JP2016186975A - Led module and led module manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module that prevents corrosion of the electrode of an LED chip and the electrode of a package substrate, and prevents disconnection of the connection portion between the electrode of the LED module and a wire and the connection portion between the electrode of the package substrate and a wire.SOLUTION: In an LED module in which an LED chip 2 is mounted on an electrode 5 of a package substrate 1, an electrode of the LED chip 2 and the electrode 5 of the package substrate 1 are electrically connected to each other by a wire 6, a reflector 4 is arranged around the LED chip 2, and the LED chip 2, the inner circumferential surface of the reflector 4, the electrode 5 of the package substrate 1, and the wire 6 are filled with a sealing resin 3, the same kind of inorganic insulation membranes 7 are integrally formed at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED module that suppresses intrusion of air and moisture into a wire breakage and sealing resin, and a manufacturing method thereof.

  Conventionally, LED modules in which LED chips are sealed with resin have been widely used as lighting fixtures. The general structure of the LED module is that the LED chip 2 is mounted on the electrode 5 of the package substrate 1 as shown in the cross-sectional view of FIG. 2, and the electrode 6 of the LED chip 2 and the electrode 5 of the package substrate 1 are connected to the wire 6. And a reflector 4 that reflects light around the LED chip 2 is arranged, and the inner peripheral surface of the reflector 4, the wire 6, the LED chip 2, and the recessed space composed of the electrode 5 of the package substrate 1 are arranged. The sealing resin 3 made of silicone resin is filled and sealed from the atmosphere.

  The LED chip 2 is repeatedly heated and cooled by turning on and off, and the linear expansion coefficient of each material such as the package substrate 1, the reflector 4, the wire 6, and the LED chip 2 due to thermal expansion and contraction at that time. There is a problem in that the stress due to the difference between the electrodes and the electrode of the LED chip 2 that is weakly connected or the connection part between the electrode 5 of the package substrate 1 and the wire 6 is disconnected and the LED chip 2 does not light.

  In addition, the adhesion between the sealing resin 3 made of silicone resin and the reflector 4 made of ceramic is weak, and the sealing resin 3 peels off due to expansion and contraction caused by turning on and off of the LED chip 2, thereby creating a gap. There arises a problem that air and moisture enter from there and the electrodes of the LED chip 2 and the electrodes 5 of the package substrate 1 corrode.

  Patent Document 1 (Japanese Patent Laid-Open No. 2011-134786) describes a configuration in which an inorganic insulating layer is formed on the inner peripheral surface of a substrate in order to prevent corrosion of a reflector made of silver.

  However, although the thing of patent document 1 can prevent corrosion since the inorganic insulating layer is formed in the reflector, since the inorganic insulating layer is not formed in the surface of the electrode of a LED chip, or the electrode of a package board | substrate. The corrosion of the electrode of the LED chip and the electrode of the package substrate cannot be prevented. In addition, disconnection of the connection portion between the electrode of the LED chip or the electrode of the package substrate and the wire cannot be prevented.

  Patent Document 1: Japanese Patent Application Laid-Open No. 2011-134786

  It is an object of the present invention to prevent corrosion of an electrode of an LED chip and an electrode of a package substrate, and to prevent disconnection of a connection portion between the electrode of the LED chip and a wire and a connection portion of the electrode of the package substrate and the wire. To do.

  In order to solve the above-described problem, the present invention provides an LED chip mounted on an electrode of a package substrate, and the electrode of the LED chip and the electrode of the package substrate are electrically connected by a wire, A reflector is disposed, the LED chip, an inner peripheral surface of the reflector, an electrode of the package substrate, and an LED module in which the wire is filled with a sealing resin, a boundary between the sealing resin and the reflector, An LED module, wherein an inorganic insulating film of the same type is integrally formed at a boundary between the sealing resin and the LED chip and a boundary between the sealing resin and the electrode of the package substrate. It is to provide.

  With this configuration, it is possible to prevent corrosion of the electrode of the LED chip and the electrode of the package substrate by preventing the formation of a gap between the sealing resin and the reflector and preventing air and moisture from entering. In addition, the bonding portion between the LED chip electrode and the wire and the bonding portion between the package substrate electrode and the wire are held by the inorganic insulating film. The disconnection of the connection part between the electrode of the substrate and the wire can be prevented.

  The inorganic insulating film may be a Si-based film.

  With this configuration, adhesion with a sealing resin made of a silicone resin is improved.

  The Si-based film may be a film made of a SiCN film.

  With this configuration, adhesion with a sealing resin made of a silicone resin is improved.

  The inorganic insulating film may have a structure in which a buffer layer and a barrier layer are stacked.

  With this configuration, the adhesion with the sealing resin made of a silicone resin is improved, and the barrier property is improved to further prevent the intrusion of air and moisture.

Furthermore, the barrier layer may be composed of a SiO2 film or an AL2O3 film.

  With this configuration, the adhesion with the sealing resin made of a silicone resin is improved, the intrusion of air and moisture can be further prevented, and transparency can be ensured so that light can easily pass through.

  In order to solve the above problems, the present invention provides an LED chip mounted on an electrode of a package substrate, and the electrode of the LED chip and the electrode of the package substrate are electrically connected by a wire, A film forming step of integrally forming the same kind of inorganic insulating film on the LED chip, the inner peripheral surface of the reflector, and the electrode of the package substrate in which the reflector is disposed around the reflector, and the inorganic insulating film is formed. The LED chip, the inner peripheral surface of the reflector, and the electrode of the package substrate are filled with a sealing resin, and the inner peripheral surfaces of the LED chip, the wire, and the reflector are sealed with the sealing resin. The manufacturing method of the LED module characterized by providing the sealing process to stop is provided.

  By this manufacturing method, it is possible to prevent the formation of a gap between the sealing resin and the reflector and prevent the intrusion of air and moisture, thereby preventing the corrosion of the electrode of the LED chip and the electrode of the package substrate. In addition, the connection portion between the electrode of the LED chip and the wire and the connection portion between the electrode of the LED chip and the wire and the connection portion of the electrode of the package substrate and the wire are pressed by the inorganic insulating film, It is possible to manufacture an LED module that can prevent disconnection of the connection portion between the electrode of the package substrate and the wire.

  As described above, an LED chip is mounted on the electrode of the package substrate, the electrode of the LED chip and the electrode of the package substrate are electrically connected by a wire, a reflector is disposed around the LED chip, An LED module in which an LED chip, an inner peripheral surface of the reflector, an electrode of the package substrate, and the wire are sealed with a sealing resin, a boundary between the sealing resin and the reflector, and the sealing resin The LED module is characterized in that the same kind of inorganic insulating film is integrally formed at the boundary between the LED chip and the boundary between the sealing resin and the electrode of the package substrate. In addition to preventing corrosion of the electrode of the package substrate and the connection between the electrode of the LED chip and the wire and the electric power of the package substrate. And it is possible to prevent disconnection of the connection portion of the wire.

  The LED of the module in which an LED chip is mounted on the electrode of the package substrate, the electrode of the LED chip and the electrode of the package substrate are electrically connected by a wire, and a reflector is disposed around the LED chip A film forming step of integrally forming an inorganic insulating film of the same type on a chip, an inner peripheral surface of the reflector, and an electrode of the package substrate; an LED chip on which the inorganic insulating film is formed; an inner surface of the reflector A sealing process is provided in which a sealing resin is filled in the peripheral surface and the electrode of the package substrate, and the inner peripheral surface of the LED chip, the wire, and the reflector is sealed with the sealing resin. The LED module manufacturing method prevents the corrosion of the electrode of the LED chip and the electrode of the package substrate, and the electrode of the LED chip It is possible to manufacture an LED module capable of preventing the disconnection of the connection portion between the electrode and the wire connecting portion and the package substrate and wires.

The figure which shows the cross section of the LED module of this invention. The figure which shows the cross section of the conventional LED module.

(LED module)
A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a view showing a cross section of the LED module. The LED chip 2 is mounted on the electrode 5 of the package substrate 1, and the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 are electrically connected by a wire 6. In addition, a reflector 4 made of ceramic or the like is disposed around the LED chip 2 so that a part of the light emitted from the LED chip 2 is reflected and travels to the atmosphere, so that more light is emitted from the LED module. It is supposed to be.

The inner peripheral surface of the reflector 4, the surface of the LED chip 2, and the electrode 5 of the package substrate 1 are integrally covered with the same type of inorganic insulating film 7. An inorganic insulating film 7 is also formed on part or all of the wire 6. The inorganic insulating film 7 is also called a buffer layer, and is formed using SiCN. By forming the inorganic insulating film 7 made of SiCN, the adhesion with the sealing resin 3 made of silicone resin is improved.

  Note that the SiCN of the inorganic insulating film 7 may contain a small atomic% ratio of O that may be mixed in the manufacturing process. Specifically, the proportion of O is 10% or less.

  However, when a large amount of O is contained as in the case where SiO2 is formed as the inorganic insulating film 7, the electrode 5 of the package substrate and the electrode of the LED chip 2 may be oxidized.

  Here, being integrally covered means that it is entirely covered without a break, and thus, it is possible to prevent air and moisture from entering from a break or the like.

The thickness of the inorganic insulating film 7 may be about 1 μm, but may be greater than this or less than this.

The inorganic insulating film 7 is a buffer layer made of an inorganic material. Note that an inorganic substance is a substance excluding an organic substance, and specifically, a substance having no carbon skeleton. That is, the inorganic substance does not include synthetic / natural resins and other compounds having a carbon skeleton (including a hydrocarbon skeleton).

  The recess space where the inorganic insulating film 7 is formed is filled with a sealing resin 3 made of silicone resin, and the inner periphery of the LED chip 2, the electrode 5 of the package substrate 1, the wire 6, and the reflector 4. The surface is sealed from the atmosphere.

  That is, the same kind of inorganic insulating film 7 is integrally formed at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1. The film is formed.

  By forming the inorganic insulating film 7 at the boundary between the sealing resin 3 and the reflector 4, the adhesion between the sealing resin 3 and the reflector 4 is improved, and there is a gap between the sealing resin 3 and the reflector 4. By preventing the generation of air and moisture, the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 can be prevented from corroding.

  Further, the inorganic insulating film 7 is formed at the boundary between the sealing resin 3 and the LED chip 2 and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1, so that the electrode of the LED chip 2 and the wire 6 are formed. And the connection portion between the electrode 5 of the package substrate 1 and the wire 6 are held by the inorganic insulating film 7, and the connection portion between the electrode of the LED chip 2 and the wire 6 and the electrode 5 of the package substrate 1. And disconnection of the connecting portion between the wire 6 and the wire 6 can be prevented.

  Further, the same kind of inorganic insulating film 7 is integrated at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1. Since the film is formed in a film, there is no gap in the film, so that no gap is generated, and the intrusion of air and moisture can be prevented, and the electrode of the LED chip 2 or the electrode 5 of the package substrate 1 is prevented from corroding. it can.

(Production method)
Next, the manufacturing method of the LED module in Example 1 of this invention is demonstrated. As shown in FIG. 1, the LED chip 2 is mounted on the electrode 5 of the package substrate 1 having the reflector 4, and the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 are electrically connected by the wire 6. On the other hand, the film-forming process which forms the inorganic insulating film 7 in the recessed space of the internal peripheral surface of this module with a plasma CVD apparatus is implemented.

That is, the inner peripheral surface of the reflector 4, the surface of the LED chip 2, and the electrode 5 of the package substrate 1 are integrally formed with the same kind of inorganic insulating film 7. Further, the inorganic insulating film 7 may be formed on part or all of the wire 6. The inorganic insulating film 7 is formed using SiCN. The thickness of the inorganic insulating film 7 may be about 1 μm, but may be greater than this or less than this.

  In Example 1, a plasma CVD apparatus was used to form the inorganic insulating film 7 made of SiCN. However, the present invention is not necessarily limited to this, and the film can be formed using a sputtering apparatus, a vapor deposition apparatus, or the like. it can.

  Finally, a sealing process of filling the sealing resin 3 made of silicone resin into the recessed space of the module on which the inorganic insulating film 7 is formed is performed, so that the LED chip 2, the electrode 5 of the package substrate 1, the wire 6 and the inner peripheral surface of the reflector 4 are sealed from the atmosphere to complete the LED module.

  By this manufacturing method, it is possible to prevent the gap between the sealing resin 3 and the reflector 4 and prevent air and moisture from entering, thereby corroding the electrode of the LED chip 2 and the electrode 5 of the package substrate 1. In addition, the bonding portion between the electrode of the LED chip 2 and the wire 6 and the bonding portion between the electrode 5 of the package substrate 1 and the wire 6 are pressed by the inorganic insulating film 7. An LED module that can prevent disconnection of the connection portion between the wire 6 and the connection portion between the electrode 5 of the package substrate 1 and the wire 6 can be manufactured.

Further, the same kind of inorganic insulating film 7 is integrally formed at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1. By forming the film, the boundary between the films does not exist, so that no gaps are generated, the intrusion of air and moisture can be prevented, and the electrode of the LED chip 2 or the electrode 5 of the package substrate 1 is corroded. Can be completely prevented.

(LED module)
The LED module in Example 2 of the present invention is different from Example 1 in that the inorganic insulating film 7 has a laminated structure. That is, as shown in FIG. 1, the inner peripheral surface of the reflector 4, the surface of the LED chip 2, and the electrode 5 of the package substrate 1 are integrally covered with the same type of inorganic insulating film 7. The inorganic insulating film 7 has a laminated structure including a buffer layer made of an inorganic material and a barrier layer made of an inorganic material on the surface thereof. That is, the inorganic insulating film 7 is composed of two layers, a buffer layer made of the same kind of inorganic material and a barrier layer made of the same kind of inorganic substance.

  Here, the barrier layer is a layer having a higher density than the buffer layer. As a result, the adhesion is lower than that of the buffer layer, but the barrier property is improved as compared with the buffer layer. The barrier layer made of an inorganic material is specifically formed using SiO2, but is not necessarily limited thereto, and may be formed using Al2O3.

  The barrier layer needs to have high transparency in order to extract light in addition to adhesion and prevention of intrusion of air and moisture. Therefore, a highly transparent oxide film (SiO2, AL2O3) is preferable, and a silicone resin is used. Considering the adhesion with the sealing resin 3 made of SiO2, SiO2 is most preferable. However, a nitride film (SiN, SiON) may be used in the case where the thin film is used to reduce the influence on translucency.

  The buffer layer is an inorganic substance made of a material having a lower linear expansion coefficient than that of the sealing resin 3, although it has a lower barrier property than the barrier layer and has a higher adhesion than the barrier layer. Specifically, the buffer layer may be a silicon-based film containing H, C, N, and Si. More specifically, a SiCN film may be used, but the present invention is not necessarily limited thereto, and a SiN film or a SiON film may be used.

  In Example 2, the buffer layer made of an inorganic material and the barrier layer made of an inorganic material were formed one by one to form a two-layer inorganic insulating film 7, but the present invention is not limited to this. Alternatively, a plurality of buffer layers and barrier layers made of an inorganic material may be alternately stacked to form an inorganic insulating film 7 that is integrally covered. Thereby, adhesiveness and barrier property can further be improved.

  Moreover, being covered integrally is covering the whole without a cut | interruption, and it can prevent that air | atmosphere and a water | moisture content penetrate | invade from a cut | interruption etc. by this.

  The recessed space on the surface of the inorganic insulating film 7 having a laminated structure is filled with the sealing resin 3 made of silicone resin, and the LED chip and the like are sealed from the atmosphere.

  By laminating a barrier layer made of an inorganic material in addition to the buffer layer at the boundary between the sealing resin 3 and the reflector 4 to form the inorganic insulating film 7, the adhesion between the sealing resin 3 and the reflector 4 is improved. It is possible to prevent a gap from being formed between the sealing resin 3 and the reflector 4 and to further prevent corrosion of the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 by further preventing air and moisture from entering. it can.

Further, the inorganic insulating film 7 having a laminated structure is formed on the boundary between the sealing resin 3 and the LED chip 2 and on the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1, whereby the electrode of the LED chip 2 is formed. And the bonding portion of the wire 6 and the bonding portion of the electrode 5 of the package substrate 1 and the wire 6 are held by the inorganic insulating film 7, and the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 and the wire 6 Disconnection of the connecting portion can be further prevented.

Further, the same kind of inorganic insulating film 7 is integrated at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1. Since the film is formed in a film, there is no gap in the film, so that no gap is generated, and the intrusion of air and moisture can be prevented, and the electrode of the LED chip 2 or the electrode 5 of the package substrate 1 is prevented from corroding. it can.

(Production method)
Next, the manufacturing method of the LED module in Example 2 of this invention is demonstrated. As shown in FIG. 1, the LED chip 2 is mounted on the electrode 5 of the package substrate 1 having the reflector 4, and the electrode of the LED chip 2 and the electrode 5 of the package substrate 1 are electrically connected by the wire 6. On the other hand, a buffer layer film forming step is performed in which a buffer layer made of the same kind of inorganic material is formed in the concave space on the inner peripheral surface of the module by a plasma CVD apparatus. Specifically, the buffer layer made of an inorganic material can be formed of SiCN.

  Further, a multi-layered inorganic insulating film 7 is formed by performing a barrier layer forming step of forming a barrier layer made of the same kind of inorganic material on the surface of the buffer layer made of the same kind of inorganic substance by a plasma CVD apparatus. The barrier layer made of an inorganic material can be specifically formed using SiO 2, but is not necessarily limited thereto, and may be formed using Al 2 O 3.

  As described above, the barrier layer is preferably an oxide film (SiO2, AL2O3) having high transparency because it requires high transparency in order to extract light in addition to adhesion and moisture penetration prevention, Considering the adhesion to the sealing resin 3 made of silicone resin, SiO2 is most preferable. However, a nitride film (SiN, SiON) may be used in the case where the thin film is used to reduce the influence on translucency.

  In Example 2, the film formation process is completed by performing the buffer layer film formation process and the barrier layer film formation process.

  In addition, although plasma CVD is used to form a buffer layer made of SiCN or a barrier layer made of SiO 2, the present invention is not necessarily limited to this, and the film is formed using a sputtering apparatus, a vapor deposition apparatus, or the like. Can do.

  Finally, the sealing resin 3 made of silicone resin is filled in the space of the module in which the inorganic insulating film 7 made of the buffer layer and the barrier layer is formed, and the LED chip 2, the electrode 5 of the package substrate 1, the wire 6. And the sealing process which seals the internal peripheral surface of the reflector 4 from air | atmosphere is implemented, and an LED module is completed.

  By this manufacturing method, the adhesiveness between the sealing resin 3 and the reflector 4 is improved, the gap is prevented from being generated, and the air and moisture can be further prevented from entering, whereby the electrode of the LED chip 2 and the package substrate 1 can prevent corrosion of the electrode 5 and the bonded portion between the electrode of the LED chip 2 and the wire 6 and the bonded portion between the electrode 5 of the package substrate 1 and the wire 6 are pressed by the inorganic insulating film 7. The LED module which can be comprised and can prevent the disconnection of the connection part of the electrode of the LED chip 2 and the wire 6 and the connection part of the electrode 5 of the package substrate 1 and the wire 6 can be manufactured. .

In addition, a buffer layer made of the same kind of inorganic substance is formed at the boundary between the sealing resin 3 and the reflector 4, the boundary between the sealing resin 3 and the LED chip 2, and the boundary between the sealing resin 3 and the electrode 5 of the package substrate 1. By integrally forming a multi-layered inorganic insulating film 7 made of an oxide film made of the same kind of inorganic substance, there is no gap in the film, so that no gaps are formed, and intrusion of air and moisture can be prevented. The corrosion of the second electrode and the electrode 5 of the package substrate 1 can be further prevented.

The present invention can be widely applied to LED modules and LED module manufacturing methods.

1 Package substrate 2 LED chip 3 Sealing resin 4 Reflector 5 Electrode 6 Wire 7 Inorganic insulating film

Claims (6)

  An LED chip is mounted on an electrode of the package substrate, an electrode of the LED chip and an electrode of the package substrate are electrically connected by a wire, a reflector is disposed around the LED chip, and the LED chip and the reflector An LED module in which the electrode of the package substrate and the wire are filled with a sealing resin, the boundary between the sealing resin and the reflector, the boundary between the sealing resin and the LED chip And the same kind of inorganic insulating film is integrally formed at the boundary between the sealing resin and the electrode of the package substrate.   The LED module according to claim 1, wherein the inorganic insulating film is a Si-based film.   The LED module according to claim 2, wherein the Si-based film is a SiCN film.   The LED module according to claim 1, wherein the inorganic insulating film has a configuration in which a buffer layer and a barrier layer are stacked.   The LED module according to claim 4, wherein the barrier layer is made of a SiO 2 film or an AL 2 O 3 film. An LED chip mounted on an electrode of the package substrate, the LED chip electrode and the electrode of the package substrate are electrically connected by a wire, and the LED chip of the module in which a reflector is disposed around the LED chip; A film forming step of integrally forming the same type of inorganic insulating film on the inner peripheral surface of the reflector and the electrode of the package substrate, the LED chip on which the inorganic insulating film is formed, and the inner peripheral surface of the reflector And a sealing step of filling the electrode of the package substrate with a sealing resin and sealing the inner peripheral surfaces of the LED chip, the wire, and the reflector with the sealing resin. Manufacturing method of LED module.

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