JP2016139681A - Steam supply device, steam drying device, steam supply method and steam drying method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem that, in steam drying of a substrate having a fine pattern formed thereon, prevention of pattern collapse due to moisture contained in an original IPA to be stored is a problem.SOLUTION: A recycling and dehydrating means 30 is connected to a storage unit 11 itself, a mixed liquid of an IPA and water is supplied to the storage unit 11 from a mixed liquid supply source via a pipeline 12, and then moisture is removed from the mixed liquid in the storage unit 11 by a dehydrating section 33. Then, the IPA in the storage section 11 is vaporized to be supplied to a substrate processing section 90. Thus, the concentration of moisture contained in an original IPA to be stored can be reduced, so that pattern collapse can be minimized.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate vapor drying apparatus, a substrate vapor drying method, a vapor generation apparatus used for a substrate vapor drying process, and a vapor generation method. The substrate includes a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a field emission display (FED) substrate, a substrate for an optical disk, a substrate for a magnetic disk, Various substrates such as a photoelectric magnetic disk substrate are included.

  In a manufacturing process of an electronic component such as a semiconductor device or a liquid crystal display device, a process using a processing liquid is performed on a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device. Specifically, the main surface of the substrate is subjected to a wet process with a chemical solution, whereby the main surface of the substrate is cleaned or etched, and then deionized water (De Ionized) is applied to the main surface of the substrate to which the chemical solution is supplied. Pure water such as Water (hereinafter referred to as “DIW”) is supplied to perform a rinsing process for washing away the chemical on the main surface of the substrate.

  After the rinsing process is performed, a drying process for removing the pure water remaining on the main surface of the substrate and drying the substrate is performed. As a method of performing this drying treatment, for example, spin drying in which pure water is shaken and removed by centrifugal force due to rotation of the substrate, nitrogen gas is blown to the main surface of the substrate, pure water on the main surface of the substrate is blown off, or evaporation is performed. Conventionally, spray drying to be removed is performed.

  However, in the above-described drying method, when a pattern consisting of fine irregularities is formed on the main surface of the substrate, the pattern concave portion is exposed when the pattern of the substrate main surface is exposed from the liquid surface of the pure water due to the progress of drying. The pattern collapse may occur due to the surface tension of pure water left inside the pattern. In particular, in recent years when the pattern formed on the main surface of the substrate is miniaturized, prevention of pattern collapse has become an important issue.

  Therefore, by supplying a liquid or vapor of isopropyl alcohol (Isopropyl Alcohol, hereinafter referred to as “IPA”), which is an organic solvent having a surface tension lower than that of pure water, to the main surface of the substrate after the rinsing process. There is a technique in which pure water adhering to a surface is replaced with IPA, and then the substrate is dried by removing the IPA from the substrate main surface.

  The technology of performing drying by replacing the pure water adhering to the substrate main surface with IPA by supplying the vapor of IPA to the substrate main surface and then removing the IPA from the substrate main surface is disclosed in Patent Document 1 and Patent It is disclosed in Document 2.

  As a method for generating the IPA vapor, as disclosed in Patent Document 3, N2 gas is bubbled into the IPA stored in the IPA tank to generate a mixed gas containing IPA vapor, or Patent Document 4 A two-fluid nozzle system that generates a mixed fluid of IPA liquid and N2 gas using a two-fluid nozzle, and then heats the mixed fluid to generate IPA vapor. There is known a liquid heating method in which IPA of liquid stored inside is heated by a heater block and evaporated.

  In addition, the waste IPA used in the semiconductor device manufacturing process is recovered and the ion exchange resin is used for the recovered IPA in order to purify and reuse the IPA as much as when purchased for the semiconductor device manufacturing process. In this manner, the ion exchange treatment for removing the ion components in the IPA, the dehydration treatment using the pervaporation membrane, and the distillation treatment are sequentially executed, and the above-described purification treatment is performed on the waste IPA in the circulation line until the alcohol concentration becomes a predetermined value or more. Then, the technique which supplies IPA after refinement | purification to a supply tank is disclosed by patent document 6. FIG.

Japanese Patent Laid-Open No. 4-155924 JP 2008-198741 A JP 2003-168668 A JP 2007-46838 A JP-A-5-90240 JP 2013-23440 A JP 2008-112971 A

  In the semiconductor device manufacturing process, as described above, there is a problem of preventing pattern collapse due to the surface tension of moisture remaining in the pattern on the main surface of the substrate when the substrate is dried. Conventionally, measures have been taken to replace the moisture in the pattern with a substance such as IPA having a low surface tension. However, in recent years when the pattern becomes finer, due to the influence of moisture contained in the IPA itself supplied to the main surface of the substrate, moisture remains on the main surface of the substrate even after the IPA replacement, and the pattern collapses. There is a situation that cannot be suppressed.

  More specifically, when moisture remains on the main surface of the substrate, the moisture is also filled between patterns formed on the surface of the substrate. When the water content to be filled is high enough to exert a surface tension relative to the height of the convex portion of the pattern, the surface tension of the water acts on the pattern as the water content between the patterns evaporates. Collapse will occur. The finer the pattern, the smaller the volume between the patterns. Therefore, even if a small amount of moisture remains on the main surface of the substrate, the moisture is filled between the patterns to a sufficient height that can exert surface tension.

  Therefore, in order to prevent pattern collapse, the moisture remaining on the main surface of the substrate needs to be reduced as the pattern becomes finer.

  For example, the dewatering circulation line described in Patent Document 6 is provided in a line for collecting IPA after substrate processing. For this reason, in Patent Document 6, the moisture originally contained in the IPA charged as the supplemental alcohol in the supply tank cannot be removed, and the pattern collapse may occur due to the moisture.

  For example, Patent Document 7 discloses that pure water on the upper surface of a wafer is supplied by supplying an IPA liquid to the wafer in a state in which the processing space in the chamber for processing the wafer is filled with CDA (Clean Dried Air). A technique is disclosed in which water is dissolved in the IPA liquid supplied to the surface of the wafer by substituting IPA with IPA.

  However, there is a case where a large amount of moisture is contained in the IPA before being supplied to the substrate, that is, the IPA stored in the tank and before being supplied from the nozzle to the substrate. In this case, even if the substrate is dried by IPA vapor, moisture is already contained in the generated IPA vapor. When the substrate is dried by spraying the vapor on the substrate, the pattern collapses due to the moisture. Will occur.

  Here, IPA has high hygroscopicity, for example, when IPA is carried into the tank and flows into the tank, or during storage in the tank, the IPA touches the outside air containing moisture and absorbs moisture, so that moisture has already been obtained before substrate processing. A situation may occur in which the concentration is equal to or higher than a predetermined concentration value.

  Even in the case where moisture absorption at the time of IPA carry-in as described above hardly occurs, in recent years when the pattern is becoming finer, the pattern is caused by the moisture in the IPA originally included at the time of purchase. There is a risk of collapse.

  A commercially available IPA has a grade set according to the application and the like, and a standard value for each impurity such as a moisture content is determined for each grade. In the electronic industry applications where higher-purity IPA is required, such as semiconductor device manufacturing processes, the so-called “EL grade (high-purity product)” IPA is used. The IPA concentration of the grade depends on the standard value of each company. Although it is different, it is about 99.9% or more. However, even an EL grade IPA may contain about 0.01% to 0.1% of moisture, and even such a small amount of moisture may affect pattern collapse.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a vapor supply method for reducing the amount of water contained in IPA vapor supplied to a substrate, generating high-concentration IPA vapor, and supplying the vapor to a processing chamber, and An object of the present invention is to provide a vapor drying apparatus and a vapor drying method and a vapor drying apparatus for performing a substrate drying process using IPA vapor supplied by the vapor supply apparatus.

  The vapor supply apparatus according to the first invention of the present application is used in a vapor drying process for supplying vapor of a low surface tension liquid having a surface tension equal to or lower than the surface tension of the treatment liquid to the main surface of the substrate to which the treatment liquid is attached. A vapor supply device, wherein the liquid mixture storing the liquid mixture including the low surface tension liquid and water, the liquid mixture stored in the liquid mixture storage section is introduced and dehydrated, and the liquid dehydrated Circulating dehydration means for returning the mixed liquid to the mixed liquid storage section; vapor generating means for generating a mixed vapor that is a vapor of the mixed liquid from the mixed liquid stored in the mixed liquid storage section; A vapor supply pipe connected to the liquid reservoir and supplying the mixed vapor generated by the vapor generation means to the substrate;

2nd invention of this application is the steam supply apparatus of 1st invention, Comprising:
The apparatus further includes mixed liquid supply means for supplying the mixed liquid to the mixed liquid storage unit.

  3rd invention of this application is the vapor | steam supply apparatus of 2nd invention, Comprising: The said liquid mixture supply means supplies the said liquid mixture whose ratio of water is 0.1 weight% or less to the said liquid mixture storage part. It is characterized by.

  A fourth invention of the present application is the steam supply device according to any one of the first invention to the third invention, wherein the mixed steam generated by the steam generating means is exhausted to an exhaust mechanism outside the liquid mixture reservoir. Exhaust means is further provided.

  A fifth invention of the present application is the vapor supply apparatus according to the fourth invention, further comprising a mixed vapor supply means for supplying the mixed vapor to the mixed liquid storage section, wherein the mixed vapor supply means is provided in the mixed liquid storage section. The ratio of water in the mixed steam to be supplied is less than or equal to the ratio of water in the mixed liquid stored in the mixed liquid storage section.

  6th invention of this application is a steam supply apparatus of 5th invention, Comprising: The said mixed steam supply means has a mixed steam storage part which stores the said mixed steam, The said mixed steam storage part is the said steam supply pipe | tube. And the steam supply pipe supplies the mixed steam generated by the steam generating means to at least one of the substrate and the mixed steam storage section.

  7th invention of this application is the vapor | steam supply apparatus in any one of 4th invention from 6th invention, Comprising: The density | concentration of the said low surface tension liquid or the water | moisture content contained in the said liquid mixture stored in the said liquid mixture storage part And a control unit that controls the vapor generation unit and the exhaust unit based on the concentration detected by the sensor, and the control unit is stored in the mixed liquid storage unit. When the moisture concentration of the mixed liquid is equal to or lower than a first predetermined value and greater than a second predetermined value, the vapor generation means generates the mixed vapor from the mixed liquid stored in the mixed liquid storage unit. The vapor generating means exhausts the mixed vapor to the exhaust mechanism, and when the water concentration of the mixed liquid stored in the mixed liquid storage portion is equal to or lower than the second predetermined value, the vapor generating means The mixed vapor is generated from the mixed liquid stored in the mixed liquid storage unit, the mixed vapor is supplied to the vapor supply pipe, and the first predetermined value is the low surface tension liquid included in the mixed liquid Of the low surface tension liquid contained in the mixed vapor generated from the mixed liquid is equal to or lower than the azeotropic concentration, and the second predetermined value is the first predetermined value. The value is smaller than that.

  An eighth invention of the present application is the vapor supply device according to the seventh invention, further comprising an outflow pipe for allowing the mixed liquid stored in the mixed liquid storage section to flow out, wherein the sensor flows out of the outflow pipe. Using the mixed liquid, the concentration of the low surface tension liquid or moisture contained in the mixed liquid is detected.

  A ninth invention of the present application is the steam supply device according to any one of the first to eighth inventions, wherein the circulating dehydration means includes a separation unit for separating water in the mixed liquid, and And an adsorption part for adsorbing water.

  A tenth invention of the present application is a steam drying device, wherein any one of the steam supply devices from the first invention to the ninth invention, a chamber for housing the substrate, a pipe connection with the steam supply pipe, A nozzle for supplying mixed vapor to the substrate accommodated in the chamber.

  An eleventh aspect of the present invention is a vapor supply method used in a vapor drying process for supplying a vapor of a low surface tension liquid having a surface tension equal to or lower than the surface tension of the treatment liquid to the main surface of the substrate to which the treatment liquid is adhered. A storage step of supplying the mixed liquid to a mixed liquid storage section that stores the mixed liquid containing the low surface tension liquid and water, and the mixed liquid stored in the mixed liquid storage section. A circulation dehydration step of dehydrating by introducing the dehydrated portion into the dehydrated portion connected to the pipe line and returning the dehydrated mixed liquid from the dehydrated portion to the mixed liquid storage portion; and the stored in the mixed liquid storage portion A vapor supply step of generating a mixed vapor that is a vapor of the mixed liquid from the mixed liquid, and supplying the mixed vapor to a vapor supply pipe connected to the mixed liquid storage unit and supplying the mixed vapor to the substrate; Prepare.

  A twelfth invention of the present application is the steam supply method according to the eleventh invention, wherein the storing step supplies the mixed liquid having a water ratio of 0.1 wt% or less to the mixed liquid storing portion. And

  A thirteenth invention of the present application is the steam supply method of the twelfth invention, wherein the storing step supplies the mixed liquid having a ratio of water larger than a first predetermined value to the mixed liquid storing portion, After the water concentration of the mixed liquid stored in the mixed liquid storage part by the circulation dehydration step is equal to or less than the first predetermined value and larger than a second predetermined value, the water stored in the mixed liquid storage part A vaporization dehydration step of generating the mixed vapor from the mixed liquid and exhausting the mixed vapor to an exhaust mechanism outside the mixed liquid storage unit; and the vapor supply step includes moisture of the mixed liquid by the vaporization dehydration step. After the concentration becomes equal to or lower than the second predetermined value, the mixed vapor is generated from the mixed liquid stored in the mixed liquid storage unit, the mixed vapor is supplied to the vapor supply pipe, and the first predetermined value is set. To the mixed liquid The concentration of the low surface tension liquid to be mixed is equal to or lower than the azeotropic concentration at which the concentration of the vapor of the low surface tension liquid contained in the mixed vapor generated from the mixed liquid is equal to the second predetermined value. Is a value smaller than the first predetermined value.

  A thirteenth invention of the present application is a vapor drying method for supplying a vapor of a low surface tension liquid having a surface tension equal to or lower than the surface tension of the processing liquid to the main surface of the substrate to which the processing liquid is adhered, wherein the low surface tension A storage step of supplying the mixed liquid to a mixed liquid storage section that stores the mixed liquid containing liquid and water, and the mixed liquid stored in the mixed liquid storage section are connected to the mixed liquid storage section by a conduit From the mixed liquid stored in the mixed liquid storage unit, the mixing dehydration step of introducing the dehydrated portion into the dehydration unit and returning the dehydrated mixed liquid to the mixed liquid storage unit from the dehydration unit A vapor supply step of generating a mixed vapor, which is a liquid vapor, and supplying the mixed vapor to a main surface of the substrate to which the processing liquid is attached via a vapor supply pipe connected to the mixed liquid storage unit; Prepare.

  According to the present invention, the amount of moisture contained in the IPA vapor supplied to the substrate can be reduced, and high-concentration IPA vapor can be generated and supplied.

  According to the present invention, the substrate can be dried well by supplying the high-concentration IPA vapor to the substrate and performing the substrate drying process.

It is a schematic diagram which shows the whole structure of the vapor drying apparatus concerning 1st Embodiment. It is a schematic diagram which shows the structure of the dehydration part concerning 1st Embodiment. It is a schematic diagram which shows the structure of the control part concerning 1st Embodiment. It is a flowchart of the vapor | steam drying method concerning 1st Embodiment. It is a graph which shows the gas-liquid equilibrium curve in IPA aqueous solution. It is an image figure which shows the water concentration for every elapsed time at the time of dehydrating a liquid mixture.

  In the following description, a substrate means a semiconductor substrate, a glass substrate for photomask, a glass substrate for liquid crystal display, a glass substrate for plasma display, a substrate for FED (Field Emission Display), a substrate for optical disk, a substrate for magnetic disk, and a magneto-optical substrate. Various substrates such as disk substrates.

  In the following description, a substrate on which a circuit pattern or the like (hereinafter referred to as “pattern”) is formed only on one main surface will be used as an example. Here, the one main surface on which the pattern is formed is referred to as “front surface”, and the other main surface on which the pattern on the opposite side is not formed is referred to as “back surface”. Further, the surface of the substrate directed downward is referred to as “lower surface”, and the surface of the substrate directed upward is referred to as “upper surface”. In the following description, the upper surface is assumed to be the surface (one main surface).

  Embodiments of the present invention will be described below with reference to the drawings, taking a substrate processing apparatus used for processing a semiconductor substrate as an example. Note that the present invention is not limited to the processing of semiconductor substrates, and can also be applied to processing of various substrates such as glass substrates for liquid crystal displays.

<First Embodiment>
<1-1. Device configuration>
FIG. 1 is a diagram illustrating a schematic configuration of a steam drying apparatus according to the first embodiment. The vapor drying apparatus 1 has a lower surface tension than the adhering liquid on the substrate W in order to remove the adhering liquid such as DIW adhering to the substrate W such as a semiconductor substrate (hereinafter simply referred to as “substrate W”). This is a single-wafer type apparatus used for a vapor drying process for supplying vapor of a low surface tension liquid.

  Here, as the low surface tension liquid, an organic solvent such as IPA, HFE (hydrofluoroether), ethanol, methanol or the like is used. Hereinafter, in the first embodiment, the low surface tension liquid will be described as IPA.

  The low surface tension liquid is not limited to the above liquid, and any liquid can be used in place of the above liquid as long as it has a lower surface tension than DIW and higher volatility than DIW.

  Further, the adhesion liquid on the substrate W is not limited to DIW, and may be the same liquid as the liquid selected as the low surface tension liquid, for example.

  The vapor drying apparatus 1 controls the substrate drying unit 90 that performs a drying process on the substrate W, the vapor supply apparatus 10 that generates IPA vapor and supplies the IPA vapor to the substrate processing unit 90, and the vapor drying apparatus 1. A control unit 70 is provided. The control unit 70 is electrically connected to each part of the steam drying device 1 and controls the steam drying device 1 by giving a command to each part.

  FIG. 2 is a diagram showing a detailed configuration of a dehydrating unit 33 described later in the steam drying apparatus 1. FIG. 3 is a block diagram illustrating a connection relationship between the control unit 70 and each unit of the steam drying apparatus 1. Hereinafter, the configuration of the steam drying apparatus 1 will be described with reference to FIGS. 1, 2, and 3 as appropriate.

  The steam supply apparatus 10 mainly includes a mixed liquid storage unit 11, a steam supply pipe 13, a steam generation unit 20, a circulation dehydration unit 30, an exhaust unit 40, and a mixed steam supply unit 50. Details of each part in the steam supply device 10 will be described later.

  The substrate processing unit 90 mainly includes a chamber 91 that accommodates the substrate W, a nitrogen gas mixing unit 60 that mixes IPA vapor and nitrogen gas supplied from the vapor supply apparatus 10, and a nozzle 92 that blows IPA vapor onto the substrate W. And comprising. Details of each part in the substrate processing unit 90 will be described later.

  Next, the structure of each part in the steam supply apparatus 10 will be described.

  The vapor supply apparatus 10 stores liquid IPA (hereinafter referred to as “mixed liquid”) containing water, and supplies the mixed liquid from the mixed liquid supply source to the mixed liquid storage section 11. And a valve V <b> 1 that is inserted in the pipe 12 and controls communication between the mixed liquid supply source and the mixed liquid storage unit 11.

  The valve V <b> 1 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V1 and the valve V1 is opened, the mixed liquid is supplied from the mixed liquid supply source to the mixed liquid storage unit 11 via the pipe 12. Further, when the control unit 70 issues an operation command to the valve V1 and the valve V1 is closed, the supply of the mixed liquid from the mixed liquid supply source to the mixed liquid storage unit 11 is stopped.

  Here, the liquid mixture supplied from the liquid mixture supply source in the first embodiment is a liquid containing 0.1 wt% of moisture and 99.9 wt% of IPA. The mixed liquid supply source may be a tank provided in the steam drying apparatus 1, a factory facility such as a large tank provided outside the steam drying apparatus 1 and in the factory, or a movable that is brought in from outside the factory. It may be a type tank.

  The mixed liquid storage unit 11 is a tank that stores the mixed liquid. The liquid mixture storage unit 11 is provided with a liquid level sensor (not shown) in order to detect the amount of liquid mixture stored therein. The liquid level sensor is electrically connected to the control unit 70 and outputs a detection signal to the control unit 70 when the liquid level in the mixed liquid storage unit 11 is equal to or higher than a predetermined height.

  In the implementation of the present invention, the installation of the liquid level sensor is not indispensable, and a window may be provided in the tank so that the operator can know the amount of liquid mixture stored in the liquid mixture storage unit.

  Further, the vapor supply apparatus 10 includes a sensor 14 that measures the moisture concentration contained in the mixed liquid stored in the mixed liquid storage unit 11. In general, there are an off-line sensor and an in-line sensor as moisture concentration measuring sensors. The off-line sensor is actually taken out from the storage unit to perform measurement, and the in-line sensor is to measure the liquid without taking it out from the storage unit or the pipeline. The sensor 14 used in the first embodiment is installed on an offline line outside the mixed liquid storage unit 11 and can measure the moisture concentration on the order of ppm (parts per million), that is, on the order of 0.0001%. In this embodiment, a moisture measuring device using the Karl Fischer method is used as the sensor 14.

  The sensor 14 is electrically connected to the control unit 70 and outputs the moisture concentration measured by the sensor 14 to the control unit 70 as an electric signal. The electric signal input to the control unit 70 is stored in the storage unit 72 described later as data. As described above, the moisture concentration stored in the mixed liquid storage unit 11 can be monitored by the sensor 14 and the control unit 70.

  In the first embodiment, the sensor 14 that measures the moisture concentration is used as described above. However, the present invention is not limited to this, and a sensor that measures the IPA concentration may be used as the sensor 14. In the first embodiment, an off-line sensor is used as the sensor 14, but an in-line sensor may be used.

  Furthermore, the vapor supply apparatus 10 includes a pipe 15 connected to the mixed liquid storage unit 11 and a valve V11 inserted in the pipe 15. The pipe 15 is a drain line for dripping the liquid mixture stored in the liquid mixture storage unit 11 to the sensor 14 by a desired amount, one end connected to the liquid mixture storage unit 11, and the other end to the sensor 14. It is the open end opened so that dripping is possible.

  The valve V <b> 11 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V11 and the valve V11 is opened, the mixed liquid flows out (or drops) from the open end, which is the other end of the pipe 15, from the mixed liquid storage section 11 through the pipe 15. ) Further, when the control unit 70 issues an operation command to the valve V11 and the valve V11 is closed, the outflow of the mixed liquid from the open end of the pipe 15 is stopped.

  The supply of the mixed liquid to the sensor 14 may be configured to be directly dropped from the open end of the pipe 15, or the mixed liquid flowing out from the open end flows into another container and is dropped from the container. Then, the liquid mixture may be obtained and then dropped from the dropper onto the sensor 14. In the present embodiment, the pipe 15 is configured to be dropped directly from the open end.

  Further, the vapor supply device 10 includes vapor generation means 20 that generates a mixed vapor including the vapor of the mixed liquid from the mixed liquid stored in the mixed liquid storage unit 11.

  The vapor generation means 20 is inserted into the pipe 21 for supplying nitrogen gas from the nitrogen gas supply source into the mixed liquid stored in the mixed liquid storage unit 11, and is inserted into the pipe 21. The valve V2 which controls communication with the part 11 and the heating part 22 which heats the liquid mixture stored in the liquid mixture storage part 11 are provided.

  The valve V <b> 2 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V2 and the valve V2 is opened, nitrogen gas is supplied from the nitrogen gas supply source into the mixed liquid in the mixed liquid storage unit 11 through the pipe 21. Further, when the control unit 70 issues an operation command to the valve V2 and the valve V2 is closed, the supply of nitrogen gas from the nitrogen gas supply source to the mixed liquid storage unit 11 is stopped.

  Here, in the first embodiment, the nitrogen gas supplied from the nitrogen gas supply source has its moisture content removed by a drying means (not shown) and the dew point is adjusted to -40 ° C or lower, more preferably -80 ° C or lower. Nitrogen gas. The nitrogen gas supply source may be a tank provided in the steam drying device 1, a factory facility such as a large tank provided outside the steam drying device 1 and in the factory, or a movable that is brought in from outside the factory. It may be a type tank.

  In addition, in the vapor | steam production | generation means 20 of 1st Embodiment, although nitrogen gas is used as mentioned above, regarding implementation of this invention, it is not restricted to this, Argon gas, 80% of nitrogen, and oxygen 20% are included, and a dew point is It is good also as a structure which replaces with nitrogen gas and supplies clean dry air (CDA) which is -40 degrees C or less.

  The heating unit 22 is a known resistance heater, is electrically connected to the control unit 70, and performs heating of the mixed liquid stored in the mixed liquid storage unit 11 according to an operation command of the control unit 70. The heating temperature is adjusted by an operation command of the control unit 70, and the mixed liquid stored in the mixed liquid storage unit 11 can be heated at least from room temperature to about 100 ° C.

  When the vapor of the mixed liquid is generated by the vapor generating means 20, the valve V2 is opened according to the operation command of the control unit 70, nitrogen gas is supplied into the mixed liquid, and the heating unit 22 is operated to store the mixed liquid. The mixed liquid stored in the part 11 is heated to such an extent that it does not boil.

  Specifically, the mixed liquid is heated to about 50 ° C. to 60 ° C. by the heating unit 22. In the mixed liquid, the boiling point of IPA is 82.6 ° C, the boiling point of pure water is 100 ° C, and the azeotropic point of the mixed liquid obtained by mixing IPA and water is about 87 ° C. By heating to about 60 ° C. to about 60 ° C., the vapor pressure of the mixed liquid can be increased to higher than normal temperature without boiling the mixed liquid. Thereby, mixing of the vapor | steam of a liquid mixture into the nitrogen gas supplied from the nitrogen gas supply source can be accelerated | stimulated, and the mixed vapor | steam containing nitrogen gas, IPA, and water vapor | steam is produced | generated.

  In the first embodiment, as described above, the bubbling method and the liquid heating method are employed together as the mixed steam generation method.

  Regarding the implementation of the present invention, the means for generating the mixed steam is not limited to the above-described method, and a two-fluid nozzle method may be used, and the bubbling method and the liquid heating method are not used in combination, and each is used alone. Also good. In the first embodiment, as described above, the heating unit 22 heats the mixed liquid to a temperature lower than the boiling point to promote vaporization. However, the present invention is not limited to this and is heated to a temperature higher than the boiling point. May be.

  In addition, the vapor supply device 10 introduces the mixed liquid stored in the mixed liquid storage unit 11 to remove the moisture contained in the mixed liquid, that is, dehydrates the mixed liquid stored in the mixed liquid storage unit. 11 is provided with a circulating dehydrating means 30 for returning to 11.

  The circulation dehydrating unit 30 includes a pipe 31, a valve V <b> 3, a pump 32, a dehydrating part 33, and a pipe 34. The dehydrating unit 33 is a part for removing moisture contained in the mixed liquid, and details thereof will be described later.

  The pipe 31 connects the mixed liquid storage unit 11 and a later-described separation unit 331 in the dehydration unit 33, and introduces the mixed liquid stored in the mixed liquid storage unit 11 into the dehydration unit 33. A valve V3 and a pump 32 are inserted in the pipe 31. The pipe 34 is a pipe provided separately from the pipe 31 that connects the dehydration unit 33 and the mixed liquid storage unit 11. The pipe 34 passes through the dehydration unit 33 and is mixed with the mixed liquid that has been dehydrated by the dehydration unit 33. It returns to the storage part 11.

  The valve V <b> 3 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. The pump 32 is a pump that is electrically connected to the control unit 70 and sends the liquid in the pipe 31 from the valve V3 side to the dehydration unit 33 side according to an operation command of the control unit 70. When the control unit 70 issues an operation command to the pump 32 and the valve V3, and the operation of the pump 32 is started and the valve V3 is opened, the mixed liquid is supplied from the mixed liquid storage unit 11 to the dehydrating unit 33 via the pipe 31. Is done. Further, the mixed liquid that has passed through the dehydrating unit 33 and has been dehydrated by the dehydrating unit 33 is supplied to the mixed liquid storage unit 11 via the pipe 34.

  In addition, when the control unit 70 issues an operation command to the pump 32 and the valve V3, the operation of the pump 32 is stopped and the valve V3 is closed, the mixed liquid storage unit 11 to the dehydrating unit 33 is performed via the pipe 31. And the supply of the mixed liquid from the dehydrating unit 33 to the mixed liquid storage unit 11 through the pipe 34 are stopped.

  Next, the dehydrating unit 33 in the circulation dehydrating unit 30 will be described with reference to FIG. FIG. 2 is a schematic diagram illustrating the configuration of the dehydrating unit 33.

  The dehydrating unit 33 is connected to the piping 31, the separating unit 331 directly connected to the piping 31, the adsorption unit 332 provided at the rear stage of the separation unit 331 as viewed from the pump 32, and the downstream unit of the adsorption unit 332 as viewed from the pump 32. And a filter 333.

  The dehydrating unit 33 includes a valve V <b> 10 that is inserted between the mixed liquid storage unit 11 and the filter 333 in the pipe 34 and controls communication between the mixed liquid storage unit 11 and the filter 333. The valve V <b> 10 is a valve provided so that the mixed liquid does not flow backward from the mixed liquid storage unit 11 to the dehydrating unit 33 via the pipe 34.

  Regarding the implementation of the present invention, the valve V10 is not limited to the valve, and a backflow prevention valve may be provided in the pipe 34.

  The separation unit 331 is configured by a separation membrane that separates IPA and water contained in the mixed liquid, and separates water in the mixed liquid that is a separation target from the IPA by a pervaporation (PV) method. As the separation membrane, a zeolite membrane, a polyimide separation membrane, or a cellulose separation membrane can be used. In the first embodiment, the zeolite is widely used as a separation membrane for dehydration from alcohol and has a very strong hygroscopic property. Use a membrane.

  The adsorbing unit 332 is configured by an adsorbing member that adsorbs moisture contained in the mixed liquid, and selectively absorbs and removes moisture from the mixed liquid using the hygroscopic property of the adsorbing member, thereby increasing the concentration of IPA in the mixed liquid. . In the first embodiment, zeolite is used as the material of the adsorption member. The implementation of the present invention is not limited to zeolite, and any material that selectively adsorbs moisture in alcohol can be used.

  The filter 333 is composed of a porous filter medium, and removes impurity particles (for example, zeolite pieces) generated by passing the mixed liquid through the separation unit 331 and the adsorption unit 332. As the filter medium, in addition to a glass fiber filter or a membrane filter, a known solvent filter can be used. In the first embodiment, a membrane filter widely used in a semiconductor cleaning process and having organic solvent resistance is used.

  Returning to FIG. The vapor supply apparatus 10 further includes an exhaust unit 40 that exhausts the mixed vapor generated by the vapor generation unit 20 to the exhaust mechanism in the mixed liquid storage unit 11.

  The exhaust means 40 includes a pipe 41 that connects the mixed liquid storage unit 11 and the exhaust mechanism, and a valve V4 that is inserted in the pipe 41 and controls communication between the mixed liquid storage unit 11 and the exhaust mechanism.

  The valve V <b> 4 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V4 and the valve V4 is opened, the mixed vapor is exhausted from the mixed liquid storage unit 11 to the exhaust mechanism via the pipe 41. Further, when the control unit 70 issues an operation command to the valve V4 and the valve V4 is closed, the exhaust of the mixed steam from the mixed liquid storage unit 11 to the exhaust mechanism is stopped.

  In addition, it is good also as a structure which mixes a vapor | steam positively by inserting a pump in the piping 41 further.

  Here, the exhaust mechanism is provided outside the mixed liquid storage unit 11, stores the mixed vapor discharged from the mixed liquid storage unit 11 through the pipe 41 as it is, or applies a known liquefaction process to the mixed vapor to obtain a liquid It is a tank that is stored as a state, and may be a tank provided in the steam drying device 1, a factory equipment such as a large tank provided outside the steam drying device 1 and in the factory, or taken out of the factory Possible movable tanks may be used. The mixed steam stored in the tank is discarded inside or outside the factory or reused by performing a known IPA purification process.

  In addition, the vapor supply apparatus 10 is interposed between the vapor supply pipe 13 that connects the mixed liquid storage unit 11 and the pipe 61 in the substrate processing unit 90, and the vapor supply pipe 13. And a valve V5 for controlling communication. Via the vapor supply pipe 13, the mixed vapor generated by the vapor generation means 20 in the mixed liquid storage unit 11 is supplied to the substrate processing unit 90 or a mixed vapor storage unit 52 described later.

  The valve V <b> 5 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V5 and the valve V5 is opened, the mixed liquid storage unit 11 and the pipe 51 in the substrate 51 or the substrate processing unit 90 described below are connected via the vapor supply pipe 13. Connecting.

  When the valve V5 is opened and a later-described valve V6 is opened, the mixed liquid storage unit 11 and the nozzle 92 in the substrate processing unit 90 are connected via the vapor supply pipe 13 and the pipe 61. When the valve V5 is opened and a later-described valve V7 is opened, the mixed liquid storage unit 11 and the mixed vapor storage unit 52 are connected via the vapor supply pipe 13 and the pipe 51.

  Further, when the control unit 70 issues an operation command to the valve V5 and the valve V5 is closed, the connection between the mixed liquid storage unit 11 and the pipe 51 or the pipe 61 is cut off.

  The steam supply pipe 13 may be configured such that a pump is further inserted. By interposing the pump, the mixed steam in the steam supply pipe 13 can be positively supplied to the substrate processing unit 90. Further, after the mixed vapor generated in the mixed liquid storage unit 11 is supplied to the vapor supply pipe 13, when the mixed vapor is cooled in the vapor supply pipe 13, the mixed vapor is condensed in the vapor supply pipe 13 to become a mixed liquid. Returning to the substrate W, there is a possibility that the liquid mixture may drip. In order to prevent this, the steam supply pipe 13 may be provided with a temperature control mechanism that adjusts the temperature of the steam supply pipe 13 to about 50 to 60 ° C.

  The vapor supply apparatus 10 further includes a mixed vapor supply unit 50 that supplies the mixed vapor to the mixed liquid storage unit 11. The mixed steam supply means 50 is inserted into the mixed steam storage section 52 that stores the mixed steam, the pipe 51 that connects the mixed steam storage section 52 and the steam supply pipe 13, and mixed with the steam supply pipe 13. A valve V7 that controls communication with the vapor storage unit 52, a pipe 53 that connects the mixed vapor storage unit 52 and the mixed liquid storage unit 11, and a pipe 53, and the mixed vapor storage unit 52 and the mixed liquid storage unit And a valve V8 that controls communication with the motor 11.

  The mixed steam storage unit 52 is a tank that stores mixed steam therein. In order to prevent outside air and moisture from being mixed into the mixed steam, the mixed steam reservoir 52 is sealed except that it is connected to the pipe 51 and the pipe 53. Therefore, the external atmosphere and the mixed steam in the mixed steam storage unit 52 are blocked.

  The valve V <b> 7 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V7 and the valve V7 is opened, the steam supply pipe 13 and the mixed steam storage unit 52 communicate with each other. At this time, when the valve V5 is opened and the mixed vapor is supplied from the mixed liquid storage unit 11 to the vapor supply pipe 13, the mixed vapor is supplied to the mixed vapor storage unit 52 via the pipe 51, and the mixed vapor is supplied. Is stored in the mixed steam storage section 52. Further, when the control unit 70 issues an operation command to the valve V7 and the valve V7 is closed, the communication between the steam supply pipe 13 and the mixed steam storage part 52 is interrupted, and the mixed steam flowing in the steam supply pipe 13 is The mixed steam reservoir 52 is not supplied.

  In addition, it is good also as a structure which supplies the mixed steam in the steam supply pipe | tube 13 to the mixed steam storage part 52 positively by inserting a pump between the valve | bulb V7 and the mixed steam storage part 52 in the piping 51. FIG.

  Moreover, it is good also as a structure which prevents the backflow of the mixed steam from the mixed steam storage part 52 to the steam supply pipe | tube 13 by inserting the backflow prevention valve in the piping 51 further.

  The valve V <b> 8 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V8 and the valve V8 is opened, the mixed vapor storage unit 52 and the mixed liquid storage unit 11 communicate with each other, and the mixed vapor storage unit 52 stores the mixed vapor. The mixed vapor is supplied to the mixed liquid storage unit 11 through the pipe 53.

  Here, as will be described later, when the mixed steam is supplied to the mixed steam storage section 52, the mixed steam storage section is obtained by using high-pressure nitrogen gas from the nitrogen gas supply source in the steam generation means 20. In 52, the mixed vapor is stored in a positive pressure state higher than the atmospheric pressure. Therefore, when the valve V8 is opened, if the inside of the mixed liquid storage unit 11 is at atmospheric pressure and the inside of the mixed vapor storage unit 52 is in a positive pressure state higher than the atmospheric pressure, the mixed vapor storage unit 52 can supply the mixed steam. Is supplied to the mixed liquid reservoir 11 through the pipe 53.

  Further, when the control unit 70 issues an operation command to the valve V8 and the valve V8 is closed, the communication between the mixed vapor storage unit 52 and the mixed liquid storage unit 11 is interrupted and stored in the mixed vapor storage unit 52. The mixed vapor is not supplied to the mixed liquid storage unit 11.

  In addition, when the mixed steam is cooled in the pipe 51, the mixed steam storage section 52, or the pipe 53, the inside of these aggregates and returns to the mixed liquid, which may cause dripping of the mixed liquid inside the pipe or the storage section. There is. In order to prevent this, it is good also as a structure which provides the temperature control mechanism which temperature-controls these inside to about 50-60 degreeC in the piping 51, the mixed steam storage part 52, or the piping 53, and suppresses aggregation of mixed steam. .

  Next, the configuration of each unit in the substrate processing unit 90 will be described.

  The substrate processing unit 90 includes a chamber 91 that accommodates the substrate W. The chamber 91 forms a processing space for processing the substrate W by the side wall, the ceiling, and the bottom surface.

  The substrate processing unit 90 also includes a shutter 93 for carrying the substrate W in and out of the chamber 91, a holding unit (not shown) for holding the loaded substrate W, and the substrate W held by the holding unit. A nozzle 92 for supplying mixed steam to the main surface is provided.

  The nozzle 92 is provided with a movement mechanism (not shown). The movement mechanism is electrically connected to the control unit 70, and the nozzle 92 is positioned at a position facing the main surface of the substrate W according to an operation command of the control unit 70. Positioned. The shutter 93 and the holding unit are also electrically connected to the control unit 70, respectively, and the opening / closing of the shutter 93 and the holding state of the substrate W by the holding unit are controlled by an operation command of the control unit 70.

  In addition, the substrate processing unit 90 includes a nitrogen gas mixing unit 60 that mixes nitrogen gas with the IPA vapor supplied from the vapor supply apparatus 10. The nitrogen gas mixing means 60 includes a pipe 61 that connects the steam supply pipe 13 and the nozzle 92, and a valve V <b> 6 that is inserted in the pipe 61 and controls communication between the steam supply pipe 13 and the nozzle 92.

  Further, the nitrogen gas mixing means 60 is branched and connected between the valve V6 and the nozzle 92 in the pipe 61, the pipe 62 connecting the pipe 61 and the nitrogen gas supply source, and the pipe 62. And a valve V9 for controlling communication with the gas supply source.

  The nitrogen gas supply source is a gas supply source that supplies nitrogen gas to the pipe 62 (for example, a gas cylinder in which nitrogen gas is compressed and stored). The nitrogen gas supply source may be a cylinder provided in the steam drying apparatus 1, a factory facility such as a large cylinder provided outside the steam drying apparatus 1 and in the factory, or a movable that is brought in from outside the factory. An expression cylinder may be sufficient. In the first embodiment, the gas supplied from the nitrogen gas supply source is a nitrogen gas having a dew point of −40 ° C. or less, preferably a dew point of −100 ° C. or less and a concentration of 99.999% by volume or more.

  The valve V <b> 6 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V6 and the valve V6 is opened, the steam supply pipe 13 and the nozzle 92 communicate with each other, and the mixed steam flowing in the steam supply pipe 13 passes through the pipe 61 to the nozzle 92. Supplied. Further, when the control unit 70 issues an operation command to the valve V6 and the valve V6 is closed, the communication between the steam supply pipe 13 and the nozzle 92 is cut off, and the mixed steam flowing in the steam supply pipe 13 passes through the nozzle 92. Is not supplied.

  When the valve V6 is opened with the valve V5 opened, the mixed liquid storage unit 11 and the nozzle 92 in the substrate processing unit 90 are connected via the vapor supply pipe 13 and the pipe 61.

  The valve V <b> 9 is a valve that is electrically connected to the control unit 70 and opens and closes according to an operation command from the control unit 70. When the control unit 70 issues an operation command to the valve V9 and the valve V9 is opened, the nitrogen gas supply source and the pipe 61 communicate with each other, and the nitrogen gas is supplied from the nitrogen gas supply source through the pipe 62 to the pipe 61 and the nozzle 92. To be supplied. When the control unit 70 issues an operation command to the valve V9 and the valve V9 is closed, the communication between the nitrogen gas supply source and the pipe 61 is cut off, and the nitrogen gas pipe 61 and nozzle from the nitrogen gas supply source are cut off. Supply to 92 stops.

  In addition, when the mixed vapor is cooled in the pipe 61, the mixed vapor returns to the mixed liquid in the pipe 61, and the liquid dripping of the mixed liquid onto the substrate W may occur. In order to prevent this, the pipe 61 may be provided with a temperature control mechanism that adjusts the temperature of the inside to about 50 to 60 ° C. to suppress the aggregation of the mixed steam. Further, since the pipe 62 is connected to the pipe 61 by a pipe, mixed steam may flow in. Therefore, the piping 62 may be provided with the temperature control mechanism so as to suppress the mixed vapor from aggregating.

  Next, the configuration of the control unit 70 will be described with reference to FIG. FIG. 3 is a block diagram illustrating the configuration of the control unit 70 and the relationship between each unit of the control unit 70 and the steam drying apparatus 1. The control unit 70 is electrically connected to each unit of the steam drying apparatus 1, that is, the sensor 14, the heating unit 22, the pump 32, the substrate processing unit 90, and the valves V1 to V11, and controls the operation of each unit.

  The control unit 70 is configured by a computer having a CPU 71 and a storage unit 72 that perform various arithmetic processes. The storage unit 72 includes a ROM 721 that is a read-only memory that stores basic programs, a RAM 722 that is a readable / writable memory that stores various types of information, and a magnetic disk 723 that stores control software, data, and the like. In the magnetic disk, substrate processing conditions corresponding to the substrate W are stored in advance as a program 73 (also called a recipe). The CPU reads the contents into the RAM, and the CPU vaporizes according to the contents of the program read into the RAM. Each part of the drying apparatus 1 is controlled.

  The control unit 70 further includes reading means 75 for reading the storage medium 74 that stores the change / addition program. The storage medium 74 is inserted into the reading unit 75 from the outside, and the change / addition program in the storage medium 74 read by the reading unit 75 is stored as a program 73 in the storage unit 72.

  Further, the control unit 70 includes a display unit 76 for notifying the operator of the currently selected program 73 and the state of the steam drying apparatus 1, and the operator can create / change the program 73, An input unit 77 used for selecting a desired one is connected.

<1-2. Processing steps>
Next, the steam supply and substrate processing steps in the steam drying apparatus 1 configured as described above will be described. Here, an uneven pattern is formed in advance on the main surface of the substrate W. The pattern has a convex part and a concave part. In this embodiment, a convex part is the height of the range of 100-200 nm, and is the width | variety of the range of 10-20 nm. Moreover, the distance (width | variety of a recessed part) between adjacent convex parts is the range of 10-1000 nm. Further, DIW as a rinsing liquid, for example, adheres to the main surface of the substrate W by a wet process performed in advance.

  In the present embodiment, the substrate W on which the scale pattern as described above is formed is used. However, the present invention is not limited to this, and a scale pattern not included in the above range may be used. The substrate processing described later may be performed on the substrate W on which no uneven pattern is formed on the surface.

  Hereinafter, the steam supply method according to the first embodiment will be described with reference to FIG. FIG. 4 is a flowchart showing a steam supply operation to the substrate processing unit 90 of the steam supply apparatus 10 in the first embodiment.

  First, a program 73 corresponding to a predetermined substrate W is selected by the operator at the input unit 77 (see FIG. 3) and is instructed to be executed. Thereafter, the operation of each unit in the steam supply device 10 is executed according to an operation command from the control unit 70.

  In order to supply the mixed steam with less water content to the substrate processing unit 90, the steam supply apparatus 10 executes the following steam supply process. That is, first, the mixed liquid is supplied to the mixed liquid storage unit 11 from the mixed liquid supply source and stored (S11), and the mixed liquid stored in the mixed liquid storage unit 11 is introduced into the circulation dehydrating unit 30 for dehydration. A circulating dehydration step (S12) for returning the mixed liquid dehydrated in the unit 33 to the mixed liquid storage unit 11, and a water concentration in the mixed liquid by the circulating dehydration step is equal to or lower than a first predetermined value (in this embodiment, 0). Is detected by the sensor 14, the mixed liquid stored in the mixed liquid storage unit 11 is heated by the heating unit 22 to generate mixed vapor, and the generated mixed vapor is exhausted. A vaporization dehydration step (S13) for exhausting the liquid mixture storage unit 11 to the outside by the means 40, and a water concentration in the liquid mixture is equal to or less than a second predetermined value (in this embodiment, 0.0005% by weight or less). ) Is detected by the sensor 14, the mixed vapor is generated by supplying nitrogen gas from the nitrogen gas supply source into the mixed liquid in the mixed liquid storage unit 11 through the pipe 21, and the generated mixing A steam supply step (S14) for sending steam to the substrate processing unit 90 via the steam supply pipe 13 is executed.

  Details of the above steps (S11 to S14) will be described with reference to FIGS. 1, 2 and 3 as appropriate.

  First, when the operator selects and executes the program 73, the control unit 70 confirms whether each unit in the steam drying apparatus 1 is in the initial state, and if there is a portion that is not in the initial state, Each part is set to the initial state by the operation command. As an initial state, the steam drying device 1 closes all the valves V1 to V11, and the pumps of the respective parts such as the pump 32 stop operating. In addition, the operation of the heating unit 22 is stopped, and the mixed liquid storage unit 11 is not heated. After the initial state is confirmed, the control unit sequentially executes each step (S11 to S14).

  When the storage step (S11) is started by the operation command of the control unit 70, first, the control unit 70 confirms the presence or absence of a detection signal from the liquid level sensor provided in the mixed liquid storage unit 11. When it is detected that there is no detection signal and the liquid level is lower than the predetermined height, the control unit 70 issues an operation command to the valve V1, opens the valve V1, and mixes the mixed liquid from the mixed liquid supply source. 11 through a pipe 12.

  When the liquid level of the mixed liquid in the mixed liquid reservoir 11 rises due to the supply of the mixed liquid from the mixed liquid supply source, and the liquid level reaches a predetermined height detected by the liquid level sensor, the liquid level sensor controls. A detection signal is transmitted to the unit 70. Upon receiving the detection signal, the control unit 70 issues a control command to the valve V1, closes the valve V1, and stops the supply of the mixed liquid from the mixed liquid supply source to the mixed liquid storage unit 11.

  Here, the mixed liquid supplied from the mixed liquid supply source is a liquid containing 0.1% by weight of moisture and 99.9% by weight of IPA.

  In addition, when water vapor is contained in the atmosphere in the mixed liquid storage unit 11 or the pipe 12, moisture absorption by IPA occurs, so the mixed liquid storage unit 11 is more than the mixed liquid supplied from the mixed liquid supply source. The liquid mixture stored in the tank has a lower IPA concentration and a higher moisture concentration.

  Further, when the mixed liquid is already stored in the mixed liquid storage unit 11, the IPA concentration and moisture of the mixed liquid in the mixed liquid storage unit 11 after newly supplying the mixed liquid from the mixed liquid supply source The concentration depends on the IPA concentration and water concentration of the liquid mixture that has already been stored.

  When the control unit 70 confirms that the liquid level sensor is equal to or higher than the predetermined height and the valve V1 is closed, the circulation dehydration step (S12) is started. When the circulation dehydration process is started, the control unit 70 issues an operation command to the circulation dehydration means 30, operates the pump 32, and opens the valve V3 and the valve V10 (see FIG. 2).

  When the pump 32 is operated by the operation command of the control unit 70 and the valve V3 and the valve V10 are opened, the mixed liquid stored in the mixed liquid storage unit 11 is introduced from the pipe 31 to the dehydration unit 33.

  In the dehydrating unit 33, the mixed liquid sequentially passes through the separating unit 331 and the adsorbing unit 332, so that the water contained in the mixed liquid is separated and adsorbed, and the water contained in the mixed liquid is removed. Is made. In the filter 333, the impurity fine particles generated in the separation unit 331 and the adsorption unit 332 are removed by filtration. Thereby, by allowing the dehydrating part 33 to pass through, it is possible to obtain a mixed liquid in which the water concentration is lower than that of the mixed liquid before introduction into the dehydrating part 33 and the IPA concentration is increased.

  The mixed liquid that has passed through the dehydration unit 33 and has been dehydrated is returned to the mixed liquid storage unit 11 through the pipe 34. The mixed liquid that has been dehydrated and has a high IPA concentration is stored in the mixed liquid storage unit 11 and mixed with the mixed liquid before the dehydration process is performed, so that the entire mixed liquid stored in the mixed liquid storage unit 11 is mixed. IPA concentration increases.

  In the circulation dehydration step (S12), the control unit 70 may confirm the moisture concentration in the mixed liquid stored in the mixed liquid storage unit 11 by the sensor 14 before the operation command to the circulation dehydration unit 30. Good. In this case, the control unit 70 confirms the moisture concentration detected by the sensor 14, and when the moisture concentration detected by the sensor 14 is equal to or higher than the first predetermined value, issues an operation command to the circulation dehydrating unit 30. Thereby, when the water concentration is already equal to or lower than the first predetermined value, the circulation dehydration step (S12) can be omitted.

  In the first embodiment, the first predetermined value is 0.001% by weight (that is, 10 ppm). Further, when the sensor 14 detects the IPA concentration, when the IPA concentration detected by the sensor 14 is equal to or lower than the third predetermined value, the control unit 70 issues an operation command to the circulation dehydrating unit 30 and the pump 32. May be configured to open the valve V3. Here, the third predetermined value is 99.999% by weight.

  The first predetermined value is not limited to 0.001% by weight, but is preferably set to a value equal to or lower than the moisture concentration in the mixed liquid supplied from the mixed liquid supply source. In the first embodiment, the first predetermined value is 0. A value of .01% by weight or less is preferably selected as the first predetermined value.

  Similarly, the third predetermined value is not limited to 99.999% by weight, but is preferably set to a value equal to or higher than the IPA concentration in the mixed liquid supplied from the mixed liquid supply source. In the form, a value of 99.99% by weight or more is preferably selected as the third predetermined value.

  The control unit 70 issues an operation command to the valve V11 every time a predetermined time elapses after the start of the circulating dehydration step (S12), and drops a predetermined volume of the mixed liquid to the sensor 14 via the pipe 15. The water concentration of the mixed liquid detected by is confirmed. When it is confirmed that the moisture concentration detected by the sensor 14 is equal to or lower than the first predetermined value, the vaporization dehydration step (S13) is started. In this embodiment, even after the start of the vaporization dehydration step (S13), the circulation dehydration step (S12) is continuously performed for a predetermined time, and the circulation dehydration step is ended after the predetermined time has elapsed.

  That is, after the control unit 70 receives a signal equal to or lower than the first predetermined value from the sensor 14, a timer (not shown) provided in the control unit 70 counts, and after a predetermined time has elapsed, Accordingly, the pump 32 is stopped, the valve V3 and the valve V10 are closed, the liquid mixture is introduced from the liquid mixture reservoir 11 into the dehydrator 33, and the liquid mixture from the dewaterer 33 to the liquid mixture reservoir 11 is mixed. Will stop returning.

  When the vaporization dehydration step (S13) is started, the control unit 70 issues an operation command to the vapor generating means 20, operates the heating unit 22, and starts heating the mixed liquid in the mixed liquid storage unit 11 by the heating unit 22. To do. In the first embodiment, the mixed liquid is heated to about 50 ° C. to 60 ° C. by the heating unit 22. As a result, the vapor pressure of the mixed liquid increases, so that a mixed vapor containing IPA vapor and water vapor is generated from the liquid surface of the mixed liquid.

  Further, the control unit 70 issues an operation command to the exhaust means 40 to open the valve V4. As a result, the mixed steam generated by the heating unit 22 is exhausted to the exhaust mechanism through the pipe 41.

  Here, the ratio of IPA vapor and water vapor in the mixed vapor generated by the heating unit 22 and the ratio of IPA and moisture in the mixed liquid stored in the mixed liquid storage unit 11 will be described. FIG. 5 shows a vapor-liquid equilibrium curve relating to IPA and pure water.

  FIG. 5 shows a mixed vapor (that is, gas phase) of IPA vapor and water vapor generated when the mixed liquid is evaporated, with the IPA concentration in the mixed liquid (that is, liquid phase) of IPA and pure water as the horizontal axis. The vertical axis represents the IPA (vapour) concentration.

  For example, when a part of a sufficient amount of liquid mixture having an IPA concentration of 61% by weight and pure water of 39% by weight is evaporated, the concentration of IPA vapor is 82% by weight and water vapor is 18% by weight. Some mixed steam is produced. That is, when the mixed vapor is generated from the mixed liquid having an IPA concentration of 61% by weight, it means that an IPA vapor having a higher concentration than the IPA concentration of the mixed liquid is obtained. This is because IPA generally has a higher vapor pressure than pure water and is more likely to volatilize.

  Such a property is seen in a mixed liquid having an IPA concentration of 87% by weight or less as shown in the vapor-liquid equilibrium curve of FIG. When the mixed liquid having an IPA concentration of 87% by weight is evaporated, a mixed vapor having an IPA vapor concentration of 87% by weight is generated. That is, when the IPA concentration in the mixed liquid is 87% by weight, a so-called azeotropic state is obtained in which the mixed liquid and the mixed vapor generated from the mixed liquid have the same IPA concentration. In the present application, the IPA concentration of the mixed liquid (that is, the low surface tension liquid concentration) is thus equal to the IPA vapor concentration of the mixed vapor generated from the mixed liquid (that is, the vapor concentration of the low surface tension liquid). The IPA concentration is sometimes referred to as “azeotropic concentration”.

  When the IPA concentration becomes higher than the azeotropic concentration in the mixed liquid, the IPA vapor concentration in the mixed vapor becomes lower than the IPA concentration in the mixed liquid. In other words, in the mixed liquid, when the water concentration becomes lower than the azeotropic concentration, the water vapor concentration in the mixed vapor becomes higher than the water concentration in the mixed liquid.

  For example, when a part of a sufficient amount of liquid mixture having an IPA concentration of 97% by weight and pure water of 3% by weight is evaporated, the concentration of IPA vapor is 95% by weight and water vapor is 5% by weight. Some mixed steam is produced. That is, when a mixed vapor is generated from a mixed liquid having an IPA concentration higher than the azeotropic concentration, it means that water vapor having a concentration higher than the water concentration of the mixed liquid is obtained. Then, a larger proportion of water vapor is removed from the mixed liquid as the mixed vapor, so that the IPA concentration of the mixed liquid after the mixed vapor is generated becomes high.

  The vaporization dehydration step (S13) utilizes the above mechanism. That is, after the water concentration in the mixed liquid is lowered to the first predetermined value or lower (in the first embodiment, 0.001 wt% or lower, that is, the IPA concentration is equal to or higher than the azeotropic concentration) by the circulation dehydration step (S12), the heating unit 22 By generating the mixed vapor from the liquid level of the mixed liquid, the concentration of water vapor contained in the mixed vapor becomes higher than the concentration of moisture contained in the mixed liquid, and the moisture concentration of the mixed liquid becomes low after the mixed vapor is generated. Take advantage of that.

  In the vaporization dehydration step, the control unit 70 further issues an operation command to the mixed vapor supply means 50, opens the valve V8, and supplies the mixed vapor from the mixed vapor storage unit 52 to the mixed liquid storage unit 11 via the pipe 53. To do. The details of the mixed vapor supplied from the mixed vapor storage unit 52 will be described later, but the mixed vapor has an IPA vapor concentration higher than the IPA concentration of the mixed liquid stored in the mixed liquid storage unit 11 in the vaporization dehydration step. The mixed steam having

  Thus, by supplying the mixed vapor having a higher IPA vapor concentration than the IPA concentration of the mixed liquid stored in the mixed liquid storage unit 11 to the mixed liquid storage unit 11 during the vaporization dehydration step, This atmosphere can be an atmosphere having a high IPA vapor concentration. Accordingly, it is possible to preferentially dehydrate moisture contained in the mixed liquid while suppressing the IPA from evaporating from the mixed liquid in the mixed liquid storage unit 11 and being exhausted to the exhaust mechanism.

  By the vaporization dehydration step (S13), the IPA concentration of the mixed liquid stored in the mixed liquid storage unit 11 is increased, and the water concentration is decreased.

  Even after the start of the vaporization and dehydration step (S13), the control unit 70 issues an operation command to the valve V11 every time a predetermined time elapses, and drops a predetermined volume of the mixed liquid to the sensor 14 via the pipe 15. 14 confirms the water concentration of the mixed liquid detected. When the control unit 70 confirms that the water concentration of the mixed liquid stored in the mixed liquid storage unit 11 is equal to or lower than the second predetermined value, the control unit 70 issues an operation command to the exhaust means 40 and closes the valves V4 and V8. To do. Subsequently, the control unit 70 starts a steam supply step (S14).

  In the first embodiment, the second predetermined value is 0.0005% by weight (that is, 5 ppm). Further, when the sensor 14 detects the IPA concentration, when the IPA concentration detected by the sensor 14 is equal to or higher than the fourth predetermined value, the control unit 70 issues an operation command to the exhaust means 40, and the valves V4 and The valve V8 may be closed. Here, the fourth predetermined value is 99.9995% by weight.

  The second predetermined value is not limited to 0.0005% by weight, but is set to a value smaller than the first predetermined value. Similarly, the fourth predetermined value is not limited to 99.9995% by weight, but is set to a value larger than the third predetermined value.

  Here, since the liquid mixture (99.9%) having an IPA concentration equal to or higher than the azeotropic point concentration is already stored in the liquid mixture storage unit 11 at the time of the storage step (S11), this liquid mixture is the first. Even if the water concentration is equal to or higher than the predetermined value (0.001 wt%), the vaporization dehydration step (S13) is performed by the circulation dehydration step (S12) without reducing the water concentration to the first predetermined value or less. The effect of using the boiling concentration is obtained.

  However, when the vaporization dehydration process is performed, loss of IPA from the mixed liquid storage unit 11 occurs as described above. Therefore, before the vaporization dehydration step, the circulation dehydration step is performed in advance to increase the IPA concentration to some extent, and then the vaporization dehydration step is performed. Thereby, the water | moisture content remaining in trace amount in the liquid mixture storage part 11 can be removed, suppressing the loss of IPA.

  Further, even if only the circulation dehydration step is continued, it is possible to reduce the water concentration to the second predetermined value or less. However, when the water concentration is lowered to some extent, the dehydration efficiency by the dehydration unit 33 is reduced, and thus the time required for obtaining a low water concentration equal to or lower than the second predetermined value after the storage step (S11) is lengthened.

  FIG. 6 shows the relationship between the decrease in the water concentration due to the removal of water by the dewatering unit 33 and the elapsed time from the start of the circulating dewatering process. As shown in FIG. 6, the slope of the graph line becomes gentle as the water concentration decreases (that is, the water removal efficiency decreases), and the mixed liquid in the mixed liquid storage unit 11 has a low water concentration to some extent. The degree of decrease in the water concentration by the dehydrating unit 33 is saturated.

  The separating unit 331, the adsorbing unit 332, and the filter 333 in the dehydrating unit 33 are generally consumables, and when used for a long time as described above, the replacement cycle is accelerated and the maintenance burden of the apparatus is increased.

  Therefore, in the first embodiment, the mixed liquid in the mixed liquid storage unit 11 is less than or equal to the water concentration (first predetermined value in the case of the first embodiment) at which the efficiency of water removal by the dehydrating unit 33 starts to decrease. At that point, a vaporization dehydration step is performed. Thereby, the water | moisture content which remains in the mixed liquid storage part 11 can be removed, suppressing the use time of the spin-drying | dehydration part 33 (namely, suppressing the maintenance burden of an apparatus).

  Therefore, the optimum value of the first predetermined value depends on the function of the dewatering unit 33. The relationship shown in FIG. 6 may be acquired in advance using the dehydrating unit 33, and the moisture concentration corresponding to the predetermined inclination may be defined as the first predetermined value.

  Returning to FIG. Next, a steam supply process (S14) is demonstrated.

  Here, in the substrate processing unit 90, the controller 70 performs a substrate W loading / holding step in parallel with or prior to the vapor supply step (S14).

  In the step of carrying in and holding the substrate W, the control unit 70 issues an operation command to each unit of the substrate processing unit 90, whereby the substrate W is carried into the chamber 91 from the shutter 93, and the substrate W is held by a holding unit (not shown). Is done. Then, the nozzle 92 is positioned at a position facing the main surface of the substrate W. Here, on the main surface of the substrate W, wet processing is performed on the substrate W by a wet processing unit in the chamber 91 (not shown) before or after the chamber 91 is loaded, A treatment liquid such as a rinsing liquid (hereinafter simply referred to as “treatment liquid”) adheres.

  The vapor supply step (S14) is a step of supplying the mixed vapor generated in the mixed liquid storage unit 11 to the vapor supply pipe 13. When the vapor supply step (S14) is started, the control unit 70 issues an operation command to the vapor generation means 20, maintains the heating of the mixed liquid in the mixed liquid storage unit 11 by the heating unit 22, and turns on the valve V2. Establish. Thus, nitrogen gas is supplied from the nitrogen gas supply source into the mixed liquid in the mixed liquid storage unit 11 via the pipe 21. As a result, mixed vapor is generated in the mixed liquid reservoir 11.

  Further, the control unit 70 issues an operation command to the valve V5 to open the valve V5. As a result, the mixed vapor generated in the mixed liquid storage unit 11 is supplied into the vapor supply pipe 13.

  Subsequently, the control unit 70 issues an operation command to the valve V6 to open the valve V6. Thereby, the mixed steam flowing in the steam supply pipe 13 is supplied to the substrate W from the nozzle 92 in the chamber 91 via the pipe 61. That is, the processing liquid attached to the surface of the substrate W is replaced with the mixed steam by the supply of the mixed steam, whereby the processing liquid on the surface of the substrate W is removed.

  When the processing liquid on the surface of the substrate W is replaced with the mixed vapor and the surface of the substrate W is covered with the mixed liquid, the control unit 70 then instructs the valve V9 to open the valve V9. Further, an operation command is given to the valve V6, and the valve V6 is closed. Thereby, the communication between the nozzle 92 and the mixed liquid storage unit 11 is blocked, and the supply of the mixed vapor to the substrate W is stopped. Further, nitrogen gas is supplied to the pipe 61 from a nitrogen gas supply source, and vaporization of the mixed liquid from the surface of the substrate W is executed.

  As described above, the liquid mixture on the surface of the substrate W is removed, and the vapor drying process of the substrate W is completed.

  Here, the mixed vapor that is the source of the mixed liquid covering the surface of the substrate W has a moisture concentration of 5 ppm or less by the circulation dehydration step (S12) and the vaporization dehydration step (S13). Compared with the case where the vaporization dehydration process is not performed, the water concentration is low. Thereby, even when the mixed liquid covering the surface of the substrate W is removed from the substrate W, the moisture remaining on the surface of the substrate W is reduced, and the pattern of the surface of the substrate W due to the moisture contained in the mixed liquid is reduced. The collapse can be prevented from occurring.

  In addition, after the valve V6 is closed, the control unit 70 issues an operation command to the valve V7 to open the valve V7. Further, the supply of the nitrogen gas from the nitrogen gas supply source in the vapor generating means 20 to the mixed liquid storage unit 11 is continued. Here, the pressure of the nitrogen gas supplied from the nitrogen gas supply source to the mixed liquid storage unit 11 is a positive pressure higher than the atmospheric pressure. Since only the valves V2, V5 and V7 are opened now, the mixed steam generated by passing nitrogen gas through the mixed liquid in the mixed liquid storage section 11 is in a positive pressure state higher than the atmospheric pressure, and the steam supply pipe 13 and the pipe 51, and is stored in the mixed steam storage part 52 in a positive pressure state.

  Thereby, the mixed vapor | steam whose water content to contain is below a 2nd predetermined value can be stored in the mixed vapor storage part 52 for the following vaporization dehydration process.

  In the vapor supply process, after the vapor drying process of the substrate W is completed, the control unit 70 issues an operation command to each unit of the vapor drying apparatus 1, closes the valves V9, V5, V2, and V7, and the heating unit. 22 is stopped, the substrate W is carried out of the chamber 91 from the shutter 93, and a series of vapor drying steps is completed.

  The above S11 thru | or S14 are the vapor | steam drying processes in 1st Embodiment.

  In the first embodiment, before the vaporization dehydration step, the circulation dehydration step is performed in advance, and the IPA concentration is increased to some extent, and then the vaporization dehydration step is performed, thereby suppressing the loss of IPA and the inside of the mixed liquid storage unit 11. It is possible to remove moisture remaining in a trace amount.

  Furthermore, in the first embodiment, by performing the vaporization dehydration process in combination with the circulation dehydration process, the use time of the dehydration unit is suppressed, and the maintenance burden of the apparatus is suppressed, and a minute amount remains in the mixed liquid storage unit. Moisture can be removed.

  Then, when the mixed liquid covering the surface of the substrate W is removed from the substrate W by reducing the moisture concentration of the mixed vapor supplied to the substrate W by the circulation dehydration step and the vaporization dehydration step, the processing liquid is replaced. In addition, moisture remaining on the surface of the substrate W is reduced, and it is possible to prevent the pattern collapse on the surface of the substrate W due to moisture contained in the mixed liquid.

  In the first embodiment, the circulating dehydration unit is connected to the mixed liquid storage unit, and after the mixed liquid is stored in the mixed liquid storage unit, that is, after the storing step, the circulating dehydration step and the vaporization dehydration step are performed. . Thereby, the water originally contained in the liquid mixture supplied from the outside to the liquid mixture reservoir can be removed, and the pattern collapse on the surface of the substrate W due to the water contained in the liquid mixture. It can be prevented from occurring.

<2. Modification>
In the first embodiment, the embodiment having the most executed steps is shown in the embodiment of the present invention. The implementation of the present invention is not limited to this, and the problems to be solved by the present invention can be solved without executing all the steps shown in the first embodiment.

<2-1. Omission of vaporization dehydration process>
Regarding the implementation of the present invention, the vapor dehydration step may be omitted, the circulation dehydration step may be performed after the storage step, and then the steam supply step may be performed. The required high IPA concentration depends on the scale of the pattern formed on the substrate W to be processed in the substrate processing unit 90, and even if the contained moisture concentration is 10 ppm, it is possible to prevent the pattern collapse. In such a case, after the circulation dehydration step (S12) shown in FIG. 4, the vapor supply step (S14) may be performed without performing the vaporization dehydration step (S13).

  Thereby, the water | moisture content which remains in the liquid mixture in the liquid mixture storage part 11 can be removed without the loss of IPA which arises in a vaporization dehydration process, and the pattern collapse in the vapor | steam drying process of the board | substrate W can be prevented.

<2-2. Omission of mixed steam supply from mixed steam storage section in vaporization dehydration process>
Regarding the implementation of the present invention, in the vaporization dehydration step, the supply of the mixed vapor from the mixed vapor storage unit 52 to the mixed liquid storage unit 11 is not essential, and the mixing by the heating unit 22 is performed without supplying the mixed vapor. The liquid mixture may be vaporized by heating the liquid.

  Thereby, since it is not necessary to prepare the mixed vapor storage part 52, the increase in apparatus cost and the enlargement of an apparatus can be suppressed.

<2-3. Ultrasonic generator>
In the first embodiment, the steam generation unit 20 includes the heating unit 22. However, the implementation of the present invention is not limited to this, and the generation of ultrasonic waves for applying ultrasonic vibration to the mixed liquid stored in the mixed liquid storage unit 11 instead of or in addition to the heating unit 22. A part may be provided. The ultrasonic generator is electrically connected to the controller 70 and applies ultrasonic vibration to the mixed liquid according to an operation command of the controller 70.

  The liquid surface of the mixed liquid becomes mist-like by ultrasonic vibration. In this state, by supplying nitrogen gas from the nitrogen gas supply source to the mixed liquid storage unit 11, the mist-like mixed liquid is included in the nitrogen gas, and the mixed liquid becomes mist-like so that the surface area is large. It vaporizes in nitrogen gas. Thereby, the mixed vapor containing the vapor of the mixed liquid is generated.

  As described above, when an ultrasonic wave generation unit is used instead of the heating unit 22, mixed steam can be generated at room temperature. When the mixed liquid is obtained by bubbling after heating the mixed liquid to about 50 ° C. to 60 ° C. using the heating unit 22, the mixed vapor having a temperature higher than the normal temperature is cooled to the normal temperature in the vapor supply pipe 13, There is a risk that the mixed liquid may aggregate in the vapor supply pipe 13. In the first embodiment, it may be necessary to provide a temperature control mechanism in the steam supply pipe 13 in order to prevent this, but if an ultrasonic generator is used instead of the heater 22, the mixed liquid is heated. Since the mixed vapor can be obtained without any risk of coagulation of the mixed liquid caused by cooling from high temperature to room temperature, the cost of parts for the countermeasure against the aggregation can be reduced, and the apparatus can be simplified. Can do.

The present invention relates to a semiconductor wafer, a glass substrate for photomask, a glass substrate for liquid crystal display, a glass substrate for plasma display, a substrate for FED (Field Emission Display), a substrate for optical disk, a substrate for magnetic disk, a substrate for magneto-optical disk, etc. The present invention can be applied to a vapor drying method and a vapor drying apparatus that vapor-dry the entire surface of the substrate including the vapor, a vapor supply method and a vapor supply apparatus that generate and supply vapor to be supplied to the entire surface of the substrate.

DESCRIPTION OF SYMBOLS 1 Steam drying apparatus 10 Steam supply apparatus 11 Mixed liquid storage part 12 Pipe 13 Steam supply pipe 14 Sensor 20 Steam generation means 21 Pipe 22 Heating part 30 Circulation dehydration means 31 Pipe 32 Pump 33 Dehydration part 34 Pipe 40 Exhaust means 41 Pipe 50 Mixing Steam supply means 51 Pipe 52 Mixed steam storage section 53 Pipe 60 Nitrogen gas mixing means 61 Pipe 62 Pipe 70 Control section 71 CPU
72 Storage Unit 73 Program 74 Recording Medium 75 Reading Unit 90 Substrate Processing Units V1 to V11 Valve W Substrate

Claims (14)

A vapor supply apparatus used for a vapor drying process for supplying a vapor of a low surface tension liquid having a surface tension equal to or lower than a surface tension of the treatment liquid to the main surface of the substrate to which the treatment liquid is attached;
A mixed liquid reservoir for storing a mixed liquid containing the low surface tension liquid and water;
Circulating and dehydrating means for introducing and dehydrating the mixed liquid stored in the mixed liquid storage unit and returning the dehydrated mixed liquid to the mixed liquid storage unit;
Vapor generating means for generating a mixed vapor that is a vapor of the mixed liquid from the mixed liquid stored in the mixed liquid storage unit;
A vapor supply pipe connected to the mixed liquid reservoir and supplying the mixed vapor generated by the vapor generating means to the substrate;
A steam supply device.
The steam supply device according to claim 1,
Mixed liquid supply means for supplying the mixed liquid to the mixed liquid reservoir;
A steam supply device further comprising:
The steam supply device according to claim 2,
The vapor supply apparatus according to claim 1, wherein the liquid mixture supply means supplies the liquid mixture having a ratio of water of 0.1% by weight or less to the liquid mixture reservoir.
The steam supply device according to any one of claims 1 to 3,
A steam supply device further comprising exhaust means for exhausting the mixed steam generated by the steam generating means to an exhaust mechanism outside the mixed liquid storage section.
The steam supply device according to claim 4,
Further comprising a mixed vapor supply means for supplying the mixed vapor to the mixed liquid reservoir,
The ratio of water in the mixed steam supplied to the mixed liquid storage section by the mixed steam supply means is equal to or less than the ratio of water in the mixed liquid stored in the mixed liquid storage section. .
The steam supply device according to claim 5,
The mixed steam supply means has a mixed steam storage section for storing the mixed steam,
The mixed steam reservoir is connected to the steam supply pipe,
The steam supply pipe, wherein the steam supply pipe supplies the mixed steam generated by the steam generating means to at least one of the substrate and the mixed steam storage section.
The steam supply device according to any one of claims 4 to 6,
A sensor for detecting the concentration of the low surface tension liquid or moisture contained in the mixed liquid stored in the mixed liquid storage unit;
Based on the concentration detected by the sensor, a control unit that controls the vapor generating means and the exhaust means;
Further comprising
The controller is
When the water concentration of the mixed liquid stored in the mixed liquid storage unit is equal to or lower than a first predetermined value and greater than a second predetermined value, the vapor generation unit stores the mixed liquid storage unit in the mixed liquid storage unit. Generating the mixed vapor from the mixed liquid, and exhausting the mixed vapor to the exhaust mechanism by the exhaust means;
When the moisture concentration of the mixed liquid stored in the mixed liquid storage unit is equal to or lower than the second predetermined value, the vapor generation unit generates the mixed vapor from the mixed liquid stored in the mixed liquid storage unit. And supplying the mixed steam to the steam supply pipe,
The first predetermined value is an azeotropic concentration at which the concentration of the low surface tension liquid contained in the mixed liquid is equal to the concentration of the low surface tension liquid contained in the mixed vapor generated from the mixed liquid. With the following values:
The steam supply device, wherein the second predetermined value is smaller than the first predetermined value.
The steam supply device according to claim 7,
An outlet pipe for allowing the mixed liquid stored in the mixed liquid storage part to flow out;
The said sensor detects the density | concentration of the said surface tension liquid or the water | moisture content contained in the said mixed liquid using the said mixed liquid which flowed out from the said outflow piping, The vapor | steam supply apparatus characterized by the above-mentioned.
The steam supply device according to any one of claims 1 to 8,
The steam supply device according to claim 1, wherein the circulation dehydrating unit includes a separation unit that separates water in the mixed liquid and an adsorption unit that adsorbs water in the mixed liquid.
The steam supply device according to any one of claims 1 to 9,
A chamber containing the substrate;
A nozzle connected to the vapor supply pipe and supplying the mixed vapor to the substrate housed in the chamber;
A steam drying apparatus.
A vapor supply method used in a vapor drying process for supplying a vapor of a low surface tension liquid having a surface tension equal to or lower than the surface tension of the treatment liquid to the main surface of the substrate to which the treatment liquid is attached,
A storage step of supplying the mixed liquid to a mixed liquid storage section that stores the mixed liquid containing the low surface tension liquid and water;
The mixed liquid stored in the mixed liquid storage part is introduced into the dehydration part connected to the mixed liquid storage part through a pipe and dehydrated, and the dehydrated mixed liquid is stored in the mixed liquid storage from the dehydration part. A circulation dehydration process to return to the department,
From the mixed liquid stored in the mixed liquid storage unit, a mixed vapor that is a vapor of the mixed liquid is generated, and connected to the mixed liquid storage unit to a vapor supply pipe that supplies the mixed vapor to the substrate, A steam supply step for supplying mixed steam;
A steam supply method.
The steam supply method according to claim 11,
The said supply process supplies the said liquid mixture whose ratio of water is 0.1 weight% or less to the said liquid mixture storage part, The vapor | steam supply method characterized by the above-mentioned.
The steam supply method according to claim 12,
In the storage step, the liquid mixture is supplied with the liquid mixture having a value greater than a first predetermined value.
After the circulating liquid dehydration step, the water concentration of the liquid mixture stored in the liquid mixture storage section is less than the first predetermined value and greater than the second predetermined value, and then stored in the liquid mixture storage section. A vaporization dehydration step of generating the mixed vapor from the mixed liquid and exhausting the mixed vapor to an exhaust mechanism outside the mixed liquid storage unit;
The vapor supply step generates the mixed vapor from the mixed liquid stored in the mixed liquid storage unit after the moisture concentration of the mixed liquid becomes equal to or lower than the second predetermined value by the vaporization dehydration step, Supplying mixed steam to the steam supply pipe;
The first predetermined value is an azeotropic concentration at which the concentration of the low surface tension liquid contained in the mixed liquid is equal to the concentration of the low surface tension liquid contained in the mixed vapor generated from the mixed liquid. With the following values:
The steam supply method, wherein the second predetermined value is smaller than the first predetermined value.
A vapor drying method for supplying a vapor of a low surface tension liquid having a surface tension equal to or lower than the surface tension of the treatment liquid to the main surface of the substrate to which the treatment liquid is attached,
A storage step of supplying the mixed liquid to a mixed liquid storage section that stores the mixed liquid containing the low surface tension liquid and water;
The mixed liquid stored in the mixed liquid storage part is introduced into the dehydration part connected to the mixed liquid storage part through a pipe and dehydrated, and the dehydrated mixed liquid is stored in the mixed liquid storage from the dehydration part. A circulation dehydration process to return to the department,
The mixed liquid that is the vapor of the mixed liquid is generated from the mixed liquid stored in the mixed liquid storage section, and the treatment liquid is attached via a vapor supply pipe connected to the mixed liquid storage section. A steam supply step of supplying the mixed steam to the main surface of the substrate;
A steam drying method comprising:

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