JP2016187885A - Method for producing cork, cork production device, and cork produced by the production method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a cork capable of suitably producing a buried cork without exposing an IC chip, a cork production device, and a cork produce by the production method.SOLUTION: Provided is a method for producing a cork 5 where a closed ring-shaped molding space 9 opening to one direction and also surrounded by a plurality of split type dies 14, 15, 14, 15 freely slidable to a direction orthogonal to the one direction is filled with a molding material 2 including cork grains and a binder resin, an IC chip 3 is arranged so as to be buried into the molding material, in a state where the opening of the molding space is closed, the plurality of split dies are slide to a direction in which the molding space is narrowed, and the molding material is subjected to compression molding into a columnar shape.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cork stopper manufacturing method, a cork stopper manufacturing apparatus, and a cork stopper manufactured by the manufacturing method.

Conventionally, cork stoppers have been frequently used from the viewpoint of hermeticity and texture as stoppers for closing the mouths of containers for storing beverages such as wine and various other items. In addition, a label on which information such as the name of the product, the type of the contained item, the production location, the production year, the producer, etc. is affixed to such a container, but from the viewpoint of the amount of information and information processing properties, etc. Further improvement was desired.
For example, Patent Document 1 below discloses a configuration in which an IC chip that stores various types of wine information such as a wine name and a country of production is installed on a cork stopper of a wine bottle.
Patent Document 2 below describes that a tag device that measures the temperature of the environment in which wine is placed may be provided inside the cork stopper of the bottle.

JP 2003-331186 A JP 2010-79559 A

However, in the device described in Patent Document 1, it is considered that the IC chip is dropped or damaged because the IC chip is exposed on the cork stopper.
Further, Patent Document 2 does not specifically disclose how the tag device can be provided inside the cork stopper, and further improvement is desired.

  The present invention has been made in view of the above circumstances, and a cork stopper manufacturing method, a cork stopper manufacturing apparatus, and a cork manufactured by the manufacturing method capable of suitably manufacturing an embedded cork stopper without exposing an IC chip. The purpose is to provide a stopper.

  In order to achieve the above object, a method for manufacturing a cork stopper according to the present invention includes a closed annular shape surrounded by a plurality of divided molds that open in one direction and are slidable in a direction perpendicular to the one direction. A molding material containing cork grains and a binder resin is loaded into the molding space, an IC chip is arranged so as to be embedded in the molding material, and the molding space is narrowed in a state in which the opening of the molding space is closed. The plurality of split molds are slid to compress the molding material into a columnar shape.

According to the present invention, a cork stopper can be manufactured by arranging an IC chip so as to be embedded in a molding material containing cork grains loaded in a molding space and a binder resin, and compression molding into a columnar shape. Can be embedded in the cork stopper without being exposed on the surface of the cork stopper. In addition, in an aspect in which a notch or the like is provided in a molded cork stopper to enclose an IC chip, it is conceivable that the notch mark is conspicuous, but the IC is formed without such a notch mark being formed. A cork stopper with an embedded chip can be manufactured.
In addition, with the closed annular molding space opening in one direction closed, a plurality of divided molds that are slidable in a direction orthogonal to one direction are slid in a direction to narrow the molding space, and the molding material is It is designed to be compression molded into a columnar shape. Accordingly, the columnar cork stopper is molded by being compressed in a direction substantially along the axial (centripetal) direction which is a direction orthogonal to the axial direction (longitudinal direction) of the columnar cork stopper. Thereby, for example, a cork stopper excellent in radial flexibility can be manufactured as compared with an aspect in which a cork stopper is manufactured by compressing along the axial direction. It is possible to embed relatively accurately in a desired position.

In the present invention, the IC chip may be placed in the molding material by passing through the cylindrical member with the tip of the cylindrical member inserted into the molding space.
According to the present invention, for example, when the molding material is loaded into the molding space, in a state in which the molding material is loaded to the middle of the molding space, the IC chip is dropped and supplied, for example. The IC chip can be embedded at a desired position more accurately. Further, for example, compared to a case where the IC chip is held at the tip of the rod-shaped member and the IC chip is disposed in the molding material, the IC chip is not exposed to the outside when the IC chip is supplied. Since it can arrange | position, the damage by the contact to the other member and molding material of an IC chip, etc. can be suppressed.

In the present invention, with the tip of the rod-shaped member holding the IC chip inserted in the molding space, the rod-shaped member is separated from the IC chip and the IC chip is arranged in the molding material. May be.
According to the present invention, as described above, when the molding material is loaded into the molding space, the IC chip is more accurately compared with an aspect in which the IC chip is arranged in a state where the molding material is loaded halfway through the molding space. Can be embedded at a desired position. Further, for example, the IC chip can be embedded more accurately at a desired position as compared with a case where the IC chip is disposed in the molding material by passing through the cylindrical member.

In the present invention, the IC chip may be arranged in the molding material so that the IC chip is embedded in an outer peripheral portion away from the central axis of the cork stopper.
ADVANTAGE OF THE INVENTION According to this invention, it can suppress that an IC chip interferes with the cork screw used in the case of plugging.

The cork stopper according to the present invention is manufactured by the method for manufacturing a cork stopper according to the present invention.
According to the present invention, since it is a cork stopper manufactured by the method for manufacturing a cork stopper according to the present invention, it has excellent radial flexibility, and various information can be stored or various information can be stored. Can be embedded without exposing a writable or readable IC chip.

In order to achieve the above object, the cork stopper manufacturing apparatus according to the present invention is formed so as to surround a closed annular molding space opened in one direction in which a molding material containing cork grains and a binder resin is loaded. And a plurality of split molds that are slidable in a direction orthogonal to the one direction are provided, and the plurality of split molds are slid in a direction to narrow the molding space in a state where the opening of the molding space is closed. A molding part for compressing and molding the molding material into a columnar shape and an IC chip embedding part for arranging an IC chip so as to be embedded in the molding material loaded in the molding space are provided.
According to the present invention, similarly to the above, a cork stopper embedded without exposing the IC chip can be suitably manufactured.

  The cork stopper manufacturing method and the cork stopper manufacturing apparatus according to the present invention can suitably manufacture an embedded cork stopper without exposing the IC chip by adopting the above-described configuration.

(A), (b) is a typical example of one step of a method for manufacturing a cork stopper according to an embodiment of the present invention that is executed using the cork stopper manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a partially broken schematic plan view with a part omitted. It is the partially broken schematic longitudinal cross-sectional view which abbreviate | omitted a part of the cork stopper manufacturing apparatus. (A), (b) is the partially broken schematic longitudinal cross-sectional view corresponding to FIG. 2 which shows typically an example of 1 process of the manufacturing method of the cork stopper, respectively. (A), (b) is the partially broken schematic longitudinal cross-sectional view corresponding to FIG. 2 which shows typically an example of 1 process of the manufacturing method of the cork stopper, respectively. (A), (b) is the partially broken schematic longitudinal cross-sectional view corresponding to FIG. 2 which shows typically an example of 1 process of the manufacturing method of the cork stopper, respectively. It is a partially broken schematic longitudinal cross-sectional view corresponding to FIG. 2 which shows typically an example of 1 process of the manufacturing method of the cork stopper. (A), (b) is a schematic longitudinal cross-sectional view which each shows typically an example of 1 process of the manufacturing method of the cork stopper, (c), (d) was manufactured by the manufacturing method of the cork stopper An example of the cork stopper which concerns on one Embodiment of this invention is shown typically, (c) is a schematic side view, (d) is a schematic plan view. (A), (b) is an example of one process of the manufacturing method of the cork stopper which concerns on other embodiment of this invention performed using the cork stopper manufacturing apparatus which concerns on other embodiment of this invention, and this It is a partially broken schematic longitudinal sectional view schematically showing and corresponding to FIGS. 3 (a) and 3 (b), respectively.

Embodiments of the present invention will be described below with reference to the drawings.
In some of the drawings, some of the detailed reference numerals attached to other drawings are omitted.
FIGS. 1 to 6 and FIGS. 7A and 7B are schematic diagrams illustrating an example of a cork stopper manufacturing apparatus according to the first embodiment and a cork stopper manufacturing method according to the first embodiment executed using the cork stopper manufacturing apparatus. FIG.

  As shown in FIGS. 1 and 4, the cork stopper manufacturing apparatus 1 according to the present embodiment is a closed annular molding space (cavity) opened in one direction in which a molding material 2 containing cork grains and a binder resin is loaded. 9 includes a molding part 10 provided with a plurality of divided dies 14, 15, 14, and 15 that are formed so as to surround 9 and are slidable in a direction orthogonal to one direction. The molding unit 10 is configured to compress the molding material 2 into a columnar shape by sliding the plurality of divided dies 14, 15, 14, 15 in a direction to narrow the molding space 9 with the opening of the molding space 9 closed. Has been. Further, as shown in FIG. 3, the cork stopper manufacturing apparatus 1 includes an IC chip embedding unit 30 that places the IC chip 3 so as to be embedded in the molding material 2 loaded in the molding space 9.

The molding part 10 opens upward as one direction which is the same direction as the opening direction of the molding space 9, and is provided with an accommodation space for slidably accommodating the plurality of divided dies 14, 15, 14, 15. A base 11, a split type drive unit 19 that slides these split molds 14, 15, 14, 15, and a lid 20 that closes an upper opening of the molding space 9 surrounded by the split molds 14, 15, 14, 15. And.
The molding base 11 includes a bottom portion 11a that is rectangular in plan view, and four side wall portions 11c, 11c, 11d, and 11d that are provided so as to rise from four sides of the bottom portion 11a. The accommodation space is divided. In the present embodiment, the columnar body 4 that is compression-molded on the bottom portion 11a is formed so that the columnar body 4 (see FIG. 7) that is compression-molded to become the cork stopper 5 can be extracted from the bottom side of the molding base 11. An insertion hole 11b into which the accommodating cylinder 24 is inserted is provided.

The cylindrical body 24 has a cylindrical shape that opens upward, and has an outer diameter substantially the same as the diameter of the insertion hole 11b. The cylindrical body 24 has an inner diameter substantially the same as the outer diameter of the columnar body 4, that is, the cork stopper 5. Further, the cylindrical body 24 is arranged so as to be coaxial with the narrow cylindrical forming space 9 formed by the plurality of split molds 14, 15, 14, 15. The cylindrical body 24 accommodates a disk-like body 25 that is slidable in the up-down direction, which is the axial direction.
The disc-like body 25 has an outer diameter that is substantially the same as the inner diameter of the cylindrical body 24, and is moved up and down in the cylindrical body 24 by a telescopic rod 26 a of a disc-like body driving unit 26 described later. Further, the disk-like body 25 has a configuration in which an upper surface is a flat surface and an engagement recess 25a (see FIG. 7A) for receiving the tip of the telescopic rod 26a is provided on the lower surface side.

Further, a rod insertion hole 24a (see FIG. 7A) for receiving the telescopic rod 26a is provided at the bottom of the cylindrical body 24. The rod insertion hole 24a has a smaller diameter than the outer diameter of the disc-like body 25 so that the disc-like body 25 can be prevented from coming off downward. The vertical dimension of the cylindrical body 24 is such that the columnar body 4 that becomes the single cork stopper 5 can be received in a state in which the disk-shaped body 25 is in contact with the bottom thereof. That is, the dimension along the axial direction from the upper surface of the disk-shaped body 25 that is in contact with the bottom of the cylindrical body 24 to the upper end surface of the cylindrical body 24 is the dimension along the axial direction of the columnar body 4, that is, the cork stopper 5. And approximately the same dimensions.
The upper end surface of the cylindrical body 24 and the upper surface of the disk-like body 25 are substantially flush with the upper surface of the bottom portion 11a of the molding base 11, as shown in FIGS. The bottom surface that forms the molding surface of the molding space 9 is formed together with the top surface of the bottom portion 11a.

The disk-shaped body driving unit 26 is provided on the lower side of the molding base 11. The disk-shaped body driving unit 26 is configured to include a mounting portion 26c on which the cylindrical body 24 is mounted at the tip of the cylindrical portion 26b that houses the telescopic rod 26a. In addition, the disk-shaped body driving unit 26 is configured to expand and contract the expansion / contraction rod 26a in the vertical direction, and the distal end portion of the expansion / contraction rod 26a is fitted into the engagement recess 25a of the disk-shaped body 25, so that the disk-shaped body 25 is configured to move up and down.
The disk-shaped body driving unit 26 can extend the telescopic rod 26a so that the upper surface of the disk-shaped body 25 is substantially flush with the upper surface of the bottom 11a of the molding base 11 (substantially the same plane). It is said that. In addition, as shown in FIG. 5A, the disc-like body driving unit 26 can retract the telescopic rod 26 a so that the disc-like body 25 comes into contact with the bottom of the cylindrical body 24. Further, as shown in FIG. 5B, the disk-shaped body drive unit 26 has an upper end surface that is a tip surface of the telescopic rod 26a substantially flush with the upper surface of the mounting portion 26c (substantially the same plane). Thus, the telescopic rod 26a can be degenerated.
The disk-shaped body driving unit 26 may be an air cylinder, a hydraulic cylinder, an electric cylinder, or the like, and is not limited to such a cylinder. An actuator may be used.

As shown in FIG. 1B, the plurality of divided dies 14, 15, 14, and 15 are molded in a cylindrical molding space 9 formed in a state of being slid in the direction of narrowing the molding space 9 (stenosis state). Cylinder inner peripheral surfaces 14d, 15d, 14d, and 15d are formed. The dimensions along the inner diameter and the axial direction of the cylindrical molding space 9 in which the divided molds 14, 15, 14, and 15 are formed in a constricted state are the dimensions along the outer diameter and the axial direction of the columnar body 4 that is compression-molded thereby. It becomes.
Moreover, these division | segmentation type | molds 14, 15, 14, and 15 are divided | segmented so that the cylindrical internal peripheral surfaces 14d, 15d, 14d, and 15d of the molding space 9 may be equally divided to the circumferential direction. In the present embodiment, the divided molds 14, 15, 14, 15 divided into four so as to divide the cylindrical inner peripheral surfaces 14 d, 15 d, 14 d, 15 d of the molding space 9 into four equal parts in the circumferential direction are formed in the molding part 10. The configuration is provided. Further, the split molds 14, 15, 14, 15 are slid along a facing direction of a pair of side wall portions (drive side wall portions) 11 c, 11 c facing each other of the molding base 11, 12 is provided. In addition, the slide molds 12 and 12 are each provided with a pair of split drive units 19 and 19 for sliding driving.

As shown in FIG. 1, the slide molds 12 and 12 have the same configuration. The slide blocks 13 and 13 provided on the drive side wall portions 11 c and 11 c side, and the slide blocks 13 and 13, respectively. 13 is provided with first split molds 14 and 14 fixedly provided at 13 and second split molds 15 and 15 movable with respect to the slide blocks 13 and 13, respectively.
The slide blocks 13 and 13 are placed on the bottom portion 11a of the molding base 11, and are slid on the bottom portion 11a along a pair of remaining side walls (guide side wall portions) 11d and 11d facing each other on the molding base 11. The Further, connecting rods 17a and 17a that are driven in the sliding direction by the split-type driving units 19 and 19 are connected to the driving side wall portions 11c and 11c of the slide blocks 13 and 13, respectively. The connecting rods 17a and 17a are provided so as to penetrate the driving side wall portions 11c and 11c in the sliding direction corresponding to the wall thickness direction. In the present embodiment, a plurality of (two in the illustrated example) connecting rods 17a, 17a, 17a, 17a are connected to the slide blocks 13, 13 at intervals in a direction along the opposing direction of the guide side wall portions 11d, 11d. The configuration is as follows. The connecting rods 17 a, 17 a, 17 a, and 17 a are connected to the drive plates 17 and 17 at the ends of the split drive units 19 and 19.

  The pair of split drive units 19 and 19 are provided with telescopic rods 19a and 19a that extend and contract in the sliding direction of the slide blocks 13 and 13, respectively. The distal ends of the telescopic rods 19a and 19a of the split drive units 19 and 19 are arranged close to the surfaces of the drive plates 17 and 17 facing the split drive units 19 and 19 side when the telescopic rods 19a and 19a are retracted. Or it is in contact. When the telescopic rods 19a and 19a of the split drive units 19 and 19 are extended, the drive plates 17 and 17 move to the side close to each other, and the slide blocks 13 and 13 slide to the side close to each other. In the present embodiment, the urging members 18 and 18 that urge the slide blocks 13 and 13 that have been slid toward the proximity side to slide toward the separation side are provided. In the illustrated example, the urging members 18 and 18 are compressed coil springs that are compressed between the drive side wall portions 11c and 11c and the drive plates 17 and 17 through the connecting rods 17a, 17a, 17a, and 17a. An example is shown. The urging members 18 and 18 are not limited to compression coil springs, and various other spring members such as a leaf spring can be employed. Furthermore, without providing the urging members 18 and 18, the telescopic rods 19 a and 19 a of the split drive units 19 and 19 are directly or indirectly connected to the slide blocks 13 and 13, and the split type is provided. It is good also as a structure which slides the slide blocks 13 and 13 slid to the proximity | contact side by retracting the expansion-contraction rods 19a and 19a of the drive parts 19 and 19. Further, the split-type drive units 19 and 19 may be various actuators similarly to the disk-like body drive unit 26 described above.

Moreover, the recessed part is provided in the opposing part of these slide blocks 13 and 13 so that it may open toward the mutually opposing direction. The concave portions of the slide blocks 13 and 13 are provided in a cutout shape over the entire vertical direction. Further, the concave portions of the slide blocks 13 and 13 intersect with each other so as to form a substantially square-shaped (rhombus-shaped) space in a plan view in a state where the slide blocks 13 and 13 are abutted and abutted with each other. The first wall surfaces 13a and 13a and the second wall surfaces 13b and 13b, which are defined as above, are respectively divided into V shapes in plan view. The first wall surfaces 13a and 13a and the second wall surfaces 13b and 13b of the slide blocks 13 and 13 are provided orthogonally so that the angle formed by each other is 90 °. Further, the corner of the recess of one slide block 13 (the corner between the first wall surface 13a and the second wall surface 13b) and the corner of the recess of the other slide block 13 (the first wall surface 13a and the second wall surface 13b). The slide blocks 13 and 13 are provided with recesses so that the corners of the slide blocks 13 and 13 coincide with each other when viewed in the slide direction.
Further, the first wall surfaces 13a, 13a of the slide blocks 13, 13 are arranged so as to face each other so as to form a pair of opposite sides in a plan view in a state where the slide blocks 13, 13 are in contact with each other. The Further, the second wall surfaces 13b, 13b of the slide blocks 13, 13 are arranged so as to face each other so as to form a pair of opposing sides in a plan view in a state where the slide blocks 13, 13 are in contact with each other. The

The first split molds 14 and 14 and the second split molds 15 and 15 are all the same size and shape, and are generally rectangular parallelepiped blocks.
The first split molds 14 and 14 are configured so that the first side surfaces 14a and 14a, which are one side surface of the long side in a plan view, are brought into contact with the first wall surfaces 13a and 13a of the slide blocks 13 and 13, respectively. 13 and 13 are fixed. The first split molds 14 and 14 have a first wall surface so that a space in which the second split molds 15 and 15 can be received is formed between the second wall surfaces 13 b and 13 b of the slide blocks 13 and 13. It is fixed to 13a, 13a. Further, the second side surfaces 14b and 14b as the surfaces (one side surface on the short side in plan view) facing the second wall surfaces 13b and 13b of the slide blocks 13 and 13 in the first split molds 14 and 14, The second wall surfaces 13b and 13b are parallel to each other.
Further, the third side surfaces 14c and 14c which are the other side surfaces of the long side in a plan view provided so as to oppose each other of the first split molds 14 and 14 are parallel to the first wall surfaces 13a and 13a. A flat curved surface having a quadrangular arc-shaped concave curved surface in a plan view is provided on one end portion side of the flat surface, and the concave curved surface constitutes cylindrical inner peripheral surfaces 14d and 14d. The cylindrical inner peripheral surfaces 14d and 14d of the first split molds 14 and 14 are provided so as to face each other. Moreover, a part of flat surface connected to the cylindrical inner peripheral surfaces 14d and 14d of the third side surfaces 14c and 14c constitutes a molding surface of the molding space 9 in a state (initial state) before being narrowed. In addition, these 1st division | segmentation type | molds 14 and 14 are good also as what was provided in each slide block 13 and 13 integrally.

The second split molds 15 and 15 each slide the first side surfaces 15a and 15a that are one side surface of the long side in a plan view and the third side surfaces 15c and 15c that are the other side surface of the long side in a plan view. The second wall surfaces 13b, 13b of the blocks 13, 13 and the second side surfaces 14b, 14b of the first split molds 14, 14 are brought into contact with or close to each other, and the second wall surfaces 13b, 13b and the first split of the slide blocks 13, 13 are brought into contact with each other. The molds 14 and 14 are slidable along the second side surfaces 14b and 14b. That is, the second split molds 15 and 15 are slidable in a direction (normal direction) perpendicular to the first wall surfaces 13 a and 13 a of the slide blocks 13 and 13. In addition, the second side surfaces 15b and 15b, which are one side surface of the second split molds 15 and 15 in a plan view, are adjacent to the front side of the first split molds 14 and 14, respectively. The third side surfaces 14c and 14c are in contact with the flat surfaces. Moreover, the surface (other side surface on the short side in plan view) of each slide block 13, 13 in the second split molds 15, 15 facing the first wall surface 13a, 13a side and the first wall surfaces 13a, 13a. There are provided biasing members 16, 16 such as compression coil springs for biasing the second split molds 15, 15 in directions in which they are separated from the first wall surfaces 13 a, 13 a.
Further, the third side surfaces 15c and 15c of the second split molds 15 and 15 provided so as to face each other are flat on one end side of a flat surface parallel to the second wall surfaces 13b and 13b, as described above. When viewed, the concave curved surfaces having a quadrangular arc shape are provided in a series, and the concave curved surfaces constitute the cylindrical inner peripheral surfaces 15d and 15d. The cylindrical inner peripheral surfaces 15d and 15d of the second split molds 15 and 15 are provided so as to face each other. Moreover, a part of flat surface connected to the cylindrical inner peripheral surfaces 15d and 15d of the third side surfaces 15c and 15c constitutes a molding surface of the molding space 9 in a state (initial state) before being narrowed.

With the above-described configuration, as shown in FIG. 1 (a), these split molds 14, 15, 14, and 15 have a substantially square shape in which the four corners are formed in a semicircular arc shape in a plan view in the initial state. A molding space 9 is defined.
Further, when the telescopic rods 19a, 19a of the split-type drive units 19, 19 are extended from this initial state and the slide blocks 13, 13 are slid toward each other, the second split molds 15, 15 are respectively connected. The slide blocks 13 and 13 slide to the side close to the first wall surfaces 13 a and 13 a against the bias of the biasing members 16 and 16. At this time, the cylindrical inner peripheral surfaces 14d and 14d of the first split molds 14 and 14 are close to each other, and the cylindrical inner peripheral surfaces 15d and 15d of the second split molds 15 and 15 are close to each other. At this time, the plurality of split molds 14 and 15 are applied to the molding material 2 loaded in the molding space 9 so that a substantially uniform compressive force is applied from the outer peripheral side in the axial direction over the entire circumferential direction. , 14, 15 are slid while being in sliding contact with each other. Thereby, as shown in FIG.1 (b), the molding space 9 is narrowed from an initial state, and becomes cylindrical shape (constriction state).
Further, when the telescopic rods 19a, 19a of the split drive units 19, 19 are retracted from this narrowed state, the slide blocks 13, 13 slide to the side away from each other. Thereby, each 2nd division | segmentation type | mold 15,15 is urged | biased by each urging | biasing member 16,16, and slides to the side spaced apart from 1st wall surface 13a, 13a of each slide block 13,13, The said initial state and Become. In addition, you may make it set the internal peripheral dimension of the shaping | molding space 9 in an initial state suitably according to the compression rate (compression degree) etc. which the cork stopper 5 desires. In the above example, the first divided molds 14 and 14 are fixedly provided to the slide blocks 13 and 13, but the first wall surfaces 13a and 13a of the slide blocks 13 and 13 are shown. It is good also as what was made slidable along 13a. In this case, an appropriate urging member may be provided for urging each of the first split molds 14 and 14 in the direction of approaching the second wall surfaces 13b and 13b opposed to the second side surfaces 14b and 14b. Good.

As shown in FIG. 4 (a), the lid 20 has a lower surface in contact with the upper surfaces of the divided dies 14, 15, 14, 15 around the molding space 9 in the initial state, and the upper opening of the molding space 9 is opened. It is configured to close. That is, the lower surface of the lid 20 constitutes a molding surface that defines the upper side of the molding space 9. In addition, you may make it provide the cover body drive part which moves this cover body 20 to an up-down direction, and opens and closes the upper opening of the shaping | molding space 9, for example.
In the present embodiment, as shown in FIGS. 4B and 5A, the lid body 20 includes the lid body portion 21 and the compression-molded columnar body 4 from the molding space 9 as described above. An extrusion rod 23 that pushes downward so as to be pushed in is provided. Further, the lower surface of the lid main body 21 and the lower surface of the extrusion rod 23 constitute a molding surface that defines the upper side of the molding space 9. The lid body 21 is provided with a rod insertion hole 22 through which the push rod 23 is inserted. The rod insertion hole 22 and the extrusion rod 23 are arranged so as to be coaxial with the cylindrical body 24 in a state where the lid 20 closes the upper opening of the molding space 9. Further, the inner diameter of the rod insertion hole 22 and the outer diameter of the push rod 23 are substantially the same diameter, and are substantially the same as the inner diameter of the cylindrical body 24.

Although not shown, the push rod 23 is configured to be expanded and contracted in the vertical direction by an appropriate drive unit (actuator) similar to the above.
As shown in FIG. 4, when the plurality of split dies 14, 15, 14, 15 are slid, the push rod 23 has a lower surface that is the tip surface substantially the same as the lower surface of the lid body 21 of the lid body 20. It is made into a degenerated state so that it may become flush. The extrusion rod 23 has a lower surface substantially equal to the upper surface of the bottom portion 11a of the molding base 11 as shown in FIG. Then, it is extended downward so as to be in an extended state. At this time, the telescopic rod 26a of the disk-shaped body drive unit 26 is contracted so as to be interlocked with the extension of the push rod 23, the disk-shaped body 25 in the cylindrical body 24 moves downward, and the columnar body 4 is moved downward. The cylinder 24 is accommodated.

In the present embodiment, the upper opening of the cylindrical body 24 in which the columnar body 4 is housed in this way is closed by the lid member 7. Further, a mechanism for closing the upper opening of the cylindrical body 24 by relatively moving the lid member 7 and the cylindrical body 24 is provided.
In the illustrated example, an up / down transfer unit 27 that moves a disk-like body drive unit 26 on which the cylinder 24 is placed on the upper end portion downward, and a cylinder 24 that is transferred downward by the up / down transfer unit 27. And a horizontal transfer unit 29 for moving the slab in the horizontal direction.
The up / down transfer unit 27 is provided on the lower side of the transfer base 28 provided at an interval on the lower side of the molding base 11. The up / down transfer unit 27 includes a telescopic rod 27a that connects the disc-like body driving unit 26 to the tip and extends and contracts in the vertical direction. As shown in FIG. 2, the vertical transfer portion 27 has a telescopic rod 27a so that the upper end surface of the cylindrical body 24 and the upper surface of the bottom portion 11a of the molding base 11 are substantially flush with each other. Can be extended. In addition, as shown in FIGS. 5B and 6, the upper and lower transfer unit 27 is substantially flush with the upper surface of the mounting portion 26 c of the disk-shaped body driving unit 26 and the upper surface of the transfer base 28 ( The telescopic rod 27a can be degenerated so as to be substantially in the same plane). The contraction of the telescopic rod 27a may be performed in conjunction with the extension of the push rod 23.

The horizontal transfer unit 29 includes an extendable rod 29a that extends and contracts in the horizontal direction on the transfer base 28. The distal end of the telescopic rod 29a is provided with a notch-like recess for receiving the cylinder 24, and the cylinder 24 is slid on the transfer base 28 in a state where the cylinder 24 is received in the recess. It is set as the structure moved to a horizontal direction front side.
As shown in FIG. 6, the lid member 7 includes an upper piece 7 a disposed so as to close the upper opening of the cylinder 24, a lower piece 7 b on which the cylinder 24 is placed, and the upper pieces It is a substantially C-shaped material (channel material) -like member having a connecting piece portion for connecting 7a and the lower piece portion 7b. The lid member 7 is arranged on the front side in the extension direction of the telescopic rod 29a of the horizontal transfer portion 29 so that the upper surface of the lower piece portion 7b is substantially flush with the upper surface of the transfer base 28 (substantially the same plane). Has been.
As described above, the cylindrical body 24 transferred to the lower side by the vertical transfer part 27 is accommodated between the upper piece 7a and the lower piece 7b of the lid member 7 by extending the telescopic rod 29a of the horizontal transfer part 29. To be transported.
The vertical transfer unit 27 and the horizontal transfer unit 29 may be various actuators similar to those described above.
The lid member 7 may have a long shape that can accommodate a plurality of cylindrical bodies 24. In this case, a mechanism for moving the lid member 7 in the horizontal direction substantially orthogonal to the transfer direction of the horizontal transfer unit 29 is further provided, and the lid member 7 can be moved sequentially to accommodate a plurality of cylinders 24 in the lid member 7. The configuration may be as follows.

As shown in FIGS. 1A and 2, the IC chip embedding part 30 is a cylindrical member 30 in which the tip part is inserted into the molding space 9 in this embodiment.
The cylindrical member 30 is formed in an elongated rod shape, and has a configuration in which a hollow portion 31 through which an IC chip (integrated circuit) 3 passes is provided over the entire longitudinal direction. In the present embodiment, the cross-sectional shape perpendicular to the longitudinal direction of the hollow portion 31 is a flat rectangular shape so that the IC chip 3 having a rectangular thin flat plate shape can be inserted. The cylindrical member 30 is not limited to such a rectangular cylindrical shape, and may be other polygonal cylindrical shapes, cylindrical shapes, or the like.
Further, in the present embodiment, when the IC chip 3 is arranged in the molding material 2, the tip of the cylindrical member 30 is embedded so that the IC chip 3 is embedded in the outer peripheral portion away from the central axis of the cork stopper 5. It is set as the structure by which a part is located in the outer peripheral side site | part of the molding space 9 of an initial state. Further, in the illustrated example, when the IC chip 3 is disposed in the molding material 2, the distal end portion of the cylindrical member 30 is in an initial state so that the IC chip 3 is embedded in the upper end portion of the cork stopper 5. An example of positioning at the upper end side portion of the molding space 9 is shown. Further, in the illustrated example, when the IC chip 3 is arranged in the molding material 2, an example is shown in which the cylindrical member 30 is arranged in an oblique manner in contact with the outer periphery of the upper end of the molding space 9. You may make it arrange | position along the longitudinal direction (vertical direction) of the longitudinal direction of the shaped member 30. FIG.
The cork stopper manufacturing apparatus 1 may be provided with a chip supply unit that supplies the IC chip 3 to the cylindrical member 30.
Further, the cork stopper manufacturing apparatus 1 may be provided with a mechanism for moving the tubular member 30.

  Further, the IC chip 3 may be configured to store various types of information or write and read various types of information. As such an IC chip 3, it is possible to adopt a known chip on which various electronic devices such as a CPU, various memories, and a communication unit are mounted. Further, the information stored in the IC chip 3 may be information such as a product name, the type and production location of a stored item, a production year, a producer, a seller, and an importer. The information stored in the IC chip 3 includes, for example, the name and type of wine (red, white, rose, etc.) when the container sealed by the manufactured cork stopper 5 is a wine bottle. , Taste, fragrance, hue, maturity period, temperature when drinking, etc. Also, it may be the harvest location, year, variety, quality, etc. of the grapes that are the raw materials, and the name and type of the dish that matches the wine It is good also as various other information. Moreover, it is good also as an ID code defined for every accommodation etc. instead of the aspect which stores such various information in the IC chip 3. FIG. In this case, the ID code stored in the IC chip 3 may be appropriately read, and various information stored in association with the ID code may be searched from the database. Such various information and ID codes stored in the IC chip 3 may be written before the cork stopper 5 is manufactured, or may be written after the cork stopper 5 is manufactured.

Although not shown, the cork stopper manufacturing apparatus 1 is provided with a control panel having a supply part for supplying the molding material 2 and a control part for controlling each part in the molding space 9 in the initial state. ing.
As such a supply unit, a hopper for storing the molding material 2 in which a binder resin is added to cork grains, and a supply feeder that is provided on the lower end side of the hopper and quantitatively supplies the molding material 2 are provided. It may be a thing. Further, the molding material 2 may be obtained by mixing the cork grains and the binder resin with a mixer such as an appropriate mixing drum, or spraying a liquid binder resin on the cork grains to be conveyed. It is good also as what added binder resin. The binder resin may be a thermoplastic resin, a thermosetting resin, or an elastomer, and may be suitable for contact with beverages and foods.
In addition, the control panel includes a control unit including a CPU, a display operation unit for setting, inputting, and displaying various settings, setting conditions input and set by operation of the display operation unit, A storage unit for storing input values, various programs, and the like may be provided. Each unit may be controlled by this control unit, and a cork stopper manufacturing method according to this embodiment, which will be described later, may be executed.

Next, an example of the manufacturing method of the cork stopper which concerns on this embodiment using the cork stopper manufacturing apparatus 1 set as the said structure is demonstrated.
The method for manufacturing a cork stopper according to the present embodiment is a closed ring molding surrounded by a plurality of divided dies 14, 15, 14, 15 that are open in one direction and slidable in a direction orthogonal to one direction. The space 9 is provided with a material loading step for loading a molding material 2 containing cork grains and a binder resin. In addition, the cork stopper manufacturing method includes an IC chip placement step of placing the IC chip 3 so as to be embedded in the molding material 2. The cork stopper is produced by compressing the molding material 2 into a columnar shape by sliding a plurality of divided dies 14, 15, 14, 15 in the direction of narrowing the molding space 9 with the opening of the molding space 9 closed. A compression step is provided. Moreover, the manufacturing method of a cork stopper is equipped with the heating process which heats and hardens binder resin in the state which shape | molded the columnar body 4 compression-molded. Further, the cork stopper manufacturing method includes a finishing process step in which the columnar body 4 is subjected to an appropriate finishing process to obtain the cork stopper 5.

First, as shown in FIG. 1A and FIG. 2, the slide blocks 13 and 13 are separated from each other, and the divided dies 14, 15, 14, and 15 are set to the initial state described above.
Moreover, the front-end | tip part of the cylindrical member 30 is positioned in the molding space 9 of this initial state.
Then, as shown in FIG. 3A, the molding material 2 is loaded into the molding space 9 in the initial state. In other words, in the present embodiment, before the molding material 2 is loaded into the molding space 9, the distal end portion of the cylindrical member 30 is inserted into the molding space 9. With the tip of the cylindrical member 30 inserted in the molding space 9 in this way, the IC chip 3 is placed in the molding material 2 by passing through the cylindrical member 30, and the cylindrical member 30 is extracted. Separated from the space 9 (see FIG. 3B).
In the example of the figure, in the material loading process, the molding material 2 is loaded up to a height (level) in the vicinity of the opening edge of the molding space 9 so as to substantially fill the molding space 9 in the initial state. It is not restricted to such an aspect. The loading height (loading level) of the molding material 2 with respect to the molding space 9 in the initial state is such that the IC chip 3 is disposed at a desired position after compression molding, and the columnar body 4 after compression molding is desired. You may make it set suitably so that it may become a compression rate. Preferably, the loading level may be a level that is 2/3 or higher of the molding space 9 in the initial state, and more preferably a level that is 3/4 or higher.

  Then, as shown in FIGS. 4A and 4B, the slide blocks 13 and 13 are brought close to each other in a state where the upper opening of the molding space 9 is closed by the lid 20 (the lid body 21 and the extrusion rod 23). The split molds 14, 15, 14, 15 are brought into the constricted state as described above so as to be slid to the side so as to narrow the molding space 9, and the molding material 2 is compressed into a columnar body 4. Thus, when compressing the molding material 2, a substantially uniform compressive force is applied in the axial direction of the columnar body 4 by the plurality of split dies 14, 15, 14, 15. There is almost no movement of the arranged IC chip 3 in the vertical direction. The ratio of the dimension along the radial direction from the axis of the molding material 2 before compression to the IC chip 3 and the dimension along the radial direction from the IC chip 3 to the inner peripheral surface of the molding space 9 is generally maintained. Thus, the IC chip 3 is embedded in the outer peripheral side portion of the columnar body 4. The IC chip 3 is arranged in the IC chip arrangement process so that the position of the IC chip 3 in the radial direction of the columnar body 4 (cork stopper 5) is outside the outer diameter (diameter) of a general cork screw. It may be. For example, when the outer diameter of the cork screw is about 10 mm, the IC chip 3 is arranged in the IC chip arrangement process so that the IC chip 3 is arranged at a position more than 5 mm away from the central axis of the columnar body 4 (cork stopper 5). May be arranged.

Next, as shown in FIG. 5A, the push rod 23 is extended, the telescopic rod 26 a is retracted, and the columnar body 4 is accommodated in the cylindrical body 24. Further, as shown in FIGS. 5B and 6, the cylindrical body 24 in which the columnar body 4 is accommodated is transferred to the lower side, moved in the horizontal direction, and accommodated in the lid member 7 to be accommodated in the columnar body 4. Keep the shape.
Then, with the columnar body 4 held in this manner, as shown in FIG. 7A, heating is performed in an appropriate heater 8 to cure the binder resin and fix the cork grains. As a heating method of such a heater 8, various heating methods such as a radiation method and an electromagnetic induction method may be adopted.
And the cover member 7 is taken out from the heater 8, and the cylinder 24 is taken out from the cover member 7 as shown in FIG.7 (b). Then, for example, the disk-shaped body 25 is moved so as to be pushed up to the opening side of the cylindrical body 24, and the columnar body 4 is taken out from the cylindrical body 24. As shown in FIGS. A finishing process is performed to obtain a cork stopper 5. In the example of the figure, an example in which C chamfered chamfered portions 6 and 6 are provided at the peripheral edge portions of both ends in the axial direction of the cork stopper 5, but R chamfered chamfered portions 6 and 6 are provided. Further, such chamfered portions 6 and 6 may not be provided. Moreover, you may make it provide the resin-made holding part made larger diameter than the cork stopper 5, for example in the axial direction one end part of the cork stopper 5 manufactured in this way. A synthetic resin coating layer may be provided so as to cover the entire exposed outer surface.

  The cork stopper 5 manufactured by the cork stopper manufacturing method and the cork stopper manufacturing apparatus 1 according to the present embodiment has excellent radial flexibility, and has excellent followability to the container mouth and sealing performance. Next. Further, it can be embedded without exposing the IC chip 3 in which various information is stored or various information can be written or read.

Moreover, the cork stopper manufacturing method and the cork stopper manufacturing apparatus 1 according to the present embodiment can suitably manufacture the cork stopper 5 embedded without exposing the IC chip 3 by adopting the above-described configuration. it can.
That is, the IC chip 3 can be arranged so as to be embedded in the molding material 2 loaded in the molding space 9 and can be compression-molded into a columnar shape to manufacture the cork stopper 5, so that the IC chip 3 is placed on the surface of the cork stopper 5. It can be embedded in the cork stopper 5 without being exposed. Further, for example, in a mode in which a notch or the like is provided in the cork stopper 5 after molding and the IC chip 3 is enclosed, the notch mark may be conspicuous. However, such a notch mark is formed. The cork stopper 5 in which the IC chip 3 is embedded can be manufactured without any problems.

In addition, with the opening of the molding space 9 closed, the plurality of split molds 14, 15, 14, 15 are slid in the direction of narrowing the molding space 9, and the molding material 2 is compression-molded into a columnar shape. Therefore, it is compressed and molded in a direction substantially along the axial direction, which is a direction orthogonal to the axial direction of the columnar cork stopper 5. Thereby, compared with the aspect which manufactures a cork stopper by compressing along an axial direction, for example, the cork stopper 5 excellent in the flexibility in the radial direction can be manufactured. It can be embedded relatively accurately at a desired position in the axial direction.
Moreover, in this embodiment, since the molding space 9 corresponds to the single cork stopper 5, the IC chip 3 can be embedded at a desired position more accurately.

In the present embodiment, the IC chip 3 is arranged in the molding material 2 by passing through the cylindrical member 30 in a state where the tip of the cylindrical member 30 is inserted into the molding space 9. Therefore, for example, when the molding material 2 is loaded into the molding space 9, the IC chip 3 is dropped and supplied in a state where the molding material 2 is loaded halfway through the molding space 9, for example. The IC chip 3 can be embedded at a desired position more accurately. Further, for example, the IC chip 3 is supplied as compared with the case where the IC chip 3 is held in the tip portion of the rod-like member as described in the second embodiment and the IC chip 3 is arranged in the molding material 2. Since it can arrange | position in the molding material 2 without exposing outside when doing, the damage by the contact to the other member of IC chip 3, the molding material 2, etc. can be suppressed.
Further, in the present embodiment, before the molding material 2 is loaded into the molding space 9, the distal end portion of the cylindrical member 30 is inserted into the molding space 9. In other words, the molding material 2 is loaded into the molding space 9 with the distal end portion of the cylindrical member 30 inserted into the molding space 9. Therefore, for example, compared with a case where the cylindrical member 30 is inserted after the molding material 2 is loaded into the molding space 9, the penetration of the molding material 2 into the cylindrical member 30 can be suppressed. . Instead of such a mode, the cylindrical member 30 may be inserted after the molding material 2 is loaded into the molding space 9.

  Further, in the present embodiment, the IC chip 3 is embedded in an outer peripheral portion (for example, a position outside the outer peripheral diameter of a general cork screw as described above) away from the central axis of the cork stopper 5. Thus, the IC chip 3 is arranged in the molding material 2. Therefore, it is possible to suppress the IC chip 3 from interfering with the cork screw used for plugging. Instead of such a mode, the IC chip 3 may be arranged in the molding material 2 so that the IC chip 3 is embedded in the vicinity of the central axis of the cork stopper 5.

Next, another embodiment of the cork stopper manufacturing method and cork stopper manufacturing apparatus according to the present invention will be described with reference to the drawings.
FIG. 8 is a diagram schematically illustrating an example of a cork stopper manufacturing apparatus according to the second embodiment and a cork stopper manufacturing method according to the second embodiment executed using the cork stopper manufacturing apparatus.
Note that differences from the first embodiment will be mainly described, and the same components will be denoted by the same reference numerals, and description thereof will be omitted or simplified. Also, the description of the same steps as those in the first embodiment will be omitted or briefly described.

The cork stopper manufacturing apparatus 1A according to the present embodiment is mainly different from the first embodiment in the configuration of the IC chip embedding part 30A.
In the present embodiment, the IC chip embedded portion 30A is a rod-shaped member 30A that can hold the IC chip 3 at the tip as shown in FIG. In addition, a grip portion 32 that grips the IC chip 3 so as to grip the IC chip 3 is provided at the tip of the rod-shaped member 30A. The grip portion 32 has a plurality of wire-like claw portions whose front end sides are contacted and separated, and the IC chip 3 can be gripped by bringing the front end sides of the claw portions close to each other. By separating the sides, the grasped IC chip 3 can be detached.
Further, in the present embodiment, in a state where the tip end portion of the rod-shaped member 30A holding the IC chip 3 on the gripping portion 32 is inserted into the molding space 9, the tip end side of the gripping portion 32 is separated and the rod shape is separated from the IC chip 3. The IC chip 3 is arranged in the molding material 2 with the member 30 </ b> A (gripping part 32) separated. In the present embodiment, the tip portion of the rod-shaped member 30A holding the IC chip 3 in the gripping portion 32 is inserted into the molding space 9 with the molding material 2 loaded in the molding space 9 in the initial state. . Instead of such an aspect, the tip of the rod-shaped member 30A holding the IC chip 3 may be inserted into the molding space 9 before the molding material 2 is loaded into the molding space 9.

The cork stopper manufacturing method and the cork stopper manufacturing apparatus 1A according to the present embodiment also have substantially the same effects as those of the first embodiment.
In the present embodiment, the IC chip 3 is arranged in the molding material 2 by separating the bar member 30A from the IC chip 3 with the tip of the bar member 30A holding the IC chip 3 inserted in the molding space 9. It is configured to do. Therefore, as described above, when the molding material 2 is loaded into the molding space 9, the IC chip 3 is compared with the mode in which the IC chip 3 is disposed with the molding material 2 being loaded halfway through the molding space 9. It can be embedded at a desired position more accurately.
In addition, for example, the IC chip 3 can be placed at a desired position more accurately as compared with the case where the IC chip 3 is disposed in the molding material 2 by passing through the cylindrical member as in the first embodiment. Can be buried.

In addition, in this embodiment, it is set as the structure which provided the holding part 32 which hold | grips so that the IC chip 3 may be grasped in the front-end | tip part of 30 A of rod-shaped members, However, It is not restricted to such an aspect. For example, the rod-shaped member 30A may be a cylindrical member communicated with a vacuum generator, and the IC chip 3 may be held at the tip by suction by starting the vacuum generator.
Moreover, in each said embodiment, the example which was set as the structure which carried out the compression molding in the state spaced apart from the shaping | molding space 9 so that the member (cylindrical member 30 or rod-shaped member 30A) for arrange | positioning IC chip 3 may be extracted is shown. However, it is not limited to such a mode. For example, it is good also as an aspect which extracts the member for arrange | positioning the IC chip 3 after compression molding. In this case, for example, an aspect in which a member for placing the IC chip 3 is provided on the lower surface side of the lid 20 so as to be suspended. In this case, the member that suspends and holds the IC chip 3 may be flexible so that it can follow when it is compression-molded with a relatively small diameter.

In addition, the mode of disposing the IC chip 3 in the molding material 2 is not limited to the above-described mode. For example, the IC chip 3 is loaded in the state where the molding material 2 is loaded halfway through the molding space 9. It is good also as an aspect etc. which drop-feed and others, and various deformation | transformation are possible.
Moreover, as a mode in which the molding material 2 is compression-molded into a columnar shape by sliding the plurality of divided dies 14, 15, 14, 15 in the direction of narrowing the molding space 9 with the opening of the molding space 9 closed. It is not restricted to such an aspect, Various deformation | transformation are possible.
Moreover, in each said embodiment, although the method and apparatus 1 and 1A which manufacture the columnar cork stopper 5 are illustrated, it is good also as the method and apparatus 1 and 1A which manufacture a prismatic cork stopper. In this case, the plurality of split dies 14, 15, 14, 15 and the like of the molding unit 10 may be appropriately modified.

DESCRIPTION OF SYMBOLS 1,1A Cork stopper manufacturing apparatus 2 Molding material 3 IC chip 5 Cork stopper 9 Molding space 10 Molding part 14 1st division type 15 2nd division type 30 Cylindrical member (IC chip embedding part)
30A Bar-shaped member (IC chip embedded part)

Claims (6)

  A molding material containing cork grains and a binder resin is loaded into a closed annular molding space that is open in one direction and is slidable in a direction orthogonal to the one direction, and is surrounded by a plurality of divided molds. An IC chip is arranged so as to be embedded in the molding material, and the molding material is compressed into a columnar shape by sliding the plurality of divided molds in the direction of narrowing the molding space with the opening of the molding space closed. A method for producing a cork stopper. In claim 1,
A method for producing a cork stopper, wherein the IC chip is placed in the molding material by passing through the cylindrical member with the tip of the cylindrical member inserted into the molding space. In claim 1,
A cork stopper wherein the IC chip is disposed in the molding material by separating the bar member from the IC chip in a state where the tip of the bar member holding the IC chip is inserted into the molding space. Manufacturing method. In any one of Claims 1 thru | or 3,
A method of manufacturing a cork stopper, wherein the IC chip is disposed in the molding material so that the IC chip is embedded in an outer peripheral part away from a central axis of the cork stopper.   The cork stopper manufactured by the manufacturing method of the cork stopper of any one of Claims 1 thru | or 4. A plurality of divided molds are formed so as to surround a closed annular molding space that opens in one direction in which a molding material containing a cork grain and a binder resin is loaded, and is slidable in a direction perpendicular to the one direction. A molding part that is provided, and in a state where the opening of the molding space is closed, the plurality of divided molds are slid in a direction to narrow the molding space, and the molding material is compression-molded into a columnar shape;
An IC chip embedding part for arranging an IC chip so as to be embedded in the molding material loaded in the molding space;
A cork stopper manufacturing apparatus comprising:

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