JP2016143757A - Electronic device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which secures electric connection between two members joined by an adhesive and prevents creep deformation of an adhesive layer even when used for a long time, and to provide a manufacturing method of the electronic device.SOLUTION: An electrode device 30 includes: a first member 10 provided with an electrode 12; a second member 20 provided with a hole 24 located at a position corresponding to the electrode 12; and a probe pin 21 which is narrower than a diameter of the hole 24, elastically deforms, is disposed in the hole 24, and contacts with the electrode 12 at its tip side. The first member 10 and the second member 20 are joined by an adhesive 25. The probe pin 21 is fixed by the adhesive 25 filling in the hole 24.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an electronic device and a method for manufacturing the same.

  In recent years, portable electronic devices (hereinafter referred to as “portable terminals”) such as smartphones and tablet terminals have been widely used. These mobile terminals are equipped with various functions using wireless communication technologies such as voice communication, WiFi, GPS (Global Positioning System), NFC (Near Field Communication), and television.

  The mobile terminal is provided with a dedicated antenna for each function such as voice call, WiFi, GPS, NFC, and television. These antennas are formed of, for example, a thin metal plate and are disposed on the side surface of the housing.

JP 2001-22910 A JP 2010-114559 A

  When a metal antenna is disposed on the side surface of the housing, there are problems that the design is restricted and the characteristics of the antenna change due to contact with the human body.

  Therefore, it is conceivable to arrange the antenna at a place where it cannot be seen from the outside, for example, on the rear side of the edge of the display panel. In this case, it is necessary to electrically connect the antenna on the display panel side to the circuit board disposed in the housing.

  For example, one member is provided with an antenna and a flat electrode connected to the antenna, and the other member is provided with a metal projection, and the electrode and the projection are brought into contact with each other when the members are joined with an adhesive. There is a method of electrically connecting the two (for example, see Patent Document 1). Using this method, it is conceivable to electrically connect the antenna on the display panel side and the circuit board in the housing.

  However, in that case, the contact between the electrode and the protrusion may become unstable due to variations in the thickness of the adhesive layer, and the reliability of electrical connection is not sufficient.

  There is also a method of electrically connecting two members through a leaf spring curved in a U-shape (see, for example, Patent Document 2). Using this method, for example, when joining a display panel and a housing, a metal leaf spring is arranged between the antenna electrode and the circuit board side electrode, and the leaf spring is an antenna electrode by elastic force. It is conceivable to always make contact with both the electrode on the circuit board side.

  However, in this case, the elastic force of the leaf springs works in the direction that separates the display panel and the housing even after the adhesive is cured. There is a possibility that the joint with the housing is broken.

  The disclosed technology provides an electronic device that can secure an electrical connection between two members to be joined by an adhesive and can prevent creep deformation of the adhesive layer even when used for a long period of time. Objective.

  According to one aspect of the disclosed technology, a first member provided with an electrode, a second member provided with a hole at a position corresponding to the electrode of the first member, and a diameter of the hole A probe pin which is thin and elastically deformable, is disposed in the hole and whose tip side contacts the electrode of the first member, and the first member and the second member, An electronic device having an adhesive filled in the hole and fixing the probe pin is provided.

  According to another aspect of the disclosed technology, a hole is provided at a position corresponding to the first member provided with the electrode and the electrode, and the hole is elastically narrower than the diameter of the hole in the hole. A step of forming a second member on which a deformable probe pin is disposed, and the first member and the second member are disposed with an adhesive interposed therebetween, and the hole is filled with the adhesive. And a step of elastically contacting the tip side of the probe pin to the electrode, and a step of fixing the probe pin by the adhesive that is cured and adhered to the probe pin. A manufacturing method is provided.

  According to the electronic device and the manufacturing method according to the above aspect, electrical connection between two members joined by an adhesive can be secured, and creep deformation of the adhesive layer can be prevented even when used for a long time.

FIGS. 1A and 1B are plan views illustrating an example of an electronic apparatus according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II in FIG. 3A and 3B are sectional views showing the structure of the probe pin. FIG. 4 is a view (No. 1) illustrating the method for manufacturing the electronic apparatus according to the first embodiment. FIG. 5 is a diagram (part 2) illustrating the method for manufacturing the electronic apparatus according to the first embodiment. FIG. 6 is a view (No. 3) illustrating the method for manufacturing the electronic apparatus according to the first embodiment. FIG. 7 is a view (No. 4) illustrating the method for manufacturing the electronic apparatus according to the first embodiment. 8A and 8B are schematic cross-sectional views showing a first modification. 9A and 9B are schematic cross-sectional views showing a second modification. FIG. 10 is a plan view illustrating a housing of the electronic device according to the second embodiment. 11 is a cross-sectional view taken along the line II-II in FIG. FIG. 12 is a view (No. 1) illustrating the method for manufacturing the electronic apparatus according to the second embodiment. FIG. 13 is a diagram (part 2) illustrating the method for manufacturing the electronic apparatus according to the second embodiment. FIG. 14 is a plan view illustrating a housing of the electronic device according to the third embodiment. 15 is a cross-sectional view taken along the line III-III in FIG. FIG. 16 is a view (No. 1) illustrating the method for manufacturing the electronic apparatus according to the third embodiment. FIG. 17 is a diagram (part 2) illustrating the method for manufacturing the electronic apparatus according to the third embodiment. FIG. 18 is a diagram (part 3) illustrating the method for manufacturing the electronic apparatus according to the third embodiment.

  Hereinafter, embodiments will be described with reference to the accompanying drawings.

(First embodiment)
FIGS. 1A and 1B are plan views illustrating an example of an electronic apparatus according to the first embodiment. FIG. 2 is a cross-sectional view taken along the line II in FIG. In the present embodiment, the case where the electronic device is a mobile terminal such as a smartphone is described.

  FIG. 1A shows the display panel 10, and FIG. 1B shows the housing 20. The portable terminal is assembled by joining the edge of the display panel 10 shown in FIG. 1A and the edge of the housing 20 shown in FIG. 1B with an adhesive. The display panel 10 is an example of a first member, and the housing 20 is an example of a second member.

  The display panel 10 is a thin plate-like member, and a large number of pixels are provided in the display area 15 for displaying characters, images, and the like. As shown in FIG. 1A, a plurality of antennas 11 a to 11 e made of metal thin films are arranged on the edge of the display panel 10, that is, on the back surface of the area outside the display area 15.

  The lengths of the antennas 11a to 11e are set according to functions such as voice call, WiFi, GPS, NFC, and television, respectively. In addition, circular pads (electrodes) 12 are provided at both ends of each of the antennas 11a to 11e.

  On the other hand, the housing 20 is a member having a concave cross section provided with a space in which a circuit board (not shown) or the like is disposed. As shown in FIG. 1B, a plurality of holes 24 are provided on the upper surface of the edge portion (hereinafter referred to as “side wall portion 23”) of the housing 20. These holes 24 are arranged at positions facing the respective pads 12 on the display panel 10 side.

  Further, as shown in FIG. 2, probe pins 21 are respectively arranged inside the holes 24. A coil spring is provided in the probe pin 21 as will be described later, and the probe pin 21 elastically expands and contracts (deforms) along its central axis direction. The probe pin 21 has a diameter smaller than that of the hole 24, and a space filled with an adhesive is provided between the probe pin 21 and the inner surface of the hole 24 as described later.

  What is necessary is just to set the diameter of the probe pin 21 and the diameter of the hole 24 suitably. For example, the diameter of the probe pin 21 may be 0.2 mm to 2 mm, and the diameter of the hole 24 may be 1.2 mm to 6 mm.

  FIG. 3A is a cross-sectional view showing the structure of the probe pin 21. As shown in FIG. 3A, the probe pin 21 is a metal member having a cylindrical portion 21a, a coil spring 21b, a contact portion 21c, and an insertion portion 21d.

  The cylinder part 21a is a cylindrical member, and the coil spring 21b is disposed in the cylinder part 21a. The contact part 21c is a rod-shaped member, the lower part side is arrange | positioned in the cylinder part 21a, and the upper part protrudes upwards from the cylinder part 21a. The contact portion 21c is urged upward by the elastic force of the coil spring 21b.

  The insertion portion 21d is a convex member disposed on the lower side of the cylindrical portion 21a. As shown in FIG. 2, the probe pin connection portion 22a of the connection terminal 22 is disposed at the bottom of the hole 24, and is connected to the probe pin 21 by inserting the insertion portion 21d into the hole of the probe pin connection portion 22a. The terminal 22 is electrically and mechanically connected.

  Note that the tip of the probe pin 21 may be flat as shown in FIG. 3A or sharp as shown in FIG.

  As shown in FIG. 2, the connection terminal 22 includes a probe pin connection portion 22a disposed at the bottom of the hole 24, a pad 22b disposed inside the side wall portion 23 and connected to the circuit board, and a probe pin connection. A communication portion 22c that communicates between the portion 22a and the pad 22b is provided.

  The probe pin connecting portion 22a, the pad 22b, and the connecting portion 22c are integrally formed of metal. The connection terminal 22 is integrated with the housing 20 by, for example, an insert molding technique.

  Hereinafter, a method for manufacturing an electronic apparatus (mobile terminal) according to the present embodiment will be described with reference to FIGS. 1 and 4 to 7.

  First, the display panel 10 and the housing 20 shown in FIGS. 1A and 1B are manufactured. Antennas 11 a to 11 e and pads 12 made of a metal thin film are formed on the edge of the display panel 10.

  The antennas 11 a to 11 e and the pad 12 are formed by, for example, punching or etching a film with copper foil to form a desired antenna and pad shape pattern, and affixing these patterns to the edge of the display panel 10. Can be formed. Alternatively, conductive paste can be printed on the edge of the display panel 10 to form antenna and pad patterns, and copper can be plated on these patterns.

  The housing 20 is formed by integrating resin and connection terminals 22 using, for example, an insert molding technique. And when arrange | positioning a circuit board in the housing | casing 20, both are electrically connected by making the terminal and the connection part 22 which were provided in the circuit board side contact, for example.

  Next, as shown in the plan view of FIG. 4, an adhesive 25 is applied to the upper surface of the side wall portion 23 of the housing 20. At this time, the adhesive 25 is also filled inside the hole 24. The type of the adhesive 25 is not particularly limited, but it is preferable to use an adhesive whose volume shrinks with curing (hereinafter referred to as “curing shrinkable adhesive”). In that case, the shrinkage rate (shrinkage rate in the thickness direction) of the curing shrinkable adhesive is preferably about 3% to 8%.

  Next, as shown in FIG. 5, the housing 20 is placed in the housing fixing jig 31. The housing fixing jig 31 is provided with an abutting block 32 having a predetermined height around a portion where the housing 20 is disposed.

  Note that reference numeral 27 in FIG. 5 is a circuit board disposed in the housing 20. The circuit board 27 is provided with an electronic circuit for driving the display panel 10. Reference numeral 28 in FIG. 5 is a terminal provided on the circuit board 27.

  After that, for example, the display panel 10 is sucked by the suction jig 33 of the vacuum suction type transporter, and the display panel 10 is disposed above the housing 20. Then, as shown in FIG. 6, the suction jig 33 is lowered until the suction jig 33 contacts the abutting block 32. In this way, by bringing the suction jig 33 and the abutting block 32 into contact with each other, the distance between the upper surface of the side wall portion 23 and the display panel 10 becomes constant, and the thickness of the adhesive layer is made uniform. be able to.

  In the present application, an adhesive interposed between the display panel 10 and the side wall portion 23 is called an adhesive layer. The thickness of the adhesive layer is, for example, 0.2 mm to 0.4 mm.

  Next, the adhesive 25 is cured. At this time, until the adhesive 25 is cured, the contact portion 21c and the pad 12 are brought into contact with each other with a constant pressure by the elastic force of the coil spring 21b. Thereafter, when the adhesive 25 is cured, the contact portion 21c and the pad 12 are fixed while maintaining the contact pressure at that time. Further, when the adhesive 25 is cured, the contact portion 21c is fixed by the adhesive 25, so that the elasticity (elasticity) of the probe pin 21 is lost. That is, the shape of the probe pin 21 is fixed by the adhesive 25 attached to the probe pin 21.

  Next, after the adhesive 25 is sufficiently cured, the electronic device (mobile terminal) in which the housing 20 and the display panel 10 are joined is taken out from the housing fixing jig 31. FIG. 7 shows a cross section of the electronic device 30 taken out from the housing fixing jig 31. In this way, the manufacture of the electronic device 30 is completed.

  As described above, in this embodiment, since the tip (contact portion 21c) of the probe pin 21 is elastically brought into contact with the pad 12, even if the thickness of the adhesive layer varies, the probe pin 21 and the pad 12 can be reliably brought into contact with.

  Further, in this embodiment, since the elasticity of the probe pin 21 is lost when the adhesive 25 is cured, creep deformation of the adhesive layer is avoided even when used for a long time. Thereby, the reliability over the long term of the junction part by the adhesive agent 25 is ensured.

  In the present embodiment, the probe pin 21 and the connection terminal 22 are electrically and mechanically connected by inserting the insertion portion 21d of the probe pin 21 into the hole of the connection terminal 22. However, the probe pin 21 and the connection terminal 22 may be joined by solder, a conductive adhesive, or the like, or may be joined by a screw or welding.

(Modification 1)
8A and 8B are schematic cross-sectional views showing electronic devices according to Modification Example 1. FIG. The modification 1 differs from the first embodiment described above in that a protrusion that defines the thickness of the adhesive layer is provided on the upper surface of the side wall portion of the housing 20. Since the other configuration is basically the same as that of the first embodiment, the description of the overlapping parts is omitted here. In FIGS. 8A and 8B, the same components as those in FIGS. 2 and 7 are denoted by the same reference numerals.

  As shown in FIG. 8A, in the first modification, the protrusion 41 is provided at a predetermined position on the upper surface of the side wall 23 of the housing 20. And as shown in FIG.8 (b), when joining the display panel 10 and the housing | casing 20 with the adhesive agent 25, the thickness of an adhesive bond layer is brought about by abutting the display panel 10 on the top part of the processus | protrusion 41. FIG. To be constant. The height of the protrusion 41 may be set as appropriate. Here, the height of the protrusion 41 is set to 0.2 mm to 0.4 mm. The height of the protrusion 41 is the thickness of the adhesive layer.

  In the first modification, the thickness of the adhesive layer is made constant by bringing the protrusion 41 and the display panel 10 into contact with each other, so that the housing fixing jig 31 having the abutting block 32 as shown in FIG. 5 is unnecessary. Thus, the thickness of the adhesive layer can be made more uniform.

  In the above example, the protrusion 41 is provided on the housing 20 side, but the protrusion 41 may be provided on the display panel 10 side.

(Modification 2)
9A and 9B are schematic cross-sectional views showing a second modification. 9A and 9B, the same components as those in FIG. 2 are denoted by the same reference numerals.

  In the second modification, a leaf spring is used as the probe pin 42 as shown in FIG. The lower end of the probe pin 42 is connected to the connection part 22, and the upper end protrudes slightly upward from the side wall part 23 of the housing 20.

  As shown in FIG. 9B, when the display panel 10 and the housing 20 are joined with the adhesive 25, the probe pin 42 is elastically curved or bent by being pressed by the pad 12 of the display panel 10. The tip of the probe pin 42 and the pad 12 come into contact with each other with a constant pressure.

  Thereafter, when the adhesive 25 is cured, the shape of the probe pin 42 is fixed by the adhesive filled in the hole 24, and the elasticity of the probe pin 42 is lost.

  In the second modification, the same effect as that of the first embodiment can be obtained.

(Second Embodiment)
FIG. 10 is a plan view showing the housing 50 of the electronic device of the second embodiment, and FIG. 11 is a cross-sectional view taken along the line II-II in FIG. This embodiment also shows an example applied to a mobile terminal such as a smartphone, and the description of the same parts as those in the first embodiment is omitted.

  The housing 50 is a member having a concave cross section provided with a space in which a circuit board (not shown) or the like is disposed. Probe pins 51 and protrusions 54 that define the thickness of the adhesive layer are disposed at predetermined positions on the side wall 53 of the housing 50.

  While the probe pin 21 of the first embodiment has elasticity (elasticity), the probe pin 51 of the present embodiment is a rod-like member that does not have elasticity. In the first embodiment, a space (hole 24) filled with an adhesive is provided around the probe pin 21, but in the present embodiment, such a space is not provided.

  Only the tip of the probe pin 51 protrudes on the side wall 53, and the other part is buried in the side wall 53. The protruding amount of the tip portion of the probe pin 51 is set to be approximately the same as or more than the value obtained by subtracting the thickness of the pad 12 from the height of the protrusion 54.

  As shown in FIG. 11, the tip of the probe pin 51 is pointed. The lower part of the probe pin 51 communicates with the connection terminal 22.

  The probe pin 51 and the connection terminal 22 may be integrally formed, and the lower end portion of the probe pin 51 is inserted into the hole of the probe pin connection portion 22a of the connection terminal 22 as in the first embodiment. May be electrically and mechanically connected.

  Hereinafter, a method for manufacturing an electronic apparatus (mobile terminal) according to the present embodiment will be described with reference to FIGS.

  First, as shown in the plan view of FIG. 12, an adhesive 56 is applied to the upper surface of the side wall portion 53 of the housing 50. Although the kind of the adhesive agent 56 is not limited, It is preferable to use the hardening shrinkable adhesive agent whose volume shrinks with hardening.

  Thereafter, for example, the display panel 10 is sucked by a suction jig of a vacuum suction type transporter, and the display panel 10 is disposed above the housing 50 as shown in FIG. Then, as shown in FIG. 13B, the suction jig is lowered until the display panel 10 comes into contact with the protrusion 54.

  Thereby, the tip of the probe pin 51 bites into the pad 12, and the probe pin 51 and the pad 12 are electrically connected.

  Thereafter, the adhesive 56 is cured, and the connection state between the probe pin 51 and the pad 12 is fixed. When a curing shrinkable adhesive is used as the adhesive 56, the stress that draws the display panel 10 toward the housing 50 works, so that the probe pin 51 and the pad 12 can be connected more reliably, and electrical connection can be achieved. Reliability is further improved. In this way, the electronic device according to the present embodiment is completed.

  As described above, in the present embodiment, the thickness of the adhesive layer is made constant by abutting the display panel 10 against the protrusions 54 provided on the side wall portion 53 of the housing 50. Thereby, the dispersion | variation in the thickness of an adhesive bond layer is avoided, and the probe pin 51 and the pad 12 can be connected reliably.

  Further, in the present embodiment, the tip of the probe pin 51 is sharpened and bites into the pad 12. Thereby, the electrical connection between the probe pin 51 and the pad 12 is further ensured.

  Furthermore, since the probe pin 51 of the present embodiment does not have elasticity, the adhesive layer does not undergo creep deformation even when used for a long time.

(Third embodiment)
FIG. 14 is a plan view showing a housing 60 of the electronic apparatus of the third embodiment, and FIG. 15 is a cross-sectional view taken along the line III-III in FIG. This embodiment also shows an example applied to a mobile terminal such as a smartphone, and the description of the same parts as those in the first embodiment is omitted.

  The housing 60 is a member having a concave cross section provided with a space in which a circuit board (not shown) or the like is disposed. Probe pins 61 are arranged at predetermined positions on the side wall 63 of the housing 60. Similarly to the second embodiment, the probe pin 61 of the present embodiment is also a rod-like member having no stretchability. Further, as in the second embodiment, a space filled with an adhesive is not provided around the probe pin 61.

  Only the tip of the probe pin 61 protrudes on the side wall part 63, and the other part is buried in the side wall part 63. The protruding amount of the tip of the probe pin 61 is set according to the desired thickness of the adhesive layer. Further, the tip of the probe pin 61 is pointed, and the lower part communicates with the terminal portion 2.

  Hereinafter, a method for manufacturing an electronic apparatus (mobile terminal) according to the present embodiment will be described with reference to FIGS.

  First, as shown in the plan view of FIG. 16, an adhesive 66 is applied to the upper surface of the side wall 63 of the housing 60. In the present embodiment, a curing shrinkable adhesive is used as the adhesive 66. However, if a thermosetting shrinkable adhesive that is cured by heat is used, it is necessary to heat the adhesive to, for example, 80 ° C. or higher, such as characteristics of the display panel 10 and semiconductor elements mounted on the circuit board. The characteristics may deteriorate.

  Therefore, in the present embodiment, a curing shrinkable adhesive other than the thermosetting shrinkable adhesive (hereinafter referred to as “non-thermosetting shrinkable adhesive”) is used. As a non-thermosetting shrinkable adhesive material, it is possible to use a one-component or two-component epoxy adhesive, a moisture-curable silicone adhesive, a reactive urethane adhesive, or a two-component acrylic adhesive. it can.

  Next, as shown in FIG. 17, the housing 60 is placed in the housing fixing jig 31. The housing fixing jig 31 is provided with an abutting block 32 having a predetermined height around a portion where the housing 60 is disposed.

  Thereafter, for example, the display panel 10 is sucked by the suction jig 33 of the vacuum suction type transporting machine, and the display panel 10 is disposed above the housing 60. Then, as shown in FIG. 18, the suction jig 33 is lowered until the suction jig 33 contacts the abutting block 32.

  In this way, by bringing the suction jig 33 and the abutting block 32 into contact with each other, the distance between the upper surface of the side wall portion 63 and the display panel 10 becomes constant, and the thickness of the adhesive layer is made uniform. be able to. Further, since the tip of the probe pin 61 is sharp, the tip of the probe pin 61 bites into the pad 12, and the probe pin 61 and the pad 12 are reliably electrically connected.

  Next, the adhesive 66 is cured. In this way, the manufacture of the electronic device according to the present embodiment is completed.

  As described above, in the present embodiment, a curing shrinkable adhesive is used as the adhesive 66. Therefore, even if the probe pin 61 and the pad 12 are not sufficiently in contact immediately after the display panel 10 and the housing 60 are joined with the adhesive 66, the display panel 10 is attached to the housing as the adhesive 66 is cured. Approaching the 60 side, the probe pin 61 and the pad 12 are in sufficient contact. Thereby, the probe pin 61 and the pad 12 can be electrically connected.

  Further, in the present embodiment, the tip of the probe pin 61 is sharpened and bites into the pad 12. Thereby, the electrical connection between the probe pin 61 and the pad 12 is further ensured.

  Furthermore, since the probe pin 61 of the present embodiment does not have elasticity, the adhesive layer does not creep even when used for a long time.

  The following additional notes are disclosed with respect to the above embodiments.

(Appendix 1) a first member provided with an electrode;
A second member provided with a hole at a position corresponding to the electrode of the first member;
A probe pin that is narrower than the diameter of the hole and elastically deformable, the probe pin being disposed in the hole and having a tip side in contact with the electrode of the first member;
An electronic apparatus comprising: an adhesive that joins the first member and the second member and that is filled in the hole and fixes the probe pin.

  (Additional remark 2) It is provided in the at least one member of the said 1st member and the said 2nd member, It has the protrusion which contact | abuts the other member and prescribes | regulates the layer thickness of the said adhesive agent, It is characterized by the above-mentioned. The electronic device according to attachment 1.

  (Supplementary note 3) The electronic apparatus according to Supplementary note 1 or 2, wherein the adhesive is a curing shrinkable adhesive that shrinks in volume as it cures.

  (Appendix 4) The electronic device according to any one of appendices 1 to 3, wherein the probe pin has a sharp tip.

  (Appendix 5) The electronic device according to any one of appendices 1 to 4, wherein the probe pin includes a coil spring and a contact portion that is urged by the coil spring and contacts the electrode. .

  (Additional remark 6) The said probe pin consists of leaf springs, The electronic device of any one of Additional remark 1 thru | or 4 characterized by the above-mentioned.

  (Supplementary note 7) A circuit board is disposed on the second member, and the first member includes a display panel driven by the circuit board. Electronic equipment.

  (Supplementary note 8) The electronic apparatus according to supplementary note 7, wherein the electrode of the first member is connected to an antenna.

(Supplementary Note 9) A first member provided with an electrode, a hole provided at a position corresponding to the electrode, and a probe pin that is elastically deformable and thinner than the diameter of the hole is disposed in the hole. Forming the two members;
Arranging the first member and the second member with an adhesive interposed therebetween, filling the hole with the adhesive, and elastically contacting the tip side of the probe pin to the electrode; ,
And a step of fixing the probe pin with the adhesive adhered to the probe pin by curing the adhesive.

(Appendix 10) A step of forming a first member provided with an electrode, and a second member having a plurality of protrusions and a probe pin having a sharp tip,
Bringing the protrusion into contact with the first member, causing the tip of the probe pin to bite into the electrode, and bonding the first member and the second member with an adhesive;
A method for manufacturing an electronic device, comprising:

  (Additional remark 11) The manufacturing method of the electronic device of Additional remark 10 characterized by using the hardening shrinkable adhesive whose volume shrinks with hardening as said adhesive agent.

(Additional remark 12) The process of forming the 2nd member which has the 1st member provided with the electrode, and the probe pin of the shape where the tip sharpened,
A step of causing the tip of the probe pin to bite into the electrode and joining the first member and the second member with a curing shrinkable adhesive whose volume is reduced with curing;
A method for manufacturing an electronic device, comprising:

  DESCRIPTION OF SYMBOLS 10 ... Display panel, 11a-11e ... Antenna, 12 ... Pad, 15 ... Display area, 20, 50, 60 ... Housing, 21, 42, 51, 61 ... Probe pin, 22 ... Connection terminal 23, 53, 63 ... Side wall portion, 24 ... hole, 25, 56, 66 ... adhesive, 27 ... circuit board, 28 ... terminal, 30 ... electronic device, 31 ... housing fixing jig, 32 ... butting block, 33 ... adsorption jig, 41, 54 ... projections.

Claims (6)

A first member provided with an electrode;
A second member provided with a hole at a position corresponding to the electrode of the first member;
A probe pin that is narrower than the diameter of the hole and elastically deformable, the probe pin being disposed in the hole and having a tip side in contact with the electrode of the first member;
An electronic apparatus comprising: an adhesive that joins the first member and the second member and that is filled in the hole and fixes the probe pin.   2. The projection according to claim 1, further comprising a protrusion provided on at least one of the first member and the second member and defining a layer thickness of the adhesive in contact with the other member. The electronic device described.   The electronic device according to claim 1, wherein a circuit board is disposed on the second member, and the first member includes a display panel driven by the circuit board. A first member provided with an electrode, and a second member in which a hole is provided at a position corresponding to the electrode, and an elastically deformable probe pin that is thinner than the diameter of the hole is disposed in the hole; Forming a step;
Arranging the first member and the second member with an adhesive interposed therebetween, filling the hole with the adhesive, and elastically contacting the tip side of the probe pin to the electrode; ,
And a step of fixing the probe pin with the adhesive adhered to the probe pin by curing the adhesive. Forming a first member provided with an electrode, and a second member having a plurality of protrusions and a probe pin having a pointed tip.
Bringing the protrusion into contact with the first member, causing the tip of the probe pin to bite into the electrode, and bonding the first member and the second member with an adhesive;
A method for manufacturing an electronic device, comprising:   The method for manufacturing an electronic device according to claim 5, wherein a curing shrinkable adhesive whose volume is reduced with curing is used as the adhesive.

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