JP2016167540A - Light emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting module which allows an electrode of an LED die and an electrode on a circuit board to be simply and successfully connected without using wire bonding when the LED die is mounted on the circuit board in a face-up manner.SOLUTION: A light emitting module 10 includes an LED die 11 in which a semiconductor layer covers an upper surface of a semiconductor substrate 12 and an anode electrode 14 and a cathode electrode 15 are formed on the semiconductor layer. In the light emitting module 10, the LED die 11 is mounted on a circuit board 19 in a face-up manner and the anode electrode 14 and the cathode electrode 15 are connected to electrodes on the circuit board 19, respectively. For the connection, flexible printed circuit boards 17, 18 in each of which a wiring pattern is formed on a polyimide sheet are used.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting module in which an LED die is mounted face-up on a circuit board, and more particularly to a light emitting module that connects an electrode on an LED die and an electrode on a circuit board by a method other than wire bonding.

  In a light emitting module mounted on a circuit board with the light emitting layer of the LED die facing upward (hereinafter referred to as face-up mounting), the electrode on the LED die and the electrode on the circuit board are often connected by wire bonding. . However, in wire bonding, not only is the gold wire to be used expensive, but it is also necessary to introduce and maintain an apparatus (wire bonder) dedicated to wire bonding.

  On the other hand, even in face-up mounting, it has been proposed to connect the electrode on the LED die and the electrode on the circuit board by a method other than wire bonding. For example, FIG. 10A of Patent Document 1 shows a light emitting module in which an electrode formed on a side surface of a semiconductor layer of an LED element (LED die) and a wiring pattern on a substrate (circuit board) are connected by solder. Yes. In addition, () is a term used in this specification and the like (the same applies hereinafter).

  Therefore, FIG. 10A of Patent Document 1 is shown again in FIG. 14 and its structure will be described. FIG. 14 is a cross-sectional view of a conventional light emitting module, showing the LED element 101 and its mounted state. In addition, the code | symbol is changed in FIG.

  In the light emitting module shown in FIG. 14, the LED element 101 is mounted on a substrate 123 made of alumina with an adhesive (not shown), and a wiring pattern 122 (electrode) on the substrate 123 and an n external electrode 117 (cathode) of the LED element 101 are mounted. Electrode) and p external electrode 118 (anode electrode) are connected by solder 120A. The LED element 101 is obtained by laminating a GaN semiconductor layer 100 on a sapphire substrate 110 (semiconductor substrate). In the GaN semiconductor layer 100, an AlN buffer layer 111, an n-GaN layer 112, a light emitting layer 113, a p-GaN layer 114, insulating layers 116 and 119, and a p contact electrode 115 are stacked and insulated on the side surface of the p-GaN layer 114. N and p external electrodes 117 and 118 are formed with the layer 116 interposed therebetween.

JP 2006-73618 A (FIG. 10A)

  However, in recent LED dies, the p-GaN layer is about several μm. That is, in the light emitting module disclosed in Patent Document 1, the thicknesses of the n and p external electrodes 117 and 118 formed on the outer peripheral side surface of the p-GaN layer 114 are also several μm. Therefore, the connection between the n and p external electrodes 117 and 118 and the wiring pattern 122 on the substrate 123 by the solder 120A becomes difficult and unstable. Further, in order to weld the solder to the side surface of the sapphire substrate 110 or the like, an additional surface treatment such as plating is required.

  Accordingly, the present invention has been made in view of the above problems, and when LED face is mounted face-up on a circuit board, the electrode of the LED die and the electrode on the circuit board are easily and reliably not wire bonded. It is an object of the present invention to provide a light emitting module that can be connected to each other.

In order to solve the above problems, the light emitting module of the present invention is
LED die, circuit board and flexible printed circuit board,
The LED die has an anode electrode and a cathode electrode on an upper surface of a semiconductor layer formed on the semiconductor substrate, and is mounted face-up on the circuit board.
The flexible printed circuit board has a wiring pattern formed on a base sheet, and connects the anode electrode or the cathode electrode to an electrode formed on an upper surface of the circuit board.

  In the LED die included in the light emitting module of the present invention, a semiconductor layer covers the upper surface of a semiconductor substrate, and an anode electrode and a cathode electrode are formed on the semiconductor layer. Further, in the light emitting module of the present invention, the LED die is face-up mounted on the circuit board, and the anode electrode or the cathode electrode is connected to the electrode on the circuit board. For this connection, a flexible printed board having a wiring pattern on a base sheet made of polyimide or the like is used.

  The upper surface of the LED die may be elongated, and the anode electrode may be disposed at one end and the cathode electrode may be disposed at the other end.

  The upper surface of the LED die may be rectangular or square, and the anode electrode and the cathode electrode may be disposed at each corner.

  The flexible printed circuit board may be divided into two connection portions with the anode electrode or the cathode electrode of the LED die.

  A plurality of LED dies are arranged face up on the circuit board, one flexible printed board is connected to the anode electrode and the cathode electrode of the plurality of LED dies, and the flexible printed board is connected to the LED die. A portion overlapping with the light emitting portion may be opened.

  The semiconductor substrate may be Si.

  The phosphor may be disposed only on the upper surface of the semiconductor layer while avoiding a connection portion between the anode electrode and the cathode electrode and the flexible printed board.

  Since the flexible printed circuit board can be deformed by being bent, it can be arranged along the side surface of the LED die. Furthermore, the wiring pattern of the flexible printed circuit board is bonded to the anode electrode, the cathode electrode, and the circuit board electrode in a larger area than wire bonding. That is, in the light emitting module of the present invention, the anode and cathode electrode of the LED die and the electrode of the circuit board are connected by the flexible printed board, so that the LED die electrode and the electrode on the circuit board can be easily and reliably connected.

The perspective view of the LED die | dye contained in the light emitting module of 1st Embodiment of this invention. The perspective view of the light emitting module shown as 1st Embodiment of this invention. Sectional drawing of the light emitting module shown in FIG. The top view of the land pattern of the light emitting module shown in FIG. The perspective view of the LED die | dye contained in the light emitting module of 2nd Embodiment of this invention. The perspective view of the light emitting module shown as 2nd Embodiment of this invention. The top view of the land pattern of the light emitting module shown in FIG. The top view of the light emitting module shown as 3rd Embodiment of this invention. The perspective view of the flexible printed circuit board contained in the light emitting module shown in FIG. The top view of the land pattern of the light emitting module shown in FIG. The top view of the light emitting module shown as 4th Embodiment of this invention. The perspective view of the flexible printed circuit board contained in the light emitting module shown in FIG. The top view of the land pattern of the light emitting module shown in FIG. Sectional drawing of the conventional light emitting module.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted. For the sake of explanation, the scale of the members is changed as appropriate.

(First embodiment)
FIG. 1 is a perspective view of an LED die 11 included in a light emitting module 10 shown as the first embodiment of the present invention. As shown in FIG. 1, the LED die 11 is generally a rectangular parallelepiped, and has a width of about 300 μm, a length of about 1000 μm, and a height of about 200 μm. A semiconductor layer 13 is formed on the semiconductor substrate 12 included in the LED die 11. The upper surface of the LED die 11 is elongated, and an anode electrode 14 (circular shape) is disposed at one end of the upper surface, and a cathode electrode 15 (rectangular shape) is disposed at the other end.

  Further, the phosphor 16 is disposed only on the upper surface of the semiconductor layer 13 while avoiding connection portions between the anode electrode 14 and the cathode electrode 15 and flexible printed boards 17 and 18 (see FIG. 2) described later. The width of the phosphor 16 is equal to the width of the LED die 11. The thickness of the phosphor 16 is substantially the same as that of the semiconductor substrate 12, but is drawn thin so that the anode electrode 14 is conspicuous in FIG. 1 (the same applies to FIG. 2; see FIG. 3).

  FIG. 2 is a perspective view of the light emitting module 10. As shown in FIG. 2, the LED die 11 is mounted face up on the upper surface of the circuit board 19. The anode electrode 14 of the LED die 11 is connected to the electrode 19a (see FIG. 3) of the circuit board 19 by the flexible printed board 17. Similarly, the cathode electrode 15 of the LED die 11 is connected to the electrode 19b (see FIG. 3) of the circuit board 19 by the flexible printed board 18. In the figure, the widths of the flexible printed boards 17 and 18 are wider than the width of the LED die 11.

  FIG. 3 is a cross-sectional view of the light emitting module 10 drawn along the line AA ′ of FIG. In FIG. 3, a connection pattern 12a is formed on the lower surface of the semiconductor substrate 12, and a semiconductor layer 13 is formed on the upper surface. The semiconductor substrate 12 is made of Si and has a thickness of about 200 μm. The connection pattern 12a fixes the LED die 11 to the circuit board 19 with a bonding metal such as solder, and is made of a metal layer such as Au and has a thickness of about 1 μm. The semiconductor layer 13 has a thickness of 10 μm or less, and a light emitting layer (not shown) and p-GaN 13b are stacked on the n-GaN layer 13a including the buffer layer. The light emitting layer becomes a boundary portion between the n-GaN layer 13a and the p-GaN layer 13b.

The anode electrode 14 is a metal layer mainly composed of Au having a thickness of about 1 μm, and is formed at the end of the upper surface of the p-GaN layer 13b. The cathode electrode 15 is also a metal layer mainly composed of Au and having a thickness of about 1 μm, and is formed on the n-GaN layer 13a exposed by removing a part of the p-GaN layer 13b. As described above, the phosphor 16 is the flexible printed circuit board 1.
7 and 18 is disposed on the semiconductor layer 13 so as to avoid the connection portion, and has a thickness of 100 to 200 μm. The fluorescent particles are dispersed in a resin such as silicone.

  The circuit board 19 is made of Al, ceramic, resin, or the like whose surface is insulated, and includes electrodes 19a, 19b, and 19c on the upper surface. The electrodes 19a, 19b, and 19c are metal layers obtained by plating NiAu on a copper foil. The flexible printed boards 17 and 18 are formed by laminating a copper foil 35 and an insulating layer 36 on a base sheet 34 (hereinafter referred to as a polyimide sheet 34) made of polyimide, and the electrodes of the anode electrode 14, the cathode electrode 15 and the circuit board 19 are used. Connection portions 19a and 19b are plated with NiAu. The polyimide sheet 34 has a thickness of about 12.5 to 35 μm, and the copper foil 35 has a thickness of about 9 to 18 μm.

  The LED die 11 and the circuit board 19 are joined together by solder 33 c interposed between the connection pattern 12 a formed on the lower surface of the LED die 11 and the electrode 19 c formed on the upper surface of the circuit board 19. The flexible printed boards 17 and 18 and the circuit board 19 are also joined by solders 33a and 33b interposed between the copper foil 35 of the flexible printed boards 17 and 18 and the electrodes 19a and 19b formed on the upper surface of the circuit board 19. . In contrast, in the flexible printed circuit boards 17 and 18 and the LED die 11, the Au layer on the copper foil 35 of the flexible printed circuit boards 17 and 18 is directly connected to the Au layer on the anode electrode 14 and the cathode electrode 15 of the LED die 11 ( Alternatively, bonding is performed by Au—Sn eutectic (in this case, an Sn layer is formed in advance on the terminal portion of the anode electrode 14 or the like or the flexible printed circuit board 17 or the like).

  FIG. 4 is a plan view showing a land pattern of the light emitting module 10. Each land pattern corresponds to the electrodes 19a, 19b, and 19c formed on the circuit board 19 and has a rectangular shape. As described above, the electrode 19c is joined to the bottom surface of the LED die 11 by soldering to fix the LED die 11 to the circuit board 19 (see FIG. 3). On the other hand, the electrodes 19a and 19b are electrically connected to the anode electrode 14 and the cathode electrode 15 by the flexible printed boards 17 and 18 (see FIG. 3). That is, the flexible printed circuit boards 17 and 18 are connected to the LED die 11 and the circuit board 19 without stress.

  The flexible printed circuit boards 17 and 18 arranged along the side surface of the LED die 11 in the bent state as described above are not subjected to the stress related to the fixing of the LED die 11 and further have a wider area than wire bonding. Thus, since the anode electrode 14 and the cathode electrode 15 are joined, a simple and reliable connection can be achieved in the light emitting module 10.

  The semiconductor substrate 12 of the light emitting module 10 is made of Si. For this reason, the light emitting module 10 has a feature of high heat dissipation compared to a light emitting module using a semiconductor substrate material made of sapphire. That is, the light emitting module 10 can efficiently transmit the heat generated in the light emitting layer to the circuit board 19. Furthermore, the light emitting module 10 employs solder 33 c for bonding to the circuit board 19. This is also advantageous for heat conduction compared to other methods of fixing the LED die with an adhesive. When the circuit board 19 is made of resin, it is preferable that a thermal via be provided in the electrode 19c so that heat can be conducted to a heat radiating member such as a heat sink on the lower surface of the circuit board 19 with low thermal resistance. The circuit board 19 may be a mother board on which other electronic components such as resistors and connectors are mounted, or an interposer (also referred to as a submount board) inserted between the LED die 11 and the mother board. Also good.

  As described above, the semiconductor substrate 12 of the light emitting module 10 is made of opaque Si. Therefore, the connection pattern 12a provided on the bottom surface may be an Au layer having a low reflectance. In contrast, sapphire is sometimes used as a semiconductor substrate. In this case, in order to improve the light emission efficiency, it is preferable that the connection pattern formed on the bottom surface has an Al layer or an Ag layer to increase the reflectance.

  In the light emitting module 10, the phosphor 16 is arranged only on the upper surface of the semiconductor substrate 12 as shown in FIG. 2. That is, the phosphor 16 is disposed so as to avoid the connection portion between the anode electrode 14 and the cathode electrode 15 and the flexible printed boards 17 and 18. Since the semiconductor layer 13 has a thickness of 10 μm or less as described above, light is hardly emitted in the lateral direction (direction parallel to the upper surface of the semiconductor substrate 12). That is, light is emitted only in the upward direction (direction perpendicular to the upper surface of the semiconductor substrate 12). As a result, the phosphor 16 may be disposed only on the light emitting layer. Such a structure is suitable for mass production because the LED die 11 can be manufactured by applying and patterning the phosphor 16 in a wafer state and then separating the wafer into individual pieces.

(Second Embodiment)
FIG. 5 is a perspective view of the LED die 51 included in the light emitting module 50 according to the second embodiment of the present invention. As shown in FIG. 5, the LED die 51 is a rectangular parallelepiped whose plane shape is almost square, and has a width and length of about 1000 μm and a height of about 200 μm. A semiconductor layer 53 is formed on the semiconductor substrate 52 included in the LED die 51. An anode electrode 54 (circular shape) is disposed at two corners (corner portions) on the upper surface of the LED die 51, and a cathode electrode 55 (rectangular shape) is disposed at the other two corners (corner portions).

  The phosphor 56 is disposed only on the upper surface of the LED die 51 so as to avoid a connection portion between the anode electrode 54 and the cathode electrode 55 and flexible printed boards 57 and 58 (see FIG. 6) described later. The side of the phosphor 56 is flush with the side of the LED die 51. Although the thickness of the phosphor 56 is substantially equal to that of the semiconductor substrate 52, it is drawn thinly so that the anode electrode 54 is conspicuous in FIG. 5 as in FIG. 2 (same in FIG. 6).

  FIG. 6 is a perspective view of the light emitting module 50. As shown in FIG. 6, the LED die 51 is mounted face up on the upper surface of the circuit board 59. The anode electrode 54 of the LED die 51 is connected to the electrode 59a (see FIG. 7) of the circuit board 59 by a flexible printed board 57. Similarly, the cathode electrode 55 of the LED die 51 is connected to the electrode 59b (see FIG. 7) of the circuit board 59 by the flexible printed board 58. Since two anode electrodes 54 exist on the upper surface of the LED die 51, the flexible printed circuit board 57 has two connection portions with the anode electrode 54 of the LED die 51. Similarly, since there are two cathode electrodes 55, the flexible printed circuit board 58 is divided into two portions where the LED die 51 is connected to the cathode electrode 55.

  As described above, the anode electrode 54 and the cathode electrode 55 are provided at the four corners of the upper surface of the LED die 51 having a wide rectangular shape, and the flexible printed boards 57 and 58 are not connected to the anode electrode 54 and the cathode electrode 55. If the LED 56 does not overlap with the upper surface of the LED die 51, the phosphor 56 can be inserted between the anode electrode 54 and the cathode electrode 55 at the sides. As a result, the LED module 50 can secure a wide light emitting area while avoiding concentration of current distribution. The cross section including the anode electrode 54 and the cathode electrode 55 is equal to the cross sectional view shown in FIG.

FIG. 7 is a plan view showing a land pattern of the light emitting module 50. Each land pattern corresponds to the electrodes 59a, 59b, and 59c formed on the circuit board 59. The electrodes 59a and 59b are elongated rectangles, and the electrode 59c is a wide rectangle. As described above, the electrode 59c is joined to the connection pattern (see FIG. 3) formed on the bottom surface of the LED die 51 by soldering, and the LED die 51 is fixed to the circuit board 59. On the other hand, the electrodes 59a and 59b are electrically connected to the anode electrode 54 and the cathode electrode 55 by the flexible printed boards 57 and 58 (see FIG. 6). That is, the flexible printed boards 57 and 58 are connected to the LED die 51 and the circuit board 59 in a state without stress.

  The flexible printed circuit boards 57 and 58 arranged along the side surface of the LED die 51 in the bent state as described above are not subjected to the stress related to the fixing of the LED die 51 and further have a wider area than the wire bonding. Thus, since the anode electrode 54 and the cathode electrode 55 are joined, a simple and reliable connection can be achieved in the light emitting module 50.

(Third embodiment)
FIG. 8 is a plan view of a light emitting module 80 shown as a third embodiment of the present invention, and FIG. 9 is a perspective view of a flexible printed circuit board 87 included in the light emitting module 80. As shown in FIG. 8, the light emitting module 80 is a module in which four LED dies 51 shown in FIG. 5 are mounted face-up on a circuit board 89 and arranged in two rows and two columns. The anode electrode 54 and the cathode electrode 55 of each LED die 51 are connected to one flexible printed board 87. The flexible printed circuit board 87 has four openings 87a, covers the LED die 51, and has an opening that overlaps the light emitting part.

  The flexible printed circuit board 87 is formed with a circuit made of copper foil. That is, the four LED dies 51 can be connected in series, in parallel, or in series-parallel with the circuit of the flexible printed circuit board 87. The flexible printed circuit board 87 is bent along the side of the LED die 51 in the same manner as the flexible printed circuit boards 57 and 58 shown in FIG. 6, and the bent part is in contact with the side of the LED die 51. Unlike the flexible printed boards 57 and 58 that are bent in this manner, they are separated from the sides of the LED die 51 so as to maintain a predetermined distance.

  FIG. 10 is a plan view showing a land pattern of the light emitting module 80. The land pattern includes elongated rectangular electrodes 89a and 89b and four wide rectangular electrodes 89c. The electrodes 89 a and 89 b are a + side power supply terminal and a − side power supply terminal for supplying power to the LED 51. The electrode 89c is bonded to a connection pattern (see FIG. 3) formed on the bottom surface of the LED die 51 by soldering, and fixes the LED die 51 to the circuit board 89. In the light emitting module 80 as well as the light emitting modules 10 and 50 (see FIGS. 2 and 6), the flexible printed circuit board 87 is connected to the LED die 51 and the circuit board 89 without stress.

  As described above, the flexible printed circuit board 87 arranged along the side surface of the LED die 51 in a bent state is free from the stress associated with fixing the LED die 51, and has a wider area than wire bonding. Since it is joined to the electrode 54 and the cathode electrode 55 and further includes a circuit made of copper foil, a simple and reliable connection can be achieved in the light emitting module 80.

  In the light emitting module 80, the land pattern for connecting the flexible printed board 87 and the circuit board 89 is only the power supply electrodes 89a and 89b. However, when power is supplied to a large number of LED dies using a single flexible printed circuit board, power may be supplied to each LED die individually. At this time, the electrode 89a or the electrode 89b is divided. For example, when each LED die is a red light emitting LED die, a green light emitting LED die, a blue light emitting LED die, or an LED die that emits another color (for example, white), power may be individually supplied to each LED die. good. By adjusting the amount of power supplied to each LED die, light adjustment and color adjustment of the light emitting module are possible. When the planar shapes of the LED dies are different, the shapes of the opening and the connecting portion are adjusted. The LED dies are preferably equal in height, but may be slightly different.

(Fourth embodiment)
11 is a plan view of a light emitting module 90 shown as the fourth embodiment of the present invention, FIG. 12 is a perspective view of a flexible printed circuit board 97 included in the light emitting module 90, and FIG. 13 is a plan view showing a land pattern of the light emitting module 90. is there.

  As shown in FIG. 11, the light emitting module 90 has a larger number of LED dies 51 arranged on a circuit board 99 in a substantially circular shape than the light emitting module 80 shown in FIG. 8. The anode electrode 54 and the cathode electrode 55 of each LED die 51 are connected to one flexible printed circuit board 97.

  Similar to the flexible printed circuit board 87 (see FIG. 8), the flexible printed circuit board 97 is provided with an opening 97a (a connection part such as the anode electrode 54 is omitted) in a portion overlapping the light emitting part of the LED die 51, and a circuit made of copper foil is provided. Is formed. That is, the LED die 51 can be connected in series, parallel, or series-parallel by the circuit of the flexible printed circuit board 97. The flexible printed circuit board 97 is bent along the sides of the LED die 51 shown in the upper and lower parts of the drawing similarly to the flexible printed circuit boards 57 and 58 shown in FIG. , 58 are separated from the sides of the LED die 51 so as to maintain a predetermined distance.

  As shown in FIG. 13, the land pattern is composed of elongated rectangular electrodes 99a and 99b and 24 wide rectangular electrodes 99c. The electrodes 99a and 99b are a + side power supply terminal and a − side power supply terminal for supplying power to the LED die 51. The electrode 99c is joined to a connection pattern (see FIG. 3) formed on the bottom surface of the LED die 51 by soldering, and fixes the LED die 51 to the circuit board 99. That is, the light emitting module 90 is also connected to the LED die 51 and the circuit board 99 (see FIG. 11) in a state where the flexible printed circuit board 97 is not stressed as in the light emitting modules 10, 50, and 80 (see FIGS. 2, 6, and 8). doing.

  The flexible printed circuit board 97 arranged along the side surface of the LED die 51 in the bent state as described above is free from the stress associated with fixing the LED die 51 and has a larger area than the wire bonding. 54 and the cathode electrode 55 are joined, and a circuit made of copper foil is provided, so that a simple and reliable connection can be achieved in the light emitting module 90. Further, the light emitting module 90 may supply power to the LED dies 51 individually (or for each group) in the same manner as the light emitting module 80.

10, 50, 80, 90 ... light emitting module,
11, 51 ... LED die,
12, 52 ... Semiconductor substrate,
12a ... pattern for connection,
13, 53 ... semiconductor layer,
13a ... n-GaN layer,
13b ... p-GaN layer,
14, 54 ... anode electrode,
15, 55 ... cathode electrode,
16, 56 ... phosphor,
17, 18, 57, 58, 87, 97 ... flexible printed circuit board,
19, 59, 89, 99 ... circuit board,
19a, 19b, 19c, 59a, 59b, 59c,
89a, 89b, 89c, 99a, 99b, 99c ... electrodes,
33a, 33b, 33c ... solder,
34 ... Polyimide sheet (base sheet),
35 ... copper foil,
36 ... insulating layer,
87a, 97a ... opening.

Claims (7)

LED die, circuit board and flexible printed circuit board,
The LED die has an anode electrode and a cathode electrode on an upper surface of a semiconductor layer formed on the semiconductor substrate, and is mounted face-up on the circuit board.
The flexible printed circuit board has a wiring pattern formed on a base sheet, and connects the anode electrode or the cathode electrode to an electrode formed on an upper surface of the circuit board.   The light emitting module according to claim 1, wherein an upper surface of the LED die is elongated, and the anode electrode is disposed at one end and the cathode electrode is disposed at the other end.   2. The light emitting module according to claim 1, wherein an upper surface of the LED die is rectangular or square, and the anode electrode and the cathode electrode are disposed at respective corner portions.   4. The light emitting module according to claim 3, wherein the flexible printed circuit board is divided into two connection portions with the anode electrode or the cathode electrode of the LED die.   A plurality of LED dies are arranged face up on the circuit board, one flexible printed board is connected to the anode electrode and the cathode electrode of the plurality of LED dies, and the flexible printed board is connected to the LED die. 4. The light emitting module according to claim 1, wherein a portion overlapping with the light emitting portion is opened. 5.   The light emitting module according to claim 1, wherein the semiconductor substrate is Si.   7. The phosphor according to claim 1, wherein a phosphor is disposed only on an upper surface of the semiconductor layer while avoiding a connection portion between the anode electrode and the cathode electrode and the flexible printed circuit board. The light emitting module according to 1.

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