JP2016149907A - Electric power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion system which achieves downsizing of a capacitor and enables further improvement of the cooling efficiency of a capacitor element.SOLUTION: An electric power conversion system has a capacitor 2 and a heat radiation member 3 for cooling the capacitor 2. The capacitor 2 has: a capacitor element 21; an electrode part 22; a bus bar 23; and a moisture resistance member 24. The electrode part 22 is connected to a metal layer 211. The electrode part 22 is formed by a porous metal material. The bus bar 23 is connected to a major surface S1 of the electrode part 22 which is opposite to a side connected to the metal layer 211. The moisture resistance member 24 covers the capacitor element 21 and a part of the bus bar 23. The bus bar 23 and the electrode part 22 are disposed between the capacitor element 23 and the heat radiation member 3. A heat radiation member 3 side major surface S2 of the bus bar 23 is exposed from the moisture resistance member 24.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a power conversion device including a capacitor and a heat dissipation member that cools the capacitor.

  2. Description of the Related Art Conventionally, as a power conversion device that performs power conversion between DC power and AC power, a device including a capacitor to which a DC voltage is applied and a heat dissipation member that cools the capacitor is known (see Patent Document 1 below). ). The capacitor includes a capacitor element, an electrode portion formed on the capacitor element, and a bus bar connected to the electrode portion. This capacitor is configured to electrically connect the capacitor element to another electronic component via a bus bar and an electrode portion.

  The capacitor element includes a dielectric and a metal layer formed on the surface of the dielectric. When moisture enters from the outside of the capacitor element, the metal layer may be oxidized and the capacitance may be reduced. Moreover, the said electrode part is formed with porous metal materials, such as a metallicon electrode, and has moisture permeability. Therefore, in the capacitor, the capacitor element, the electrode portion, and the bus bar are sealed with a moisture-resistant member such as an epoxy resin. This suppresses moisture from entering the capacitor element from the outside.

JP 2009-289943 A

  However, the power converter has a problem that it is difficult to reduce the size of the capacitor. That is, as described above, in the capacitor, the capacitor element, the electrode portion, and the bus bar are all sealed by the moisture-resistant member. Therefore, the amount of moisture-resistant members used is large, and it is difficult to reduce the size of the capacitor.

  Moreover, the said power converter device has room for improvement in the cooling efficiency of a capacitor | condenser element. That is, as described above, the capacitor element includes a dielectric and a metal layer formed on the surface of the dielectric. Ripple current flows through this metal layer, and resistance heat is generated. In the power converter, the capacitor element is directly cooled by the heat radiating member. Therefore, there is a problem that heat generated from the metal layer is shielded by the dielectric and it is difficult to efficiently transfer the heat to the heat radiating member. Therefore, the cooling efficiency of the capacitor element cannot be sufficiently increased.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a power conversion device that can reduce the size of a capacitor and further increase the cooling efficiency of the capacitor element.

One aspect of the present invention is a power converter including a capacitor and a heat dissipation member that cools the capacitor,
The capacitor is
A capacitor element comprising a dielectric and a metal layer formed on the surface of the dielectric;
An electrode portion formed on the capacitor element, made of a porous metal material and connected to the metal layer;
A bus bar made of a metal material having moisture resistance and connected to the main surface of the electrode portion opposite to the side connected to the metal layer;
A moisture-resistant member having moisture resistance,
The capacitor element and the electrode portion are sealed by the moisture-resistant member and the bus bar, and the moisture-resistant member covers a part of the bus bar,
The bus bar and the electrode part are interposed between the capacitor element and the heat dissipation member,
A main surface of the bus bar on the heat radiating member side is exposed from the moisture-resistant member.

In the power conversion device, the bus bar and the electrode portion are interposed between the capacitor element and the heat dissipation member.
Therefore, the cooling efficiency of the capacitor element can be increased. That is, with the above configuration, the bus bar is disposed in the vicinity of the heat radiating member. Therefore, the bus bar can be cooled by the heat radiating member, and the electrode portion can be further cooled. As described above, the capacitor element includes a dielectric and a metal layer formed on the surface of the dielectric, and the metal layer mainly generates heat. The metal layer is connected to the electrode part. Therefore, by cooling the bus bar and the electrode part with the heat radiating member, it is possible to transmit the heat generated from the metal layer to the electrode part and further to the heat radiating member via the bus bar. Therefore, the dielectric is less likely to hinder heat conduction, and the cooling efficiency of the capacitor element can be increased.

Moreover, in the said power converter device, the main surface at the side of a heat radiating member of a bus bar is exposed from the moisture-resistant member.
If it does in this way, a moisture-proof member will not intervene between a bus bar and a heat radiating member. Therefore, the moisture resistant member is unlikely to hinder heat conduction from the bus bar to the heat radiating member. Therefore, the bus bar and the electrode portion can be more efficiently cooled by the heat radiating member, and the cooling efficiency of the capacitor element can be further increased.
Further, with the above configuration, the main surface of the bus bar on the heat radiating member side is not covered with the moisture-resistant member, so that the length of the capacitor in the thickness direction of the bus bar can be shortened. Therefore, it is easy to miniaturize the capacitor.
Since the bus bar is formed of a metal material having moisture resistance, moisture entering the electrode portion from the outside can be shielded by the bus bar itself without covering the main surface of the bus bar with the moisture resistant member.

  As described above, according to the present invention, it is possible to provide a power converter that can reduce the size of the capacitor and can further increase the cooling efficiency of the capacitor element.

  In this specification, “having moisture resistance” means impervious to moisture.

FIG. 4 is a cross-sectional view of the capacitor and the heat radiating member in the first embodiment, taken along the line II in FIG. II-II sectional drawing of FIG. FIG. 3 is a view taken in the direction of arrow III in FIG. FIG. 3 is a perspective view of a capacitor in the first embodiment. It is sectional drawing of the power converter device in Example 1, Comprising: It is VV sectional drawing of FIG. VI-VI sectional drawing of FIG. FIG. 3 is an enlarged cross-sectional view of a main part of the capacitor in Example 1. The circuit diagram of the power converter device in Example 1. FIG. Sectional drawing of the capacitor | condenser and heat radiating member in Example 2. FIG. The perspective view of the bus-bar and connection terminal in Example 2. FIG. Sectional drawing of the capacitor | condenser and heat radiating member in Example 3. FIG. The perspective view of the bus-bar and connection terminal in Example 3. FIG. Sectional drawing of the capacitor | condenser and heat radiating member in Example 4. FIG. The perspective view of the insulating member in Example 4. FIG. The perspective view of the insulating member which formed the side wall part in cyclic | annular form in Example 4. FIG. Sectional drawing of the capacitor | condenser and heat radiating member in Example 5. FIG.

  The power conversion device can be a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle.

Example 1
The Example which concerns on the said power converter device is described using FIGS. As shown in FIG. 5, the power conversion device 1 of this example includes a capacitor 2 and a heat radiating member 3 that cools the capacitor 2. As shown in FIGS. 1 to 3, the capacitor 2 includes a capacitor element 21, an electrode portion 22, a bus bar 23, and a moisture-resistant member 24.

As shown in FIG. 7, the capacitor element 21 includes a dielectric 210 and a metal layer 211 formed on the surface of the dielectric 210. The electrode portion 22 is formed on the capacitor element 21 and is made of a porous metal material. The electrode part 22 is connected to the metal layer 211.
As shown in FIGS. 1 and 2, the bus bar 23 is connected to the main surface S <b> 1 on the opposite side of the electrode portion 22 from the side connected to the metal layer 211. The bus bar 23 is made of a metal material having moisture resistance.

Capacitor element 21 and electrode portion 22 are sealed by moisture-resistant member 24 and bus bar 23. The moisture resistant member 24 covers a part of the bus bar 23.
The bus bar 23 and the electrode part 22 are interposed between the capacitor element 23 and the heat dissipation member 3.
The main surface S <b> 2 of the bus bar 23 on the heat radiating member 3 side is exposed from the moisture-resistant member 24.

  The power conversion device 1 of this example is a vehicle-mounted power conversion device to be mounted on a vehicle such as an electric vehicle or a hybrid vehicle. The capacitor element 21 is a film capacitor element. As shown in FIG. 6, the capacitor element 21 includes a film (dielectric 210) made of a synthetic resin and a metal layer 211 formed on the surface of the film. The capacitor element 21 is formed by winding this film. The metal layer 211 includes a first metal layer 211a connected to one electrode portion 22a and a second metal layer 211b connected to the other electrode portion 22b (see FIG. 1). The electrode unit 22 is a metallicon electrode.

  As shown in FIGS. 5 and 8, the power conversion device 1 of this example includes two capacitors 2 (2a and 2b), which are a filter capacitor 2a and a smoothing capacitor 2b.

  As shown in FIGS. 1 and 4, a connection terminal 230 for electrically connecting the capacitor element 21 to another electronic component 5 extends from the bus bar 23. The bus bar 23 and the connection terminal 230 are made of a copper plate or the like.

  The moisture-resistant member 24 covers the side surface S3 of the capacitor element 21, the side surface S4 of the electrode portion 22, and the side surface S5 of the bus bar 23. The moisture resistant member 24 is made of a synthetic resin such as an epoxy resin. Further, the bus bar 23 covers the main surface S <b> 1 of the electrode part 22.

  As described above, since the electrode portion 22 is formed of a porous metal material, it has moisture permeability. Further, when moisture enters the capacitor element 21, the metal layer 211 (see FIG. 7) of the capacitor element 21 may be oxidized, and the capacitance may be reduced. Therefore, in this example, the electrode part 22 and the capacitor element 21 are sealed with a moisture-resistant bus bar 23 and a moisture-resistant member 24. This prevents moisture from entering the electrode portion 22 and the capacitor element 21 from the outside.

  Moreover, in this example, the bus bar 23 is cooled using the heat radiating member 3. Thereby, the electrode part 22 is cooled and the capacitor | condenser element 21 is further cooled. Therefore, the bus bar 23 also has a function as a cooling plate. Thus, the bus bar 23 of this example functions as a cooling plate for cooling the capacitor element 21, functions as a waterproof plate for preventing moisture from entering from the outside, and the capacitor element 21 and other electronic devices. It also has a function for electrically connecting the component 5.

  As shown in FIGS. 1 and 2, bus bars 23 (23a, 23b) are connected to the two electrodes 22 (22a, 22b) formed on the capacitor element 21, respectively. In this example, the two electrodes 22 (22a, 22b) are both disposed between the capacitor element 21 and the heat dissipation member 3.

  On the other hand, the heat radiating member 3 of this example is a cooling pipe 3a in which a flow path 12 through which the refrigerant 11 flows is formed. The cooling pipe 3a is made of metal. An insulating member 6 is interposed between the cooling pipe 3a and the bus bar 23 to insulate them. The insulating member 6 is made of ceramic.

As shown in FIG. 5, the power conversion device 1 of this example includes a plurality of electronic components 5 (5 _S , 5 _L ) other than the capacitor 2. The electronic component 5, there is a semiconductor module _{5 S} and the reactor _{5 L.} Capacitor 2 (2a, 2b) and the reactor _{5 L} and the semiconductor module _{5 S} is electrically connected by a connecting plate 14. Thus, the booster circuit 100 (see FIG. 8) and the inverter circuit 101 are configured.

In this example, the electronic component 5 (5 _S , 5 _L ), the capacitor 2 (2a, 2b), and the cooling pipe 3a are stacked in the X direction to form the stacked body 10. The laminate 10 is stored in a case 13. A pressure member 4 (plate spring) is disposed between the first wall 131 of the case 13 and the laminated body 10. The pressurizing member 4 presses the laminated body 10 toward the second wall portion 132 of the case 13. Thus, the bus bar 23 of the capacitor 2 (2a, 2b) is pressed against the cooling pipe 3a to cool the bus bar 23. Further, the contact pressure between the electronic component 5 (5 _S , 5 _L ) and the cooling pipe 3 a is secured by the pressing force of the pressurizing member 4, and the laminated body 10 is fixed in the case 10.

As shown in FIG. 5, the two cooling pipes 3 a adjacent to each other in the X direction are connected by a pair of connecting pipes 17. The connecting pipes 17 are respectively provided at both ends of the cooling pipe 3a in the width direction (Y direction) orthogonal to both the protruding direction (Z direction) of the power terminal 52 (see FIG. 6) and the X direction. In addition, an inlet pipe 15 for introducing the refrigerant 11 and an outlet pipe 16 for leading the refrigerant 11 are connected to some of the cooling pipes 3a. When the refrigerant 11 is introduced from the introduction pipe 15, the refrigerant 11 flows through all the cooling pipes 3 a through the connecting pipe 17 and is led out from the outlet pipe 16. Thus, the capacitor 2 (2a, 2b) and the electronic component 5 (5 _S , 5 _L ) are cooled.

As shown in FIG. 6, the semiconductor module 5 </ b> _S includes a main body 51 containing a semiconductor element 50 (see FIG. 8), a power terminal 52 protruding from the main body 51, and a control terminal 53. The power terminal 52 includes a positive terminal 52p and a negative terminal 52n to which a DC voltage is applied, and an AC terminal 52c connected to the three-phase AC motor 81 (see FIG. 8). The control terminal 53 is connected to the control circuit board 18. The switching operation of the semiconductor element 50 is controlled by the control circuit board 18.

As shown in FIG. 8, in this example, a filter capacitor 2a, a reactor 5 _L, and a part of the semiconductor module 5 _S, is formed with the step-up circuit 100. Further, the inverter circuit 101 is formed by the other semiconductor module _5S and the smoothing capacitor 2b. In this example, the booster circuit 100 is used to boost the voltage of the DC power supply 8, and then the inverter circuit 101 is used to convert DC power into AC power. The three-phase AC motor 81 is driven using the obtained AC power. As a result, the vehicle is running. The filter capacitor 2a removes noise current contained in the current I supplied from the DC power supply 8. Further, the smoothing capacitor 2b smoothes the DC voltage boosted by the booster circuit 100.

The effect of this example will be described. As shown in FIGS. 1 and 2, in this example, the bus bar 23 and the electrode portion 22 are interposed between the capacitor element 21 and the heat dissipation member 3.
Therefore, the cooling efficiency of the capacitor element 21 can be increased. That is, with the above configuration, the bus bar 23 is disposed in the vicinity of the heat radiating member 3, so that the bus bar 23 can be cooled by the heat radiating member 3 and further the electrode portion 22 can be cooled. As described above, the capacitor element 21 includes the dielectric 210 (see FIG. 7) and the metal layer 211 formed on the surface of the dielectric 210, and the metal layer 211 mainly generates heat. The metal layer 211 is connected to the electrode part 22. Therefore, by cooling the bus bar 23 and the electrode part 22 by the heat radiating member 3, it is possible to transmit the heat generated from the metal layer 211 to the electrode part 22 and further to the heat radiating member 3 via the bus bar 23. Therefore, the dielectric 210 is less likely to hinder heat conduction, and the cooling efficiency of the capacitor element 21 can be increased.

In this example, the main surface S <b> 1 of the bus bar 23 on the heat radiating member 3 side is exposed from the moisture-resistant member 24.
In this way, the moisture-resistant member 24 is not interposed between the bus bar 23 and the heat radiating member 3. Therefore, the moisture resistant member 24 is unlikely to hinder heat conduction from the bus bar 23 to the heat radiating member 3. Therefore, the bus bar 23 and the electrode part 22 can be more efficiently cooled by the heat radiating member 3, and the cooling efficiency of the capacitor element 21 can be further increased.
Further, with the above configuration, the main surface S1 of the bus bar 23 on the heat radiating member 3 side is not covered with the moisture-resistant member 24, so the length of the capacitor 2 in the thickness direction (X direction) of the bus bar 23 is shortened. Can do. Therefore, the capacitor 2 can be easily downsized.
Since the bus bar 23 is made of a metal material having moisture resistance, the bus bar 23 itself shields moisture entering the electrode portion 22 from the outside without covering the main surface S2 of the bus bar 23 with the moisture resistant member 24. can do.

In this example, bus bars 23 (23a, 23b) are connected to the two electrode portions 22 (22a, 22b) formed in the capacitor element 21, respectively. The two electrode portions 22 (22a, 22b) are both interposed between the capacitor element 21 and the heat dissipation member 3 together with the bus bar 23 (23a, 23b).
Therefore, both of the two electrode portions 22 (22a, 22b) can be cooled by the heat dissipation member 3, and the cooling efficiency of the capacitor element 21 can be further increased.

Further, the capacitor 2 of this example includes a connection terminal 230 extending from the bus bar 23 as shown in FIG. The connection terminal 230 is electrically connected to the other electronic component 5 (5 _S , 5 _L ). A part of the connection terminal 230 is sealed by the moisture resistant member 24.
If it does in this way, since the connection terminal 230 is sealed with the moisture-resistant member 24, the insulation of the connection terminal 230 can be improved.

In this example, as described above, the bus bar 23 and the electrode portion 22 are cooled by the heat radiating member 3, thereby cooling the capacitor element 21. Therefore, even if the capacitor 2 is arranged in the vicinity of the heat generating electronic component 5 such as the reactor 5 _L , the semiconductor module 5 _S, etc. (see FIG. 5), the electronic components 5 (5 _S , 5 _L ) It can suppress that the temperature of the capacitor | condenser element 21 rises too much under heat.

  As described above, according to this example, it is possible to provide a power conversion device that can reduce the size of the capacitor and further increase the cooling efficiency of the capacitor element.

  In this example, the cooling pipe 3a is used as the heat radiating member 3, but the present invention is not limited to this. For example, a case 13 (see FIG. 5) or a heat sink (not shown) is used as the heat radiating member 3. Also good.

(Example 2)
In the following embodiments, the same reference numerals used in the drawings among the reference numerals used in the drawings represent the same components as in the first embodiment unless otherwise specified.

  In this example, the shape of the bus bar 23 is changed. As shown in FIGS. 9 and 10, the bus bar 23 of the present example includes a bottom wall 25 and an annular side wall 26 standing from the bottom wall 25 in the X direction. The annular side wall 26 and the bottom wall 25 form an electrode fitting recess 239 into which the electrode portion 22 is fitted. A part of the capacitor element 21 is also fitted in the electrode fitting recess 239.

  In this example, the tip end portion 261 that is a portion of the annular side wall 26 that is located on the opening side of the electrode fitting recess 239 in the X direction is covered with the moisture-resistant member 24. In addition, a connection terminal 230 is attached to a base end portion 262 that is a portion near the bottom wall 25 in the annular side wall 26.

  The bus bar 23 is formed, for example, by pressing a metal plate. The connection terminal 230 is welded or soldered to the bus bar 23.

  Moreover, the moisture resistant member 24 of this example includes a film winding portion 241 formed by winding a moisture resistant film 240 having moisture resistance. As the moisture resistant film 240, for example, an aluminum laminated film in which aluminum is deposited on the surface of an insulating film can be used.

  The effect of this example will be described. In this example, an electrode fitting recess 239 into which the electrode portion 22 is fitted is formed in the bus bar 23. Therefore, not only the main surface S <b> 1 of the electrode part 22 but also the side surface S <b> 4 can be cooled by the bus bar 23. Therefore, the cooling efficiency of the electrode part 22 can be improved and the cooling efficiency of the capacitor | condenser element 21 can be improved more.

  In this example, a part of the capacitor element 21 is also fitted in the electrode fitting recess 239. Therefore, the capacitor element 21 can be cooled from the side surface S3 using the bus bar 23. Therefore, the cooling efficiency of the capacitor element 21 can be further increased.

  In this example, the tip 261 of the annular side wall 26 is covered with the moisture-resistant member 24. Therefore, it is possible to more reliably suppress moisture from entering the capacitor element 21 from the outside.

  Further, when the electrode fitting recess 239 is formed as in this example, the tip portion 261 of the bus bar 23 can be covered with the moisture-resistant member 24 without increasing the thickness of the bus bar 23 as in the first embodiment. Therefore, the bus bar 23 can be thinned, and the length of the capacitor 2 in the X direction can be shortened. Therefore, the capacitor 2 can be reduced in size. Moreover, since the usage-amount of the metal material which comprises the bus-bar 23 can be reduced, the capacitor 2 can be reduced in weight and the manufacturing cost of the capacitor 2 can be reduced.

Moreover, the moisture-resistant member 24 of this example includes a film winding portion 241 formed by winding the moisture-resistant film 240. When the capacitor 2 is manufactured, the moisture-resistant film 240 can be wound while being pulled. Therefore, the moisture-resistant film 240 is easily adhered to the capacitor element 21 and the bus bar 23. Therefore, it is difficult to form a gap between the moisture resistant film 240 and the bus bar 23 and the like, and it is easy to improve the moisture resistance between them. Therefore, even if the number of turns of the moisture resistant film 240 is small, high moisture resistance can be ensured, and the thickness can be reduced as compared with the case where the moisture resistant member 24 is formed by molding a synthetic resin. Therefore, the capacitor 2 can be reduced in size.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

(Example 3)
In this example, the shape of the bus bar 23 is changed. As shown in FIGS. 11 and 12, the bus bar 23 of this example includes a bottom wall 25 and an annular side wall 26 erected from the bottom wall 25. The annular side wall 26 includes an inner portion 263 connected to the bottom wall 25 and an outer portion 264 disposed outside the inner portion 263. The inner portion 263 and the bottom wall 25 form an electrode fitting recess 239 into which the electrode portion 22 is fitted. A part of the capacitor element 212 is also fitted in the electrode fitting recess 239.

  The inner portion 263 and the outer portion 264 are connected to each other at the end portion 28 on the opening side of the electrode fitting recess 239 in the X direction. Further, the connection terminal 230 extends from the end portion 29 on the bottom wall 25 side of the outer portion 264 in the X direction.

  In this example, the bus bar 23 and the connection terminal 230 are integrally formed by pressing one metal plate.

  In this example, the moisture resistant member 24 covers the distal end portion 261 of the outer portion 264 that is the opening side portion of the electrode fitting recess 239 in the X direction. The moisture resistant member 24 of this example is formed by winding a moisture resistant film 240 having moisture resistance, as in the second embodiment.

The effect of this example will be described. The bus bar 23 of this example includes a bottom wall 25 and an annular side wall 26. The annular side wall 26 includes an inner portion 263 and an outer portion 264, which are connected to each other at an end portion 28 on the opening side of the electrode fitting recess 239 in the X direction. Further, the connection terminal 230 extends from the end portion 29 on the bottom wall 25 side of the outer portion 264 in the X direction.
In this way, by processing a single metal plate, the bus bar 23 and the connection terminal 230 that can cover the distal end portion 26 of the annular side wall 26 with the moisture-resistant member 24 can be integrally formed. Therefore, the bus bar 23 and the connection terminal 230 can be easily manufactured, and the manufacturing cost of the capacitor 2 can be easily reduced.
In addition, the configuration and operational effects similar to those of the second embodiment are provided.

Example 4
In this example, the structure of the insulating member 6 is changed. As shown in FIGS. 13 and 14, the insulating member 6 of the present example includes a bottom 61 that contacts the cooling pipe 3 a and a protrusion 62 that protrudes from the bottom 61 in the X direction. The bottom 61 and the protrusion 62 form a bus bar fitting recess 60 into which the bus bar 23 is fitted.

The effect of this example will be described. If it is set as the said structure, the creeping distance between the metal cooling pipes 3a and the bus-bar 23 can be lengthened. Therefore, it becomes easy to insulate the cooling pipe 3a and the bus bar.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

  In this example, as shown in FIG. 14, the protrusions 62 are not formed at both ends 611 and 612 of the bottom 61 in the Y direction. In this example, since the length in the Y direction of the bottom 61 is longer than the length in the Y direction of the bus bar 23 (see FIG. 4), the protrusions 62 may not be formed on the both end portions 611 and 612. The bus bar 23 and the cooling pipe 3a can be sufficiently insulated. When the length of the bottom 61 in the Y direction is short, as shown in FIG. 15, it is desirable to form the protrusions 62 at the both ends 611 and 612 of the bottom. In this way, the bus bar 23 can be surrounded from the four sides by the protrusions 62, so that it is difficult to form a portion where the creepage distance between the bus bar 23 and the cooling pipe 3a is locally shortened. Therefore, the bus bar 23 and the cooling pipe 3a can be sufficiently insulated.

(Example 5)
In this example, the structure of the moisture-resistant member 24 is changed. As shown in FIG. 16, the moisture-resistant member 24 of this example includes a film winding part 241 formed by winding a moisture-resistant film 240 and a resin molding part 242 formed by molding a synthetic resin. The film winding part 241 is covered with a resin molding part 242.

  As the moisture resistant film 240, for example, an aluminum laminated film in which aluminum is deposited on the surface of an insulating film can be used. Further, for example, an epoxy resin can be used as the synthetic resin constituting the resin molding portion 242.

  The effect of this example will be described. Since the moisture-resistant member 24 of this example includes the film winding part 241 and the resin molding part 242, the capacitor element 21 and the bus bar 23 can be covered twice. Therefore, moisture resistance can be further improved.

In addition, as described in the second embodiment, the moisture resistant film 240 can be adhered to the capacitor element 21 and the like, so that it is easy to obtain a high moisture resistance effect even if the number of turns is small. Therefore, the film winding part 241 can easily reduce the thickness. Therefore, by forming the film winding part 241, the entire thickness of the moisture resistant member 24 can be reduced.
In addition, the configuration and operational effects similar to those of the first embodiment are provided.

DESCRIPTION OF SYMBOLS 1 Power converter 2 Capacitor 21 Capacitor element 210 Dielectric 211 Metal layer 22 Electrode part 23 Bus bar 24 Moisture resistant member 3 Heat radiating member

Claims (7)

A power converter (1) comprising a capacitor (2) and a heat dissipating member (3) for cooling the capacitor (2),
The capacitor (2)
A capacitor element (21) comprising a dielectric (210) and a metal layer (211) formed on the surface of the dielectric (210);
An electrode portion (22) formed on the capacitor element (21), made of a porous metal material, and connected to the metal layer (211);
A bus bar (23) made of a metal material having moisture resistance and connected to the main surface (S1) opposite to the side connected to the metal layer (211) of the electrode part (22);
A moisture resistant member (24) having moisture resistance,
The moisture resistant member (24) and the bus bar (23) seal the capacitor element (21) and the electrode part (22), and the moisture resistant member (24) is a part of the bus bar (23). Covering
The bus bar (23) and the electrode part (22) are interposed between the capacitor element (21) and the heat dissipation member (3),
The main surface (S2) of the said bus-bar (23) at the said heat radiating member (3) side is exposed from the said moisture-resistant member (24), The power converter device (1) characterized by the above-mentioned.   The bus bars (23a, 23b) are respectively connected to the two electrode portions (22a, 22b) formed on the capacitor element (21), and both the two electrode portions (22a, 22b) are connected to each other. The power converter (1) according to claim 1, wherein both the bus bars (23a, 23b) are interposed between the capacitor element (21) and the heat dissipating member (3).   The power converter (1) according to claim 1 or 2, wherein the bus bar (23) includes an electrode fitting recess (239) into which the electrode portion (22) is fitted.   The said moisture-resistant member (24) is provided with the film winding part (241) formed by winding the moisture-resistant film (240) which has moisture resistance, The any one of Claims 1-3 characterized by the above-mentioned. The power converter device (1) according to one item.   5. The power conversion according to claim 4, wherein the moisture-resistant member (24) includes a resin molding part (242) formed by molding a synthetic resin and the film winding part (241). Device (1).   A connection terminal (230) for electrically connecting the capacitor element (23) to another electronic component (5) extends from the bus bar (23), and the connection terminal (230) is formed by the moisture-resistant member (24). The power converter device (1) according to any one of claims 1 to 5, characterized in that a part thereof is sealed.   The heat radiating member (3) is made of metal, and an insulating member (6) for insulating them is interposed between the bus bar (23) and the heat radiating member (3), and the insulating member (6) The power converter (1) according to any one of claims 1 to 6, wherein a bus bar fitting recess (60) into which the bus bar (23) is fitted is formed.

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