JP2016189628A - Piezoelectric vibration element and piezoelectric wafer - Google Patents

Piezoelectric vibration element and piezoelectric wafer Download PDF

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JP2016189628A
JP2016189628A JP2016148048A JP2016148048A JP2016189628A JP 2016189628 A JP2016189628 A JP 2016189628A JP 2016148048 A JP2016148048 A JP 2016148048A JP 2016148048 A JP2016148048 A JP 2016148048A JP 2016189628 A JP2016189628 A JP 2016189628A
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piezoelectric
piezoelectric substrate
vibration element
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JP6276341B2 (en
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飯田　浩章
Hiroaki Iida
浩章 飯田
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Kyocera Crystal Device Corp
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Abstract

PROBLEM TO BE SOLVED: To form a plurality of piezoelectric vibration elements that can be in different shapes on a plate-like piezoelectric plate.SOLUTION: A piezoelectric vibration element 100 comprises: a plate-like piezoelectric substrate part 10; support parts 20a, 20b that are provided on one end of the piezoelectric substrate part 10; a piezoelectric element 70 that is connected with the piezoelectric substrate part 10 via the support parts 20a, 20b and includes a pedestal part 30 formed thicker than the piezoelectric substrate part 10; excitation electrodes 11a, 11b that are provided on the piezoelectric substrate part 10; first terminal electrodes 12a, 12b that are provided on the one end where the support parts 20a, 20b are provided and electrically connected with the excitation electrodes 11a, 11b; second terminal electrodes 31a, 31b that are provided on the pedestal part 30 and electrically connected with the first terminal electrodes 12a, 12b; and a first split groove 40 that is provided at a portion where the piezoelectric substrate part 10, support part 20a, and support part 20b are in contact with each other.SELECTED DRAWING: Figure 1

Description

本発明は、圧電デバイスに用いられる圧電振動素子および圧電ウエハに関するものである。   The present invention relates to a piezoelectric vibration element and a piezoelectric wafer used for a piezoelectric device.

従来より、電子機器に組み込まれるタイミングデバイスとして、圧電デバイが幅広く用いられている。また、電子機器は小型化が進み、電子機器に搭載される圧電デバイスにおいても同様に小型化が要求されている。例えば、圧電デバイスの一つである圧電振動子は、凹部を有する素子搭載部材と、素子搭載部材の凹部内に搭載された圧電振動素子と、圧電振動素子を気密に封止するための蓋部材とで構成されている。   Conventionally, piezoelectric devices have been widely used as timing devices incorporated in electronic equipment. In addition, electronic devices are increasingly downsized, and piezoelectric devices mounted on electronic devices are similarly required to be downsized. For example, a piezoelectric vibrator which is one of piezoelectric devices includes an element mounting member having a recess, a piezoelectric vibration element mounted in the recess of the element mounting member, and a lid member for hermetically sealing the piezoelectric vibration element It consists of and.

圧電振動素子は、平板状の圧電基板と、圧電基板の両主面に設けられた励振電極と、圧電基板の両主面に設けられており励振電極に電気的に接続された端子電極とを備えている。このような、圧電振動素子の製造方法は、例えば個片化された平板状の圧電基板の主面を所望の周波数の厚さまで研磨する工程と、圧電基板の研磨面に励振電極や端子電極となる金属を蒸着する工程を有している。しかし、この従来の製造方法で小型化された圧電基板を製造する場合は、個片化された圧電基板の主面を所望の周波数の厚さまでの研磨や励振電極および端子電極等の加工の処理が難しく煩雑であった。そのため、小型化された圧電振動素子は、
個片にされるまでの工程を複数の圧電基板が形成された圧電ウエハ単位で製造する方法が提案されている（特許文献１参照）。また、この方法は、圧電ウエハに同一形状の圧電振動素子を複数個形成することができるため、生産性の高い方法である。 The piezoelectric vibration element includes a flat piezoelectric substrate, excitation electrodes provided on both main surfaces of the piezoelectric substrate, and terminal electrodes provided on both main surfaces of the piezoelectric substrate and electrically connected to the excitation electrodes. I have. Such a method of manufacturing a piezoelectric vibration element includes, for example, a step of polishing a principal surface of a flat plate-shaped piezoelectric substrate divided into pieces to a desired frequency thickness, and an excitation electrode and a terminal electrode on the polishing surface of the piezoelectric substrate. The process which vapor-deposits the metal which becomes. However, when manufacturing a piezoelectric substrate reduced in size by this conventional manufacturing method, the main surface of the separated piezoelectric substrate is polished to a desired frequency thickness or processing of the excitation electrode and the terminal electrode is performed. Was difficult and cumbersome. Therefore, the miniaturized piezoelectric vibration element is
There has been proposed a method of manufacturing a process up to individual pieces in units of piezoelectric wafers on which a plurality of piezoelectric substrates are formed (see Patent Document 1). This method is a highly productive method because a plurality of piezoelectric vibration elements having the same shape can be formed on the piezoelectric wafer.

特開平１０−２０９７８５号公報Japanese Patent Laid-Open No. 10-209785

しかしながら、従来は、製造効率を上げるため一つの圧電ウエハに一種類の素子しか形成していなかった。そのため、異なる形状の素子を製造する場合は、他の圧電ウエハを用いて製造していた。しかし、このような場合、同じような製造工程でありながら同じ製造装置をそれぞれの形状に対応させて用意する必要があるため、生産性が悪化する要因となっていた。そこで、本発明は、前記問題を解決し生産性が良い圧電振動素子を圧電ウエハに形成することを課題とする。   However, conventionally, only one type of element has been formed on one piezoelectric wafer in order to increase manufacturing efficiency. Therefore, when manufacturing elements having different shapes, they are manufactured using other piezoelectric wafers. However, in such a case, since it is necessary to prepare the same manufacturing apparatus corresponding to each shape, although it is the same manufacturing process, it became a factor which deteriorates productivity. Accordingly, an object of the present invention is to solve the above-described problems and form a piezoelectric vibration element with good productivity on a piezoelectric wafer.

本発明によれば、圧電振動素子は、平板形状の圧電基板部と、圧電基板部の一方の端部に設けられ、圧電基板部から離れるに従って厚さが増している支持部と、圧電基板部に支持部を介して接続されており、圧電基板部より厚くかつ支持部の最も厚さが厚い部分と接続されている台座部と、を有した圧電素子と、圧電基板部に設けられた励振電極と、圧電基板部の支持部が形成された端部に設けられており、励振電極と電気的に接続された第１端子電極と、台座部に設けられており、第１端子電極と電気的に接続された第２端子電極と、圧電基板部と支持部とが接する部分に設けられ、所定の深さだけ堀り下げて略V字状の断面を形成した第１割溝と、を備えている。   According to the present invention, a piezoelectric vibration element includes a flat plate-shaped piezoelectric substrate portion, a support portion that is provided at one end of the piezoelectric substrate portion and increases in thickness as the distance from the piezoelectric substrate portion increases, and a piezoelectric substrate portion And a pedestal portion connected to a portion thicker than the piezoelectric substrate portion and connected to the thickest portion of the support portion, and an excitation provided on the piezoelectric substrate portion An electrode and a first terminal electrode electrically connected to the excitation electrode; and a pedestal portion provided at an end portion where the support portion of the piezoelectric substrate portion is formed; Second terminal electrodes connected to each other, and a first dividing groove provided at a portion where the piezoelectric substrate portion and the support portion are in contact with each other, and having a substantially V-shaped cross section formed by digging down by a predetermined depth, I have.

また本発明は、圧電基板部と台座部との間に形成されている支持部に、厚み方向に貫通している貫通孔が形成されている。   In the present invention, a through hole penetrating in the thickness direction is formed in the support portion formed between the piezoelectric substrate portion and the pedestal portion.

また本発明は、板状の圧電板に複数の圧電振動素子が設けられた圧電ウエハであって、平板形状の圧電基板部と、圧電基板部の一方の端部に設けられ、圧電基板部から離れるに従って厚さが増している支持部と、圧電基板部に支持部を介して接続されており、圧電基板部より厚くかつ支持部の最も厚さが厚い部分と接続されている台座部と、を有した圧電素子と、圧電基板部に設けられた励振電極と、圧電基板部の前記支持部が形成された端部に設けられており、励振電極と電気的に接続された第１端子電極と、台座部に設けられており、第１端子電極と電気的に接続された第２端子電極と、
圧電基板部と支持部とが接する部分に設けられ、所定の深さだけ堀り下げて略Ｖ字状の断面を形成した第１割溝と、を有した圧電素子の台座部が、圧電板に接続されており、台座部と板状の圧電板とが接する部分に、所定の深さだけ掘り下げて略Ｖ字状の断面を形成した第２割溝が形成されている。 The present invention also provides a piezoelectric wafer in which a plurality of piezoelectric vibration elements are provided on a plate-like piezoelectric plate, the plate-like piezoelectric substrate portion, and provided at one end of the piezoelectric substrate portion. A support portion that increases in thickness as it leaves, and a pedestal portion that is connected to the piezoelectric substrate portion via the support portion, and is connected to a portion that is thicker than the piezoelectric substrate portion and thickest in the support portion; A piezoelectric element having a piezoelectric substrate, an excitation electrode provided on the piezoelectric substrate portion, and a first terminal electrode provided at an end of the piezoelectric substrate portion where the support portion is formed and electrically connected to the excitation electrode A second terminal electrode provided on the pedestal portion and electrically connected to the first terminal electrode;
A piezoelectric element pedestal having a first split groove provided at a portion where the piezoelectric substrate portion and the support portion are in contact with each other and having a substantially V-shaped cross-section formed by digging down to a predetermined depth is provided on the piezoelectric plate. A second split groove is formed in a portion where the pedestal portion and the plate-like piezoelectric plate are in contact with each other to form a substantially V-shaped cross section by digging a predetermined depth.

本発明による圧電振動素子は、圧電振動素子は、平板形状の圧電基板部と、圧電基板部の一方の端部に設けられ、圧電基板部から離れるに従って厚さが増している支持部と、圧電基板部に支持部を介して接続されており、圧電基板部より厚くかつ支持部の最も厚さが厚い部分と接続されている台座部と、を有した圧電素子と、圧電基板部に設けられた励振電極と、圧電基板部の支持部が形成された端部に設けられており、励振電極と電気的に接続された第１端子電極と、台座部に設けられており、第１端子電極と電気的に接続された第２端子電極と、圧電基板部と支持部とが接する部分に設けられ、所定の深さだけ堀り下げて略V字状の断面を形成した第１割溝と、を備えていることにより、圧電基板部の一方の端部に台座部が設けられた圧電振動素子が設けられることとなる。また、圧電基板部と支持部とが接する部分に設けられた第１割溝で割断することにより、平板形状の圧電振動素子ができる。よって、本発明による圧電振動素子は、１つの形状の圧電振動素子から異なる２つの形状の圧電振動素子を形成することができる。   The piezoelectric vibration element according to the present invention includes a flat plate-shaped piezoelectric substrate portion, a support portion that is provided at one end of the piezoelectric substrate portion, and increases in thickness as the distance from the piezoelectric substrate portion increases. A piezo-electric element having a base portion connected to a substrate portion via a support portion and connected to a portion thicker than the piezoelectric substrate portion and thickest of the support portion, and provided on the piezoelectric substrate portion An excitation electrode, and a first terminal electrode electrically connected to the excitation electrode, a pedestal portion, and a first terminal electrode. A second terminal electrode electrically connected to the first electrode, a first split groove provided in a portion where the piezoelectric substrate portion and the support portion are in contact with each other, and having a substantially V-shaped cross section formed by digging down a predetermined depth; The piezoelectric substrate part is provided with a pedestal part at one end thereof. A vibration element will be provided. Moreover, a plate-shaped piezoelectric vibration element can be obtained by cleaving with a first split groove provided in a portion where the piezoelectric substrate portion and the support portion are in contact with each other. Therefore, the piezoelectric vibrating element according to the present invention can form two different shaped piezoelectric vibrating elements from one shaped piezoelectric vibrating element.

また、圧電振動素子が板状の圧電板に複数設けられている圧電ウエハであって、圧電振動素子の台座部が、圧電板に接続されており、台座部と圧電板とのが接する部分に、所定の深さだけ掘り下げて略Ｖ字状の断面を形成した第２割溝が形成されていることにより、一つの板状の圧電板に異なる２つの形状の圧電振動素子を複数個形成することができる。よって、圧電振動素子の生産性が向上する。   The piezoelectric wafer includes a plurality of piezoelectric vibration elements provided on a plate-like piezoelectric plate, and the pedestal portion of the piezoelectric vibration element is connected to the piezoelectric plate, and the pedestal portion and the piezoelectric plate are in contact with each other. A plurality of piezoelectric vibration elements having two different shapes are formed on one plate-like piezoelectric plate by forming the second split groove that is dug down to a predetermined depth to form a substantially V-shaped cross section. be able to. Therefore, productivity of the piezoelectric vibration element is improved.

本発明の実施形態における圧電振動素子を示す斜視図である。It is a perspective view which shows the piezoelectric vibration element in embodiment of this invention. 本発明の実施形態における圧電素子を示す斜視図である。It is a perspective view which shows the piezoelectric element in embodiment of this invention. （ａ）は図１のＡ−Ａ断面図であり、（ｂ）は図１のＢ−Ｂ断面図である。(A) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. 本発明の実施形態における圧電振動素子の製造工程を説明するフローチャートである。It is a flowchart explaining the manufacturing process of the piezoelectric vibration element in embodiment of this invention. 本発明の実施形態における圧電ウエハの一部を示す斜視図である。It is a perspective view which shows a part of piezoelectric wafer in embodiment of this invention. 圧電ウエハに形成されている圧電振動素子を第１割溝で割断された状態の一例を示す斜視図である。It is a perspective view which shows an example of the state which the piezoelectric vibration element formed in the piezoelectric wafer was cleaved by the 1st split groove. 圧電振動素子に形成されている支持部の変形例を示す斜視図である。It is a perspective view which shows the modification of the support part currently formed in the piezoelectric vibration element. 圧電振動素子の他の変形例を示す斜視図である。It is a perspective view which shows the other modification of a piezoelectric vibration element.

以下、本発明のいくつかの例示的な実施形態について、図面を参照して説明する。なお、同一要素には同一の符号を付し重複する説明を省略する。また、構成を明確にするために誇張して図示している。   Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same element and the overlapping description is abbreviate | omitted. In addition, the illustration is exaggerated for the sake of clarity.

図１，図２および図３（ａ），（ｂ）に示されているように、本発明の実施形態における圧電振動素子１００は、圧電素子７０，励振電極１１ａ，１１ｂ，第１端子電極１２ａ，１２ｂ，第２端子電極３１ａ，３１ｂから構成されている。また、圧電素子７０は、圧電基板部１０，支持部２０ａ，２０ｂ，台座部３０，第１割溝４０から構成されている。また、圧電基板部１０の一方の主面と、支持部２０ａ，２０ｂの一方の主面と、台座部３０の一方の主面とは同一面で構成されており、その面内に第１割溝４０が形成されている。
なお、圧電振動素子１００は、例えば結晶軸に対し所定の角度で切断された圧電板２００を用いてフォトリソグラフィ技術とウエットエッチング技術によって製造される。また、圧電基板部１０と、支持部２０ａ，２０ｂと、台座部３０と、第１割溝４０は、例えばウエットエッチング技術によって一体的に形成される。 As shown in FIGS. 1, 2 and 3A, 3B, the piezoelectric vibration element 100 according to the embodiment of the present invention includes a piezoelectric element 70, excitation electrodes 11a and 11b, and a first terminal electrode 12a. , 12b and second terminal electrodes 31a, 31b. The piezoelectric element 70 includes the piezoelectric substrate part 10, support parts 20 a and 20 b, a pedestal part 30, and a first split groove 40. In addition, one main surface of the piezoelectric substrate portion 10, one main surface of the support portions 20a and 20b, and one main surface of the pedestal portion 30 are configured as the same surface, and the first plane is within the surface. A groove 40 is formed.
The piezoelectric vibration element 100 is manufactured by, for example, a photolithography technique and a wet etching technique using a piezoelectric plate 200 cut at a predetermined angle with respect to a crystal axis. Moreover, the piezoelectric substrate part 10, the support parts 20a and 20b, the base part 30, and the 1st split groove 40 are integrally formed, for example by the wet etching technique.

図２に示すように、圧電基板部１０は、平板形状の水晶よりなり、平面視で長方形状を有している。また、圧電基板部１０の両主面には、励振電極１１ａ，１１ｂが設けられおり、励振電極１１ａ，１１ｂに電気的に接続された第１端子電極１２ａ，１２ｂとを有している。また、圧電基板部１０に設けられた励振電極１１ａおよび励振電極１１ｂは、外部より電圧が加わることにより、所定の周波数で厚みすべり振動を起こすようになっている。なお、圧電基板部１０は、圧電材料で形成されていてもよい。   As shown in FIG. 2, the piezoelectric substrate portion 10 is made of a plate-shaped crystal and has a rectangular shape in plan view. In addition, excitation electrodes 11a and 11b are provided on both main surfaces of the piezoelectric substrate unit 10, and first terminal electrodes 12a and 12b are electrically connected to the excitation electrodes 11a and 11b. Further, the excitation electrode 11a and the excitation electrode 11b provided on the piezoelectric substrate portion 10 are caused to undergo thickness-shear vibration at a predetermined frequency when a voltage is applied from the outside. The piezoelectric substrate unit 10 may be formed of a piezoelectric material.

図１および図３（ｂ）に示すように、励振電極１１ａ，１１ｂは、Ｃｒ(クロム)などの下地金属膜の上に設けられ、例えば金、銀、アルミ等のいずれかの金属材料より形成されている。また、励振電極１１ａ，１１ｂは、平面透視において、圧電基板部１０の中央部にそれぞれ配置されている。また、励振電極１１ａは、第１端子電極１２ａに電気的に接続されており、励振電極１１ｂは、第１端子電極１２ｂに電気的に接続されている。   As shown in FIGS. 1 and 3B, the excitation electrodes 11a and 11b are provided on a base metal film such as Cr (chromium), and are formed of any metal material such as gold, silver, or aluminum. Has been. In addition, the excitation electrodes 11a and 11b are respectively disposed in the central portion of the piezoelectric substrate portion 10 in plan perspective. The excitation electrode 11a is electrically connected to the first terminal electrode 12a, and the excitation electrode 11b is electrically connected to the first terminal electrode 12b.

図１に示すように、第１端子電極１２ａ，１２ｂは、励振電極１１ａ，１１ｂと同様にＣｒ(クロム)などの下地金属膜の上に設けられ、金、銀、アルミ等のいずれかの金属材料より形成されている。また、第１端子電極１２ａ，１２ｂは、平面視において圧電基板部１０の短辺部の端部に設けられている。また、第１端子電極１２ａは、圧電基板部１０の励振電極１１ａが設けられた面から励振電極１１ｂが設けられた面まで引き回されている。また、第１端子電極１２ｂは、圧電基板部１０の励振電極１１ｂが設けられた面から励振電極１１ａが設けられた面まで引き回されている。   As shown in FIG. 1, the first terminal electrodes 12a and 12b are provided on a base metal film such as Cr (chromium) like the excitation electrodes 11a and 11b, and are made of any metal such as gold, silver, and aluminum. It is made of material. The first terminal electrodes 12a and 12b are provided at the end of the short side portion of the piezoelectric substrate portion 10 in plan view. The first terminal electrode 12a is routed from the surface of the piezoelectric substrate unit 10 on which the excitation electrode 11a is provided to the surface on which the excitation electrode 11b is provided. The first terminal electrode 12b is routed from the surface of the piezoelectric substrate portion 10 on which the excitation electrode 11b is provided to the surface on which the excitation electrode 11a is provided.

図２に示すように、支持部２０ａ，２０ｂは、水晶よりなり、圧電基板部１０の第１端子電極１２ａ，１２ｂが形成された端部に設けられている。また、支持部２０ａ，２０ｂは、圧電基板部１０の短辺側の両角部に形成されている。また、支持部２０ａは、圧電基板部１０の第１端子電極１２ａが形成されている側に設けられており、平面視において圧電基板部１０の第１端子電極１２ａと同一の幅を有している。また、支持部２０ａの一方の主面は、圧電基板部１０の一方の主面と台座部３０の一方の主面とで同一平面を形成しており、
支持部２０ａの他方の主面は、圧電基板部１０の他方の主面から台座部３０の他方の主面に向かい斜めに形成されている。また、支持部２０ｂは、圧電基板部１０の第１端子電極１２ｂが形成されている側に設けられており、平面視において圧電基板部１０の第１端子電極１２ｂと同一の幅を有している。
また、支持部２０ｂの一方の主面は、圧電基板部１０の一方の主面と台座部３０の一方の主面とで同一平面を形成しており、支持部２０ｂの他方の主面は、圧電基板部１０の他方の主面から台座部３０の他方の主面に向かい厚さが増すように斜めに形成されている。また、図３（ｂ）に示すように、支持部２０ａと支持部２０ｂの間には、貫通孔６０が設けられている。 As shown in FIG. 2, the support portions 20 a and 20 b are made of quartz and are provided at the ends of the piezoelectric substrate portion 10 where the first terminal electrodes 12 a and 12 b are formed. The support portions 20 a and 20 b are formed at both corners on the short side of the piezoelectric substrate portion 10. The support portion 20a is provided on the side of the piezoelectric substrate portion 10 where the first terminal electrode 12a is formed, and has the same width as the first terminal electrode 12a of the piezoelectric substrate portion 10 in plan view. Yes. In addition, one main surface of the support portion 20a forms the same plane with one main surface of the piezoelectric substrate portion 10 and one main surface of the pedestal portion 30,
The other main surface of the support portion 20 a is formed obliquely from the other main surface of the piezoelectric substrate portion 10 toward the other main surface of the pedestal portion 30. The support portion 20b is provided on the side of the piezoelectric substrate portion 10 where the first terminal electrode 12b is formed, and has the same width as the first terminal electrode 12b of the piezoelectric substrate portion 10 in plan view. Yes.
Further, one main surface of the support portion 20b forms the same plane with one main surface of the piezoelectric substrate portion 10 and one main surface of the pedestal portion 30, and the other main surface of the support portion 20b is The piezoelectric substrate portion 10 is formed obliquely so that the thickness increases from the other main surface of the piezoelectric substrate portion 10 toward the other main surface of the pedestal portion 30. Moreover, as shown in FIG.3 (b), the through-hole 60 is provided between the support part 20a and the support part 20b.

また、図１および図３（ａ）に示すように、支持部２０ａの側面は、第１端子電極１２ａと同様にＣｒ(クロム)などの下地金属膜の上に設けられ、金、銀、アルミ等のいずれかの金属材料によって覆われている。また、支持部２０ａを覆っている金属材料は、第１端子電極１２ａと電気的に接続されている。また、支持部２０ｂの側面は、第１端子電極１２ｂと同様にＣｒ(クロム)などの下地金属膜の上に設けられ、金、銀、アルミ等のいずれかの金属材料によって覆われている。また、支持部２０ｂを覆っている金属材料は、第１端子電極１２ｂと電気的に接続されている。   Further, as shown in FIGS. 1 and 3A, the side surface of the support portion 20a is provided on a base metal film such as Cr (chromium) like the first terminal electrode 12a, and is made of gold, silver or aluminum. Etc. are covered with any metal material. Further, the metal material covering the support portion 20a is electrically connected to the first terminal electrode 12a. Further, the side surface of the support portion 20b is provided on a base metal film such as Cr (chrome) similarly to the first terminal electrode 12b, and is covered with any metal material such as gold, silver, or aluminum. In addition, the metal material covering the support portion 20b is electrically connected to the first terminal electrode 12b.

図２および図３（ａ）に示すように、台座部３０は、支持部２０ａ，２０ｂと同様に水晶よりなり、側面視において圧電基板部１０の厚さよりも厚く形成されている。また、台座部３０は、支持部２０ａ，２０ｂの圧電基板部１０が設けられた側と相対する側に設けられており、第２端子電極３１ａ，３１ｂを有している。   As shown in FIGS. 2 and 3A, the pedestal portion 30 is made of crystal like the support portions 20a and 20b, and is thicker than the piezoelectric substrate portion 10 in a side view. The pedestal portion 30 is provided on the side of the support portions 20a and 20b opposite to the side on which the piezoelectric substrate portion 10 is provided, and has second terminal electrodes 31a and 31b.

図１に示すように、第２端子電極３１ａ，３１ｂは、支持部２０ａ，２０ｂと同様にＣｒ(クロム)などの下地金属膜の上に設けられ、金、銀、アルミ等のいずれかの金属材料より形成されている。また、第２端子電極３１ａ，３１ｂは、台座部３０の両主面の短辺部の両端にそれぞれ設けられている。また、台座部３０の両主面の短辺部に形成された第２端子電極３１ａの幅は、支持部２０ａの幅と同じ幅で両主面に形成されており、第２端子電極３１ａは、台座部３０の一方の面から台座部３０の他方の面まで引き回されている。また、台座部３０の両主面の短辺部に形成された第２端子電極３１ｂの幅は、
支持部２０ｂの幅と同じ幅で両主面に形成されており、第２端子電極３１ｂは、台座部３０の一方の面から台座部３０の他方の面までそれぞれ引き回されている。また、第２端子電極３１ａは、支持部２０ａを覆っている金属材料を介して第１端子電極１２ａに電気的に接続されている。また、第２端子電極３１ｂは、支持部２０ｂを覆っている金属材料を介して第１端子電極１２ｂに電気的に接続されている。 As shown in FIG. 1, the second terminal electrodes 31a and 31b are provided on a base metal film such as Cr (chromium) like the support portions 20a and 20b, and are made of any metal such as gold, silver, and aluminum. It is made of material. Further, the second terminal electrodes 31 a and 31 b are provided at both ends of the short sides of both main surfaces of the pedestal 30. The width of the second terminal electrode 31a formed on the short sides of both main surfaces of the pedestal 30 is the same width as the width of the support portion 20a, and is formed on both main surfaces. The second terminal electrode 31a The pedestal 30 is routed from one surface to the other surface of the pedestal 30. In addition, the width of the second terminal electrode 31b formed on the short sides of both main surfaces of the pedestal 30 is:
The second terminal electrodes 31b are routed from one surface of the pedestal portion 30 to the other surface of the pedestal portion 30, respectively, with the same width as the width of the support portion 20b. The second terminal electrode 31a is electrically connected to the first terminal electrode 12a through a metal material that covers the support portion 20a. The second terminal electrode 31b is electrically connected to the first terminal electrode 12b through a metal material covering the support portion 20b.

第１割溝４０は、同一面で構成された圧電基板部１０と、支持部２０ａ，２０ｂとの境に形成されており、所定の深さだけ掘り下げて略Ｖ字状の断面を形成している。   The first split groove 40 is formed at the boundary between the piezoelectric substrate section 10 configured on the same surface and the support sections 20a and 20b, and is formed by digging a predetermined depth to form a substantially V-shaped cross section. Yes.

このように、本発明の実施形態における圧電振動素子１００は、平板形状の圧電基板部１０と、圧電基板部１０の一方の端部に設けられた支持部２０ａ，２０ｂと、圧電基板部１０に支持部２０ａ，２０ｂを介して接続されており、圧電基板部１０より厚く形成された台座部３０とを有した圧電素子７０と、圧電基板部１０に設けられた励振電極１１ａ，１１ｂと、圧電基板部１０の支持部２０ａおよび支持部２０ｂが形成された端部に設けられており、励振電極１１ａ，１１ｂと電気的に接続された第１端子電極１２ａ，１２ｂと、台座部３０に設けられており、
第１端子電極１２ａ，１２ｂと電気的に接続された第２端子電極３１ａ、３１ｂと、圧電基板部１０と支持部２０ａおよび支持部２０ｂとが接する部分に設けられた第１割溝４０とを備えている。また、圧電振動素子１００は、圧電基板部１０の一方の主面と、支持部２０ａ，２０ｂの一方の主面と、台座部３０の一方の主面とは同一面で構成されており、その面上に第１割溝４０が形成されている。このことにより、圧電振動素子１００は、圧電基板部１０の一方の端部に台座３０が設けられており、圧電基板部１０と台座部３０とに段差が形成された圧電振動素子１００ができることとなる。
また、圧電基板部１０と支持部２０ａ，２０ｂとが接する部分に設けられた第１割溝４０で割断することにより、平板形状の圧電振動素子１００ができる。よって、本発明による圧電振動素子１００は、１つの形状の圧電振動素子１００から異なる２つの形状の圧電振動素子１００を形成することができる。 As described above, the piezoelectric vibration element 100 according to the embodiment of the present invention includes the flat plate-shaped piezoelectric substrate portion 10, the support portions 20 a and 20 b provided at one end of the piezoelectric substrate portion 10, and the piezoelectric substrate portion 10. A piezoelectric element 70 having a pedestal portion 30 that is connected to the support portions 20a and 20b and formed thicker than the piezoelectric substrate portion 10, excitation electrodes 11a and 11b provided on the piezoelectric substrate portion 10, and piezoelectric elements. A first terminal electrode 12a, 12b electrically connected to the excitation electrodes 11a, 11b and provided on the pedestal 30 is provided at the end of the substrate part 10 where the support part 20a and the support part 20b are formed. And
Second terminal electrodes 31a and 31b electrically connected to the first terminal electrodes 12a and 12b, and a first split groove 40 provided at a portion where the piezoelectric substrate portion 10 and the support portion 20a and the support portion 20b are in contact with each other. I have. In the piezoelectric vibration element 100, one main surface of the piezoelectric substrate portion 10, one main surface of the support portions 20a and 20b, and one main surface of the pedestal portion 30 are configured as the same surface. A first split groove 40 is formed on the surface. As a result, the piezoelectric vibration element 100 is provided with the pedestal 30 at one end of the piezoelectric substrate portion 10, and the piezoelectric vibration element 100 in which a step is formed between the piezoelectric substrate portion 10 and the pedestal portion 30 can be obtained. Become.
Further, the plate-shaped piezoelectric vibration element 100 can be formed by cleaving with the first split groove 40 provided in the portion where the piezoelectric substrate portion 10 and the support portions 20a and 20b are in contact with each other. Therefore, the piezoelectric vibration element 100 according to the present invention can form two different shapes of the piezoelectric vibration element 100 from one shape of the piezoelectric vibration element 100.

このような、圧電基板部１０の一方の端部に台座部３０が設けられており、圧電基板部１０と台座部３０とに段差が形成された圧電振動素子１００であれば、基板に台座部３０と圧電基板部１０との段差が形成されている側を向けて台座部３０を固定した場合、圧電振動素子１００は、台座部３０と圧電基板部１０との段差により、圧電基板部１０に形成された励振電極１１ａが基板から離間された状態となる。よって、安定した周波数特性が得られることとなる。   If the piezoelectric vibration element 100 is provided with a pedestal portion 30 at one end of the piezoelectric substrate portion 10 and a step is formed between the piezoelectric substrate portion 10 and the pedestal portion 30, the pedestal portion is provided on the substrate. When the pedestal portion 30 is fixed with the side where the step between the pedestal 30 and the piezoelectric substrate portion 10 is formed, the piezoelectric vibration element 100 is placed on the piezoelectric substrate portion 10 by the step between the pedestal portion 30 and the piezoelectric substrate portion 10. The formed excitation electrode 11a is separated from the substrate. Therefore, stable frequency characteristics can be obtained.

また、圧電基板部１０と支持部２０ａ，２０ｂとが接する部分に設けられた第１割溝４０で割断することによりできる平板形状の圧電振動素子１００であれば、圧電振動素子１００は、基板に平板形状の圧電振動素子１００を固定した場合、片持ち支持の圧電振動子を製造することができる。   Further, if the piezoelectric vibration element 100 has a flat plate shape that can be cut by the first split groove 40 provided in the portion where the piezoelectric substrate portion 10 and the support portions 20a and 20b are in contact, the piezoelectric vibration element 100 is attached to the substrate. When the flat plate-shaped piezoelectric vibration element 100 is fixed, a cantilevered piezoelectric vibrator can be manufactured.

また、本発明の実施形態における圧電振動素子１００は、支持部２０ａと支持部２０ｂの間に設けられた貫通孔６０と、支持部２０ａおよび支持部２０ｂに形成された第１割溝４０とが設けられていることにより、支持部２０ａ，２０ｂから圧電基板部１０を容易に分離することができる。また、励振電極１１ａ，１１ｂより発生した振動エネルギーが、圧電基板部１０の支持部２０ａ，２０ｂが設けられた方向に漏れだしても、
支持部２０ａと支持部２０ｂの間に設けられた貫通孔６０と支持部２０ａおよび支持部２０ｂに形成された第１割溝４０とによって振動エネルギーの伝播を遮断することができる。
また、支持部２０ａと支持部２０ｂの間に設けられた貫通孔６０は、支持部２０ａを覆っている金属材料と支持部２０ｂを覆っている金属材料との接触を回避している。 In addition, the piezoelectric vibration element 100 according to the embodiment of the present invention includes a through hole 60 provided between the support portion 20a and the support portion 20b, and a first split groove 40 formed in the support portion 20a and the support portion 20b. By being provided, the piezoelectric substrate part 10 can be easily separated from the support parts 20a, 20b. Even if the vibration energy generated from the excitation electrodes 11a and 11b leaks in the direction in which the support portions 20a and 20b of the piezoelectric substrate portion 10 are provided,
Propagation of vibration energy can be blocked by the through hole 60 provided between the support portion 20a and the support portion 20b and the first split groove 40 formed in the support portion 20a and the support portion 20b.
Moreover, the through hole 60 provided between the support part 20a and the support part 20b avoids contact between the metal material covering the support part 20a and the metal material covering the support part 20b.

本発明の実施形態における圧電振動素子１００は、圧電ウエハ３００に設けられており、この圧電ウエハ３００から個片化されて形成される。また、圧電ウエハ３００は、板状の圧電板２００と複数の圧電振動素子１００とで構成されている。
圧電板２００は、例えば水晶よりなり、アズグロウンの結晶体を水晶の結晶軸に沿って機械加工され、機械加工されたアズグロウンを結晶軸に対し所定の角度で平板状に切断して形成されたものである。また、圧電板２００は、本発明の実施形態における圧電振動素子１００の台座部３０が圧電板２００に接続されており、台座部３０と圧電板２００とが接する部分に第２割溝５０が設けられている。また、圧電板２００には、圧電振動素子１００が複数個形成されている。 The piezoelectric vibration element 100 according to the embodiment of the present invention is provided on a piezoelectric wafer 300 and is formed by being separated from the piezoelectric wafer 300. The piezoelectric wafer 300 is composed of a plate-like piezoelectric plate 200 and a plurality of piezoelectric vibration elements 100.
The piezoelectric plate 200 is made of, for example, quartz, and is formed by machining an as-grown crystal along the crystal axis of the quartz and cutting the machined as-grown into a flat plate shape at a predetermined angle with respect to the crystal axis. It is. In addition, the piezoelectric plate 200 has the pedestal portion 30 of the piezoelectric vibration element 100 according to the embodiment of the present invention connected to the piezoelectric plate 200, and a second split groove 50 is provided at a portion where the pedestal portion 30 and the piezoelectric plate 200 are in contact. It has been. In addition, a plurality of piezoelectric vibration elements 100 are formed on the piezoelectric plate 200.

第２割溝５０は、同一面で構成された台座部３０と、圧電板２００との境に形成されており、所定の深さだけ掘り下げて略Ｖ字状の断面を形成している。また、第２割溝５０は、同一面で構成された台座部３０と、圧電板２００との境にだけ設けられているのではなく、圧電基板部１０と台座部３０で段差ができている方向の台座部３０と、圧電板２００との境にも形成されている。この第２割溝５０は、台座部３０の短辺部の端部から第２端子部の幅の大きさまで形成されており、所定の深さだけ掘り下げて略Ｖ字状の断面を形成している。   The second split groove 50 is formed at the boundary between the pedestal portion 30 configured on the same surface and the piezoelectric plate 200 and is dug down to a predetermined depth to form a substantially V-shaped cross section. In addition, the second split groove 50 is not provided only at the boundary between the pedestal portion 30 and the piezoelectric plate 200 configured on the same surface, but has a step between the piezoelectric substrate portion 10 and the pedestal portion 30. It is also formed at the boundary between the pedestal 30 in the direction and the piezoelectric plate 200. The second split groove 50 is formed from the end of the short side portion of the pedestal portion 30 to the width of the second terminal portion, and is dug down to a predetermined depth to form a substantially V-shaped cross section. Yes.

本発明の実施形態における圧電ウエハ３００によれば、アズグロウンの結晶体を水晶の結晶軸に沿って機械加工され、機械加工されたアズグロウンを結晶軸に対し所定の角度で平板状に切断して形成された圧電板２００に圧電振動素子１００が複数個形成されることとなる。よって、同じ周波数温度特性を備えた圧電振動素子１００が複数個形成することができる。   According to the piezoelectric wafer 300 in the embodiment of the present invention, the as-grown crystal is machined along the crystal axis of the crystal, and the machined as-grown is cut into a flat plate shape at a predetermined angle with respect to the crystal axis. A plurality of piezoelectric vibration elements 100 are formed on the piezoelectric plate 200 formed. Therefore, a plurality of piezoelectric vibration elements 100 having the same frequency temperature characteristic can be formed.

また、本発明の実施形態における圧電ウエハ３００によれば、圧電板２００に形成された圧電振動素子１００は、例えば台座を備えた圧電振動素子１００が必要な場合は、第２割溝５０のところで折り取れば個片化できる。また、平板状の圧電振動素子１００が必要な場合は、第１割溝４０のところで折り取れば個片化できる等、一つの板状の圧電板２００に異なる２つの形状の圧電振動素子１００を複数個形成することができる。よって、本発明の実施形態における圧電ウエハ３００は、圧電振動素子１００の生産性を向上させることができる。   Further, according to the piezoelectric wafer 300 in the embodiment of the present invention, the piezoelectric vibration element 100 formed on the piezoelectric plate 200 is, for example, at the second split groove 50 when the piezoelectric vibration element 100 having a pedestal is required. If it is broken, it can be singulated. In addition, when the plate-like piezoelectric vibration element 100 is required, two different shapes of the piezoelectric vibration element 100 can be formed on one plate-like piezoelectric plate 200, for example, by being broken at the first dividing groove 40. A plurality can be formed. Therefore, the piezoelectric wafer 300 according to the embodiment of the present invention can improve the productivity of the piezoelectric vibration element 100.

次に、本発明の実施形態における圧電振動素子１００の製造方法について説明する。図４に示されているように、圧電振動素子１００の製造においては、結晶軸に対し所定の角度で切断された大判の水晶からなる板状の圧電板２００を準備する（Ｓ１）。次にフォトリソグラフィ技術とウエットエッチング技術により、板状の圧電板２００に圧電基板部１０，支持部２０ａ，２０ｂおよび台座部３０で構成された複数の圧電素子７０の外形と、貫通孔６０と、第１割溝４０と、第２割溝５０を同時に形成する（Ｓ２）。
次に、フォトリソグラフィ技術を用いて支持部２０ａおよび支持部２０ｂからそれぞれ圧電基板部１０に向かって設けられた傾斜と、所定の周波数が得られる厚さに圧電基板部１０を形成する（Ｓ３）。次に、圧電基板部１０に励振電極１１ａおよび励振電極１１ｂ，第1端子電極１２ａおよび第１端子電極１２ｂ，第２端子電極３１ａおよび第２端子電極３１ｂ、支持部２０ａと支持部２０ｂをそれぞれ覆う金属膜を形成する（Ｓ４）。最後に、個片化は、例えば台座を備えた圧電振動素子１００が必要な場合は、第２割溝５０のところで折り取れば個片化できる。また、平板状の圧電振動素子１００が必要な場合は、第１割溝４０のところで折り取れば個片化できる。このように、所望の形状に合わせて板状の圧電板２００からそれぞれ個片化する（Ｓ５）。このようにして、圧電振動素子１００を製造する。 Next, a method for manufacturing the piezoelectric vibration element 100 in the embodiment of the present invention will be described. As shown in FIG. 4, in the manufacture of the piezoelectric vibration element 100, a plate-like piezoelectric plate 200 made of a large crystal cut at a predetermined angle with respect to the crystal axis is prepared (S1). Next, by the photolithography technique and the wet etching technique, the outer shape of the plurality of piezoelectric elements 70 including the piezoelectric substrate portion 10, the support portions 20 a and 20 b, and the pedestal portion 30 on the plate-like piezoelectric plate 200, the through hole 60, The first split groove 40 and the second split groove 50 are formed simultaneously (S2).
Next, the piezo-electric substrate unit 10 is formed using a photolithography technique to have a slope provided from the support unit 20a and the support unit 20b toward the piezoelectric substrate unit 10 and to have a predetermined frequency (S3). . Next, the excitation electrode 11a and the excitation electrode 11b, the first terminal electrode 12a and the first terminal electrode 12b, the second terminal electrode 31a and the second terminal electrode 31b, the support part 20a and the support part 20b are respectively covered on the piezoelectric substrate part 10. A metal film is formed (S4). Finally, for example, when the piezoelectric vibration element 100 having a pedestal is required, the singulation can be performed by folding the second vibrating groove 50. Further, when the plate-like piezoelectric vibration element 100 is necessary, it can be separated into pieces by folding at the first dividing groove 40. In this way, the plate-like piezoelectric plate 200 is separated into individual pieces according to a desired shape (S5). In this way, the piezoelectric vibration element 100 is manufactured.

本発明の実施形態における圧電振動素子１００の製造方法によれば、圧電素子７０の外形と、貫通孔６０と、第１割溝４０と、第２割溝５０を同時に形成することができるので、効率よく圧電素子７０を製造することができる。また、各電極形成も容易にできるので効率よく圧電振動素子１００を製造することができる。   According to the method of manufacturing the piezoelectric vibration element 100 in the embodiment of the present invention, the outer shape of the piezoelectric element 70, the through hole 60, the first split groove 40, and the second split groove 50 can be formed simultaneously. The piezoelectric element 70 can be manufactured efficiently. Moreover, since each electrode can be formed easily, the piezoelectric vibration element 100 can be manufactured efficiently.

また、本発明の実施形態における圧電振動素子１００の製造方法によれば、二種類の圧電振動素子１００を選択することができる構成になっているので、圧電振動素子１００の搭載状況に応じて圧電振動素子１００の形状が選べることができる。よって、圧電デバイスの設計の自由度が増すこととなる。   In addition, according to the method for manufacturing the piezoelectric vibration element 100 in the embodiment of the present invention, since two types of piezoelectric vibration elements 100 can be selected, the piezoelectric vibration element 100 can be selected according to the mounting state of the piezoelectric vibration element 100. The shape of the vibration element 100 can be selected. Therefore, the degree of freedom in designing the piezoelectric device is increased.

また、図５および図６に示されているように、本発明の実施形態における圧電ウエハ３００は、圧電振動素子１００を圧電板２００に複数個形成することにより、圧電板２００に異なる形状にできる圧電振動素子１００を複数個形成することができる。よって、圧電振動素子１００の生産性が向上する。   As shown in FIGS. 5 and 6, the piezoelectric wafer 300 according to the embodiment of the present invention can be formed in different shapes on the piezoelectric plate 200 by forming a plurality of piezoelectric vibration elements 100 on the piezoelectric plate 200. A plurality of piezoelectric vibration elements 100 can be formed. Therefore, the productivity of the piezoelectric vibration element 100 is improved.

なお、本発明はこれに限定されず、適宜変更可能である。
例えば、図７に示されているように、本発明の実施形態の変形例として、支持部２０ａおよび支持部２０ｂが、側面視において圧電基板部１０と同じ厚さに形成されていてもよい。 In addition, this invention is not limited to this, It can change suitably.
For example, as shown in FIG. 7, as a modification of the embodiment of the present invention, the support portion 20a and the support portion 20b may be formed to have the same thickness as the piezoelectric substrate portion 10 in a side view.

また、例えば、図８に示されているように、本発明の実施形態の変形例として、支持部２０ａおよび支持部２０ｂが、側面視において圧電基板部１０と同じ厚さに形成されており、圧電基板部１０が、側面視において台座部３０の厚さ方向を二等分する位置に設けられていてもよい。   Further, for example, as shown in FIG. 8, as a modification of the embodiment of the present invention, the support portion 20a and the support portion 20b are formed to the same thickness as the piezoelectric substrate portion 10 in a side view, The piezoelectric substrate portion 10 may be provided at a position that bisects the thickness direction of the pedestal portion 30 in a side view.

１００ 圧電振動素子
１０ 圧電基板部
１１ａ、１１ｂ 励振電極
１２ａ、１２ｂ 第１端子電極
２０ａ、２０ｂ 支持部
３０ 台座部
３１ａ、３１ｂ 第２端子電極
４０ 第１割溝
５０ 第２割溝
６０ 貫通孔
７０ 圧電素子
２００ 圧電板
３００ 圧電ウエハ DESCRIPTION OF SYMBOLS 100 Piezoelectric vibration element 10 Piezoelectric board | substrate part 11a, 11b Excitation electrode 12a, 12b 1st terminal electrode 20a, 20b Support part 30 Base part 31a, 31b 2nd terminal electrode 40 1st dividing groove 50 2nd dividing groove 60 Through-hole 70 Piezoelectric Element 200 Piezoelectric plate 300 Piezoelectric wafer

Claims (3)

平板形状の圧電基板部と、
前記圧電基板部の一方の端部に設けられ、前記圧電基板部から離れるに従って厚さが増している支持部と、
前記圧電基板部に前記支持部を介して接続されており、前記圧電基板部より厚くかつ前記支持部の最も厚さが厚い部分と接続されている台座部と、
を有した圧電素子と、
前記圧電基板部に設けられた励振電極と、
前記圧電基板部の前記支持部が形成された端部に設けられており、前記励振電極と電気的に接続された第１端子電極と、
前記台座部に設けられており、前記第１端子電極と電気的に接続された第２端子電極と、
前記圧電基板部と前記支持部とが接する部分に設けられ、所定の深さだけ堀り下げて略Ｖ字状の断面を形成した第１割溝と、
を備えていることを特徴とする圧電振動素子。 A plate-shaped piezoelectric substrate portion;
A support portion provided at one end of the piezoelectric substrate portion, the thickness of which increases as the distance from the piezoelectric substrate portion increases;
A pedestal connected to the piezoelectric substrate through the support, connected to a portion thicker than the piezoelectric substrate and thickest of the support;
A piezoelectric element having
An excitation electrode provided on the piezoelectric substrate portion;
A first terminal electrode provided at an end portion of the piezoelectric substrate portion where the support portion is formed, and electrically connected to the excitation electrode;
A second terminal electrode provided on the pedestal portion and electrically connected to the first terminal electrode;
A first split groove provided at a portion where the piezoelectric substrate portion and the support portion are in contact with each other to form a substantially V-shaped cross section by drilling down to a predetermined depth;
A piezoelectric vibration element comprising: 請求項１に記載の圧電振動素子であって、
前記圧電基板部と前記台座部との間に形成されている前記支持部に、厚み方向に貫通している貫通孔が形成されている
ことを特徴とする圧電振動素子。 The piezoelectric vibration element according to claim 1,
A piezoelectric vibration element, wherein a through hole penetrating in a thickness direction is formed in the support portion formed between the piezoelectric substrate portion and the pedestal portion. 請求項１または請求項２に記載の圧電振動素子が板状の圧電板に複数設けられている圧電ウエハであって、
前記圧電振動素子の前記台座部が、前記圧電板に接続されており、
前記台座部と前記圧電板とのが接する部分に、所定の深さだけ掘り下げて略Ｖ字状の断面を形成した第２割溝が形成されている
ことを特徴とした圧電ウエハ。 A piezoelectric wafer in which a plurality of piezoelectric vibration elements according to claim 1 or 2 are provided on a plate-like piezoelectric plate,
The pedestal portion of the piezoelectric vibration element is connected to the piezoelectric plate;
A piezoelectric wafer, wherein a second split groove having a substantially V-shaped cross section formed by digging a predetermined depth is formed in a portion where the pedestal portion and the piezoelectric plate are in contact with each other.
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JP2002198772A (en) * 2000-12-27 2002-07-12 Toyo Commun Equip Co Ltd High frequency piezoelectric device
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