JP2016143724A - Printed board support device and printed board reflow method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board support device which enables position change of a support member supporting a printed board to be conducted concurrently with replacement of a screen printing plate, and to provide a printed board reflow method.SOLUTION: A printed board support device includes: a plate material having slits arranged parallel to each other; support members placed on the respective slits and supporting a printed board placed above the plate material; and a moving mechanism which moves the support members along a longitudinal direction of the slits through the slits from the lower side of the plate material.SELECTED DRAWING: Figure 1

Description

  The present application relates to a printed circuit board support device and a printed circuit board reflow method.

  In recent years, SMT (Surface mount technology) in which electronic components are directly soldered to the surface of a printed circuit board has become widespread. A mounting line using SMT includes a step of applying paste solder on the surface of a printed circuit board. A squeegee is used in the step of applying paste solder on the surface of the printed circuit board. Therefore, in the step of applying paste-like solder to the surface of the printed circuit board, one that supports the printed circuit board from the opposite side of the squeegee is used to prevent the printed circuit board pressed by the squeegee from bending. Various things are proposed as what supports a printed circuit board (for example, refer patent document 1-2).

JP 2000-114793 A JP-T-2004-522317

  An electronic component may already be mounted on one side of a printed circuit board on which paste solder is to be applied. Therefore, when the printed circuit board is supported by the surface on which the electronic component is mounted, for example, the positional relationship between a plurality of support members that support the printed circuit board so that the member that supports the printed circuit board does not interfere with the electronic component. Is appropriately adjusted. However, when paste-like solder is applied to the surface of the printed board with a squeegee, the screen plate on which the solder printing pattern is formed is positioned above the support pins. Therefore, when changing the position of the support member that supports the printed circuit board, the screen plate is moved to a position that does not hinder the operation of changing the position of the support member. Therefore, it is difficult to perform the position change of the support member and the screen plate replacement work in parallel.

  Therefore, the present application provides a printed circuit board support device and a printed circuit board reflow method that can change the position of the support member that supports the printed circuit board in parallel with the screen plate replacement operation.

  The present application discloses the following printed circuit board support apparatus. That is, the present application is a plate member having a plurality of parallel slits, a plurality of members placed on each of the slits, a support member for supporting a printed circuit board placed above the plate member, and a bottom of the plate member And a moving mechanism for moving the support member along the longitudinal direction of the slit through the slits from the side.

  Moreover, this application discloses the following printed circuit board reflow methods. That is, the present application is a plurality of members placed on a plurality of parallel slits formed in the plate material, and the support member that supports the printed circuit board placed above the plate material is provided from the lower side of the plate material. A print which moves along the longitudinal direction of the slit through each slit, places the printed circuit board on the plate material, and applies paste-like solder to the printed circuit board supported by the support member on the plate material A substrate reflow method is disclosed.

  If it is said printed circuit board support apparatus and a printed circuit board reflow method, the position change of the supporting member which supports a printed circuit board can be performed in parallel with the replacement | exchange operation | work of a screen plate.

Drawing 1 is an example of the figure showing the internal structure of the printed circuit board support device concerning an embodiment. FIG. 2 is an example of a top view of the printed circuit board support apparatus according to the embodiment. FIG. 3A is an example of a perspective view of a backup pin unit. FIG. 3B is an example of an internal structure diagram of the backup pin unit. FIG. 4 is an example of a state diagram of the backup pin unit mounted on the slit of the base plate. FIG. 5 is an example of a diagram illustrating a method of adjusting the position of the support pin. FIG. 6 is an example of a configuration diagram of the SMT mounting line. FIG. 7 is an example of a diagram showing an outline of processing performed in a cream solder printer. FIG. 8 is an example of a transparent perspective view of a printed board supported by a board support jig. FIG. 9 is an example of a diagram showing a positional relationship between the screen plate and the substrate support jig when the cream solder printing machine is stopped. FIG. 10 is an example of a control block diagram of the printed circuit board support apparatus. FIG. 11 is an example of an operation flowchart realized by the control device that controls the moving mechanism. FIG. 12 is an example of a diagram showing how the hand moves directly below the backup pin unit to be moved. FIG. 13 is an example of a diagram illustrating how the hand moves up. FIG. 14 is an example of a diagram illustrating how the backup pin unit is moved. FIG. 15 is an example of a diagram illustrating a state in which the backup pin unit is fixed to the base plate at the movement destination. FIG. 16 is an example of an operation flowchart of the cream solder printer realized in the cream solder printer. FIG. 17 is an example of a diagram illustrating a printed circuit board support device according to a first modification. FIG. 18 is an example of a diagram illustrating a printed circuit board support apparatus according to a second modification. FIG. 19 is an example of an enlarged view of a hand. FIG. 20 is an example of a diagram illustrating the movement of the sleeve.

  Hereinafter, embodiments will be described. The embodiment described below is merely an example, and the technical scope of the present disclosure is not limited to the following aspect.

Drawing 1 is an example of the figure showing the internal structure of the printed circuit board support device concerning an embodiment. FIG. 2 is an example of a top view of the printed circuit board support apparatus 1 according to the embodiment. A printed circuit board support apparatus 1 according to the present embodiment includes a base plate 3 (which is an example of a “plate material” in the present application) having a plurality of parallel slits 2, and a plurality of backup pin units placed on each slit 2. 4 (which is an example of a “supporting member” in the present application) and a moving mechanism 5 that moves the backup pin unit 4. The backup pin unit 4 supports a printed circuit board 50 placed above the base plate 3. The moving mechanism 5 moves or rotates the backup pin unit 4 from the lower side of the base plate 3 through the slit 2 along the longitudinal direction of the slit 2. The base plate 3 is formed of a magnetic material such as iron, and has a strength that does not warp the plate surface even when the backup pin unit 4 that supports the printed circuit board 50 is placed. The length of each slit 2 formed in the base plate 3 and the number of slits are appropriately determined according to the specification of the dimensions of the printed circuit board 50 to be supported by the printed circuit board support device 1.

  The backup pin unit 4 has a circular pedestal 6 placed on the slit 2, and protrudes downward from the center of the pedestal 6, and a positioning pin 7 (an example of a “fitting portion” in the present application) that fits into the slit 2. When there is a positioning pin 7 that is eccentric from the center of the pedestal 6, the support pin 8 protrudes upward from the pedestal 6 and contacts the printed circuit board 50 placed above the base plate 3 (the “protruding portion” in the present application). For example). In FIG. 2, two backup pin units 4 are arranged in each slit 2, but the printed circuit board support device 1 according to the present embodiment is not limited to such a mode. Three or more backup pin units 4 may be arranged in each slit 2.

  The moving mechanism 5 is disposed below the base plate 3 and includes a hand 9 and an actuator 10. The hand 9 is a mechanism capable of gripping the positioning pin 7 of the backup pin unit 4, for example, a mechanism simply provided with a hole into which the positioning pin 7 fits, and the positioning pin 7 is gripped by two finger-shaped members. A mechanism, a mechanism that engages with the positioning pin 7 by a magnetic force, and other various mechanisms are applicable. The actuator 10 moves the hand 9 along the three axis directions (X axis, Y axis, Z axis) in the front, rear, left, and right directions, and the axis about the axis (Z axis) orthogonal to the plate surface of the base plate 3. 9 is a mechanism capable of rotating 9. The actuator 10 and the hand 9 have, for example, a built-in electric drive mechanism, operate according to a signal sent from a control device (not shown), grab the positioning pin 7 and move the backup pin unit 4 freely.

  FIG. 3A is an example of a perspective view of the backup pin unit 4. The positioning pin 7 of the backup pin unit 4 is provided with a protrusion-like detent 11 that protrudes laterally from the outer peripheral surface of the positioning pin 7. The rotation stopper 11 is provided for the purpose of preventing the backup pin unit 4 gripped by the hand 9 from idling around the central axis of the positioning pin 7. Therefore, when the moving mechanism 5 rotates the backup pin unit 4 with the hand 9, the backup pin unit 4 does not idle. The rotation stopper 11 is not limited to a protrusion-like shape protruding sideways from the outer peripheral surface of the positioning pin 7. The rotation stopper 11 can adopt, for example, one in which the outer peripheral surface of the positioning pin 7 is roughened, one in which the positioning pin 7 is a polygonal shaft in cross section, and other various forms.

  FIG. 3B is an example of an internal structure diagram of the backup pin unit 4. A permanent magnet 12 is embedded in the base 6 of the backup pin unit 4. Therefore, the backup pin unit 4 is attracted and fixed to the base plate 3 by the magnetic force of the permanent magnet 12 that attracts the magnetic base plate 3. Note that the printed circuit board support device 1 according to the present embodiment is not limited to the one in which the permanent magnet 12 is embedded in the backup pin unit 4. In the printed circuit board support device 1 according to the present embodiment, for example, the base plate 3 is magnetized or the base plate 3 is formed of a permanent magnet, and the backup pin unit 4 is formed of a magnetic material. May be attracted and fixed to the base plate 3.

FIG. 4 is an example of a state diagram of the backup pin unit 4 mounted on the slit 2 of the base plate 3. When the backup pin unit 4 is placed on the slit 2 of the base plate 3, the positioning pin 7 is fitted in the slit 2. Further, the permanent magnet 12 is in contact with the base plate 3 in a state where the backup pin unit 4 is placed on the slit 2 of the base plate 3. Therefore, when the backup pin unit 4 is placed in the slit 2 of the base plate 3, it is fixed to the base plate 3 by the magnetic force of the permanent magnet 12.

  FIG. 5 is an example of a diagram illustrating a method for adjusting the position of the support pin 8. The support pin 8 of the backup pin unit 4 protrudes upward from the pedestal 6 at a position eccentric from the positioning pin 7 protruding downward from the center of the pedestal 6 and fits into the slit 2. Therefore, when the backup pin unit 4 is rotated by the hand 9 around the positioning pin 7 fitted in the slit 2, the support pin 8 can be moved to the side of the center line of the slit 2. The movable range of the support pin 8 that can be moved by the rotation of the backup pin unit 4 is on the circumference of a circle having a predetermined radius with the positioning pin 7 as the center point. The predetermined radius corresponds to the distance between the central axis of the positioning pin 7 and the central axis of the support pin 8. Therefore, the position adjustment of the support pin 8 by the rotation of the backup pin unit 4 can be adjusted within the range of the predetermined radius at the maximum from the center line of the slit 2 to the side.

  FIG. 6 is an example of a configuration diagram of the SMT mounting line. The SMT mounting line 100 for directly soldering electronic components to the surface of the printed circuit board is formed by various devices as shown in FIG. 6, for example. That is, the SMT mounting line 100 includes a loader 110 that sequentially supplies a printed circuit board before soldering, and a cream solder printing machine 120 that applies paste-like solder to the printed circuit board supplied from the loader 110 in a predetermined pattern. . The SMT mounting line 100 includes chip mounters 130A and 130B for mounting various electronic components on a printed circuit board coated with paste-like solder, a reflow furnace 140 for heating the printed circuit board on which the electronic components are mounted, and a print after soldering. An unloader 150 for storing a substrate is included.

  FIG. 7 is an example of a diagram showing an outline of processing performed in the cream solder printer 120. The cream solder printing machine 120 applies paste solder on the printed circuit board in a predetermined pattern, so that the board support jig 101 that supports the screen plate 121, the squeegee 122, and the printed circuit board 50 on which the printed pattern of solder is formed. have. The cream solder printing machine 120 moves the squeegee 122 in a state where the screen plate 121 on which the cream solder 123 is placed is superimposed on the printed circuit board 50, so that the surface of the printed circuit board 50 supported by the substrate supporting jig 101 is The solder in the form of the pattern of the screen plate 121 is transferred.

  FIG. 8 is an example of a transparent perspective view of the printed board 50 supported by the board support jig 101. When no electronic component or the like is mounted on the printed board supported by the board support jig 101, the support pins 102 of the board support jig 101 that supports the printed board 50 may be disposed at appropriate positions on the base plate 103. it can. However, when an electronic component is already mounted on the lower surface side as in the printed circuit board 50 shown in FIG. 8, the support pins 102 of the substrate support jig 101 do not interfere with the electronic component mounted on the printed circuit board 50. Are arranged as follows. Therefore, when the type of the printed circuit board 50 handled in the SMT mounting line 100 is changed, an operation of changing the positions of the support pins 102 attached to the base plate 103 occurs.

FIG. 9 is an example of a diagram showing a positional relationship between the screen plate 121 and the substrate support jig 101 when the cream solder printer 120 is stopped. As the replacement work of the support pins 102, for example, an operator can change the support pins 102 one by one by hand or an automatic machine such as a robot. However, as in the case of the substrate support jig 101 shown in FIG. 8, when the support pins 8 that simply fit into the mounting holes of the base plate 103 are replaced, the base plate can be used regardless of whether the operator or the automatic machine performs. Usually, the upper space 103 is occupied. Therefore, when changing the type of the printed circuit board 50 handled in the SMT mounting line 100, the position of the support pin 102 is changed after removing the screen plate 121, and the new screen plate 121 is attached after changing the position of the support pin 102. The procedure will be taken. In other words, it is not possible to change the position of the support pin 102 and replace the screen plate 121 in parallel. When the type of the printed circuit board 50 handled in the SMT mounting line 100 is frequently changed, the ability to change the position of the support pins 102 and the replacement work of the screen plate 121 cannot be performed in parallel. It can be a cause of lowering.

  On the other hand, the printed circuit board support apparatus 1 according to the present embodiment moves the backup pin units 4 placed on the slits 2 from the lower side of the base plate 3 by the moving mechanism 5 to move the backup pin units 4 on the slits 2. The backup pin unit 4 can be rotated around the positioning pin 7. Therefore, the space above the base plate 3 is not occupied to move the backup pin unit 4. Therefore, if the printed circuit board support apparatus 1 according to the present embodiment is applied to a cream solder printing machine of an SMT mounting line, it is possible to suppress a decrease in productivity even if the type of printed circuit board handled in the SMT mounting line is frequently changed. Can do.

  FIG. 10 is an example of a control block diagram of the printed circuit board support apparatus 1. The printed circuit board support device 1 can be controlled by, for example, a control device 20 that realizes a control block as shown in FIG. That is, the control device 20 that controls the printed circuit board support device 1 includes, for example, an actuator drive control unit 21, an operation sequence control unit 22, an actuator instruction value calculation unit 23, and a pin coordinate database 24. The pin coordinate database 24 stores pin coordinate information in which the coordinates of the support pins 8 are defined for each drawing number of the printed circuit board 50. When the actuator drive control unit 21 obtains an actuator operation instruction value from the actuator instruction value calculation unit 23, the actuator 10X for the X axis, the actuator 10Y for the Y axis, and the actuator for the Z axis provided in the moving mechanism 5 10Z, a drive instruction signal is supplied to the T-axis actuator 10T that controls the rotation of the hand 9. When the operation sequence control unit 22 receives information from the operation instruction interface 26 that receives an operation instruction for changing the position of the support pin 8, the sensor 25X, 25Y, 25Z detects the coordinate position of each actuator 10X, 10Y, 10Z, 10T. , 25T, the current position information is acquired and output to the actuator instruction value calculation unit 23. When the actuator instruction value calculation unit 23 acquires the drawing number information from the drawing number input interface 27 that receives the drawing number input operation for defining the position of the support pin 8, the pin coordinate information corresponding to the acquired drawing number is obtained. Is obtained from the pin coordinate database 24. The actuator instruction value calculation unit 23 compares the current position information of each actuator 10X, 10Y, 10Z, and 10T obtained from the operation sequence control unit 22 with the coordinate information of each support pin 8 indicated by the pin coordinate information, The instruction value sent to each actuator 10X, 10Y, 10Z, 10T is calculated. Then, the actuator instruction value calculation unit 23 outputs the calculated instruction value to the actuator instruction value calculation unit 23.

  FIG. 11 is an example of an operation flow diagram realized by the control device 20 that controls the moving mechanism 5. When switching the type of the printed circuit board 50 handled by the SMT mounting line 100, the control device 20 performs an operation instruction for changing the position of the support pin 8 performed by the operator using the operation instruction interface 26 and a drawing number input operation performed using the figure number input interface 27. Is received (S101). When receiving the operation instruction for changing the position of the support pin 8, the control device 20 acquires pin coordinate information from the pin coordinate database 24 (S102). When acquiring the pin coordinate information, the control device 20 calculates an instruction value to be sent to each actuator 10X, 10Y, 10Z, 10T (S103).

In addition, the control apparatus 20 follows the coordinate conversion formula shown below, and the support pin 8 which pin coordinate information shows.
The position of the positioning pin 7 and the angle of the backup pin unit 4 with respect to the coordinates are calculated. Then, the control device 20 controls the actuators 10X, 10X, 10C, 10C, 10C, 10C, 10D, 10C, and 10D so that the position of the positioning pin 7 and the angle of the backup pin unit 4 placed on the slit 2 of the base plate 3 are as calculated. The instruction value to be sent to 10Y, 10Z, and 10T is calculated.

  The control device 20 sends the calculated instruction value to each actuator 10X, 10Y, 10Z, 10T. When the control device 20 sends an instruction value to each actuator 10X, 10Y, 10Z, 10T, the hand 9 moves as follows. When the control device 20 sends an instruction value to each actuator 10X, 10Y, 10Z, 10T, first, the hand 9 moves directly below the backup pin unit 4 to be moved (step S104). FIG. 12 is an example of a diagram illustrating a state in which the hand 9 moves directly below the backup pin unit 4 to be moved. Next, the hand 9 is raised (step S105). FIG. 13 is an example of a diagram illustrating how the hand 9 moves up. When the hand 9 is raised, the permanent magnet 12 of the backup pin unit 4 is separated from the base plate 3 and the fixed state of the backup pin unit 4 is released. Next, the hand 9 is moved to the movement destination of the backup pin unit 4 while rotating the hand 9 and rotated (step S106). FIG. 14 is an example of a diagram illustrating a state in which the backup pin unit 4 is moved. When the hand 9 is moved to the movement destination of the backup pin unit 4 while the hand 9 is raised, the backup pin unit 4 moves along the slit 2 on the base plate 3. Further, when the hand 9 is rotated while being raised, the relative position of the support pin 8 with respect to the positioning pin 7 changes. Next, the hand 9 is lowered (step S107). FIG. 15 is an example of a diagram showing how the backup pin unit 4 is fixed to the base plate 3 at the destination. When the hand 9 is lowered, the permanent magnet 12 comes into contact with the base plate 3 at the destination of the backup pin unit 4, and the backup pin unit 4 is fixed to the base plate 3.

  The control device 20 determines whether or not the movement of all the backup pin units 4 mounted on the base plate 3 is completed after sending the calculated instruction values to the actuators 10X, 10Y, 10Z, and 10T (S108). ). Whether or not the movement of all the backup pin units 4 mounted on the base plate 3 is completed can be determined based on the number of the backup pin units 4 that have moved. When it is determined that the movement of all the backup pin units 4 mounted on the base plate 3 has not been completed, the control device 20 executes the processes after step S104 again. In addition, when it is determined that the movement of all the backup pin units 4 mounted on the base plate 3 is completed, the control device 20 ends the series of processes from step S101 to step S108.

When the control device 20 that controls the moving mechanism 5 is linked to the control device of the cream solder printer 120, the cream solder printer 120 may realize the following operation flow, for example. FIG. 16 is an example of an operation flowchart of the cream solder printer 120 realized in the cream solder printer 120.

  When the solder paste printing machine 120 completes printing of the printed circuit board for a specific model, for example, the completion display is displayed on the display of the operation panel, and Patrite (registered trademark), which is a rotating lamp, is turned on to complete the printing to the operator. Notify (S201). Then, for example, the cream solder printer 120 refers to the order data defining the order of the model of the product handled in the SMT mounting line 100, and displays the figure number of the printed board of the next model to be printed (S202). The order data may be acquired from a control device that controls the entire SMT mounting line 100, or may be acquired from a storage device incorporated in the cream solder printer 120. Then, for example, the cream solder printing machine 120 operates an automatic machine for replacing the screen plate 121 (S203), and starts the replacement operation of the screen plate 121 (S204). Further, in the cream solder printer 120, for example, an operation instruction for changing the position of the support pin 8 or an input of a figure number is input from the control device that controls the cream solder printer 120 to the control device 20 that controls the moving mechanism 5. Performed (S205).

  When an operation instruction for changing the position of the support pin 8 or an input of a figure number is performed from the control device that controls the cream solder printing machine 120 to the control device 20 that controls the moving mechanism 5, the control device 20 Pin coordinate information is acquired from the database 24 (S206). And the control apparatus 20 will calculate the instruction value sent to each actuator 10X, 10Y, 10Z, 10T, if pin coordinate information is acquired (S207). When the calculated instruction value is sent to the actuator drive control section 21, a drive instruction signal is sent from the actuator drive control section 21 to each actuator 10X, 10Y, 10Z, 10T (S208). When a drive instruction signal is sent to each actuator 10X, 10Y, 10Z, 10T, the hand 9 is moved by each actuator 10X, 10Y, 10Z, 10T, and the arrangement of the backup pin unit 4 is changed (S209). Then, in the control device 20, it is determined whether or not the movement of all the backup pin units 4 mounted on the base plate 3 is completed (S210). When all the backup pin units 4 mounted on the base plate 3 have been moved, it is determined whether or not the screen plate 121 has been replaced in the control device that controls the cream solder printer 120. This is performed (S211). When the replacement of the screen plate 121 has been completed, a message indicating that the next type of printed circuit board is loaded and solder printing is started is displayed on the display of the cream solder printer 120 (S212). After the printed circuit board is loaded and solder printing is started, various electronic components are placed on the printed circuit board on which the solder is printed and reflowed in a reflow furnace.

  In the cream solder printer 120, when the series of processing from step S201 to step S212 is realized, the replacement of the screen plate 121 and the change of the position of the support pin 8 are performed in parallel. Therefore, the type of the printed circuit board can be changed more efficiently than the case where the procedure of changing the position of the support pin 102 after removing the screen plate 121 and attaching a new screen plate 121 after changing the position of the support pin 102 is adopted. Can be supported.

In addition, you may deform | transform the said printed circuit board support apparatus 1 as follows. FIG. 17 is an example of a diagram illustrating a printed circuit board support apparatus 1A according to the first modification. For example, as shown in FIG. 17, the printed circuit board support device 1 has an interval between the slits 2 </ b> A of the base plate 3 </ b> A that is narrower than that of the printed circuit board support device 1 of the above-described embodiment, A backup pin unit 4A provided on the shaft may be used. In the printed circuit board support apparatus 1A according to this modification, since the support pin 8A is at the center of the base 6A and the support pin 8A is not eccentric with respect to the positioning pin, when the position of the support pin 8A is changed, it is simply a backup pin. The unit 4A is moved along the slit 2A. That is, it is not necessary to rotate the backup pin unit 4A. Even in the printed circuit board supporting apparatus 1A according to the first modified example, the replacement of the screen plate and the change of the position of the support pin 8A can be performed in parallel. It is possible to cope with the change of the type of the printed circuit board more efficiently than the case where the procedure of attaching the screen plate is taken.

  The printed circuit board support device 1 may be modified as follows. FIG. 18 is an example of a diagram illustrating a printed circuit board support device 1B according to a second modification. For example, as shown in FIG. 18, the printed circuit board support device 1 may have a base plate 3 </ b> B having an opening 13 </ b> B to which one end of each slit 2 </ b> B is connected. The size of the opening 13B to which one end of each slit 2B is connected is at least large enough to allow the backup pin unit 4 to pass therethrough. If the opening 13B having a size through which the backup pin unit 4 can pass is connected to one end of each slit 2B, the number of backup pin units 4 placed on each slit 2B is moved below the base plate 3B. Can be changed by mechanism. In the printed circuit board support device 1B according to the second modification, a plurality of types of backup pin units 4 having different lengths of the support pins 8 are stocked and supported on the lower side of the base plate 3B. The backup pin unit 4 having the support pins 8 having a length corresponding to the type of the printed circuit board can be appropriately changed.

  By the way, the hands 9 of the printed circuit board support apparatuses 1, 1A, 1B according to the above-described embodiments and modifications may be as follows. FIG. 19 is an example of an enlarged view of the hand 9. FIG. 19A shows the external appearance of the hand 9, and FIG. 19B shows the internal structure of the hand 9. As shown in FIG. 19, for example, the hand 9 spirally surrounds the sliding portion 14 that protrudes upward from the hand base 9 </ b> A in a cylindrical shape, the sleeve 15 to which the sliding portion 14 fits, and the sliding portion 14. And a coil spring 16 for urging the sleeve 15 upward. The sleeve 15 is provided with a groove-shaped groove cam 17 that is inclined obliquely with respect to the central axis of the sliding portion 14. The groove cam 17 is fitted with a protrusion 18 that protrudes laterally from the side surface of the sliding portion 14. Therefore, the sleeve 15 is movable within the movable range of the groove cam 17 in which the protrusion 18 is fitted. The sleeve 15 rotates along the inclination of the groove cam 17 when moving up and down. A cam 19 is formed in a mortar shape at the upper end of the sleeve 15.

  FIG. 20 is an example of a diagram illustrating the movement of the sleeve 15. When the hand 9 is moved upward from the lower side of the backup pin unit 4, the cam 19 comes into contact with the detent 11 of the positioning pin 7 (FIG. 20A). Since the backup pin unit 4 is fixed to the base plate 3 by the permanent magnet 12, when the cam 19 comes into contact with the rotation stopper 11, the coil spring 16 is compressed and the sleeve 15 starts to rotate gradually along the inclination of the groove cam 17. (FIG. 20B). Then, the sleeve 15 rotates until the detent 11 of the positioning pin 7 fits into the bottom of the cam 19 (FIG. 20C). When the hand 9 is moved further upward, the push-up force of the hand 9 overcomes the magnetic force of the permanent magnet 12 and the backup pin unit 4 is lifted from the base plate 3. When the backup pin unit 4 is lifted from the base plate 3, the fixing force of the backup pin unit 4 is lost. Therefore, the backup pin unit 4 is pushed up together with the sleeve 15 by the force of the coil spring 16 and rotates along the inclination of the groove cam 17. The backup pin unit 4 also rotates so as to follow the rotation of the sleeve 15 (FIG. 20D). In the state where the fixing force of the backup pin unit 4 is lost, the sleeve 15 is positioned at the upper end of the movable range, and the detent 11 is also fitted in the bottom of the cam 19, so that the hand as viewed from above The angle of the backup pin unit 4 with respect to 9 is uniquely determined. Therefore, the angle of the backup pin unit 4 is uniquely determined only by pushing up the backup pin unit 4 with the rotation angle of the hand 9 appropriately adjusted, and the positional relationship of the support pin 8 with respect to the positioning pin 7 can be adjusted.

1, 1A, 1B ... Printed circuit board support device: 2, 2A, 2B ... Slit: 3, 3A, 3B, 103 ... Base plate: 4, 4A ... Backup pin unit: 5 ... Moving mechanism: 6, 6A・ ・ Pedestal: 7 ・ ・ Positioning pin: 8, 8A, 102 ・ ・ Support pin: 9 ・ ・ Hand: 9A ・ ・ Hand base: 10, 10X, 10Y, 10Z, 10T ・ ・ Actuator: 11 ・ ・ Detent: 12 .. Permanent magnet: 13B. Opening: 14. Sliding part: 15. Sleeve: 16. Coil spring: 17. Groove cam: 18. Projection: 19. Cam: 20. Control device : 21 ·· Actuator drive control unit: 22 · · Operation sequence control unit: 23 · · Actuator instruction value calculation unit: 24 · · Pin coordinate database: 25X, 25Y, 25Z, 25T · · · 26: Operation instruction interface: 27 ... Drawing number input interface: 50 ... Print board: 100 ... SMT mounting line: 101 ... Board support jig: 110 ... Loader: 120 ... Cream solder printer : 121-Screen version: 122-Squeegee: 123-Cream solder: 130A, 130B-Chip mounter: 140-Reflow furnace: 150-Unloader

Claims (7)

A plate having a plurality of slits in parallel;
A plurality of members placed on each of the slits, a support member for supporting a printed circuit board placed above the plate,
A moving mechanism for moving the support member along the longitudinal direction of the slit from the lower side of the plate material through the slits. The support member is
A fitting portion that fits into the slit;
The printed circuit board support device according to claim 1, further comprising: a protruding portion that protrudes upward at a position that is eccentric with respect to the fitting portion, and that contacts a printed circuit board placed above the plate member. The support member has a circular pedestal placed on the slit,
The fitting portion protrudes downward from the center of the pedestal,
The protruding portion protrudes upward at a position eccentric from the center of the pedestal,
The printed circuit board support apparatus according to claim 2. The moving mechanism rotates the support member around the fitting portion;
The printed circuit board support apparatus according to claim 2 or 3. The plate has an opening to which one end of each slit is connected,
The moving mechanism places the support member on the slit through the opening from the lower side of the plate material.
The printed circuit board support apparatus according to any one of claims 1 to 4. At least one of the plate member and the support member has a permanent magnet that attracts the other by magnetic force.
The printed circuit board support apparatus according to any one of claims 1 to 5. A plurality of members placed on a plurality of parallel slits formed in the plate material, and a support member that supports a printed circuit board placed above the plate material, the lower side of the plate material from above the slits through the slits Move along the length of the slit,
Place the printed circuit board on the plate material,
A printed circuit board reflow method in which paste-like solder is applied to the printed circuit board supported by the support member on the plate material.

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