JP2016150536A - Hot stamp device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot stamp device which properly transfers a foil to a transfer surface having a protruding part at low costs.SOLUTION: A hot stamp device according to an embodiment includes: a transfer film 10 which is transferred to a transfer surface having a protruding part; and a pressing pad 104 which presses the transfer film 10 to the transfer surface. The pressing pad 104 is formed by a silicon material and has: a pressing surface 106a facing the transfer surface; and a facing surface 106b facing the pressing surface 106a. A recessed part 106c which corresponds to the protruding part of the transfer surface is formed on the facing surface 106b.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a hot stamp apparatus.

  Patent Document 1 discloses a hot stamp method for transferring a foil onto a transfer surface having a recess. In patent document 1, after pressing foil with a stamp member with respect to the transfer surface which has a recessed part in a pressure-reduced state, the press of a stamp member is cancelled | released in an atmospheric pressure state.

  Patent Document 2 discloses a curved surface transfer method for color copy. In the transfer method described in Patent Document 2, a color toner image is transferred to the surface of a material to be copied having a curved surface by being heated and pressed by silicon rubber provided in a heating printer.

  Patent Document 3 describes a thermal transfer method for a three-dimensional curved surface. In Patent Document 3, a three-dimensional curved foil transfer surface is inclined to obtain an approximate two-dimensional curved surface, and foil transfer is performed by horizontal relative movement of a thermal transfer roll provided with an inclined axis parallel to the foil transfer surface.

JP 2012-111045 A Japanese Patent Laid-Open No. 10-236088 Japanese Patent No. 2046649

  In Patent Document 1, since the pressing step is performed in a reduced pressure state, a vacuum chamber in which a product having a transfer surface and a stamp member are arranged is necessary, which increases the size and complexity of the equipment and increases the equipment cost. Further, since the inside of the vacuum chamber is set to a predetermined pressure, a time for evacuation is required, the molding cycle is long, and the production cost is increased. As the product becomes larger, the above problem becomes more prominent.

  In Patent Document 3, a three-dimensional curved surface having a straight line portion and a curved surface portion continuous with the straight portion is a transfer target, and the foil is pressed against the product by a linear roller. Moreover, since it is necessary to synchronize the inclination of a product and the movement of a roller, an installation becomes complicated and an installation cost becomes high.

  The present invention has been made against the background of the problems as described above, and an object of the present invention is to provide a hot stamp apparatus that can transfer a foil to a transfer surface having a convex portion at low cost. Is to provide.

  The hot stamp device according to an embodiment includes a transfer film transferred to a transfer surface having a convex portion, and a press pad that presses the transfer film against the transfer surface, and the press pad is made of a silicon material. And having a pressing surface facing the transfer surface and a facing surface facing the pressing surface, and a recess corresponding to the convex portion of the transfer surface is formed on the facing surface.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the hot stamp apparatus which can transfer foil favorably with respect to the transfer surface which has a convex part at low cost.

It is a figure which shows the front body structure of the hot stamp apparatus which concerns on embodiment. It is a figure which shows an example of a structure of the transfer film transcribe | transferred with the hot stamp apparatus which concerns on embodiment. It is a figure explaining the transfer process using the hot stamp apparatus which concerns on embodiment. It is a figure explaining the transfer process using the hot stamp apparatus which concerns on embodiment. It is a figure explaining the transfer process using the hot stamp apparatus which concerns on embodiment. It is a figure explaining the transfer process using the hot stamp apparatus which concerns on embodiment. It is a figure which shows the state of the press pad at the time of transcription | transfer. It is a figure which shows the state of the contact bonding layer and product at the time of transcription | transfer. It is a figure explaining the structure of the press pad used for the hot stamp apparatus of embodiment. It is a figure explaining the structure of the press pad used for the hot stamp apparatus of embodiment. It is a figure which shows the state of the press pad shown by FIG. 9, 10 at the time of transcription | transfer. It is a figure which shows the state of the press pad shown by FIG. 9, 10 at the time of transcription | transfer. It is a figure which shows the state of the press pad shown by FIG. 9, 10 at the time of transcription | transfer. It is a graph which shows the relationship between an adhesive layer temperature and an adhesive pressure. It is a graph which shows the relationship between product temperature and adhesive layer temperature. It is a graph which shows the relationship between product temperature and press pad temperature.

  Hereinafter, embodiments will be described with reference to the drawings. In the following drawings, components having the same action are denoted by the same reference numerals. In addition, the dimensional relationship in each figure does not reflect the actual dimensional relationship.

  A hot stamp apparatus according to an embodiment will be described with reference to FIG. FIG. 1 is a diagram illustrating an overall configuration of the hot stamp apparatus 100. The hot stamp apparatus 100 performs transfer on a product 101 that is a plate-like member curved in a convex shape. As shown in FIG. 1, the hot stamp apparatus 100 includes a fixing jig 102, a heater 103, and a pressing pad 104.

  As the transfer film 10 transferred to the product 101, for example, a transfer film having a structure as shown in FIG. 2 can be used. As shown in FIG. 2, the transfer film 10 includes a carrier layer 11, a release layer 12, a clear layer 13, a vapor deposition layer 14, and an adhesive layer 15.

  The carrier layer 11 is a base film that holds the clear layer 13 and the vapor deposition layer 14 transferred to the product 101. As the carrier layer 11, for example, an olefin resin having a thickness of 50 to 100 μm or a urethane resin can be used. The release layer 12 is provided for peeling the carrier layer 11 from the clear layer 13 after transfer.

  The clear layer 13 is a layer for protecting the vapor deposition layer 14. The clear layer 13 is made of an acrylic, urethane, or polyester resin having a thickness of 4 to 10 μm. The vapor deposition layer 14 is a metal layer such as Sn (tin) or In (indium).

  The adhesive layer 15 fixes the vapor deposition layer 14 on the transfer surface of the product 101. The adhesive layer 15 is made of an acrylic or vinyl chloride-based adhesive having a thickness of 3 to 10 μm. The adhesive layer 15 is a hot melt adhesive that is reduced in viscosity by heating.

  The configuration of the transfer film 10 is not limited to the above. For example, the metal vapor deposition film to be transferred may be directly formed on the base film.

  The fixing jig 102 holds the product 101 to be transferred. The product 101 is disposed on the fixing jig 102 so that the transfer surface having the convex portion faces upward. A heater 103 is disposed above the product 101. Further, the transfer film 10 is disposed above the heater 103. The heater 103 heats the transfer film 10 simultaneously with heating the product 101.

  Further, a pressing pad 104 is disposed on the transfer film 10. The pressing pad 104 is disposed so as to face the transfer surface of the product 101. The transfer film 10 is disposed between the product 101 and the pressing pad 104. The pressing pad 104 presses the transfer film 10 against the product 101 with a predetermined adhesive pressure during transfer. The pressing pad 104 is made of a silicon material. For example, a rubber having a rubber hardness of 5 to 50 degrees, stretchability of 200% or more, and heat resistance of 150 ° C. or more is preferably used.

  A driving unit (not shown) is connected to the pressing pad 104. The adhesion pressure of the transfer film 10 to the product 101 can be changed as appropriate. The pressing pad 104 is heated by flowing hot air of 200 to 250 ° C. inside, for example. For example, the heater 103 heats each component so that the temperature of the product 101 is 60 to 80 ° C. and the temperature of the transfer film 10 is 100 to 120 ° C. Note that heating means such as a heater coil for heating the fixing jig 102 and the pressing pad 104 may be provided.

  Although not shown in FIG. 1, the pressing pad 104 is provided with a concave portion formed corresponding to the convex portion of the product 101. A detailed configuration of the pressing pad 104 will be described later.

  Here, with reference to FIG. 3 to FIG. 6, the transfer process will be described using the hot stamp apparatus 100. 3 to 6 are process diagrams schematically showing a transfer process using the hot stamp apparatus 100. FIG.

  FIG. 3 shows a setting process of the transfer film 10 and the product 101. As shown in FIG. 3, first, the product 101 is mounted on the fixing jig 102 so that the transfer surface having the convex portion faces upward. In addition, the transfer film 10 is disposed so that the adhesive layer 15 faces the transfer surface of the product 101.

  FIG. 4 shows a heating process of the transfer film 10 and the product 101. As shown in FIG. 4, the transfer film 10 and the product 101 are heated by the heater 103.

  FIG. 5 shows a press / transfer process. As shown in FIG. 5, the pressing pad 104 moves to the product 101 side and presses the transfer film 10 against the transfer surface of the product 101. In the present embodiment, the adhesion pressure can be set to 0.2 MPa, for example.

  FIG. 6 shows a process of taking out the transfer film 10 and the product 101. While the pressing by the pressing pad 104 is released, the adhesive layer 15 is cooled, the adhesive layer 15 is solidified, and the vapor deposition layer 14 is fixed to the transfer surface of the product 101. Thereafter, the carrier layer 11 and the release layer 12 of the transfer film 10 are peeled from the product 101, whereby the product 101 in which the clear layer 13 and the vapor deposition layer 14 are fixed to the transfer surface having the convex portions by the adhesive layer 15 is obtained.

  Here, the effect of the embodiment will be described with reference to FIGS. FIG. 7 is a view showing the state of the pressing pad during transfer, and FIG. 8 is a view showing the state of the adhesive layer and the product during transfer. In FIG. 7, the point where the pressing pad 104 first contacts the transfer film 10 is indicated by a circle, and this is the starting point. In the example shown in FIG. 7, the vertex of the convex portion of the product 101 is the starting point.

  As described above, the pressing pad 104 is a soft pad having a rubber hardness of 5 to 50 degrees. For this reason, as the pressing pad 104 is pressed against the transfer film 10, the contact area between the pressing pad 104 and the transfer film 10 gradually increases from the starting point toward the outside of the transfer film 10.

  Thereby, the transfer film 10 can be bonded to the product 101 from the starting point to the outside. That is, the transfer film 10 is gradually attached from the apex of the convex portion of the product 101 toward the skirt. For this reason, when press-transferring to the product 101 having the convex portion, the transfer film 10 can be bonded by extending the wrinkles while extruding the bubbles, and the appearance quality can be improved.

  Further, as described above, the transfer is performed in a state where the product 101, the pressing pad 104, and the transfer film 10 are each heated to a predetermined temperature. For this reason, as shown in FIG. 8, when the adhesive layer 15 of the transfer film 10 comes into contact with the product 101, it is possible to suppress heat escaping from the transfer film 10 to the product 101 side. Thereby, the temperature fall of the contact bonding layer 15 can be suppressed and it becomes possible to adhere | attach the transfer film 10 to the product 101 with a low adhesion pressure.

  Here, the configuration of the pressing pad 104 will be described in detail with reference to FIGS. The pressing pad 104 has a first pressing pad portion 105 shown in FIG. 9 and a second pressing pad portion 106 shown in FIG.

  As shown in FIG. 9, the 1st press pad part 105 is a flat member, and is provided with the 1st surface 105a, the 2nd surface 105b, and the recessed part 105c. A recess 105c is formed in the first surface 105a. The concave portion 105 c is formed corresponding to the convex portion of the product 101. The second surface 105b facing the first surface 105a is attached to the hot stamp device 100.

  As shown in FIG. 10, the second pressing pad portion 106 is a flat plate-like member, and includes a pressing surface 106a, a facing surface 106b, and a concave portion 106c. The pressing surface 106 a is disposed to face the transfer surface of the product 101, contacts the transfer film 10, and presses the contact film against the product 101. A concavity 106c is formed on the facing surface 106b facing the pressing surface 106a. The concave portion 106 c is formed corresponding to the convex portion of the product 101.

  As shown in FIG. 11, the facing surface 106b is disposed to face the first surface 105a shown in FIG. Accordingly, the press pad 104 is formed with a hollow portion corresponding to the shape of the transfer surface of the product 101 by the concave portion 105c and the concave portion 106c. In the present embodiment, the first pressing pad portion 105 has a rubber hardness of 50 degrees, and the second pressing pad portion 106 has a rubber hardness of 10 degrees.

  Here, the state of the pressing pad shown in FIGS. 9 and 10 during transfer will be described with reference to FIGS. In FIG. 11, the point where the pressing surface 106a of the pressing pad 104 first contacts the transfer film 10 is indicated by a circle, and this is the starting point.

  As described above, as the pressing pad 104 is pressed against the transfer film 10 side, the area where the pressing pad 104 and the transfer film 10 come in contact gradually from the starting point toward the outside of the transfer film 10 as shown in FIG. Increase.

  As described above, since the second pressing pad portion 106 is softer than the first pressing pad portion 105, the deformation of the second pressing pad portion 106 is larger than that of the first pressing pad portion 105. Since the press pad 104 is formed with a thinned portion including a concave portion 106c and a concave portion 105c, the second press pad portion 106 is deformed so as to follow the transfer surface as it is pressed against the product 101. As a result, it is possible to appropriately perform hot stamping on the product 101 having the convex portion without setting the reduced pressure state.

  FIG. 14 shows the relationship between the adhesive layer temperature and the adhesive pressure. As described above, in the embodiment, the product 101 is heated to 60 to 80 ° C., and the transfer film 10 is heated to 100 to 120 ° C. In this case, as indicated by a broken line in FIG. 14, the temperature of the adhesive layer 15 is 90 to 100 ° C. Since the adhesive layer 15 is a hot-melt adhesive and softens as the temperature increases, the transfer film 10 can be attached with a low adhesive pressure.

  FIG. 15 shows the relationship between the product temperature and the adhesive layer temperature. In FIG. 15, the result indicated by diamonds is when the temperature of the pressing pad 104 is 100 ° C., and the result indicated by squares is when the temperature of the pressing pad 104 is 150 ° C.

  As shown in FIG. 15, it can be seen that when the temperature of the product 101 is increased, the temperature of the adhesive layer 15 is increased. Further, as the temperature of the pressing pad 104 increases, the temperature of the adhesive layer 15 increases. For this reason, in order to reduce the adhesive pressure of the pressure pad 104, it is necessary to adjust the temperature of the product 101 and the temperature of the pressure pad 104 so that the temperature of the adhesive layer 15 does not decrease.

  FIG. 16 is a graph showing the relationship between the product temperature and the pressure pad temperature. As described above, the transfer film 10 can be bonded with an adhesive pressure of 0.2 MPa or less by setting the temperature of the product 101 to 60 to 80 ° C. and the temperature of the pressing pad 104 to 100 to 150 ° C. It becomes possible.

  Note that the present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention. The process procedures shown in the embodiment, the shapes and combinations of the constituent members, and the like are examples, and can be variously changed based on process conditions, design requirements, and the like. For example, the shape of the concave portions of the first press pad portion 105 and the second press pad portion 106 (the shape of the lightening portion of the press pad 104) can be appropriately changed according to the shape of the convex portion of the product 101. .

DESCRIPTION OF SYMBOLS 100 Hot stamp apparatus 101 Product 102 Fixing jig 103 Heater 104 Press pad 105 1st press pad part 106 2nd press pad part 105a 1st surface 105b 2nd surface 105c Recess 106a Press surface 106b Opposing surface 106c Recess 10 Transfer film 11 Carrier Layer 12 Release layer 13 Clear layer 14 Deposition layer 15 Adhesive layer

Claims (1)

A transfer film to be transferred to a transfer surface having a convex portion;
A pressing pad for pressing the transfer film against the transfer surface;
With
The pressing pad is made of a silicon material,
A pressing surface facing the transfer surface, and a facing surface facing the pressing surface;
A concave portion corresponding to the convex portion of the transfer surface is formed on the facing surface.
Hot stamp device.

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