JP2016178142A - Component built-in power supply module, component built-in module, and driving method for component built-in module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component built-in module capable of being downsized and outputting a plurality of voltage values, without increasing mounting area.SOLUTION: A component built-in power supply module and a component built-in module are configured so as to comprise: a multilayer wiring board including a plurality of wiring layers sequentially stacked so as to be separated from one another, insulation members positioned between the plurality of wiring layers to electrically insulate the plurality of wiring layers, and inter-layer connection bodies for establishing electric connection between the plurality of wiring layers; a plurality of IC chips for voltage output that are mounted on a wiring layer positioned inside the plurality of wiring layers; and a plurality of RC delay circuits, each of which is connected in parallel to each IC chip.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component built-in power supply module, a component built-in module, and a method for driving the component built-in module that can be suitably used in information communication devices and mobile communication devices.

  In recent years, electronic devices are required to have higher density and higher functionality in the trend of higher performance and smaller size. From this point of view, even modules with circuit components are required to support high density and high functionality. In order to meet such demands, multilayer wiring boards are now being actively performed.

  On the other hand, in a power supply circuit that performs voltage conversion, in general, a circuit that maintains an output voltage constant by feeding back an output voltage with respect to an input voltage (a voltage after smoothing a switched high-frequency voltage) to a control circuit. Although the configuration is adopted, the feedback (FB) signal tends to be very easily affected by the leakage magnetic flux from the above-described inductor.

  Therefore, disturbance of the feedback signal makes it difficult to keep the reference voltage of the power supply circuit constant, and it is difficult to perform desired accurate voltage conversion (that is, to cause malfunction of the power supply circuit). More generally speaking, the leakage magnetic flux from the inductor electromagnetically couples with a signal line formed around the electronic component, which becomes one of the major factors that induce deterioration of the purity of the signal.

  In view of such a problem, in Patent Document 1, in the multilayer wiring board in which the first electronic component is incorporated and the second electronic component is mounted on the main surface, the first electronic component and the first electronic component are disposed inside the multilayer wiring board. There is disclosed a component built-in module in which a first shield layer connected to a predetermined ground potential is disposed between a second electronic component.

  In such a component built-in module, since the second electronic component is placed on the board in which the first electronic component is built, the first electronic component is naturally placed in the vertical position in the surface direction of the board. The second electronic component is disposed in a state of being close to each other (within the mounting range of the second electronic component). At this time, since the first shield layer connected to a predetermined ground potential (for example, 0 V voltage) is provided between the first electronic component and the second electronic component, the second electronic component is provided. Even if the magnetic flux leaks from a component (for example, an inductor), the first shield layer functions as an electromagnetic wave shield. Therefore, the first electronic component is affected by noise caused by the leakage magnetic flux from the second electronic component. Stable operation is ensured without receiving.

  In addition, the first shield layer can function as an electromagnetic wave shield for various signal lines that can be formed in the substrate in which the first electronic component is built, so that leakage magnetic flux from the second electronic component can be prevented. Such mutual interference between electromagnetic noise and signals transmitted through various signal lines can be prevented. In this way, the first electronic component and various signal lines can be protected from electromagnetic waves that can become noise such as leakage magnetic flux from the second electronic component, so that the component built-in module has a complicated wiring structure. Even in the case of having the signal transmission, the signal transmission along the complicated signal path can be stably performed.

  However, since the component built-in module described in Patent Document 1 includes only a single first electronic component, it cannot cope with the generation of a plurality of voltages. Further, in order to cope with the generation of a plurality of voltages, it is necessary to dispose a plurality of the component built-in modules, which causes a problem of increasing the mounting area.

Japanese Patent No. 5369827

  An object of the present invention is to provide a component built-in module that can be downsized and output a plurality of voltage values without increasing the mounting area.

In order to achieve the above object, the present invention provides:
A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connection to be connected;
A plurality of IC chips for voltage output mounted on a wiring layer located inward of the plurality of wiring layers;
A plurality of RC delay circuits each connected in parallel to each IC chip;
It is related with the power supply module with a built-in component characterized by comprising.

The present invention also provides:
A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connection to be connected;
A plurality of IC chips for voltage output mounted on a wiring layer located inward of the plurality of wiring layers;
A plurality of RC delay circuits each connected in parallel to each IC chip;
The present invention relates to a component built-in module, wherein an active element is mounted on the multilayer wiring board so as to be electrically connected to the multilayer wiring board.

Furthermore, the present invention provides
A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connector to be connected, a plurality of IC chips for voltage output mounted on an inner wiring layer of the plurality of wiring layers, and each IC chip in parallel with each other A driving method of a component built-in module in which a plurality of RC delay circuits connected and an active element are mounted on the multilayer wiring board so as to be electrically connected to the multilayer wiring board,
The present invention relates to a method for driving a component built-in module, wherein different voltages are output from each IC chip to drive the active element.

  According to the present invention, a plurality of IC chips are arranged and mounted in at least one of a plurality of wiring layers constituting a multilayer wiring board, and a resistor R and a capacitor C are arranged in parallel with each IC chip, and the IC An RC delay circuit connected in series to the chip is configured.

  Therefore, for example, if voltage values output from a plurality of IC chips (DC-DC converters, etc.) are made different from each other, only a constant voltage is supplied to a single component built-in power supply module. A plurality of voltage values can be obtained from the component built-in power supply module without mounting or arranging an electronic component or the like outside the device. As a result, the component built-in module (active element) of the present invention having an active element mounted so as to be electrically connected to the multilayer wiring board on the multilayer wiring board constituting the component built-in power supply module It can be driven by the component built-in power supply module.

  For this reason, when driving a component built-in module (active element), a plurality of component built-in power supply modules are not required, so that a smaller size and a plurality of voltage values can be output without increasing the mounting area as in the prior art. It is possible to provide a component built-in module (component built-in power supply module) that can be used.

  In the component built-in power supply module of the present invention, since the component built-in power supply module and the active element are separated, noise generated in the component built-in power supply module is not superimposed on the active element. Therefore, it is possible to provide a component built-in module (component built-in power supply module) that is not affected by external noise.

  Furthermore, in the component built-in module (component built-in power supply module) of the present invention, external connection terminals can be formed on the front and back of the module. By electrically connecting a predetermined inspection device to the external connection terminal, the component An electrical inspection of an IC chip or the like disposed in the built-in power supply module can be performed.

  In an example of the present invention, the time constants of the plurality of RC delay circuits can be made different from each other, and the voltage can be output in a time series from the plurality of IC chips. Accordingly, the same or different voltage values can be supplied in time series to the active elements of the component built-in module of the present invention, and the active elements supply a plurality of switching processes, for example, power supplies A, B, and C. In this case, even when the power source B is driven after the power source A is turned on and the power source C is driven after an arbitrary time after the power source B is driven, the active element can be driven. And

  As described above, according to the present invention, it is possible to provide a component built-in module that can be downsized and output a plurality of voltage values without increasing the mounting area.

  It is also possible to provide a component built-in module that is not affected by external noise. Furthermore, it becomes possible to perform an electrical inspection of an IC chip or the like disposed in the component built-in power supply module.

It is a section lineblock diagram showing the component built-in power supply module of an embodiment. It is sectional drawing along the II line of the component built-in power supply module shown in FIG. It is sectional drawing along the II-II line | wire of the component built-in power supply module shown in FIG. FIG. 4 is an equivalent circuit diagram of a first voltage generation circuit, a second voltage generation circuit, and a third voltage generation circuit in the component built-in power supply module of the embodiment. It is sectional drawing which shows the structure of the component built-in module of embodiment. Similarly, it is sectional drawing which shows the structure of the component built-in module of embodiment.

  Hereinafter, specific features of the present invention will be described based on embodiments for carrying out the invention.

(First embodiment)
FIG. 1 is a plan view showing the configuration of a component built-in power supply module according to the present embodiment, and FIGS. 2 and 3 are enlarged sectional views showing one voltage generation circuit in the component built-in power supply module shown in FIG. is there. Specifically, FIG. 2 is a sectional view taken along line II of the component built-in power supply module shown in FIG. 1, and FIG. 3 is a sectional view taken along line II-II of the component built-in power supply module shown in FIG. FIG.

  As shown in FIGS. 1 to 3, the component built-in power supply module 100 according to the present embodiment includes a multilayer wiring board 10 and a total of three voltage output devices mounted on the second wiring layer 102 of the multilayer wiring board 10. A total of three RC delay circuits 31, 32, 33 connected in parallel to each IC chip on the second wiring layer 12, for example, a DC-DC converter, etc. On the second wiring layer 102, a total of three noise removing capacitors 41, 42, 43 connected in series to each IC chip and a total connected in parallel to each IC chip Three smoothing circuits 51, 52 and 53 are provided. As a result, the component built-in power supply module 100 of the present embodiment shown in FIGS. 1 to 3 has a total of three voltage generation circuits including an IC chip, an RC delay circuit, a capacitor, and a smoothing circuit.

  The number of voltage generation circuits is not limited to three, and can be an arbitrary number according to the type of voltage value to be generated from the component built-in power supply module, as will be described below.

  In the present embodiment, the IC chips 21, 22, 23, the RC delay circuits 31, 32, 33, the capacitors 41, 42, 43 and the smoothing circuits 51, 52, 53 are connected to the same wiring layer, specifically the second circuit. Although mounted on the wiring layer 12, as long as these IC chip, RC delay circuit, capacitor and smoothing circuit are connected in parallel and in series, they should be mounted on any wiring layer such as a different wiring layer. Can do.

  For convenience, in the following, a voltage generation circuit including the IC chip 21, the RC delay circuit 31, the capacitor 41, and the smoothing circuit 51 is referred to as a first voltage generation circuit 11, and the IC chip 22, the RC delay circuit 32, and the capacitor 42 are referred to. The voltage generation circuit including the smoothing circuit 52 is referred to as a second voltage generation circuit 12. Furthermore, a voltage generation circuit including the IC chip 23, the RC delay circuit 33, the capacitor 43, and the smoothing circuit 53 is referred to as a third voltage generation circuit 13.

  FIG. 4 shows an equivalent circuit diagram of the first voltage generation circuit 11, the second voltage generation circuit 12, and the third voltage generation circuit 13 in the component built-in power supply module of the present embodiment.

  The multilayer wiring board 10 includes a first wiring layer 101, a second wiring layer 102, a third wiring layer 103, a fourth wiring layer 104, a fifth wiring layer 105, and a sixth wiring layer 106. The wiring layers are sequentially stacked, and these wiring layers are electrically insulated by an insulating member 115 disposed between the layers.

  On the other hand, the first wiring layer 101 and the second wiring layer 102 are electrically connected by a first interlayer connector 107 such as a via conductor, and the second wiring layer 102 and the third wiring layer 103 are connected. Are electrically connected by a second interlayer connector 108 such as a via conductor, and the third wiring layer 103 and the fourth wiring layer 104 are electrically connected by a third interlayer connector 109 such as a via conductor. Connected. Further, the fourth wiring layer 104 and the fifth wiring layer 105 are electrically connected by a fourth interlayer connector 110 such as a via conductor, and the fifth wiring layer 105 and the sixth wiring layer 106 are connected. Are electrically connected by a fifth interlayer connector 111.

  The first wiring layer 101 and the sixth wiring layer 106 are located in the outermost layer of the multilayer wiring board 10 and function as external connection terminals.

  In the present embodiment, the number of wiring layers of the multilayer wiring board 10 is set to 6, but any number can be used as necessary.

  The RC delay circuit 31 includes a resistor 311 and a capacitor 312, the RC delay circuit 32 includes a resistor 321 and a capacitor 322, and the RC delay circuit 33 includes a resistor 331 and a capacitor 332.

  The smoothing circuit 51 includes an inductor 511 and a capacitor 512, the smoothing circuit 52 includes an inductor 521 and a capacitor 522, and the smoothing circuit 53 includes an inductor 531 and a capacitor 532.

  According to the present embodiment, IC chips (DC-DC converters, etc.) 21, 22, 23 are arranged and mounted on the second wiring layer 102 constituting the multilayer wiring board 10, and each IC chip 21, 22, is mounted. 23, resistors 311, 321, 331 and capacitors 312, 322, 332 are arranged in parallel to form RC delay circuits 31, 32, 33 connected in parallel to the IC chips 21, 22, 23. Yes.

  Therefore, for example, the voltage values output from the IC chips 21, 22, and 23 are made different from each other, and the voltages output from the first voltage generation circuit 11, the second voltage generation circuit 12, and the third voltage generation circuit 13. If the values are different from each other, only a constant voltage is supplied to the single component built-in power supply module 100, and the component built-in power supply is not required to be mounted or arranged outside the component built-in power supply module 100. A plurality of voltage values can be obtained from the module 100. As a result, when an active element is mounted on the multilayer wiring board 10 constituting the component built-in power supply module 100 so as to be electrically connected to the multilayer wiring board, the active element is converted into a single component built-in power supply. It can be driven only by the module 100.

  For this reason, when the active element is driven, a plurality of component built-in power supply modules are not required, so that it is possible to reduce the size and output a plurality of voltage values without increasing the mounting area as in the prior art. A power supply module with built-in components can be provided.

  In the component built-in power supply module 100, since the component built-in power supply module 100 and the active element are separated from each other, noise generated in the component built-in power supply module 100 is not superimposed on the active element. Therefore, it is possible to provide an active element that is not affected by external noise.

  Furthermore, the time constants of the RC delay circuit 31 in the first voltage generation circuit 11, the RC delay circuit 32 in the second voltage generation circuit 12, and the RC delay circuit 33 in the third voltage generation circuit 13 are made different from each other. If voltages are output from the chips 21, 22, and 23 in time series, the same or different voltage values are applied to the active elements electrically connected to the component built-in power supply module 100 of this embodiment in time series. When the active element supplies a plurality of switching processes, for example, the power sources A, B, and C, the power source B is supplied after a predetermined time after the power source A is turned on, and an arbitrary time after the power source B is driven. In this case, the active element can be driven even when the power source C is driven.

(Second Embodiment)
5 and 6 are cross-sectional views showing the configuration of the component built-in module according to the present embodiment. Each of the voltage generation circuits of the component built-in power supply module shown in FIGS. 2 and 3 in the first embodiment is enlarged. It corresponds to a sectional view shown.

  In addition, the same code | symbol is used about the component similar to or the same as the component shown in FIGS.

  As shown in FIGS. 5 and 6, the component built-in module 200 of the present embodiment includes a first wiring layer 101 located in the outermost layer of the multilayer wiring board 10 of the component built-in power supply module 100 shown in FIGS. An external connection terminal 71 such as a solder bump is disposed on the sixth wiring layer 106, and an active element 61 is mounted on the sixth wiring layer 106 via the external connection terminal 71.

  Therefore, for example, the voltage values output from the IC chips 21, 22, and 23 are made different from each other, and the voltages output from the first voltage generation circuit 11, the second voltage generation circuit 12, and the third voltage generation circuit 13. If the values are different from each other, only a constant voltage is supplied to the single component built-in power supply module 100, and the component built-in power supply is not required to be mounted or arranged outside the component built-in power supply module 100. A plurality of voltage values can be obtained from the module 100. As a result, when the active element 61 is mounted so as to be electrically connected to the multilayer wiring board 10 of the component built-in power supply module 100, the active element 61 is driven only by the single component built-in power supply module 100. Will be able to.

  For this reason, when the active element 61 is driven, a plurality of component built-in power supply modules are not required, so that it is possible to reduce the size and output a plurality of voltage values without increasing the mounting area as in the prior art. Module with built-in components can be provided.

  In the component built-in module 200, the component built-in power supply module 100 and the active element 61 are separated from each other, so that noise generated in the component built-in power supply module 100 is not superimposed on the active element 61. Therefore, it is possible to provide the active element 61 that is not affected by external noise.

  Furthermore, the time constants of the RC delay circuit 31 in the first voltage generation circuit 11, the RC delay circuit 32 in the second voltage generation circuit 12, and the RC delay circuit 33 in the third voltage generation circuit 13 are made different from each other. If a voltage is output from the chips 21, 22, and 23 in time series, the active element electrically connected to the sixth wiring layer 106 in the multilayer wiring board 10 of the component built-in power supply module 100 of the present embodiment. The same or different voltage values can be supplied to 61 in time series, and the active element 61 supplies a plurality of switching processes, for example, power supplies A, B and C. The active element 61 can be driven even when the power source B is driven after a certain period of time after the power source B is driven and the power source C is driven after an arbitrary time. .

  In addition, since the external connection terminal 71 is formed on the first wiring layer 101 in the component built-in module, by connecting a predetermined inspection device to the external connection terminal, the internal module 200 It is possible to perform an electrical inspection of the IC chip or the like disposed on the board.

  The present invention has been described in detail based on the above specific examples. However, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Component built-in power supply module 200 Component built-in module 10 Multilayer wiring board 11 1st voltage generation circuit 12 2nd voltage generation circuit 13 2nd voltage generation circuit 21, 22, 23 Voltage output IC chips 31, 32, 33 RC delay circuit 41, 42, 43 Smoothing circuit 51, 52, 53 Capacitor for noise removal 61 Active element 71 External connection terminal

Claims (6)

A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connection to be connected;
A plurality of IC chips for voltage output mounted on a wiring layer located inward of the plurality of wiring layers;
A plurality of RC delay circuits each connected in parallel to each IC chip;
A power module with a built-in component, characterized by comprising:   2. The component built-in power supply module according to claim 1, wherein time constants of the plurality of RC delay circuits are different from each other, and voltages are output in a time series from the plurality of IC chips. A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connection to be connected;
A plurality of IC chips for voltage output mounted on a wiring layer located inward of the plurality of wiring layers;
A plurality of RC delay circuits each connected in parallel to each IC chip;
An active component is mounted on the multilayer wiring board so as to be electrically connected to the multilayer wiring board.   4. The component built-in module according to claim 3, wherein time constants of the plurality of RC delay circuits are different from each other, and a voltage is output in a time series from the plurality of IC chips. A plurality of wiring layers that are sequentially stacked apart from each other, an insulating member that is located between the plurality of wiring layers and electrically insulates the plurality of wiring layers, and electrically between the plurality of wiring layers A multilayer wiring board having an interlayer connector to be connected, a plurality of IC chips for voltage output mounted on an inner wiring layer of the plurality of wiring layers, and each IC chip in parallel with each other A driving method of a component built-in module in which a plurality of RC delay circuits connected and an active element are mounted on the multilayer wiring board so as to be electrically connected to the multilayer wiring board,
A driving method for a component built-in module, wherein different voltages are output from each IC chip to drive the active element.   6. The component built-in according to claim 5, wherein time constants of the plurality of RC delay circuits are made different from each other, and voltage is output in time series from the plurality of IC chips to drive the active element. How to drive the module.

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