed in a box shape having an upper surface opened. The reaction container 20 is a container that houses the reaction material molded body 10 and exchanges heat with the reaction material molded body 10. The reaction vessel 20 is a flexible structure that can be deformed by a pressure difference between the outside and the inside of the reaction vessel 20.

  The seal portion 21 is a portion formed along the inner wall surface on the upper end side of the reaction vessel 20 (the portion on the upper side of the broken line in FIG. 16A).

  The reaction material storage portion 22 is a portion for storing the reaction material molded body 10.

  The reaction medium flow part 23 is formed so as to penetrate the lid part 24, and supplies the reaction medium to the reaction material molded body 10 accommodated in the reaction vessel 20 or is detached from the reaction material molded body 10. This is a part for discharging the reaction medium. The reaction medium flow part 23 is formed in, for example, a cylindrical shape with both ends opened.

  The lid portion 24 is a member that closes the opening on the upper surface side of the reaction vessel 20, and is formed in a plate shape, for example. The lid portion 24 is joined to the reaction vessel 20 by having a side surface 24 s joined to the seal portion 21 of the reaction vessel 20. As described above, the opening on the upper surface side of the reaction vessel 20 is closed by the lid portion 24. For this reason, the supply or discharge of the reaction medium in the reaction material storage unit 22 is performed only via the reaction medium flow unit 23.

  The reaction medium flow part 23 and the lid part 24 may be formed integrally, or may be formed after being formed separately and joined.

  The reaction vessel 20 can be formed, for example, by squeezing and ironing used for manufacturing a beverage can. Moreover, it is also possible to form a sheet-like member by various methods such as laser welding, seam welding, and bonding with an adhesive. As a material of the reaction vessel 20, for example, when aluminum is used, the thickness may be 30 to 200 μm, and when copper is used, for example, the material may be 10 to 100 μm. Further, a plastic sheet may be used as the sheet-like member.

  As a joining method in the seal part 21 between the reaction vessel 20 and the lid part 24, for example, when the reaction vessel 20 is made of metal, a joining method by a construction method such as diffusion joining may be used. Or a joining method using a known adhesive may be used.

  Further, in this configuration example, a square reaction container is taken as an example, but the corner may be curved. The reaction container 20 is important to be a flexible container that can be deformed by a pressure difference between the outside and the inside of the reaction container 20, and is not particularly limited as long as this function is not hindered.

(Configuration example 3 of heat storage / dissipation unit)
Next, still another configuration example of the heat storage / dissipation unit according to the present embodiment will be described. FIG. 17 is a diagram illustrating a configuration example-3 of the heat storage / dissipation unit according to the present embodiment. Specifically, FIG. 17A is an exploded view of the heat storage and release unit, and FIG. 17B is a schematic view of the heat storage and release unit after the reaction material molded body is housed in the reaction vessel. FIG. 18 is a view for explaining the structure of the reaction material molded body of Configuration Example-3 of the heat storage and heat dissipation unit according to this embodiment.

  As shown in FIG. 17A, the heat storage / dissipation unit 120 according to the present embodiment includes a reaction material molded body 10, a reaction container 20, a reaction medium flow part 23, and a lid part 24. As shown by the arrow in FIG. 17A, the heat storage / dissipation unit 120 is formed by housing the reaction material molded body 10 in the reaction vessel 20 and joining the reaction vessel 20 and the lid portion 24 at the seal portion 21. The

  As shown in FIG. 18C, the reaction material molded body 10 (10E) includes a heat transfer plate 11, a heat transfer member 12, and a reaction material molding portion 13.

  The heat transfer plate 11 is a curved plate-like member.

  The heat transfer member 12 is a member that extends substantially vertically from one surface of the heat transfer plate 11. The shape of the heat transfer member 12 can be, for example, a pin shape or a plate shape. The heat transfer member 12 has an exposed portion 12a exposed from the surface of the reaction material forming portion 13 opposite to the side where the heat transfer plate 11 is provided. Note that the heat transfer member 12 may be entirely covered with the reaction material molding portion 13 and may not have the exposed portion 12a.

  The reaction material forming portion 13 is formed in a hollow cylindrical shape so as to cover the entire inner wall surface of the heat transfer plate 11 and at least a part of the heat transfer member 12.

  As shown in FIG. 17 (a), the reaction vessel 20 has a bottom portion 20b and is formed in a cylindrical shape having an open top surface. The reaction vessel 20 houses the reaction material molded body 10, and the reaction material molded body 10 and the heat A container for giving and receiving. The reaction vessel 20 is a flexible structure that can be deformed by a pressure difference between the outside and the inside of the reaction vessel 20.

  The seal portion 21 is a portion formed along the inner wall surface on the upper end side of the reaction vessel 20 (the portion on the upper side of the broken line in FIG. 17A).

  The reaction material storage portion 22 is a portion for storing the reaction material molded body 10.

  The reaction medium flow part 23 is formed so as to penetrate the lid part 24, and supplies the reaction medium to the reaction material molded body 10 accommodated in the reaction vessel 20 or is detached from the reaction material molded body 10. This is a part for discharging the reaction medium. The reaction medium flow part 23 is formed in, for example, a cylindrical shape with both ends opened.

  The lid portion 24 is a member that closes the opening on the upper surface side of the reaction vessel 20, and is formed in a plate shape, for example. The lid portion 24 is joined to the reaction vessel 20 by having a side surface 24 s joined to the seal portion 21 of the reaction vessel 20. As described above, the opening on the upper surface side of the reaction vessel 20 is closed by the lid portion 24. For this reason, the supply or discharge of the reaction medium in the reaction material storage unit 22 is performed only via the reaction medium flow unit 23.

  The reaction medium flow part 23 and the lid part 24 may be formed integrally, or may be formed after being formed separately and joined.

  The reaction vessel 20 can be formed, for example, by squeezing and ironing used for manufacturing a beverage can. Moreover, it is also possible to form by various methods using a sheet-like member, such as laser welding, seam welding, and bonding with an adhesive. For example, by welding a rectangular sheet-shaped member after bending it into a cylindrical shape, or by using a thin aluminum tube, etc., by attaching a bottom plate to the one opening of the aluminum tube so as to close the opening, etc. Can be easily formed.

  As a material of the reaction vessel 20, for example, when aluminum is used, the thickness may be 30 to 200 μm, and when copper is used, for example, the material may be 10 to 100 μm. Moreover, you may use a plastic sheet for a member. The configuration of the reaction vessel 20 is not particularly limited as long as it is a flexible vessel that can be deformed by a pressure difference between the outside and the inside of the reaction vessel 20.

  As a joining method in the seal part 21 between the reaction vessel 20 and the lid part 24, for example, when the reaction vessel 20 is made of metal, a joining method by a construction method such as diffusion joining may be used. Or a joining method using a known adhesive may be used.

(Modification example of configuration example-3 of the heat storage / dissipation unit)
Next, as still another configuration example of the heat storage / heat dissipation unit according to the present embodiment, a modified example of the above-described configuration example-3 of the heat storage / heat dissipation unit will be described.

  FIG. 19 is a diagram for explaining a modification of the configuration example-3 of the heat storage / dissipation unit according to the present embodiment. Specifically, FIG. 19A is an exploded view of the heat storage / radiation unit, and FIG. 19B is a schematic view of the heat storage / heat dissipation unit after the reaction material molded body is housed in the reaction vessel. FIG. 20 is a view for explaining the structure of a reaction material molded body in a modification of Configuration Example-3 of the heat storage / dissipation unit according to the present embodiment, and shows a cross section of the reaction material molded body.

  The heat storage / heat dissipation unit of the present configuration example is different from the heat storage / heat dissipation unit of Configuration Example-3 in the form of the reaction material molded body 10. In addition, since it is the same as that of the thermal storage unit of the structural example-3 about another structure, below, it demonstrates centering on a different point from the thermal storage unit of the structural example-3.

  As shown in FIG. 19A, the heat storage / radiation unit 130 according to the present embodiment includes a reaction material molded body 10, a reaction container 20, a reaction medium circulation part 23, and a lid part 24. The heat storage / radiation unit 130 is formed by housing the reaction material molded body 10 in the reaction vessel 20 and joining the reaction vessel 20 and the lid 24 at the seal portion 21 as shown by the arrows in FIG. The

  As illustrated in FIG. 20, the reaction material molded body 10 (10 </ b> F) includes a heat transfer plate 11, a heat transfer member 12, and a reaction material molding portion 13.

  The heat transfer plate 11 is a curved plate-like member.

  The heat transfer member 12 is a member that is joined to the inner wall surface of the heat transfer plate 11 and aligned in substantially the same direction so that a part thereof extends substantially perpendicularly from one surface of the heat transfer plate 11.

  The reaction material forming part 13 is a semi-cylindrical member formed so as to cover the entire inner wall surface of the heat transfer plate 11 and the entire heat transfer member 12.

  The reaction material molded body 10 (10G) includes a heat transfer plate 11, a heat transfer member 12, and a reaction material molding portion 13.

  The heat transfer plate 11 is a curved plate-like member.

  The heat transfer member 12 is a member that is joined to the inner wall surface of the heat transfer plate 11 and aligned in substantially the same direction so that a part thereof extends substantially perpendicularly from one surface of the heat transfer plate 11. The heat transfer member 12 has an exposed portion 12a exposed from the surface of the reaction material forming portion 13 opposite to the side where the heat transfer plate 11 is provided.

  The reaction material forming part 13 is a semi-cylindrical member formed so as to cover a part of the inner wall surface of the heat transfer plate 11 and a part of the heat transfer member 12.

  The reaction material molded body 10F and the reaction material molded body 10G are combined into the reaction material molded body 10G so as to face each other and are stored in the reaction material storage unit 22 in a cylindrical shape.

  In the present configuration example, the reaction material molded body 10G includes a heat transfer member 12 having an exposed portion 12a exposed from the surface opposite to the side where the heat transfer plate 11 of the reaction material molded portion 13 is provided. However, it is not limited to this. An exposure in which at least one of the two reaction material molded bodies 10 (reactive material molded body 10F, reaction material molded body 10G) is exposed from the surface of the reaction material molded portion 13 opposite to the side where the heat transfer plate 11 is provided. What is necessary is just to provide the heat-transfer member 12 which has the part 12a.

  Hereinafter, an embodiment of the heat storage and heat dissipation unit will be described by taking the configuration example 1 of the heat storage and heat dissipation unit described above as an example.

(First embodiment)
FIG. 10 is a schematic cross-sectional view of the heat storage / radiation unit according to the first embodiment, and shows a cross section corresponding to the cross section taken along line BB in FIG. 9B.

  As shown in FIG. 10, in the heat storage / heat dissipation unit 100A according to the first embodiment, a reaction material molded body 10A having the structure of FIG. 1 and a structure in which the exposed portion 12a of the heat transfer member 12 is eliminated from the reaction material molded body 10A. The reaction material formed body 10 </ b> D is accommodated in the reaction container 20. Specifically, each of the reaction material molded body 10A and the reaction material molded body 10D is housed in the reaction container 20 in a state of facing each other so that the heat transfer plate 11 faces the outside.

  In the first embodiment, a space S1 is formed between the reaction material molded body 10A and the reaction material molded body 10D by the exposed portion 12a of the heat transfer member 12 of the reaction material molded body 10A. The space S1 is characterized by functioning as the reaction medium flow path 14.

  By the way, when forming the heat storage unit 100A, the reaction material molded body 10A and the reaction material molded body 10D are accommodated in the reaction container 20, and then the inside of the reaction container 20 is evacuated. At this time, the internal volume of the reaction vessel 20 decreases, and the reaction vessel 20 comes into close contact with the heat transfer plate 11 of the reaction material molded body 10A and the heat transfer plate 11 of the reaction material molded body 10D. In addition, the space at the outer edge of the reaction vessel 20 is also compressed and becomes a so-called vacuum packed state.

  Even in this state, in the heat storage / dissipation unit 100A according to the first embodiment, the reaction medium flow path 14 leading from the reaction medium flow part 23 to the surface of the reaction material forming part 13 is held by the bridging structure of the heat transfer member 12. . For this reason, the movement of the reaction medium in the reaction vessel 20 can be promoted, and a sufficient contact area between the reaction medium and the reaction material can be ensured. As a result, the heat exchange efficiency of the heat storage / radiation unit 100A can be improved.

  In addition, in FIG. 10, 10 A of reaction material molded bodies which have the heat-transfer member 12 containing the exposed part 12a, and 10 A of thermal storage units which have the reaction material molded body 10D which has the heat-transfer member 12 which does not contain the exposed part 12a are demonstrated. However, the present invention is not limited in this respect. For example, both the reaction material molded bodies 10 have the heat transfer members 12 including the exposed portions 12a exposed from the reaction material molding portions 13, and the heat transfer members 12 face each other so as not to interfere with each other. Also good.

  In the present embodiment, the heat transfer plate 11 can be curved and accommodated in a cylindrical reaction vessel 20 as shown in Structural Example 3 of the heat storage and heat dissipation unit. Furthermore, it is good also as a structure shown in the modification of the structural example-3 of the thermal storage / radiation unit according to the direction of the heat-transfer member 12 with the cylindrical reaction container 20. FIG.

(Second Embodiment)
FIG. 11 is a schematic cross-sectional view of the heat storage / dissipation unit according to the second embodiment, and shows a cross section corresponding to the cross section taken along the line AA of FIG. 9B.

  In the heat storage / dissipation unit 100B according to the second embodiment, as shown in FIG. 11, a reaction material molded body 10B having the structure of FIG.

  In the second embodiment, a space S2 is formed between the heat transfer plate 11 and the reaction material molding portion 13 by the exposed portion 12b of the heat transfer member 12 of the reaction material molded body 10B. The space S2 is characterized by functioning as the reaction medium flow path 14.

  By the way, when forming the heat storage / radiation unit 100B, the reaction material molded body 10B is stored in the reaction container 20, and then the inside of the reaction container 20 is evacuated. At this time, the internal volume of the reaction vessel 20 decreases, and the reaction vessel 20 comes into close contact with the heat transfer plate 11 and the surface of the reaction material molding portion 13 of the reaction material molded body 10B. In addition, the space at the outer edge of the reaction vessel 20 is also compressed and becomes a so-called vacuum packed state.

  Even in this state, in the heat storage / dissipation unit 100B according to the second embodiment, the reaction medium flow path 14 leading from the reaction medium flow part 23 to the surface of the reaction material forming part 13 is held by the bridging structure of the heat transfer member 12. . For this reason, the movement of the reaction medium in the reaction vessel 20 can be promoted, and a sufficient contact area between the reaction medium and the reaction material can be ensured. As a result, the heat exchange efficiency of the heat storage / radiation unit 100B can be improved.

(Third embodiment)
FIG. 12 is a schematic cross-sectional view of the heat storage / dissipation unit according to the third embodiment, and shows a cross section corresponding to the cross section taken along the line AA of FIG.

  In the heat storage / dissipation unit 100C according to the third embodiment, as shown in FIG. 12, a reaction material molded body 10B having the structure of FIG. 2A, and a reaction material molded body 10C having the structure of FIG. Is accommodated in the reaction vessel 20. Specifically, the reaction material molded body 10B and the reaction material molded body 10C are housed in the reaction container 20 in a state where the reaction material molded body 10C and the heat transfer plate 11 face each other.

  In the third embodiment, a space S1 is formed between the reaction material molded body 10B and the reaction material molded body 10C by the exposed portion 12a of the heat transfer member 12 of the reaction material molded body 10C. A space S <b> 2 is formed between the heat transfer plate 11 and the reaction material molding portion 13 by the exposed portion 12 b of the heat transfer member 12 of the reaction material molding 10 </ b> B and the reaction material molding 10 </ b> C. A feature is that these spaces S 1 and S 2 function as the reaction medium flow path 14.

  By the way, when forming the heat storage / radiation unit 100 </ b> C, the reaction material molded body 10 </ b> B and the reaction material molded body 10 </ b> C are stored in the reaction container 20, and then the inside of the reaction container 20 is evacuated. At this time, the internal volume of the reaction vessel 20 decreases, and the reaction vessel 20 comes into close contact with the heat transfer plate 11 of the reaction material molded body 10B and the heat transfer plate 11 of the reaction material molded body 10C. In addition, the space at the outer edge of the reaction vessel 20 is also compressed and becomes a so-called vacuum packed state.

  Even in this state, in the heat storage / radiation unit 100 </ b> C according to the third embodiment, the three reaction medium flow paths 14 leading from the reaction medium circulation part 23 to the surface of the reaction material forming part 13 are retained by the bridging structure of the heat transfer member 12. Is done. For this reason, the movement of the reaction medium in the reaction vessel 20 can be promoted, and a sufficient contact area between the reaction medium and the reaction material can be ensured. As a result, the heat exchange efficiency of the heat storage / radiation unit 100C can be improved.

  In addition, in FIG. 12, 10 C of reaction material molded bodies which have the heat-transfer member 12 including the exposed part 12a, and 100 C of thermal storage / radiation units which have the reaction material molding part 13 which has the heat-transfer member 12 which does not include the exposed part 12a are demonstrated. However, the present invention is not limited in this respect. For example, both reaction material molded bodies 10 each have the heat transfer member 12 including the exposed portion 12a exposed from the reaction material molding portion 13, and the heat transfer members 12 face each other so as not to interfere with each other. May be.

  EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention concretely, this invention is limited to these Examples and is not interpreted.

Example 1
In Example 1, a heat storage / dissipation unit having two reaction material molded bodies 10A described in FIG. 1 was produced.

  Specifically, using the heat transfer plate 11 described in FIG. 4, the cutout structure 112 is bent substantially perpendicularly to the upper surface of the heat transfer plate 11, and then the reaction material is molded so as to include the heat transfer member 12. By forming the portion 13, two reaction material molded bodies 10A were produced.

As the heat transfer plate 11, an aluminum plate of 500 × 800 × 0.5 mm is used, the height of the heat transfer member 12 is 10 mm, the width is 2 mm, and the density of the in-plane heat transfer members 12 is 78 per 100 cm ² ( The dimensions of the cutout structure 112 were adjusted so as to be 13 × 6).

As the reaction material, calcium sulfate was used, poured into the heat transfer plate 11 in a slurry state, and molded so as to enclose the heat transfer member 12. At this time, by adjusting the amount of the reaction material, the heat transfer member 12 was exposed by 1 mm from the reaction material molding portion 13 formed and solidified. At this time, the volume of the reaction material molding portion 13 was approximately 3600 cm ³ per molded body.

  The reaction material molded body 10A is combined by adjusting the position in the surface direction so as to face the surface where the heat transfer member 12 is exposed and so that the heat transfer members 12 do not interfere with each other. A reaction vessel 20 was constructed and a reaction medium flow part 23 was attached. This produced 100 A of heat storage / heat dissipation units.

With this configuration, the surface area of the reaction material forming part 13 that reacts with the reaction medium is 8500 cm ² with one heat storage and release unit. The larger this value, the faster the reaction speed, and the heat input / output speed in the heat storage and release process can be improved.

  Moreover, in the structure of Example 1, the heat conductivity of the longitudinal direction of the heat-transfer member 12 can be set to -2W / (m * K). This is about 10 times compared with 0.2 W / (m · K) when only calcium sulfate is solidified as a reaction material. Needless to say, the thermal conductivity can be adjusted by the number of the heat transfer members 12, and when higher heat conductivity is required, it can be dealt with by increasing the number of the heat transfer members 12.

(Example 2)
In Example 2, a heat storage / dissipation unit having one reaction material molded body 10B described with reference to FIG.

  Specifically, using the heat transfer plate 11 described in FIG. 4, the cutout structure 112 is bent substantially perpendicularly to the upper surface of the heat transfer plate 11, and then the reaction material is molded so as to include the heat transfer member 12. By forming the part 13, a reaction material molded body 10B was produced.

As the heat transfer plate 11, an aluminum plate of 500 × 800 × 0.5 mm is used, the height of the heat transfer member 12 is 20 mm, the width is 2 mm, and the density of the in-plane heat transfer members 12 is 52 per 100 cm ² ( The dimensions of the cutout structure 112 were adjusted so as to be 13 × 4).

As the reaction material, calcium sulfate was used, poured into the heat transfer plate 11 in a slurry state, and molded so as to enclose the heat transfer member 12. At this time, by adjusting the amount of the reaction material, the exposed portion 12b of the heat transfer member 12 between the heat transfer plate 11 and the reaction material molding portion 13 was set to 2 mm. The volume of the reaction material molding part 13 at this time was approximately 7200 cm ³ per one molded body.

  The produced reaction material molded body was formed of a reaction container 20 with a 100 μm aluminum metal sheet-like member, a reaction medium circulation part 23 was attached, and a heat storage / dissipation unit was formed.

With this configuration, the surface area of the reaction material forming portion 13 that reacts with the reaction medium is approximately 4500 cm ² with one heat storage / dissipation unit. The larger this value, the faster the reaction speed, and the heat input / output speed in the heat storage and release process can be improved.

  Moreover, in the structure of Example 2, the heat conductivity of the heat transfer member 12 direction can be set to -1.4W / (m * K). This is about 7 times compared with 0.2 W / (m · K) when only calcium sulfate is solidified as a reaction material. Needless to say, the thermal conductivity can be adjusted by the number of the heat transfer members 12, and when higher heat conductivity is required, it can be dealt with by increasing the number of the heat transfer members 12.

Example 3
In Example 3, a heat storage / dissipation unit having two reaction material molded bodies 10C described with reference to FIG.

  Specifically, using the heat transfer plate 11 described in FIG. 4, the cutout structure 112 is bent substantially perpendicularly to the upper surface of the heat transfer plate 11, and then the reaction material is molded so as to include the heat transfer member 12. By forming the portion 13, a reaction material molded body 10C was produced.

As the heat transfer plate 11, a 500 × 800 × 0.5 mm aluminum plate is used, the heat transfer member 12 has a height of 10 mm, a width of 2 mm, and an in-plane heat transfer member density of 78 per 100 cm ² (13 The size of the cutout of the cutout structure 112 was adjusted so that × 6).

  As the reaction material, calcium sulfate was used, poured into the heat transfer plate 11 in a slurry state, and molded so as to enclose the heat transfer member 12. At this time, by adjusting the amount of the reaction material, the heat transfer member 12 is exposed by 1 mm from the reaction material forming portion 13 formed and solidified, and the heat transfer member 12 between the heat transfer plate 11 and the reaction material forming portion 13 is exposed. The exposed portion 12b is 1 mm.

  In this structure, for example, the heat transfer member 12 is set in a silicon mold having a volume of 50 × 80 × 1 cm prepared in advance so that the heat transfer member 12 is embedded by 1 mm, and the reaction material is reacted with the heat transfer plate 11 by adjusting the input amount of the reactant. This can be realized by controlling so that a gap is formed with the material forming portion 13.

At this time, the volume of the reaction material molded portion 13 was approximately 3200 cm ³ per molded body.

  The reaction material molded body 10C is combined by adjusting the position in the surface direction so as to oppose the surface where the heat transfer member 12 is exposed and so that the heat transfer members 12 do not interfere with each other. A reaction vessel 20 was constructed and a reaction medium flow part 23 was attached. Thereby, the heat storage / radiation unit 100C was produced.

With this configuration, the surface area of the reaction material forming portion 13 that reacts with the reaction medium is approximately 16,500 cm ² with one heat storage / dissipation unit. The larger this value, the faster the reaction speed, and the heat input / output speed in the heat storage and release process can be improved.

  In the configuration of the third embodiment, similarly to the first embodiment, the heat conductivity in the direction of the heat transfer member 12 can be set to ~ 2 W / (m · K). This is about 10 times compared to 0.2 W / (m · K) when only calcium sulfate is solidified as a reaction material. Needless to say, the thermal conductivity can be adjusted by the number of the heat transfer members 12, and when higher heat conductivity is required, it can be dealt with by increasing the number of the heat transfer members 12.

(Comparative Example 1)
Comparative Example 1 will be described. FIG. 13 is a schematic cross-sectional view of the heat storage / dissipation unit in Comparative Example 1.

  In Comparative Example 1, as shown in FIG. 13, a heat storage / dissipation unit 100 </ b> Z having one reaction material molded body 10 </ b> Z that does not have the heat transfer member 12 was produced.

  Specifically, a silicon mold having a volume of 50 × 80 × 1 cm was prepared and poured into a silicon mold in a slurry state using calcium sulfate as a reaction material, thereby producing a reaction material molded body 10Z. The produced reaction material molded body 10Z was constituted by a reaction container 20 with a 100 μm aluminum metal sheet-like member, a reaction medium circulation part 23 was attached, and a heat storage / dissipation unit 100Z was constructed.

With this configuration, the surface area of the reaction material forming portion 13 that reacts with the reaction medium is about 500 cm ² with one heat storage / dissipation unit.

  As mentioned above, in Examples 1-3, the surface area which reacts with the reaction medium of the reaction material shaping | molding part 13 can be expanded significantly with respect to the comparative example 1, and the heat storage-and-radiation unit with the high effect of promoting a reaction rate is high. 100 could be realized. More specifically, in Examples 1 to 3, a surface area 9 to 32 times that of Comparative Example 1 could be obtained.

  In addition, by including the heat transfer member 12 in the reaction material molded body 10, the thermal conductivity inside the reaction material molded portion 13 could be greatly improved. More specifically, in Examples 1 to 3, a thermal conductivity 7 to 10 times that of Comparative Example 1 could be obtained.

  In this example (Examples 1 to 3), it is particularly valuable that the effect of promoting the movement of the reaction medium in the reaction vessel 20 and the effect of increasing the reaction surface area can be expressed in a form in which the reaction vessel 20 has a flexible structure. In addition, it is possible to design the heat storage / heat dissipation unit 100 in which the sensible heat loss of the reaction vessel 20 is particularly reduced.

  In Examples 1 to 3, examples in which calcium sulfate is used as a reaction material have been described, but the present invention is not limited in this respect. As the reaction material, calcium oxide, magnesium oxide, calcium bromide, calcium chloride, reaction materials using other chemical reactions, and various materials capable of storing and releasing heat such as silica gel and adsorbents represented by zeolite are used. be able to.

Example 4
In Example 4, an example in which the heat storage / dissipation unit 100 according to this embodiment is applied to a chemical heat pump will be described with reference to FIG.

  FIG. 14 is a schematic configuration diagram of an example of a chemical heat pump. In addition, when using as a chemical heat pump, one more set of heat storage / dissipation units is prepared. One heat storage and heat dissipation unit is connected to a condenser to advance the heat storage process. In the other heat storage / dissipation unit, the heat dissipation process proceeds by connecting to the evaporator. The chemical heat pump has a configuration in which the heat storage process and the heat release process can be switched by an opening / closing mechanism such as a valve, but is simplified in FIG.

  The chemical heat pump 200 includes the above-described heat storage / dissipation unit 100, the reaction medium flow path pipe 210, the heat medium flow path 220, the condenser 230, and the evaporator 240.

  The reaction medium channel pipe 210 is a pipe whose one end is connected to the reaction medium circulation part 23 of the heat storage and dissipation unit 100. Further, the other end of the reaction medium channel pipe 210 is connected to the condenser 230 via the valve 250 and is connected to the evaporator 240 via the valve 260.

  The heat medium flow path 220 is a flow path through which the heat medium passes. A plurality of heat storage / dissipation units 100 are arranged in the heat medium flow path 220. In this case, the reaction medium flow part 23 of each of the heat storage / heat dissipation units 100 is thermally connected via the reaction medium flow path piping 210. Yes.

  The condenser 230 is connected to the heat medium flow path 220 and has a function of condensing the gaseous reaction medium desorbed from the reaction material molding unit 13 through a heat storage process.

  The evaporator 240 is connected to the heat medium flow path 220 and has a function of evaporating the condensed reaction medium in order to supply it to the reaction material molding unit 13 in the heat dissipation process.

  Next, an example of heat recovery using the chemical heat pump 200 will be described. In the present embodiment, for convenience of explanation, the case where calcium sulfate is used for the reaction material forming portion 13 and water vapor is used as the reaction medium will be described, but the present invention is not limited to this.

  In the heat storage process, the valve 260 is closed and the valve 250 is opened. In this state, for example, exhaust gas generated in a factory is introduced as a heat medium H into the heat medium flow path 220, so that water vapor is desorbed from the hydrated calcium sulfate and the heat dissipation process proceeds. The water vapor desorbed from calcium sulfate is condensed in the condenser 230 through the reaction medium flow path pipe 210.

  On the other hand, in the heat dissipation process, the valve 250 is closed and the valve 260 is opened. The water vapor evaporated by the evaporator 240 is introduced into the heat storage / radiation unit 100 through the reaction medium flow path pipe 210. As the introduced water vapor reacts with calcium sulfate, the heat dissipation process proceeds.

  In the heat storage process and the heat dissipation process, the pressure in the region inside the heat medium flow path 220 and outside the heat storage and heat dissipation unit 100 (that is, the region where the heat medium H exists) is, for example, atmospheric pressure. . On the other hand, since the inside of the heat storage / radiation unit 100 is in a state where water vapor and calcium sulfate exist in the space exhausted to a vacuum, the pressure becomes the water vapor pressure in the heat storage / radiation unit 100.

  This water vapor pressure is approximated to the water vapor pressure at the temperature of the condenser 230 in the heat storage process, and is approximated to the water vapor pressure depending on the temperature of calcium sulfate in the heat release process. It becomes. That is, a pressure difference is generated between the inside and the outside of the heat storage / radiation unit 100 so that the outside is at a high pressure.

  In the present embodiment, the heat transfer surface that is a part of the outer wall of the reaction vessel 20 is formed of a sheet-like member, and therefore the heat transfer surface is pressed against calcium sulfate due to the pressure difference described above. That is, the heat transfer surface and the reaction material forming portion 13 can be connected with low thermal resistance. Thereby, in the heat dissipation process, the reaction heat generated by the reaction with the reaction medium of the reaction material forming unit 13 can be efficiently transferred to the heat transfer surface and exchanged with the heat medium H. On the other hand, in the heat storage process, the heat transferred from the heat medium H to the heat transfer surface can be efficiently stored in the reaction material molding unit 13. That is, the chemical heat pump 200 having excellent heat input / output characteristics of the heat storage / radiation unit 100 can be obtained.

  In this operation, a compressive force due to atmospheric pressure acts in the reaction vessel 20, but as described in Examples 1 to 3, the internal reaction medium flow path 14 is crushed by the bridging structure of the heat transfer member 12. It is held without. For this reason, it is possible to promote the movement of the reaction medium in the heat storage and release process, and to maintain a large reaction surface area of the reaction material forming portion 13.

  As a more specific example, the pressure inside the heat medium flow path 220 and outside the heat storage / radiation unit is about atmospheric pressure (for example, 101 kPa). An embodiment using water vapor as will be described.

  In the heat dissipation process of this embodiment, a chemical heat pump 200 having excellent heat output characteristics can be obtained under the conditions of a calcium sulfate temperature of less than 190 ° C. and a water vapor pressure of less than 90 kPa. However, the present invention is not limited to this. For example, the temperature of the reaction material forming portion 13 and the pressure of the reaction medium are designed to be higher by a method in which the heat storage / dissipation unit is arranged in the heat medium bath and external pressure is applied. Can do. That is, the chemical heat pump 200 having excellent heat input / output characteristics is obtained under all implementation conditions in which the pressure in the heat storage / radiation unit is lower than the pressure in the region outside the heat storage / heat dissipation unit 220 and outside the heat storage / heat dissipation unit. be able to.

(Example 5)
In Example 5, the form which applied the thermal storage / radiation unit 100 which concerns on this embodiment to the non-electric cooling unit is demonstrated, referring FIG.

  FIG. 15 is a schematic configuration diagram of an example of a non-electric cooling unit. In FIG. 15, only the basic configuration for providing the cooling function is shown in a simplified manner. The cooling operation is based on the premise that the heat storage of the reaction material in the heat storage / heat dissipation unit is completed, and a detailed description of this heat storage is omitted in this embodiment. For example, in the case where calcium sulfate is used as the reaction material, if baking is performed at 150 ° C. for 5 hours, the water of crystallization is deprived and becomes anhydrous, resulting in a heat storage state. This means that such an operation is performed in advance.

  The non-electric cooling unit 300 includes the above-described heat storage / radiation unit 100, the reaction medium flow pipe 310 connected to the reaction medium flow part 23 of the heat storage / radiation unit 100, and the cooling panel 320 (corresponding to the evaporator 240 of the chemical heat pump 200). ). The reaction medium flow path pipe 310 is connected to the cooling panel 320 via a valve 330. The cooling panel 320 is arrange | positioned in the cooling chamber 340, for example, and cools the inside of the cooling chamber 340. FIG.

  Next, a cooling operation using the non-electric cooling unit 300 of the present embodiment will be described. In this embodiment, for convenience of explanation, a case where calcium sulfate is used for the reaction material forming portion 13 and water vapor is used as a reaction medium will be described, but the present invention is not limited to this.

  The heat storage / radiation unit 100 is in a state where heat storage is completed, and the cooling panel 320 is filled with water. The inside of the heat storage / radiation unit 100, the reaction medium flow path pipe 310, and the cooling panel 320 is evacuated, and the valve 330 is closed.

  When the valve 330 is opened from this state, the water in the cooling panel 320 is vaporized and introduced into the heat storage and radiation unit 100 through the reaction medium flow path pipe 310. When the introduced water vapor reacts with calcium sulfate, vaporization of the water in the cooling panel 320 is promoted, and as a result, the cooling panel 320 is cooled by the heat of vaporization.

  Calcium sulfate generates heat due to reaction with water vapor, but due to the effect of heat transfer / reaction promotion of the heat storage / radiation unit 100 of this embodiment, the generated heat is efficiently released from the surface of the reaction vessel 20 into the atmosphere. The reaction of calcium with water vapor continues. This cooling effect continues until either the calcium sulfate in the heat storage / radiation unit 100 becomes hemihydrate and the reaction stops, or the water in the cooling panel 320 evaporates and is exhausted.

  That is, it is possible to provide the non-electric cooling unit 300 having excellent cooling capacity. As described above, since no power supply is required in the cooling operation, this function is referred to as the non-electric cooling unit 300 in this embodiment.

  As described above, the heat storage / dissipation unit, the chemical heat pump, and the non-electric cooling unit have been described by way of examples. However, the present invention is not limited to the above examples, and various modifications and improvements can be made within the scope of the present invention. .

DESCRIPTION OF SYMBOLS 10 Reaction material molded object 11 Heat transfer plate 12 Heat transfer member 12a Exposed part 12b Exposed part 13 Reaction material shaping part 14 Reaction medium flow path 20 Reaction container 21 Seal part 22 Reactive material storage part 23 Reaction medium distribution part 24 Cover part 100 Storage Heat dissipation unit 200 Chemical heat pump 210 Reaction medium flow path piping 220 Heat medium flow path 230 Condenser 240 Evaporator 250 Valve 260 Valve 300 Non-electric cooling unit 310 Reaction medium flow path 320 Cooling panel 330 Valve

Japanese Patent Application Laid-Open No. 2014-044000 JP-A-9-142801

Claims (11)

A reaction material molded body for exchanging heat with the reaction medium;
A reaction vessel that houses the reaction material molded body and exchanges heat with the reaction material molded body;
A reaction medium flow part connected to the reaction vessel and supplying the reaction medium to the reaction vessel or discharging the reaction medium from the reaction vessel;
The reaction material molded body includes a plate-shaped heat transfer plate that is in contact with the reaction vessel, a heat transfer member that extends substantially perpendicularly from one surface of the heat transfer plate, and a part of the heat transfer member is exposed. And having a reaction material molding part containing the heat transfer member,
The reaction vessel is deformable by a pressure difference between the outside and inside of the reaction vessel.
Thermal storage unit. The reaction vessel is formed by a sheet-like member.
The heat storage and radiation unit according to claim 1. The sheet-like member is a metal foil or a plastic sheet.
The heat storage and radiation unit according to claim 2. The heat transfer member has a pin shape or a plate shape,
The storage-and-radiation unit according to any one of claims 1 to 3. The reaction material molding part is formed by molding and solidifying the reaction material on the heat transfer member,
The heat storage and dissipation unit according to any one of claims 1 to 4. The heat transfer member has an exposed portion exposed from a surface opposite to the side on which the heat transfer plate is provided in the reaction material molding portion.
The heat storage and dissipation unit according to any one of claims 1 to 5. The heat transfer member has an exposed portion that is exposed from a surface of the reaction material forming portion on which the heat transfer plate is provided.
The heat storage and radiation unit according to any one of claims 1 to 6. The heat transfer member is configured integrally with the heat transfer plate and has a shape in which a part of the heat transfer plate is bent substantially perpendicular to one surface of the heat transfer plate.
The heat storage / dissipation unit according to any one of claims 1 to 7. The heat transfer plate and the heat transfer member include aluminum or copper,
The heat storage and dissipation unit according to any one of claims 1 to 8. A heat storage / dissipation unit according to any one of claims 1 to 9,
A heat medium flow path thermally connected to the reaction vessel;
A reaction medium channel pipe connected to the reaction medium flow part;
A condenser connected to the reaction medium channel pipe via an opening / closing mechanism;
An evaporator connected to the reaction medium channel pipe via an opening / closing mechanism,
Chemical heat pump. A heat storage / dissipation unit according to any one of claims 1 to 9,
A reaction medium flow pipe connected to the reaction medium flow part of the heat storage and dissipation unit;
A cooling panel connected to the reaction medium channel pipe via an opening / closing mechanism,
Non-electric cooling unit.