JP2016150470A - Cable with resin molded article and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a cable with a resin molded article which can suppress damage of electronic components by heat of a molten resin while suppressing an increase in the number of components, and to provide a cable with a resin molded article.SOLUTION: A cable with a resin molded article 1 comprises a sensor 2 that has a body 20 and lead wires 21, 22 led out from the body 20, a cable 3 that is connected with the lead wires 21, 22 of the sensor 2 at an end thereof, and a resin molded article 4 that covers the sensor 2 side end of the cable 3 and a part of the lead wires 21, 22 and is formed with a storage space 40 storing the body 20 of the sensor 2. The resin molded article 4 is formed with a through hole 420 penetrating in a direction crossing the extension direction of the lead wires 21, 22 to make the lead wires 21, 22 face outside. A space 400 is formed between an inner surface 40a of the storage space 40 and the body 20 of the sensor 2. The through hole 420 and the storage space 40 communicate with each other.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cable with a resin molded body and a method for manufacturing a cable with a resin molded body.

  2. Description of the Related Art Conventionally, a cable with a resin molded body in which a sensor as an electronic component connected to an end of a cable is accommodated and the end of the cable is molded is known. Such a cable with a resin molded body is excellent in waterproofness and vibration resistance, and is used, for example, for detecting various physical quantities in a vehicle. Patent Document 1 discloses a temperature sensor disposed as a cable with a resin molded body, for example, in a transmission of an automobile, and Patent Document 2 discloses a cable with a resin molded body, for example, for detecting the rotation speed of an automobile wheel. A rotation detection sensor is described.

  The temperature sensor described in Patent Literature 1 includes a temperature element that measures temperature, an electric wire electrically connected to the temperature element, a bracket that supports the temperature element and the electric wire, and a connection between the temperature element and the temperature element in the electric wire. And a mold resin portion that molds the side end portion together with the end portion of the bracket.

  The rotation detection sensor described in Patent Document 2 is electrically connected to a cylindrical holder, a sensor element held at the tip of the holder, a case for housing the holder and the sensor element, and the sensor element. And a molded part for integrating the holder, the case, and the cable. In addition, in this rotation detection sensor, the case and the cable are integrated by the molded part in order to stabilize the attitude of the case in which the sensor element is housed and the attitude of the cable and to maintain good sensitivity of the sensor element. Has been.

JP 2012-37384 A JP2013-148556A

  The molten resin injected into the mold for forming the molded body is easier to mold because the higher the temperature, the better the fluidity. However, in the temperature sensor described in Patent Document 1, since the temperature element is directly molded with a mold resin, the temperature element may be damaged depending on the temperature of the molten resin at the time of molding. On the other hand, in the rotation detection sensor described in Patent Document 2, since the sensor element is accommodated in the case and the case and the cable are molded and integrated by the molding part, the molding part is molded. In this case, the molten resin does not directly touch the sensor element, and the possibility that the sensor element is damaged due to the temperature of the molten resin is suppressed. However, in the rotation detection sensor described in Patent Document 2, it is necessary to separately prepare a case for accommodating the sensor element, and there is a problem that the number of necessary parts and the number of work processes are increased.

  Then, this invention aims at providing the manufacturing method of the cable with a resin molding, and the cable with a resin molding which can suppress the damage of the electronic component by the heat | fever of molten resin, suppressing the increase in a number of parts. And

  In order to solve the above problems, the present invention provides an electronic component having a main body and a lead wire led out from the main body, a cable in which the lead wire of the electronic component is connected to an end, and the cable. A resin molded body that covers an end of the electronic component and a part of the lead wire, and that has a housing space in which the main body of the electronic component is accommodated. A through-hole penetrating in a direction intersecting the extending direction of the lead wire and facing the lead wire to the outside is formed, and a gap is formed between the inner surface of the housing space and the main body of the electronic component. A cable with a resin molded body in which the through hole and the accommodation space communicate with each other is provided.

  Further, in order to solve the above problems, the present invention provides an electronic component having a main body and a lead wire led out from the main body, a cable in which the lead wire of the electronic component is connected to an end, A resin molded body cable comprising: a resin molded body that covers an end portion of the electronic component side of the cable and a part of the lead wire, and a housing space in which the main body of the electronic component is housed. In the manufacturing method, the mold for forming the resin molded body includes an upper mold and a lower mold, and a cylindrical portion extending in a direction intersecting with a mold alignment direction of the upper mold and the lower mold. By using the auxiliary mold and matching the upper mold and the lower mold, the lead wire is placed between the upper wall portion provided in the upper mold and the lower wall portion provided in the lower mold. Sandwiched between the electric cylinder and the cylindrical part of the auxiliary type. An injection process for injecting molten resin into a cavity of the mold in a state in which the main body of the part is housed and the tip of the cylindrical portion is abutted against the upper wall portion and the lower wall portion; In the step, the accommodation space is controlled by the inflow of the molten resin into the accommodation space by the upper wall portion of the upper mold, the lower wall portion of the lower mold, and the cylindrical portion of the auxiliary mold. A method for producing a cable with a resin molded body is provided in which a gap is formed between the inner surface of the electronic component and the main body of the electronic component.

  According to the method for manufacturing a cable with a resin molded body and the cable with a resin molded body according to the present invention, while suppressing an increase in the number of parts, the breakage of the electronic components connected to the end of the cable due to heat of the molten resin is suppressed. It becomes possible to do.

1 shows a configuration example of a sensor module according to an embodiment of the present invention, where (a) is a perspective view showing an external appearance, and (b) is a perspective view showing an internal structure of the sensor module by omitting an illustration of a resin molding. It is. It is the perspective view of a sensor module seen from the direction opposite to Drawing 1 (a). It is sectional drawing of a sensor module. FIG. 3 is a perspective view showing a mold used for manufacturing a sensor module, wherein (a) shows an upper mold, (b) shows a lower mold, and (c) shows an auxiliary mold. (A) is sectional drawing of the metal mold | die in the injection process which forms a resin molding, (b) is the sectional view on the AA line of (a), (c) is the sectional view on the BB line of (a). FIG.

[Embodiment]
Hereinafter, with reference to FIG. 1 thru | or FIG. 5, the sensor module which concerns on embodiment of this invention, and its manufacturing method are demonstrated. This sensor module is mounted on a vehicle, for example, and is used as an in-vehicle sensor that measures the rotational speed of a wheel, the rotational angle of a handle, and the like. This sensor module is an embodiment of a cable with a resin molded body according to the present invention.

(Configuration of sensor module)
The configuration of the sensor module 1 will be described with reference to FIGS. 1 to 3.

  1A and 1B show a configuration example of a sensor module 1 according to an embodiment of the present invention, in which FIG. 1A is a perspective view showing an appearance, and FIG. 1B is an illustration of a resin molded body 4 (described later) of the sensor module 1. It is a perspective view which abbreviate | omits and shows the internal structure. FIG. 2 is a perspective view of the sensor module 1 as viewed from the opposite direction to FIG. FIG. 3 is a cross-sectional view of the sensor module 1.

  The sensor module 1 includes a sensor 2 as an electronic component for measuring a physical quantity, a cable 3 to which the sensor 2 is connected to an end, and a resin molded body 4 that covers the end of the cable 3.

  The sensor 2 includes, for example, a main body 20 formed by sealing a sensor chip on which a Hall element or the like for detecting magnetic strength is mounted with a sealing material such as ceramic or plastic, and a plurality of (this embodiment) The embodiment has two lead wires 21 and 22. The sensor 2 is not limited to one that measures magnetism, such as a hall switch or a GMR (Giant Magneto-Resistance) sensor, but may be any sensor that can measure a physical quantity while being covered with the resin molded body 4, such as a temperature sensor or a vibration sensor. Etc.

  In the cable 3, the first electric wire 31 formed by covering the conductive wire 311 with the insulator 312 and the second electric wire 32 formed by covering the conductive wire 321 with the insulator 322 are collectively covered with the sheath 33. Yes. In the present embodiment, a space is interposed between the first and second electric wires 31 and 32 and the sheath 33. However, the present invention is not limited to this. For example, the first and second electric wires 31 and 32 are bundled together. Thus, a presser roll for gathering together, a Kevlar (registered trademark) as a cushioning material, or the like may be interposed.

  As shown in FIG. 1B, in the cable 3, the first and second electric wires 31, 32 protrude from the sheath 33 at the end to which the sensor 2 is connected. In the present embodiment, the sheath 33 is made of a resin material such as urethane.

  In the first electric wire 31, the lead wire 311 exposed from the insulator 312 is connected to one lead wire 21 of the sensor 2 at the tip portion protruding from the sheath 33. Similarly, in the second electric wire 32, the lead wire 321 exposed from the insulator 322 is connected to the other lead wire 22 of the sensor 2 at the tip portion protruding from the sheath 33. Connection of the conducting wires 311 and 321 and the lead wires 21 and 22 is performed by, for example, soldering or welding.

  The resin molded body 4 covers an end portion of the cable 3 on the sensor 2 side and a part of the lead wires 21 and 22, and an accommodation space 40 (shown in FIG. 3) in which the main body 20 of the sensor 2 is accommodated in the longitudinal direction. It is formed in the edge part. The resin molded body 4 is made of a resin such as nylon or polybutylene terephthalate (PBT), and is formed by injection molding. Note that the material of the resin molded body 4 is not limited to the above, and may be the same material as the sheath 33, for example. That is, the material of the resin molded body 4 may be any resin that can be molded, and can be appropriately selected according to the application.

  The resin molded body 4 includes a cylindrical tube portion 41 in which a housing space 40 is formed, and a prism-shaped barrel portion 42 that molds the end portion on the sensor 2 side of the cable 3 and part of the lead wires 21 and 22. And a cylindrical lead-out portion 43 that protrudes from one end of the body portion 42 in the lead-out direction of the cable 3 (on the side opposite to the sensor 2). The cylinder part 41, the body part 42, and the lead-out part 43 are aligned along the longitudinal direction of the resin molded body 4 and are integrally formed. The cable 3 is led out from the lead-out part 43 along the longitudinal direction of the resin molded body 4, and a body part 42 is provided between the lead-out part 43 and the cylinder part 41. The lead wires 21 and 22 of the sensor 2 extend parallel to the longitudinal direction of the resin molded body 4 inside the trunk portion 42.

  As shown in FIG. 3, a gap 400 is formed between the main body 20 of the sensor 2 and the inner surface 40 a of the accommodation space 40 in the cylinder portion 41. The gap 400 is formed between the inner surface 40 a of the housing space 40 over the entire side surface of the main body 20 along the longitudinal direction of the resin molded body 4. Thereby, the main body 20 of the sensor 2 and the resin molding 4 are non-contact.

  Moreover, the cylinder part 41 has the opening 41a which makes the main body 20 of the sensor 2 face outside in the longitudinal direction of the cable 3 in the front-end | tip part. In addition, in this Embodiment, although the cylinder part 41 is a square cylinder shape, it is not restricted to this, For example, cylindrical shapes other than a square shape or square shape may be sufficient. Further, the cylindrical portion 41 may have a rectangular cylindrical inner surface and a cylindrical outer surface. That is, the shape of the cylinder part 41 is not particularly limited as long as it has a cylinder shape that can accommodate the main body 20 of the sensor 2.

  The body portion 42 is formed with a through-hole 420 that penetrates the resin molded body 4 in a direction intersecting the extending direction of the lead wires 21 and 22 of the sensor 2 and faces the lead wires 21 and 22 to the outside. . In the present embodiment, the through-hole 420 penetrates the resin molded body 4 in a direction orthogonal to the extending direction of the lead wires 21 and 22 (longitudinal direction of the resin molded body 4) and the arrangement direction of the lead wires 21 and 22. doing. In the present embodiment, the body portion 42 has a prismatic shape along with the shape of the cylindrical portion 41. However, the body portion 42 may be, for example, a columnar shape, and the shape is not particularly limited.

  The through hole 420 communicates with the accommodation space 40. In other words, the lead wires 21 and 22 that are visible from the outside of the resin molded body 4 through the through-hole 420 are directly connected to the main body 20 of the sensor 2, and between the portion visible through the through-hole 420 and the main body 20. The resin molded body 4 is not in contact with the lead wires 21 and 22 in FIG.

(Method for manufacturing sensor module)
Next, with reference to FIG.4 and FIG.5, the manufacturing method of the sensor module 1 is demonstrated.

  FIG. 4 is a perspective view showing a mold used for manufacturing the sensor module 1, wherein (a) is an upper mold, (b) is a lower mold, and (c) is an auxiliary mold. 5A is a cross-sectional view of the mold in the injection process for forming the resin molded body 4, FIG. 5B is a cross-sectional view taken along the line AA in FIG. 5A, and FIG. It is the BB sectional view taken on the line of Fig.5 (a).

  In the manufacturing method according to the present embodiment, an upper mold 51, a lower mold 52, and an auxiliary mold 53 are used as the mold 5 for forming the resin molded body 4.

  The upper mold 51 includes a first recess 511 for molding the cylindrical portion 41 and the body portion 42 of the resin molded body 4, a second recess 512 for molding the lead-out portion 43 of the resin molded body 4, and the cable 3. A third recess 513 for supporting the lead-out portion from the resin molded body 4 is formed. The first recess 511 has a groove shape with an end on the opposite side to the second and third recesses 512 and 513 opened.

An upper wall 510 is erected on the bottom surface 511 a of the first recess 511. The upper wall 510 has a flat plate shape orthogonal to the extending direction of the first recess 511, and a pair of side surfaces 511 b and 511 c and the upper wall 510 of the first recess 511 facing each other with the upper wall 510 interposed therebetween. A first gap S ₁₁ and a second gap S ₁₂ (see FIG. 5B) are formed between the gaps and serve as a flow path for the molten resin in the injection process.

  The front end surface 510a of the upper wall portion 510 and the mold matching surface 51a of the upper mold 51 with the lower mold 52 are on one virtual plane. That is, the protruding height of the upper wall portion 510 from the bottom surface 511a is a height corresponding to the width of the pair of side surfaces 511b and 511c in the direction orthogonal to the bottom surface 511a. The upper mold 51 is formed with a molten resin injection hole 514.

  The lower mold 52 is configured in the same manner as the upper mold 51 except for holding grooves 520b and 520c described later. That is, the lower mold 52 includes a first recess 521 for molding the cylindrical portion 41 and the body portion 42 of the resin molded body 4, a second recess 522 for molding the lead-out portion 43 of the resin molded body 4, and a cable. 3 is formed with a third concave portion 523 for supporting a lead-out portion from the resin molded body 4. The first recess 521 has a groove shape with an end on the opposite side to the second and third recesses 522 and 523 opened.

A lower wall portion 520 is erected on the bottom surface 521 a of the first recess 521 of the lower mold 52. The lower wall portion 520 has a flat plate shape orthogonal to the extending direction of the first recess portion 521, and a pair of side surfaces 521 b and 521 c of the first recess portion 521 and the lower wall portion 520 facing each other with the lower wall portion 520 interposed therebetween. A first gap S ₂₁ and a second gap S ₂₂ (see FIG. 5 (b)) that form a flow path for the molten resin in the injection process are formed. The front end surface 520a of the lower wall portion 520 and the mold matching surface 52a of the upper mold 51 in the lower mold 52 are on one virtual plane. That is, the protruding height of the lower wall portion 520 from the bottom surface 521a is a height corresponding to the width of the pair of side surfaces 521b and 521c in the direction orthogonal to the bottom surface 521a.

  Holding grooves 520b and 520c for holding the lead wires 21 and 22 of the sensor 2 in the injection process are formed on the distal end surface 520a of the lower wall portion 520. In this embodiment, no holding groove is formed on the upper wall portion 510, but a holding groove for holding the lead wires 21 and 22 may be formed on the tip surface 510a of the upper wall portion 510. . In other words, the holding groove for holding the lead wires 21 and 22 may be formed in at least one of the upper wall portion 510 and the lower wall portion 520. The upper wall portion 510 and the lower wall portion 520 constitute a pair of wall portions provided on the upper mold 51 and the lower mold 52.

  As shown in FIG. 5A, the upper mold 51 and the lower mold 52 are such that the bottom surface 511 a of the first recess 511 of the upper mold 51 and the bottom surface 521 a of the first recess 521 of the lower mold 52 are the end portions of the cable 3. And the molds are matched so as to face each other with the sensor 2 in between. When the upper mold 51 and the lower mold 52 are matched, the first recess 511 and the second recess 512 of the upper mold 51 communicate with the first recess 521 and the second recess 522 of the lower mold 52, and the upper mold 51 The sheath 33 of the cable 3 is sandwiched between the third recess 513 and the third recess 523 of the lower mold 52.

Further, the die matching of the upper die 51 and lower die 52, through the first gap _{S 21} and the communication of the first gap _{S 11} and the lower mold 52 of the upper mold 51, the second gap _{S 12} of the upper mold 51 and the lower The second gap S ₂₂ of the mold 52 communicates with the tip surface 510 a of the upper wall portion 510 and the tip surface 520 a of the lower wall portion 520, and the lead wires 21 and 22 of the sensor 2 are connected to the upper wall portion 510. It is sandwiched and held between the lower wall portion 520.

  As shown in FIG. 4C, the auxiliary mold 53 is erected on the flat base portion 531 and the base portion 531, and in a direction intersecting the mold alignment direction of the upper mold 51 and the lower mold 52. And a cylindrical portion 532 that extends. A front end surface 532 a of the cylindrical portion 532 is a flat surface, and a space 530 capable of accommodating the main body 20 of the sensor 2 is formed inside the cylindrical portion 532. The auxiliary mold 53 slides in the extending direction of the first recesses 511 and 521 of the upper mold 51 and the lower mold 52 (the extending direction of the lead wires 21 and 22) in a state where the upper mold 51 and the lower mold 52 are combined. Is possible. In addition, in this Embodiment, although the cylinder part 532 is a square cylinder shape, it is not restricted to this, For example, a cylinder shape and square tube shapes other than a square may be sufficient.

(Method for manufacturing sensor module)
Next, a method for manufacturing the sensor module 1 will be described.

  The manufacturing method of the sensor module 1 includes an arrangement step in which the subassembly body 2 a in which the sensor 2 is connected to the end of the cable 3 is arranged on the lower mold 52, and the upper mold 51 and the auxiliary mold 53 are formed on the lower mold 52. A mold matching process for matching, and an injection process for injecting molten resin from the injection hole 514 into the cavity 5a of the mold 5 formed by the mold matching.

  In the arranging step, the sub-assembly body 2a formed by connecting the conducting wires 311 and 321 of the first and second electric wires 31 and 32 protruding from the sheath 33 to the lead wires 21 and 22 of the sensor 2, respectively, The part 22 is disposed so as to be accommodated in the holding grooves 520 b and 520 c of the lower wall part 520 in the lower mold 52.

  In the mold matching step, the upper mold 51 is moved in a mold matching direction orthogonal to the mold matching surface 52 a of the lower mold 52, and the mold matching surface 51 a of the upper mold 51 is abutted against the mold matching surface 52 a of the lower mold 52. Thereafter, the auxiliary mold 53 is further slid, and the front end surface 532a of the cylindrical portion 532 is abutted against the side surface 510d of the upper wall portion 510 and the side surface 520d of the lower wall portion 520. At this time, the entire body 20 of the sensor 2 is accommodated in the space 530 in the cylindrical portion 532, and the openings of the first concave portions 511 and 521 of the upper die 51 and the lower die 52 are closed by the base portion 531 of the auxiliary die 53. Is done.

The cavity 5a of the mold 5 includes a first cavity 5b closer to the second recesses 512 and 522 than the upper wall 510 and the lower wall 520 in the first recesses 511 and 521 of the upper mold 51 and the lower mold 52, and an auxiliary mold. and a second cavity 5c of the outer peripheral side of the tubular portion 532 in 53, a first cavity 5b and the second cavity 5c is a first gap _{S 11} and the second gap _{S 12} and the lower mold 52 of the upper die 51 It communicates with one gap _{S 21} and the second gap _{S 22.}

In the injection step, the molten resin is injected from the end of the first cavity 5b on the second recess 512, 522 side. The molten resin injected into the first cavity 5b is supplied to the second cavity 5c through the first gap _{S 11, S 21} and the second gap _{S 12, S 22} of the upper mold 51 and the lower die 52. The first cavity 5b and the first gap _{S 11, S 21} and the second gap _{S 12,} the molten resin was solidified in _{S 22} the next body part 42 of the resin molded body 4, the molten resin was solidified at the second cavities 5c is molded It becomes the cylinder part 41 of the body 4. Further, the molten resin solidified in the second concave portions 512 and 522 becomes the lead-out portion 43 of the resin molded body 4.

  In this injection process, the upper wall portion 510 of the upper die 51, the lower wall portion 520 of the lower die 52, and the cylindrical portion 532 of the auxiliary die 53 restrict the inflow of molten resin into the accommodation space 40 (see FIG. 3). As a result, a gap 400 is formed between the inner surface 44 a of the accommodation space 40 and the main body 20 of the sensor 2. In other words, the void 400 is formed by pulling out the cylindrical portion 532 of the auxiliary mold 53 from the solidified molten resin. Further, the through hole 420 of the resin molded body 4 is formed by pulling out the upper wall portion 510 and the lower wall portion 520 from the solidified molten resin.

  Through the above steps, the resin in which the gap 400 is formed between the inner surface 40a of the housing space 40 and the main body 20 of the sensor 2 and the through hole 420 is formed so that the lead wires 21 and 22 of the sensor 2 face the outside. The sensor module 1 having the molded body 4 is obtained.

(Operation and effect of the embodiment)
According to the embodiment described above, the following operations and effects (1) to (4) can be obtained.

(1) In the injection step of molding the resin molded body 4, the main body 20 of the sensor 2 is accommodated by the upper wall portion 510 of the upper mold 51, the lower wall section 520 of the lower mold 52, and the cylindrical portion 532 of the auxiliary mold 53. Since the inflow of the molten resin into the housing space 40 is restricted, the main body 20 of the sensor 2 can be prevented from being damaged by the heat of the molten resin. Further, the cable 3 and the sensor 2 can be molded by the resin molded body 4 without using a case for protecting the main body 20 of the sensor 2 from the heat of the molten resin. The work to be accommodated in the case or the like is not necessary, and the number of work steps can be reduced.

(2) The resin molded body 4 is formed with a through hole 420 that exposes the lead wires 21 and 22 of the sensor 2 to the outside, and the accommodation space 40 that houses the main body 20 of the sensor 2 communicates with the through hole 420. Therefore, it can be visually confirmed after the molding of the resin molded body 4 whether the molten resin has leaked to the main body 20 side along the lead wires 21 and 22 in the injection process. That is, for example, in the mold matching process, the lead wires 21 and 22 are detached from the holding grooves 520b and 520c, and there is a larger gap than usual between the distal end surface 510a of the upper wall portion 510 and the distal end surface 520a of the lower wall portion 520. If it has been completed, the molten resin leaking along the lead wires 21 and 22 from this gap may reach the main body 20 and the main body 20 may be damaged by the heat. Then, by visually confirming the lead wires 21 and 22 from both sides of the through-hole 420, it is possible to confirm the presence or absence of such leakage of the molten resin. Thereby, it can prevent that the sensor module 1 with which the main body 20 of the sensor 2 may be damaged is shipped.

(3) Since the resin molded body 4 has the opening 41a at the distal end portion of the cylindrical portion 41, the main body 20 of the sensor 2 in the accommodation space 40 can be visually observed from the opening 41a. For this reason, for example, it can be confirmed whether or not the molten resin has leaked from the gap between the cylindrical portion 532 of the auxiliary mold 53 and the upper wall portion 510 or the lower wall portion 520. Similarly to the above (2), the sensor 2 It is possible to prevent the sensor module 1 that may be damaged in the main body 20 from being shipped.

(4) Since the through hole 420 is formed by pulling out the upper wall portion 510 and the lower wall portion 520, the through hole 420 can be easily formed. Further, since the gap 400 between the main body 20 of the sensor 2 and the inner surface 40a of the accommodation space 40 is formed by pulling out the cylindrical portion 532 of the auxiliary mold 53, the gap 400 can be easily formed.

(5) In the injection process, the lead wires 21 and 22 of the sensor 2 are held in the holding grooves 520b and 520c formed in the lower wall portion 520, so that the front end surface 510a of the upper wall portion 510 and the lower wall portion 520 The lead wires 21 and 22 can be reliably held while narrowing the gap with the front end surface 520a, and leakage of molten resin and displacement of the sensor 2 can be suppressed.

(Summary of embodiment)
Next, the technical idea grasped from the embodiment described above will be described with reference to the reference numerals in the embodiment. However, each reference numeral in the following description does not limit the constituent elements in the claims to members or the like specifically shown in the embodiment.

[1] An electronic component (sensor 2) having a main body (20) and lead wires (21, 22) led out from the main body (20), and the lead wires (21, 22) of the electronic component (2) The cable (3) connected to the end, the end of the cable (3) on the electronic component (2) side, and a part of the lead wires (21, 22) are covered, and the electronic component (2) A resin molded body (4) in which an accommodation space (40) in which the main body (20) is accommodated is formed, and the lead wire (21, 22) is extended to the resin molded body (4). A through hole (420) that penetrates in a direction intersecting the direction and faces the lead wires (21, 22) to the outside is formed, and the inner surface (40a) of the housing space (40) and the electronic component (2) ) Is formed between the body (20) and a gap (400), Serial through-hole and (420) and the receiving space (40) is communicated, a resin molded body with cable (1).

[2] The resin molded body cable (1) according to [1], wherein the resin molded body (4) has an opening (41a) that faces the body (20) of the electronic component (2) to the outside. ).

[3] The through hole (420) includes a pair of wall portions (upper wall portions) provided in the upper mold (51) and the lower mold (52) of the mold (5) for molding the resin molded body (4). 510 and the lower wall portion 520) are formed by pulling out the cable (1) with a resin molded body according to the above [1] or [2].

[4] The mold (5) extends in a direction intersecting with the mold alignment direction of the upper mold (51) and the lower mold (52) and protrudes into the pair of wall portions (510, 520). The auxiliary die (52) having a cylindrical portion (532) applied thereto, and the gap (400) is formed by pulling out the cylindrical portion (532) of the auxiliary die (53), [3] (1) A cable with a resin molded body according to the above.

[5] An electronic component (2) having a main body (20) and lead wires (21, 22) led out from the main body (20), and the lead wires (21, 22) of the electronic component (2) are ends. Covering the cable (3) connected to the part, the end of the cable (3) on the electronic component (2) side and part of the lead wires (21, 22), and the electronic component (2) A resin molded body (4) having a housing space (40) in which the main body (20) is housed, and a method for producing a cable with a resin molded body (1), the resin molded body (4) ) As the mold (5) for forming the upper mold (51) and the lower mold (52), and the direction intersecting the mold alignment direction of the upper mold (51) and the lower mold (52) An auxiliary die (53) having a cylindrical portion (532) extending to the upper die (51) and the front By matching the lower mold (52), the upper wall (510) provided on the upper mold (51) and the lower wall (520) provided on the lower mold (52) are arranged. The lead wires (21, 22) are sandwiched, and the main body (20) of the electronic component (2) is accommodated in the cylindrical portion (532) of the auxiliary mold (52) and the tip of the cylindrical portion (532). An injection step of injecting a molten resin into the cavity (5a) of the mold (5) in a state where the portion is abutted against the upper wall portion (510) and the lower wall portion (520), The upper space (510) of the upper mold (51), the lower wall (520) of the lower mold (52), and the cylindrical part (532) of the auxiliary mold (53) By restricting the inflow of the molten resin into (40), the storage space (40) The gap between the main body (20) (400) is formed, the manufacturing method of the resin molded body with cable (1) surface (40a) and the electronic component (2).

[6] A through hole (420) that penetrates the resin molded body (4) in a direction intersecting the extending direction of the lead wires (21, 22) and faces the lead wire to the outside, The method for producing a cable (1) with a resin molded body according to [5], which is formed by pulling out the wall portion (510) and the lower wall portion (520).

[7] In the injection step, the lead wires (21, 22) are inserted into the holding grooves (520b, 520c) formed in at least one of the upper wall portion (510) and the lower wall portion (520). The manufacturing method of the cable (1) with a resin molding as described in said [5] or [6] hold | maintained.

  While the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

1 ... sensor module 2 ... sensor (electronic component)
DESCRIPTION OF SYMBOLS 20 ... Main body 21,22 ... Lead wire 3 ... Cable 4 ... Resin molding 40 ... Accommodating space 40a ... Inner surface 41a ... Opening 400 ... Gap 420 ... Through-hole 5 ... Mold 5a ... Cavity 51 ... Upper die 510 ... Upper wall part 52 ... Lower mold 520 ... Lower wall part 520b, 520c ... Holding groove 53 ... Auxiliary mold 531 ... Base part 532 ... Tube part

Claims (7)

An electronic component having a main body and lead wires derived from the main body;
A cable in which the lead wire of the electronic component is connected to an end; and
A resin molded body that covers an end of the cable on the electronic component side and a part of the lead wire, and has a housing space in which the main body of the electronic component is housed.
The resin molded body is formed with a through-hole penetrating in a direction intersecting the extending direction of the lead wire and facing the lead wire to the outside,
A gap is formed between the inner surface of the housing space and the main body of the electronic component,
The through hole and the accommodation space communicated,
Cable with resin molding. The resin molded body has an opening that exposes the main body of the electronic component to the outside.
The cable with a resin molded body according to claim 1. The through hole was formed by pulling out a pair of wall portions provided in an upper mold and a lower mold of a mold for molding the resin molded body,
The cable with a resin molded body according to claim 1 or 2. The mold includes an auxiliary mold having a cylindrical portion that extends in a direction intersecting the mold alignment direction of the upper mold and the lower mold and is abutted against the pair of wall portions,
The gap is formed by pulling out the cylindrical portion of the auxiliary mold,
The cable with a resin molded body according to claim 3. An electronic component having a main body and a lead wire led out from the main body, a cable in which the lead wire of the electronic component is connected to an end portion, an end portion on the electronic component side of the cable, and a part of the lead wire And a resin molded body in which a housing space for housing the main body of the electronic component is formed, and a method of manufacturing a cable with a resin molded body,
As a mold for forming the resin molded body, an upper mold and a lower mold, and an auxiliary mold having a cylindrical portion extending in a direction intersecting the mold alignment direction of the upper mold and the lower mold,
By matching the upper mold and the lower mold, the lead wire is sandwiched between an upper wall portion provided in the upper mold and a lower wall portion provided in the lower mold,
The main body of the electronic component is accommodated in the cylindrical portion of the auxiliary mold, and the molten resin is injected into the cavity of the mold in a state where the tip portion of the cylindrical portion is abutted against the upper wall portion and the lower wall portion. Having an injection process of injecting;
In the injection process, the upper wall portion of the upper mold, the lower wall portion of the lower mold, and the cylindrical portion of the auxiliary mold regulate the inflow of the molten resin into the accommodation space, thereby A gap is formed between the inner surface of the housing space and the main body of the electronic component.
Manufacturing method of cable with resin molding. Forming a through hole through the resin molded body in a direction crossing the extending direction of the lead wire so as to expose the lead wire to the outside by pulling out the upper wall portion and the lower wall portion;
The manufacturing method of the cable with a resin molding of Claim 5. In the injection step, the lead wire is held in a holding groove formed in at least one of the upper wall portion and the lower wall portion.
The manufacturing method of the cable with a resin molding of Claim 5 or 6.

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